Features • High-performance, Low-power 32-bit Atmel® AVR® Microcontroller • • • • • • • • • • • • • • • – Compact Single-cycle RISC Instruction Set Including DSP Instructions – Read-modify-write Instructions and Atomic Bit Manipulation – Performance • Up to 64DMIPS Running at 50MHz from Flash (1 Flash Wait State) • Up to 36DMIPS Running at 25MHz from Flash (0 Flash Wait State) – Memory Protection Unit (MPU) • Secure Access Unit (SAU) providing User-defined Peripheral Protection picoPower® Technology for Ultra-low Power Consumption Multi-hierarchy Bus System – High-performance Data Transfers on Separate Buses for Increased Performance – 12 Peripheral DMA Channels Improve Speed for Peripheral Communication Internal High-speed Flash – 256Kbytes and 128Kbytes Versions – Single-cycle Access up to 25MHz – FlashVault Technology Allows Pre-programmed Secure Library Support for End User Applications – Prefetch Buffer Optimizing Instruction Execution at Maximum Speed – 100,000 Write Cycles, 15-year Data Retention Capability – Flash Security Locks and User-defined Configuration Area Internal High-speed SRAM, Single-cycle Access at Full Speed – 32Kbytes Interrupt Controller (INTC) – Autovectored Low-latency Interrupt Service with Programmable Priority External Interrupt Controller (EIC) Peripheral Event System for Direct Peripheral to Peripheral Communication System Functions – Power and Clock Manager – SleepWalking Power Saving Control – Internal System RC Oscillator (RCSYS) – 32 KHz Oscillator – Multipurpose Oscillator, Phase Locked Loop (PLL), and Digital Frequency Locked Loop (DFLL) Windowed Watchdog Timer (WDT) Asynchronous Timer (AST) with Real-time Clock Capability – Counter or Calendar Mode Supported Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency Six 16-bit Timer/Counter (TC) Channels – External Clock Inputs, PWM, Capture, and Various Counting Capabilities PWM Channels on All I/O Pins (PWMA) – 8-bit PWM with a Source Clock up to 150MHz Four Universal Synchronous/Asynchronous Receiver/Transmitters (USART) – Independent Baudrate Generator, Support for SPI – Support for Hardware Handshaking One Master/Slave Serial Peripheral Interface (SPI) with Chip Select Signals – Up to 15 SPI Slaves can be Addressed 32-bit Atmel AVR Microcontroller AT32UC3L0256 AT32UC3L0128 Summary 32145BS–01/2012 AT32UC3L0128/256 • Two Master and Two Slave Two-wire Interfaces (TWI), 400kbit/s I2C-compatible • One 8-channel Analog-to-digital Converter (ADC) with up to 12 Bits Resolution • • • • • • • – Internal Temperature Sensor Eight Analog Comparators (AC) with Optional Window Detection Capacitive Touch (CAT) Module – Hardware-assisted Atmel® AVR® QTouch® and Atmel® AVR® QMatrix Touch Acquisition – Supports QTouch and QMatrix Capture from Capacitive Touch Sensors QTouch Library Support – Capacitive Touch Buttons, Sliders, and Wheels – QTouch and QMatrix Acquisition On-chip Non-intrusive Debug System – Nexus Class 2+, Runtime Control, Non-intrusive Data and Program Trace – aWire Single-pin Programming Trace and Debug Interface Muxed with Reset Pin – NanoTrace Provides Trace Capabilities through JTAG or aWire Interface 48-pin TQFP/QFN/TLLGA (36 GPIO Pins) Five High-drive I/O Pins Single 1.62-3.6 V Power Supply 2 32145BS–01/2012 AT32UC3L0128/256 1. Description The Atmel® AVR® AT32UC3L0128/256 is a complete system-on-chip microcontroller based on the AVR32 UC RISC processor running at frequencies up to 50MHz. AVR32 UC is a high-performance 32-bit RISC microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density, and high performance. The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern and real-time operating systems. The Secure Access Unit (SAU) is used together with the MPU to provide the required security and integrity. Higher computation capability is achieved using a rich set of DSP instructions. The AT32UC3L0128/256 embeds state-of-the-art picoPower technology for ultra-low power consumption. Combined power control techniques are used to bring active current consumption down to 174µA/MHz, and leakage down to 220nA while still retaining a bank of backup registers. The device allows a wide range of trade-offs between functionality and power consumption, giving the user the ability to reach the lowest possible power consumption with the feature set required for the application. The Peripheral Direct Memory Access (DMA) controller enables data transfers between peripherals and memories without processor involvement. The Peripheral DMA controller drastically reduces processing overhead when transferring continuous and large data streams. The AT32UC3L0128/256 incorporates on-chip Flash and SRAM memories for secure and fast access. The FlashVault technology allows secure libraries to be programmed into the device. The secure libraries can be executed while the CPU is in Secure State, but not read by nonsecure software in the device. The device can thus be shipped to end customers, who will be able to program their own code into the device to access the secure libraries, but without risk of compromising the proprietary secure code. The External Interrupt Controller (EIC) allows pins to be configured as external interrupts. Each external interrupt has its own interrupt request and can be individually masked. The Peripheral Event System allows peripherals to receive, react to, and send peripheral events without CPU intervention. Asynchronous interrupts allow advanced peripheral operation in low power sleep modes. The Power Manager (PM) improves design flexibility and security. The Power Manager supports SleepWalking functionality, by which a module can be selectively activated based on peripheral events, even in sleep modes where the module clock is stopped. Power monitoring is supported by on-chip Power-on Reset (POR), Brown-out Detector (BOD), and Supply Monitor (SM). The device features several oscillators, such as Phase Locked Loop (PLL), Digital Frequency Locked Loop (DFLL), Oscillator 0 (OSC0), and system RC oscillator (RCSYS). Either of these oscillators can be used as source for the system clock. The DFLL is a programmable internal oscillator from 20 to 150MHz. It can be tuned to a high accuracy if an accurate reference clock is running, e.g. the 32KHz crystal oscillator. The Watchdog Timer (WDT) will reset the device unless it is periodically serviced by the software. This allows the device to recover from a condition that has caused the system to be unstable. The Asynchronous Timer (AST) combined with the 32KHz crystal oscillator supports powerful real-time clock capabilities, with a maximum timeout of up to 136 years. The AST can operate in counter mode or calendar mode. 3 32145BS–01/2012 AT32UC3L0128/256 The Frequency Meter (FREQM) allows accurate measuring of a clock frequency by comparing it to a known reference clock. The device includes six identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation. The Pulse Width Modulation controller (PWMA) provides 8-bit PWM channels which can be synchronized and controlled from a common timer. One PWM channel is available for each I/O pin on the device, enabling applications that require multiple PWM outputs, such as LCD backlight control. The PWM channels can operate independently, with duty cycles set individually, or in interlinked mode, with multiple channels changed at the same time. The AT32UC3L0128/256 also features many communication interfaces, like USART, SPI, and TWI, for communication intensive applications. The USART supports different communication modes, like SPI Mode and LIN Mode. A general purpose 8-channel ADC is provided, as well as eight analog comparators (AC). The ADC can operate in 10-bit mode at full speed or in enhanced mode at reduced speed, offering up to 12-bit resolution. The ADC also provides an internal temperature sensor input channel. The analog comparators can be paired to detect when the sensing voltage is within or outside the defined reference window. The Capacitive Touch (CAT) module senses touch on external capacitive touch sensors, using the QTouch technology. Capacitive touch sensors use no external mechanical components, unlike normal push buttons, and therefore demand less maintenance in the user application. The CAT module allows up to 17 touch sensors, or up to 16 by 8 matrix sensors to be interfaced. All touch sensors can be configured to operate autonomously without software interaction, allowing wakeup from sleep modes when activated. Atmel offers the QTouch library for embedding capacitive touch buttons, sliders, and wheels functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys as well as Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications. The AT32UC3L0128/256 integrates a class 2+ Nexus 2.0 On-chip Debug (OCD) System, with non-intrusive real-time trace and full-speed read/write memory access, in addition to basic runtime control. The NanoTrace interface enables trace feature for aWire- or JTAG-based debuggers. The single-pin aWire interface allows all features available through the JTAG interface to be accessed through the RESET pin, allowing the JTAG pins to be used for GPIO or peripherals. 4 32145BS–01/2012 AT32UC3L0128/256 2. Overview Block Diagram aWire MEMORY PROTECTION UNIT INSTR INTERFACE DATA INTERFACE M M M SAU S GENERALPURPOSE I/Os HSB-PB BRIDGE B PA PB POWER MANAGER CLOCK CONTROLLER SLEEP CONTROLLER RESET CONTROLLER RCSYS M REGISTERS BUS PERIPHERAL DMA CONTROLLER HSB-PB BRIDGE A CAPACITIVE TOUCH MODULE USART0 USART1 USART2 USART3 SPI TWI MASTER 0 TWI MASTER 1 RC32K XIN32 XOUT32 OSC32K XIN0 XOUT0 OSC0 SYSTEM CONTROL INTERFACE DFLL TWI SLAVE 0 TWI SLAVE 1 INTERRUPT CONTROLLER NMI PWMA[35..0] DMA PLL EXTINT[5..1] DIS VDIVEN CSA[16:0] CSB[16:0] SMP SYNC RXD TXD CLK RTS, CTS MISO, MOSI NPCS[3..0] TWCK TWD TWALM TWCK DMA RC120M 128/256 KB FLASH SCK GCLK_IN[1..0] GCLK[4..0] RC32OUT S S CONFIGURATION 32 KB SRAM S HIGH SPEED BUS MATRIX S/M LOCAL BUS 8-CHANNEL ADC INTERFACE FREQUENCY METER TWALM ADP[1..0] TRIGGER AD[8..0] A[2..0] TIMER/COUNTER 0 TIMER/COUNTER 1 B[2..0] CLK[2..0] ASYNCHRONOUS TIMER WATCHDOG TIMER PA PB ADVREFP EXTERNAL INTERRUPT CONTROLLER PWM CONTROLLER TWD GENERAL PURPOSE I/Os DATAOUT NEXUS CLASS 2+ OCD FLASH CONTROLLER JTAG INTERFACE LOCAL BUS INTERFACE DMA RESET_N TCK TDO TDI TMS AVR32UC CPU DMA MCKO MDO[5..0] MSEO[1..0] EVTI_N EVTO_N MEMORY INTERFACE Block Diagram DMA Figure 2-1. DMA 2.1 AC INTERFACE ACBP[3..0] ACBN[3..0] ACAP[3..0] ACAN[3..0] ACREFN GLUE LOGIC CONTROLLER OUT[1:0] IN[7..0] 5 32145BS–01/2012 AT32UC3L0128/256 2.2 Configuration Summary Table 2-1. Configuration Summary Feature Flash AT32UC3L0256 AT32UC3L0128 256KB 128KB SRAM 32KB GPIO 36 High-drive pins 5 External Interrupts 6 TWI 2 USART 4 Peripheral DMA Channels 12 Peripheral Event System 1 SPI 1 Asynchronous Timers 1 Timer/Counter Channels 6 PWM channels 36 Frequency Meter 1 Watchdog Timer 1 Power Manager 1 Secure Access Unit 1 Glue Logic Controller 1 Oscillators ADC Digital Frequency Locked Loop 20-150 MHz (DFLL) Phase Locked Loop 40-240 MHz (PLL) Crystal Oscillator 0.45-16 MHz (OSC0) Crystal Oscillator 32 KHz (OSC32K) RC Oscillator 120MHz (RC120M) RC Oscillator 115 kHz (RCSYS) RC Oscillator 32 kHz (RC32K) 8-channel 12-bit Temperature Sensor 1 Analog Comparators 8 Capacitive Touch Module 1 JTAG 1 aWire 1 Max Frequency Packages 50 MHz TQFP48/QFN48/TLLGA48 6 32145BS–01/2012 AT32UC3L0128/256 3. Package and Pinout 3.1 Package The device pins are multiplexed with peripheral functions as described in Section 3.2.1. TQFP48/QFN48 Pinout 36 35 34 33 32 31 30 29 28 27 26 25 PA14 VDDANA ADVREFP GNDANA PB08 PB07 PB06 PB09 PA04 PA11 PA13 PA20 Figure 3-1. PA15 PA16 PA17 PA19 PA18 VDDIO GND PB11 GND PA10 PA12 VDDIO 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 PA21 PB10 RESET_N PB04 PB05 GND VDDCORE VDDIN PB01 PA07 PA01 PA02 12 11 10 9 8 7 6 5 4 3 2 1 PA05 PA00 PA06 PA22 PB03 PB02 PB00 PB12 PA03 PA08 PA09 GND 7 32145BS–01/2012 AT32UC3L0128/256 TLLGA48 Pinout 37 36 35 34 33 32 31 30 29 28 27 26 25 PA15 PA14 VDDANA ADVREFP GNDANA PB08 PB07 PB06 PB09 PA04 PA11 PA13 PA20 Figure 3-2. PA16 PA17 PA19 PA18 VDDIO GND PB11 GND PA10 PA12 VDDIO 24 23 22 21 20 19 18 17 16 15 14 38 39 40 41 42 43 44 45 46 47 48 PA21 PB10 RESET_N PB04 PB05 GND VDDCORE VDDIN PB01 PA07 PA01 13 12 11 10 9 8 7 6 5 4 3 2 1 PA02 PA05 PA00 PA06 PA22 PB03 PB02 PB00 PB12 PA03 PA08 PA09 GND 3.2 Peripheral Multiplexing on I/O Lines 3.2.1 Multiplexed Signals Each GPIO line can be assigned to one of the peripheral functions. The following table describes the peripheral signals multiplexed to the GPIO lines. Table 3-1. GPIO Controller Function Multiplexing 48pin PIN G P I O 11 PA00 0 14 PA01 1 GPIO Function Pin Type A B C VDDIO Normal I/O USART0 TXD USART1 RTS SPI NPCS[2] VDDIO Normal I/O USART0 RXD USART1 CTS SPI NPCS[3] Supply D E F PWMA PWMA[0] USART1 CLK PWMA PWMA[1] ACIFB ACAP[0] G H SCIF GCLK[0] CAT CSA[2] TWIMS0 TWALM CAT CSA[1] 8 32145BS–01/2012 AT32UC3L0128/256 Table 3-1. GPIO Controller Function Multiplexing 13 PA02 2 VDDIO Highdrive I/O USART0 RTS ADCIFB TRIGGER USART2 TXD TC0 A0 PWMA PWMA[2] ACIFB ACBP[0] USART0 CLK CAT CSA[3] 4 PA03 3 VDDIO Normal I/O USART0 CTS SPI NPCS[1] USART2 TXD TC0 B0 PWMA PWMA[3] ACIFB ACBN[3] USART0 CLK CAT CSB[3] 28 PA04 4 VDDIO Normal I/O SPI MISO TWIMS0 TWCK USART1 RXD TC0 B1 PWMA PWMA[4] ACIFB ACBP[1] 12 PA05 5 VDDIO Normal I/O (TWI) SPI MOSI TWIMS1 TWCK USART1 TXD TC0 A1 PWMA PWMA[5] ACIFB ACBN[0] TWIMS0 TWD CAT CSB[7] SPI SCK USART2 TXD USART1 CLK TC0 B0 PWMA PWMA[6] EIC EXTINT[2] SCIF GCLK[1] CAT CSB[1] ACIFB ACAN[0] EIC NMI (EXTINT[0]) CAT CSB[2] CAT CSA[7] 10 PA06 6 VDDIO Highdrive I/O, 5V tolerant 15 PA07 7 VDDIO Normal I/O (TWI) SPI NPCS[0] USART2 RXD TWIMS1 TWALM TWIMS0 TWCK PWMA PWMA[7] 3 PA08 8 VDDIO Highdrive I/O USART1 TXD SPI NPCS[2] TC0 A2 ADCIFB ADP[0] PWMA PWMA[8] 2 PA09 9 VDDIO Highdrive I/O USART1 RXD SPI NPCS[3] TC0 B2 ADCIFB ADP[1] PWMA PWMA[9] SCIF GCLK[2] EIC EXTINT[1] CAT CSB[4] 46 PA10 10 VDDIO Normal I/O TWIMS0 TWD PWMA PWMA[10] ACIFB ACAP[1] SCIF GCLK[2] CAT CSA[5] 27 PA11 11 VDDIN Normal I/O 47 PA12 12 VDDIO Normal I/O 26 PA13 13 VDDIN Normal I/O 36 PA14 14 VDDIO 37 PA15 15 38 PA16 39 TC0 A0 CAT CSA[4] PWMA PWMA[11] USART2 CLK TC0 CLK1 CAT SMP PWMA PWMA[12] ACIFB ACAN[1] SCIF GCLK[3] CAT CSB[5] GLOC OUT[0] GLOC IN[7] TC0 A0 SCIF GCLK[2] PWMA PWMA[13] CAT SMP EIC EXTINT[2] CAT CSA[0] Normal I/O ADCIFB AD[0] TC0 CLK2 USART2 RTS CAT SMP PWMA PWMA[14] SCIF GCLK[4] CAT CSA[6] VDDIO Normal I/O ADCIFB AD[1] TC0 CLK1 GLOC IN[6] PWMA PWMA[15] CAT SYNC EIC EXTINT[3] CAT CSB[6] 16 VDDIO Normal I/O ADCIFB AD[2] TC0 CLK0 GLOC IN[5] PWMA PWMA[16] ACIFB ACREFN EIC EXTINT[4] CAT CSA[8] PA17 17 VDDIO Normal I/O (TWI) TWIMS1 TWD PWMA PWMA[17] CAT SMP CAT DIS CAT CSB[8] 41 PA18 18 VDDIO Normal I/O ADCIFB AD[4] GLOC IN[4] PWMA PWMA[18] CAT SYNC EIC EXTINT[5] CAT CSB[0] 40 PA19 19 VDDIO Normal I/O ADCIFB AD[5] TC0 A2 TWIMS1 TWALM PWMA PWMA[19] SCIF GCLK_IN[0] CAT SYNC CAT CSA[10] 25 PA20 20 VDDIN Normal I/O USART2 TXD TC0 A1 GLOC IN[3] PWMA PWMA[20] SCIF RC32OUT USART2 RXD TWIMS0 TWD TC0 B1 ADCIFB TRIGGER PWMA PWMA[21] PWMA PWMAOD[21] TC0 A1 USART2 CTS TC0 B1 24 PA21 21 VDDIN Normal I/O (TWI, 5V tolerant, SMBus) 9 PA22 22 VDDIO Normal I/O USART0 CTS USART2 CLK TC0 B2 CAT SMP PWMA PWMA[22] ACIFB ACBN[2] 6 PB00 32 VDDIO Normal I/O USART3 TXD ADCIFB ADP[0] SPI NPCS[0] TC0 A1 PWMA PWMA[23] ACIFB ACAP[2] 16 PB01 33 VDDIO Highdrive I/O USART3 RXD ADCIFB ADP[1] SPI SCK TC0 B1 PWMA PWMA[24] 7 PB02 34 VDDIO Normal I/O USART3 RTS USART3 CLK SPI MISO TC0 A2 PWMA PWMA[25] ACIFB ACAN[2] CAT CSA[12] SCIF GCLK[0] CAT SMP CAT CSB[10] TC1 A0 CAT CSA[9] TC1 A1 CAT CSB[9] SCIF GCLK[1] CAT CSB[11] 9 32145BS–01/2012 AT32UC3L0128/256 Table 3-1. 