CALMIRCO CM1210-01SC 1, 2, 4 and 8-channel very low capacitance esd protector Datasheet

CM1210
1, 2, 4 and 8-Channel Very Low Capacitance ESD Protectors
Features
Product Description
•
•
•
The CM1210 family of diode arrays has been designed
to provide ESD protection for electronic components or
sub-systems requiring minimal capacitive loading.
These devices are ideal for protecting systems with
high data and clock rates or for circuits requiring low
capacitive loading. Each ESD channel consists of a
pair of diodes which will steer the ESD current pulse to
either the positive (VP) or negative (VN) supply rail. The
CM1210 will protect against ESD pulses up to +6KV
per the IEC 61000-4-2 standard.
•
•
1,2,4 and 8 channels of ESD protection
Very low loading capacitance (1.0pF typical)
+6 kV ESD protection per channel (IEC 61000-4-2
standard)
Available in SOT23, SOT143, SC70 and MSOP
packages
Lead-free versions available
Applications
•
•
•
•
•
•
USB2.0 ports at 480Mbps
IEEE1394 Firewire ports at 400Mbps
Gigabit Ethernet ports
Flat panel display interfaces
Wireless antennas
General purpose high-speed data line ESD
protection
This device is particularly well-suited for systems using
high-speed port implementations such as USB2.0,
IEEE1394 (Firewire, i.Link), Gigabit Ethernet and
corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where
extremely low loading capacitance with ESD protection
are required in a small package footprint.
The CM1210 family of devices is optionally available
with lead-free finishing.
Electrical Schematics
VP
VP
CH1
CH1
VP
CH3
CH1
VN
CH2
CH2
VN
VN
CM1210-01ST/SO
CM1210-01SC/S7
CH4
CM1210-02ST/SO
CM1210-02SC/S7
CH7
CH8
CH1
CH2
VP
CM1210-04ST/SO
CH5
CH6
CH3
CH4
VN
CM1210-08MS/MR
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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1
CM1210
PACKAGE / PINOUT DIAGRAMS
Top View
Top View
1
VN
3
VN
CH1
2
VP
3-Pin SOT23-3
3-Pin SC70-3
Top View
Top View
1
CH1
1
VN
4
CH1
2
CH2
5-pin SC70-5
3
4
VP
2
3
CH2
4-Pin SOT143-4
Top View
CH4
6
VP
5
CH3
4
CH1
1
CH2
2
CH3
3
CH4
4
VN
5
10
CH8
9
CH7
D10/D108
3
VP
CH2
D10/D104
2
VN
5
D10/D112
VN
1
VN
D10/D111
D10/D101
3
2
VP
1
CH1
D10/D102
CH1
Top View
8
VP
7
CH6
6
CH5
10-pin MSOP-10
6-pin SOT23-6
Note: These drawings are not to scale.
SOT23-3 & SC70-3 PACKAGE
PIN DESCRIPTIONS
SOT143-4 PACKAGE PIN DESCRIPTIONS
PIN
NAME
TYPE
DESCRIPTION
DESCRIPTION
1
VN
GND
Negative voltage supply rail
ESD Channel
2
CH1
I/O
ESD Channel
PWR
Positive voltage supply rail
3
CH2
I/O
ESD Channel
GND
Negative voltage supply rail
4
VP
PWR
PIN
NAME
TYPE
1
CH1
I/O
2
VP
3
VN
SC70-5 PACKAGE PIN DESCRIPTIONS
Positive voltage supply rail
MSOP-10 PACKAGE PIN DESCRIPTIONS
PIN
NAME
TYPE
DESCRIPTION
PIN
NAME
TYPE
1
VN
GND
Negative voltage supply rail
1
CH1
I/O
ESD Channel
2
VN
GND
Negative voltage supply rail
2
CH2
I/O
ESD Channel
3
VP
PWR
Positive voltage supply rail
3
CH3
I/O
ESD Channel
CH4
I/O
ESD Channel
DESCRIPTION
4
CH1
I/O
ESD Channel
4
5
CH2
I/O
ESD Channel
5
VN
GND
6
CH5
I/O
7
CH6
I/O
8
VP
PWR
9
CH7
I/O
ESD Channel
10
CH8
I/O
ESD Channel
SOT23-6 PACKAGE PIN DESCRIPTIONS
PIN
NAME
TYPE
1
CH1
I/O
2
VN
GND
3
CH2
I/O
4
CH3
I/O
5
VP
PWR
6
CH4
I/O
DESCRIPTION
ESD Channel
Negative voltage supply rail
Negative voltage supply rail
ESD Channel
ESD Channel
Positive voltage supply rail
ESD Channel
ESD Channel
Positive voltage supply rail
ESD Channel
© 2004 California Micro Devices Corp. All rights reserved.
