Rohm BD9560MUV Switching regulator controller for graphic chip core Datasheet

High performance Regulators for PCs
Switching Regulator Controller
for Graphic Chip Cores
BD9560MUV
No.10030ECT10
●Description
BD9560MUV is a switching regulator controller with high output current which can achieve low output voltage (0.412V ~
1.2875V) from a wide input voltage range (4.5V ~ 25V). The setting of output voltage depends on DAC built in. High
efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. SLLM (Simple
Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide
load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection
function with timer latch, over voltage protection, over current protection and power good function are all built in. This
switching regulator is specially designed for GMCH.
●Features
1) Switching Regulator Controller
2) Light Load Mode and Continuous Mode Changeable
3) Thermal Shut Down circuit built-in (TSD)
4) Under Voltage Lockout circuit built-in (UVLO)
5) Over Current Protection circuit built-in (OCP)
6) Over Voltage Protection circuit built-in (OVP)
7) Short circuit protection with timer-latch built-in
8) Power good circuit built-in
9) Soft start function to minimize rush current during startup
10) Switching Frequency Variable (f=200 KHz ~ 600 KHz)
11) VQFN032V5050 package
●Applications
Laptop PC, Desktop PC, Digital Components
●Maximum Absolute Ratings (Ta=25℃)
Parameter
Input voltage 1
Input voltage 2
Input voltage 3
BOOT voltage
BOOT-SW voltage
HG-SW voltage
LG voltage
VREF voltage
VRON input voltage
Logic input voltage
Logic output voltage 1
Logic output voltage 2
Power dissipation1
Power dissipation2
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Symbol
VCC
PVCC
VIN
BOOT
BOOT-SW
HG-SW
LG
VREF
VRON
CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C
PWRGD
SUS_OUT
Pd1
Pd2
Topr
Tstg
Tjmax
Ratings
*1*2
7
7 *1*2
35 *1*2
35 *1*2
7 *1*2
7 *1*2
PVCC
VCC
7 *1
VCC
7
VCC
0.38*3
0.88*4
-10 ~ +100
-55 ~ +150
+150
Unit
V
V
V
V
V
V
V
V
V
V
V
V
W
W
℃
℃
℃
*1 Not to exceed Pd..
*2 Maximum voltage that can be proof against instantaneous applied voltage such as serge, back electromotive voltage or continuous pulse applied voltage
(Duty ratio : less than 10%)
*3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board )
*4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB.)
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1/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Operating Conditions (Ta=25℃)
Parameter
Ratings
Symbol
Min.
Max.
Unit
Input voltage 1
VCC
4.5
5.5
V
Input voltage 2
PVCC
4.5
5.5
V
Input voltage 3
VIN
4.5
25
V
BOOT voltage
BOOT
4.5
30
V
SW voltage
SW
-2
25
V
BOOT-SW
4.5
5.5
V
VRON input voltage
VRON
-0.3
5.5
V
Logic input voltage
BOOT-SW voltage
CL/SCP/SS/TON/SLLM/VID4-0/PWRGD_C/DAC_C
-0.3
VCC+0.3
V
Logic output voltage 1
PWRGD
-
5.5
V
Logic output voltage 2
SUS_OUT
-0.3
VCC
V
*This product should not be used in a radioactive environment.
●ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Ta=25℃, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V)
Limits
Parameter
Symbol
Unit
MIN.
TYP.
MAX.
Conditions
[Total block]
VCC bias current
ICC_VCC
-
4
10
mA
VCC=5V
VIN bias current
ICC_VIN
-
20
50
µA
VIN=12V
VCC shut down mode current
IST_VCC
-
0
10
µA
VRON=0V
VIN shut down mode current
IST_VIN
-
0
10
µA
VRON=0V
VRON low voltage
VRON_L
GND
-
0.8
V
VRON high voltage
VRON_H
2.3
-
5.5
V
VRON bias current
IVRON
-
10
20
µA
VRON=5V
Reference output voltage
VREF
2.475
2.500
2.525
V
IREF=0 to 100µA
Maximum source current
[Reference voltage block]
IREF_source
0.5
-
-
mA
Line regulation
Reg.l
-
0.1
0.3
%/V
VCC=4.5 to 5.5V
Load regulation
Reg.L
-
5
20
mV
IREF=0 to 0.5mA
Threshold voltage
VOVPL
1.400
1.500
1.600
V
Hysterisys voltage
VOVPH
50
150
250
mV
VCC input threshold voltage
VCC_UVLO
4.0
4.1
4.2
V
VCC hysterics voltage
dVCC_UVLO
50
100
200
mV
[Over voltage protection block]
[Under voltage lock-out block]
VCC: Sweep up
VCC: Sweep down
[VID block]
VID input high voltage
VVID_H
2.0
-
VCC
V
VID input low voltage
VVID_L
GND
-
0.8
V
VID bias current
IVID
-
0
1
µA
DAC delay charge current
IDAC+
90
170
250
µA
VVID=3.3V
DAC output voltage
VDAC
1.2683
1.2811
1.2939
V
VFB
VDAC-0.5%
VDAC
VDAC+0.5%
V
Current limit threshold1
Ilim
22
30
38
mV
CL=0.48V
CL adjustment range
CL bias current
VCL
ICL
0.2
-
0
1.5
1
V
µA
CL=5V
VID[0:4]=0V
[Error amplifier block]
Output feedback voltage
[Current limit protection block]
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© 2010 ROHM Co., Ltd. All rights reserved.
2/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●ELECTRICAL CHARACTERISTICS
(Unless otherwise noted, Ta=25℃, VCC=5V,VIN=12V, VRON=5V,VDAC=1.2811V,SLLM=0V)
Limits
Unit
Parameter
Symbol
MIN.
