TI1 DRV5032FCDBZT Ultra-low-power digital-switch hall effect sensor Datasheet

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DRV5032
SLVSDC7A – APRIL 2017 – REVISED MAY 2017
DRV5032 Ultra-Low-Power Digital-Switch Hall Effect Sensor
1 Features
3 Description
•
The DRV5032 device is an ultra-low-power digitalswitch Hall effect sensor, designed for the most
compact and battery-sensitive systems. The device is
offered in multiple sampling rates, output drivers, and
packages to accommodate various applications.
1
•
•
•
•
•
•
•
Industry-Leading Ultra-Low Power Consumption
– 5-Hz Version: 0.54 µA With 1.8 V
– 20-Hz Versions: 1.6 µA With 3 V
1.65- to 5.5-V Operating VCC Range
Magnetic Threshold (Typical BOP):
– 3 mT, High Sensitivity
Omnipolar and Dual-Unipolar Options
20-Hz and 5-Hz Sampling Rate Options
Open-Drain and Push-Pull Output Options
SOT-23 and X2SON Package Options
–40°C to +85°C Operating Temperature Range
2 Applications
•
•
•
•
•
•
•
When the applied magnetic flux density exceeds the
BOP threshold, the device output drives a low voltage.
The output stays low until the flux density decreases
to less than BRP, and then the output either drives a
high voltage or becomes high impedance, depending
on the device version. By incorporating an internal
oscillator, the device samples the magnetic field and
updates the output at a rate of 20 Hz, or 5 Hz for the
lowest current consumption. Omnipolar and dualunipolar magnetic responses are available.
The device operates from a VCC range of 1.65 V to
5.5 V, and is packaged in a standard SOT-23 and
small X2SON.
Battery-Critical Position Sensing
Electricity Meter Tamper Detection
Cell Phone, Laptop, or Tablet Case Sensing
E-locks, Smoke Detectors, Appliances
Medical Devices, IoT Systems
Valve or Solenoid Position Detection
Contactless Diagnostics or Activation
Device Information(1)
PART NUMBER
DRV5032
PACKAGE
BODY SIZE (NOM)
SOT-23 (3)
2.92 mm × 1.30 mm
X2SON (4)
1.10 mm × 1.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Current Consumption of 5-Hz Version
Typical Schematic
1.4
distance
DRV5032
VCC
OUT
N S
Controller
GPIO
GND
Copyright © 201 7, Texas Instrumen ts Incorpor ate d
Average Supply Current (PA)
VCC
1.2
1
0.8
0.6
0.4
1.65 V
3V
5.5 V
0.2
0
-40
-10
20
Temperature (qC)
50
80
D011
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV5032
SLVSDC7A – APRIL 2017 – REVISED MAY 2017
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
5
5
5
5
6
6
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Magnetic Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes........................................ 12
9
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ............................................... 13
9.3 Do's and Don'ts ....................................................... 16
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (April 2017) to Revision A
•
2
Page
Added the FA and FD device versions .................................................................................................................................. 1
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5 Device Comparison Table
VERSION
MAGNETIC
THRESHOLD
MAGNETIC
RESPONSE
FA
FB
FC
3 mT
FD
Omnipolar
Dual-Unipolar
OUTPUT
TYPE
Push-pull
SAMPLING
RATE
PACKAGES
AVAILABLE
20 Hz
SOT-23, X2SON
5 Hz
SOT-23
Open-drain
20 Hz
SOT-23
Push-pull
20 Hz
X2SON
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6 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
VCC
1
3
OUT
GND
2
FA Version DMR Package
4-Pin X2SON
Top View
FD Version DMR Package
4-Pin X2SON
Top View
VCC
OUT
VCC
OUT1
1
4
1
4
Thermal
Pad
Thermal
Pad
2
3
2
3
GND
NC
GND
OUT2
Pin Functions
PIN
NO.
