ETC2 AD523-00 Package drawings and specification Datasheet

Appendix
Appendix
Package Drawings and Specifications
Package Drawing – SOIC8
.193 (4.90)
.154 (3.91)
.236 (5.99)
NVE
XXXXX
-XX
.015 (.381)
x 45°
.154 (3.91)
.016 (.40) NOM.
.020 (.508)
.188 (4.77)
.017 TYP.
.054 (1.37)
.061 (1.55)
Dimensions: inch (mm)
.050 (1.27) x 6
BASIC
.004 (.10) MIN.
.010 (.26) MAX.
Note: SOIC8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – MSOP8
.118
(3.00)
.118 (3.00)
.005 (.13) NOM.
.193 (4.90)
NVE
XXX
.118 (3.00)
.021 (.533)
.154 (3.91)
.012 TYP.
.034 (.86)
.040 (1.02)
Dimensions: inches (mm)
.0256 (.65) x 6
BASIC
.004 (.10) MIN.
.012 (.31) MAX.
Note: MSOP8 Package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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Appendix
Package Drawing – TDFN6 2.5 mm x 2.5 mm
2.00 ± 0.05
0.80 MAX
4
4
6
2.50 ± 0.10
1.30 ± 0.05
6
C0.10
PIN 1 ID
1
1
0.65 TYP. (4x)
3
3
0.30 ± 0.05(6x)
0.30 ± 0.05(6x)
2.50 ± 0.10
0.0-0.05
PIN 1 INDEX AREA
1.30 REF (2X)
0.20 REF.
Note: Dimensions in mm. TDFN6 package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – TDFN SO8
PIN 1 INDEX AREA
0.75±0.05
4
4
1
1
6.00 ± 0.20
3.40 ± 0.15
Pin 1 ID
3.90 ± 0.15
5
0.65 ± 0.10 (8x)
8
5
5
4.900 ± 0.20
0.0-0.05 0.40 ± 0.05 (8x)
1.27 Typ. (6x)
3.81REF (2x)
0.75±0.05 MAX
Note: Dimensions in mm. TDFN SO8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
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Appendix
Package Drawing – PLLP6 3.0 mm x 3.0 mm
3.10 (0.122)
3.00 (0.118)
3.10 (0.122)
3.00 (0.118)
0.98 (0.038)
0.93 (0.036)
0.45 (0.018)
0.35 (0.014)
1.55 (0.061)
1.45 (0.057)
0.45 (0.018)
0.40 (0.016)
0.12 (0.005)
0.02 (0.001)
2.30 (0.091)
2.20 (0.087)
1.00 (0.039)
0.85 (0.033)
0.05 (0.002)
0.00 (0.000)
Note: The PLLP6 package has thermal power dissipation of 320°C/Watt in free air. Attaching the package to
a circuit board improves thermal performance. Dimensions are in mm (inches).
Note on Lead-Free Packages
The electronics industry has been working to provide lead-free products in response to concerns about
the environmental impact of the use of lead (Pb) in solder finishes. Increasing customer demand and
directives to decrease the amounts of lead in consumer electronics products from governments around
the globe, drives this effort.
Lead-free finishes utilizing pure tin (Sn) have already been qualified at NVE and are available in most
of our products. However, additional lead times are associated with these parts.
Since most lead-free solders being used in board assembly environments have higher melting
temperatures than traditional tin-lead solders, higher reflow temperatures may be necessary to form an
equivalent solder joint between the component and the PC board. NVE characterizes all lead-free
packages using elevated temperature (245°C to 260°C) reflow profiles characteristic of lead-free board
assembly environments. All lead-free products will be identified with an “E” suffix on the part number
and a lower case “e” marking on the package.
This lead-free transition is an important component of NVE’s commitment to take an active part in
protecting the environment and our responsibility to our customers and the communities around the
world in which we do business. We remain dedicated to meeting our customers’ requirements and
expectations.
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Appendix
Recommended Solder Reflow Profile
NVE recommends the following soldering profile:
300
For leaded (Pb) parts, the peak temperature shown in this profile can be decreased to as low as 230°C.
Exceeding 265°C at peak or the time at peak temperature shown in this profile can damage the parts.
Specifically:
1.