TYP.
MAX.
Conditions
[Load slope setup block]
Offset voltage
VLS
TBD
0
TBD
mV
Delay time
TSS
-
65
-
µs
SS Delay charge current
ISS
1.5
2.0
2.5
µA
Delay time
TSCP
-
60
-
µs
SCP Delay charge current
ISCP
1.5
2.0
2.5
µA
[Soft start block]
Css=100pF
[Short circuit Protection]
Cscp=100pF
[SLLM block]
Continuous mode threshold
Vthcon
GND
-
0.5
V
VthSL2M
VCC-0.5
-
VCC
V
Fosc
-
300
-
kHz
TON=1V
On time pulse width
Fosc
250
350
450
ns
TON=1V
TON adjustment voltage
VTON
0.2
-
2.0
V
TON bias current
ITON
-
0
1
µA
MinOff
0.25
0.5
1.0
µs
HG high side ON resistor
RonHGH
-
1
2
Ω
HG low side ON resistor
RonHGL
-
1
2
Ω
LG high side ON resistor
RonLGH
-
1
2
Ω
LG high side ON resistor
RonLGL
-
0.5
1
Ω
PWRGD Low threshold voltage
PGDLow
VDAC-0.4
VDAC-0.3
VDAC-0.2
V
PWRGD High threshold voltage
PGDHigh
VDAC+0.1
VDAC+0.2
VDAC+0.3
V
PWRGD Output voltage
VPWRGD
-
-
0.4
V
IPRGD=4mA
PWRGD Output leakage current
PGDLeak
-
-
10
µA
PWRGD=3.6V
PWRGD_C Delay charge current
IPD
1.5
2.0
2.5
µA
SLLM threshold
[Operating frequency]
Switching frequency
[On time pulse width]
TON=5V
[OFF time width]
Min off time
[Driver block]
[Power good block]
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3/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●DAC code table
Render Suspend States
Render Performance States
State
VRON
VID4
VID3
VID2
VID1
VID0
VCCGFX
1
0
0
0
0
0
1.28750V
1.2811V
0
1
0
0
0
0
1
1.26175V
1.2554V
0
1
0
0
0
1
0
1.23600V
1.2298V
0
1
0
0
0
1
1
1.21025V
1.2042V
0
1
0
0
1
0
0
1.18450V
1.1786V
0
1
0
0
1
0
1
1.15875V
1.1530V
0
1
0
0
1
1
0
1.13300V
1.1273V
0
1
0
0
1
1
1
1.10725V
1.1017V
0
1
0
1
0
0
0
1.08150V
1.0761V
0
1
0
1
0
0
1
1.05575V
1.0505V
0
1
0
1
0
1
0
1.03000V
1.0249V
0
1
0
1
0
1
1
1.00425V
0.9992V
0
1
0
1
1
0
0
0.97850V
0.9736V
0
1
0
1
1
0
1
0.95275V
0.9480V
0
1
0
1
1
1
0
0.92700V
0.9224V
0
1
0
1
1
1
1
0.90125V
0.8967V
0
1
1
0
0
0
0
0.87550V
0.8711V
0
1
1
0
0
0
1
0.84975V
0.8455V
0
1
1
0
0
1
0
0.82400V
0.8199V
1
1
1
0
0
1
1
0.79825V
0.7943V
1
1
1
0
1
0
0
0.77250V
0.7686V
1
1
1
0
1
0
1
0.74675V
0.7430V
1
1
1
0
1
1
0
0.72100V
0.7174V
1
1
1
0
1
1
1
0.69525V
0.6918V
1
1
1
1
0
0
0
0.66950V
0.6662V
1
1
1
1
0
0
1
0.64375V
0.6405V
1
1
1
1
0
1
0
0.61800V
0.6149V
1
1
1
1
0
1
1
0.59225V
0.5893V
1
1
1
1
1
0
0
0.56650V
0.5637V
1
1
1
1
1
0
1
0.54075V
0.5380V
1
1
1
1
1
1
0
0.51500V
0.5124V
1
1
1
1
1
1
1
0.41200V
0.4099V
1
0
×
×
×
×
×
0.000V
×
1
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4/21
VDAC
SUS OUT
2010.04 - Rev.C
Technical Note
BD9560MUV
3
3
2.5
2.5
2.5
2
2
2
1.5
RON[Ω]
3
RON[Ω]
RON[Ω]
●Reference Data
1.5
1
1
1
0.5
0.5
0.5
0
-10
10
30
50
Ta(℃)
70
0
-10
90
Fig.1 HG high side ON resistance
10
30
50
Ta(℃)
70
0
-10
90
1
1.35
10
30
50
Ta(℃)
70
90
Fig.3 LG high side ON resistance
Fig.2 HG low side ON resistance
1000
V IN=5V
V IN=12V
0.9
V IN=21V
DAC=0.412V
setup voltage+2%
0.8
800
setup voltage-2%
1.3
0.7
DAC=0.84975V
V nom+5%
V nom-5%
0.6
0.5
0.4
DAC=1.2875V
on time[ns]
VCC_CORE[V]
RON[Ω]
1.5
1.25
600
400
0.3
1.2
0.2
200
0.1
0
-10
10
30
50
Ta( ℃)
70
1.15
90
0
0
2
4
6
8
10
0
Io[A]
Fig.4 LG low side ON resistance
4ch IL
(5A/div)
4ch IL
(5A/div)
2ch HG
(10V/div)
Fig.8(VIN=12V)
Switching wave form (Iout=0A)
4ch IL
(5A/div)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
3ch LG
(5V/div)
3ch LG
(5V/div)
2ch HG
(10V/div)
2ch HG
(5V/div)
Fig.10 (VIN=5V)
Switching wave form (Iout=10A)
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Fig.11(VIN=12V)
