TI1 DS14C88 Quad cmos line driver Datasheet

DS14C88
www.ti.com
SNLS080C – MAY 1998 – REVISED APRIL 2013
DS14C88 Quad CMOS Line Driver
Check for Samples: DS14C88
FEATURES
DESCRIPTION
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•
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The DS14C88, pin-for-pin compatible to the
DS1488/MC1488, is a quad line drivers designed to
interface data terminal equipment (DTE) with data
circuit-terminating equipment (DCE). This device
translates standard TTL/CMOS logic levels to levels
conforming to EIA-232-D and CCITT V.28 standards.
1
2
Meets EIA-232D and CCITT V.28 Standards
LOW Power Consumption
Wide Power Supply Range: ±5V to ±12V
Available in SOIC Package
The device is fabricated in low threshold CMOS metal
gate technology. The device provides very low power
consumption compared to its bipolar equivalents: 500
μA (DS14C88) versus 25 mA (DS1488).
The DS14C88 simplifies designs by eliminating the
need for external slew rate control capacitors. Slew
rate control in accordance with EIA-232D is provided
on-chip, eliminating the output capacitors.
Connection Diagram
Figure 1. SOIC or PDIP Package- Top View
See Package Number NFF0014A or D0014A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS14C88
SNLS080C – MAY 1998 – REVISED APRIL 2013
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Absolute Maximum Ratings (1) (2) (3) (4)
Supply Voltage
V+ Pin
+13V
V− Pin
−13V
(V+) +0.3V to GND −0.3V
Driver Input Voltage
|(V+) − VO| ≤ 30V
Driver Output Voltage
|(V−) − VO| ≤ 30V
Continuous Power Dissipation @+25°C (5)
NFF0014A Package
1513 mW
D0014A Package
1063 mW
Junction Temperature
+150°C
Lead Temperature (Soldering 4 seconds)
+260°C
−65°C to +150°C
Storage Temperature Range
(1)
(2)
(3)
(4)
(5)
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be Ensured. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
This Product does not meet 2000V ESD rating.
ESD Rating (HBM, 1.5 kΩ, 100 pF) ≥ 1.0 kV.
Derate NFF0014A Package 12.1 mW/°C, and D0014A Package 8.5 mW/°C above +25°C.
Recommended Operating Conditions
Min
Max
Units
V Supply (GND = 0V)
+4.5
+12.6
V
V− Supply (GND = 0V)
−4.5
−12.6
V
+
Operating Free Air Temp. (TA)
DS14C88
0
+75
°C
Electrical Characteristics
Over Recommended Operating Conditions, unless otherwise specified
Parameter
IIL
Maximum Low Input Current
Test Conditions
Min
Typ
VIN = GND
+
Max
Units
+10
μA
IIH
Maximum High Input Current
VIN = V
−10
VIL
Low Level Input Voltage
V+ ≥ +7V, V− ≤ −7V
GND
0.8
V
V+ < +7V, V−> −7V
GND
0.6
V
+
VIH
High Level Input Voltage
VOL
Low Level Output Level
2.0
VIN = VIH
RL = 3 kΩ or 7 kΩ
V
V
V+ = 4.5V, V− = −4.5V
−4.0
−3.0
V
V+ = 9V, V− = 9V
−8.0
−6.5
V
−10.5
−9.0
V
+
−
V = 12V, V = −12V
VOH
High Level Output Level
VIN = VIL
RL = 3 kΩ or 7 kΩ
V+ = 4.5V, V− = −4.5V
3.0
4.0
V
V+ = 9V, V− = −9V
6.5
8.0
V
V+ = 12V, V− = −12V
9.0
10.5
V
High Level Output Short Circuit
Current (1)
VIN = 0.8V, VO = GND
IOS−
Low Level Output Short Circuit
Current (1)
VIN = 2.0V, VO = GND
ROUT
Output Resistance
V+ = V− = GND = 0V
−2V ≤ VO ≤ +2V (2) (Figure 2 )
(2)
2
+
−
V = +12V, V = −12V
IOS+
(1)
μA
−45
mA
+45
mA
300
Ω
IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device dissipation may be
exceeded.
Power supply (V+, V−) and GND pins are connected to ground for the Output Resistance Test (RO).
