Datasheet Operational Amplifiers Low Noise Operational Amplifiers BA8522Rxxx General Description Key Specifications Operating Supply Voltage (split supply): ±2V to ±16V Temperature Range: -40°C to +105°C Input Offset Voltage: ±1.5mV(Max) Slew Rate: 3V/µs(Typ) Total Harmonic Distortion: 0.002%(Typ) Input Referred Noise Voltage: 9 nV/ Hz (Typ) BA8522Rxxx are low noise operational amplifiers of high voltage gain. It excels especially in input referred noise voltage (9 nV/ Hz ), total harmonic distortion (0.002%) and operating voltage range (±2V to ±16V) and it is the most suitable operational amplifier with audio equipment. Features Packages High Voltage Gain Low Input Referred Noise Voltage Low Total Harmonic Distortion Low Input Offset Voltage Wide Operating Supply Voltage Wide Operating Temperature Range SOP8 SSOP-B8 MSOP8 W(Typ) x D(Typ) x H(Max) 5.00mm x 6.20mm x 1.71mm 3.00mm x 6.40mm x 1.35mm 2.90mm x 4.00mm x 0.90mm Application Audio Application Consumer Equipment Active Filter Simplified Schematic VCC -IN OUT +IN VEE Figure 1. Simplified schematic (1 channel only) 〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 1/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Pin Configuration BA8522RF : SOP8 BA8522RFV : SSOP-B8 BA8522RFVM : MSOP8 8 VCC OUT1 1 -IN1 +IN1 2 CH1 7 - + 3 6 CH2 Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VEE 5 +IN2 6 -IN2 7 OUT2 8 VCC OUT2 -IN2 + - VEE 5 +IN2 4 Package SOP8 SSOP-B8 MSOP8 BA8522RF BA8522RFV BA8522RFVM Ordering Information B A 8 5 2 2 R x x x xx Packaging and Forming Specification E2: Embossed tape and reel (SOP8/SSOP-B8) TR: Embossed tape and reel (MSOP8) Package F : SOP8 FV : SSOP-B8 FVM : MSOP8 Part Number BA8522Rxxx - Line-up Topr -40°C to +105°C Operating Supply Voltage (split supply) ±2.0V to ±16.0V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 Supply Current (Typ) 5.5mA Slew Rate (Typ) 3V/µs 2/22 Package Orderable Part Number SOP8 Reel of 2500 BA8522RF-E2 SSOP-B8 Reel of 2500 BA8522RFV-E2 MSOP8 Reel of 3000 BA8522RFVM-TR TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Absolute Maximum Ratings (TA=25°C) Parameter Supply Voltage Symbol Ratings Unit VCC-VEE +36 V SOP8 Power Dissipation PD SSOP-B8 MSOP8 (Note 5) (Note 1,4) 0.69 0.62(Note 2,4) 0.59 W (Note 3,4) Differential Input Voltage VID +36 V Input Common-mode Voltage Range VICM (VEE-0.3) to VEE+36 V Input Current (Note 6) II -10 mA Operating Supply Voltage Vopr ±2 to ±16 (+4 to +32) V Output Current IOUT ±50 mA Operating Temperature Topr -40 to +105 °C Storage Temperature Tstg 55 to +150 °C TJmax +150 °C Maximum Junction Temperature (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) To use at temperature above TA=25°C reduce 5.5mW/°C. To use at temperature above TA=25°C reduce 5.0mW/°C. To use at temperature above TA=25°C reduce 4.7mW/°C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. (Note 6) Excessive input current will flow if a differential input voltage in excess of approximately ±0.6V is applied between the input unless some limiting resistance is used. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 3/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Electrical Characteristics ○ BA8522Rxxx (Unless otherwise specified VCC=+15V, VEE=-15V, TA=25°C) Limits Parameter Symbol Min Typ Max Input Offset Voltage (Note 7) Unit Condition VIO - 0.1 1.5 mV - VIO/ΔT - 2 - μV/°C - Input Offset Current (Note 7) IIO - 5 200 nA - Input Bias Current (Note 8) IB - 50 500 nA - Supply Current ICC - 5.5 9 mA Maximum Output Voltage VOM ±12 ±13.5 - V RL≧10kΩ ±10.5 ±11 - V RL≧2kΩ Large Signal Voltage Gain AV 86 110 - dB RL≧10kΩ, OUT=±10V VICM ±12 ±14 - V - Common-mode Rejection Ratio CMRR 70 90 - dB - Power Supply Rejection Ratio PSRR 76.5 90 - dB - Channel Separation CS - 105 - dB Slew Rate SR - 3 - V/μs RL=2kΩ, CL=100pF GBW - 6 - MHz f=500kHz - 1.2 - μVrms - 9 - nV/ Hz THD+N - 0.002 - % AV=20dB, OUT=5Vrms f=1kHz, 80kHz-LPF CS - 100 - dB OUT=0.5Vrms, f=1kHz AV=40dB, Input referred Input Offset Voltage drift (Note 7) Input Common-mode Voltage Range Gain Bandwidth Input Referred Noise Voltage Total Harmonic Distortion + Noise Channel Separation RL=∞, All Op-Amps, +IN=0V AV=40dB, f=1kHz OUT=1Vrms AV=40dB, RS=100Ω DIN-AUDIO VN AV=40dB, RS=100Ω, f=1kHz (Note 7) Absolute value (Note 8) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 