Switching wave form (Iout=10A)
5/21
5
1ch Vout
(20mV/div)
3ch LG
(5V/div)
1ch Vout
(20mV/div)
4
1ch Vout
(20mV/div)
3ch LG
(5V/div)
Fig.7 (VIN=5V)
Switching wave form (Iout=0A)
3
Fig.6 Ton_On time
4ch IL
(5A/div)
2ch HG
(5V/div)
2
TON[V]
Fig.5 Load slope
1ch Vout
(20mV/div)
1
3ch LG
(5V/div)
2ch HG
(10V/div)
Fig.9 (VIN=21V)
Switching wave form (Iout=0A)
4ch IL
(5A/div)
1ch Vout
(20mV/div)
3ch LG
(5V/div)
2ch HG
(10V/div)
Fig.12 (VIN=21V)
Switching wave form (Iout=10A)
2010.04 - Rev.C
Technical Note
BD9560MUV
●Reference Data
4ch Iout
(5A/div)
4ch Iout
(5A/div)
4ch Iout
(5A/div)
3ch Vout
(50mV/div)
3ch Vout
(50mV/div)
2ch LG
(5V/div)
2ch LG
(5V/div)
2ch LG
(5V/div)
1ch HG
(5V/div)
1ch HG
(5V/div)
1ch HG
(10V/div)
Fig.13 Transient Response (VIN=5V)
VOUT=1.2875V, IOUT=0A→10A
Fig.14 Transient Response (VIN=12V)
VOUT=1.2875V, IOUT=0A→10A
3ch Vout
(50mV/div)
Fig.15 Transient Response (VIN=21V)
VOUT=1.2875V, IOUT=0A→10A
3ch Vout
(50mV/div)
3ch Vout
(50mV/div)
4ch Iout
(5A/div)
4ch Iout
(5A/div)
4ch Iout
(5A/div)
2ch LG
(5V/div)
2ch LG
(5V/div)
2ch LG
(5V/div)
1ch HG
(5V/div)
1ch HG
(5V/div)
1ch HG
(10V/div)
3ch Vout
(50mV/div)
Fig.16 Transient Response (VIN=5V)
VOUT=1.2875V, IOUT=10A→0A
Fig.17 Transient Response (VIN=12V)
VOUT=1.2875V, IOUT=10A→0A
VR_ON
VR_ON
VR_ON
2V/div
Fig.18 Transient Response (VIN=21V)
VOUT=1.2875V, IOUT=10A→0A
2V/div
2V/div
VOUT
200mV/div
VOUT
VOUT
200mV/div
200mV/div
IL
5A/div
Fig.19 Wakeup wave form
VOUT=1.2875V,VIN=12V, IOUT=0A
VR_ON
2V/div
Fig.20 Wakeup wave form
VOUT=1.2875V,VIN=12V, RVOUT=120mΩ
VOUT
VCC_CORE
200mV/div
Fig.21 Wakeup wave form
VOUT=0.84975V,VIN=12V, IOUT=0A
VR_ON
VR_ON
2V/div
2V/div
VOUT
100mV/div
VOUT
100mV/div
IL
Fig.22 Wakeup wave from
VOUT=0.84975V,VIN=12V, RVOUT=80mΩ
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IL
5A/div
5A/div
Fig.23 Wakeup wave form
VOUT=0.412V,VIN=12V, IOUT=0A
6/21
Fig.24 Wakeup wave form
VOUT=0.412V,VIN=12V, RVOUT=40mΩ
2010.04 - Rev.C
Technical Note
BD9560MUV
●Block Diagram, Application circuit
VRON VCC
25
VREF 14
GND
VIN
13
Refernce
Block
V_3
32
VID(3)
VID(2)
VID(1)
VID(0)
VSS_SNS
VID4
VID3
VID2
VID1
VID0
SGND
1.5V
7
5bit
DAC
Delay
VDAC
DAC_C
VDAC
UVLO
OVP
TSD
ILIM
SCP
6
5
11
SUS_OUT 23
VDAC
UVLO
VR_ON
SS
BOOT
31
30
R
Controller
29
Q
Driver
Logic
S
28
27
SS
VDAC
21
19
20
Short
Circuit
ILIM
18
17
SCP
ISM
3
VOUT
PVCC
LG
FB
LSM
LSP
ISM
ISP
UVLO
Delay
SCP
HG
SW
PGND
26
TSD
Thermal
Protection
10
Delay
OVP
Over Voltage
Protect
9
8
2
VIN
VDAC
ISM
ISM
VID(4)
1
UVLO
Under
Voltage
Lock out
VREF
PWRGD
PWRGD_C
12
22 24
TON
4
16
SLLM
CL
SS
Soft Start
Block
SS
●Pin Configuration
VQFN032V5050
(Unit : mm)
●Pin Function Table
Pin No.
Pin name
Pin No.
Pin name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PWRGD_C
PWRGD
SCP
SS
VID0
VID1
VID2
VID3
VID4
DAC_C
SGND
GND
VCC
VREF
NC
CL
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
ISP
ISM
LSM
LSP
FB
TON
SUS_OUT
SLLM
VRON
PGND
LG
PVCC
SW
HG
BOOT
VIN
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7/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Pin Descriptions
・VCC
This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V.
It is recommended that a 1uF bypass capacitor be put in this pin.
・VRON
When VRON pin voltage at least 2.3V, the status of this switching regulator become active. Conversely, the status
switches off when VRON pin voltage goes lower than 0.8V and circuit current becomes 10µA or less.