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Copyright © 1998–2013, Texas Instruments Incorporated
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DS14C88
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SNLS080C – MAY 1998 – REVISED APRIL 2013
Electrical Characteristics (continued)
Over Recommended Operating Conditions, unless otherwise specified
Parameter
ICC+
Positive Supply Current
Test Conditions
Max
Units
V = 4.5V, V = −4.5V
10
μA
V+ = 9V, V− = −9V
30
μA
V+ = 12V, V− = −12V
60
μA
V+ = 4.5V, V− = −4.5V
50
μA
−
V = 9V, V = −9V
300
μA
V+ = 12V, V− = −12V
500
μA
V+ = 4.5V, V− = −4.5V
−10
μA
−
V = 9V, V = −9V
−10
μA
V+ = 12V, V− = −12V
−10
μA
V+ = 4.5V, V− = −4.5V
−30
μA
−
V = 9V, V = −9V
−30
μA
V+ = 12V, V− = −12V
−60
μA
Typ
Max
Units
V = +4.5V, V = −4.5V
1.5
6.0
μs
V+ = +9.0V, V− = −9.0V
1.2
5.0
μs
V+ = +12V, V− = −12V
1.2
4.0
μs
V = +4.5V, V = −4.5V
1.5
6.0
μs
V+ = +9.0V, V− = −9.0V
1.35
5.0
μs
V+ = +12V, V− = −12V
1.3
4.0
μs
VIN = VILmax
RL = OPEN
VIN = VIHmin
RL = OPEN
ICC-
Negative Supply Current
Min
+
VIN = VILmax
RL = OPEN
+
VIN = VIHmin
RL = OPEN
+
Typ
−
+
Switching Characteristics (1) (2)
Over Recommended Operating Conditions, unless otheriwse specified (Figure 3, Figure 4)
Parameter
tPLH
tPHL
Propagation Delay Low to High
Propagation Delay High to Low
Test Conditions
+
+
−
(3)
tr
Rise Time
tf
Fall Time (3)
tsk
Typical Propagation Delay Skew
0.2
1.0
μs
0.2
1.0
μs
V+ = +4.5V, V− = −4.5V
250
ns
V+ = +9.0V, V− = −9.0V
200
ns
150
ns
+
−
V = +12V, V = −12V
SR
(1)
(2)
(3)
Output Slew Rate (3)
Min
−
RL = 3 kΩ to 7 kΩ
CL = 15 pF to 2500 pF
30
V/μs
AC input test waveforms for test purposes: tr = tf ≤ 20 ns, VIH = 2V, VIL = 0.8V (0.6V at V+ = 4.5V, V− = −4.5V)
Input rise and rall times must not exceed 5 μs.
The output slew rate, rise time, and fall time are measured from the +3.0V to the −3.0V level on the output waveform.
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
3
DS14C88
SNLS080C – MAY 1998 – REVISED APRIL 2013
www.ti.com
Parameter Measure Information
Figure 2. Output Resistance Test Circuit (Power-Off)
Figure 3. Driver Load Circuit (4)
Figure 4. Driver Switching Waveform
(4)
CL include jig and probe capacitances.
TYPICAL APPLICATION INFORMATION
Figure 5. EIA-232D Data Transmission
4
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
DS14C88
www.ti.com
SNLS080C – MAY 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 4
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Copyright © 1998–2013, Texas Instruments Incorporated
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5
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS14C88M
LIFEBUY
SOIC
D
14
55
TBD
Call TI
Call TI
0 to 70
DS14C88M
DS14C88M/NOPB
ACTIVE
SOIC
D
14
55
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS14C88M
DS14C88MX
LIFEBUY
SOIC
D
14
2500
TBD
Call TI
Call TI
0 to 70
DS14C88M
DS14C88MX/NOPB
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS14C88M
DS14C88N/NOPB
ACTIVE
PDIP
NFF
14
25
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
DS14C88N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS14C88MX
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
DS14C88MX/NOPB
SOIC
D
14
2500
330.0
16.4
6.5
9.35
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS14C88MX
SOIC
D
14
2500
367.0
367.0
35.0
DS14C88MX/NOPB
SOIC
D
14
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NFF0014A
N0014A
N14A (Rev G)
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