NAME
I/O
DESCRIPTION
SOT-23
X2SON (FA)
GND
3
2
2
—
Ground reference
OUT
2
4
—
O
Omnipolar output that responds to north and south magnetic poles
OUT1
—
—
4
O
Unipolar output that responds to north magnetic poles near the top of the
package
OUT2
—
—
3
O
Unipolar output that responds to south magnetic poles near the top of the
package
NC
—
3
—
—
No-connect. This pin is not connected to the silicon. It should be left
floating or tied to ground. It should be soldered to the board for
mechanical support.
VCC
1
1
1
—
1.65-V to 5.5-V power supply. TI recommends connecting this pin to a
ceramic capacitor to ground with a value of at least 0.1 µF.
Thermal
Pad
—
PAD
PAD
—
No-connect. This pin should be left floating or tied to ground. It should be
soldered to the board for mechanical support.
4
X2SON (FD)
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
–0.3
5.5
V
Power supply voltage
VCC
Power supply voltage slew rate
VCC
Output voltage
OUT, OUT1, OUT2
–0.3
VCC + 0.3
V
Output current
OUT, OUT1, OUT2
–5
5
mA
105
°C
150
°C
Unlimited
Magnetic flux density, BMAX
V / µs
Unlimited
T
Junction temperature, TJ
Storage temperature, Tstg
(1)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±6000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Power supply voltage
VO
Output voltage
IO
Output current
TA
Operating ambient temperature
MIN
MAX
1.65
5.5
UNIT
V
0
5.5
V
–5
5
mA
–40
85
°C
7.4 Thermal Information
DRV5032
THERMAL METRIC (1)
RθJA
SOT-23 (DBZ)
X2SON (DMR)
3 PINS
4 PINS
356
159
°C/W
128
77
°C/W
Junction-to-ambient thermal resistance
RθJC(top) Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
(1)
UNIT
94
102
°C/W
11.4
0.9
°C/W
92
100
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
VCC – 0.35
VCC – 0.1
MAX
UNIT
PUSH-PULL OUTPUT DRIVER
VOH
High-level output voltage
IOUT = –1 mA
VOL
Low-level output voltage
IOUT = 1 mA
V
0.1
0.3
V
5
100
nA
0.1
0.3
V
13.3
20
37
Hz
27
50
75
ms
3.5
µA
OPEN-DRAIN OUTPUT
IOZ
High impedance output leakage
current
VCC = 5.5 V, OUT = 5.5 V
VOL
Low-level output voltage
IOUT = 1 mA
DRV5032FA, DRV5032FC, DRV5032FD
fS
Frequency of magnetic sampling
tS
Period of magnetic sampling
ICC(AVG)
Average current consumption
VCC = 1.8 V
1.3
VCC = 3 V
1.6
VCC = 5 V
2.3
DRV5032FB
fS
Frequency of magnetic sampling
3.5
5
8.5
Hz
tS
Period of magnetic sampling
117
200
286
ms
1.8
µA
2
2.7
mA
100
µs
ICC(AVG)
Average current consumption
VCC = 1.8 V
0.54
VCC = 3 V
0.69
VCC = 5 V
1.06
ALL VERSIONS
ICC(PK)
Peak current consumption
tON
Power-on time
55
tACTIVE
Active time period (see Figure 13)
40
µs
7.6 Magnetic Characteristics
for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DRV5032FA, DRV5032FB, DRV5032FC
BOP
Magnetic threshold operate point
±1.5
±3
±4.8
mT
BRP
Magnetic threshold release point
±0.5
±1.5
±3
mT
BHYS
Magnetic hysteresis: |BOP – BRP|
0.8
1.5
3
mT
DRV5032FD
BOP
Magnetic threshold operate point
(see Figure 10)
OUT1 pin
–4.8
–3
–1.5
OUT2 pin
1.5
3
4.8
BRP
Magnetic threshold release point
(see Figure 10)
OUT1 pin
–3
–1.5
–0.5
OUT2 pin
0.5
1.5
3
BHYS
Magnetic hysteresis: |BOP – BRP|
Each output
0.8
1.5
3
6
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mT
mT
mT
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7.7 Typical Characteristics
1.4
2.5
Average Supply Current (PA)
Average Supply Current (PA)
3
2