・VREF
This is the reference voltage output pin. The voltage is 2.5V, with 100µA current ability. It is recommended that a 0.1uF
capacitor be established between VREF and GND.
・CL
BD9560MUV detects the voltage between ISP pin and ISM pin and limits the output current (OCP) voltage equivalent to 1/16 of
the CL voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR can also be used for this
platform.
・SS
This is the adjustment pin to set the soft start time. SS voltage is low during shutdown status. When VRON is the status
of high, the soft start time can be determined by the SS charge current and capacitor between SS and GND. Until SS
reaches DAC output voltage, the output voltage VOUT is equivalent to SS voltage.
・SCP
This is the pin to adjust the timer latch time for short circuit protection. The timer circuit is active when the output voltage
VOUT becomes 70% of DAC output voltage, and the output switches OFF (HG=L, LG=L) and is latched after the
specified time. When the UVLO circuit is active or VRON is low, this latch function is cancelled.
・VIN
Since the VIN line is also the input voltage of switching regulator, stability depends in the impedance of the voltage
supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application.
・TON
This is the adjustment pin to set the ON time. On time is determined by the applied voltage to TON pin.
・ISP, ISM
These pins are connected to both sides of the current sense resistor detect output current. The voltage drop between ISP and
ISM is compared with the voltage equivalent to 1/16 of CL voltage. When this voltage drop hits the specified voltage level, the
output voltage is OFF. And these are the pins returned output voltage for Power Good block, SCP block and OVP block.
・BOOT
This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from
SW). BOOT voltage swings between (VIN+VCC) and VCC during active operation.
・HG
This is the voltage supply to drive the Gate of the high side. This voltage swings between BOOT and SW. High-speed Gate driving
for the high side FET is achieved due to the low on-resistance (1.5 ohm when HG is high, 1.0 ohm when HG is low) driver.
・SW
This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings between
VIN and GND.
・PVCC
This is the power supply to drive the low side FET Gate. It is recommended that a 10uF bypass capacitor be established
to compensate for rush current during the FET ON/OFF transition.
・LG
This is the voltage supply to drive the Gate of the low side FET. This voltage swings between PVCC and PGND.
High–speed Gate driving for the low side FET is achieved due to the low on-resistance (1.5 ohm when LG is high, 0.5
ohm when LG is low) driver.
・PGND
This is the power ground pin connected to the source of the low side FET.
・PWRGD
This is the Power Good output pin with open drain. When VOUT range is (VDAC-300mV) to (VDAC+200mV), the status
is high, and when it is in out of range, the status is low.
・PWRGD_C
This is the pin to adjust the delay time of Power Good. When the status of the output voltage is Power Good, the delay
time is determined by the capacitor connected between the fixed current for internal IC and PWRGD_C-GND.
・SLLM
This is the adjustment pin to set the control mode. When SLLM pin voltage goes lower than 0.5V, the status is continuous
mode. Conversely the status is SLLM (Simple Light Load Mode) when SLLM pin voltage is at least (VCC-0.5).
・VID[0:4]
This is the logic input pin for 5bit DAC.
・LSP, LSM
This is the input pin for the amplifier to set the load slope.
・SUS_OUT
The output is SUS_OUT=”H” in performance states, is SUS_OUT=”L” in sleep states.
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© 2010 ROHM Co., Ltd. All rights reserved.
8/21
2010.04 - Rev.C
Technical Note
BD9560MUV
● Timing Chart
・Soft Start Function
Soft start is exercised with the VRON pin set high.
Current control takes effect at startup, enabling a
moderate output voltage “ramping start.” Soft start
timing and incoming current are calculated with
formulas (1) and (2) below.
VRON
TSS
SS
Soft start time
Tss= VDAC×Css [sec] ・・・(1)
2μA(typ)
VOUT
Incoming current
IIN=
IIN
Co×VOUT
Tss
[A] ・・・(2)
(Css: Soft start capacitor; Co: Output capacitor)
・Timer Latch Type Short Circuit Protection
VDAC×0.7
Short protection kicks in when output falls to or below
(VDAC X0.7).
When the programmed time period elapses, output is
latched OFF to prevent destruction of the IC. Output
voltage can be restored either by reconnecting the
VRON pin or disabling UVLO. Short Circuit Protection
timing is calculated with formulas (3) below.
VOUT
TSCP
SCP
Short Circuit Protection time
VRON/UVLO
Tscp=
1.2(V)×CSCP
[sec] ・・・(3)
2μA(typ)
・Output Over Voltage Circuit Protection
VOUT
1.5V
Over voltage protection kicks and low side FET is the
status of full ON in when output is up to 1.5V or more
（LG=High、HG=Low）. It is operated ordinary with
falling of output.
HG
LG
Switching
・Power good function
VOUT
Power good function kicks in when output is from
(VOUT-300mV) to (VOUT+200mV). After setting, power
good pin is the status of high. (Pull up the resistance
outside) Delay timing of power good is calculated with
formulas (4) below.
VOUT-300mV
TPWRGD
Power good delay time
PWRGD_C
TPWRGD =
PWRGD
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1.2(V)×CPWRGD_C
2μA(typ)
[sec] ・・・(4)
(CPWRGD : PWRGD_C pin capacitor)
9/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●External Component Selection
1. Inductor (L) selection
The inductor value is a major influence on the output ripple current.
As formula (5) below indicates, the greater the inductor or the
switching frequency, the lower the ripple current.
ΔIL
ΔIL=
(VIN-VOUT)×VOUT
[A]・・・(5)
L×VIN×f
The proper output ripple current setting is about 30% of
maximum output current.