8 21 GPIO Controller Function Multiplexing PB03 PB04 35 36 VDDIO Normal I/O USART3 CTS USART3 CLK SPI MOSI TC0 B2 PWMA PWMA[26] ACIFB ACBP[2] TC1 A2 CAT CSA[11] VDDIN Normal I/O (TWI, 5V tolerant, SMBus) TC1 A0 USART1 RTS USART1 CLK TWIMS0 TWALM PWMA PWMA[27] PWMA PWMAOD[27] TWIMS1 TWCK CAT CSA[14] TC1 B0 USART1 CTS USART1 CLK TWIMS0 TWCK PWMA PWMA[28] PWMA PWMAOD[28] SCIF GCLK[3] CAT CSB[14] 20 PB05 37 VDDIN Normal I/O (TWI, 5V tolerant, SMBus) 30 PB06 38 VDDIO Normal I/O TC1 A1 USART3 TXD ADCIFB AD[6] GLOC IN[2] PWMA PWMA[29] ACIFB ACAN[3] EIC NMI (EXTINT[0]) CAT CSB[13] 31 PB07 39 VDDIO Normal I/O TC1 B1 USART3 RXD ADCIFB AD[7] GLOC IN[1] PWMA PWMA[30] ACIFB ACAP[3] EIC EXTINT[1] CAT CSA[13] 32 PB08 40 VDDIO Normal I/O TC1 A2 USART3 RTS ADCIFB AD[8] GLOC IN[0] PWMA PWMA[31] CAT SYNC EIC EXTINT[2] CAT CSB[12] 29 PB09 41 VDDIO Normal I/O TC1 B2 USART3 CTS USART3 CLK PWMA PWMA[32] ACIFB ACBN[1] EIC EXTINT[3] CAT CSB[15] 23 PB10 42 VDDIN Normal I/O TC1 CLK0 USART1 TXD USART3 CLK GLOC OUT[1] PWMA PWMA[33] SCIF GCLK_IN[1] EIC EXTINT[4] CAT CSB[16] 44 PB11 43 VDDIO Normal I/O TC1 CLK1 USART1 RXD ADCIFB TRIGGER PWMA PWMA[34] CAT VDIVEN EIC EXTINT[5] CAT CSA[16] 5 PB12 44 VDDIO Normal I/O TC1 CLK2 CAT SYNC PWMA PWMA[35] ACIFB ACBP[3] SCIF GCLK[4] CAT CSA[15] TWIMS1 TWALM See Section 3.3 for a description of the various peripheral signals. Refer to ”Electrical Characteristics” on page 41 for a description of the electrical properties of the pin types used. 3.2.2 TWI, 5V Tolerant, and SMBUS Pins Some normal I/O pins offer TWI, 5V tolerance, and SMBUS features. These features are only available when either of the TWI functions or the PWMAOD function in the PWMA are selected for these pins. Refer to the ”TWI Pin Characteristics(1)” on page 48 for a description of the electrical properties of the TWI, 5V tolerance, and SMBUS pins. 10 32145BS–01/2012 AT32UC3L0128/256 3.2.3 Peripheral Functions Each GPIO line can be assigned to one of several peripheral functions. The following table describes how the various peripheral functions are selected. The last listed function has priority in case multiple functions are enabled on the same pin. Table 3-2. 3.2.4 Function Description GPIO Controller Function multiplexing GPIO and GPIO peripheral selection A to H Nexus OCD AUX port connections OCD trace system aWire DATAOUT aWire output in two-pin mode JTAG port connections JTAG debug port Oscillators OSC0, OSC32 JTAG Port Connections If the JTAG is enabled, the JTAG will take control over a number of pins, irrespectively of the I/O Controller configuration. Table 3-3. 3.2.5 Peripheral Functions JTAG Pinout 48-pin Pin name JTAG pin 11 PA00 TCK 14 PA01 TMS 13 PA02 TDO 4 PA03 TDI Nexus OCD AUX Port Connections If the OCD trace system is enabled, the trace system will take control over a number of pins, irrespectively of the I/O Controller configuration. Two different OCD trace pin mappings are possible, depending on the configuration of the OCD AXS register. For details, see the AVR32 UC Technical Reference Manual. Table 3-4. Nexus OCD AUX Port Connections Pin AXS=1 AXS=0 EVTI_N PA05 PB08 MDO[5] PA10 PB00 MDO[4] PA18 PB04 MDO[3] PA17 PB05 MDO[2] PA16 PB03 MDO[1] PA15 PB02 MDO[0] PA14 PB09 11 32145BS–01/2012 AT32UC3L0128/256 Table 3-4. 3.2.6 Pin AXS=1 AXS=0 EVTO_N PA04 PA04 MCKO PA06 PB01 MSEO[1] PA07 PB11 MSEO[0] PA11 PB12 Oscillator Pinout The oscillators are not mapped to the normal GPIO functions and their muxings are controlled by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more information about this. Table 3-5. 3.2.7 Nexus OCD AUX Port Connections Oscillator Pinout 48-pin Pin Name Oscillator Pin 3 PA08 XIN0 46 PA10 XIN32 26 PA13 XIN32_2 2 PA09 XOUT0 47 PA12 XOUT32 25 PA20 XOUT32_2 Other Functions The functions listed in Table 3-6 are not mapped to the normal GPIO functions. The aWire DATA pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be active after the aWire is enabled and the 2_PIN_MODE command has been sent. The WAKE_N pin is always enabled. Please refer to Section 6.1.4 on page 40 for constraints on the WAKE_N pin. Table 3-6. Other Functions 48-pin Pin Function 27 PA11 WAKE_N 22 RESET_N aWire DATA 11 PA00 aWire DATAOUT 12 32145BS–01/2012 AT32UC3L0128/256 3.3 Signal Descriptions The following table gives details on signal names classified by peripheral. Table 3-7. Signal Descriptions List Signal Name Function Type Active Level Comments Analog Comparator Interface - ACIFB ACAN3 - ACAN0 Negative inputs for comparators "A" Analog ACAP3 - ACAP0 Positive inputs for comparators "A" Analog ACBN3 - ACBN0 Negative inputs for comparators "B" Analog ACBP3 - ACBP0 Positive inputs for comparators "B" Analog ACREFN Common negative reference Analog ADC Interface - ADCIFB AD8 - AD0 Analog Signal Analog ADP1 - ADP0 Drive Pin for resistive touch screen Output TRIGGER External trigger Input aWire - AW DATA aWire data I/O DATAOUT aWire data output for 2-pin mode I/O Capacitive Touch Module - CAT CSA16 - CSA0 Capacitive Sense A I/O CSB16 - CSB0 Capacitive Sense B I/O DIS Discharge current control Analog SMP SMP signal Output SYNC Synchronize signal VDIVEN Voltage divider enable Input Output External Interrupt Controller - EIC NMI (EXTINT0) Non-Maskable Interrupt Input EXTINT5 - EXTINT1 External interrupt Input Glue Logic Controller - GLOC IN7 - IN0 Inputs to lookup tables OUT1 - OUT0 Outputs from lookup tables Input Output JTAG module - JTAG TCK Test Clock Input TDI Test Data In Input TDO Test Data Out TMS Test Mode Select Output Input 13 32145BS–01/2012 AT32UC3L0128/256 Table 3-7. Signal Descriptions List Power Manager - PM RESET_N Reset Input Low Pulse Width Modulation Controller - PWMA PWMA35 - PWMA0 PWMA channel waveforms Output PWMAOD35 PWMAOD0 PWMA channel waveforms, open drain mode Output Not all channels support open drain mode System Control Interface - SCIF GCLK4 - GCLK0 Generic Clock Output Output GCLK_IN1 - GCLK_IN0 Generic Clock Input RC32OUT RC32K output at startup Output XIN0 Crystal 0 Input Analog/ Digital XIN32 Crystal 32 Input (primary location) Analog/ Digital XIN32_2 Crystal 32 Input (secondary location) Analog/ Digital XOUT0 Crystal 0 Output Analog XOUT32 Crystal 32 Output (primary location) Analog XOUT32_2 Crystal 32 Output (secondary location) Analog Input Serial Peripheral Interface - SPI MISO Master In Slave Out I/O MOSI Master Out Slave In I/O NPCS3 - NPCS0 SPI Peripheral Chip Select I/O SCK Clock I/O Low Timer/Counter - TC0, TC1 A0 Channel 0 Line A I/O A1 Channel 1 Line A I/O A2 Channel 2 Line A I/O B0 Channel 0 Line B I/O B1 Channel 1 Line B I/O B2 Channel 2 Line B I/O CLK0 Channel 0 External Clock Input Input CLK1 Channel 1 External Clock Input Input CLK2 Channel 2 External Clock Input Input Two-wire Interface - TWIMS0, TWIMS1 TWALM SMBus SMBALERT I/O TWCK Two-wire Serial Clock I/O TWD Two-wire Serial Data I/O Low 14 32145BS–01/2012 AT32UC3L0128/256 Table 3-7. Signal Descriptions List Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3 CLK Clock CTS Clear To Send RTS Request To Send RXD Receive Data Input TXD Transmit Data Output Note: I/O Input Low Output Low 1. ADCIFB: AD3 does not exist. Table 3-8. Signal Description List, Continued Signal Name Function Type Active Level Comments Power VDDCORE Core Power Supply / Voltage Regulator Output Power Input/Output 1.62V to 1.98V VDDIO I/O Power Supply Power Input 1.62V to 3.6V. VDDIO should always be equal to or lower than VDDIN. VDDANA Analog Power Supply Power Input 1.62V to 1.98V ADVREFP Analog Reference Voltage Power Input 1.62V to 1.98V VDDIN Voltage Regulator Input Power Input 1.62V to 3.6V (1) GNDANA Analog Ground Ground GND Ground Ground Auxiliary Port - AUX MCKO Trace Data Output Clock Output MDO5 - MDO0 Trace Data Output Output MSEO1 - MSEO0 Trace Frame Control Output EVTI_N Event In EVTO_N Event Out Input Low Output Low General Purpose I/O pin PA22 - PA00 Parallel I/O Controller I/O Port 0 I/O PB12 - PB00 Parallel I/O Controller I/O Port 1 I/O 1. See Section 6.1 on page 36 15 32145BS–01/2012 AT32UC3L0128/256 3.4 3.4.1 I/O Line Considerations JTAG Pins The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI pins have pull-up resistors when JTAG is enabled. The TCK pin always has pull-up enabled during reset. The TDO pin is an output, driven at VDDIO, and has no pull-up resistor. The JTAG pins can be used as GPIO pins and multiplexed with peripherals when the JTAG is disabled. Please refer to Section 3.2.4 on page 11 for the JTAG port connections. 3.4.2 PA00 Note that PA00 is multiplexed with TCK. PA00 GPIO function must only be used as output in the application. 3.4.3 RESET_N Pin The RESET_N pin is a schmitt input and integrates a permanent pull-up resistor to VDDIN. As the product integrates a power-on reset detector, the RESET_N pin can be left unconnected in case no reset from the system needs to be applied to the product. The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debugging, it must not be driven by external circuitry. 3.4.4 TWI Pins PA21/PB04/PB05 When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and inputs with spike filtering. When used as GPIO pins or used for other peripherals, the pins have the same characteristics as other GPIO pins. Selected pins are also SMBus compliant (refer to Section 3.2.1 on page 8). As required by the SMBus specification, these pins provide no leakage path to ground when the AT32UC3L0128/256 is powered down. This allows other devices on the SMBus to continue communicating even though the AT32UC3L0128/256 is not powered. After reset a TWI function is selected on these pins instead of the GPIO. Please refer to the GPIO Module Configuration chapter for details. 3.4.5 TWI Pins PA05/PA07/PA17 When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and inputs with spike filtering. When used as GPIO pins or used for other peripherals, the pins have the same characteristics as other GPIO pins. After reset a TWI function is selected on these pins instead of the GPIO. Please refer to the GPIO Module Configuration chapter for details. 3.4.6 GPIO Pins All the I/O lines integrate a pull-up resistor. Programming of this pull-up resistor is performed independently for each I/O line through the GPIO Controllers. After reset, I/O lines default as inputs with pull-up resistors disabled, except PA00 which has the pull-up resistor enabled. PA20 selects SCIF-RC32OUT (GPIO Function F) as default enabled after reset. 3.4.7 High-drive Pins The five pins PA02, PA06, PA08, PA09, and PB01 have high-drive output capabilities. Refer to Section 7. on page 41 for electrical characteristics. 16 32145BS–01/2012 AT32UC3L0128/256 3.4.8 RC32OUT Pin 3.4.8.1 Clock output at startup After power-up, the clock generated by the 32kHz RC oscillator (RC32K) will be output on PA20, even when the device is still reset by the Power-On Reset Circuitry. This clock can be used by the system to start other devices or to clock a switching regulator to rise the power supply voltage up to an acceptable value. The clock will be available on PA20, but will be disabled if one of the following conditions are true: • PA20 is configured to use a GPIO function other than F (SCIF-RC32OUT) • PA20 is configured as a General Purpose Input/Output (GPIO) • The bit FRC32 in the Power Manager PPCR register is written to zero (refer to the Power Manager chapter) The maximum amplitude of the clock signal will be defined by VDDIN. Once the RC32K output on PA20 is disabled it can never be enabled again. 3.4.8.2 3.4.9 XOUT32_2 function PA20 selects RC32OUT as default enabled after reset. This function is not automatically disabled when the user enables the XOUT32_2 function on PA20. This disturbs the oscillator and may result in the wrong frequency. To avoid this, RC32OUT must be disabled when XOUT32_2 is enabled. ADC Input Pins These pins are regular I/O pins powered from the VDDIO. However, when these pins are used for ADC inputs, the voltage applied to the pin must not exceed 1.98V. Internal circuitry ensures that the pin cannot be used as an analog input pin when the I/O drives to VDD. When the pins are not used for ADC inputs, the pins may be driven to the full I/O voltage range. 17 32145BS–01/2012 AT32UC3L0128/256 4. Processor and Architecture Rev: 2.1.2.0 This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the AVR32 architecture. A summary of the programming model, instruction set, and MPU is presented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical Reference Manual. 4.1 Features • 32-bit load/store AVR32A RISC architecture – – – – – 15 general-purpose 32-bit registers 32-bit Stack Pointer, Program Counter and Link Register reside in register file Fully orthogonal instruction set Privileged and unprivileged modes enabling efficient and secure operating systems Innovative instruction set together with variable instruction length ensuring industry leading code density – DSP extension with saturating arithmetic, and a wide variety of multiply instructions • 3-stage pipeline allowing one instruction per clock cycle for most instructions – Byte, halfword, word, and double word memory access – Multiple interrupt priority levels • MPU allows for operating systems with memory protection • Secure State for supporting FlashVault technology 4.2 AVR32 Architecture AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for costsensitive embedded applications, with particular emphasis on low power consumption and high code density. In addition, the instruction set architecture has been tuned to allow a variety of microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications. Through a quantitative approach, a large set of industry recognized benchmarks has been compiled and analyzed to achieve the best code density in its class. In addition to lowering the memory requirements, a compact code size also contributes to the core’s low power characteristics. The processor supports byte and halfword data types without penalty in code size and performance. Memory load and store operations are provided for byte, halfword, word, and double word data with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely linked to the architecture and is able to exploit code optimization features, both for size and speed. In order to reduce code size to a minimum, some instructions have multiple addressing modes. As an example, instructions with immediates often have a compact format with a smaller immediate, and an extended format with a larger immediate. In this way, the compiler is able to use the format giving the smallest code size. Another feature of the instruction set is that frequently used instructions, like add, have a compact format with two operands as well as an extended format with three operands. The larger format increases performance, allowing an addition and a data move in the same instruction in a 18 32145BS–01/2012 AT32UC3L0128/256 single cycle. Load and store instructions have several different formats in order to reduce code size and speed up execution. The register file is organized as sixteen 32-bit registers and includes the Program Counter, the Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values from function calls and is used implicitly by some instructions. 4.3 The AVR32UC CPU The AVR32UC CPU targets low- and medium-performance applications, and provides an advanced On-Chip Debug (OCD) system, no caches, and a Memory Protection Unit (MPU). Java acceleration hardware is not implemented. AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch, one High Speed Bus master for data access, and one High Speed Bus slave interface allowing other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing. Also, power consumption is reduced by not needing a full High Speed Bus access for memory accesses. A dedicated data RAM interface is provided for communicating with the internal data RAMs. A local bus interface is provided for connecting the CPU to device-specific high-speed systems, such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated memory range allocated to it, and data transfers are performed using regular load and store instructions. Details on which devices that are mapped into the local bus space is given in the CPU Local Bus section in the Memories chapter. Figure 4-1 on page 20 displays the contents of AVR32UC. 19 32145BS–01/2012 AT32UC3L0128/256 OCD interface Reset interface Overview of the AVR32UC CPU Interrupt controller interface Figure 4-1. OCD system Power/ Reset control AVR32UC CPU pipeline MPU 4.3.1 High Speed Bus slave CPU Local Bus master CPU Local Bus High Speed Bus master High Speed Bus High Speed Bus High Speed Bus master High Speed Bus Data memory controller Instruction memory controller CPU RAM Pipeline Overview AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruction Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic (ALU) section, one multiply (MUL) section, and one load/store (LS) section. Instructions are issued and complete in order. Certain operations require several clock cycles to complete, and in this case, the instruction resides in the ID and EX stages for the required number of clock cycles. Since there is only three pipeline stages, no internal data forwarding is required, and no data dependencies can arise in the pipeline. Figure 4-2 on page 21 shows an overview of the AVR32UC pipeline stages. 