CM1423 Secure Digital (SD) Card EMI Filter Array with ESD Protection Features Product Description • California Micro Devices's CM1423 is an EMI filter array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The CM1423’s filters have component values of 12pF100Ω-12pF. The part includes ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All the ESD diodes are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • • Provides EMI filtering and ESD protection for an SD port on a mobile device Six channels of EMI filtering with ESD protection Four channels of ESD protection ±15kV ESD protection on all I/O pins (IEC 610004-2, contact discharge) ±30kV ESD protection (HBM) Better than 25dB of attenuation at 1GHz for 12pF100Ω -12pF filter configuration Integrates 34 components into small form factor CSP solution 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Available with OptiGuard™ coated version for improved reliability at assembly Lead-free version available Applications • • • • Secure Digital (SD) Card data lines in mobile handsets SD Card interface protection for other mobile electronics such as MP3 players, PDAs and digital cameras I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1423 is ideal for EMI filtering and protecting data lines from ESD for the Secure Digital (SD) Card interface slot in mobile handsets. The CM1423 is an all-inclusive solution for the SD card interface since its EMI filters provide the proper cut-off frequency to attenuate unwanted signals. The CM1423 is manufactured in a space-saving, lowprofile, chip-scale package, and is optionally available with OptiGuard™ coating for improved reliability. It is also available with lead-free finishing. Electrical Schematic DAT 2 100Ω A1 12pF DAT 3 100Ω A2 12pF CLK 100Ω A5 12pF C2 DAT 3 DAT 0 CMD DAT 1 12pF C7 12pF VSS1* A4 C4 A6 C6 VDD* DAT 0 ESD* VSS2* 12pF 100Ω A8 CLK 12pF 12pF C3 C5 100Ω A7 12pF 100Ω A3 DAT 2 12pF 12pF CMD C1 C8 12pF DAT 1 * In a typical SD Card application, A4 (A6) is connected to C4 (C6). See example given in applications section. © 2005 California Micro Devices Corp. All rights reserved. 01/12/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CM1423 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 A DAT2 DAT3 CMD VDD CLK VSS2 DAT0 C1 C2 C3 C4 C5 C6 C7 N231 B Orientation Marking C DAT1 C8 GND GND GND GND B1 B2 B3 B4 A1 A2 A3 A4 A5 A6 A7 A8 A1 DAT2 DAT3 CMD VSS1 CLK ESD DAT0 DAT1 DAT1 CM1423-01 Chip Scale Package (non-coated) Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 A DAT2 DAT3 CMD VDD CLK VSS2 DAT0 C1 C2 C3 C4 C5 C6 C7 N233 B Orientation Marking C C8 GND GND GND GND B1 B2 B3 B4 A1 A2 A3 A4 A5 A6 A7 A8 A1 DAT2 DAT3 CMD VSS1 CLK ESD DAT0 DAT1 CM1423-03 Chip Scale Package (OptiGuard™ coated) Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 DAT2 DATA2 Filter+ESD Channel, System Side C1 DAT2 DATA2 Filter+ ESD Channel, SD Card Side A2 DAT3 DATA3 Filter+ESD Channel, System Side C2 DAT3 DATA3 Filter+ ESD Channel, SD Card Side A3 CMD CMD Signal Filter+ESD Channel, System Side C3 CMD CMD Signal Filter+ESD Channel, SD Card Side A4 VSS1 ESD-only Channel, Supply Voltage Ground C4 VDD ESD-only Channel, Supply Voltage A5 CLK Clock Filter + ESD Channel C5 CLK Clock Filter + ESD Channel A6 ESD ESD-only Channel C6 VSS2 Supply Voltage Ground A7 DAT0 DATA0 Filter+ ESD Channel, System Side C7 DAT0 DATA0 Filter+ ESD Channel, SD Card Side A8 DAT1 DATA1 Filter+ ESD Channel, System Side C8 DAT1 DATA1 Filter+ ESD Channel, SD Card Side B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish OptiguardTM Coated No Coating Ordering Part OptiguardTM Coated No Coating Number1 Number1 Part Marking Ordering Part Number1 Part Marking Ordering Part PKG Part Marking Ordering Part Bumps Number1 Part Marking 20 CSP CM1423-01CS N231 CM1423-03CS N233 CM1423-01CP N231 CM1423-03CP N233 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/12/05 CM1423 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS R Resistance C Capacitance At 2.5V DC, 1MHz, 30mV AC Diode Standoff Voltage IDIODE = 10µA ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R = 100Ω, C = 12pF; Note 5 VDIODE VCL fC MIN TYP MAX UNITS 80 100 120 Ω 9 12 15 pF 5.5 V 100 5.6 -1.5 6.8 -0.8 nA 9.0 -0.4 V V ±30 kV ±15 kV +12 -7 V V 145 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 01/12/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CM1423 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/12/05 CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. A5-C5 EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 01/12/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CM1423 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 5. A7-C7 EMI Filter Performance Figure 6. A8-C8 EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/12/05 CM1423 Performance Information Figure 7. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 01/12/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 CM1423 Application Information CHIPSET SIDE CM1423 100k A1 DAT2 FILTER+ESD CONNECTOR SIDE C1 DAT2 100k A2 DAT3 FILTER+ESD C2 CD/DAT3 10k A3 CMD FILTER+ESD A4 VSS1 C3 C4 SD Memory Card CMD VDD 100k A5 CLK FILTER+ESD A6 ESD C5 C6 (top view, card contacts are on the bottom side) CLK VSS2 9 = DAT2 1 = CD/DAT3 2 = CMD 3 = VSS1 (GND) 4 = VDD 5 = CLK 6 = VSS2 (GND) 7 = DAT0 8 = DAT1 100k A7 DAT0 FILTER+ESD C7 DAT0 100k DAT1 A8 FILTER+ESD C8 DAT1 Note: 100kΩ and 10kΩ pull-up resistors are not included in CM1423. Designer will need to determine the appropriate pull-up resistor value for each design. Figure 8. Typical SD Card Application © 2005 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/12/05 CM1423 Application Information (cont’d) Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 9. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 10. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 11. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 01/12/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 9 CM1423 Mechanical Details CM1423Mechanical Specifications Mechanical Package Diagrams The package dimensions for the CM1423-01 and the CM1423-03 are presented below. CM1423-01 (non-coated CSP) BOTTOM VIEW A1 PACKAGE DIMENSIONS Custom CSP Bumps 20 C Min Nom B Inches Max Min Nom A Max 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D3 0.600 0.670 0.739 0.0236 0.0264 0.0291 D4 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel 2 3 4 5 7 6 8 D1 D2 CM1423-03 (OptiGuard™-coated CSP) OptiGuardTM Coating BOTTOM VIEW A1 C1 B2 B1 C B A A 1 2 3 4 5 7 6 8 D3 D4 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 3500 pieces Controlling dimension: millimeters A2 0.355 0.380 0.405 0.0140 0.0150 0.0159 1 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS C2 D2 A B4 B3 A1 A2 Millimeters C2 Dim SIDE VIEW B2 B1 B4 B3 Package C1 SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1423 Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1423-01 4.00 X 1.46 X 0.60 4.11 X 1.57 X 0.76 12mm 330mm (13") 3500 4mm 4mm CM1423-03 4.00 X 1.46 X 0.67 4.11 X 1.57 X 0.76 12mm 330mm (13") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 12. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 01/12/05