VIN
IL
ΔIL=0.3×IOUTmax. [A]・・・(6)
VOUT
L
L=
Co
(VIN-VOUT)×VOUT
L×VIN×f
[H]・・・(7)
(ΔIL: output ripple current; f: switch frequency)
Output ripple current
※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed
the inductor rated current value.
※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.
2. Output Capacitor (CO) Selection
VIN
When determining the proper output capacitor, be sure to factor in the
equivalent series resistance required to smooth out ripple volume and maintain
a stable output voltage range.
Output ripple voltage is determined as in formula (8) below.
VOUT
L
ESR
ΔVOUT=ΔIL×ESR [V]・・・(8)
Co
(ΔIL: Output ripple current; ESR: CO equivalent series resistance)
※In selecting a capacitor, make sure the capacitor rating allows sufficient
margin relative to output voltage. Note that a lower ESR can minimize output
ripple voltage.
Output Capacitor
Please give due consideration to the conditions in formula (9) below for output capacity, bearing in mind that output rise
time must be established within the soft start time frame.
Tss×(Limit-IOUT)
Co≦
VOUT
・・・(9)
Tss: Soft start time
Limit: Over current detection 2A(Typ)
Note: Improper capacitor may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
The input capacitor selected must have low enough ESR resistance to fully
support large ripple output, in order to prevent extreme over current.
The formula for ripple current IRMS is given in (10) below.
VIN
Cin
VOUT
L
IRMS=IOUT×
√VCC(VCC-VOUT)
Co
[A]・・・(10)
VCC
Where VCC=2×VOUT, IRMS=
IOUT
2
Input Capacitor
A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10/21
2010.04 - Rev.C
Technical Note
BD9560MUV
4. MOSFET Selection
Loss on the main MOSFET
Pmain=PRON+PGATE+PTRAN
VIN
main switch
=
VOUT
L
VOUT
VIN
×RON×IOUT2+Ciss×f×VDD+
2
VIN ×Crss×IOUT×f
IDRIVE
・・・(11)
(Ron: On-resistance of FET; Ciss: FET gate capacity;
f: Switching frequency Crss: FET inverse transfer function;
IDRIVE: Gate bottom current)
Co
Loss on the synchronous MOSFET
synchronous switch
Psyn=PRON+PGATE
=
VIN-VOUT
VIN
×RON×IOUT2+Ciss×f×VDD
・・・(12)
5. Setting Detection Resistance
VIN
The over current protection function detects the output ripple current
bottom value. This parameter (setting value) is determined as in formula
(13) below.
R
L
VOUT
ILMIT=
IL
VCL×1/16
R
Co
[A]・・・(13)
(VILIM: ILIM voltage; R: Detection resistance)
Current limit
VIN
When it detect the over current protection from DCR of “the coil L”,
this parameter (setting value) is determined as in formula (14) below.
IL
L
RL
r
C
VOUT
Co
ILMIT=VCL×1/16×
(RL=
L
r×C
r×C
L
[A]・・・(14)
)
(VCL:CL voltage RL:DCR value of the coil)
Current limit
6. Setting Load Line Slope
VIN
HG
IL
RSENSE
VOUT
FB =
R2
R1
= (1+
LG
×RSENSE×IL+ RSENSE×IL+VOUT
R2
R1
) × RSENSE×IL+VOUT
So that,
SS
VDAC
Amplifier for setting
Load slope
R2
) × RSENSE
LSP
R1
SLOPELL = (1+
LSM
R1
(SLOPELL : Load Line Slope)
R1
FB R2
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© 2010 ROHM Co., Ltd. All rights reserved.
11/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●I/O Equivalent Circuit
1pin(PWRGD_C)
2pin(PWRGD)
3pin(SCP)
PWRGD
SCP
PWRGD_C
GND
4pin(SS)
5pin(VID0) ~ 9pin(VID4)
SS
10pin(DAC_C)
VID[0:4]
14pin(VREF)
DAC_C
16pin(CL),17pin(ISP)
18pin(ISM)
ISM
VREF
CL
ISP
19pin(LSM),20pin(LSP),22pin(TON)
21pin(FB)
23pin(SUS_OUT)
VCC
VCC
SUS_OUT
LSM
LSP
TON
FB
24pin(SLLM)
VCC
25pin(VRON)
27pin(LG)
VDD
VR_ON
SLLM
LG
29pin(SW)
BOOT
SW
30pin(HG)
BOOT
HG
31pin(BOOT)
32pin(VIN)
BOOT
BOOT
VIN
HG
HG
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© 2010 ROHM Co., Ltd. All rights reserved.
