HDSEMI ES3AF S maf plastic-encapsulate diode Datasheet

ES3AF THRU ES3JF
HD AF80
SMAF Plastic-Encapsulate Diodes
Super Fast Recovery Rectifier Diode
Features
●Io
3A
SMAF
●VRRM
50V-600V
●High surge current capability
●Glass passivated chip
● Polarity: Color band denotes cathode
Applications
● Rectifier
Marking
● ES3AF-ES3JF : ES3A-ES3J
Item
Symbol Unit
ES3
Test Conditions
AF BF
Repetitive Peak Reverse Voltage
Maximum RMS Voltage
CF DF EF
GF HF
JF
VRRM
V
50
100
150 200
300
400
500 600
V RMS
V
35
70
105 140
210
280
350 420
IF(AV)
A
IFSM
A
TJ
℃
-55~+150
TSTG
℃
-55 ~ +150
Average Forward Current
Surge(Non-repetitive)Forward
Current
Junction Temperature
Storage Temperature
60HZ Half-sine wave, Resistance
load, TL=120℃
3.0
60Hz Half-sine wave ,1 cycle ,
Ta =25℃
100
Electrical Characteristics (Ta=25℃ Unless otherwise specified)
Item
Unit
Peak Forward Voltage
VF
V
IF =3.0A
Maximum reverse recovery
time
trr
ns
IF=0.5A,IR=1.0A,Irr=0.25A
35
Ta =25℃
10
Ta =100℃
100
Peak Reverse Current
Thermal
Resistance(Typical)
IRRM1
IRRM2
μA
RθJ-A
Test Condition
ES3
Symbol
VRM=VRRM
AF BF CF
DF FF GF
0.95
1.25
HF JF
1.7
1)
Between junction and ambient
47
Between junction and terminal
12
℃/W
RθJ-L
1)
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper
pad areas
High Diode Semiconductor
1
Typical Characteristics
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
IFSM(A)
IO(A)
FIG.1: FORWARD CURRENT DERATING CURVE
3.5
3.0
150
125
8.3ms Single Half Sine Wave
2.5
100
2.0
75
1.5
50
1.0
Resistive or Inductive Load
P.C.B. Mounted on 0.2"×0.2"
(5.0mm×5.0mm)Copper Pad Areas
0.5
0
0
25
25
75
50
100
125
150
TL(℃)
0
1
10
FIG.3: TYPICAL FORWARD CHARACTERISTICS
FIG.4:TYPICAL REVERSE CHARACTERISTICS
100
IR(uA)
IF(A)
100
Number of Cycles
TJ=25℃
Pulse width=300us
1% Duty Cycle
10000
Tj=150℃
1000
10
Tj=125℃
100
ES3A-D
1.0
ES3F-G
Tj=100℃
10
ES3H-J
0.1
Tj=25℃
1.0
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
1.8
VF(V)
20
40
60
80
100
Voltage(%)
FIG.5: Diagram of circuit and Testing wave form of reverse recovery time
I
D
trr
IF
VR
IF
RL
t
0
IRR
IR
High Diode Semiconductor
2
SMAF
.193(4.90)
.173(4.40)
.047(1.20)
.035(0.90)
.146(3.70)
.130(3.30)
.063(1.60)
.106(2.70) .051(1.30)
.094(2.40)
.009(0.23)
.007(0.18)
.051(1.30)
.039(1.00)
Dimensions in inches and (millimeters)
SMAF
1.9
4.65
0.55
JSHD
JSHD
High Diode Semiconductor
3
Reel Taping Specifications For Surface Mount Devices-SMAF
High Diode Semiconductor
4
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