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01/14/04
CM1210
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish
Ordering Part
Ordering Part
Pins
Package
Number1
Part Marking
Number1
Part Marking
3
SOT23-3
CM1210-01ST
D10
CM1210-01SO
D101
3
SC70-3
CM1210-01SC
D10
CM1210-01S7
D111
4
SOT143-4
CM1210-02ST
D10
CM1210-02SO
D102
5
SC70-5
CM1210-02SC
D10
CM1210-02S7
D112
6
SOT23-6
CM1210-04ST
D10
CM1210-04SO
D104
10
MSOP-10
CM1210-08MS
D10
CM1210-08MR
D108
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
8.0
V
8
mA
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
225
200
225
200
225
400
mW
mW
mW
mW
mW
mW
RATING
UNITS
-40 to +85
°C
0 to 5.5
V
Supply Voltage (VP - VN)
Diode Forward DC Current (Note 1)
DC Voltage at any channel input
Package Power Rating
SOT23-3 Package (CM1210-01ST/SO)
SC70-3 Package (CM1210-01SC/S7)
SOT143 Package (CM1210-02ST/SO)
SC70-5 Package (CM1210-02SC/S7)
SOT23-6 Package (CM1210-04ST/SO)
MSOP10 Package (CM1210-08MS/MR)
Note 1: Only one diode conducting at a time.
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Operating Supply Voltage (VP - VN)
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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3
CM1210
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
IP
Supply Current
(VP-VN)=3.3V
VF
Diode Forward Voltage
Top Diode
Bottom Diode
IF = 8mA
ILEAK
CIN
VESD
VCL
MIN
0.60
0.60
Channel Leakage Current
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V; Note 2 applies
ESD Protection
Peak Discharge Voltage at any
channel input, in system
a) Contact discharge per IEC
61000-4-2 standard
Notes 2,3 and 5; TA=25°C
Channel Clamp Voltage
CM1210-01ST, CM1210-01SC,
CM1210-02ST, CM1210-02SC
Positive Transients
Negative Transients
At 8kV ESD HBM; Notes 2 & 4
Channel Clamp Voltage
CM1210-04ST, CM1210-08MS
Positive Transients
Negative Transients
At 8kV ESD HBM; Notes 2 & 4
MAX
UNIT
S
8.0
µA
0.80
0.80
0.95
0.95
V
V
+0.1
+1.0
µA
1.0
1.3
pF
TYP
+6
kV
VP + 10.0
VN - 10.0
V
V
VP + 13.0
VN - 13.0
V
V
Note 1: All parameters specified at TA = -40°C to +85°C unless otherwise noted.
Note 2: These parameters guaranteed by design and characterization.
Note 3: From I/O pins to VP or VN only. VP bypassed to VN with a 0.22µF ceramic capacitor (see Application Information for more
details).
Note 4: Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded.
Note 5: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
© 2004 California Micro Devices Corp. All rights reserved.
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CM1210
Performance Information
Input Channel Capacitance Performance Curves
Input Capacitance (pF)
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
Input Voltage (V)
Typical Variation of CIN vs. VIN
Input Capacitance (pF)
(f=1MHz, VP = 3.3V, V N = 0V, 0.1 µF chip capacitor between VP and V N, 25°C )
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0V DC Input Bias
1.65V DC Input Bias
-50
-25
0
25
50
75
100
Temperature (°C)
Typical Variation of CIN vs. Temp
(f=1MHz, VIN=30mV, V P = 3.3V, V N = 0V,
0.1 µF chip capacitor between VP and VN)
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
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Fax: 408.263.7846
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CM1210
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
TEST CIRCUIT
P1
P2
VP(3.3V)
I/On
GND
Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V)
TEST CIRCUIT
P1
P2
VP(3.3V)
I/On
GND
Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V)
© 2004 California Micro Devices Corp. All rights reserved.
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CM1210
Application Information
Design Considerations
a ROUT of 1 ohm would result in a 10V increment in
VCL for a peak IESD of 10A.
In order to realize the maximum protection against
ESD pulses, care must be taken in the PCB layout to
minimize parasitic series inductances on the Supply/
Ground rails as well as the signal trace segment
between the signal input (typically a connector) and the
ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an
input channel. The parasitic series inductance back to
the power supply is represented by L 1 and L2. The voltage VCL on the line being protected is:
If the inductances and resistance described above are
close to zero, the rail-clamp ESD protection diodes will
do a good job of protection. However, since this is not
possible in practical situations, a bypass capacitor
must be used to absorb the very high frequency ESD
energy. So for any brand of rail-clamp ESD protection
diodes, a bypass capacitor should be connected
between the VP pin of the diodes and the ground plane
(VN pin of the diodes) as shown in the Application Circuit diagram below. A value of 0.22µF is adequate.