12/21
SW
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Circuit(Application for POS CAP)
3.3V
VCC
R0
VIN
VIN
R2
VCC_CORE
R1
VIN_IC
32
SW1
R3
VIN
C1
P_MON
15
R41
C19
C18
P_MON
C20
C21
C22
C23
C24
Vcc
R26
SW2
R4
SW3
R5
SW4
R6
25
5
6
SW5
R7
SW6
R8
VRON
VID0
PVCC
BTS
VCC
3.3V
VID4
2
PWRGD
R10
LG
PGND
R12
16
CL
VREF
CL
14
VIN_IC
VREF
R15
C_TON
R16
VREF
22
Vcc
C6
C7
C8
Vcc
TON
DAC
R19
13
27
VCC_CORE
R33
R34
Tr1a
PGND
26
LSM
LSP
SGND
VCC
SLLM
12
C13
R43
Tr1b
R31
D1
R29
R30
PULSE_I
N
R32
R42
Tr3A
Tr3B
R28
17
18
R27
VIN_IC
R24
21
R25
R22
19
R21
C25
20
R23
R20
11
VCC
C11
GND GND
C9
R44
ISM
FB
1
PWRGD_C
3
SCP
4 SS
10
C5
ISP
VCC CORE
R36
L1
C12
R14
C4
Tr2a
29 R35
R13
C3
C16
R37
R11
C2
VREF
HG
SW
R9
C15
C14
30
VIN_FET VIN_FET
R39
31 R38
VID3
PVCC
C17
VIN
D2
VID1
VID2
9
R40
28
GND
SUS_OUT
R18
24
23
R17
SW7
C10
R45
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
13/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Parts List
Part No
Value
Company
Part name
Part No
Value
Company
Part name
R0
0Ω
ROHM
MCR03 Series
R41
-
-
-
R1
-
-
-
R42
-
-
-
R2
-
-
-
R43
-
-
-
R3
0Ω
ROHM
MCR03 Series
R44
-
-
-
R4
0Ω
ROHM
MCR03 Series
R45
0Ω
ROHM
MCR03 Series
R5
0Ω
ROHM
MCR03 Series
C1
0.01uF
MURATA
GMR18 Series
R6
0Ω
ROHM
MCR03 Series
C2
-
-
-
R7
0Ω
ROHM
MCR03 Series
C3
-
-
-
R8
0Ω
ROHM
MCR03 Series
C4
0.1uF
MURATA
GMR18 Series
R9
-
-
-
C5
0.01uF
MURATA
GMR18 Series
R10
20kΩ
ROHM
MCR03 Series
C6
0.01uF
MURATA
GMR18 Series
R11
-
-
-
C7
0.01uF
MURATA
GMR18 Series
R12
300kΩ
ROHM
MCR03 Series
C8
2200pF
MURATA
GMR18 Series
R13
47kΩ
ROHM
MCR03 Series
C9
1uF
MURATA
GMR18 Series
R14
0Ω
ROHM
MCR03 Series
C10
-
-
-
R15
560kΩ
ROHM
MCR03 Series
C11
-
-
-
R16
62kΩ
ROHM
MCR03 Series
C12
-
-
-
R17
-
-
-
C13
-
-
-
R18
0Ω
ROHM
MCR03 Series
C14
0.22uF
MURATA
GMR18 Series
R19
10Ω
ROHM
MCR03 Series
C15
10uF
KYOCERA
CM32X7R106M25A
R20
-
-
-
C16
-
-
-
R21
1kΩ
ROHM
MCR03 Series
C17
10uF
MURATA
GMR21 Series
R22
1kΩ
ROHM
MCR03 Series
C18
-
-
-
R23
1MΩ
ROHM
MCR03 Series
C19
-
-
-
R24
3kΩ
ROHM
MCR03 Series
C20
R25
1MΩ
ROHM
MCR03 Series
C21
R27
0Ω
ROHM
MCR03 Series
C22
-
-
-
R28
0Ω
ROHM
MCR03 Series
C23
330uF
Panasonic
EEFSX0D331XE
R29
-
-
-
C24
-
-
-
R30
-
-
-
C25
-
-
-
R31
0Ω
ROHM
MCR03 Series
C-Ton
-
-
-
R32
0Ω
ROHM
MCR03 Series
R33
-
-
-
L1
0.7uH
TDK
VLM10055T-R70M120
R34
0Ω
ROHM
MCR03 Series
D1
-
-
-
D2
Diode
ROHM
RB521S-30
10uF×8 KYOCERA
-
-
CM21B106M06A
-
R35
0Ω
ROHM
MCR03 Series
R36
2ｍΩ
ROHM
PMR100
R37
0Ω
ROHM
MCR03 Series
TR1A
FET
NEC
uPA2702
R38
0Ω
ROHM
MCR03 Series
TR2A
FET
NEC
uPA2702
R39
0Ω
ROHM
MCR03 Series
TR3A
-
-
-
R40
10Ω
ROHM
MCR03 Series
TR3B
-
-
-
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
14/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Circuit(Application for ceramic capacitor)
3.3V
VCC
R0
VIN
VIN
R2
VCC_CORE
R1
VIN_IC
32
SW1
C1
R3
VIN
P_MON
15
R41
C19
C18
P_MON
C20
C21
C22
C23
C24
Vcc
R26
SW2
R4
SW3
R5
SW4
R6
VRON
VID0
R7
R8
VID2
8
9
VID4
2
PWRGD
PGND
R12
16
CL
14
VIN_IC
VREF
R15
C_TON
R16
VREF
22
Vcc
C6
C7
C8
Vcc
R19
TON
DAC
13
GND GND
C9
R44
ISM
FB
1 PWRGD_C
3
SCP
4
SS
10
C5
ISP
12
LSM
LSP
SGND
C16
Tr2a
VCC CORE
27
R36
L1
29 R35
VCC_CORE
R33
R34
Tr1a
C13
R43
Tr1b
PGND
26
PULSE_IN
R30
D1
R29
R31
R32
Tr3A
Tr3B
R42
R28
17
C12
R14
C4
CL
C15
R37
R13
C3
VREF
LG
R11
C2
30
VIN_FET VIN_FET
R39
31 R38
C14
HG
PVCC
C17
VIN
D2
BTS
SW
R9
R40
28
VID3
R10
VREF
PVCC
VID1
7
SW6
3.3V
5
6
SW5
VCC
25
18
R27
VIN_IC
R24
21
R25
R22
19
R21
C25
20
R23
R20
11
VCC
C11
VCC
GND
SLLM
SUS_OUT
R18
24
23
R17
SW7
C10
R45
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
15/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Parts List
Part No Value
Company
Part name
R0
0Ω
ROHM
MCR03 Series
R1
1kΩ
ROHM
R2
-
-
R3
0Ω
R4
Part No Value
Company
Part name
R41
-
-
-
MCR03 Series
R42
-
-
-
-
R43
-
-
-
ROHM
MCR03 Series
R44
-
-
-
0Ω
ROHM
MCR03 Series
R45
0Ω
ROHM
MCR03 Series
R5
0Ω
ROHM
MCR03 Series
C1
0.01uF
MURATA
GMR18 Series
R6
0Ω
ROHM
MCR03 Series
C2
-
-
-
R7
0Ω
ROHM
MCR03 Series
C3
-
-
-
R8
0Ω
ROHM
MCR03 Series
C4
0.1uF
MURATA
GMR18 Series
R9
-
-
-
C5
0.01uF
MURATA
GMR18 Series
R10
20kΩ
ROHM
MCR03 Series
C6
0.01uF
