Rohm BD2065AFJ-E2 High side switch ic Datasheet

Datasheet
High Side Switch ICs 1ch
BD2061AFJ
BD2065AFJ
●Key Specifications
„ Input voltage range:
2.7V to 5.5V
„ ON resistance :
80mΩ(Typ.)
„ Over current threshold:
1.1A min., 2.3A max.
„ Standby current:
0.01μA (Typ.)
„ Operating temperature range:
-40℃ to +85℃
●General Description
Single channel high side switch IC for USB port is a
high side switch having over current protection used in
power supply line of universal serial bus (USB).
N-channel power MOSFET of low on resistance and
low supply current are realized in this IC.
And, over current detection circuit, thermal shutdown
circuit, under voltage lockout and soft start circuit are
built in.
●Package
SOP-J8
W(Typ.) D(Typ.) H (Max.)
4.90mm x 6.00mm x 1.65mm
●Features
„ Low on resistance 80mΩ N-ch MOSFET Switch.
„ Continuous current load 1.0A
„ Control input logic
¾ Active-Low :
BD2061AFJ
¾ Active-High:
BD2065AFJ
„ Soft start circuit
„ Over current detection
„ Thermal shutdown
„ Under voltage lockout
„ Open drain error flag output
„ Reverse-current protection when power switch off
„ TTL Enable input
„ 1.2ms typical rise time
SOP-J8
●Applications
USB hub in consumer appliances, Car accessory, PC,
PC peripheral equipment, and so forth
●Typical Application Circuit
5V(typ.)
GND
OUT
IN
OUT
IN
OUT
VBUS
D+
+
C IN
CL -
DGND
EN( /EN ) /OC
●Lineup
Min.
1.1A
1.1A
Over current threshold
Typ.
Max.
1.5A
2.3A
1.5A
2.3A
○Product structure：Silicon monolithic integrated circuit
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001
Control input logic
Package
Orderable Part Number
Low
SOP-J8
Reel of 2500
BD2061AFJ – E2
High
SOP-J8
Reel of 2500
BD2065AFJ – E2
○This product has no designed protection against radioactive rays
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BD2061AFJ
Datasheet
BD2065AFJ
●Block Diagram
UVLO HYSTERESIS VOLTAGE : VHYS[V]
1 .0
0 .8
0 .6
0 .4
0 .2
0 .0
-5 0
0
50
100
A M B IE N T T E M P E R A T U R E : T a [℃ ]
●Pin Configurations
●Pin Descriptions
◎BD2061AFJ
Pin No.
Symbol
BD2065AFJ
TOP VIEW
BD2061AFJ
TOP VIEW
1
GND
OUT
8
1
GND
OUT
8
2
IN
OUT
7
2
IN
OUT
7
3
IN
OUT
6
3
IN
OUT
6
4
/EN
/OC
5
4
EN
/OC
5
I/O
Pin function
1
GND
I
Ground.
2, 3
IN
I
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
When used, connect each pin outside.
4
/EN
I
Enable input.
Power switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
5
/OC
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7, 8
OUT
O
Power switch output.
When used, connect each pin outside.
◎BD2065AFJ
Pin No.
Symbol
I/O
Pin function
1
GND
I
Ground.
2, 3
IN
I
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
When used, connect each pin outside.
4
EN
I
Enable input.
Power switch on at High level.
High level input > 2.0V, Low level input < 0.8V
5
/OC
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7, 8
OUT
O
Power switch output.
When used, connect each pin outside.
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BD2061AFJ
Datasheet
BD2065AFJ
●Absolute Maximum Ratings
Parameter
Symbol
Ratings
Supply voltage
VIN
-0.3
to
6.0
Enable voltage
Unit
V
VEN, V/EN
-0.3
to
6.0
V
/OC voltage
V/OC
-0.3
to
6.0
V
/OC current
IS/OC
OUT voltage
VOUT
-0.3
6.0
V
Storage temperature
TSTG
-55 to 150
℃
Power dissipation
10
to
A
*1
PD
560
mW
*1 In case Ta = 25℃ is exceeded, 4.48mW should be reduced per 1℃.
