PROFET® BTS410F2
Smart High-Side Power Switch
Features
Overload protection
Current limitation
Short circuit protection
Thermal shutdown
Overvoltage protection (including load dump)
Fast demagnetization of inductive loads
Reverse battery protection1)
Undervoltage and overvoltage shutdown with
auto-restart and hysteresis
Open drain diagnostic output
Open load detection in ON-state
CMOS compatible input
Loss of ground and loss of Vbb protection
Electrostatic discharge (ESD) protection
Green Product (RoHS compliant)
AEC Qualified
Product Summary
Overvoltage protection
Operating voltage
On-state resistance
Load current (ISO)
Current limitation
Vbb(AZ)
Vbb(on)
RON
IL(ISO)
IL(SCr)
65
V
4.7 ... 42 V
220 m
1.8
A
2.7
A
PG-TO263-5-2
Application
C compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads
Most suitable for inductive loads
Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Providing embedded protective functions.
+ V bb
Voltage
source
Overvoltage
protection
Current
limit
3
Gate
protection
V Logic
2
Voltage
Charge pump
sensor
Level shifter
Limit for
unclamped
ind. loads
Rectifier
IN
OUT
5
Temperature
sensor
Open load
ESD
4
Logic
Load
detection
ST
Short circuit
detection
PROFET
GND
1
Signal GND
)
1
Load GND
With external current limit (e.g. resistor RGND=150 ) in GND connection, resistors in series with IN and ST
connections, reverse load current limited by connected load.
Data Sheet
1
2013-10-15
BTS410F2
Pin
Symbol
Function
1
GND
-
Logic ground
2
IN
I
Input, activates the power switch in case of logical high signal
3
Vbb
+
Positive power supply voltage,
the tab is shorted to this pin
4
ST
S
Diagnostic feedback, low on failure
5
OUT
(Load, L)
O
Output to the load
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter
Supply voltage (overvoltage protection see page 3)
Load
dump protection2) VLoadDump = UA + Vs, UA = 13.5 V
3)
RI = 2 , RL= 6.6 , td= 400 ms, IN= low or high
Load current (Short circuit current, see page 4)
Operating temperature range
Storage temperature range
Power dissipation (DC), TC 25 °C
Inductive load switch-off energy dissipation, single pulse
Vbb = 12V, Tj,start = 150°C, TC = 150°C const.
IL = 1.8 A, ZL = 2.3 H, 0 :
Electrostatic discharge capability (ESD)
IN:
(Human Body Model)
all other pins:
Symbol
Vbb
VLoad dump4)
Values
65
100
Unit
V
V
self-limited
-40 ...+150
-55 ...+150
50
A
°C
4.5
1
2
J
kV
VIN
IIN
IST
-0.5 ... +6
5.0
5.0
V
mA
Symbol
Values
typ
max
-2.5
-75
35
--
Unit
IL
Tj
Tstg
Ptot
EAS
VESD
W
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 6
Thermal Characteristics
Parameter and Conditions
Thermal resistance
)
2
3)
4)
)
5
chip - case: RthJC
junction - ambient (free air): RthJA
SMD version, device on PCB5):
min
----
K/W
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a
150 resistor in the GND connection and a 15 k resistor in series with the status pin. A resistor for the
protection of the input is integrated.
RI = internal resistance of the load dump test pulse generator
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb
connection. PCB is vertical without blown air.
Data Sheet
2
2013-10-15
BTS410F2
Electrical Characteristics
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Values
min
typ
max
Unit
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
IL = 1.6 A
Tj=25 °C: RON
Tj=150 °C:
Nominal load current, ISO Norm (pin 3 to 5)
VON = 0.5 V, TC = 85 °C
Output current (pin 5) while GND disconnected or
GND pulled up, Vbb=30 V, VIN= 0, see diagram
page 7, Tj =-40...+150°C
Turn-on time
IN
to 90% VOUT:
Turn-off time
IN
to 10% VOUT:
RL = 12 , Tj =-40...+150°C
Slew rate on
10 to 30% VOUT, RL = 12 , Tj =-40...+150°C
Slew rate off
70 to 40% VOUT, RL = 12 , Tj =-40...+150°C
--
190
220
390
440
m
IL(ISO)
IL(GNDhigh)
1.6
--
1.8
--
-1
A
mA
ton
toff
12
5
---
125
85
s
dV /dton
--
--
3
V/s
-dV/dtoff
--
--
6
V/s
Tj =-40...+150°C:
Tj =25°C:
Tj =-40...+150°C:
Undervoltage restart
Tj =-40...+150°C:
Undervoltage restart of charge pump
see diagram page 13
Undervoltage hysteresis
Vbb(under) = Vbb(u rst) - Vbb(under)
Overvoltage shutdown
Tj =-40...+150°C:
Overvoltage restart
Tj =-40...+150°C:
Overvoltage hysteresis
Tj =-40...+150°C:
7)
Overvoltage protection
Tj =-40...+150°C:
Ibb=4 mA
Standby current (pin 3)
Tj=-40...+25°C:
VIN=0
Tj= 150°C:
Vbb(on)
Vbb(under)
4.7
2.9
2.7
---
----5.6
42
4.5
4.7
4.9
6.0
V
V
Vbb(under)
--
0.1
--
V
Vbb(over)
Vbb(o rst)
Vbb(over)
Vbb(AZ)
42
40
-65
--0.1
70
52
----
V
V
V
V
IL(off)
10
18
--
15
25
20
A
Leakage output current (included in Ibb(off))
VIN=0
Operating current (Pin 1)8), VIN=5 V,
Tj =-40...+150°C
----
IGND
--
1
2.1
mA
Operating Parameters
Operating voltage 6)
Undervoltage shutdown
)
6
7)
)
8
Vbb(u rst)
Vbb(ucp)
Ibb(off)
V
V
A
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT Vbb - 2 V
Meassured without load. See also VON(CL) in table of protection functions and circuit diagram page 7.