MURATA
GMR18 Series
R11
-
-
-
C7
0.01uF
MURATA
GMR18 Series
R12
300kΩ
ROHM
MCR03 Series
C8
2200pF
MURATA
GMR18 Series
R13
47kΩ
ROHM
MCR03 Series
C9
1uF
MURATA
GMR18 Series
R14
0Ω
ROHM
MCR03 Series
C10
-
-
-
R15
560kΩ
ROHM
MCR03 Series
C11
-
-
-
R16
62kΩ
ROHM
MCR03 Series
C12
-
-
-
R17
-
-
-
C13
-
-
-
R18
0Ω
ROHM
MCR03 Series
C14
0.47uF
MURATA
GMR21 Series
R19
10Ω
ROHM
MCR03 Series
C15
10uF
KYOCERA
CM32X7R106M25A
R20
-
-
-
C16
-
-
-
R21
1kΩ
ROHM
MCR03 Series
C17
10uF
MURATA
GMR21 Series
R22
1kΩ
ROHM
MCR03 Series
C18
-
-
R23
1MΩ
ROHM
MCR03 Series
C19
47uF×4 KYOCERA
CM32B476M06A
R24
3kΩ
ROHM
MCR03 Series
C20
47uF×4 KYOCERA
CM32B476M06A
R25
1MΩ
ROHM
MCR03 Series
C21
-
-
-
R27
0Ω
ROHM
MCR03 Series
C22
-
-
-
R28
0Ω
ROHM
MCR03 Series
C23
-
-
-
R29
-
-
-
C24
-
-
-
R30
-
-
-
C25
-
-
-
R31
0Ω
ROHM
MCR03 Series
C-Ton
-
-
-
R32
0Ω
ROHM
MCR03 Series
R33
-
-
-
L1
0.7uH
Panasonic
ETQP2H0R7BFA
R34
0Ω
ROHM
MCR03 Series
D1
-
-
-
R35
0Ω
ROHM
MCR03 Series
D2
Diode
ROHM
RB521S-30
R36
2ｍΩ
ROHM
PMR100
R37
0Ω
ROHM
MCR03 Series
TR1A
FET
NEC
uPA2702
R38
0Ω
ROHM
MCR03 Series
TR2A
FET
NEC
uPA2702
R39
0Ω
ROHM
MCR03 Series
TR3A
-
-
-
R40
10Ω
ROHM
MCR03 Series
TR3B
-
-
-
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/21
-
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Circuit(Application for VIN UVLO OFF)
3.3V
R0
VCC
R2
VCC_CORE
VCC
32
SW1
R3
VIN
C1
P_MON
15
R41
C19
C18
P_MON
C20
C21
C22
C23
C24
Vcc
R26
SW2
25
R4
SW3
R5
SW4
R6
SW5
R7
SW6
R8
5
6
VRON
VID0
VID1
31
VCC
R9
2
VID4
HG
SW
LG
R11
C2
PGND
R12
16
CL
ISP
CL
VREF
14
VIN
VREF
R15
Vcc
C5
C6
C7
C8
22
VREF
TON
R16
C_TON
Vcc
R19
GND GND
C9
1
PWRGD_C
3
SCP
4
10 SS
DAC
29
R35
27
R34
Tr2a
VCC CORE
R36
L1
VCC_CORE
Tr1a
R33
C13
R43
Tr1b
PGND
26
D1
PULSE_IN
R29
R31
R30
R32
Tr3A
Tr3B
R42
R28
17
IS
R27
18
V IN_IC
M
21
FB
LSM
LSP
SGND
R24
R25
R22
19
R21
C25
20
R23
R20
11
VCC
C11
13
VCC
SLLM
12
GND
R44
C15 C16
R37
C12
R14
C4
30
R13
C3
PVCC
VIN_FET VIN_FET
R39
R38
C14
PWRGD
R10
VREF
C17
VIN
BTS
8 VID3
9
R40
28
D2
7
VID2
3.3V
PVCC
SUS_OUT
R18
24
23
R17
SW7
C10
R45
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
17/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Evaluation Board Parts List
Part No Value
Company
Part name
R0
0Ω
ROHM
MCR03 Series
R1
1kΩ
ROHM
R2
-
-
R3
0Ω
R4
Part No Value
Company
Part name
R41
-
-
-
MCR03 Series
R42
-
-
-
-
R43
-
-
-
ROHM
MCR03 Series
R44
-
-
-
0Ω
ROHM
MCR03 Series
R45
0Ω
ROHM
MCR03 Series
R5
0Ω
ROHM
MCR03 Series
C1
0.01uF
MURATA
GMR18 Series
R6
0Ω
ROHM
MCR03 Series
C2
-
-
-
R7
0Ω
ROHM
MCR03 Series
C3
-
-
-
R8
0Ω
ROHM
MCR03 Series
C4
0.1uF
MURATA
GMR18 Series
R9
-
-
-
C5
0.01uF
MURATA
GMR18 Series
R10
20kΩ
ROHM
MCR03 Series
C6
0.01uF
MURATA
GMR18 Series
R11
-
-
-
C7
0.01uF
MURATA
GMR18 Series
R12
300kΩ
ROHM
MCR03 Series
C8
2200pF
MURATA
GMR18 Series
R13
47kΩ
ROHM
MCR03 Series
C9
1uF
MURATA
GMR18 Series
R14
0Ω
ROHM
MCR03 Series
C10
-
-
-
R15
560kΩ
ROHM
MCR03 Series
C11
-
-
-
R16
62kΩ
ROHM
MCR03 Series
C12
-
-
-
R17
-
-
-
C13
-
-
-
R18
0Ω
ROHM
MCR03 Series
C14
0.22uF
MURATA
GMR18 Series
R19
10Ω
ROHM
MCR03 Series
C15
10uF
KYOCERA
CM32X7R106M25A
R20
-
-
-
C16
-
-
-
R21
1kΩ
ROHM
MCR03 Series
C17
10uF
MURATA
GMR21 Series
R22
1kΩ
ROHM
MCR03 Series
C18
-
-
-
R23
1MΩ
ROHM
MCR03 Series
C19
-
-
-
R24
3kΩ
ROHM
MCR03 Series
C20
R25
1MΩ
ROHM
MCR03 Series
C21
R27
0Ω
ROHM
MCR03 Series
C22
-
-
-
R28
0Ω
ROHM
MCR03 Series
C23
330uF
Panasonic
EEFSX0D331XE
R29
-
-
-
C24
-
-
-
R30
-
-
-
C25
-
-
-
R31
0Ω
ROHM
MCR03 Series
C-Ton
-
-
-
R32
0Ω
ROHM
MCR03 Series
R33
-
-
-
L1
0.7uH
TDK
VLM10055T-R70M120
R34
0Ω
ROHM
MCR03 Series
D1
-
-
-
R35
0Ω
ROHM
MCR03 Series
D2
Diode
ROHM
RB521S-30
R36
2ｍΩ
ROHM
MCR03 Series
R37
0Ω
ROHM
MCR03 Series
TR1A
FET
NEC
uPA2702
R38
0Ω
ROHM
MCR03 Series
TR2A
FET
NEC
uPA2702
R39
0Ω
ROHM
MCR03 Series
TR3A
-
-
-
R40
10Ω
ROHM
MCR03 Series
TR3B
-
-
-
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© 2010 ROHM Co., Ltd. All rights reserved.
18/21
10uF×8 KYOCERA
-
-
CM21B106M06A
-
2010.04 - Rev.C
Technical Note
BD9560MUV
● Operation Notes and Precautions
1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and
