Datasheet Voltage Detector IC Series Counter Timer Built-in CMOS Voltage Detector IC BD45xxx series BD46xxx series ●Key Specifications Detection voltage: ●General Description ROHM’s BD45xxx and BD46xxx series are highly accurate, low current consumption Voltage Detector ICs. Because the counter timer delay circuit is built into these series, an external capacitor for the delay time setting is unnecessary. The lineup was established with low output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 4.8V in increments of 0.1V, so that the series may be selected according the application at hand. ●Features Counter Timer Built-in No delay time setting external capacitor required Ultra-low current consumption Two output types (Nch open drain and CMOS output) Package SSOP5 is similar to SOT-23-5 (JEDEC) 2.3V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: ±1.0% Ultra-low current consumption: 0.85µA (Typ.) Operating temperature range: -40°C to +105°C Three internal, fixed delay time: 50ms 100ms 200ms ●Package SSOP5 2.90mm x 2.80mm x 1.25mm ●Applications Circuits using microcontrollers or logic circuits that require a reset. ●Typical Application Circuit VDD1 VDD2 VDD1 RL BD45xxx RST Micro controller BD46xxx RST CL Micro controller CL （Noise-filtering Capacitor） （Noise-filtering Capacitor） GND GND （Open Drain Output Type） BD45xxx series （CMOS Output Type） BD46xxx series ●Pin Descriptions ●Connection Diagram SSOP5 VDD VOUT TOP VIEW Lot. No Marking ER SUB GND PIN No. Symbol Function 1 ER 2 SUB Substrate * 3 GND GND 4 VOUT Reset Output 5 VDD Power Supply Voltage Manual Reset *Connect the substrate to GND. ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Ordering Information B D x Part Number x x Output Type 45 : Open Drain 46 : CMOS x x Reset Voltage Value 23 : 2.3V 0.1V step 48 : 4.8V x - Counter Timer Package Delay Time Settings G : SSOP5 5 : 50ms 1 : 100ms 2 : 200ms T R Packaging and forming specification TR : Embossed tape and reel SSOP5 5 4 1 2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 1.25Max. ) 0.05±0.05 1.1±0.05 S +0.05 0.42 −0.04 0.95 0.1 S Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Lineup Table 1. Open Drain Output Type Counter Timer Delay Time Settings 50ms Detection Voltage Marking T0 4.8V T1 4.7V T2 4.6V T3 4.5V T4 4.4V T5 4.3V T6 4.2V T7 4.1V T8 4.0V T9 3.9V TA 3.8V TB 3.7V TC 3.6V TD 3.5V TE 3.4V TF 3.3V TG 3.2V TH 3.1V TJ 3.0V TK 2.9V TL 2.8V TM 2.7V TN 2.6V TP 2.5V TQ 2.4V TR 2.3V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Part Number BD45485 BD45475 BD45465 BD45455 BD45445 BD45435 BD45425 BD45415 BD45405 BD45395 BD45385 BD45375 BD45365 BD45355 BD45345 BD45335 BD45325 BD45315 BD45305 BD45295 BD45285 BD45275 BD45265 BD45255 BD45245 BD45235 100ms Marking TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U5 U6 U7 U8 U9 UA UB UC UD UE UF UG UH 2/13 Part Number BD45481 BD45471 BD45461 BD45451 BD45441 BD45431 BD45421 BD45411 BD45401 BD45391 BD45381 BD45371 BD45361 BD45351 BD45341 BD45331 BD45321 BD45311 BD45301 BD45291 BD45281 BD45271 BD45261 BD45251 BD45241 BD45231 200ms Marking UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UY UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 Part Number BD45482 BD45472 BD45462 BD45452 BD45442 BD45432 BD45422 BD45412 BD45402 BD45392 BD45382 BD45372 BD45362 BD45352 BD45342 BD45332 BD45322 BD45312 BD45302 BD45292 BD45282 BD45272 BD45262 BD45252 BD45242 BD45232 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Lineup - continued Table 2. CMOS Output Type Counter Timer Delay Time Settings 50ms Detection Voltage Marking VA 4.8V VB 4.7V VC 4.6V VD 4.5V VE 4.4V VF 4.3V VG 4.2V VH 4.1V VJ 4.0V VK 3.9V VL 3.8V VM 3.7V VN 3.6V VP 3.5V VQ 3.4V VR 3.3V VS 3.2V VT 3.1V VU 3.0V VV 2.9V