LCD and Camera EMI Filter Array with ESD Protection CM1431 Features Product Description • The CM1431 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor TDFN 0.40mm pitch packages. The CM1431 has component values of 15pF-100Ω-15pF per channel. The CM1431 has a cut-off frequency of 120MHz and can be used in applications with data rates up to 48Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz TDFN package with 0.40mm lead pitch: • 4-ch. = 8-lead TDFN • 6-ch. = 12-lead TDFN • 8-ch. = 16-lead TDFN Tiny TDFN package size: • 8-lead: 1.7mm x 1.35mm • 12-lead: 2.5mm x 1.35mm • 16-lead: 3.3mm x 1.35mm Increased robustness against vertical impacts during manufacturing process Lead-free finishing Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1431 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1431 is housed in space-saving, low-profile 8-, 12- and 16-lead TDFN packages with a 0.40mm pitch and is available with lead-free finishing. This smaller size TDFN package provides up to 42% board space saving vs. the 0.50mm pitch TDFN packages. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1431/D CM1431 Electrical Schematic 1 of 4, 6 or 8 EMI/RFI + ESD Channels 8 7 6 5 Rev. 2 | Page 2 of 12 | www.onsemi.com CM1431 PIN DESCRIPTIONS DEVICE PIN(s) DEVICE PIN(s) -04 -06 -08 NAME 1 1 1 FILTER1 2 2 2 3 3 4 -04 -06 -08 NAME Filter + ESD Channel 1 8 12 16 FILTER1 Filter + ESD Channel 1 FILTER2 Filter + ESD Channel 2 7 11 15 FILTER2 Filter + ESD Channel 2 3 FILTER3 Filter + ESD Channel 3 6 10 14 FILTER3 Filter + ESD Channel 3 4 4 FILTER4 Filter + ESD Channel 4 5 9 13 FILTER4 Filter + ESD Channel 4 5 5 FILTER5 Filter + ESD Channel 5 8 12 FILTER5 Filter + ESD Channel 5 6 6 FILTER6 Filter + ESD Channel 6 7 11 FILTER6 Filter + ESD Channel 6 7 FILTER7 Filter + ESD Channel 7 10 FILTER7 Filter + ESD Channel 7 8 FILTER8 Filter + ESD Channel 8 9 FILTER8 Filter + ESD Channel 8 GND PAD GND DESCRIPTION DESCRIPTION Device Ground Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish Pins Package Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 8 TDFN-8 CM1431-04DF WF CM1431-04DE WE 12 TDFN-12 CM1431-06DF N31F CM1431-06DE N31E 16 TDFN-16 CM1431-08DF N318F CM1431-08DE N318E Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 2 | Page 3 of 12 | www.onsemi.com CM1431 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 12 | www.onsemi.com CM1431 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance CTOTAL MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 24 30 36 pF Capacitance C At 2.5VDC Reverse Bias, 1MHz, 30mVAC 12 15 18 pF Standoff Voltage IDIODE=10µA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 0.1 1.0 µA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V C VDIODE VESD RDYN f C A1GHz In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 5.6 -1.5 V Note 2 Dynamic Resistance Positive Negative ±30 kV ±15 kV 2.3 0.9 Ω Ω 110 MHz Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Channel R = 100Ω, Channel C = 15pF Absolute Attenuation @ 1GHz from 0dB Level ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1and 3 35 dB ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1 and 3 30 dB A800MHz - 6GHz Absolute Attenuation @ 800MHz to 6GHz from 0dB Level Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Attenuation / RF curves characterized by a network analyzer using microprobes. Rev. 2 | Page 5 of 12 | www.onsemi.com CM1431 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) Rev. 2 | Page 6 of 12 | www.onsemi.com CM1431 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) Rev. 2 | Page 7 of 12 | www.onsemi.com CM1431 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) Rev. 2 | Page 8 of 12 | www.onsemi.com CM1431 Mechanical Details CM1431-04DF/DE Mechanical Specifications Dimensions for the CM1431-04DF/DE supplied in a 8-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C Leads 8 ✝ Millimeters Dim. Inches Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 0.20 REF A3 0.008 REF b 0.15 0.20 0.25 0.006 0.008 0.010 D 1.65 1.70 1.75 0.065 0.067 0.069 D2 1.10 1.20 1.30 0.043 0.047 0.051 E 1.30 1.35 1.40 0.051 0.053 0.055 E2 0.30 0.40 0.50 0.012 0.016 0.020 0.40 BSC e K 0.20 L 0.15 # per tape and reel 0.016 BSC 0.008 0.25 0.35 0.006 0.010 0.014 3000 pieces Dimensions for 8-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Rev. 2 | Page 9 of 12 | www.onsemi.com CM1431 Mechanical Details (cont’d) CM1431-06DF/DE Mechanical Specifications Dimensions for the CM1431-06DF/DE suplied in a 12-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-12, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C Leads 12 ✝ Millimeters Dim. Inches Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 0.20 REF A3 0.008 REF b 0.15 0.20 0.25 0.006 0.008 0.010 D 2.45 2.50 2.55 0.096 0.098 0.100 D2 1.90 2.00 2.10 0.075 0.079 0.083 E 1.30 1.35 1.40 0.051 0.053 0.055 E2 0.25 0.35 0.45 0.010 0.014 0.018 0.40 BSC e K 0.20 L 0.15 # per tape and reel 0.016 BSC 0.008 0.25 0.35 0.006 0.010 0.014 3000 pieces Dimensions for 12-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Rev. 2 | Page 10 of 12 | www.onsemi.com CM1431 Mechanical Details (cont’d) CM1431-08DF/DE Mechanical Specifications Dimensions for the CM1431-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information document. PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C Leads 16 ✝ Millimeters Dim. Inches Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 A3 0.40 0.55 0.70 0.016 0.022 0.028 0.20 REF b 0.008 REF D 3.25 3.30 3.35 0.128 0.130 0.132 D2 2.80 2.90 3.00 0.110 0.114 0.118 E 1.30 1.35 1.40 0.051 0.053 0.055 E2 0.35 0.40 0.45 0.014 0.016 0.018 0.40 BSC e K 0.20 L 0.15 # per tape and reel 0.016 BSC 0.008 0.25 0.35 0.006 0.010 0.014 3000 pieces Dimensions for 16-Lead, 0.4mm pitch TDFN package Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Rev. 2 | Page 11 of 12 | www.onsemi.com CM1431 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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