CPC44055ST AC Power Switch INTEGRATED CIRCUITS DIVISION Characteristics Description Parameter Rating Units AC Operating Voltage 20-280 VAC (Vrms) Input Voltage Range 9-16 V Load Current With 5°C/W Heat Sink 20 No Heat Sink 5 Arms On-State Voltage Drop 1.1 VP (at IL=2AP) Blocking Voltage 800 VP Thermal Resistance, Junction-to-Case, JC 0.35 °C/W Features • Load Current up to 20Arms with 5°C/W Heat Sink • 800VP Blocking Voltage Creepage Pin 1 to Pin 2 of 0.225 inch (5.715 mm) • Zero-Cross Switching • 2500Vrms Isolation, Input to Output Creepage Pin 2 to Pin 3 of 0.375 inch (9.525 mm) • DC Voltage Control, AC Output • Optically Isolated • Low EMI and RFI Generation • High Noise Immunity • Machine Insertable, Wave Solderable CPC44055ST is a voltage-controlled AC Solid State Switch utilizing dual power SCR outputs. This device also includes zero-cross turn-on circuitry and is specified with an 800VP blocking voltage. Tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide exceptional noise immunity and 2500Vrms of isolation. As a result, the CPC44055ST is well suited for industrial environments where electromagnetic interference would disrupt the operation of communications and control systems. The unique SuperSIP package pioneered by IXYS Integrated Circuits Division allows Solid State Relays to achieve the highest load current currently available in any similar-sized package. This package features a unique process in which the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal resistance (0.35°C/W). Ordering Information Applications • Lighting • Tungsten Load: 4.75A (Free Air), 15A (Heat Sink) • Electrical Ballast: 5A (Free Air), 15A (Heat Sink) • Programmable Controls • Process Controls • Power Control Panels • Remote Switching • Gas Pump Electronics • Contactors • Large Relays • Solenoids • Motors: 1/3HP (Free Air), 1/2HP (Heat Sink) • Heaters Part Description CPC44055ST SuperSIP Package (13 per tube) Pin Configuration & Waveforms ZC 1 2 AC Load 3 +V 4 –V Control Approvals • UL 508 Recognized Component: File E69938 See “UL Approved Ratings” on page 4. AC Line Load Current Voltage Across Relay DS-CPC44055ST-R02 www.ixysic.com 1 CPC44055ST INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Blocking Voltage Reverse Input Voltage Input Control Voltage Input Power Dissipation 1 Total Power Dissipation 2 I2t for Fusing (1/2 Sine Wave, 60Hz) Isolation Voltage, Input to Output 60 Seconds ESD, Human Body Model Operational Temperature Storage Temperature 1 2 Min Max Units - 800 5 17 225 4.4 VP V V mW W - 200 A2s - 2500 Vrms - 40 - 40 4 +85 +125 kV °C °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33mW / °C. Free air, no heat sink. 1.2 Recommended Operating Conditions Parameter Input Control Voltage 1 1 Conditions Symbol Min. Typ. Max. Units TA=-40°C to 85°C VIN 9 - 16 V For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use VIN >10V. 1.3 Electrical Characteristics @ 25°C Parameter Output Characteristics Load Current Continuous Continuous Maximum Surge Current Off-State Leakage Current On-State Voltage Drop 1 Off-State dV/dt Switching Speeds Turn-On Turn-Off Zero-Cross Turn-On Voltage Holding Current Latching Current Operating Frequency 2 Load Power Factor for Guaranteed Turn-On 3 Conditions Symbol No Heat Sink, VL=20-280Vrms TC=25°C 1/2 Sine Wave, 60Hz VL=800V IL=2AP VIN=0V IL IP ILEAK - dV/dt ton toff Minimum Typical Maximum 0.1 0.1 1000 0.85 - 5 40 150 100 1.1 - 6.8 - 0.5 0.5 20 5 50 75 500 - Units Arms A AP VP V/s 1st half-cycle subsequent half-cycle f=60Hz IH IL PF 20 0.25 IL=1A Resistive, f=60Hz VIN=10V VR=5V RIN VIN IIN IR 0.9 0.8 7.8 - 1 8.8 - 1.1 5 10.1 10 k V V mA A VIO=0V, f=1MHz CIO - - 3 pF VIN=10V - cycles V mA mA Hz - Input Characteristics Input Resistor Input Control Voltage to Activate Input Control Voltage to Deactivate Input Current Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output 1 2 3 Tested at a peak value equivalent. Zero-cross first half-cycle @ < 100Hz. Snubber circuits may be required at low power factors. R02 www.ixysic.com 2 CPC44055ST INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.35 °C/W Free Air JA 27 °C/W - TJ -40 to +100 °C Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) 2.1 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating θCA = (TJ - TA) PD - θJC TJ = Junction Temperature (°C), TJ ≤ 150°C * TA = Ambient Temperature (°C) θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD = On-State Voltage (Vrms) • Load Current (Arms) * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 2.2 Thermal Performance Data Output Power Dissipation vs. Ambient Temperature Output Power Dissipation vs. Load Current 40 40 Output Power (W) Heat Sink 2ºC/W 5ºC/W 10ºC/W 15ºC/W 30 25 20 30 25 20 15 15 10 10 5 5 No Heat Sink 0 0 0 3 Output Power (W) 35 35 5 10 15 20 Load Current (Arms) 25 30 0 10 www.ixysic.com 20 30 40 50 60 70 Ambient