TOSHIBA CLS02

CLS02
TOSHIBA Schottky Barrier Diode
CLS02
Switching-Mode Power Supply (Secondary-Rectification)
Applications (Low Voltage)
DC/DC Converter Applications
Unit: mm
4 ± 0.2
②
Repetitive peak reverse voltage: VRRM = 40 V
Suitable for compact assembly due to small surface-mount package:
1.2 ± 0.1
“L−FLATTM” (Toshiba package name)
Rating
Unit
Repetitive peak reverse voltage
VRRM
40
V
Average forward current
IF (AV)
10 (Note.1)
A
IFSM
100 (50 Hz)
A
Tj
−40~125
°C
Tstg
−40~150
°C
Non-repetitive peak surge current
Junction temperature
Storage temperature range
2.85 ± 0.2
Symbol
① ANODE
② CATHODE
JEDEC
⎯
JEITA
⎯
TOSHIBA
Note1: Tℓ = 75°C
Rectangular waveform (α = 180°), VR = 20 V
2.7 ± 0.2
0 ~ 0.03
1.8 ± 0.1
①
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
0.8 ± 0.2
•
•
4.2 ± 0.2
Average forward current: IF (AV) = 10 A
3.2 ± 0.2
Forward voltage: VFM = 0.55 V (max)
•
5.5 ± 0.1
•
0.6 ± 0.1
8.2 ± 0.2
1.5 ± 0.1
3-4F1A
Weight: 0.15 g (typ.)
Note2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Peak repetitive reverse current
Junction capacitance
Symbol
Test Condition
Min
Typ.
Max
Unit
VFM (1)
IFM = 3.0 A (pulse test)
⎯
0.36
⎯
VFM (2)
IFM = 5.0 A (pulse test)
⎯
0.41
⎯
VFM (3)
IFM = 10 A (pulse test)
⎯
0.5
0.55
IRRM (1)
VRRM = 5 V (pulse test)
⎯
4.0
⎯
μA
IRRM (2)
VRRM = 40 V (pulse test)
⎯
0.03
1.0
mA
VR = 10 V, f = 1.0 MHz
⎯
420
⎯
pF
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(board thickness: 1.6 t)
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode
4.5 mm × 3.4 mm
⎯
⎯
100
°C/W
⎯
⎯
5
°C/W
Cj
Thermal resistance
(junction to ambient)
Rth (j-a)
Thermal resistance
(junction to lead)
Rth (j-ℓ)
⎯
1
V
2007-11-06
CLS02
Marking
Abbreviation Code
Part No.
S02
CLS02
Standard Soldering Pad
Unit: mm
2.9
2.5
5.9
1.8
2.6
4.8
Handling Precautions
1)
Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility
that SBD will cause thermal runaway when used under high-temperature or high-voltage conditions. Be sure
to take forward and reverse loss into consideration during design.
2)
The absolute maximum ratings, are rated values that must not be exceeded during operation, even for an
instant. The following are the general derating methods that we recommend for when designing a circuit
incorporating this device.
VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account when designing a device for operation at low
temperatures.
IF (AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF
(AV) and that Tj be below 100°C. When using this device, take the margin into consideration by
using an allowable Tamax-IF (AV) curve.
IFSM:
This rating specifies the non-repetitive peak current. This applies only to abnormal operation,
which seldom occurs during the lifespan of the device.
Tj:
Derate this rating when using the device in order to ensure high reliability. We recommend that
the device be used at a Tj of below 100°C.
3)
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the
device. When using the device, design the circuit board and soldering land size to match the appropriate
thermal resistance value.
4)
Refer to the databook on Rectifiers for further information.
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CLS02
PF (AV) – IF (AV)
Instantaneous forward current
Average forward power dissipation
PF (AV) (W)
10.0
iF
(A)
iF – vF
100
Tj = 125°C
10
75°C
1
25°C
0.1
Pulse test
0.01
0.0
0.2
0.4
0.6
0.8
Instantaneous forward voltage
DC
8.0
180°
6.0
α = 60°
4.0
Rectangular
waveform
2.0
0° α 360°
Conduction angle α
0.0
1.0
vF
120°
0
4
(V)
100
40
0° α 360°
IF (AV)
Conduction
angle α
VR = 20 V
20
0
DC
180°
Rectangular
waveform
60
0
4
8
12
Average forward current
(A)
IF (AV)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness: 1.6 t)
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode
4.5 mm × 3.4 mm
120
100
Ta max (°C)
Maximum allowable temperature
120
80
Rectangular
waveform
DC
60
α = 180°
40
0° α 360°
IF (AV)
Conduction
angle α
VR = 20 V
20
0
16
0
4
(A)
8
12
Average forward current
IF (AV)
16
(A)
rth (j-a) – t
1000
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
140
120°
IF (AV)
16
Ta max – IF (AV)
Tℓ max – IF (AV)
α = 60°
12
Average forward current
140
80
8
500
300
100
50
30
10
5
3
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness: 1.6 t)
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode
4.5 mm × 3.4 mm
1
0.5
0.3
0.1
0.001
0.003
0.01
0.03
0.1
0.3
Time
1
3
t
3
10
30
100
300
1000
(s)
2007-11-06
CLS02
Surge forward current
(non-repetitive)
(typ.)
(A)
Ta = 25°C
5000
f = 1 MHz
Junction capacitance
1000
500
100
50
10
3
1
5
10
30
Reverse voltage
VR
50
100
120
Ta = 25°C
IFSM
Cj (pF)
10000
100
Peak surge forward current
Cj – V R
80
f = 50 Hz
60
40
20
0
3
1
(V)
IR – Tj
PR (AV) – VR
(typ.)
2.0
10
100
40 V
30 V
20 V
10 V
VR = 5 V
(typ.)
1.5
PR (AV) (W)
Average reverse power dissipation
(mA)
IR
Reverse current
100
0.01
50
Rectangular
waveform
0°
360°
Pulse test
1
30
10
Number of cycles
1000
0.1
5
VR
α
300°
Conduction angle α
Tj = 125°C
1.0
DC
240°
180°
120°
0.5
α = 60°
0.001
0
20
40
60
80
100
Junction temperature
120
Tj
140
0.0
160
0
10
20
Reverse voltage
(°C)
4
30
VR
40
(V)
2007-11-06
CLS02
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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