20 32145BS–01/2012 AT32UC3L0128/256 Figure 4-2. The AVR32UC Pipeline MUL IF ID Prefetch unit Decode unit Regfile Read ALU LS 4.3.2 Multiply unit Regfile write ALU unit Load-store unit AVR32A Microarchitecture Compliance AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is targeted at cost-sensitive, lower-end applications like smaller microcontrollers. This microarchitecture does not provide dedicated hardware registers for shadowing of register file registers in interrupt contexts. Additionally, it does not provide hardware registers for the return address registers and return status registers. Instead, all this information is stored on the system stack. This saves chip area at the expense of slower interrupt handling. 4.3.2.1 Interrupt Handling Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These registers are pushed regardless of the priority level of the pending interrupt. The return address and status register are also automatically pushed to stack. The interrupt handler can therefore use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are restored, and execution continues at the return address stored popped from stack. The stack is also used to store the status register and return address for exceptions and scall. Executing the rete or rets instruction at the completion of an exception or system call will pop this status register and continue execution at the popped return address. 4.3.2.2 Java Support AVR32UC does not provide Java hardware acceleration. 4.3.2.3 Memory Protection The MPU allows the user to check all memory accesses for privilege violations. If an access is attempted to an illegal memory address, the access is aborted and an exception is taken. The MPU in AVR32UC is specified in the AVR32UC Technical Reference manual. 4.3.2.4 Unaligned Reference Handling AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an 21 32145BS–01/2012 AT32UC3L0128/256 address exception. Doubleword-sized accesses with word-aligned pointers will automatically be performed as two word-sized accesses. The following table shows the instructions with support for unaligned addresses. All other instructions require aligned addresses. Table 4-1. 4.3.2.5 Instructions with Unaligned Reference Support Instruction Supported Alignment ld.d Word st.d Word Unimplemented Instructions The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented Instruction Exception if executed: • All SIMD instructions • All coprocessor instructions if no coprocessors are present • retj, incjosp, popjc, pushjc • tlbr, tlbs, tlbw • cache 4.3.2.6 CPU and Architecture Revision Three major revisions of the AVR32UC CPU currently exist. The device described in this datasheet uses CPU revision 3. The Architecture Revision field in the CONFIG0 system register identifies which architecture revision is implemented in a specific device. AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled for revision 1 or 2 is binary-compatible with revision 3 CPUs. 22 32145BS–01/2012 AT32UC3L0128/256 4.4 4.4.1 Programming Model Register File Configuration The AVR32UC register file is shown below. Figure 4-3. The AVR32UC Register File Application Supervisor INT0 Bit 31 Bit 31 Bit 31 Bit 0 Bit 0 INT1 Bit 0 INT2 Bit 31 Bit 0 INT3 Bit 31 Bit 0 Bit 31 Bit 0 Exception NMI Bit 31 Bit 31 Bit 0 Secure Bit 0 Bit 31 Bit 0 PC LR SP_APP R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SEC R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR SR SR SR SR SR SR SR SR SS_STATUS SS_ADRF SS_ADRR SS_ADR0 SS_ADR1 SS_SP_SYS SS_SP_APP SS_RAR SS_RSR 4.4.2 Status Register Configuration The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 4-4 and Figure 4-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T, and L bits, while the upper halfword contains information about the mode and state the processor executes in. Refer to the AVR32 Architecture Manual for details. Figure 4-4. The Status Register High Halfword Bit 31 Bit 16 SS LC 1 - - DM D - M2 M1 M0 EM I3M I2M FE I1M I0M GM 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 Bit nam e Initial value G lobal Interrupt M ask Interrupt Level 0 M ask Interrupt Level 1 M ask Interrupt Level 2 M ask Interrupt Level 3 M ask Exception M ask M ode Bit 0 M ode Bit 1 M ode Bit 2 Reserved Debug State Debug State M ask Reserved Secure State 23 32145BS–01/2012 AT32UC3L0128/256 Figure 4-5. The Status Register Low Halfword Bit 15 Bit 0 - T - - - - - - - - L Q V N Z C Bit name 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Initial value Carry Zero Sign Overflow Saturation Lock Reserved Scratch Reserved 4.4.3 Processor States 4.4.3.1 Normal RISC State The AVR32 processor supports several different execution contexts as shown in Table 4-2. Table 4-2. Overview of Execution Modes, their Priorities and Privilege Levels. Priority Mode Security Description 1 Non Maskable Interrupt Privileged Non Maskable high priority interrupt mode 2 Exception Privileged Execute exceptions 3 Interrupt 3 Privileged General purpose interrupt mode 4 Interrupt 2 Privileged General purpose interrupt mode 5 Interrupt 1 Privileged General purpose interrupt mode 6 Interrupt 0 Privileged General purpose interrupt mode N/A Supervisor Privileged Runs supervisor calls N/A Application Unprivileged Normal program execution mode Mode changes can be made under software control, or can be caused by external interrupts or exception processing. A mode can be interrupted by a higher priority mode, but never by one with lower priority. Nested exceptions can be supported with a minimal software overhead. When running an operating system on the AVR32, user processes will typically execute in the application mode. The programs executed in this mode are restricted from executing certain instructions. Furthermore, most system registers together with the upper halfword of the status register cannot be accessed. Protected memory areas are also not available. All other operating modes are privileged and are collectively called System Modes. They have full access to all privileged and unprivileged resources. After a reset, the processor will be in supervisor mode. 4.4.3.2 Debug State The AVR32 can be set in a debug state, which allows implementation of software monitor routines that can read out and alter system information for use during application development. This implies that all system and application registers, including the status registers and program counters, are accessible in debug state. The privileged instructions are also available. All interrupt levels are by default disabled when debug state is entered, but they can individually be switched on by the monitor routine by clearing the respective mask bit in the status register. 24 32145BS–01/2012 AT32UC3L0128/256 Debug state can be entered as described in the AVR32UC Technical Reference Manual. Debug state is exited by the retd instruction. 4.4.3.3 4.4.4 Secure State The AVR32 can be set in a secure state, that allows a part of the code to execute in a state with higher security levels. The rest of the code can not access resources reserved for this secure code. Secure State is used to implement FlashVault technology. Refer to the AVR32UC Technical Reference Manual for details. System Registers The system registers are placed outside of the virtual memory space, and are only accessible using the privileged mfsr and mtsr instructions. The table below lists the system registers specified in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is responsible for maintaining correct sequencing of any instructions following a mtsr instruction. For detail on the system registers, refer to the AVR32UC Technical Reference Manual. Table 4-3. System Registers Reg # Address Name Function 0 0 SR Status Register 1 4 EVBA Exception Vector Base Address 2 8 ACBA Application Call Base Address 3 12 CPUCR CPU Control Register 4 16 ECR Exception Cause Register 5 20 RSR_SUP Unused in AVR32UC 6 24 RSR_INT0 Unused in AVR32UC 7 28 RSR_INT1 Unused in AVR32UC 8 32 RSR_INT2 Unused in AVR32UC 9 36 RSR_INT3 Unused in AVR32UC 10 40 RSR_EX Unused in AVR32UC 11 44 RSR_NMI Unused in AVR32UC 12 48 RSR_DBG Return Status Register for Debug mode 13 52 RAR_SUP Unused in AVR32UC 14 56 RAR_INT0 Unused in AVR32UC 15 60 RAR_INT1 Unused in AVR32UC 16 64 RAR_INT2 Unused in AVR32UC 17 68 RAR_INT3 Unused in AVR32UC 18 72 RAR_EX Unused in AVR32UC 19 76 RAR_NMI Unused in AVR32UC 20 80 RAR_DBG Return Address Register for Debug mode 21 84 JECR Unused in AVR32UC 22 88 JOSP Unused in AVR32UC 23 92 JAVA_LV0 Unused in AVR32UC 25 32145BS–01/2012 AT32UC3L0128/256 Table 4-3. System Registers (Continued) Reg # Address Name Function 24 96 JAVA_LV1 Unused in AVR32UC 25 100 JAVA_LV2 Unused in AVR32UC 26 104 JAVA_LV3 Unused in AVR32UC 27 108 JAVA_LV4 Unused in AVR32UC 28 112 JAVA_LV5 Unused in AVR32UC 29 116 JAVA_LV6 Unused in AVR32UC 30 120 JAVA_LV7 Unused in AVR32UC 31 124 JTBA Unused in AVR32UC 32 128 JBCR Unused in AVR32UC 33-63 132-252 Reserved Reserved for future use 64 256 CONFIG0 Configuration register 0 65 260 CONFIG1 Configuration register 1 66 264 COUNT Cycle Counter register 67 268 COMPARE Compare register 68 272 TLBEHI Unused in AVR32UC 69 276 TLBELO Unused in AVR32UC 70 280 PTBR Unused in AVR32UC 71 284 TLBEAR Unused in AVR32UC 72 288 MMUCR Unused in AVR32UC 73 292 TLBARLO Unused in AVR32UC 74 296 TLBARHI Unused in AVR32UC 75 300 PCCNT Unused in AVR32UC 76 304 PCNT0 Unused in AVR32UC 77 308 PCNT1 Unused in AVR32UC 78 312 PCCR Unused in AVR32UC 79 316 BEAR Bus Error Address Register 80 320 MPUAR0 MPU Address Register region 0 81 324 MPUAR1 MPU Address Register region 1 82 328 MPUAR2 MPU Address Register region 2 83 332 MPUAR3 MPU Address Register region 3 84 336 MPUAR4 MPU Address Register region 4 85 340 MPUAR5 MPU Address Register region 5 86 344 MPUAR6 MPU Address Register region 6 87 348 MPUAR7 MPU Address Register region 7 88 352 MPUPSR0 MPU Privilege Select Register region 0 89 356 MPUPSR1 MPU Privilege Select Register region 1 26 32145BS–01/2012 AT32UC3L0128/256 Table 4-3. 4.5 System Registers (Continued) Reg # Address Name Function 90 360 MPUPSR2 MPU Privilege Select Register region 2 91 364 MPUPSR3 MPU Privilege Select Register region 3 92 368 MPUPSR4 MPU Privilege Select Register region 4 93 372 MPUPSR5 MPU Privilege Select Register region 5 94 376 MPUPSR6 MPU Privilege Select Register region 6 95 380 MPUPSR7 MPU Privilege Select Register region 7 96 384 MPUCRA Unused in this version of AVR32UC 97 388 MPUCRB Unused in this version of AVR32UC 98 392 MPUBRA Unused in this version of AVR32UC 99 396 MPUBRB Unused in this version of AVR32UC 100 400 MPUAPRA MPU Access Permission Register A 101 404 MPUAPRB MPU Access Permission Register B 102 408 MPUCR MPU Control Register 103 412 SS_STATUS Secure State Status Register 104 416 SS_ADRF Secure State Address Flash Register 105 420 SS_ADRR Secure State Address RAM Register 106 424 SS_ADR0 Secure State Address 0 Register 107 428 SS_ADR1 Secure State Address 1 Register 108 432 SS_SP_SYS Secure State Stack Pointer System Register 109 436 SS_SP_APP Secure State Stack Pointer Application Register 110 440 SS_RAR Secure State Return Address Register 111 444 SS_RSR Secure State Return Status Register 112-191 448-764 Reserved Reserved for future use 192-255 768-1020 IMPL IMPLEMENTATION DEFINED Exceptions and Interrupts In the AVR32 architecture, events are used as a common term for exceptions and interrupts. AVR32UC incorporates a powerful event handling scheme. The different event sources, like Illegal Op-code and interrupt requests, have different priority levels, ensuring a well-defined behavior when multiple events are received simultaneously. Additionally, pending events of a higher priority class may preempt handling of ongoing events of a lower priority class. When an event occurs, the execution of the instruction stream is halted, and execution is passed to an event handler at an address specified in Table 4-4 on page 31. Most of the handlers are placed sequentially in the code space starting at the address specified by EVBA, with four bytes between each handler. This gives ample space for a jump instruction to be placed there, jumping to the event routine itself. A few critical handlers have larger spacing between them, allowing the entire event routine to be placed directly at the address specified by the EVBA-relative offset generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR) addresses. This allows the interrupt controller to directly specify the ISR address as an address 27 32145BS–01/2012 AT32UC3L0128/256 relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset), not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up appropriately. The same mechanisms are used to service all different types of events, including interrupt requests, yielding a uniform event handling scheme. An interrupt controller does the priority handling of the interrupts and provides the autovector offset to the CPU. 4.5.1 System Stack Issues Event handling in AVR32UC uses the system stack pointed to by the system stack pointer, SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section, since the timing of accesses to this memory section is both fast and deterministic. The user must also make sure that the system stack is large enough so that any event is able to push the required registers to stack. If the system stack is full, and an event occurs, the system will enter an UNDEFINED state. 4.5.2 Exceptions and Interrupt Requests When an event other than scall or debug request is received by the core, the following actions are performed atomically: 1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and GM bits in the Status Register are used to mask different events. Not all events can be masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and Bus Error) can not be masked. When an event is accepted, hardware automatically sets the mask bits corresponding to all sources with equal or lower priority. This inhibits acceptance of other events of the same or lower priority, except for the critical events listed above. Software may choose to clear some or all of these bits after saving the necessary state if other priority schemes are desired. It is the event source’s responsability to ensure that their events are left pending until accepted by the CPU. 2. When a request is accepted, the Status Register and Program Counter of the current context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also automatically stored to stack. Storing the Status Register ensures that the core is returned to the previous execution mode when the current event handling is completed. When exceptions occur, both the EM and GM bits are set, and the application may manually enable nested exceptions if desired by clearing the appropriate bit. Each exception handler has a dedicated handler address, and this address uniquely identifies the exception source. 3. The Mode bits are set to reflect the priority of the accepted event, and the correct register file bank is selected. The address of the event handler, as shown in Table 4-4 on page 31, is loaded into the Program Counter. The execution of the event handler routine then continues from the effective address calculated. The rete instruction signals the end of the event. When encountered, the Return Status Register and Return Address Register are popped from the system stack and restored to the Status Register and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also popped from the system stack. The restored Status Register contains information allowing the core to resume operation in the previous execution mode. This concludes the event handling. 28 32145BS–01/2012 AT32UC3L0128/256 4.5.3 Supervisor Calls The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is designed so that privileged routines can be called from any context. This facilitates sharing of code between different execution modes. The scall mechanism is designed so that a minimal execution cycle overhead is experienced when performing supervisor routine calls from timecritical event handlers. The scall instruction behaves differently depending on which mode it is called from. The behaviour is detailed in the instruction set reference. In order to allow the scall routine to return to the correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC CPU, scall and rets uses the system stack to store the return address and the status register. 