●Recommended Operating Range
Parameter
Operating voltage
Operating temperature
Continuous output current
Symbol
Ratings
Unit
VIN
2.7 to 5.5
V
TOPR
-40 to 85
℃
ILO
0 to 1.0
A
●Electrical Characteristics
◎BD2061AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25℃)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Condition
Operating Current
IDD
-
90
120
μA
V/EN = 0V, OUT = OPEN
Standby Current
ISTB
-
0.01
1
μA
V/EN = 5V, OUT = OPEN
V/EN
2.0
-
-
V
High input
-
-
0.8
V
Low input
/EN input voltage
V/EN
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
/EN input current
I/EN
-1.0
0.01
1.0
μA
V/EN = 0V or V/EN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
TD/OC
-
2.5
8
ms
ON resistance
RON
-
80
100
mΩ
Over-current Threshold
ITH
1.1
1.5
2.3
A
Output current at short
ISC
1.1
1.5
1.9
A
TON1
-
1.2
10
ms
Output turn on time
TON2
-
1.5
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
Output rise time
UVLO threshold
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IOUT = 1.0A
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
RL = 10Ω , CL = OPEN
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BD2061AFJ
Datasheet
BD2065AFJ
●Electrical Characteristics - continued
◎BD2065AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating Current
IDD
-
90
120
μA
VEN = 5V, OUT = OPEN
Standby Current
ISTB
-
0.01
1
μA
VEN = 0V, OUT = OPEN
VEN
2.0
-
-
V
High input
-
-
0.8
V
Low input
EN input voltage
VEN
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 5V
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
TD/OC
-
2.5
8
ms
ON resistance
RON
-
80
100
mΩ
Over-current Threshold
ITH
1.1
1.5
2.3
A
Output current at short
ISC
1.1
1.5
1.9
A
TON1
-
1.2
10
ms
Output turn on time
TON2
-
1.5
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
EN input current
/OC output LOW voltage
Output rise time
UVLO Threshold
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IOUT = 1.0A
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
RL = 10Ω , CL = OPEN
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BD2061AFJ
Datasheet
BD2065AFJ
●Measurement Circuit
VIN
VIN
A
1uF
1uF
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
/OC
EN(/EN)
/OC
GND
RL
VEN (V/EN )
VEN (V/EN )
A. Operating current
VIN
B. EN, /EN input voltage, Output rise, fall time
VIN
VIN
10k
1uF
VIN
1uF
I/OC
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
/OC
EN(/EN)
CL
/OC
IOUT
CL
VEN (V/EN )
VEN (V/EN )
C. ON resistance, Over current detection
D. /OC output LOW voltage
Figure 1. Measurement circuit
●Timing Diagram
TOFF1
TOFF1
TON1
VOUT
TON1
90%
10%
90%
VOUT
10%
90%
10%
90%
10%
TOFF2
TOFF2
TON2
TON2
V/EN
VEN
50%
50%
50%
Figure 2. Timing diagram (BD2061AFJ)
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TSZ22111･15･001
50%
Figure 3. Timing diagram (BD2065AFJ)
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Datasheet
BD2065AFJ
●Typical Performance Curves
120
120
VIN=5.0V
OPERATING CURRENT :
IDD [μA]
OPERATING CURRENT :
IDD [μA]
Ta=25°C
100
100
80
60
40
20
80
60
40
20
0
0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
Figure 4. Operating current
EN,/EN Enable
1.0
Figure 5. Operating current
EN,/EN Enable
1.0
Ta=25°C
VIN=5.0V
0.8
STANDBY CURRENT :
ISTB[μA]
0.8
STANDBY CURRENT :
ISTB[μA]
6
0.6
0.4
0.2
0.0
0.6
0.4
0.2
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 6. Standby current
EN,/EN Disable
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0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 7. Standby current
EN,/EN Disable
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Datasheet
BD2065AFJ
●Typical Performance Curves - continued
2.0
Ta=25°C
VIN=5.0V
ENABLE INPUT VOLTAGE :
VEN, V /EN[V]
ENABLE INPUT VOLTAGE :
VEN, V /EN[V] 0
2.0
1.5
1.5
Low to High
High to Low
1.0
Low to High
High to Low
1.0
0.5
0.5
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