between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction
depending on the relation between each potential, as follows:
・When GND＞ element A＞ element B, the P-N junction is a diode.
・When element B＞GND element A, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which
parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Transistor (NPN)
Resistance
( Pin A)
( Pin A)
B
( Pin B)
C
E
Parasitic
transistor
GND
N
P+
P
P+
P+
P
N
N
P
GND
P+
( Pin B)
N
N
N
N
B
P substrate
Parasitic pin
C
E
GND
Parasitic pin
GND
Other pins in close
proxiity
GND
Parasitic
transistor
2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit
damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the
GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between
the various pins and the VCC is recommended.
Bypass diode
Countercurrent
prevention diode
VCC
Pin
3. Absolute maximum rating
Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating
temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is
destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating
limits is to be implemented.
4.GND potential
Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the
operating mode.
5. Thermal design
In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power
Dissipation) in actual operation.
6. Short-circuits between pins and incorrect mounting position
When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may
be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or
ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and
may damage the IC.
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© 2010 ROHM Co., Ltd. All rights reserved.
19/21
2010.04 - Rev.C
Technical Note
BD9560MUV
7. Operation in strong electromagnetic fields
Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields.
8. Thermal shutdown circuit
This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature
reaches 175℃ (standard value), and has a hysteresis range of 15℃ (standard). When the IC chip temperature rises to
the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting
down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when
or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or
subsequent operation once the TSD is activated.
9. Capacitor between output and GND
When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any
reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a
capacitor larger than 1000uF between the output and GND.
10. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and
discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and
continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to
connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is
OFF before removing any component connected to the test setup.
11. GND wiring pattern
When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is
recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change
stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the
same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
● Power Dissipation
[mW]
1000
880mW
70mm×70mm×1.6mm
θja=142.0℃/W
Power Dissipation [Pd]
800
Glass-epoxy PCB
600
With no heat sink θj-a=328.9℃/W
380mW
400
200
0
25
50
75
100
125
150
[℃]
Ambient Temperature [Ta]
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© 2010 ROHM Co., Ltd. All rights reserved.
20/21
2010.04 - Rev.C
Technical Note
BD9560MUV
●Ordering part number
B
D
9
Part No.
5
6
0
M
Part No.
U
V
-
Package
MUV : VQFN032V5050
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFN032V5050
<Tape and Reel information>
5.0 ± 0.1
5.0±0.1
1.0MAX
3.4±0.1
0.4 ± 0.1
1
8
9
32
16
25
24
0.75
0.5
2500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
)
(0.22)
( reel on the left hand and you pull out the tape on the right hand
3.4 ± 0.1
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
17
+0.05
0.25 -0.04
1pin
Reel
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
21/21
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.04 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2010 ROHM Co., Ltd. All rights reserved.
R1010A