4.5.4 Debug Requests The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the Debug Exception handler. By default, Debug mode executes in the exception context, but with dedicated Return Address Register and Return Status Register. These dedicated registers remove the need for storing this data to the system stack, thereby improving debuggability. The Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers in all contexts, while retaining full privileges. Debug mode is exited by executing the retd instruction. This returns to the previous context. 4.5.5 Entry Points for Events Several different event handler entry points exist. In AVR32UC, the reset address is 0x80000000. This places the reset address in the boot flash memory area. TLB miss exceptions and scall have a dedicated space relative to EVBA where their event handler can be placed. This speeds up execution by removing the need for a jump instruction placed at the program address jumped to by the event hardware. All other exceptions have a dedicated event routine entry point located relative to EVBA. The handler routine address identifies the exception source directly. AVR32UC uses the ITLB and DTLB protection exceptions to signal a MPU protection violation. ITLB and DTLB miss exceptions are used to signal that an access address did not map to any of the entries in the MPU. TLB multiple hit exception indicates that an access address did map to multiple TLB entries, signalling an error. All interrupt requests have entry points located at an offset relative to EVBA. This autovector offset is specified by an interrupt controller. The programmer must make sure that none of the autovector offsets interfere with the placement of other code. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. Special considerations should be made when loading EVBA with a pointer. Due to security considerations, the event handlers should be located in non-writeable flash memory, or optionally in a privileged memory protection region if an MPU is present. If several events occur on the same instruction, they are handled in a prioritized way. The priority ordering is presented in Table 4-4 on page 31. If events occur on several instructions at different locations in the pipeline, the events on the oldest instruction are always handled before any events on any younger instruction, even if the younger instruction has events of higher priority 29 32145BS–01/2012 AT32UC3L0128/256 than the oldest instruction. An instruction B is younger than an instruction A if it was sent down the pipeline later than A. The addresses and priority of simultaneous events are shown in Table 4-4 on page 31. Some of the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floatingpoint unit. 30 32145BS–01/2012 AT32UC3L0128/256 Table 4-4. Priority and Handler Addresses for Events Priority Handler Address Name Event source Stored Return Address 1 0x80000000 Reset External input Undefined 2 Provided by OCD system OCD Stop CPU OCD system First non-completed instruction 3 EVBA+0x00 Unrecoverable exception Internal PC of offending instruction 4 EVBA+0x04 TLB multiple hit MPU PC of offending instruction 5 EVBA+0x08 Bus error data fetch Data bus First non-completed instruction 6 EVBA+0x0C Bus error instruction fetch Data bus First non-completed instruction 7 EVBA+0x10 NMI External input First non-completed instruction 8 Autovectored Interrupt 3 request External input First non-completed instruction 9 Autovectored Interrupt 2 request External input First non-completed instruction 10 Autovectored Interrupt 1 request External input First non-completed instruction 11 Autovectored Interrupt 0 request External input First non-completed instruction 12 EVBA+0x14 Instruction Address CPU PC of offending instruction 13 EVBA+0x50 ITLB Miss MPU PC of offending instruction 14 EVBA+0x18 ITLB Protection MPU PC of offending instruction 15 EVBA+0x1C Breakpoint OCD system First non-completed instruction 16 EVBA+0x20 Illegal Opcode Instruction PC of offending instruction 17 EVBA+0x24 Unimplemented instruction Instruction PC of offending instruction 18 EVBA+0x28 Privilege violation Instruction PC of offending instruction 19 EVBA+0x2C Floating-point UNUSED 20 EVBA+0x30 Coprocessor absent Instruction PC of offending instruction 21 EVBA+0x100 Supervisor call Instruction PC(Supervisor Call) +2 22 EVBA+0x34 Data Address (Read) CPU PC of offending instruction 23 EVBA+0x38 Data Address (Write) CPU PC of offending instruction 24 EVBA+0x60 DTLB Miss (Read) MPU PC of offending instruction 25 EVBA+0x70 DTLB Miss (Write) MPU PC of offending instruction 26 EVBA+0x3C DTLB Protection (Read) MPU PC of offending instruction 27 EVBA+0x40 DTLB Protection (Write) MPU PC of offending instruction 28 EVBA+0x44 DTLB Modified UNUSED 31 32145BS–01/2012 AT32UC3L0128/256 5. Memories 5.1 Embedded Memories • Internal high-speed flash – 256Kbytes (AT32UC3L0256) – 128Kbytes (AT32UC3L0128) • 0 wait state access at up to 25MHz in worst case conditions • 1 wait state access at up to 50MHz in worst case conditions • Pipelined flash architecture, allowing burst reads from sequential flash locations, hiding penalty of 1 wait state access • Pipelined flash architecture typically reduces the cycle penalty of 1 wait state operation to only 8% compared to 0 wait state operation • 100 000 write cycles, 15-year data retention capability • Sector lock capabilities, bootloader protection, security bit • 32 fuses, erased during chip erase • User page for data to be preserved during chip erase • Internal high-speed SRAM, single-cycle access at full speed – 32Kbytes 5.2 Physical Memory Map The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they are never remapped in any way, not even during boot. Note that AVR32 UC CPU uses unsegmented translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space is mapped as follows: Table 5-1. AT32UC3L0128/256 Physical Memory Map Device Table 5-2. Size Start Address AT32UC3L0256 AT32UC3L0128 Embedded SRAM 0x00000000 32Kbytes 32Kbytes Embedded Flash 0x80000000 256Kbytes 128Kbytes SAU Channels 0x90000000 256 bytes 256 bytes HSB-PB Bridge B 0xFFFE0000 64Kbytes 64Kbytes HSB-PB Bridge A 0xFFFF0000 64Kbytes 64Kbytes Flash Memory Parameters Part Number Flash Size (FLASH_PW) Number of pages (FLASH_P) Page size (FLASH_W) AT32UC3L0256 256Kbytes 512 512bytes AT32UC3L0128 128Kbytes 256 512bytes 32 32145BS–01/2012 AT32UC3L0128/256 5.3 Peripheral Address Map Table 5-3. Peripheral Address Mapping Address Peripheral Name 0xFFFE0000 FLASHCDW Flash Controller - FLASHCDW 0xFFFE0400 HMATRIX HSB Matrix - HMATRIX 0xFFFE0800 SAU Secure Access Unit - SAU 0xFFFF0000 PDCA Peripheral DMA Controller - PDCA INTC Interrupt controller - INTC 0xFFFF1000 0xFFFF1400 PM Power Manager - PM 0xFFFF1800 SCIF System Control Interface - SCIF AST Asynchronous Timer - AST WDT Watchdog Timer - WDT EIC External Interrupt Controller - EIC 0xFFFF1C00 0xFFFF2000 0xFFFF2400 0xFFFF2800 FREQM Frequency Meter - FREQM 0xFFFF2C00 GPIO General-Purpose Input/Output Controller - GPIO USART0 Universal Synchronous Asynchronous Receiver Transmitter - USART0 USART1 Universal Synchronous Asynchronous Receiver Transmitter - USART1 USART2 Universal Synchronous Asynchronous Receiver Transmitter - USART2 USART3 Universal Synchronous Asynchronous Receiver Transmitter - USART3 0xFFFF3000 0xFFFF3400 0xFFFF3800 0xFFFF3C00 0xFFFF4000 SPI Serial Peripheral Interface - SPI 0xFFFF4400 TWIM0 Two-wire Master Interface - TWIM0 33 32145BS–01/2012 AT32UC3L0128/256 Table 5-3. Peripheral Address Mapping 0xFFFF4800 TWIM1 Two-wire Master Interface - TWIM1 TWIS0 Two-wire Slave Interface - TWIS0 TWIS1 Two-wire Slave Interface - TWIS1 PWMA Pulse Width Modulation Controller - PWMA 0xFFFF4C00 0xFFFF5000 0xFFFF5400 0xFFFF5800 TC0 Timer/Counter - TC0 TC1 Timer/Counter - TC1 0xFFFF5C00 0xFFFF6000 ADCIFB ADC Interface - ADCIFB 0xFFFF6400 ACIFB Analog Comparator Interface - ACIFB 0xFFFF6800 CAT Capacitive Touch Module - CAT 0xFFFF6C00 GLOC Glue Logic Controller - GLOC 0xFFFF7000 AW 5.4 aWire - AW CPU Local Bus Mapping Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to being mapped on the Peripheral Bus. These registers can therefore be reached both by accesses on the Peripheral Bus, and by accesses on the local bus. Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers. 34 32145BS–01/2012 AT32UC3L0128/256 The following GPIO registers are mapped on the local bus: Table 5-4. Local Bus Mapped GPIO Registers Port Register Mode Local Bus Address Access 0 Output Driver Enable Register (ODER) WRITE 0x40000040 Write-only SET 0x40000044 Write-only CLEAR 0x40000048 Write-only TOGGLE 0x4000004C Write-only WRITE 0x40000050 Write-only SET 0x40000054 Write-only CLEAR 0x40000058 Write-only TOGGLE 0x4000005C Write-only Pin Value Register (PVR) - 0x40000060 Read-only Output Driver Enable Register (ODER) WRITE 0x40000140 Write-only SET 0x40000144 Write-only CLEAR 0x40000148 Write-only TOGGLE 0x4000014C Write-only WRITE 0x40000150 Write-only SET 0x40000154 Write-only CLEAR 0x40000158 Write-only TOGGLE 0x4000015C Write-only - 0x40000160 Read-only Output Value Register (OVR) 1 Output Value Register (OVR) Pin Value Register (PVR) 35 32145BS–01/2012 AT32UC3L0128/256 6. Supply and Startup Considerations 6.1 6.1.1 Supply Considerations Power Supplies The AT32UC3L0128/256 has several types of power supply pins: •VDDIO: Powers I/O lines. Voltage is 1.8 to 3.3V nominal. •VDDIN: Powers I/O lines and the internal regulator. Voltage is 1.8 to 3.3V nominal. •VDDANA: Powers the ADC. Voltage is 1.8V nominal. •VDDCORE: Powers the core, memories, and peripherals. Voltage is 1.8V nominal. The ground pins GND are common to VDDCORE, VDDIO, and VDDIN. The ground pin for VDDANA is GNDANA. When VDDCORE is not connected to VDDIN, the VDDIN voltage must be higher than 1.98V. Refer to Section 7. on page 41 for power consumption on the various supply pins. For decoupling recommendations for the different power supplies, please refer to the schematic checklist. Refer to Section 3.2 on page 8 for power supply connections for I/O pins. 6.1.2 Voltage Regulator The AT32UC3L0128/256 embeds a voltage regulator that converts from 3.3V nominal to 1.8V with a load of up to 60mA. The regulator supplies the output voltage on VDDCORE. The regulator may only be used to drive internal circuitry in the device. VDDCORE should be externally connected to the 1.8V domains. See Section 6.1.3 for regulator connection figures. Adequate output supply decoupling is mandatory for VDDCORE to reduce ripple and avoid oscillations. The best way to achieve this is to use two capacitors in parallel between VDDCORE and GND as close to the device as possible. Please refer to Section 7.8.1 on page 55 for decoupling capacitors values and regulator characteristics. Figure 6-1. Supply Decoupling 3.3V VDDIN C IN3 CIN2 CIN1 1.8V 1.8V Regulator VDDCORE COUT2 COUT1 The voltage regulator can be turned off in the shutdown mode to power down the core logic and keep a small part of the system powered in order to reduce power consumption. To enter this mode the 3.3V supply mode, with 1.8V regulated I/O lines power supply configuration must be used. 36 32145BS–01/2012 AT32UC3L0128/256 6.1.3 Regulator Connection The AT32UC3L0128/256 supports three power supply configurations: • 3.3V single supply mode – Shutdown mode is not available • 1.8V single supply mode – Shutdown mode is not available • 3.3V supply mode, with 1.8V regulated I/O lines – Shutdown mode is available 6.1.3.1 3.3V Single Supply Mode In 3.3V single supply mode the internal regulator is connected to the 3.3V source (VDDIN pin) and its output feeds VDDCORE. Figure 6-2 shows the power schematics to be used for 3.3V single supply mode. All I/O lines will be powered by the same power (VDDIN=VDDIO). Figure 6-2. 3.3V Single Supply Mode + 1.98-3.6V - VDDIO VDDIN I/O Pins I/O Pins OSC32K_2, AST, Wake, Regulator control OSC32K, RC32K, POR33, SM33 Linear regulator CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL, PLL GND VDDCORE VDDANA ADC GNDANA 37 32145BS–01/2012 AT32UC3L0128/256 6.1.3.2 1.8 V Single Supply Mode In 1.8V single supply mode the internal regulator is not used, and VDDIO and VDDCORE are powered by a single 1.8 V supply as shown in Figure 6-3. All I/O lines will be powered by the same power (VDDIN = VDDIO = VDDCORE). Figure 6-3. 1.8V Single Supply Mode. + 1.62-1.98V - VDDIO VDDIN I/O Pins I/O Pins OSC32K_2, AST, Wake, Regulator control OSC32K, RC32K, POR33, SM33 GND VDDCORE VDDANA ADC CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL, PLL GNDANA 38 32145BS–01/2012 AT32UC3L0128/256 6.1.3.3 3.3V Supply Mode with 1.8V Regulated I/O Lines In this mode, the internal regulator is connected to the 3.3V source and its output is connected to both VDDCORE and VDDIO as shown in Figure 6-4. This configuration is required in order to use Shutdown mode. Figure 6-4. 3.3V Supply Mode with 1.8V Regulated I/O Lines + 1.98-3.6V - VDDIO VDDIN I/O Pins I/O Pins OSC32K_2, AST, Wake, Regulator control OSC32K, RC32K, POR33, SM33 Linear regulator CPU, Peripherals, Memories, SCIF, BOD, RCSYS, DFLL, PLL VDDCORE VDDANA ADC GND GNDANA In this mode, some I/O lines are powered by VDDIN while other I/O lines are powered by VDDIO. Refer to Section 3.2.1 on page 8 for description of power supply for each I/O line. Refer to the Power Manager chapter for a description of what parts of the system are powered in Shutdown mode. Important note: As the regulator has a maximum output current of 60 mA, this mode can only be used in applications where the maximum I/O current is known and compatible with the core and peripheral power consumption. Typically, great care must be used to ensure that only a few I/O lines are toggling at the same time and drive very small loads. 39 32145BS–01/2012 AT32UC3L0128/256 6.1.4 Power-up Sequence 6.1.4.1 Maximum Rise Rate To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values described in Table 7-3 on page 42. Recommended order for power supplies is also described in this chapter. 6.1.4.2 Minimum Rise Rate The integrated Power-on Reset (POR33) circuitry monitoring the VDDIN powering supply requires a minimum rise rate for the VDDIN power supply. See Table 7-3 on page 42 for the minimum rise rate value. If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, one of the following configurations can be used: • A logic “0” value is applied during power-up on pin PA11 (WAKE_N) until VDDIN rises above 1.2V. • A logic “0” value is applied during power-up on pin RESET_N until VDDIN rises above 1.2V. 6.2 Startup Considerations This chapter summarizes the boot sequence of the AT32UC3L0128/256. The behavior after power-up is controlled by the Power Manager. For specific details, refer to the Power Manager chapter. 6.2.1 Starting of Clocks After power-up, the device will be held in a reset state by the Power-on Reset (POR18 and POR33) circuitry for a short time to allow the power to stabilize throughout the device. After reset, the device will use the System RC Oscillator (RCSYS) as clock source. Please refer to Table 7-17 on page 54 for the frequency for this oscillator. On system start-up, all high-speed clocks are disabled. All clocks to all modules are running. No clocks have a divided frequency; all parts of the system receive a clock with the same frequency as the System RC Oscillator. When powering up the device, there may be a delay before the voltage has stabilized, depending on the rise time of the supply used. The CPU can start executing code as soon as the supply is above the POR18 and POR33 thresholds, and before the supply is stable. Before switching to a high-speed clock source, the user should use the BOD to make sure the VDDCORE is above the minimum level (1.62V). 6.2.2 Fetching of Initial Instructions After reset has been released, the AVR32 UC CPU starts fetching instructions from the reset address, which is 0x80000000. This address points to the first address in the internal Flash. The code read from the internal flash is free to configure the clock system and clock sources. Please refer to the PM and SCIF chapters for more details. 40 32145BS–01/2012 AT32UC3L0128/256 7. Electrical Characteristics 7.1 Absolute Maximum Ratings* Table 7-1. Absolute Maximum Ratings Operating temperature..................................... -40°C to +85°C *NOTICE: Storage temperature...................................... -60°C to +150°C Voltage on input pins (except for 5V pins) with respect to ground .................................................................-0.3V to VVDD(2)+0.3V Voltage on 5V tolerant(1) pins with respect to ground ............... .............................................................................