AA- and AD-Series sensors are rated at 150°C maximum storage temperature. They can withstand
the solder profile shown above with no harmful effects. However, temperatures above 265°C for
even a brief period or extended periods above 160°C can cause degradation of the GMR sensor
element.
2.
AKL- and DD-Series parts contain an on-chip EEPROM. Exposure to temperatures in excess of
265°C can cause EEPROM data corruption, which will cause the parts to fall out of specification.
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Appendix
Magnet Data
NVE supplies Ceramic 8 magnets in some of our GMR sensor evaluation kits. The characteristics for
these magnets are given below:
Material Type
Ceramic 8 (C8)
Maximum Operating Temperature
300°C
Curie Temperature
450°C
Temperature Coefficient of Flux Density
-0.20 %/°C
Maximum Energy Product
3.5 MGOe
Residual Induction
3850 Gauss
Coercive Force
2950 Oersteds
Ceramic 8 M agnetic Characteristics
4500
3500
3000
2500
2000
1500
Flux De nsity, G auss (G )
4000
-35C
+25C
+85C
1000
500
0
-5000
-4000
-3000
-2000
-1000
0
De magne tizing Force , O e rste ds (O e )
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Appendix
Magnet drawings for the two round disc magnets included in the GT Sensor evaluation kits are given
below. These magnets are available from NVE as production parts. Contact NVE for pricing and
delivery information. In addition, NVE can have custom magnets built for specific applications in
Ceramic 8 or Alnico 8 materials. Please contact NVE for more details.
Ceramic 8 Disc Magnets
Note: All Dimensions in mm.
N
N
S
S
Magnet Part Number
Diameter (mm)
Length (mm)
12216
6
4
12217
3.5
4
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Appendix
Part Numbers and Marking Codes
NVE’s part number format consists of two or three letters, then three numbers, a dash, and then two
more numbers, and in some cases a final letter. Here is an example:
AAH004-00E
The meanings of the numbers and letters are defined as follows:
First Two
Letters
AA
General Part Description
Analog output magnetometer or spin valve sensor
AB
Analog output gradiometer
AD
Digital output magnetometer
AG
Evaluation kit or printed circuit board assembly
AK
Digital output gradiometer
BD
Custom digital output magnetometer
DB
Digital input signal processing IC
DC
Voltage regulator
DD
Analog input signal processing IC
Third Letter
GMR Material Used In Product
No third letter indicates NVE’s standard multilayer material
H
High sensitivity, high temperature multilayer material
L
Low hysteresis, high temperature multilayer material
V
Spin valve material with synthetic anti-ferromagnet pinning
Three Digits
xxx
Consecutive Part Number
Meaning for AD-Series parts is described in the GMR Switch section of this
catalog; other products have numbers assigned consecutively with no meaning
implied
Two Digits
After Dash
-00
Package Type
MSOP 8 pin package
-01
Raw IC (die); available in diced wafer on blue tape or waffle pack form
-02
SOIC 8 pin package
-07
Non-semiconductor style package; used for eval kits and PCBs
-10
TDFN6 2.5mm X 2.5mm 6 pin package
-11
PLLP6 3.0mm X 3.0mm 6 pin package
-12
TDFN SO8 4.9mm X 6.0mm 8 pin package
Final Letter
E
Consecutive Part Number
No final letter means a standard package; E means a lead-free package
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Appendix
