Anpec APM4427KC-TR P-channel enhancement mode mosfet Datasheet

APM4427K
P-Channel Enhancement Mode MOSFET
Pin Description
Features
•
-30V/-4A,
D
RDS(ON) = 85mΩ(typ.) @ VGS = -10V
RDS(ON) = 140mΩ(typ.) @ VGS = -4.5V
•
•
•
•
D
D
D
S
Super High Density Cell Design
S
S
Reliable and Rugged
G
Top View of SOP − 8
SOP-8 Package
( 1, 2, 3 )
S S S
Lead Free Available (RoHS Compliant)
Applications
•
(4)
G
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
DDDD
(5,6,7,8)
P-Channel MOSFET
Ordering and Marking Information
Package Code
K : SO P-8
O perating Junction Tem p. Range
C : -55 to 150°C
Handling Code
TU : Tube
TR : Tape & Reel
Lead Free Code
L : Lead Free Device Blank : Original Device
APM4427
Lead Free Code
Handling Code
Tem p. Range
Package Code
APM4427 K :
APM4427
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
1
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APM4427K
Absolute Maximum Ratings
Symbol
(TA = 25°C unless otherwise noted)
Parameter
Rating
VDSS
Drain-Source Voltage
-30
VGSS
Gate-Source Voltage
±20
ID*
Continuous Drain Current
IDM*
IS*
Pulsed Drain Current
Diode Continuous Forward Current
TJ
Maximum Junction Temperature
TSTG
Storage Temperature Range
PD*
Maximum Power Dissipation
RθJA*
Unit
V
-4
VGS=-10V
A
-16
A
-2
150
°C
-55 to 150
TA=25°C
TA=100°C
Thermal Resistance-Junction to Ambient
2
0.8
W
62.5
°C/W
Note:
2
*Surface Mounted on 1in pad area, t ≤ 10sec.
Electrical Characteristics
Symbol
Parameter
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
VSD
a
a
(TA = 25°C unless otherwise noted)
Test Condition
VGS=0V, IDS=-250µA
Typ.
Gate Leakage Current
VGS=±20V, VDS=0V
Max.
-30
-1
-30
-1
Unit
V
TJ=85°C
VDS=VGS, IDS=-250µA
Diode Forward Voltage
Min.
VDS=-24V, VGS=0V
Gate Threshold Voltage
Drain-Source On-state Resistance
APM4427K
-1.5
µA
-2
V
±100
nA
VGS=-10V, IDS=-4A
85
115
VGS=-4.5V, IDS=-2.3A
140
180
ISD=-1.25A, VGS=0V
-0.7
-1.3
VGS=0V,VDS=0V,F=1MHz
13.5
VGS=0V,
VDS=-25V,
Frequency=1.0MHz
550
mΩ
V
b
Dynamic Characteristics
RG
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
Tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
Tf
VDD=-15V, RL=15Ω,
IDS=-1A, VGEN=-10V,
RG=6Ω
Turn-off Fall Time
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
2
Ω
pF
120
80
10
20
10
25
25
55
5
15
ns
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APM4427K
Electrical Characteristics (Cont.)
Symbol
Parameter
Gate Charge Characteristics
Qg
Total Gate Charge
Test Condition
APM4427K
Min.
Typ.
Max.
12.3
16
Unit
b
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
(TA = 25°C unless otherwise noted)
VDS=-15V, VGS=-10V,
IDS=-4A
3.5
nC
1.1
a : Pulse test ; pulse width≤300µs, duty cycle≤2%.
b : Guaranteed by design, not subject to production testing.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
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APM4427K
Typical Characteristics
Drain Current
2.5
5
2.0
4
-ID - Drain Current (A)
Ptot - Power (W)
Power Dissipation
1.5
1.0
0.5
3
2
1
o
TA=25 C,VG=-10V
o
0.0
TA=25 C
0
20
40
60
0
80 100 120 140 160
20
40
60
80
100 120 140 160
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
10
s
Rd
(
)L
on
im
Normalized Transient Thermal Resistance
50
-ID - Drain Current (A)
0
it
1ms
10ms
1
100ms
1s
0.1
DC
o
TA=25 C
0.01
0.1
1
10
1
Duty = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
Single Pulse
0.01
2
1E-3
1E-4
100
-VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
2
Mounted on 1in pad
o
RθJA : 62.5 C/W
1E-3
0.01
0.1
1
10 30
Square Wave Pulse Duration (sec)
4
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APM4427K
Typical Characteristics (Cont.)