Add IST, if IST > 0, add IIN, if VIN>5.5 V
Data Sheet
3
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BTS410F2
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Protection Functions9)
Initial peak short circuit current limit (pin 3 to 5)10),
IL(SCp)
( max 450 s if VON > VON(SC) )
Tj =-40°C:
Tj =25°C:
Tj =+150°C:
Overload shutdown current limit
IL(SCr)
VON= 8 V, Tj = Tjt (see timing diagrams, page 11)
Short circuit shutdown delay after input pos. slope
VON > VON(SC),
Tj =-40..+150°C: td(SC)
Values
min
typ
max
4.0
3.5
2.0
-5.5
3.5
11
10
7.5
A
--
2.7
--
A
--
--
450
s
61
--150
---
68
-8.5
-10
--
73
75
---32
V
2
--
150
min value valid only, if input "low" time exceeds 60 s
Output clamp (inductive load switch off)
at VOUT = Vbb - VON(CL) IL= 40 mA, Tj =-40..+150°C:
IL= 1 A, Tj =-40..+150°C:
Short circuit shutdown detection voltage(pin 3 to 5)
Thermal overload trip temperature
Thermal hysteresis
Reverse battery (pin 3 to 1) 11)
Diagnostic Characteristics
Open load detection current
(on-condition)
VON(CL)
VON(SC)
Tjt
Tjt
-Vbb
IL (OL)
Tj=-40 ..150°C:
Unit
V
°C
K
V
mA
9
)
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
10)
Short circuit current limit for max. duration of td(SC) max=450 s, prior to shutdown
11)
Requires 150 resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 2 and circuit page 7).
Data Sheet
4
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BTS410F2
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 12 V unless otherwise specified
Values
min
typ
max
Input and Status Feedback12)
Input turn-on threshold voltage
Tj =-40..+150°C:
VIN(T+)
1.5
Input turn-off threshold voltage
Tj =-40..+150°C:
VIN(T-)
1.0
Input threshold hysteresis
VIN(T)
-Off state input current (pin 2), VIN = 0.4 V
IIN(off)
1
On state input current (pin 2), VIN = 5 V
IIN(on)
10
Status invalid after positive input slope
td(ST SC)
-(short circuit)
Tj=-40 ... +150°C:
Status invalid after positive input slope
td(ST)
300
(open load)
Tj=-40 ... +150°C:
Status output (open drain)
Zener limit voltage Tj =-40...+150°C, IST = +50 uA: VST(high)
5.0
-ST low voltage Tj =-40...+150°C, IST = +1.6 mA: VST(low)
12)
Unit
--0.5
-25
--
2.4
--30
70
450
V
V
V
A
A
s
--
1400
s
6
--
-0.4
V
If a ground resistor RGND is used, add the voltage drop across this resistor.
Data Sheet
5
2013-10-15
BTS410F2
Truth Table
Input-
Output
level
level
412
B2
410
D2
410
E2/F2
410
G2
410
H2
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
H
H
L
H
H
L
L
H
L
L
L15)
L15)
L
L
H
H
H
L
H
L
H
14
H (L ))
L
L
15
L )
15)
L
L
L
H
H
H
L
H
L
H
H (L14))
L
L
H
H
H
H
H
H
H
L
H
H
H
H (L14))
L
L
H
H
H
H
H
H
L
H
H
L
L
H
L
L
H
H
H
H
Normal
operation
Open load
Short circuit
to GND
Short circuit
to Vbb
Overtemperature
Undervoltage
Overvoltage
L = "Low" Level
H = "High" Level
Status
13
)
H
L
L
H
H
L
L
L
L
L
L
X = don't care
Z = high impedance, potential depends on external circuit
Status signal after the time delay shown in the diagrams (see fig 5. page 12...13)
Terms
Status output
+5V
Ibb
3
I IN
Vbb
IN
2
IL
V
V
IN
VST
OUT
PROFET
I ST
4
R ST(ON)
VON
ST
GND
1
bb
R
IGND
VOUT
GND
GND
R
ESDZD
ESD-Zener diode: 6 V typ., max 5 mA;
RST(ON) < 250 at 1.6 mA, ESD zener diodes are not
to be used as voltage clamp at DC conditions.