-0.3V to 5.5V Total DC output current on all I/O pins - VDDIO ........... 120mA Total DC output current on all I/O pins - VDDIN ............. 36mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum operating voltage VDDCORE......................... 1.98V Maximum operating voltage VDDIO, VDDIN .................... 3.6V Notes: 1. 5V tolerant pins, see Section 3.2 ”Peripheral Multiplexing on I/O Lines” on page 8 2. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details. 7.2 Supply Characteristics The following characteristics are applicable to the operating temperature range: TA =-40°C to 85°C, unless otherwise specified and are valid for a junction temperature up to TJ = 100°C. Please refer to Section 6. ”Supply and Startup Considerations” on page 36 Table 7-2. Supply Characteristics Voltage Symbol Parameter Min Max Unit VVDDIO DC supply peripheral I/Os 1.62 3.6 V DC supply peripheral I/Os, 1.8V single supply mode 1.62 1.98 V DC supply peripheral I/Os and internal regulator, 3.3V supply mode 1.98 3.6 V VVDDCORE DC supply core 1.62 1.98 V VVDDANA Analog supply voltage 1.62 1.98 V VVDDIN 41 32145BS–01/2012 AT32UC3L0128/256 Table 7-3. Supply Rise Rates and Order(1) Rise Rate Symbol Parameter Min Max Unit VVDDIO DC supply peripheral I/Os 0 2.5 V/µs VVDDIN DC supply peripheral I/Os and internal regulator 0.002 2.5 V/µs Slower rise time requires external power-on reset circuit. VVDDCORE DC supply core 0 2.5 V/µs Rise before or at the same time as VDDIO VVDDANA Analog supply voltage 0 2.5 V/µs Rise together with VDDCORE Note: 7.3 Comment 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Maximum Clock Frequencies These parameters are given in the following conditions: • VVDDCORE = 1.62V to 1.98V • Temperature = -40°C to 85°C Table 7-4. 7.4 Clock Frequencies Symbol Parameter Description Min Max fCPU CPU clock frequency 50 fPBA PBA clock frequency 50 fPBB PBB clock frequency 50 fGCLK0 GCLK0 clock frequency DFLLIF main reference, GCLK0 pin 50 fGCLK1 GCLK1 clock frequency DFLLIF dithering and SSG reference, GCLK1 pin 50 fGCLK2 GCLK2 clock frequency AST, GCLK2 pin 20 fGCLK3 GCLK3 clock frequency PWMA, GCLK3 pin 140 fGCLK4 GCLK4 clock frequency CAT, ACIFB, GCLK4 pin 50 fGCLK5 GCLK5 clock frequency GLOC 80 fGCLK6 GCLK6 clock frequency 50 fGCLK7 GCLK7 clock frequency 50 fGCLK8 GCLK8 clock frequency PLL source clock 50 fGCLK9 GCLK9 clock frequency FREQM, GCLK0-8 150 Units MHz Power Consumption The values in Table 7-5 are measured values of power consumption under the following conditions, except where noted: • Operating conditions, internal core supply (Figure 7-1) - this is the default configuration 42 32145BS–01/2012 AT32UC3L0128/256 – VVDDIN = 3.0V – VVDDCORE = 1.62V, supplied by the internal regulator – Corresponds to the 3.3V supply mode with 1.8V regulated I/O lines, please refer to the Supply and Startup Considerations section for more details • Equivalent to the 3.3V single supply mode • Consumption in 1.8V single supply mode can be estimated by subtracting the regulator static current • Operating conditions, external core supply (Figure 7-2) - used only when noted – VVDDIN = VVDDCORE = 1.8V – Corresponds to the 1.8V single supply mode, please refer to the Supply and Startup Considerations section for more details • TA = 25°C • Oscillators – OSC0 (crystal oscillator) stopped – OSC32K (32KHz crystal oscillator) running with external 32KHz crystal – DFLL running at 50MHz with OSC32K as reference • Clocks – DFLL used as main clock source – CPU, HSB, and PBB clocks undivided – PBA clock divided by 4 – The following peripheral clocks running • PM, SCIF, AST, FLASHCDW, PBA bridge – All other peripheral clocks stopped • I/Os are inactive with internal pull-up • Flash enabled in high speed mode • POR18 enabled • POR33 disabled 43 32145BS–01/2012 AT32UC3L0128/256 Table 7-5. Mode Power Consumption for Different Operating Modes Conditions Active(1) Measured on Consumption Typ CPU running a recursive Fibonacci algorithm 300 CPU running a division algorithm 174 Idle(1) 96 (1) (1) 46 Stop 38 DeepStop 25 -OSC32K and AST stopped -Internal core supply Static Shutdown Note: µA/MHz 57 Frozen Standby Unit Amp0 14 µA -OSC32K running -AST running at 1KHz -External core supply (Figure 7-2) 7.3 -OSC32K and AST stopped -External core supply (Figure 7-2) 6.7 -OSC32K running -AST running at 1KHz 800 AST and OSC32K stopped 220 nA 1. These numbers are valid for the measured condition only and must not be extrapolated to other frequencies. Figure 7-1. Measurement Schematic, Internal Core Supply Amp0 VDDIN VDDIO VDDCORE VDDANA 44 32145BS–01/2012 AT32UC3L0128/256 Figure 7-2. Measurement Schematic, External Core Supply Amp0 VDDIN VDDIO VDDCORE VDDANA 45 32145BS–01/2012 AT32UC3L0128/256 7.5 I/O Pin Characteristics Normal I/O Pin Characteristics(1) Table 7-6. Symbol Parameter RPULLUP Pull-up resistance VIL Input low-level voltage VIH Input high-level voltage VOL Output low-level voltage VOH Output high-level voltage fMAX Output frequency(2) tRISE Rise time(2) Condition Min Typ Max Units 75 100 145 kOhm VVDD = 3.0V -0.3 0.3*VVDD VVDD = 1.62V -0.3 0.3*VVDD VVDD = 3.6V 0.7*VVDD VVDD + 0.3 VVDD = 1.98V 0.7*VVDD VVDD + 0.3 VVDD = 3.0V, IOL = 3mA 0.4 VVDD = 1.62V, IOL = 2mA 0.4 VVDD = 3.0V, IOH = 3mA VVDD - 0.4 VVDD = 1.62V, IOH = 2mA VVDD - 0.4 V VVDD = 3.0V, load = 10pF 45 VVDD = 3.0V, load = 30pF 23 VVDD = 3.0V, load = 10pF 4.7 VVDD = 3.0V, load = 30pF 11.5 VVDD = 3.0V, load = 10pF 4.8 VVDD = 3.0V, load = 30pF 12 1 MHz ns Fall time(2) ILEAK Input leakage current Pull-up resistors disabled TQFP48 package 1.4 CIN Input capacitance, all normal I/O pins except PA05, PA07, PA17, PA20, PA21, PB04, PB05 QFN48 package 1.1 TLLGA48 package 1.1 TQFP48 package 2.7 QFN48 package 2.4 TLLGA48 package 2.4 TQFP48 package 3.8 QFN48 package 3.5 TLLGA48 package 3.5 Input capacitance, PA20 Input capacitance, PA05, PA07, PA17, PA21, PB04, PB05 CIN Notes: V V tFALL CIN V µA pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. High-drive I/O Pin Characteristics(1) Table 7-7. Symbol RPULLUP Parameter Pull-up resistance Condition Min Typ Max PA06 30 50 110 PA02, PB01, RESET 75 100 145 PA08, PA09 10 20 45 Units kOhm 46 32145BS–01/2012 AT32UC3L0128/256 High-drive I/O Pin Characteristics(1) Table 7-7. Symbol Parameter VIL Input low-level voltage VIH Input high-level voltage VOL Output low-level voltage VOH Output high-level voltage fMAX Output frequency, all High-drive I/O pins, except PA08 and PA09(2) tRISE Rise time, all High-drive I/O pins, except PA08 and PA09(2) Condition Min Typ Max VVDD = 3.0V -0.3 0.3*VVDD VVDD = 1.62V -0.3 0.3*VVDD VVDD = 3.6V 0.7*VVDD VVDD + 0.3 VVDD = 1.98V 0.7*VVDD VVDD + 0.3 VVDD = 3.0V, IOL = 6mA 0.4 VVDD = 1.62V, IOL = 4mA 0.4 VVDD = 3.0V, IOH = 6mA VVDD-0.4 VVDD = 1.62V, IOH = 4mA VVDD-0.4 VVDD = 3.0V, load = 30pF 23 VVDD = 3.0V, load = 10pF 4.7 VVDD = 3.0V, load = 30pF 11.5 VVDD = 3.0V, load = 10pF 4.8 tFALL Fall time, all High-drive I/O pins, except PA08 and PA09(2) VVDD = 3.0V, load = 30pF 12 Output frequency, PA08 and PA09(2) VVDD = 3.0V, load = 10pF 54 fMAX VVDD = 3.0V, load = 30pF 40 Rise time, PA08 and PA09(2) VVDD = 3.0V, load = 10pF 2.8 tRISE VVDD = 3.0V, load = 30pF 4.9 VVDD = 3.0V, load = 10pF 2.4 VVDD = 3.0V, load = 30pF 4.6 Pull-up resistors disabled 1 Fall time, PA08 and PA09 ILEAK Input leakage current CIN Input capacitance, all High-drive I/O pins, except PA08 and PA09 V V 45 tFALL V V VVDD = 3.0V, load = 10pF (2) Units MHz ns MHz ns TQFP48 package 2.2 QFN48 package 2.0 TLLGA48 package 2.0 TQFP48 package 7.0 QFN48 package 6.7 TLLGA48 package 6.7 µA pF Input capacitance, PA08 and PA09 CIN Notes: 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. High-drive I/O, 5V Tolerant, Pin Characteristics(1) Table 7-8. Symbol Parameter RPULLUP Pull-up resistance VIL Input low-level voltage Condition Min Typ Max Units 30 50 110 kOhm VVDD = 3.0V -0.3 0.3*VVDD VVDD = 1.62V -0.3 0.3*VVDD V 47 32145BS–01/2012 AT32UC3L0128/256 High-drive I/O, 5V Tolerant, Pin Characteristics(1) Table 7-8. Symbol Parameter VIH Input high-level voltage VOL Output low-level voltage VOH Output high-level voltage fMAX Output frequency(2) tRISE Rise time(2) (2) tFALL Fall time ILEAK Input leakage current CIN Notes: Input capacitance Condition Min Typ Max VVDD = 3.6V 0.7*VVDD 5.5 VVDD = 1.98V 0.7*VVDD 5.5 Units V VVDD = 3.0V, IOL = 6mA 0.4 VVDD = 1.62V, IOL = 4mA 0.4 V VVDD = 3.0V, IOH = 6mA VVDD-0.4 VVDD = 1.62V, IOH = 4mA VVDD-0.4 V VVDD = 3.0V, load = 10pF 87 VVDD = 3.0V, load = 30pF 58 VVDD = 3.0V, load = 10pF 2.3 VVDD = 3.0V, load = 30pF 4.3 VVDD = 3.0V, load = 10pF 1.9 VVDD = 3.0V, load = 30pF 3.7 5.5V, pull-up resistors disabled 10 MHz ns TQFP48 package 4.5 QFN48 package 4.2 TLLGA48 package 4.2 µA pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. TWI Pin Characteristics(1) Table 7-9. Symbol Parameter RPULLUP Pull-up resistance VIL Input low-level voltage Input high-level voltage VIH Input high-level voltage, 5V tolerant SMBUS compliant pins Condition Min Typ Max Units 25 35 60 kOhm VVDD = 3.0V -0.3 0.3*VVDD VVDD = 1.62V -0.3 0.3*VVDD VVDD = 3.6V 0.7*VVDD VVDD + 0.3 VVDD = 1.98V 0.7*VVDD VVDD + 0.3 VVDD = 3.6V 0.7*VVDD 5.5 VVDD = 1.98V 0.7*VVDD 5.5 Output low-level voltage IOL = 3mA ILEAK Input leakage current Pull-up resistors disabled IIL Input low leakage 1 IIH Input high leakage 1 Input capacitance V V VOL CIN V 0.4 V 1 TQFP48 package 3.8 QFN48 package 3.5 TLLGA48 package 3.5 µA pF 48 32145BS–01/2012 AT32UC3L0128/256 TWI Pin Characteristics(1) Table 7-9. Symbol Parameter tFALL Fall time fMAX Max frequency Condition Min Typ Cbus = 400pF, VVDD > 2.0V 250 Cbus = 400pF, VVDD > 1.62V 470 Max Units ns Cbus = 400pF, VVDD > 2.0V 400 kHz Note: 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2.1 on page 8 for details. 7.6 Oscillator Characteristics 7.6.1 Oscillator 0 (OSC0) Characteristics 7.6.1.1 Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN. Table 7-10. Digital Clock Characteristics Symbol Parameter fCPXIN XIN clock frequency tCPXIN XIN clock duty cycle(1) tSTARTUP Startup time CIN Note: XIN input capacitance Conditions Min Typ 40 0 TQFP48 package 7.0 QFN48 package 6.7 TLLGA48 package 6.7 Max Units 50 MHz 60 % cycles pF 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.6.1.2 Crystal Oscillator Characteristics The following table describes the characteristics for the oscillator when a crystal is connected between XIN and XOUT as shown in Figure 7-3. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can then be computed as follows: C LEXT = 2 ( C L – C i ) – C PCB where CPCB is the capacitance of the PCB and Ci is the internal equivalent load capacitance. 49 32145BS–01/2012 AT32UC3L0128/256 Table 7-11. Symbol Crystal Oscillator Characteristics Parameter Conditions (3) fOUT Crystal oscillator frequency CL Crystal load capacitance(3) Ci Internal equivalent load capacitance tSTARTUP Startup time Typ Max Unit 0.45 10 16 MHz 6 18 pF 2 SCIF.OSCCTRL.GAIN = 2(1) Active mode, f = 0.45MHz, SCIF.OSCCTRL.GAIN = 0 Current consumption IOSC Notes: Min Active mode, f = 10MHz, SCIF.OSCCTRL.GAIN = 2 30 000(2) cycles 30 µA 220 1. Please refer to the SCIF chapter for details. 2. Nominal crystal cycles. 3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Figure 7-3. Oscillator Connection CLEXT XOUT UC3L Ci CL XIN CLEXT 7.6.2 32KHz Crystal Oscillator (OSC32K) Characteristics Figure 7-3 and the equation above also applies to the 32 KHz oscillator connection. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can then be found in the crystal datasheet. 50 32145BS–01/2012 AT32UC3L0128/256 Table 7-12. 32 KHz Crystal Oscillator Characteristics Symbol Parameter fOUT Crystal oscillator frequency tSTARTUP Startup time CL Crystal load capacitance(2) Ci Internal equivalent load capacitance IOSC32 Current consumption Equivalent series resistance RS Notes: Conditions Min RS = 60kOhm, CL = 9pF Typ Max Unit 32 768 Hz 30 000(1) cycles 6 12.5 pF 2 0.6 (2) 32 768Hz 35 µA 85 kOhm 1. Nominal crystal cycles. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.6.3 Phase Locked Loop (PLL) Characteristics Table 7-13. Phase Locked Loop Characteristics Symbol Parameter fOUT Output frequency(1) 40 240 fIN Input frequency(1) 4 16 IPLL Current consumption tSTARTUP Startup time, from enabling the PLL until the PLL is locked Note: Conditions Min Typ Max Unit MHz 8 fIN= 4MHz 200 fIN= 16MHz 155 µA/MHz µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 51 32145BS–01/2012 AT32UC3L0128/256 7.6.4 Digital Frequency Locked Loop (DFLL) Characteristics Table 7-14. Symbol Digital Frequency Locked Loop Characteristics Parameter Conditions (2) fOUT Output frequency fREF Reference frequency(2) FINE resolution step FINE > 100, all COARSE values (3) Frequency drift over voltage and temperature Open loop mode Accuracy(2) IDFLL Power consumption tSTARTUP Startup time(2) tLOCK Lock time Notes: Min Typ Max Unit 20 150 MHz 8 150 kHz 0.38 % See Figure 7-4 FINE lock, fREF = 32kHz, SSG disabled 0.1 0.5 ACCURATE lock, fREF = 32kHz, dither clk RCSYS/2, SSG disabled 0.06 0.5 FINE lock, fREF = 8-150kHz, SSG disabled 0.2 1 ACCURATE lock, fREF = 8-150kHz, dither clk RCSYS/2, SSG disabled 0.1 1 % 25 Within 90% of final values µA/MHz 100 fREF = 32kHz, FINE lock, SSG disabled 8 fREF = 32kHz, ACCURATE lock, dithering clock = RCSYS/2, SSG disabled 28 µs ms 1. Spread Spectrum Generator (SSG) is disabled by writing a zero to the EN bit in the DFLL0SSG register. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 3. The FINE and COARSE values are selected by wrirting to the DFLL0VAL.FINE and DFLL0VAL.COARSE field respectively. 52 32145BS–01/2012 AT32UC3L0128/256 Figure 7-4. DFLL Open Loop Frequency Variation(1)(2) DFLL Open Loop Frequency variation 160 150 Frequencies (MHz) 140 130 1,98V 120 1,8V 1.62V 110 100 90 80 -40 -20 0 20 40 60 80 Tem pera ture Notes: 1. The plot shows a typical open loop mode behavior with COARSE= 99 and FINE= 255 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.6.5 120MHz RC Oscillator (RC120M) Characteristics Table 7-15. Symbol Internal 120MHz RC Oscillator Characteristics Parameter Conditions (1) fOUT Output frequency IRC120M Current consumption tSTARTUP Note: Startup time (1) VVDDCORE = 1.8V Min Typ Max Unit 88 120 152 MHz 1.2 mA 3 µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 53 32145BS–01/2012 AT32UC3L0128/256 7.6.6 32kHz RC Oscillator (RC32K) Characteristics Table 7-16. Symbol 32kHz RC Oscillator Characteristics Parameter Conditions (1) Min Typ Max Unit 20 32 44 kHz fOUT Output frequency IRC32K Current consumption 0.7 µA tSTARTUP Startup time(1) 100 µs Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.6.7 System RC Oscillator (RCSYS) Characteristics Table 7-17. System RC Oscillator Characteristics Symbol Parameter Conditions fOUT Output frequency Calibrated at 85°C 7.7 Min Typ Max Unit 111.6 115 118.4 kHz Flash Characteristics Table 7-18 gives the device maximum operating frequency depending on the number of flash wait states and the flash read mode. The FSW bit in the FLASHCDW FSR register controls the number of wait states used when accessing the flash memory. Table 7-18. Maximum Operating Frequency Flash Wait States Read Mode Maximum Operating Frequency 1 50MHz High speed read mode 0 25MHz 1 30MHz Normal read mode 0 Table 7-19. 15MHz Flash Characteristics Symbol Parameter tFPP Page programming time tFPE Page erase time tFFP Fuse programming time tFEA Full chip erase time (EA) tFCE JTAG chip erase time (CHIP_ERASE) Conditions Min Typ Max Unit 5 5 fCLK_HSB = 50MHz 1 ms 6 fCLK_HSB = 115kHz 310 54 32145BS–01/2012 AT32UC3L0128/256 Table 7-20. Flash Endurance and Data Retention Symbol Parameter NFARRAY Array endurance (write/page) 100k NFFUSE General Purpose fuses endurance (write/bit) 10k tRET Data retention 15 7.8 Conditions Typ Max Unit cycles years Analog Characteristics 7.8.1 Voltage Regulator Characteristics Table 7-21. VREG Electrical Characteristics Symbol Parameter VVDDIN Input voltage range VVDDCORE Output voltage, calibrated value Condition Min Typ Max 1.98 3.3 3.6 Units V Output voltage accuracy (1) IOUT DC output current(1) IVREG Static current of internal regulator Note: Min VVDDIN >= 1.98V 1.8 IOUT = 0.1mA to 60mA, VVDDIN > 1.98V 2 IOUT = 0.1mA to 60mA, VVDDIN < 1.98V 4 % Normal mode 60 Low power mode 1 mA Normal mode 13 Low power mode 4 µA 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Table 7-22. Decoupling Requirements Symbol Parameter CIN1 Input regulator capacitor 1 33 CIN2 Input regulator capacitor 2 100 CIN3 Input regulator capacitor 3 10 µF COUT1 Output regulator capacitor 1 100 nF COUT2 Output regulator capacitor 2 2.2 Note: Condition Typ Techno. Units nF Tantalum 0.5<ESR<10Ohm µF 1. Refer to Section 6.1.2 on page 36. 