Output Characteristics
Drain-Source On Resistance
240
16
VGS= -6,-7,-8,-9,-10V
210
-5V
12
10
8
-4V
6
4
2
0
-3V
0
1
2
3
4
5
6
7
8
9
120
VGS= -10V
90
60
30
6
8
10
12
14
Gate Threshold Voltage
1.4
10
8
o
Tj=125 C
o
Tj=-55 C
o
Tj=25 C
2
0
4
Transfer Characteristics
14
0
2
-ID - Drain Current (A)
1.6
4
0
-VDS - Drain - Source Voltage (V)
12
-ID - Drain Current (A)
150
16
6
VGS= -4.5V
180
0
10
Normalized Threshold Voltage
-ID - Drain Current (A)
RDS(ON) - On - Resistance (mΩ)
14
1
2
3
4
5
6
-VGS - Gate - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
IDS = -250µA
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
7
16
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
5
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APM4427K
Typical Characteristics (Cont.)
Drain-Source On Resistance
1.6
Source-Drain Diode Forward
20
IDS = -250µA
10
1.2
o
-IS - Source Current (A)
Normalized On Resistance
1.4
1.0
0.8
0.6
0.4
Tj=150 C
o
Tj=25 C
1
0.2
0.0
-50 -25
0
25
50
75
0.1
0.0
100 125 150
1.2 1.4
1.6
Gate Charge
10
VDS= -15V
9 I = -4A
D
-VGS - Gate - source Voltage (V)
600
C - Capacitance (pF)
1.0
Capacitance
Frequency=1MHz
Ciss
500
400
300
200
Coss
Crss
0
0.8
-VSD - Source - Drain Voltage (V)
700
0
0.6
Tj - Junction Temperature (°C)
800
100
0.2 0.4
5
10
15
20
25
7
6
5
4
3
2
1
0
30
0
2
4
6
8
10
12
14
QG - Gate Charge (nC)
-VDS - Drain - Source Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
8
6
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APM4427K
Packaging Information
E
e1
0.015X45
SOP-8 pin ( Reference JEDEC Registration MS-012)
H
e2
D
A1
A
1
L
0.004max.
Dim
Mi ll im et er s
Inche s
A
A1
D
E
Min.
1. 35
0. 10
4. 80
3. 80
Max .
1. 75
0. 25
5. 00
4. 00
Min.
0. 053
0. 004
0. 189
0. 150
Max .
0. 069
0. 010
0. 197
0. 157
H
L
e1
5. 80
0. 40
0. 33
6. 20
1. 27
0. 51
0. 228
0. 016
0. 013
0. 244
0. 050
0. 020
e2
1. 27B S C
0. 50B S C
φ 1
8°
8°
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
7
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APM4427K
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
C ritical Zone
T L to T P
T e m p e ra tu re
R am p-up
TL
tL
T sm ax
T sm in
R am p-down
ts
Preheat
25
t 25 °C to Peak
T im e
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6
minutes
max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
8
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APM4427K
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
3
3
Package Thickness
Volum e m m
Volum e m m
<350
≥350
<2.5 m m
240 +0/-5°C
225 +0/-5°C
≥2.5 m m
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
3
3
3
Package Thickness
Volum e mm
Volum e mm
Volum e mm
<350
350-2000
>2000
<1.6 m m
260 +0°C*
260 +0°C*
260 +0°C*
1.6 m m – 2.5 m m
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 m m
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and
including the stated classification tem perature (this m eans Peak reflow tem perature +0°C.
For exam ple 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
Method
MIL-STD-883D-2003
MIL-STD 883D-1005.7
JESD-22-B, A102
MIL-STD 883D-1011.9
Description
245°C,5 SEC
1000 Hrs Bias @ 125°C
168 Hrs, 100% RH, 121°C
-65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
E
P
Po
D
P1
Bo
F
W
Ao
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
D1
9
Ko
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APM4427K
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Application
SOP- 8
A
B
330 ± 1
F
5.5± 1
J
T1
T2
W
P
E
62 +1.5
C
12.75+
0.15
2 ± 0.5
12.4 ± 0.2
2 ± 0.2
12± 0. 3
8± 0.1
1.75±0.1
D
D1
Po
P1
Ao
Bo
Ko
t
2.0 ± 0.1
6.4 ± 0.1
5.2± 0. 1
2.1± 0.1
.3±0.013
1.55 +0.1 1.55+ 0.25 4.0 ± 0.1
(mm)
Cover Tape Dimensions
Application
SOP- 8
Carrier Width
12
Cover Tape Width
9.3
Devices Per Reel
2500
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. B.1 - Mar., 2005
10
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