Operation in this mode may result in a drift of the zener
voltage (increase of up to 1 V).
Input circuit (ESD protection)
IN
ST
5
I
ESDZDI1 ZDI2
I
I
GND
ZDI1 6 V typ., ESD zener diodes are not to be used as
voltage clamp at DC conditions. Operation in this mode
may result in a drift of the zener voltage (increase of up
to 1 V).
) Power Transistor off, high impedance, versions BTS 410H, BTS 412B: internal pull up current source for
open load detection.
14)
Low resistance short Vbb to output may be detected in ON-state by the no-load-detection
15)
No current sink capability during undervoltage shutdown
13
Data Sheet
6
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BTS410F2
Short circuit detection
Fault Condition: VON > 8.5 V typ.; IN high
Open-load detection
ON-state diagnostic condition: VON < RON * IL(OL); IN
high
+ V bb
+ V bb
V
ON
OUT
Short circuit
detection
Logic
unit
VON
ON
OUT
Open load
detection
Logic
unit
Inductive and overvoltage output clamp
+ V bb
V
Z
GND disconnect
VON
OUT
GND
3
P R OFE T
IN
2
PROFET
VON clamped to 68 V typ.
Overvolt. and reverse batt. protection
V
+ V bb
V
bb
V
IN
V
OUT
5
ST
4
R IN
Vbb
GND
1
ST
V
GND
Any kind of load. In case of Input=high is VOUT VIN - VIN(T+) .
Z2
IN
Due to VGND >0, no VST = low signal available.
Logic
R ST
GND disconnect with GND pull up
ST
V
3
P R O FE T
Z1
GND
2
R GND
IN
Vbb
PROFET
Signal GND
VZ1 = 6.2 V typ., VZ2 = 70 V typ., RGND= 150 , RIN,
RST= 15 k
4
OUT
5
ST
GND
1
V
V
bb
V
IN ST
V
GND
Any kind of load. If VGND > VIN - VIN(T+) device stays off
Due to VGND >0, no VST = low signal available.
Data Sheet
7
2013-10-15
BTS410F2
with an approximate solution for RL 0 :
Vbb disconnect with energized inductive
load
EAS=
Maximum allowable load inductance for
a single switch off
3
high
Vbb
IN
2
OUT
PROFET
4
IL· L
IL·RL
·(V + |VOUT(CL)|)· ln (1+
)
2·RL bb
|VOUT(CL)|
L = f (IL ); Tj,start = 150°C,TC = 150°C const.,
Vbb = 12 V, RL = 0
5
L [mH]
10000
ST
GND
1
V
bb
Normal load current can be handled by the PROFET
itself.
Vbb disconnect with charged external
inductive load
high
2
1000
S
3
IN
Vbb
PROFET
4
OUT
5
D
ST
GND
1
V
bb
100
If other external inductive loads L are connected to the PROFET,
additional elements like D are necessary.
1.5
1.75
2
2.25
2.5
2.75
3
IL [A]
Inductive Load switch-off energy
dissipation
E bb
E AS
IN
PROFET
=
ELoad
Vbb
OUT
ST
EL
GND
ZL
{
L
RL
ER
Energy stored in load inductance:
2
EL = 1/2·L·I L
While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= VON(CL)·iL(t) dt,
Data Sheet
8
2013-10-15
BTS410F2
Typ. transient thermal impedance chip case
ZthJC = f(tp, D), D=tp/T
ZthJC [K/W]
10
1
D=
0.5
0.2
0.1
0.05
0.02
0.01
0
0.1
0.01
1E-5
1E-4
1E-3
1E-2
1E-1
1E0
1E1
tp [s]
Data Sheet
9
2013-10-15
BTS410F2
Options Overview
all versions: High-side switch, Input protection, ESD protection, load dump and
reverse battery protection with 150 in GND connection, protection against loss of
ground
Type
Logic version
BTS 412 B2 410D2 410E2 410F2 410G2 410H2
Overtemperature protection with hysteresis
Tj >150 °C, latch function16)17)
Tj >150 °C, with auto-restart on cooling
Short circuit to GND protection
B
D
X
X
E
F
G
X
X
X
X
X
X
X
X
X
308
H
X
switches off when VON>3.5 V typ. and Vbb> 7 V
typ16) (when first turned on after approx. 150 s)
switches off when VON>8.5 V typ.16)
(when first turned on after approx. 150 s)
307
X
X
X
Achieved through overtemperature protection
X
Open load detection
in OFF-state with sensing current 30 A typ.