1.5
1
1.65 V
3V
5.5 V
0.5
0
-40
-10
20
Temperature (qC)
50
1.2
1
0.8
0.6
0.4
0
-40
80
80
D011
Magnetic Threshold Release Point (mT)
3
2
1
-10
20
Temperature (qC)
50
4
3
2
1
0
-40
80
-10
D013
Figure 3. |BOP| vs Temperature
20
Temperature (qC)
50
80
D015
Figure 4. |BRP| vs Temperature
5
Magnetic Threshold Release Point (mT)
5
Magnetic Threshold Operate Point (mT)
50
5
4
4
3
2
1
0
1.5
20
Temperature (qC)
Figure 2. ICC(AVG) vs Temperature (5-Hz version)
5
Magnetic Threshold Operate Point (mT)
-10
D016
Figure 1. ICC(AVG) vs Temperature (20-Hz versions)
0
-40
1.65 V
3V
5.5 V
0.2
2.5
3.5
Supply Voltage (V)
4.5
5.5
4
3
2
1
0
1.5
D012
Figure 5. |BOP| vs VCC
2.5
3.5
Supply Voltage (V)
4.5
5.5
D014
Figure 6. |BRP| vs VCC
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8 Detailed Description
8.1 Overview
The DRV5032 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a lowfrequency oscillator that enables ultra-low average power consumption. By operating from a 1.65-V to 5.5-V
supply, the device periodically measures magnetic flux density, updates the output, and enters a low-power sleep
state.
8.2 Functional Block Diagram
0.1 F
(min)
VCC
FA/FB/FD versions
VCC
Ultra-low-power
Oscillator
Voltage
Regulator
OUT
Output
Control
REF
Element Bias
FD version
VCC
Offset
Cancellation
Amp
OUT2
Temperature
Compensation
GND
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8.3 Feature Description
8.3.1 Magnetic Flux Direction
The DRV5032 device is sensitive to the magnetic field component that is perpendicular to the top of the package
(as shown in Figure 7).
B
B
SOT-23
X2SON
PCB
Figure 7. Direction of Sensitivity
8
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Feature Description (continued)
Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This
condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the
top to the bottom of the package results in negative millitesla values.
positive B
negative B
N
S
S
N
PCB
PCB
Figure 8. Flux Direction Polarity
8.3.2 Device Version Comparison
Figure 10 lists the available device versions.
VERSION
MAGNETIC
THRESHOLD
MAGNETIC
RESPONSE
FA
FB
FC
3 mT
FD
Omnipolar
Dual-Unipolar
OUTPUT
TYPE
SAMPLING
RATE
PACKAGES
AVAILABLE
20 Hz
SOT-23, X2SON
5 Hz
SOT-23
Open-drain
20 Hz
SOT-23
Push-pull
20 Hz
X2SON
Push-pull
8.3.2.1 Magnetic Threshold
Devices that have a lower magnetic threshold detect magnets at a farther distance. Higher thresholds generally
require a closer distance or larger magnet.
8.3.2.2 Magnetic Response
Omnipolar devices respond the same to north and south poles as shown in Figure 9.
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OUT
BHYS
BHYS
VCC
0V
BOP BRP
north
B
BRP BOP
0 mT
south
Figure 9. Omnipolar Functionality
The FD device version has two outputs, and each has a unipolar response. Pin OUT1 only responds to flux in
the top-down direction (north), and pin OUT2 only responds to flux in the bottom-up direction (south).
OUT1
OUT2
BHYS
BHYS
VCC
VCC
0V
north
BOP BRP
0V
B
0 mT
south
north
B
0 mT
BRP BOP
south
Figure 10. Dual-Unipolar Functionality
8.3.2.3 Output Type
The FB device version has a push-pull CMOS output that can drive a VCC or ground level. The FC device version
has an open-drain output that can become high impedance or drive ground, and an external pullup resistor must
be used.