Ceramic chip capacitors mounted with short printed
circuit board traces are good choices for this application. Electrolytic capacitors should be avoided as they
have poor high frequency characteristics. For extra
protection, connect a zener diode in parallel with the
bypass capacitor to mitigate the effects of the parasitic
series inductance inherent in the capacitor. The breakdown voltage of the zener diode should be slightly
higher than the maximum supply voltage.
VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt
+ L2 x d(IESD ) / dt
where IESD is the ESD current pulse, and VSUPPLY is
the positive supply voltage.
An ESD current pulse can rise from zero to its peak
value in a very short time. As an example, a level 4
contact discharge per the IEC61000-4-2 standard
results in a current pulse that rises from zero to 30
Amps in 1ns. Here d(IESD)/dt can be approximated by
∆IESD/∆t, or 30/(1x10 -9). So just 910nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL!
As a general rule, the ESD Protection Array should be
located as close as possible to the point of entry of
expected electrostatic discharges. The power supply
bypass capacitor mentioned above should be as close
to the VP pin of the Protection Array as possible, with
minimum PCB trace lengths to the power supply,
ground planes and between the signal input and the
ESD device to minimize stray series inductance.
Similarly for negative ESD pulses, parasitic series
inductance from the VN pin to the ground rail will lead
to drastically increased negative voltage on the line
being protected.
Another consideration is the output impedance of the
power supply for fast transient currents. Most power
supplies exhibit a much higher output impedance to
fast transient current spikes. In the VCL equation
above, the VSUPPLY term, in reality, is given by (VDC +
IESD x ROUT), where VDC and ROUT are the nominal
supply DC output voltage and effective output impedance of the power supply respectively. As an example,
Additional Information
See also California Micro Devices Application Notes
AP209, “Design Considerations for ESD Protection”
and APxxx, "ESD Protection for USB 2.0 Systems".
L2
POSITIVE SUPPLY RAIL
VP
PATH OF ESD CURRENT PULSE IESD
0.22µF
D1
D2
L1
ONE
CHANNEL
OF
CM1210
LINE BEING
PROTECTED
SYSTEM OR
CIRCUITRY
BEING
PROTECTED
CHANNEL
INPUT
20A
VCL
0A
GROUND RAIL
VN
Figure 3. Application of Positive ESD Pulse between Input Channel and Ground
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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CM1210
Mechanical Details
The CM1210 is available in SOT23-3, SC70-3, SC705, SOT23-6, SOT143-4 and MSOP-10 packages.The
various package drawings are presented below.
SOT23-3 Mechanical Specifications
Dimensions for CM1210 devices packaged in 3-pin
SOT23 packages are presented below.
Mechanical Package Diagrams
For complete information on the SOT23-3 package,
see the California Micro Devices SOT23 Package Information document.
TOP VIEW
b
3
PACKAGE DIMENSIONS
E1 E
Package
SOT23-3 (JEDEC name is TO-236)
Pins
3
Dimensions
Millimeters
Min
Max
Min
0.89
1.12
0.0350
0.0441
0.01
0.10
0.0004
0.0039
b
0.30
0.50
0.0118
0.0197
c
0.08
0.20
0.0031
0.0079
D
2.80
3.04
0.1102
0.1197
E
2.10
2.64
0.0827
0.1039
E1
1.20
1.40
0.0472
0.0551
e1
L
L1
# per tape
and reel
SIDE VIEW
D
A1 A
0.0374 BSC
1.90 BSC
0.40
e
Max
A
0.95 BSC
2
e1
Inches
A1
e
1
0.0748 BSC
0.60
0.54 REF
0.0157
END VIEW
0.0236
0.0213 REF
3000 pieces
c
L1
L
Controlling dimension: millimeters
Package Dimensions for SOT23-3.
© 2004 California Micro Devices Corp. All rights reserved.
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01/14/04
CM1210
Mechanical Details (cont’d)
SOT23-6 Mechanical Specifications
CM1210 devices are packaged in 6-pin SOT23 packages. Dimensions are presented below.
Mechanical Package Diagrams
For complete information on the SOT23-6 package,
see the California Micro Devices SOT23 Package Information document.
PACKAGE DIMENSIONS
SOT23-6 (JEDEC name is MO-178)
Pins
6
Millimeters
Min
Max
Min
--
1.45
--
0.0571
0.00
0.15
0.0000
0.0059
b
0.30
0.50
0.0118
0.0197
c
0.08
0.22
0.0031
0.0087
D
2.75
3.05
0.1083
0.1201
E
2.60
3.00
0.1024
0.1181
E1
1.45
1.75
0.0571
0.0689
e1
L
L1
# per tape
and reel
5
4
1
2
3
b
SIDE VIEW
D
A
A1
0.0374 BSC
1.90 BSC
0.30
6
Max
A
0.95 BSC
e
E1 E
Inches
A1
e
e1
Pin 1
Marking
Package
Dimensions
TOP VIEW
0.0748 BSC
0.60
0.60 REF
0.0118
END VIEW
0.0236
0.0236 REF
3000 pieces
c
L1
L
Controlling dimension: millimeters
Package Dimensions for SOT23-6.
