NT *R oH S CO M PL IA Features ■ ■ ■ ■ ■ Applications Lead free as standard RoHS compliant* ESD protection Protects up to eight data lines Low insertion loss ■ ■ ■ Cell Phones PDAs and Notebooks GPS and SMART Cards 2FAI-M16R – Integrated Passive & Active Device using MLP General Information The 2FAI-M16R device, manufactured using Thin Film on Silicon technology, provides ESD protection for the external ports of portable electronic devices such as cell phones, modems and PDAs. I/O PADS GROUND PAD The ESD protection provided by the component enables a data port to withstand a minimum ±8 KV Contact /±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol Minimum Nominal Maximum Unit R 180 200 220 Ω Capacitance @ 2.5 V 1 MHz C 16 20 24 pF Rated Standoff Voltage V Breakdown Voltage @ 1 mA V Forward Voltage @ 10 mA V Leakage Current @ 3 V I (T = 25 °C unless otherwise noted) A Resistance 5.0 WM BR V 0.8 F V 0.1 D ESD Protection: IEC 61000-4-2 Contact Discharge Air Discharge V 6.0 ±8 ±15 µA kV kV Thermal Characteristics (T = 25 °C unless otherwise noted) A DC Power Rating P Operating Temperature Range T Storage Temperature Range T *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 100 mW J -40 25 +85 °C STG -55 25 +150 °C 2FAI-M16R – Integrated Passive & Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.000 (0.1181) 0.700 (0.0276) 4.000 (0.1575) 0.750 ± 0.05 (0.0295 ± 0.0020) FAI B0412 1.000 (0.0394) 3.000 (0.1181) 0.300 (0.0118) 0.500 (0.0197) How to Order 0.203 ± 0.025 (0.0079 ± 0.0010) 1.50 (0.059) BSC 0.500 (0.0197) 0.230 ± 0.05 (0.009 ± 0.0020) 0.400 ± 0.05 (0.009 ± 0.0020) 2 FAI – M 16 R Thin Film Model MLP Package 3.000 (0.1181) No. of Solder Pads 0.300 X 45 ° (0.0118) CHAMFER 1.55 ± 0.050 (0.061 ± 0.0020) SQ. Packaging Option R = Tape and Reel Packaged 3000 pcs. / 13 ˝ reel (100 % Sn Termination) 3.000 (0.1181) DIMENSIONS = MILLIMETERS (INCHES) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAI-M16R – Integrated Passive & Active Device using MLP Block Diagram The MLP Device block diagram below includes the pin names and basic electrical connections associated with each channel. EXT1 R1 INT1 EXT8 R8 GND GND EXT2 INT2 EXT7 R2 EXT3 INT8 R3 INT7 R7 INT3 EXT6 R6 GND INT6 GND EXT4 INT5 R4 GND Frequency Response Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. EXT5 INT5 R5 2FAI-M16R – Integrated Passive & Active Device using MLP Device Pin Out The Pin-Out for the device is shown below. Note also that the device is shown with bottom side pads facing up. EXT3 EXT4 EXT5 EXT6 16 15 14 13 EXT2 EXT1 INT1 INT2 1 2 3 4 12 11 10 9 EXT7 EXT8 INT8 INT7 Pin Out Function Pin Out Function Pin Out Function Pin1 EXT2 Pin5 INT3 Pin9 INT7 Pin2 EXT1 Pin6 INT4 Pin10 INT8 Pin3 INT1 Pin7 INT5 Pin11 EXT8 Pin4 INT2 Pin8 INT6 Pin12 EXT7 Pin Out Function Pin13 EXT6 Pin14 EXT5 Pin15 EXT4 Pin16 EXT3 5 6 7 8 INT3 INT4 INT5 INT6 Packaging The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard. TOP SIDE VIEW (INTO COMPONENT POCKET) DIMENSIONS = MILLIMETERS (INCHES) 4.0 ± 0.1 (.16 ± .004) 0.3 ± 0.05 (.01 ± .002) 1.5 ± 0.1/-0 (.06 ± .004/-0) DIA. 2.0 ± 0.05 (.08 ± .002) R 1.75 ± 0.1 (.07 ± .004) 0.3 MAX. (0.01) 0.9 ± 0.1 (.035 ± .004) 12.0 ± 0.3 (.47 ± .01) 3.4 ± 0.1 (.134 ± .004) 5.5 ± 0.3 (.22 ± .01) 3.4 ± 0.1 (.134 ± .004) 8.0 ± 0.3 (.31 ± .01) ORIENTATION OF COMPONENT IN POCKET R 0.25 TYP. (0.010) BACKSIDE FACING UP Reliable Electronic Solutions Asia-Pacific: TEL +886- (0)2 25624117 • FAX +886- (0)2 25624116 Europe: TEL +41-41 768 5555 • FAX +41-41 768 5510 The Americas: TEL +1-951 781-5492 • FAX +1-951 781-5700 www.bourns.com 2FAI-M16R REV. B 03/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.