55 32145BS–01/2012 AT32UC3L0128/256 7.8.2 Power-on Reset 18 Characteristics Table 7-23. POR18 Characteristics Symbol Parameter VPOT+ Voltage threshold on VVDDCORE rising VPOT- Voltage threshold on VVDDCORE falling tDET Detection time(1) IPOR18 Current consumption tSTARTUP Note: Condition Min Typ 1.45 Max Units 1.58 V 1.2 Time with VDDCORE < VPOTnecessary to generate a reset signal (1) Startup time 1.32 460 µs 4 µA 6 µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. POR18 Operating Principle VVDDCORE Figure 7-5. VPOT+ VPOT- Reset Time 56 32145BS–01/2012 AT32UC3L0128/256 7.8.3 Power-on Reset 33 Characteristics Table 7-24. POR33 Characteristics Symbol Parameter VPOT+ Voltage threshold on VVDDIN rising VPOT- Voltage threshold on VVDDIN falling tDET Detection time(1) IPOR33 Current consumption tSTARTUP Note: Condition Min Typ 1.49 Max Units 1.58 V 1.3 Time with VDDIN < VPOTnecessary to generate a reset signal (1) Startup time 1.45 460 µs 20 µA 400 µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. POR33 Operating Principle VVDDIN Figure 7-6. VPOT+ VPOT- Reset Time 57 32145BS–01/2012 AT32UC3L0128/256 7.8.4 Brown Out Detector Characteristics The values in Table 7-25 describe the values of the BODLEVEL in the flash General Purpose Fuse register. Table 7-25. BODLEVEL Values BODLEVEL Value Min Typ Max 011111 binary (31) 0x1F 1.60 100111 binary (39) 0x27 1.69 Units V Table 7-26. BOD Characteristics Symbol Parameter Condition VHYST BOD hysteresis T = 25°C 10 mV tDET Detection time Time with VDDCORE < BODLEVEL necessary to generate a reset signal 1 µs IBOD Current consumption 7 µA tSTARTUP Startup time 5 µs 7.8.5 Min Typ Max Units Supply Monitor 33 Characteristics Table 7-27. Symbol SM33 Characteristics Parameter Voltage threshold VTH Condition (1) Calibrated , T = 25°C Min 1.675 Typ 1.75 Max 1.825 Units V Step size, between adjacent values in SCIF.SM33.CALIB(2) 11 VHYST Hysteresis(2) 30 tDET Detection time Time with VDDIN < VTH necessary to generate a reset signal 280 µs ISM33 Current consumption Normal mode 17 µA tSTARTUP Startup time Normal mode 140 µs Notes: mV 1. Calibration value can be read from the SM33.CALIB field. This field is updated by the flash fuses after a reset. Refer to SCIF chapter for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 58 32145BS–01/2012 AT32UC3L0128/256 7.8.6 Analog to Digital Converter Characteristics Table 7-28. ADC Characteristics Symbol Parameter Conditions fADC ADC clock frequency fADC ADC clock frequency tSTARTUP Startup time Return from Idle Mode tCONV Conversion time (latency) fADC = 6MHz Throughput rate Throughput rate Min Typ Max Units 12-bit resolution mode 6 MHz 10-bit resolution mode 6 8-bit resolution mode 6 15 11 µs 26 cycles VVDD > 3.0V, fADC = 6MHz, 12-bit resolution mode, low impedance source 28 kSPS VVDD > 3.0V, fADC = 6MHz, 10-bit resolution mode, low impedance source 460 VVDD > 3.0V, fADC = 6MHz, 8-bit resolution mode, low impedance source 460 kSPS VADVREFP Reference voltage range VADVREFP = VVDDANA IADC Current consumption on VVDDANA ADC Clock = 6MHz 350 IADVREFP Current consumption on ADVREFP pin fADC = 6MHz 150 Note: MHz 1.62 1.98 V µA These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.8.6.1 Inputs and Sample and Hold Acquisition Times Table 7-29. Symbol Analog Inputs Parameter Conditions Min Typ Max Units VADVREFP V 22.5 pF 12-bit mode VADn Input Voltage Range CONCHIP Internal Capacitance(1) 10-bit mode 0 8-bit mode RONCHIP Note: Internal Resistance (1) VVDDIO = 3.0V to 3.6V, VVDDCORE = 1.8V 3.15 VVDDIO = VVDDCORE = 1.62V to 1.98V 55.9 kOhm 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. The analog voltage source must be able to charge the sample and hold (S/H) capacitor in the ADC in order to achieve maximum accuracy. Seen externally the ADC input consists of a resistor ( R ONCHIP ) and a capacitor ( C ONCHIP ). In addition, the resistance ( R SOURCE ) and capacitance ( C SOURCE ) of the PCB and source must be taken into account when calculating the required sample and hold time. Figure 7-7 shows the ADC input channel equivalent circuit. 59 32145BS–01/2012 AT32UC3L0128/256 Figure 7-7. ADC Input RSOURCE Positive Input RONCHIP CSOURCE VIN CONCHIP ADCVREFP/2 The minimum sample and hold time (in ns) can be found using this formula: t SAMPLEHOLD ≥ ( R ONCHIP + R SOURCE ) × ( C ONCHIP + C SOURCE ) × ln ( 2 n+1 ) Where n is the number of bits in the conversion. t SAMPLEHOLD is defined by the SHTIM field in the ADCIFB ACR register. Please refer to the ADCIFB chapter for more information. 7.8.6.2 Applicable Conditions and Derating Data Table 7-30. Transfer Characteristics 12-bit Resolution Mode(1) Parameter Conditions Min Resolution Max 12 Integral non-linearity ADC clock frequency = 6MHz, Input Voltage Range = 0 - VADVREFP +/-4 ADC clock frequency = 6MHz, Input Voltage Range = (10% VADVREFP) (90% VADVREFP) +/-2 Differential non-linearity Offset error Units Bit LSB -1.5 ADC clock frequency = 6MHz 1.5 +/-3 Gain error Note: Typ +/-5 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Table 7-31. Transfer Characteristics, 10-bit Resolution Mode(1) Parameter Conditions Min Resolution Offset error Gain error Max 10 Integral non-linearity Differential non-linearity Typ Units Bit +/-1 ADC clock frequency = 6MHz -1 1 +/-1 LSB +/-2 60 32145BS–01/2012 AT32UC3L0128/256 Note: 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Table 7-32. Transfer Characteristics, 8-bit Resolution Mode(1) Parameter Conditions Min Resolution Max Units 8 Integral non-linearity Differential non-linearity Offset error Bit +/-0.5 ADC clock frequency = 6MHz -0.3 0.3 +/-1 Gain error Note: Typ LSB +/-1 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.8.7 Temperature Sensor Characteristics Table 7-33. Symbol Temperature Sensor Characteristics(1) Parameter Condition Min Typ Max Units Gradient 1 mV/°C ITS Current consumption 1 µA tSTARTUP Startup time 0 µs Note: 1. The Temperature Sensor is not calibrated. The accuracy of the Temperature Sensor is governed by the ADC accuracy. 61 32145BS–01/2012 AT32UC3L0128/256 7.8.8 Analog Comparator Characteristics Table 7-34. Symbol Analog Comparator Characteristics Parameter Condition Min Typ Max Positive input voltage range(3) -0.2 VVDDIO + 0.3 Negative input voltage range(3) -0.2 VVDDIO - 0.6 Units V Statistical offset (3) VACREFN = 1.0V, fAC = 12MHz, filter length = 2, hysteresis = 0(1) 20 Clock frequency for GCLK4(3) fAC Throughput rate(3) fAC = 12MHz Propagation delay Delay from input change to Interrupt Status Register Changes IAC Current consumption(3) All channels, VDDIO = 3.3V, fA = 3MHz tSTARTUP Startup time 12 MHz 12 000 000 Comparisons per second 1 ⎛ + 3⎞ × t CLKACIFB ⎝ t---------------------------------------⎠ CLKACIFB × f AC Input current per pin(3) Notes: mV ns 420 µA 3 cycles 0.2 µA/MHz(2) 1. AC.CONFn.FLEN and AC.CONFn.HYS fields, refer to the Analog Comparator Interface chapter. 2. Referring to fAC. 3. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.8.9 Capacitive Touch Characteristics 7.8.9.1 Discharge Current Source Table 7-35. DICS Characteristics Symbol Parameter RREF Internal resistor 170 kOhm (1) 0.7 % k Note: Trim step size Min Typ Max Unit 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 62 32145BS–01/2012 AT32UC3L0128/256 7.8.9.2 Table 7-36. Strong Pull-up Pull-down Strong Pull-up Pull-down Parameter Min Typ Max Pull-down resistor 1 Pull-up resistor 1 Unit kOhm 63 32145BS–01/2012 AT32UC3L0128/256 7.9 Timing Characteristics 7.9.1 Startup, Reset, and Wake-up Timing The startup, reset, and wake-up timings are calculated using the following formula: t = t CONST + N CPU × t CPU Where t CONST and N CPU are found in Table 7-37. t CPU is the period of the CPU clock. If a clock source other than RCSYS is selected as the CPU clock, the oscillator startup time, t OSCSTART , must be added to the wake-up time from the stop, deepstop, and static sleep modes. Please refer to the source for the CPU clock in the ”Oscillator Characteristics” on page 49 for more details about oscillator startup times. Table 7-37. Maximum Reset and Wake-up Timing(1) Max t CONST (in µs) Max N CPU Parameter Measuring Startup time from power-up, using regulator Time from VDDIN crossing the VPOT+ threshold of POR33 to the first instruction entering the decode stage of CPU. VDDCORE is supplied by the internal regulator. 2210 0 Startup time from power-up, no regulator Time from VDDIN crossing the VPOT+ threshold of POR33 to the first instruction entering the decode stage of CPU. VDDCORE is connected to VDDIN. 1810 0 Startup time from reset release Time from releasing a reset source (except POR18, POR33, and SM33) to the first instruction entering the decode stage of CPU. 170 0 Idle 0 19 Frozen 0 110 0 110 27 + t OSCSTART 116 Deepstop 27 + t OSCSTART 116 Static 97 + t OSCSTART 116 1180 0 Standby Wake-up Stop Wake-up from shutdown Note: From wake-up event to the first instruction of an interrupt routine entering the decode stage of the CPU. From wake-up event to the first instruction entering the decode stage of the CPU. 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 7.9.2 RESET_N Timing Table 7-38. RESET_N Waveform Parameters(1) Symbol Parameter tRESET RESET_N minimum pulse length Note: Conditions Min 10 Max Units ns 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 64 32145BS–01/2012 AT32UC3L0128/256 7.9.3 USART in SPI Mode Timing 7.9.3.1 Master mode Figure 7-8. USART in SPI Master Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI0 USPI1 MOSI USPI2 Figure 7-9. USART in SPI Master Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI3 USPI4 MOSI USPI5 Table 7-39. Symbol USART in SPI Mode Timing, Master Mode(1) Parameter Conditions USPI0 MISO setup time before SPCK rises USPI1 MISO hold time after SPCK rises USPI2 SPCK rising to MOSI delay USPI3 MISO setup time before SPCK falls USPI4 MISO hold time after SPCK falls USPI5 SPCK falling to MOSI delay Notes: Min 28.7 + VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Max Units tSAMPLE(2) 0 16.5 ns 25.8 + tSAMPLE(2) 0 21.19 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. t SPCK 1⎞ 2. Where: t SAMPLE = t SPCK – ⎛ -------------------------------------- × t CLKUSART ⎝ 2×t 2⎠ CLKUSART 65 32145BS–01/2012 AT32UC3L0128/256 Maximum SPI Frequency, Master Output The maximum SPI master output frequency is given by the following formula: 1 f CLKSPI × 2 f SPCKMAX = MIN (f PINMAX,------------, -----------------------------) SPIn 9 Where SPIn is the MOSI delay, USPI2 or USPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (------------------------------------,-----------------------------) SPIn + t VALID 9 Where SPIn is the MISO setup and hold time, USPI0 + USPI1 or USPI3 + USPI4 depending on CPOL and NCPHA. T VALID is the SPI slave response time. Please refer to the SPI slave datasheet for T VALID . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. 7.9.3.2 Slave mode Figure 7-10. USART in SPI Slave Mode with (CPOL= 0 and CPHA= 1) or (CPOL= 1 and CPHA= 0) SPCK MISO USPI6 MOSI USPI7 USPI8 66 32145BS–01/2012 AT32UC3L0128/256 Figure 7-11. USART in SPI Slave Mode with (CPOL= CPHA= 0) or (CPOL= CPHA= 1) SPCK MISO USPI9 MOSI USPI10 USPI11 Figure 7-12. USART in SPI Slave Mode, NPCS Timing USPI12 USPI13 USPI14 USPI15 SPCK, CPOL=0 SPCK, CPOL=1 NSS Table 7-40. USART in SPI mode Timing, Slave Mode(1) Symbol Parameter USPI6 SPCK falling to MISO delay Conditions Max Units 37.3 USPI7 MOSI setup time before SPCK rises USPI8 MOSI hold time after SPCK rises USPI9 SPCK rising to MISO delay USPI10 MOSI setup time before SPCK falls USPI11 MOSI hold time after SPCK falls USPI12 NSS setup time before SPCK rises USPI13 NSS hold time after SPCK falls USPI14 NSS setup time before SPCK falls USPI15 NSS hold time after SPCK rises Notes: Min tSAMPLE(2) + 2.6 + tCLK_USART 0 VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 37.0 tSAMPLE(2) + 2.6 + tCLK_USART ns 0 27.2 0 27.2 0 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. t SPCK 1 2. Where: t SAMPLE = t SPCK – ⎛ -----------------------------------+ ---⎞ × t CLKUSART ⎝ 2×t 2⎠ CLKUSART 67 32145BS–01/2012 AT32UC3L0128/256 Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (-----------------------------,------------) 9 SPIn Where SPIn is the MOSI setup and hold time, USPI7 + USPI8 or USPI10 + USPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: f CLKSPI × 2 1 f SPCKMAX = MIN (-----------------------------, f PINMAX,------------------------------------) 9 SPIn + t SETUP Where SPIn is the MISO delay, USPI6 or USPI9 depending on CPOL and NCPHA. T SETUP is the SPI master setup time. Please refer to the SPI master datasheet for T SETUP . f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 7.9.4 SPI Timing 7.9.4.1 Master mode Figure 7-13. SPI Master Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI0 SPI1 MOSI SPI2 68 32145BS–01/2012 AT32UC3L0128/256 Figure 7-14. SPI Master Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI3 SPI4 MOSI SPI5 Table 7-41. SPI Timing, Master Mode(1) Symbol Parameter SPI0 MISO setup time before SPCK rises SPI1 MISO hold time after SPCK rises SPI2 SPCK rising to MOSI delay SPI3 MISO setup time before SPCK falls SPI4 MISO hold time after SPCK falls SPI5 SPCK falling to MOSI delay Note: Conditions Min Max Units 33.4 + (tCLK_SPI)/2 VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 0 7.1 ns 29.2 + (tCLK_SPI)/2 0 8.63 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Maximum SPI Frequency, Master Output The maximum SPI master output frequency is given by the following formula: 1 f SPCKMAX = MIN (f PINMAX,------------) SPIn Where SPIn is the MOSI delay, SPI2 or SPI5 depending on CPOL and NCPHA. f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. Maximum SPI Frequency, Master Input The maximum SPI master input frequency is given by the following formula: 1 f SPCKMAX = -----------------------------------SPIn + t VALID Where SPIn is the MISO setup and hold time, SPI0 + SPI1 or SPI3 + SPI4 depending on CPOL and NCPHA. t VALID is the SPI slave response time. Please refer to the SPI slave datasheet for t VALID . 69 32145BS–01/2012 AT32UC3L0128/256 7.9.4.2 Slave mode Figure 7-15. SPI Slave Mode with (CPOL= 0 and NCPHA= 1) or (CPOL= 1 and NCPHA= 0) SPCK MISO SPI6 MOSI SPI7 SPI8 Figure 7-16. SPI Slave Mode with (CPOL= NCPHA= 0) or (CPOL= NCPHA= 1) SPCK MISO SPI9 MOSI SPI10 Figure 7-17. SPI11 SPI Slave Mode, NPCS Timing SPI12 SPI13 SPI14 SPI15 SPCK, CPOL=0 SPCK, CPOL=1 NPCS 70 32145BS–01/2012 AT32UC3L0128/256 Table 7-42. SPI Timing, Slave Mode(1) Symbol Parameter SPI6 SPCK falling to MISO delay SPI7 MOSI setup time before SPCK rises SPI8 MOSI hold time after SPCK rises SPI9 SPCK rising to MISO delay SPI10 MOSI setup time before SPCK falls SPI11 MOSI hold time after SPCK falls SPI12 NPCS setup time before SPCK rises SPI13 NPCS hold time after SPCK falls 1.1 SPI14 NPCS setup time before SPCK falls 3.3 SPI15 NPCS hold time after SPCK rises 0.7 Note: Conditions Min Max Units 29.4 0 6.0 VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF 29.0 0 ns 5.5 3.4 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Maximum SPI Frequency, Slave Input Mode The maximum SPI slave input frequency is given by the following formula: 1 f SPCKMAX = MIN (f CLKSPI,------------) SPIn Where SPIn is the MOSI setup and hold time, SPI7 + SPI8 or SPI10 + SPI11 depending on CPOL and NCPHA. f CLKSPI is the maximum frequency of the CLK_SPI. Refer to the SPI chapter for a description of this clock. Maximum SPI Frequency, Slave Output Mode The maximum SPI slave output frequency is given by the following formula: 1 f SPCKMAX = MIN (f PINMAX,------------------------------------) SPIn + t SETUP Where SPIn is the MISO delay, SPI6 or SPI9 depending on CPOL and NCPHA. t SETUP is the SPI master setup time. Please refer to the SPI master datasheet for t SETUP . f PINMAX is the maximum frequency of the SPI pins. Please refer to the I/O Pin Characteristics section for the maximum frequency of the pins. 7.9.5 TWIM/TWIS Timing Figure 7-43 shows the TWI-bus timing requirements and the compliance of the device with them. Some of these requirements (tr and tf) are met by the device without requiring user intervention. Compliance with the other requirements (tHD-STA, tSU-STA, tSU-STO, tHD-DAT, tSU-DAT-TWI, tLOWTWI, tHIGH, and fTWCK) requires user intervention through appropriate programming of the relevant 71 32145BS–01/2012 AT32UC3L0128/256 TWIM and TWIS user interface registers. Please refer to the TWIM and TWIS sections for more information. Table 7-43. TWI-Bus Timing Requirements Minimum Symbol Parameter Mode Requirement Standard(1) tr TWCK and TWD rise time tf TWCK and TWD fall time tHD-STA (Repeated) START hold time tSU-STA (Repeated) START set-up time tSU-STO STOP set-up time tHD-DAT Data hold time - 1000 20 + 0.1Cb 300 - 300 20 + 0.1Cb 300 0.6 Standard 4.7 Fast 0.6 Standard 4.0 Fast 0.6 Standard 250 Fast 100 - - Standard 4.7 Fast 1.3 TWCK HIGH period fTWCK TWCK frequency - Standard 4.0 Fast 0.6 Standard Notes: - μs tclkpb - μs 4tclkpb - μs 2tclkpb TWCK LOW period tHIGH Unit tclkpb 3.45() 0.3(2) Fast tLOW Device 4 Fast Standard tSU-DAT Requirement ns Fast Standard tLOW-TWI Device ns Fast(1) Standard tSU-DAT-TWI Data set-up time Maximum μs 2tclkpb - ns tclkpb - - 4tclkpb - μs tclkpb - - 8tclkpb - μs 100 - Fast 15tprescaled + tclkpb 0.9() 400 1 -----------------------12t clkpb kHz 1. Standard mode: f TWCK ≤ 100 kHz ; fast mode: f TWCK > 100 kHz . 