in ON-state with sensing voltage drop across
power transistor
X
X
X
X
X
X
X
X
Undervoltage shutdown with auto restart
X
X
X
X
X
X
X
X
Overvoltage shutdown with auto restart )
X
X
X
X
X
X
-
X
overtemperature
X
X
X
X
X
X
X
X
short circuit to GND
X
X
X
X
-
X
X
X
short to Vbb
X
-19)
19)
-19)
-19)
X
X
X
open load
X
X
X
X
X
X
X
X
undervoltage
X
X
-
-
-
-
X
-
overvoltage
X
X
-
-
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
18
Status feedback for
-
Status output type
CMOS
Open drain
Output negative voltage transient limit
(fast inductive load switch off)
to Vbb - VON(CL)
X
X
X
X
X
X
Load current limit
high level (can handle loads with high inrush currents)
low level (better protection of application)
Protection against loss of GND
X
X
X
) Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (V
OUT
0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 4). No latch
between turn on and td(SC).
17)
With latch function. Reseted by a) Input low, b) Undervoltage
18)
No auto restart after overvoltage in case of short circuit
19)
Low resistance short Vbb to output may be detected in ON-state by the no-load-detection
16
Data Sheet
10
2013-10-15
BTS410F2
Timing diagrams
Figure 3a: Turn on into short circuit,
Figure 1a: Vbb turn on:
IN
IN
t
ST
d(bb IN)
V
bb
V
OUT
V
td(SC)
OUT
A
I
L
ST open drain
t
t
A
in case of too early VIN=high the device may not turn on (curve A)
td(bb IN) approx. 150 s
Figure 2a: Switching an inductive load
td(SC) approx. -- s if Vbb - VOUT > 8.5 V typ.
Figure 3b: Turn on into overload,
IN
IN
t
ST
IL
I L(SCp)
d(ST)
*)
I L(SCr)
V
OUT
ST
IL
I L(OL)
t
t
Heating up may require several seconds,
Vbb - VOUT < 8.5 V typ.
*) if the time constant of load is too large, open-load-status may
occur
Data Sheet
11
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BTS410F2
Figure 3c: Short circuit while on:
Figure 5a: Open load: detection in ON-state, turn
on/off to open load
IN
IN
ST
ST
V OUT
IL
V
I
**)
t
d(ST)
OUT
L
open
t
t
**) current peak approx. 20 s
Figure 4a: Overtemperature,
Figure 5b: Open load: detection in ON-state, open
load occurs in on-state
Reset if (IN=low) and (Tj<Tjt)
IN
IN
t
d(ST OL1)
t
ST
d(ST OL2)
ST
V
V
OUT
OUT
I
T
normal
open
normal
L
J
t
t
td(ST OL1) = tbd s typ., td(ST OL2) = tbd s typ
*) ST goes high , when VIN=low and Tj<Tjt
Data Sheet
12
2013-10-15
BTS410F2
Figure 6a: Undervoltage:
Figure 7a: Overvoltage:
IN
IN
V
V bb
bb
V ON(CL)
Vbb(over)
V bb(o rst)
Vbb(u cp)
V
V
bb(under)
bb(u rst)
V
OUT
V OUT
ST
ST open drain
t
t
Figure 6b: Undervoltage restart of charge pump
Figure 9a: Overvoltage at short circuit shutdown:
VON(CL)
V on
IN
V
V
V
bb(u rst)
bb(over)
off-state
on-state
off-state
Vbb
V bb(o rst)
Output short to GND
V OUT
short circuit shutdown
I
bb(o rst)
L
V
bb(u cp)
V
ST
bb(under)
V bb
charge pump starts at Vbb(ucp) =5.6 V typ.
Data Sheet
t
Overvoltage due to power line inductance. No overvoltage autorestart of PROFET after short circuit shutdown.
13
2013-10-15
BTS410F2
Published by
Infineon Technologies AG,
D-81726 München
© Infineon Technologies AG 2013
All Rights Reserved.
Package and Ordering Code
All dimensions in mm
PG-TO263-5-2
BTS410F2 E3062A
Ordering code
SP001104818
Attention please!
The information herein is given to describe certain
components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not
limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
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For further information on technology, delivery terms and
conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon
Technologies Representatives worldwide (see address list).
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Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies
Office.
Infineon Technologies Components may only be used in lifesupport devices or systems with the express written
approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the
failure of that life-support device or system, or to affect the
safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the
human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to
assume that the health of the user or other persons may be
endangered.
Data Sheet
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2013-10-15