0
50
AMBIENT TEMPERATURE : Ta[℃]
Figure 8. EN,/EN input voltage
Figure 9. EN,/EN input voltage
0.5
0.5
Ta=25°C
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
100
0.4
0.3
0.2
0.1
VIN=5.0V
0.4
0.3
0.2
0.1
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
Figure 11. /OC output LOW voltage
Figure 10. /OC output LOW voltage
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0
50
100
AMBIENT TEMPERATURE : Ta[℃]
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Datasheet
BD2065AFJ
●Typical Performance Curves - continued
200
200
VIN=5.0V
150
150
ON RESISTANCE :
RON [mΩ]
ON RESISTANCE :
RON[ mΩ]
Ta=25°C
100
100
50
50
0
0
2
3
4
5
SUPPLY VOLTAGE : VDD [V]
6
-50
0
50
AMBIENT TEMPERATURE : Ta[℃]
Figure 12. ON resistance
Figure 13. ON resistance
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
4.0
/OC DELAY TIME :
TD/OC[mS]
/OC DELAY TIME :
TD/OC[mS]
100
3.0
2.0
1.0
3.0
2.0
1.0
0.0
2
3
4
5
0.0
6
-50
SUPPLY VOLTAGE: VIN[V]
50
100
AMBIENT TEMPERATURE: Ta[℃]
Figure 14. /OC output delay time
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0
Figure 15. /OC output delay time
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Datasheet
BD2065AFJ
●Typical Performance Curves - continued
2.00
SHORT CIRCUIT CURRENT : ISC [A]
SHORT CIRCUIT CURRENT : ISC [A]
2.00
Ta=25°C
1.50
1.00
0.50
0.00
VIN=5.0V
1.50
1.00
0.50
0.00
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃ ]
Figure 16. Output current at
shortcircuit
Figure 17. Output current at
shortcircuit
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
RISE TIME :
T ON1 [ms]
RISE TIME :
T ON1 [ms]
4.0
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
-50
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Figure 18. Output rise time
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TSZ22111･15･001
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 19. Output rise time
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BD2061AFJ
Datasheet
BD2065AFJ
●Typical Performance Curves - continued
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
TURN ON TIME :
TON2 [ms]
TURN ON TIME :
TON2 [ms]
4.0
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
-50
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 20. Output turn on time
Figure 21. Output turn on time
5.0
5.0
VIN=5.0V
Ta=25°C
4.0
4.0
FALL TIME :
T OFF1[μs]
FALL TIME :
T OFF1[μs]
0
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
Figure 23. Output fall time
Figure 22. Output fall time
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TSZ22111･15･001
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
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Datasheet
BD2065AFJ
●Typical Performance Curves - continued
5.0
5.0
VIN=5.0V
Ta=25°C
4.0
TURN OFF TIME :
TOFF2 [μs]
TURN OFF TIME :
TOFF2 [μs]
4.0
3.0
2.0
1.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 24. Output turn off time
Figure 25. Output turn off time
2.5
1.0
UVLO HYSTERESIS VOLTAGE : VHYS[V]
UVLO THRESHOLD VOLTAGE :
VUVLOH , V UVLOL [V]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2.4
VUVLOH
2.3
VUVLOL
2.2
2.1
2.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 26. UVLO threshold voltage
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0.8
Figure 27. UVLO hysteresis voltage
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Datasheet
BD2065AFJ
●Typical Wave Forms
V/EN
V/EN
(5V/div )
(5V/div.)
V/OC
V/OC
(5V/div.)
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=10Ω
CL=100μF
IOUT
IOUT
(0.5A/div.)
(0.5A/div.)
VIN=5V
RL=10Ω
CL=100μF
TIME(1ms/div.)
TIME(1ms/div.)
Figure 28. Output rise characteristic
(BD2061AFJ)
Figure 29. Output fall characteristic
(BD2061AFJ)
VEN
V/OC
(5V/div.)
(5V/div.)
V/OC
VOUT
(5V/div.)
(5V/div.)
CL=220μF
IOUT
CL=330μF
CL=147μF
(0.5A/div.)
IOUT
(0.5A/div.)
CL=47μF
VIN=5V
RL= 5Ω
VIN=5V
TIME (0.5ms/div.)
TIME (20ms/div.)