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
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▲
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CM1210
Mechanical Details (cont’d)
SOT143 Mechanical Specifications
Dimensions for CM1210 devices packaged in 4-pin
SOT143 packages are presented below.
Mechanical Package Diagrams
For complete information on the SOT143 package, see
the California Micro Devices SOT143 Package Information document.
TOP VIEW
e
4
3
PACKAGE DIMENSIONS
Package
SOT143
Pins
4
Dimensions
Millimeters
Min
Max
E1 E
1
Inches
Min
A
0.80
1.22
0.031
0.048
0.05
0.15
0.002
0.006
b
0.30
0.50
0.012
0.019
b2
0.76
0.89
0.030
0.035
c
0.08
0.20
0.003
0.008
D
2.80
3.04
0.110
0.119
E
2.10
2.64
0.082
0.103
E1
1.20
1.40
0.047
0.055
e
1.92 BSC
0.075 BSC
e1
0.20 BSC
0.008 BSC
L1
# per tape
and reel
0.4
0.6
0.54 REF
0.016
e1
Max
A1
L
2
SIDE VIEW
D
A
b2
b
A1
END VIEW
0.024
0.021 REF
c
3000 pieces
L
L1
Controlling dimension: millimeters
Package Dimensions for SOT143.
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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01/14/04
CM1210
Mechanical Details (cont’d)
SC70-3 Mechanical Specifications
Dimensions for CM1210 devices packaged in 3-pin
SC70 packages are presented below.
Mechanical Package Diagrams
For complete information on the SC70-3 package, see
the California Micro Devices SC70 Package Information document.
TOP VIEW
B
3
E1 E
PACKAGE DIMENSIONS
1
Package
SC70-3
(JEDEC name is MO-203 Issue A)
Pins
3
Dimensions
e
e
Millimeters
Min
Max
A
0.80
1.10
A1
0.00
0.10
A2
0.70
1.00
B
0.15
0.30
c
0.08
0.25
D
1.85
2.25
E1
1.15
1.35
e
SIDE VIEW
D
A2 A
A1
END VIEW
0.65 BSC
E
2.00
2.40
L
0.26
0.46
# / tape and reel
2
c
3000 pieces
L
Package Dimensions for SC70-3.
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
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▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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CM1210
Mechanical Details (cont’d)
SC70-5 Mechanical Specifications:
Dimensions for CM1210 devices packaged in 5-pin
SC70 packages are presented below.
Mechanical Package Diagrams
For complete information on the SC70-5 package, see
the California Micro Devices SC70 Package Information document.
TOP VIEW
e
e
5
E1 E
PACKAGE DIMENSIONS
1
Package
SC70-5
(JEDEC name is MO-203 Issue A)
Pins
5
Dimensions
2
3
B
Millimeters
Min
Max
A
0.80
1.10
A1
0.00
0.10
A2
0.70
1.00
B
0.15
0.30
c
0.08
0.25
D
1.85
2.25
E1
1.15
1.35
e
SIDE VIEW
D
A2 A
A1
END VIEW
0.65 BSC
E
2.00
2.40
L
0.26
0.46
# / tape and reel
4
3000 pieces
c
L
Package Dimensions for SC70-5.
© 2004 California Micro Devices Corp. All rights reserved.
12 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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01/14/04
CM1210
Mechanical Details (cont’d)
MSOP Mechanical Specifications
CM1210 devices are packaged in 10-pin MSOP packages. Dimensions are presented below.
Mechanical Package Diagrams
For complete information on the MSOP-10 package,
see the California Micro Devices MSOP Package Information document.
TOP VIEW
D
10
9
8
6
7
PACKAGE DIMENSIONS
Package
MSOP
Pins
10
Dimensions
Max
Min
Max
A
0.75
0.95
0.028
0.038
A1
0.05
0.15
0.002
0.006
B
0.18
0.40
0.006
0.016
0.18
1
0.007
2.90
3.10
0.114
0.122
E
2.90
3.10
0.114
0.122
0.50 BSC
0.0196 BSC
H
4.76
5.00
0.187
0.197
L
0.40
0.70
0.0137
0.029
# per tube
80 pieces*
# per tape
and reel
4000
2
3
5
4
SIDE VIEW
D
e
Pin 1
Marking
Inches
Min
C
E
H
Millimeters
A
SEATING
PLANE
A1
B
e
END VIEW
C
Controlling dimension: inches
* This is an approximate number which may vary.
L
Package Dimensions for MSOP-10
© 2004 California Micro Devices Corp. All rights reserved.
01/14/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
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