VW 2.8V VX 2.7V VY 4.8V VZ 4.7V W0 4.6V W1 4.5V www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Part Number BD46485 BD46475 BD46465 BD46455 BD46445 BD46435 BD46425 BD46415 BD46405 BD46395 BD46385 BD46375 BD46365 BD46355 BD46345 BD46335 BD46325 BD46315 BD46305 BD46295 BD46285 BD46275 BD46265 BD46255 BD46245 BD46235 100ms Marking W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WJ WK WL WM WN WP WQ WR WS WT 3/13 Part Number BD46481 BD46471 BD46461 BD46451 BD46441 BD46431 BD46421 BD46411 BD46401 BD46391 BD46381 BD46371 BD46361 BD46351 BD46341 BD46331 BD46321 BD46311 BD46301 BD46291 BD46281 BD46271 BD46261 BD46251 BD46241 BD46231 200ms Marking WU WV WW WX WY WZ X0 X1 X2 X3 X4 X5 X6 X7 X8 X9 XA XB XC XD XE XF XG XH XJ XK Part Number BD46482 BD46472 BD46462 BD46452 BD46442 BD46432 BD46422 BD46412 BD46402 BD46392 BD46382 BD46372 BD46362 BD46352 BD46342 BD46332 BD46322 BD46312 BD46302 BD46292 BD46282 BD46272 BD46262 BD46252 BD46242 BD46232 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series z Absolute maximum ratings Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output Output Current ER pin Voltage *1 *2 Power Dissipation Operating Temperature Ambient Storage Temperature Symbol VDD-GND VOUT IO VCT Pd Topr Tstg Limits -0.3 to +10 GND-0.3 to +10 GND-0.3 to VDD+0.3 60 GND-0.3 to VDD+0.3 540 -40 to +105 -55 to +125 Unit V V mA V mW °C °C *1 Reduced by 5.4mW/°C when used over 25°C. *2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Symbol Limit Min. Typ. Max. VDET(T) VDET(T) VDET(T) ×0.99 ×1.01 2.475 2.5 2.525 2.417 2.580 2.422 2.598 2.970 3.0 3.030 2.901 3.095 2.906 3.117 3.267 3.3 3.333 3.191 3.405 3.196 3.429 4.158 4.2 4.242 4.061 4.334 4.068 4.364 4.752 4.8 4.848 4.641 4.953 4.649 4.988 Condition *1 VDD=HÆL, RL=470kΩ Ta=+25°C VDET=2.5V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=3.0V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage VDET Ta=+25°C VDET=3.3V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=4.2V Ta=-40°C to 85°C Ta=85°C to 105°C Ta=+25°C VDET=4.8V Ta=-40°C to 85°C Ta=85°C to 105°C Detection Voltage Temperature coefficient VDET/ ∆T -40°C to +105°C Hysteresis Voltage ∆VDET VDD＝LÆHÆL, RL=470kΩ ‘High’ Output Delay time BD45XX5, BD46XX5 CL=100pF, tPLH - RL=100kΩ BD45XX1, BD46XX1 *1, *2, *3 BD45XX2, BD46XX2 VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V *1 VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V Circuit Current when ON IDD1 VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V *1 VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V *1 VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V *1 VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V Circuit Current when OFF IDD2 VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V *1 VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V *1 ±100 ±360 VDET(T) VDET(T) VDET(T) ×0.03 ×0.05 ×0.08 45 50 55 90 100 110 180 200 220 0.70 2.10 0.70 2.85 0.75 2.25 0.75 3.00 0.80 2.40 0.80 3.15 0.75 2.25 0.75 4.28 0.80 2.40 0.80 4.50 0.85 2.55 0.85 4.73 Unit V ppm/°C V ms µA µA VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. *1 Guarantee is Ta=25°C. *2 tPLH:VDD=(VDET(T)-0.5V)Æ(VDET(T)+0.5V) *3 tPLH:VDD=Please set the rise up time between VDD=0ÆVDET to more than 100µs. Attention: Please connect the GND when you don’t use ‘ER’ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued Parameter Operating Voltage Range VOPL ‘High’ Output Voltage (Pch) VOH ‘Low’Output Voltage (Nch) VOL Leak Current when OFF ER Pin ‘H’ Voltage ER Pin ‘L’ Voltage ER Pin Input Current Condition Symbol Ileak VEH VEL IEL VOL≤0.4V, RL=470kΩ, Ta=25 to 105°C VOL≤0.4V, RL=470kΩ, Ta=-40 to 25°C VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V) VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V) VDD=1.2V, ISINK = 0.45 mA VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V) *1 VDD=VDS=10V *1 *1 Min. 0.95 1.20 VDD-0.5 VDD-0.5 2.0 - Limit Typ. 1 Max. 0.3 0.3 0.1 0.8 10 Unit V V V µA V V µA VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step) RL :Pull-up resistor to be connected between VOUT and power supply. CL :Capacitor to be connected between VOUT and GND. *1 Guarantee is Ta=25°C. Attention: Please connect the GND when you don’t use ‘ER’ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Block Diagrams VDD Oscillation VOUT Circuit Counter Timer Vref GND ER Fig.1 BD45xxx Series VDD Oscillation Circuit Counter Timer Vref GND VOUT ER Fig.2 BD46xxx Series www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL [mA] CIRCUIT CURRENT ： IDD [μA] 2.0 【BD45281】 【BD45281G】 【BD46281】 1.5 1.0 0.5 0.0 1 2 3 4 5 6 7 8 9 10 【BD45281】 【 BD45281G】 【BD46281】 15 VD D =2.4V 10 5 VD D =1.2V 0 0.0 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE ：VDD [V] DRAIN-SOURCE VOLTAGE ： VD S[V] Fig.3 Circuit Current Fig.4 “Low” Output Current 7 20 【 BD46281G】 【BD46281】 15 VD D =6.0V 10 VD D =4.8V OUTPUT VOLTAGE： VOUT [V] "HIGH" OUTPUT CURRENT ： IOH [mA] 0 20 5 0 【BD45281】 【BD45421G】 6 【BD46281】 5 4 3 Ta=25℃ 2 1 Ta=25℃ 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 DRAIN-SOURCE VOLTAGE ： VD S[V] VDD SUPPLY VOLTAGE ：VDD [V] Fig.5 “High” Output Current Fig.6 I/O Characteristics www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Typical Performance Curves – continued 20 BD45421G 】 【 【BD45421】 【BD45281】 【BD46281G】 ER BIAS CURRENT ： IER[μA] OUTPUT VOLTAGE： VOUT [V] 20 【BD46281】 15 10 5 【BD46421】 15 10 5 0 0 0 1 2 3 4 5 6 7 8 0 9 10 1 2 Fig.7 ER Terminal Threshold Voltage CIRCUIT CURRENT WHEN ON ： IDD1 [μA] DETECTION VOLTAGE： VDET[V] BD 45421G 】 【 【BD45421】 【BD46421】 Low to hig h(V D ET + ΔV D ET ) 4.6 4.2 3.8 H ig h to low(V D ET ) 3.4 3.0 ～ -40 0 40 5 6 7 8 9 1.6 1.4 BD 45421G 】 【 【BD45421】 1.2 【BD46421】 1.0 0.8 0.6 0.4 0.2 0.0 - 40 80 - 20 0 20 40 60 80 T EM PER AT U R E ： T a[℃ ] T EM PER AT U R E ： T a[℃ ] Fig.9 Detection Voltage Release Voltage Fig.10 Circuit Current when ON (VDET-0.2V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10 Fig.8 ER Terminal Input Current 5.8 5.0 4 ER VOLTAGE ： VER [V] ER VOLTAGE ： VER[V] 5.4 3 8/13 100 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 1.5 MINIMUM OPERATING VOLTAGE: VOPL[V] CIRCUIT CURRENT WHEN OFF ： I DD2 [μA] ●Typical Performance Curves – continued 【BD45421】 【BD45421G】 【BD46421】 【BD45421】 【BD46421】 1.0 0 .5 0 .0 0 20 40 60 80 - 40 100 0 20 40 60 80 100 TEM PERA TURE ： Ta[ ℃ ] TEMPERATURE ： Ta[℃] Fig.11 Circuit Current when OFF Fig.12 Operating Limit Voltage 50 250 BD 4528□】G 】 【】【 【BD45282 BD46282 200 DELAY TIME：: ttPLH PHL[µs] "LOW"“LOW” DELAY TIME [μsec] ： tPLH “HIGH” DELAY TIME : tPLH [ms][msec] "HIGH" DELAY TIME - 20 BD 45282G 150 【BD45281】【BD46281 】 BD 45281G 100 50 BD 45285G 【BD45285】【BD46285 】 45281G tPH L 】 【 BD 【BD45281】 40 【BD46281】 30 20 10 0 0 -60 -40 -20 0 20 40 60 -60 -40 -20 80 100 120 0 20 40 60 80 100 120 TEM PER ATU R E ： Ta[℃ ] TEM PER ATU R E ： Ta[℃ ] Fig.13 Output Delay Time “Low”Æ”High” Fig.14 Output Delay Time “High”Æ”Low” www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Application Information Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45xxx series uses an open drain output type, it is necessary to connect either a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 Q2 Vref Vref Reset VOUT Oscillation R2 Oscillation Circuit Counter Timer R2 Reset Circuit Counter Timer Q1 VOUT Q1 R3 R3 GND GND ER ER Fig.15 (BD45xxx Type Internal Block Diagram) Fig.16 (BD46xxx Type Internal Block Diagram) Reference Data Examples of Leading (tPLH) and Falling (tPHL) Output tPHL[µs] Part Number tPLH[ms] BD45275G 50 18 BD46275G 50 18 VDD=2.2VÆ3.2V VDD=3.2VÆ2.2V *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveform Example: The following shows the relationship between the input voltages VDD, the output voltage VOUT and ER terminal when the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 12 and 13). 