Figure 30. Inrush current response
(BD2061AFJ)
Figure 31. Over current response
Ramped load
(BD2061AFJ)
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Datasheet
BD2065AFJ
●Typical Wave Forms - continued
V/OC
V/EN
(5V/div.)
(5V/div.)
V/OC
VOUT
(5V/div.)
(5V/div.)
VOUT
(5V/div.)
IOUT
IOUT
(1.0A/div.)
(1.0A/div.)
VIN=5V
CL=100μF
VIN=5V
TIME (2ms/div.)
TIME (2ms/div.)
Figure 32. Over current response
Ramped load
(BD2061AFJ)
Figure 33. Over current response
Enable to shortcircuit
(BD2061AFJ)
V/OC
V/OC
(5V/div.)
(5V/div.)
VOUT
VOUT
(5V/div.)
(5V/div.)
Thermal Shutdown
VIN=5V
CL=100μF
IOUT
IOUT
(1.0A/div.)
(1.0A/div.)
VIN=5V
CL=100μF
TIME (2ms/div.)
TIME (0.2s/div.)
Figure 34. Over current response
Enable to shortcircuit
(BD2061AFJ)
Figure 35. Over current response
Enable to shortcircuit
(BD2061AFJ)
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Datasheet
BD2065AFJ
●Typical Wave Forms - continued
VIN
VIN
(5V/div.)
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(1.0A/div.)
IOUT
(1.0A/div.)
V/OC
(5V/div.)
V/OC
RL=5Ω
CL=147μF
(5V/div.)
RL=5Ω
CL=147μF
TIME (10ms/div.)
TIME (10ms/div.)
Figure 36. UVLO response
Increasing VIN
(BD2061AFJ)
Figure 37. UVLO response
Decreasing VIN
(BD2061AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2065AFJ, refer to the characteristic of BD2061AFJ.
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BD2061AFJ
Datasheet
BD2065AFJ
●Typical Application Circuit
5V(typ.)
VBUS
D+
IN
Regulator
OUT
DGND
USB
Controller
10k to
100kΩ
CIN
GND
OUT
IN
OUT
IN
OUT
EN(/EN) /OC
VBUS
+
CL -
D+
DGND
●Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source
lines to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up value which satisfies the application as CL.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
●Functional Description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by an 80mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is not present in the off status, it is possible
to prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 140℃ (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power
switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 120℃ (typ.),
power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is
removed or the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs an error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
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3-1. When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
3-2. When the output short-circuits or high-current load is connected while the switch is on, very large current flows until
the over current limit circuit reacts. When the current detection limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of 100mV(Typ).
Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current or thermal shutdown, the output level is low.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
V/EN
VOUT
Output shortcircuit
Thermal shut down
IOUT
V/OC
delay
Figure 38. Over current detection, thermal shutdown timing
(BD2061FJ)
VEN
VOUT
Output shortcircuit
Thermal shut down
IOUT
V/OC
delay
Figure 39. Over current detection, thermal shutdown timing
(BD2065AFJ)
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●Power Dissipation
(SOP-J8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Figure 40. Power dissipation curve (Pd-Ta Curve)
●I/O Equivalence Circuit
Symbol
Pin No
EN(/EN)
4
/OC
5
OUT
6,7,8
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●Operational Notes
(1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
(4) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
(9) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
E
Parasitic
element
N
N
P+
GND
Parasitic element
Figure 41.
C
N
P substrate
GND
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B
P+
P
E
P substrate
Parasitic element
N
GND
Parasitic
GND element
Other adjacent elements
Example of monolithic IC structure
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BD2065AFJ
(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature
of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
Power dissipation
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
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BD2061AFJ
Datasheet
BD2065AFJ
●Ordering Information
B
D
2
0
6
1
A
Part Number
B
D
F
J
-
Package
FJ: SOP-J8
2
0
6
5
A
Part Number
F
J
Package
FJ: SOP-J8
E2
Packaging and forming specification
E2: Embossed tape and reel
-
E2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Part Number Marking
BD2061AFJ
D061A
BD2065AFJ
D065A
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BD2065AFJ
●Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
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Datasheet
BD2065AFJ
●Revision History
Date
Revision
11.Mar.2013
001
Changes
New Release
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Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
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Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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