VCC
Output
Control
Output
Output
Control
Figure 11. Push-Pull Output (Simplified)
10
Output
Figure 12. Open-Drain Output (Simplified)
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8.3.2.4 Sampling Rate
When the DRV5032 device powers up, it measures the first magnetic sample and sets the output within the tON
time. The output is latched, and the device enters an ultra-low-power sleep state. After each tS time has passed,
the device measures a new sample and updates the output if necessary. If the magnetic field does not change
between periods, the output also does not change.
VCC
1.65 V
tON
time
tS
ICC
tS
tACTIVE
ICC(PK)
time
Output
VCC
Invalid
1st sample
2nd sample
3rd sample
GND
time
Figure 13. Timing Diagram
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8.3.3 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 14
shows the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered
650 µm
±70 µm
±80 µm
X2SON
Top View
X2SON
Side View
centered
250 µm
±60 µm
±50 µm
Figure 14. Hall Element Location
8.4 Device Functional Modes
The DRV5032 device has one mode of operation that applies when the Recommended Operating Conditions are
met.
12
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DRV5032 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
9.1.1 Output Type Tradeoffs
The push-pull output allows for the lowest system power consumption, since there is no current leakage path
when the output drives high or low. The open-drain output involves a leakage path when the output drives low,
through the external pullup resistor.
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of
sensors.
9.2 Typical Applications
9.2.1 General-Purpose Magnet Sensing
distance
VCC
DRV5032
VCC
OUT
N S
Controller
GPIO
GND
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Figure 15. Typical Application Diagram
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VCC
3.3 V
Magnet
1-cm Cube NdFeB
Closest magnet distance
2.5 cm
Magnetic flux density at closest distance
7.8 mT
Magnetic flux density when magnet moves away
Close to 0 mT
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9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, three variables should always be considered: the
magnet, sensing distance, and threshold of the sensor.
Magnets are made from different ferromagnetic materials that have tradeoffs in cost, shift across temperature,
absolute max temperature ratings, magnetic remanence, and magnetic coercivity. The magnetic remanence and
the dimensions of a magnet determine the magnetic flux density it produces across a distance.
The DRV5032 device has a detection threshold specified by parameter BOP. To reliably activate the sensor, the
magnet must apply greater than the max specified BOP. In such a system, the sensor typically detects the
magnet before it has moved to the closest position. When the magnet moves away from the sensor, it must apply
less than the minimum specified BRP to reliably release the sensor.
9.2.1.3 Application Curve
60
Magnetic Flux Density (mT)
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
3.5
Distance (cm)
4
4.5
5
D017
Figure 16. Magnetic Profile of a 1-cm Cube NdFeB Magnet
9.2.2 Three-Position Switch
This application uses the DRV5032FD for a three-position switch.
1
2
3
PCB
Figure 17. Three-Position Slider Switch with Embedded Magnet
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 2.
Table 2. Design Parameters
14
DESIGN PARAMETER
EXAMPLE VALUE
Hall effect device
DRV5032FD
VCC
5V
Switch travel distance
5 mm in each direction
Magnet
10 mm cylinder
Mechanical tolerance per position
±0.5 mm
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9.2.2.2 Detailed Design Procedure
A standard 2-pole magnet produces strong perpendicular flux components near the outer edges of the poles, and
no perpendicular flux near the center at the north-south pole boundary. When the DRV5032FD is below the
center of the magnet, it receives close to 0 mT, and both outputs drive high. If the switch with the embedded
magnet moves left or right, the sensor receives a north or south field, and OUT1 or OUT2 drive low. This
provides 3 digital states of detection.
The length of the magnet should ideally be two times the distance of travel toward each side. Then, when the
switch is pushed to either side, the outer edge of the magnet is positioned directly above the sensor where it
applies the strongest perpendicular flux component.
To determine the magnitude of perpendicular magnetic flux for a given magnet and distance, TI recommends
using simulation software or testing with a linear Hall effect sensor.
9.2.2.3 Application Curve
Figure 18 shows the typical magnetic flux lines around a 2-pole magnet.
Figure 18. Typical Magnetic Flux Lines
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9.3 Do's and Don'ts
Because the Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, a
correct magnet approach must be used for the sensor to detect the field. Figure 19 shows the correct and
incorrect approaches.