1 When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD ⑦ VDD is faster than tPHL. VOPL 2 When V 0V DD is greater than VOPL but less than the reset release voltage (VDET + ∆VDET), the output voltages will switch to Low. VOH 3 If V tPLH tPLH DD exceeds the reset release voltage (VDET + ∆VDET), the tPLH VOUT counter timer start and VOUT switches from L to H. tPHL VOL 4 When more than the high level voltage is supplied to the ER tPHL terminal, VOUT comes to “L” after tPLH delay time. Therefore, a time VEH when ER terminal is “H” is necessary for 100µsec or more. ER 5 When the ER terminal switches to Low, the counter timer starts tPHL to operate, a delay of tPLH occurs, and VOUT switches from “L” to “H”. 6 If V DD drops below the detection voltage (VDET) when the power ① ② ③ ④⑤ ⑥ supply is powered down or when there is a power supply fluctuation, Fig.17 Timing Waveform VOUT switches to L (with a delay of tPHL). 7 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). The system is designed such that the output does not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. These time changes by the application and use it, please verify and confirm using practical applications. VDD VDET+ΔVDET VDET www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Circuit Applications 1) Examples of common power supply detection reset circuits. VDD1 Application examples of BD45xxx series (Open Drain output type) and BD46xxx series (CMOS output type) are shown below. VDD2 RL BD45xxx RST Micro controller CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output type (BD45xxx) with a load resistance RL as shown Fig.18. CL （Noise-filtering Capacitor） GND Fig.18 Open Drain Output Type CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use a CMOS output type (BD46xxx) device or an open drain output type (BD45xxx) device with a pull up resistor between the output and VDD1. VDD1 BD46xxx RST Micro controller When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). CL （Noise-filtering Capacitor） GND Fig.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BD45xxx BD45xxx RST Micro controller GND Fig. 20 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BD45xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series 3) Examples of the power supply with resistor dividers. In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 VDD BD45xxx BD46xxx R1 CIN VOUT CL GND Fig. 21 When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. IDD In-rush Current 0 VDD VDET Fig. 22 Current Consumption vs. Power Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet BD45xxx series BD46xxx series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can obtained. The electrical characteristics are guaranteed under the conditions of each parameter. be approximately 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of about 1MΩ is assumed between the ER terminal and the GND terminal, 100kΩ connection between the ER terminal and the VDD terminal would be recommended. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. 11) External parameters The recommended parameter range for RL is 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 13) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 14) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0R7R0G300010-1-2 18.Dec.2012 Rev.005 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.