Product Folder Order Now Support & Community Tools & Software Technical Documents bq25970, bq25971 SLUSD72A – NOVEMBER 2017 – REVISED DECEMBER 2017 bq25970, bq25971 I2C Controlled Single Cell High Efficiency 8-A Switched Cap Fast Chargers With ADC 1 Features • • 1 • • • 97% Efficient Power Stage for 8-A Fast Charge Switched Cap Architecture Optimized for 50% Duty Cycle – Input Voltage is 2x Battery Voltage (3.5 V to 4.65 V) – Output Current is 2x of Input Current (up to 4.5 A) – Reduces Power Loss Across the Cable Integrated Programmable Protection Features for Safe Operation – Input Over-Voltage Protection (BUS_OVP) – Input Over-Current Protection (BUS_OCP) with Adjustable Alarm – Input Over-Voltage with External OVP FET (VAC_OVP up to 17 V, bq25970 only) – Battery Over-Voltage Protection (BAT_OVP) with Adjustable Alarm – Output Over-Voltage (VOUT_OVP) – Input Over-Current Protection (BUS_OCP) with Adjustable Alarm – IBAT Over-Current Protection (BAT_OCP) with Adjustable Alarm – Battery Temperature Monitoring – Connector Temperature Monitoring Programmable Settings for System Optimization – Optional VBATREG and IBATREG Regulation for System Load and Wall Adapter Transients (bq25970 only with External OVP FET) – STAT, FLAG, and MASK options for Interrupts – ADC Readings and Configuration Integrated 12-Bit Effective Analog-to Digital Converter (ADC) – ±0.5% BUS Voltage – ±0.5% VOUT Voltage – –0.4% to 0.2% BAT Voltage with Differential Sensing – ±1.5% BAT Current at 6 A with External RSENSE – ±1% BAT Temperature – ±1% BUS Temperature – ±4°C Die Temperature 2 Applications • • Smart Phone Tablet PC 3 Description The bq2597x is a 97% efficient, 8-A battery charging solution using a switched cap architecture. This architecture and the integrated FETs are optimized to enable a 50% duty cycle, allowing the cable current to be half the current delivered to the battery, reducing the losses over the charging cable as well as limiting the temperature rise in the application. Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) bq25970 (2) DSBGA (56) 3.00 mm x 3.20 mm bq25971 (3) DSBGA (56) 3.00 mm x 3.20 mm (1) (2) (3) For all available packages, see the orderable addendum at the end of the data sheet. External OVP Capable No External OVP Simplified Application Phone bq25970 VOUT SC Phase #1 SC Phase #2 Adaptor D+/D- CC1/ CC2 bq2589x SW SYSTEM SYS BAT D+/D- PD Controller (TUSB422) I2C Battery VBUS Type C Connector Host + PD Controller (MSP430 + TPS25740) Type C Connector AC/DC Converter AP (MSP430) Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq25970, bq25971 SLUSD72A – NOVEMBER 2017 – REVISED DECEMBER 2017 www.ti.com 4 Revision History Changes from Original (November 2017) to Revision A Page • Deleted ±5% BUS Current at 4 A in Features........................................................................................................................ 1 • Changed ±1% BAT Current at 6 A with External RSENSE to ±1.5% BAT Current at 6 A with External RSENSE in Features.... 1 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: bq25970 bq25971 bq25970, bq25971 www.ti.com SLUSD72A – NOVEMBER 2017 – REVISED DECEMBER 2017 5 Description (Continued) The dual-phase architecture reduces the input cap requirements as well as reducing the output voltage ripple. When used with a standard charger such as the bq2589x, the system enables the fastest charging at the lowest power loss from pre-charge through CC, CV, and termination. The device integrates all the necessary protection features to ensure safe charging, including input over-voltage and over-current protection, output over-voltage and over-current protection, temperature sensing for the battery and cable, and monitoring the die temperature. The device includes a 12-bit effective analog-to-digital converter (ADC) to provide bus voltage, bus current, output voltage, battery voltage, battery current, bus temperature, bat temperature, die temperature, and other calculated measurements needed to manage the charging of the battery from the smart wall adapter or power bank. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: bq25970 bq25971 3 bq25970, bq25971 SLUSD72A – NOVEMBER 2017 – REVISED DECEMBER 2017 www.ti.com 6 Device and Documentation Support 6.1 Device Support 6.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 6.1.2 Device Nomenclature IADAPT (A) Output current of adapter VADAPT (V) Output voltage of adapter VCONADROP (V) Voltage drop across the adapter connector VCONA (V) Output voltage after adapter connector (same as the voltage at the beginning of the cable) VCABLEDROP (V) Voltage drop VCABLED (V) Voltage at the cable, going into the device VCOND (V) Output voltage after the device connector VDEVCON (V) Output voltage after the device control FETs (controlled by the PD controller) IIN (A) Input current to the bq2597x VIN (V) Input voltage to the bq2597x VOUT (V) Output voltage of the bq2597x VCONBDROP (V) Voltage drop across the battery connector and sense resistor VBAT (V) Voltage at the battery IBAT (A) Current at the battery 6.2 Documentation Support 6.2.1 Related Documentation For related documentation see the following: • bq2597xEVM-xxx User's Guide SLUUBR4 6.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY bq25970 Click here Click here Click here Click here Click here bq25971 Click here Click here Click here Click here Click here 6.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: bq25970 bq25971 bq25970, bq25971 www.ti.com SLUSD72A – NOVEMBER 2017 – REVISED DECEMBER 2017 6.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.6 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 6.7 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 6.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: bq25970 bq25971 5 PACKAGE OPTION ADDENDUM www.ti.com 12-Dec-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ25970YFFR ACTIVE DSBGA YFF 56 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ25970 BQ25970YFFT ACTIVE DSBGA YFF 56 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ25970 BQ25971YFFR ACTIVE DSBGA YFF 56 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ25971 BQ25971YFFT ACTIVE DSBGA YFF 56 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ25971 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Dec-2017 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) BQ25970YFFR DSBGA YFF 56 3000 330.0 12.4 BQ25970YFFT DSBGA YFF 56 250 330.0 BQ25971YFFT DSBGA YFF 56 250 330.0 3.22 3.55 0.81 8.0 12.0 Q1 12.4 3.22 3.55 0.81 8.0 12.0 Q1 12.4 3.22 3.55 0.81 8.0 12.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 27-Jan-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25970YFFR DSBGA YFF 56 3000 367.0 367.0 35.0 BQ25970YFFT DSBGA YFF 56 250 367.0 367.0 35.0 BQ25971YFFT DSBGA YFF 56 250 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE YFF0056 DSBGA - 0.625 mm max height SCALE 4.200 DIE SIZE BALL GRID ARRAY B E A BUMP A1 CORNER D C 0.625 MAX SEATING PLANE BALL TYP 0.30 0.12 0.05 C 2.4 TYP SYMM H G D: Max = 3.361 mm, Min =3.301 mm F E 2.8 TYP SYMM E: Max = 2.813 mm, Min =2.753 mm D C 56X B 0.3 0.2 0.015 C A B A 0.4 TYP 1 2 3 4 5 6 7 0.4 TYP 4219481/A 10/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YFF0056 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP 56X ( 0.23) 1 2 4 3 5 6 7 A (0.4) TYP B C D SYMM E F G H SYMM LAND PATTERN EXAMPLE SCALE:25X ( 0.23) METAL 0.05 MAX 0.05 MIN ( 0.23) SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219481/A 10/2014 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). www.ti.com EXAMPLE STENCIL DESIGN YFF0056 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP (R0.05) TYP 56X ( 0.25) 1 2 3 4 5 6 7 A (0.4) TYP METAL TYP B C D SYMM E F G H SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:30X 4219481/A 10/2014 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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