2. A device must internally provide a hold time of at least 300 ns for TWD with reference to the falling edge of TWCK. Notations: Cb = total capacitance of one bus line in pF tclkpb = period of TWI peripheral bus clock tprescaled = period of TWI internal prescaled clock (see chapters on TWIM and TWIS) The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW-TWI) of TWCK. 72 32145BS–01/2012 AT32UC3L0128/256 7.9.6 JTAG Timing Figure 7-18. JTAG Interface Signals JTAG2 TCK JTAG0 JTAG1 TMS/TDI JTAG3 JTAG4 JTAG7 JTAG8 TDO JTAG5 JTAG6 Boundary Scan Inputs Boundary Scan Outputs JTAG9 JTAG10 Table 7-44. JTAG Timings(1) Symbol Parameter JTAG0 TCK Low Half-period 21.8 JTAG1 TCK High Half-period 8.6 JTAG2 TCK Period 30.3 JTAG3 TDI, TMS Setup before TCK High JTAG4 TDI, TMS Hold after TCK High JTAG5 TDO Hold Time JTAG6 TCK Low to TDO Valid JTAG7 Boundary Scan Inputs Setup Time JTAG8 Boundary Scan Inputs Hold Time 6.9 JTAG9 Boundary Scan Outputs Hold Time 9.3 JTAG10 TCK to Boundary Scan Outputs Valid Note: Conditions VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF Min Max Units 2.0 2.3 ns 9.5 21.8 0.6 32.2 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 73 32145BS–01/2012 AT32UC3L0128/256 8. Mechanical Characteristics 8.1 8.1.1 Thermal Considerations Thermal Data Table 8-1 summarizes the thermal resistance data depending on the package. Table 8-1. 8.1.2 Thermal Resistance Data Symbol Parameter Condition Package Typ θJA Junction-to-ambient thermal resistance Still Air TQFP48 54.4 θJC Junction-to-case thermal resistance TQFP48 15.7 θJA Junction-to-ambient thermal resistance QFN48 26.0 θJC Junction-to-case thermal resistance QFN48 1.6 θJA Junction-to-ambient thermal resistance TLLGA48 25.4 θJC Junction-to-case thermal resistance TLLGA48 12.7 Still Air Still Air Unit °C/W °C/W °C/W Junction Temperature The average chip-junction temperature, TJ, in °C can be obtained from the following: 1. T J = T A + ( P D × θ JA ) 2. T J = T A + ( P D × ( θ HEATSINK + θ JC ) ) where: • θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 8-1. • θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 8-1. • θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet. • PD = device power consumption (W) estimated from data provided in Section 7.4 on page 42. • TA = ambient temperature (°C). From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in °C. 74 32145BS–01/2012 AT32UC3L0128/256 8.2 Package Drawings Figure 8-1. TQFP-48 Package Drawing Table 8-2. Device and Package Maximum Weight 140 Table 8-3. mg Package Characteristics Moisture Sensitivity Level Table 8-4. MSL3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification E3 75 32145BS–01/2012 AT32UC3L0128/256 Figure 8-2. Note: QFN-48 Package Drawing The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Table 8-5. Device and Package Maximum Weight 140 Table 8-6. mg Package Characteristics Moisture Sensitivity Level Table 8-7. MSL3 Package Reference JEDEC Drawing Reference M0-220 JESD97 Classification E3 76 32145BS–01/2012 AT32UC3L0128/256 Figure 8-3. TLLGA-48 Package Drawing Table 8-8. Device and Package Maximum Weight 39.3 Table 8-9. mg Package Characteristics Moisture Sensitivity Level Table 8-10. MSL3 Package Reference JEDEC Drawing Reference N/A JESD97 Classification E4 77 32145BS–01/2012 AT32UC3L0128/256 8.3 Soldering Profile Table 8-11 gives the recommended soldering profile from J-STD-20. Table 8-11. Soldering Profile Profile Feature Green Package Average Ramp-up Rate (217°C to Peak) 3°C/s max Preheat Temperature 175°C ±25°C 150-200°C Time Maintained Above 217°C 60-150 s Time within 5°C of Actual Peak Temperature 30 s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max Time 25°C to Peak Temperature 8 minutes max A maximum of three reflow passes is allowed per component. 78 32145BS–01/2012 AT32UC3L0128/256 9. Ordering Information Table 9-1. Ordering Information Device Ordering Code Carrier Type AT32UC3L0256-AUTES ES AT32UC3L0256-AUT Tray AT32UC3L0256-AUR Tape & Reel Package Package Type Temperature Operating Range TQFP 48 JESD97 Classification E3 AT32UC3L0256 AT32UC3L0256-ZAUTES ES AT32UC3L0256-ZAUT Tray AT32UC3L0256-ZAUR Tape & Reel AT32UC3L0256-D3HES ES AT32UC3L0256-D3HT Tray AT32UC3L0256-D3HR Tape & Reel AT32UC3L0128-AUT Tray AT32UC3L0128-AUR Tape & Reel AT32UC3L0128-ZAUT Tray AT32UC3L0128-ZAUR Tape & Reel AT32UC3L0128-D3HT Tray AT32UC3L0128-D3HR Tape & Reel QFN 48 TLLGA 48 JESD97 Classification E4 Industrial (-40°C to 85°C) TQFP 48 JESD97 Classification E3 AT32UC3L0128 QFN 48 TLLGA 48 JESD97 Classification E4 79 32145BS–01/2012 AT32UC3L0128/256 10. Errata 10.1 10.1.1 Rev. C SCIF 1. The RC32K output on PA20 is not always permanently disabled The RC32K output on PA20 may sometimes re-appear. Fix/Workaround Before using RC32K for other purposes, the following procedure has to be followed in order to properly disable it: - Run the CPU on RCSYS - Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT - Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as one - Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as zero. 2. PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 3. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any location in the SCIF memory range. Fix/Workaround None. 10.1.2 SPI 1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 2. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 3. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 80 32145BS–01/2012 AT32UC3L0128/256 4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 5. SPI mode fault detection enable causes incorrect behavior When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate properly. Fix/Workaround Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS. 6. SPI RDR.PCS is not correct The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not correctly indicate the value on the NPCS pins at the end of a transfer. Fix/Workaround Do not use the PCS field of the SPI RDR. 10.1.3 TWI 1. SMBALERT bit may be set after reset The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after system reset. Fix/Workaround After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer. 2. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 10.1.4 TC 1. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 10.1.5 CAT 1. CAT QMatrix sense capacitors discharged prematurely At the end of a QMatrix burst charging sequence that uses different burst count values for different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the periph81 32145BS–01/2012 AT32UC3L0128/256 eral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency. This results in premature loss of charge from the sense capacitors and thus increased variability of the acquired count values. Fix/Workaround Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11, 13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register. 2. Autonomous CAT acquisition must be longer than AST source clock period When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST source clock is larger than one CAT acquisition. One AST clock period after the AST trigger, the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely, ruining the result. Fix/Workaround Always ensure that the ATCFG1.max field is set so that the duration of the autonomous touch acquisition is greater than one clock period of the AST source clock. 10.1.6 aWire 1. aWire MEMORY_SPEED_REQUEST command does not return correct CV The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to the formula in the aWire Debug Interface chapter. Fix/Workaround Issue a dummy read to address 0x100000000 before issuing the MEMORY_SPEED_REQUEST command and use this formula instead: 7f aw f sab = ----------------CV – 3 10.2 10.2.1 Rev. B SCIF 1. The RC32K output on PA20 is not always permanently disabled The RC32K output on PA20 may sometimes re-appear. Fix/Workaround Before using RC32K for other purposes, the following procedure has to be followed in order to properly disable it: - Run the CPU on RCSYS - Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT - Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as one - Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as zero. 2. PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 3. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature 82 32145BS–01/2012 AT32UC3L0128/256 The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any location in the SCIF memory range. Fix/Workaround None. 10.2.2 WDT 1. WDT Control Register does not have synchronization feedback When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN), Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization takes a finite amount of time, but only the status of the synchronization of the EN bit is reflected back to the user. Writing to the synchronized fields during synchronization can lead to undefined behavior. Fix/Workaround -When writing to the affected fields, the user must ensure a wait corresponding to 2 clock cycles of both the WDT peripheral bus clock and the selected WDT clock source. -When doing writes that changes the EN bit, the EN bit can be read back until it reflects the written value. 10.2.3 SPI 1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 2. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 3. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 5. SPI mode fault detection enable causes incorrect behavior When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate 83 32145BS–01/2012 AT32UC3L0128/256 properly. Fix/Workaround Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS. 6. SPI RDR.PCS is not correct The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not correctly indicate the value on the NPCS pins at the end of a transfer. Fix/Workaround Do not use the PCS field of the SPI RDR. 10.2.4 TWI 1. TWIS may not wake the device from sleep mode If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed. Fix/Workaround When using the TWI address match to wake the device from sleep, do not switch to sleep modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus events. 2. SMBALERT bit may be set after reset The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after system reset. Fix/Workaround After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer. 3. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 10.2.5 PWMA 1. The SR.READY bit cannot be cleared by writing to SCR.READY The Ready bit in the Status Register will not be cleared when writing a one to the corresponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is set. Fix/Workaround Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Status Register before enabling the interrupt. 10.2.6 TC 1. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround 84 32145BS–01/2012 AT32UC3L0128/256 Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 10.2.7 CAT 1. CAT QMatrix sense capacitors discharged prematurely At the end of a QMatrix burst charging sequence that uses different burst count values for different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the peripheral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency. This results in premature loss of charge from the sense capacitors and thus increased variability of the acquired count values. Fix/Workaround Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11, 13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register. 2. Autonomous CAT acquisition must be longer than AST source clock period When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST source clock is larger than one CAT acquisition. One AST clock period after the AST trigger, the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely, ruining the result. Fix/Workaround Always ensure that the ATCFG1.max field is set so that the duration of the autonomous touch acquisition is greater than one clock period of the AST source clock. 3. CAT consumes unnecessary power when disabled or when autonomous touch not used A CAT prescaler controlled by the ATCFG0.DIV field will be active even when the CAT module is disabled or when the autonomous touch feature is not used, thereby causing unnecessary power consumption. Fix/Workaround If the CAT module is not used, disable the CLK_CAT clock in the PM module. If the CAT module is used but the autonomous touch feature is not used, the power consumption of the CAT module may be reduced by writing 0xFFFF to the ATCFG0.DIV field. 10.2.8 aWire 1. aWire MEMORY_SPEED_REQUEST command does not return correct CV The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to the formula in the aWire Debug Interface chapter. Fix/Workaround Issue a dummy read to address 0x100000000 before issuing the MEMORY_SPEED_REQUEST command and use this formula instead: 7f aw f sab = ----------------CV – 3 85 32145BS–01/2012 AT32UC3L0128/256 10.3 10.3.1 Rev. A Device 1. JTAGID is wrong The JTAGID is 0x021DF03F. Fix/Workaround None. 10.3.2 FLASHCDW 1. General-purpose fuse programming does not work The general-purpose fuses cannot be programmed and are stuck at 1. Please refer to the Fuse Settings chapter in the FLASHCDW for more information about what functions are affected. Fix/Workaround None. 2. Set Security Bit command does not work The Set Security Bit (SSB) command of the FLASHCDW does not work. The device cannot be locked from external JTAG, aWire, or other debug accesses. Fix/Workaround None. 3. Flash programming time is longer than specified The flash programming time is now: Table 10-1. Flash Characteristics Symbol Parameter TFPP Page programming time TFPE Page erase time TFFP Fuse programming time TFEA Full chip erase time (EA) TFCE JTAG chip erase time (CHIP_ERASE) Conditions Min Typ Max Unit 7.5 7.5 fCLK_HSB= 50MHz 1 ms 9 fCLK_HSB= 115kHz 250 Fix/Workaround None. 10.3.3 Power Manager 1. Clock Failure Detector (CFD) can be issued while turning off the CFD While turning off the CFD, the CFD bit in the Status Register (SR) can be set. This will change the main clock source to RCSYS. Fix/Workaround Solution 1: Enable CFD interrupt. If CFD interrupt is issues after turning off the CFD, switch back to original main clock source. Solution 2: Only turn off the CFD while running the main clock on RCSYS. 2. Sleepwalking in idle and frozen sleep mode will mask all other PB clocks 86 32145BS–01/2012 AT32UC3L0128/256 If the CPU is in idle or frozen sleep mode and a module is in a state that triggers sleep walking, all PB clocks will be masked except the PB clock to the sleepwalking module. Fix/Workaround Mask all clock requests in the PM.PPCR register before going into idle or frozen mode. 2. Unused PB clocks are running Three unused PBA clocks are enabled by default and will cause increased active power consumption. Fix/Workaround Disable the clocks by writing zeroes to bits [27:25] in the PBA clock mask register. 10.3.4 SCIF 1. The RC32K output on PA20 is not always permanently disabled The RC32K output on PA20 may sometimes re-appear. Fix/Workaround Before using RC32K for other purposes, the following procedure has to be followed in order to properly disable it: - Run the CPU on RCSYS - Disable the output to PA20 by writing a zero to PM.PPCR.RC32OUT - Enable RC32K by writing a one to SCIF.RC32KCR.EN, and wait for this bit to be read as one - Disable RC32K by writing a zero to SCIF.RC32KCR.EN, and wait for this bit to be read as zero. 2. PLL lock might not clear after disable Under certain circumstances, the lock signal from the Phase Locked Loop (PLL) oscillator may not go back to zero after the PLL oscillator has been disabled. This can cause the propagation of clock signals with the wrong frequency to parts of the system that use the PLL clock. Fix/Workaround PLL must be turned off before entering STOP, DEEPSTOP or STATIC sleep modes. If PLL has been turned off, a delay of 30us must be observed after the PLL has been enabled again before the SCIF.PLL0LOCK bit can be used as a valid indication that the PLL is locked. 