CORRECT
S
S
N
N
N
S
INCORRECT
N
S
Figure 19. Correct and Incorrect Magnet Approaches
16
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10 Power Supply Recommendations
The DRV5032 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
11 Layout
11.1 Layout Guidelines
Magnetic fields generally pass through most nonferromagnetic materials with no significant disturbance.
Embedding Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is
common practice. Magnetic fields also easily pass through most printed-circuit boards, which makes placing the
magnet on the opposite side possible.
11.2 Layout Example
VCC
GND
OUT
Figure 20. Layout Example
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: DRV5032
PACKAGE OUTLINE
DMR0004A
X2SON - 0.4 mm max height
SCALE 9.000
PLASTIC SMALL OUTLINE - NO LEAD
1.15
1.05
B
A
PIN 1 INDEX AREA
1.45
1.35
C
0.4 MAX
SEATING PLANE
0.05
0.00
0.08 C
2X 0.5
SYMM
2
3
EXPOSED
THERMAL PAD
5
0.6±0.05
SYMM
4X
PIN 1 ID
(OPTIONAL)
0.25
0.15
4
1
4X
0.8±0.05
0.27
0.17
0.1
0.05
C B
C
A
4222825/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
(R0.05) TYP
4
1
4X (0.4)
5
SYMM
(0.6)
(1.4)
( 0.2) VIA
2
SYMM
3
(0.8)
LAND PATTERN EXAMPLE
SCALE:35X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222825/A 03/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
(R0.05) TYP
4
1
4X (0.4)
5
SYMM
(0.57)
(1.4)
METAL
TYP
2
SYMM
3
(0.76)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/A 03/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
DRV5032AJDBZR
PREVIEW
DRV5032AJDMRR
DRV5032FADBZR
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2AJ
(4/5)
SOT-23
DBZ
3
3000
PREVIEW
X2SON
DMR
4
3000
TBD
Call TI
Call TI
-40 to 85
2AJ
PREVIEW
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FA
DRV5032FADBZT
PREVIEW
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FA
DRV5032FADMRR
PREVIEW
X2SON
DMR
4
3000
TBD
Call TI
Call TI
-40 to 85
2FA
DRV5032FADMRT
PREVIEW
X2SON
DMR
4
250
TBD
Call TI
Call TI
-40 to 85
DRV5032FBDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FB
DRV5032FBDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FB
DRV5032FCDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FC
DRV5032FCDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
2FC
DRV5032FDDMRR
PREVIEW
X2SON
DMR
4
3000
TBD
Call TI
Call TI
-40 to 85
2FD
DRV5032FDDMRT
PREVIEW
X2SON
DMR
4
250
TBD
Call TI
Call TI
-40 to 85
2FD
DRV5032ZEDBZT
PREVIEW
SOT-23
DBZ
3
250
TBD
Call TI
Call TI
-40 to 85
2ZE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2017
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DRV5032FBDBZR
SOT-23
DBZ
3
3000
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.15
2.77
1.22
4.0
8.0
Q3
DRV5032FBDBZT
SOT-23
DBZ
3
250
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5032FCDBZR
SOT-23
DBZ
3
3000
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
DRV5032FCDBZT
SOT-23
DBZ
3
250
180.0
8.4
3.15
2.77
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV5032FBDBZR
SOT-23
DBZ
3
3000
183.0
183.0
20.0
DRV5032FBDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
DRV5032FCDBZR
SOT-23
DBZ
3
3000
183.0
183.0
20.0
DRV5032FCDBZT
SOT-23
DBZ
3
250
202.0
201.0
28.0
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.4
1.2
PIN 1
INDEX AREA
1.12 MAX
B
A
0.1 C
1
0.95
3.04
2.80
1.9
3X
3
0.5
0.3
0.2
2
(0.95)
C A B
0.25
GAGE PLANE
0 -8 TYP
0.10
TYP
0.01
0.20
TYP
0.08
0.6
TYP
0.2
SEATING PLANE
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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