4/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VCC/VEE) Indicates the maximum voltage that can be applied between the positive VCC terminal and VEE terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics item (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Voltage Drift (ΔVIO/ΔT) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. (3) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (4) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (5) Supply Current (ICC) Indicates the current that flows within the IC under specified no-load conditions. (6) Output Saturation Voltage (VOM) Signifies the voltage range that can be output under specific output conditions. (7) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output Voltage) / (Differential Input Voltage) (8) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (9) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (10) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (11) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. (12) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (13) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. (14) Input Referred Noise Voltage (VN) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 5/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet (15) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 6/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves ○ BA8522Rxxx 1.0 10 0.8 8 BA8522RF 0.6 Supply Current [mA] Power Dissipation [W] -40°C BA8522RFV 0.4 25°C 6 4 105°C BA8522RFVM 0.2 2 0.0 0 0 25 50 75 100 125 Ambient Temperature [°C] . 150 0 10 15 20 25 30 35 Supply Voltage [V] Figure 3. Supply Current vs Supply Voltage Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 10 Maximum Output Voltage Swing [VP-P] 30 8 ±15V Supply Current [mA] 5 6 4 ±2 V ±7.5 V 2 0 25 20 15 10 5 0 -50 -25 0 25 50 75 100 125 0.1 Ambient Temperature [°C] 1 Load Resistance [kΩ] 10 Figure 5. Maximum Output Voltage Swing vs Load Resistance (VCC/VEE=+15V/-15V, TA=25°C) Figure 4. Supply Current vs Ambient Temperature (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 7/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves - continued ○ BA8522Rxxx 10 20 Maximum Output Voltage [V] Maximum Output Voltage [V] 15 10 VOH 5 0 -5 VOL -10 VOH 5 0 -5 VOL -15 -10 -20 0.1 1 Load Resistance [kΩ] ±0 10 ±4 ±6 Supply Voltage [V] ±8 ±10 Figure 7. Maximum Output Voltage vs Supply Voltage (RL=2kΩ, TA=25°C) 20 20 15 15 Maximum Output Voltage [V] Maximum Output Voltage [V] Figure 6. Maximum Output Voltage vs Load Resistance (VCC/VEE=+15V/-15V, TA=25°C) ±2 10 VOH 5 0 -5 VOL -10 10 VOH 5 0 -5 VOL -10 -15 -15 -20 -50 -20 -25 0 25 50 75 100 0 125 5 10 15 20 Ambient Temperature [°C] Output Current [mA] Figure 8. Maximum Output Voltage vs Ambient Temperature (VCC/VEE=+15V/-15V, RL=2kΩ) Figure 9. Maximum Output Voltage vs Output Current (VCC/VEE=+15V/-15V, TA=25°C) 25 (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 8/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves - continued 6 6 4 4 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○ BA8522Rxxx -40℃ 0 25℃ 105℃ -2 ±2V 2 0 ±15V -2 -4 -4 -6 -6 ±0 ±2 ±4 ±6 ±8 ±10 ±12 Supply Voltage [V] ±14 -50 ±16 -25 0 25 50 75 100 125 Ambient Temperature [°C] Figure 10. Input Offset Voltage vs Supply Voltage (VICM=0V, EK=0V) Figure 11. Input Offset Voltage vs Ambient Temperature (VICM=0V, EK=0V) 100 100 -40°C 80 25°C Input Bias Current [nA] 80 Input Bias Current [nA] ±7.5V 60 105°C 40 ±2V ±7.5V 60 ±15V 40 20 20 0 0 ±0 ±2 ±4 ±6 ±8 ±10 ±12 Supply Voltage [V] ±14 -50 ±16 -25 0 25 50 75 100 Ambient Temperature [°C] 125 Figure 13. Input Bias Current vs Ambient Temperature (VICM=0V, EK=0V) Figure 12. Input Bias Current vs Supply Voltage (VICM=0V, EK=0V) (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 9/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves - continued 30 30 20 20 Input Offset Current [nA] Input Offset Current [nA] ○ BA8522Rxxx 105°C 10 0 25°C -40°C -10 ±2V 10 0 ±15V -10 -20 -20 -30 -30 ±0 ±2 ±4 ±6 ±8 ±10 ±12 Supply Voltage [V] ±14 ±7.5V -50 ±16 Figure 14. Input Offset Current vs Supply Voltage (VICM=0V, EK=0V) -25 0 25 50 75 100 Ambient Temperature [°C] 125 Figure 15. Input Offset Current vs Ambient Temperature (VICM=0V, EK=0V) 5 150 Common Mode Rejection Ratio [dB] 4 Input Offset Voltage [mV] 3 2 25°C -40°C 