Some of NVE’s products are delivered in packages that are too small to be marked with the complete
part number. In these cases a three-letter code is used to identify the part. The following table provides
a cross-reference from part number to marking code:
NVE Part Number
AA004-00
AA006-00
AAH004-00
AAV001-11
AAV002-11
AB001-00
ABH001-00
ABL004-00
ABL005-00
ABL006-00
ABL014-00
ABL015-00
ABL016-00
ABL004-10
ABL005-10
ABL006-10
ABL014-10
ABL015-10
ABL016-10
AD004-00
AD005-00
AD006-00
AD020-00
AD021-00
AD022-00
AD023-00
AD024-00
AD024-10
AD104-00
AD105-00
AD106-00
AD120-00
AD121-00
AD122-00
AD123-00
AD124-00
AD204-00
AD205-00
AD206-00
AD220-00
AD221-00
AD222-00
AD223-00
AD224-00
AD304-00
AD305-00
AD306-00
AD320-00
AD321-00
AD322-00
Code
CBD
CBC
CBF
BBP
BBQ
CBG
CBH
FDB
FDC
FDL
FDD
FDF
FDM
FDG
FDH
FDN
FDJ
FDK
FDP
BBH
BBG
BBJ
BBK
BBB
BBC
BBD
BBF
BBL
DBH
DBG
DBJ
DBK
DBB
DBC
DBD
DBF
FBH
FBG
FBJ
FBK
FBB
FBC
FBD
FBF
GBH
GBG
GBJ
GBK
GBB
GBC
NVE Part Number
AD323-00
AD324-00
AD404-00
AD405-00
AD406-00
AD420-00
AD421-00
AD422-00
AD423-00
AD424-00
AD504-00
AD505-00
AD506-00
AD520-00
AD521-00
AD522-00
AD523-00
AD524-00
AD604-00
AD605-00
AD606-00
AD620-00
AD621-00
AD622-00
AD623-00
AD624-00
AD704-00
AD705-00
AD706-00
AD720-00
AD721-00
AD722-00
AD723-00
AD724-00
AD081-00
AD082-00
AD083-00
AD084-00
AD821-00
AD822-00
AD823-00
AD824-00
AD921-00
AD922-00
AD923-00
AD924-00
ADH025-00
BD012-00
DB001-00
DC001-10
DC002-10
Code
GBD
GBF
HBH
HBG
HBJ
HBK
HBB
HBC
HBD
HBF
JBH
JBG
JBJ
JBK
JBB
JBC
JBD
JBF
KBH
KBG
KBJ
KBK
KBB
KBC
KBD
KBF
LBH
LBG
LBJ
LBK
LBB
LBC
LBD
LBF
BDB
BDC
BDD
BDF
MBB
MBC
MBD
MBF
NBB
NBC
NBD
NBF
MBL
ZBF
FFD
FFB
FFC
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Appendix
The following table provides a cross-reference from marking code to part number:
Code
BBB
BBC
BBD
BBF
BBG
BBH
BBJ
BBK
BBL
BBP
BBQ
BDB
BDC
BDD
BDF
CBC
CBD
CBF
CBG
CBH
DBB
DBC
DBD
DBF
DBG
DBH
DBJ
DBK
FBB
FBC
FBD
FBF
FBG
FBH
FBJ
FBK
FDB
FDC
FDD
FDF
FDG
FDH
FDJ
FDK
FDL
FDM
FDN
FDP
FFB
FFC
NVE Part Number
AD021-00
AD022-00
AD023-00
AD024-00
AD005-00
AD004-00
AD006-00
AD020-00
AD024-10
AAV001-11
AAV002-11
AD081-00
AD082-00
AD083-00
AD084-00
AA006-00
AA004-00
AAH004-00
AB001-00
ABH001-00
AD121-00
AD122-00
AD123-00
AD124-00
AD105-00
AD104-00
AD106-00
AD120-00
AD221-00
AD222-00
AD223-00
AD224-00
AD205-00
AD204-00
AD206-00
AD220-00
ABL004-00
ABL005-00
ABL014-00
ABL015-00
ABL004-10
ABL005-10
ABL014-10
ABL015-10
ABL006-00
ABL016-00
ABL006-10
ABL016-10
DC001-10
DC002-10
Code
FFD
GBB
GBC
GBD
GBF
GBG
GBH
GBJ
GBK
HBB
HBC
HBD
HBF
HBG
HBH
HBJ
HBK
JBB
JBC
JBD
JBF
JBG
JBH
JBJ
JBK
KBB
KBC
KBD
KBF
KBG
KBH
KBJ
KBK
LBB
LBC
LBD
LBF
LBG
LBH
LBJ
LBK
MBB
MBC
MBD
MBF
MBL
NBB
NBC
NBD
NBF
ZBF
NVE Part Number
DB001-00
AD321-00
AD322-00
AD323-00
AD324-00
AD305-00
AD304-00
AD306-00
AD320-00
AD421-00
AD422-00
AD423-00
AD424-00
AD405-00
AD404-00
AD406-00
AD420-00
AD521-00
AD522-00
AD523-00
AD524-00
AD505-00
AD504-00
AD506-00
AD520-00
AD621-00
AD622-00
AD623-00
AD624-00
AD605-00
AD604-00
AD606-00
AD620-00
AD721-00
AD722-00
AD723-00
AD724-00
AD705-00
AD704-00
AD706-00
AD720-00
AD821-00
AD822-00
AD823-00
AD824-00
ADH025-00
AD921-00
AD922-00
AD923-00
AD924-00
BD012-00
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Appendix
Definitions and Conversion Factors
Definitions:
CSK or Sink: Current sinking output, also referred to as Open Collector output.
