EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED – 1W EHP-A07/UB01-P01 Features feature of the device: small package with high efficiency View angle: 120°. high luminous flux output: more than 9lm@350mA. ESD protection. soldering methods: SMT. grouping parameter: total luminous flux, dominant wavelength. z optical efficiency: 7 lm/W. z Thermal resistance (junction to lead): 17 K/W. z RoHS: The product itself will remain within RoHS compliant version z z z z z z Applications z z z z TFT LCD display backlight Decorative and entertainment illumination Signal and symbol luminaries for orientation marker lights (e.g. steps, exit ways, etc.) Exterior and interior automotive illumination Materials Items Description Housing Heat resistant polymer Encapsulating Resin Clear silicone resin Electrodes Ag plating copper alloy Die attach Silver paste Chip InGaN Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 1 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Dimensions Cathode mark Notes: 1. Dimensions are in millimeters 2. Tolerances unless dimensions ±0.25mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 2 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Maximum Ratings (T Ambient=25ºC) Parameter Symbol Rating Unit Operating Temperature Topr -40 ~ +100 ºC Storage Temperature Tstg -40 ~ +100 ºC Junction temperature Tj 125 ºC Forward Current IF 500 mA Power Dissipation Pd 2.1 W Junction to heat-sink thermal resistance Rth 17 K/W Electro-Optical Characteristics (T Ambient=25ºC) Parameter Bin Luminous Flux(1) Min Typ. Max E4 5 ---- 6 E5 6 ---- 8 8 ---- 10 10 ---- 13 ---- 120 ---- 3.25 ---- 3.55 3.55 ---- 3.85 3.85 ---- 4.15 460 ---- 465 465 ---- 470 F1 Symbol Фv F2 Viewing Angle(2) ---- 2θ1/2 V2 Forward Voltage(3) V3 VF V4 B7 Wavelength(4) B8 λd Unit Condition lm deg IF=350mA V nm Note. 1. Luminous flux measurement tolerance : ±10% 2. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 3. Forward Voltage measurement tolerance : ±0.1V 4. Wavelength measurement tolerance : ±1nm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 3 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=350mA, T Ambient=25ºC Forward Voltage vs Forward Current, T Ambient=25ºC 3.8 Forward Voltage (Volt) Relative Luminous Intensity (%) 100 80 60 40 20 3.6 3.4 3.2 3.0 0 400 500 600 700 2.8 800 0 100 200 Wavelength (nm) 1.4 500 400 1.2 Forward Current (mA) Relative Luminous Intensity 400 Forward Current Derating Curve, Derating based on TJMAX=125°C Relative Luminous Intensity vs Forward Current, T Ambient=25ºC 1.0 0.8 0.6 0.4 350 300 250 200 150 0.2 0.0 300 Forward Current (mA) 0 100 200 300 400 500 Forward Current (mA) 100 0 20 40 60 80 ο Ambient Temperature ( C) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 4 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen 100 EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Typical Representative Spatial Radiation Pattern 0 10 1.0 30 0.9 Relative Intensity 20 40 0.8 50 0.7 0.6 60 0.5 0.4 70 0.3 0.2 80 0.1 90 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 Angle (Degree) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 5 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Label explanation CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is ±0.1mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 6 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Carrier Tape Dimensions: Loaded quantity 800 PCS per reel. Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is ±0.1mm Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 7 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Reliability Test Items and Results Stress Test Stress Condition Stress Duration Solderability Tsol=230℃, 5sec 1 times Reflow Tsol=260℃, 10sec, 6min 3 times H：＋110℃ 20min. '∫ 10sec. 'L：－ 40℃ 20min. 500 Cycles Temperature Cycle H：＋100℃ 30min. '∫ 5min. 'L：－ 40℃ 30min. 1000 Cycles High Temperature/Humidity Reverse Bias Ta=85℃ , RH=85% 1000hours High Temperature Storage Ta=110℃ 1000hours Low Temperature Storage Ta=-40℃ 1000hours Intermittent operational Life Ta=25℃, IF=1000mA 30mS on/ 2500mS off 1000hours High Temperature Operation Life #1 Ta=55℃, IF=350mA 1000hours High Temperature Operation Life #2 Ta=85℃, IF=225mA 1000hours High Temperature Operation Life #3 Ta=100℃, IF=150mA 1000hours Low Temperature Operation Life Ta=-40℃, IF=350mA 1000hours Power Temperature Cycle H：＋85℃ 15min. '∫ 5min. 'L：－ 40℃ 15min. IF=225mA,2min on/off 1000cycles ESD Human Body Model 2000V, Interval:0.5sec 3 times ESD Machine Model 200V, Interval:0.5sec 3 times Thermal Shock *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)＜50% *VF: FORWARD VOLTAGE DIFFERENCE＜20% Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 8 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 Precautions For Use 1. Over-current-proof Though EHP-A07 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. Storage i. Do not open moisture proof bag before the products are ready to use. ii. Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. iii. The LEDs should be used within a year. iv. After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less. v. The LEDs should be used within 168 hours (7 days) after opening the package. vi. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. vii. Pre-curing treatment : 60±5℃ for 24 hours. 3. Thermal Management i. Because EHP-A07 LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance. ii. Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat. iii. A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum. iv. Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. v. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 9 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen EVERLIGHT ELECTRONICS CO.,LTD. EHP-A07/UB01-P01 4. Soldering Condition i. Lead reflow soldering temperature profile ii. Reflow soldering should not be done more than two times. iii. While soldering, do not put stress on the LEDs during heating. iv. After soldering, do not warp the circuit board 5. Soldering Iron i. For prototype builds or small series production runs it is possible to place and solder the LED by hand. ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. iv. Be careful because the damage of the product is often started at the time of the hand solder. 6. Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 2.0 Page: 10 of 11 Device No. : DSE-7N1-003 Prepared date: Sep 10, 2006 Prepared by: Peggy Chen