1 0 -1 105°C -2 -3 125 100 75 50 25 -4 -5 0 -15 -10 -5 0 5 10 Common Mode Input Voltage [V] 15 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 17. Common Mode Rejection Ratio vs Ambient Temperature (VCC/VEE=+15V/-15V, VICM=-12V to +12V) Figure 16. Input Offset Voltage vs Common Mode Input Voltage (VCC=8V, EK=-4V) (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 10/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves - continued ○ BA8522Rxxx 5 125 4 Slew Rate [V/µs] Power Supply Rejection Ratio [dB] 150 100 75 3 2 50 1 25 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 ±0 125 ±6 ±8 ±10 ±12 Supply Voltage [V] ±14 ±16 1 Total Harmonic Distortion [%] 80 Equivalent Input Noise Voltage [nV/√Hz] ±4 Figure 19. Slew Rate vs Supply Voltage (CL=100pF, RL=2kΩ, TA=25°C) Figure 18. Power Supply Rejection Ratio vs Ambient Temperature (VCC/VEE=+2V/-2V to +15V/-15V) 60 40 20 0 ±2 0.1 20kHz 1kHz 0.01 20Hz 0.001 0.0001 1 1 10 10 102 103 100 1000 Frequency [Hz] Frequency [Hz] 104 10000 0.1 1 Output Voltage [Vrms] 10 Figure 21. Total Harmonic Distortion vs Output Voltage (VCC/VEE=+15V/-15V, Av=20dB RL=2kΩ, 80kHz-LPF, TA=25°C) Figure 20. Equivalent Input Noise Voltage vs Frequency (VCC/VEE=+15V/-15V, RS=100Ω, TA=25°C) (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 11/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Typical Performance Curves - continued ○ BA8522Rxxx 30 60 180 50 20 40 150 120 GAIN 30 90 20 60 5 10 30 0 0 15 10 1 10 100 FREQUENCY [kHz] 1000 102 0.1 1013 4 5 1010 10100 Frequency [Hz] Frequency : f [kHz] 6 10 1000 0 7 10 10000 Figure 23. Voltage Gain・Phase vs Frequency (VCC/VEE=+15V/-15V, Av=40dB, RL=2kΩ, TA=25°C) Figure 22. Maximum Output Voltage Swing vs Frequency (VCC/VEE=+15V/-15V, RL=2kΩ, TA=25°C) (*) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 12/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 Phase [deg] 25 Voltage Gain [dB] Maximum Output Voltage Swing [V P-P ] PHASE BA8522Rxxx Datasheet Application Information NULL method condition for Test Circuit 1 VCC, VEE, EK, VICM Unit: V Parameter VF SW1 SW2 SW3 VCC VEE EK VICM Calculation Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1 Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2 VF3 OFF ON OFF 15 -15 0 0 3 VF4 ON OFF 15 -15 10 0 ON ON 15 -15 -10 0 15 -15 0 -12 15 -15 0 12 2 -2 0 0 16 -16 0 0 Input Bias Current VF5 Large Signal Voltage Gain ON VF6 VF7 Common-Mode Rejection Ratio (Input Common-Mode Voltage Range) ON ON 4 OFF VF8 5 VF9 Power Supply Rejection Ratio ON ON OFF VF10 - Calculation 1. Input Offset Voltage (VIO) VIO = 2. Input Offset Current (IIO) IIO = 3. Input Bias Current (IB) IB = 4. Large Signal Voltage Gain (AV) Av = 20Log 5. Common-mode Rejection Ration (CMRR) CMRR = 20Log 6. Power supply rejection ratio (PSRR) PSRR = 20Log |VF1| 6 [V] 1 + RF/RS |VF2 - VF1| RI x (1 + RF/RS) [A] |VF4 - VF3| 2 x RI x (1 + RF/RS) [A] EK × (1+RF/RS) |VF6 - VF5| [dB] VICM × (1+RF/RS) |VF8 - VF7| VCC × (1+ RF/RS) |VF10 - VF9| [dB] [dB] 0.1μF RF=50kΩ SW1 RS=50Ω 500kΩ VCC 15V EK RI=10kΩ 0.1μF Vo 500kΩ DUT SW3 RS=50Ω 1000pF RI=10kΩ NULL RL VICM 50kΩ V VF SW2 -15V VEE Figure 24. Test circuit1 (one channel only) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 13/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF Maximum Output Voltage OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON Slew Rate OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF Gain Bandwidth OFF ON OFF OFF ON ON OFF OFF ON ON ON OFF Input Referred Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF Input voltage SW4 VH R2 SW5 VCC VL － SW1 SW2 SW6 RS SW7 SW8 SW9 SW10 SW11 t Input wave Output voltage ＋ SW3 SR＝ΔV/Δt SW12 R1 90% VH VEE ΔV C RL -IN CL +IN 10% VL Δt Output wave Figure 25. Test Circuit 2 (each channel) Figure 26. Slew Rate Input Waveform R2=100kΩ R2=100kΩ VCC R1=1kΩ VCC R1=1kΩ － － ＋ VIN R1//R2 t VEE OUT1 =0.5Vrms ＋ R1//R2 OUT2 VEE CS = 20Log 100 × OUT1 OUT2 Figure 27. Test Circuit 3(Channel Separation) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 14/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 28(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax－TA) / PD °C/W The Derating curve in Figure 28(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 28(c) shows an example of the derating curve for BA8522Rxxx. Power dissipation of LSI [W] PD(max) θJA=(TJmax-TA)/ PD °C/W P2 θJA2 < θJA1 Ambient temperature TA [ °C ] θ’JA2 P1 θJA2 TJ’max θ’JA1 0 25 Chip surface temperature TJ [ °C ] 50 TJmax θJA1 75 100 125 150 Ambient temperature TA [ °C ] (b) Derating curve (a) Thermal resistance 1.0 Power Dissipation [W] 0.8 BA8522RF(Note 9) 0.6 BA8522RFV(Note 10) 0.4 BA8522RFVM(Note 11) 0.2 0.0 0 25 50 75 100 125 Ambient Temperature [°C] . 