Differential: The field difference between the Operate Point and the Release Point.
Electrical Offset: The inherent imbalance of the bridge expressed in differential voltage output.
HBM: Human Body Model for ESD specifications.
Hysteresis: The maximum deviation in volts between the output with increasing field and the output
with decreasing field, where the applied field is unipolar (applied in either a positive or negative
direction, without crossing the zero field point), divided by Voltage Span. Expressed as a percentage.
Input Voltage Range: The voltage range that can be applied across the bridge.
IOL (Current Output Low): The output current in the low (logic 0) state (output stage switched on).
Max Output: A specification given in millivolts per applied voltage. This is the maximum output
voltage possible. This output condition is achieved when one set of resistors is in magnetic saturation
(have achieved the maximum resistance change possible) while the other pair are at zero applied
magnetic field.
Nonlinearity: The maximum deviation from a linear fit taken over the Field Range divided by the
Voltage Span. Expressed as a percentage.
Off-axis Characteristic: A specification that describes the variation in sensor output versus the angle
between the applied field direction and the sensitive axis of the GMR sensor with constant electrical
and magnetic inputs applied. Applicable to non-integrated bridge sensors. The output will vary as the
cosine of the angle rotated.
Operate Point: The field level which produces a logical change in state from “0” to “1” in NVE’s
digital magnetic field sensors ADXXX-XX.
Operating Frequency: Frequency range within which a sensor will produce a responsive output.
Output Leakage Current (Current Output High): The output current in the high (logic 1) state
(output stage switched off).
Output Saturation Voltage (Voltage Output Low): The output voltage in the low (logic 0) state
(output stage switched on).
RBP: Reverse Battery Protection.
Release Point: The field level which produces a logical change in state from “1” to “0” in NVE’s
digital magnetic field sensors ADXXX-XX.
Resistor Separation: This is the mean separation between the two pairs of resistors, in a Gradiometer
or Differential sensor.
Sensitivity: A measure of the output magnitude based on electrical and magnetic input conditions.
Expressed in millivolts of differential output per applied voltage per Oersted.
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Appendix
Specified Linear Range: Typically 70% of the field it takes to saturate the part. Field dependent
specifications are based upon this range.
TCOI (Temperature Coefficient of Output at Constant Input Current): The variation of the
output voltage over temperature with a constant input current applied. Expressed as a percentage per
unit temperature change.
TCOV (Temperature Coefficient of Output at Constant Input Voltage): The variation of the
output voltage over temperature with a constant input voltage applied. Expressed as a percentage per
unit temperature change.
TCR (Temperature Coefficient of Resistance): The variation of the GMR resistors over
temperature. Expressed as a percentage per unit temperature change.
Voltage Span: The differential output voltage taken from zero to 70% of the saturation field level.
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Appendix
Conversion Factors
To Convert
µWb
A/cm
A/m
At
G
G
G
G
G
G
G
Gb
kA/m
maxwell
maxwell
mT
maxwell
nT
nT
Into
maxwell
Oe
Oe
Gb
Oe
T
mT
nT
Wb/cm2
Wb/in2
Wb/m2
At
Oe
Wb
µWb
G
volt second
G
gamma (γ)
Multiply by
102
1.256
1.256 x 10-2
1.256
1 (when µo=1)
10-4
10-1
105
10-8
6.452 x 10-8
10-4
0.796
1.256 x 101
10-8
10-2
10
10-8
10-5
1
Oe
A/cm
7.962 x 10-1
Oe
Oe
T
T
volt second
volt second
Wb
Wb/cm2
Wb/m2
A/m
kA/m
G
Wb/m2
maxwell
Wb
maxwell
G
G
7.962 x 101
7.962 x 10-2
104
1
108
1
108
108
104
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