AOSMD AO8403 P-channel enhancement mode field effect transistor Datasheet

AO8403
P-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO8403 uses advanced trench technology to provide
excellent RDS(ON), low gate charge and operation with gate
voltages as low as 1.8V. This device is suitable for use as
a load switch or in PWM applications. It is ESD
protected. Standard Product AO8403 is Pb-free (meets
ROHS & Sony 259 specifications). AO8403L is a Green
Product ordering option. AO8403 and AO8403L are
electrically identical.
VDS (V) = -20V
ID = -4 A (VGS = -4.5V)
RDS(ON) < 42mΩ (VGS = -4.5V)
RDS(ON) < 52mΩ (VGS = -2.5V)
RDS(ON) < 70mΩ (VGS = -1.8V)
ESD Rating: 3000V HBM
D
TSSOP-8
Top View
D
S
S
G
1
2
3
4
8
7
6
5
D
S
S
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
ID
IDM
TA=70°C
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
±8
V
-30
1.5
W
1
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
-3.5
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Units
V
-4
TA=25°C
Power Dissipation A
Maximum
-20
RθJA
RθJL
Typ
64
89
53
Max
83
120
70
Units
°C/W
°C/W
°C/W
AO8403
Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VGS(th)
Gate Threshold Voltage
On state drain current
ID(ON)
Conditions
Min
ID=-250µA, VGS=0V
VDS=-16V, VGS=0V
-20
VDS=0V, VGS=±4.5V
VDS=0V, VGS=±8V
VDS=VGS ID=-250µA
VGS=-4.5V, VDS=-5V
-0.3
-25
gFS
VSD
IS
Static Drain-Source On-Resistance
TJ=125°C
VGS=-2.5V, ID=-4A
VGS=-1.8V, ID=-3A
VDS=-5V, ID=-4A
Forward Transconductance
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
8
-0.55
mΩ
56
16
70
-0.78
-1
-2.2
V
A
1750
pF
pF
VGS=-4.5V, VDS=-10V, ID=-4A
17.2
1.3
IF=-4A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=-4A, dI/dt=100A/µs
-1
mΩ
160
6.5
VGS=-4.5V, VDS=-10V, RL=2.5Ω,
RGEN=3Ω
µA
µA
52
VGS=0V, VDS=0V, f=1MHz
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
±1
±10
45
Rg
Turn-On DelayTime
µA
42
60
1450
205
tD(on)
tr
tD(off)
tf
trr
Qrr
-1
-5
35
48
VGS=0V, VDS=-10V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
Units
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Gate resistance
Max
V
TJ=55°C
VGS=-4.5V, ID=-4A
RDS(ON)
Typ
mΩ
S
pF
Ω
21
4.5
9.5
17
94
35
31
13.8
nC
nC
nC
ns
ns
ns
ns
ns
nC
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
Rev1: August 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
AO8403
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
25
10
-4.5V
-8V
VDS=-5V
-3.0V
20
8
15
6
-2.5V
-ID(A)
-ID (A)
-2.0V
10
125°C
4
VGS=-1.5V
5
2
0
25°C
0
0
1
2
3
4
5
0
0.5
80
Normalized On-Resistance
RDS(ON) (mΩ)
1.5
2
1.6
VGS=-1.8V
60
VGS=-2.5V
40
VGS=-4.5V
20
ID=-4A, VGS=-2.5V
1.4
ID=-2A, VGS=-1.8V
1.2
ID=-4A, VGS=-4.5V
1.0
0.8
0
2
4
6
8
10
0
25
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
1E+01
90
1E+00
ID=-4A
75
100
125
150
175
125°C
1E-01
-IS (A)
70
60
125°C
50
50
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
100
80
RDS(ON) (mΩ)
1
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
25°C
1E-02
1E-03
1E-04
40
25°C
1E-05
30
1E-06
20
0
2
4
6
8
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO8403
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2400
5
VDS=-10V
ID=-4A
2000
Capacitance (pF)
-VGS (Volts)
4
3
2
1
Ciss
1600
1200
800
Coss
400
Crss
0
0
0
5
10
15
20
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
TJ(Max)=150°C
TA=25°C
40
100µs
1.0
10ms
1s
10s
20
10
0.1s
DC
0
0.001
0.1
1
10
100
-VDS (Volts)
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=90°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
20
30
1ms
10
15
TJ(Max)=150°C
TA=25°C
10µs
RDS(ON)
10.0 limited
0.1
10
-VDS (Volts)
Figure 8: Capacitance Characteristics
Power (W)
-ID (Amps)
100.0
5
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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