3. PLLCOUNT value larger than zero can cause PLLEN glitch Initializing the PLLCOUNT with a value greater than zero creates a glitch on the PLLEN signal during asynchronous wake up. Fix/Workaround The lock-masking mechanism for the PLL should not be used. The PLLCOUNT field of the PLL Control Register should always be written to zero. 4. RCSYS is not calibrated The RCSYS is not calibrated and will run faster than 115.2kHz. Frequencies around 150kHz can be expected. Fix/Workaround If a known clock source is available the RCSYS can be runtime calibrated by using the frequency meter (FREQM) and tuning the RCSYS by writing to the RCCR register in SCIF. 5. Writing 0x5A5A5A5A to the SCIF memory range will enable the SCIF UNLOCK feature The SCIF UNLOCK feature will be enabled if the value 0x5A5A5A5A is written to any location in the SCIF memory range. Fix/Workaround 87 32145BS–01/2012 AT32UC3L0128/256 None. 10.3.5 WDT 1. Clearing the Watchdog Timer (WDT) counter in second half of timeout period will issue a Watchdog reset If the WDT counter is cleared in the second half of the timeout period, the WDT will immediately issue a Watchdog reset. Fix/Workaround Use twice as long timeout period as needed and clear the WDT counter within the first half of the timeout period. If the WDT counter is cleared after the first half of the timeout period, you will get a Watchdog reset immediately. If the WDT counter is not cleared at all, the time before the reset will be twice as long as needed. 2. WDT Control Register does not have synchronization feedback When writing to the Timeout Prescale Select (PSEL), Time Ban Prescale Select (TBAN), Enable (EN), or WDT Mode (MODE) fieldss of the WDT Control Register (CTRL), a synchronizer is started to propagate the values to the WDT clcok domain. This synchronization takes a finite amount of time, but only the status of the synchronization of the EN bit is reflected back to the user. Writing to the synchronized fields during synchronization can lead to undefined behavior. Fix/Workaround -When writing to the affected fields, the user must ensure a wait corresponding to 2 clock cycles of both the WDT peripheral bus clock and the selected WDT clock source. -When doing writes that changes the EN bit, the EN bit can be read back until it reflects the written value. 10.3.6 GPIO 1. Clearing Interrupt flags can mask other interrupts When clearing interrupt flags in a GPIO port, interrupts on other pins of that port, happening in the same clock cycle will not be registered. Fix/Workaround Read the PVR register of the port before and after clearing the interrupt to see if any pin change has happened while clearing the interrupt. If any change occurred in the PVR between the reads, they must be treated as an interrupt. 10.3.7 SPI 1. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 2. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 88 32145BS–01/2012 AT32UC3L0128/256 3. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 4. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 5. SPI mode fault detection enable causes incorrect behavior When mode fault detection is enabled (MR.MODFDIS==0), the SPI module may not operate properly. Fix/Workaround Always disable mode fault detection before using the SPI by writing a one to MR.MODFDIS. 6. SPI RDR.PCS is not correct The PCS (Peripheral Chip Select) field in the SPI RDR (Receive Data Register) does not correctly indicate the value on the NPCS pins at the end of a transfer. Fix/Workaround Do not use the PCS field of the SPI RDR. 10.3.8 TWI 1. TWIS may not wake the device from sleep mode If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed. Fix/Workaround When using the TWI address match to wake the device from sleep, do not switch to sleep modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus events. 2. SMBALERT bit may be set after reset The SMBus Alert (SMBALERT) bit in the Status Register (SR) might be erroneously set after system reset. Fix/Workaround After system reset, clear the SR.SMBALERT bit before commencing any TWI transfer. 3. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 4. TWIS stretch on Address match error 89 32145BS–01/2012 AT32UC3L0128/256 When the TWIS stretches TWCK due to a slave address match, it also holds TWD low for the same duration if it is to be receiving data. When TWIS releases TWCK, it releases TWD at the same time. This can cause a TWI timing violation. Fix/Workaround None. 5. TWIM TWALM polarity is wrong The TWALM signal in the TWIM is active high instead of active low. Fix/Workaround Use an external inverter to invert the signal going into the TWIM. When using both TWIM and TWIS on the same pins, the TWALM cannot be used. 10.3.9 PWMA 1. The SR.READY bit cannot be cleared by writing to SCR.READY The Ready bit in the Status Register will not be cleared when writing a one to the corresponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is set. Fix/Workaround Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Status Register before enabling the interrupt. 10.3.10 TC 1. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 10.3.11 ADCIFB 1. ADCIFB DMA transfer does not work with divided PBA clock DMA requests from the ADCIFB will not be performed when the PBA clock is slower than the HSB clock. Fix/Workaround Do not use divided PBA clock when the PDCA transfers from the ADCIFB. 10.3.12 CAT 1. CAT QMatrix sense capacitors discharged prematurely At the end of a QMatrix burst charging sequence that uses different burst count values for different Y lines, the Y lines may be incorrectly grounded for up to n-1 periods of the peripheral bus clock, where n is the ratio of the PB clock frequency to the GCLK_CAT frequency. This results in premature loss of charge from the sense capacitors and thus increased variability of the acquired count values. Fix/Workaround Enable the 1kOhm drive resistors on all implemented QMatrix Y lines (CSA 1, 3, 5, 7, 9, 11, 13, and/or 15) by writing ones to the corresponding odd bits of the CSARES register. 90 32145BS–01/2012 AT32UC3L0128/256 2. Autonomous CAT acquisition must be longer than AST source clock period When using the AST to trigger CAT autonomous touch acquisition in sleep modes where the CAT bus clock is turned off, the CAT will start several acquisitions if the period of the AST source clock is larger than one CAT acquisition. One AST clock period after the AST trigger, the CAT clock will automatically stop and the CAT acquisition can be stopped prematurely, ruining the result. Fix/Workaround Always ensure that the ATCFG1.max field is set so that the duration of the autonomous touch acquisition is greater than one clock period of the AST source clock. 3. CAT consumes unnecessary power when disabled or when autonomous touch not used A CAT prescaler controlled by the ATCFG0.DIV field will be active even when the CAT module is disabled or when the autonomous touch feature is not used, thereby causing unnecessary power consumption. Fix/Workaround If the CAT module is not used, disable the CLK_CAT clock in the PM module. If the CAT module is used but the autonomous touch feature is not used, the power consumption of the CAT module may be reduced by writing 0xFFFF to the ATCFG0.DIV field. 4. CAT module does not terminate QTouch burst on detect The CAT module does not terminate a QTouch burst when the detection voltage is reached on the sense capacitor. This can cause the sense capacitor to be charged more than necessary. Depending on the dielectric absorption characteristics of the capacitor, this can lead to unstable measurements. Fix/Workaround Use the minimum possible value for the MAX field in the ATCFG1, TG0CFG1, and TG1CFG1 registers. 10.3.13 aWire 1. aWire MEMORY_SPEED_REQUEST command does not return correct CV The aWire MEMORY_SPEED_REQUEST command does not return a CV corresponding to the formula in the aWire Debug Interface chapter. Fix/Workaround Issue a dummy read to address 0x100000000 before issuing the MEMORY_SPEED_REQUEST command and use this formula instead: 7f aw f sab = ----------------CV – 3 10.3.14 I/O Pins 1. PA05 is not 3.3V tolerant. PA05 should be grounded on the PCB and left unused if VDDIO is above 1.8V. Fix/Workaround None. 2. No pull-up on pins that are not bonded PB13 to PB27 are not bonded on UC3L0256/128, but has no pull-up and can cause current consumption on VDDIO/VDDIN if left undriven. Fix/Workaround 91 32145BS–01/2012 AT32UC3L0128/256 Enable pull-ups on PB13 to PB27 by writing 0x0FFFE000 to the PUERS1 register in the GPIO. 3. PA17 has low ESD tolerance PA17 only tolerates 500V ESD pulses (Human Body Model). Fix/Workaround Care must be taken during manufacturing and PCB design. 92 32145BS–01/2012 AT32UC3L0128/256 11. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 11.1 11.2 Rev. B – 01/2012 1. Description: DFLL frequency is 20 to 150MHz, not 40 to 150MHz. 2. Description: “One touch sensor can be configured to operate autonomously...” replaced by “All touch sensors can be configured to operate autonomously...”. 3. Block Diagram: GCLK_IN is input, not output, and is 2 bits wide (GCLK_IN[1..0]). CAT SMP corrected from I/O to output. SPI NPCS corrected from output to I/O. 4. Package and Pinout: PRND signal removed from Signal Descriptions List table and GPIO Controller Function Multiplexing table. 5. Supply and Startup Considerations: In 1.8V single supply mode figure, the input voltage is 1.62-1.98V, not 1.98-3.6V. “On system start-up, the DFLL is disabled” is replaced by “On system start-up, all high-speed clocks are disabled”. 6. ADCIFB: PRND signal removed from block diagram. 7. Electrical Characteristics: Added PLL source clock in the Clock Frequencies table in the Maximum Clock Frequencies section. Removed 64-pin package information from I/O Pin Characteristics tables and Digital Clock Characteristics table. 8. Electrical Characteristics: Removed USB Transceiver Characteristics, as the device contains no USB. 9. Mechanical Characteristics: Added notes to package drawings. 10. Summary: Removed Programming and Debugging chapter, added Processor and Architecture chapter. 11. Datasheet Revision History: Corrected release date for datasheet rev. A; the correct date is 12/2011. Rev. A – 12/2011 1. Initial revision. 93 32145BS–01/2012 AT32UC3L0128/256 Table of Contents Features ..................................................................................................... 1 1 Description ............................................................................................... 3 2 Overview ................................................................................................... 5 3 4 5 6 7 2.1 Block Diagram ...................................................................................................5 2.2 Configuration Summary .....................................................................................6 Package and Pinout ................................................................................. 7 3.1 Package .............................................................................................................7 3.2 Peripheral Multiplexing on I/O Lines ..................................................................8 3.3 Signal Descriptions ..........................................................................................13 3.4 I/O Line Considerations ...................................................................................16 Processor and Architecture .................................................................. 18 4.1 Features ..........................................................................................................18 4.2 AVR32 Architecture .........................................................................................18 4.3 The AVR32UC CPU ........................................................................................19 4.4 Programming Model ........................................................................................23 4.5 Exceptions and Interrupts ................................................................................27 Memories ................................................................................................ 32 5.1 Embedded Memories ......................................................................................32 5.2 Physical Memory Map .....................................................................................32 5.3 Peripheral Address Map ..................................................................................33 5.4 CPU Local Bus Mapping .................................................................................34 Supply and Startup Considerations ..................................................... 36 6.1 Supply Considerations .....................................................................................36 6.2 Startup Considerations ....................................................................................40 Electrical Characteristics ...................................................................... 41 7.1 Absolute Maximum Ratings* ...........................................................................41 7.2 Supply Characteristics .....................................................................................41 7.3 Maximum Clock Frequencies ..........................................................................42 7.4 Power Consumption ........................................................................................42 7.5 I/O Pin Characteristics .....................................................................................46 7.6 Oscillator Characteristics .................................................................................49 7.7 Flash Characteristics .......................................................................................54 i 32145BS–01/2012 AT32UC3L0128/256 8 9 7.8 Analog Characteristics .....................................................................................55 7.9 Timing Characteristics .....................................................................................64 Mechanical Characteristics ................................................................... 74 8.1 Thermal Considerations ..................................................................................74 8.2 Package Drawings ...........................................................................................75 8.3 Soldering Profile ..............................................................................................78 Ordering Information ............................................................................. 79 10 Errata ....................................................................................................... 80 10.1 Rev. C ..............................................................................................................80 10.2 Rev. B ..............................................................................................................82 10.3 Rev. A ..............................................................................................................86 11 Datasheet Revision History .................................................................. 93 11.1 Rev. B – 01/2012 .............................................................................................93 11.2 Rev. A – 12/2011 .............................................................................................93 Table of Contents....................................................................................... i ii 32145BS–01/2012 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 16F, Shin Osaki Kangyo Bldg. 1-6-4 Osaka Shinagawa-ku Tokyo 104-0032 JAPAN Tel: (+81) 3-6417-0300 Fax: (+81) 3-6417-0370 © 2012 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, AVR ®, picoPower ®, QTouch ®, AKS ® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. 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