Temperature (ºC) 80 90 R02 CPC44055ST INTEGRATED CIRCUITS DIVISION 3 UL Approved Ratings 3.1 General Loads Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 20 - 280 4.75 40 20 - 280 2.5 85 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 70 Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 20 - 280 4.75 40 20 - 280 2.5 85 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 70 Voltage (VAC) Current Surrounding Air Temperature (°C) 220 - 240 1/3 HP, 3.6 FLA 40 3.2 Tungsten Lamp Load 3.3 Motor Load 220 - 240 1/6 HP, 2.2 FLA 85 110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 40 110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 70 Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 120 5 35 120 15 (with Heat Sink*) 40 120 10 (with Heat Sink*) 70 3.4 Electronic Ballast Load Note: *Heat Sink Used for UL Testing: Ohmite MA-302-55E R02 www.ixysic.com 4 CPC44055ST INTEGRATED CIRCUITS DIVISION 4 Performance Data (@25°C Unless Otherwise Noted) Input Voltage to Activate Resistive Load (N=50, IL=1A, VL=120VAC/60Hz) 25 Device Count (N) Device Count (N) 20 15 10 5 Typical Blocking Voltage Distribution (N=50) 20 20 Device Count (N) 25 On-State Voltage Drop (N=50, VIN=10V, IL=2A) 15 10 5 0 0 15 10 5 0 0.856 0.859 0.862 0.865 0.868 0.871 0.874 On-State Voltage Drop (V) 3.868 3.908 3.948 3.988 4.028 4.068 4.108 LED Forward Voltage (V) 876 878 880 882 884 Blocking Voltage (VP) 886 Zero-Cross Voltage Distribution (N=50, VIN=10V) 20 Device Count (N) 874 15 10 5 0 6.2 10 5 0 60 50 40 30 On-State Voltage Drop vs. Temperature (VIN=10V) IL=4AP IL=3AP IL=2AP IL=1AP 0.95 0.90 0.85 0.80 -20 0 20 40 60 Temperature (ºC) 80 -40 -20 0 20 40 60 Temperature (ºC) 80 100 7.0 6.8 6.6 6.4 6.2 -40 100 Input Voltage to Activate Resistive Load (IL=1A, 60Hz) 6.0 5.5 5.0 4.5 4.0 -20 0 20 40 60 Temperature (ºC) 80 100 Input Voltage to Activate Inductive Load (IL=500mA, 60Hz, 400mH) 9.0 8.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 3.5 0.75 7.2 6.0 -40 20 Input Voltage to Activate (V) 10 15 Input Voltage (V) Input Voltage to Activate (V) On-State Voltage Drop (VP) 5 Zero-Cross vs. Temperature (VIN=10V, RL=120Ω) 7.4 70 20 0 1.00 7.4 Zero-Cross Voltage (V) Holding current (mA) Input Current (mA) 80 15 6.6 6.8 7.0 7.2 Zero-Cross Voltage (V) Holding Current vs. Temperature (VIN=0V, RL=1.9Ω) Input Voltage vs. Input Current 20 6.4 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 The performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R02 CPC44055ST INTEGRATED CIRCUITS DIVISION 5.5 5.0 4.5 4.0 3.5 6.44 6.40 6.35 6.30 6.25 6.20 6.15 6.10 500 600 Typical Load Current vs. On-State Voltage Drop (VIN=10V) 100 200 300 400 Load Frequency (Hz) 500 6.40 6.38 6.36 6.34 0 600 0 -2 -4 200 300 400 Load Frequency (Hz) 500 600 100 950 900 850 VL=800V VL=600V VL=400V 10 1 0.1 0.01 0.001 800 -40 1.0 100 Off-State Leakage Current vs. Temperature 1000 2 -0.5 0.0 0.5 On-State Voltage Drop (V) 6.42 Breakdown Voltage vs. Temperature 4 -6 -1.0 0 Leakage Current (μA) 200 300 400 Load Frequency (Hz) Breakdown Voltage (VP) 6 100 Input Voltage to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=196mH/110Ω) 6.32 6.05 0 Load Current (A) Input Voltage to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=400mH/220Ω) Input Voltage to Activate (V) 6.45 Input Voltage to Activate (V) Input Voltage to Activate (V) 6.0 Input Voltage to Activate vs. Load Frequency - Resistive Load (VL=67V, IL=4.91Arms, RL=10Ω) 300 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Surge Current Non-Repetitive (TJ=50ºC Prior to Surge) Surge Current (A) 250 200 150 100 50 0 1ms 10ms 100ms Time 1s 10s The performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 6 CPC44055ST INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC44055ST MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC44055ST 245°C for 30 seconds NOTE: The exposed surface of the DCB substrate is not to be soldered. 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. 7 www.ixysic.com R02 CPC44055ST INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 3.807±0.076 (0.150±0.003) 38.100±0.254 (1.500±0.010) TOP 35.544±0.254 (1.360±0.010) BOTTOM 1.778±0.254 (0.070±0.010) 13.005±0.254 (0.512±0.010) 17.780±0.254 (0.700±0.010) 9.169±0.127 (0.361±0.005) DCB Substrate NOTE: Not to be soldered Pin 1 2.540±0.254 (0.100±0.010) (4x) 3.810±0.127 (0.150±0.005) DIMENSIONS millimeters (inches) Pin 1 2.997±0.254 (0.118±0.010) 2.540±0.127 (0.100±0.005) 5.080±0.127 (0.200±0.005) 6.350±0.127 (0.250±0.005) 1.016±0.076 (0.040±0.003) (4x) 0.635±0.025 (0.025±0.001) 10.160±0.127 (0.400±0.005) 12.700±0.127 (0.500±0.005) 1.397±0.127 (0.055±0.005) Pin tolerances are non-cumulative RECOMMENDED HOLE PATTERN Hole Size 1.45 mm (0.057 in) x4 Pin 1 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC44055ST-R02 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/9/2015 R02 www.ixysic.com 8