150 (c)BA8522Rxxx (Note 9) 5.5 (Note 10) 5.0 (Note 11) 4.7 Unit mW/°C When using the unit above TA=25°C, subtract the value above per degree°C. Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (copper foil area less than 3%) is mounted. Figure 28. Thermal Resistance and Derating Curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 15/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Examples of Circuit ○Voltage Follower Voltage gain is 0dB. VCC Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT IN OUT=IN VEE Figure 29. Voltage Follower Circuit ○Inverting Amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression VCC IN R1 OUT OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. R1//R2 VEE Figure 30. Inverting Amplifier Circuit ○Non-inverting Amplifier R1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. VDD OUT=(1 + R2/R1)・IN OUT Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. IN VEE Figure 31. Non-inverting Amplifier Circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 16/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure 32): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 17/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Operational Notes – continued Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 32. Example of monolithic IC structure 12. Unused circuits When there are unused op-amps, it is recommended that they are connected as in Figure 33, setting the non-inverting input terminal to a potential within the in-phase input voltage range (VICM). VDD Keep this potential in VICM VICM 13. Input Voltage Applying VEE +36V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. + VSS Figure 33. Example of Application Circuit for Unused Op-amp 14. Power supply(single/dual) The op-amp operates when the voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 15. Output capacitor If a large capacitor is connected between the output pin and VEE pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1uF between output pin and VEE pin. 16. Oscillation by output capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 17. Short-circuit of Output Terminal When output terminal and VCC or VEE terminal are shorted, excessive Output current may flow under some conditions, and heating may destroy IC. It is necessary to connect a resistor as shown in Figure 34. , thereby protecting against load shorting. VCC protection resistor VEE Figure 34. The Example of Output Short Protection www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 18/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Physical Dimensions Tape and Reel Information Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 ) ∗ Order quantity needs to be multiple of the minimum quantity. 19/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name SSOP-B8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 ) ∗ Order quantity needs to be multiple of the minimum quantity. 20/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name MSOP8 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 ∗ Order quantity needs to be multiple of the minimum quantity. 21/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 BA8522Rxxx Datasheet Marking Diagrams SOP8(TOP VIEW) SSOP-B8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK MSOP8(TOP VIEW) Part Number Marking Product Name LOT Number Package Type F BA8522R FV FVM Marking SOP8 SSOP-B8 8522R MSOP8 1PIN MARK Land pattern data All dimensions in mm Land length Land width ≧ℓ 2 b2 PKG Land pitch e Land space MIE SOP8 1.27 4.60 1.10 0.76 SSOP-B8 0.65 4.60 1.20 0.35 MSOP8 0.65 2.62 0.99 0.35 SOP8, SSOP-B8, MSOP8 b2 e MIE ℓ2 Revision History Date Revision 13.Sep.2013 001 Changes New Release www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 22/22 TSZ02201-0RAR1G200040-1-2 13.Sep.2013 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BA8522RF - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BA8522RF SOP8 2500 2500 Taping inquiry Yes