TI1 ADS1278SHKP Octal simultaneous-sampling 24-bit analog-to-digital converter Datasheet

ADS1278-HT
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SBAS447C – MARCH 2009 – REVISED AUGUST 2012
OCTAL SIMULTANEOUS-SAMPLING 24-BIT ANALOG-TO-DIGITAL CONVERTER
Check for Samples: ADS1278-HT
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
1
23
•
•
•
•
•
•
•
•
•
•
Simultaneously Measure Eight Channels
Up to 128-kSPS Data Rate
AC Performance:
62-kHz Bandwidth
111-dB SNR (High-Resolution Mode)
–108-dB THD
DC Accuracy:
0.8-μV/°C Offset Drift
1.3-ppm/°C Gain Drift
Selectable Operating Modes:
High-Speed: 128 kSPS, 106 dB SNR
High-Resolution: 52 kSPS, 111 dB SNR
Low-Power: 52 kSPS, 31 mW/ch
Low-Speed: 10 kSPS, 7 mW/ch
Linear Phase Digital Filter
SPI™ or Frame-Sync Serial Interface
Low Sampling Aperture Error
Modulator Output Option (digital filter bypass)
Analog Supply: 5 V
Digital Core: 1.8 V
I/O Supply: 1.8 V to 3.3 V
Currently Available in an 84-Pin HFQ Package
and a KGD Chiptray Option
SUPPORTS EXTREME TEMPERATURE
APPLICATIONS
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Extreme (–55°C/210°C)
Temperature Range (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
Texas Instruments High Temperature Products
Utilize Highly Optimized Silicon (Die) Solutions
With Dsign and Process Enhancements to
Maximize Performance Over Extended
Temperatures
Down-Hole Drilling
High Temperature Environments
Vibration/Modal Analysis
Multi-Channel Data Acquisition
Acoustics/Dynamic Strain Gauges
Pressure Sensors
DESCRIPTION
Based on the single-channel ADS1271, the ADS1278
(octal) is a 24-bit, delta-sigma (ΔΣ) analog-to-digital
converter (ADC) with data rates up to 128 k samples
per second (SPS), allowing simultaneous sampling of
eight channels.
Traditionally, industrial delta-sigma ADCs offering
good drift performance use digital filters with large
passband droop. As a result, they have limited signal
bandwidth and are mostly suited for dc
measurements. High-resolution ADCs in audio
applications offer larger usable bandwidths, but the
offset and drift specifications are significantly weaker
than respective industrial counterparts. The ADS1278
combines these types of converters, allowing highprecision industrial measurement with excellent dc
and ac specifications.
The
high-order,
chopper-stabilized
modulator
achieves very low drift with low in-band noise. The
onboard decimation filter suppresses modulator and
signal out-of-band noise. These ADCs provide a
usable signal bandwidth up to 90% of the Nyquist
rate with less than 0.005 dB of ripple.
Four operating modes allow for optimization of speed,
resolution, and power. All operations are controlled
directly by pins; there are no registers to program.
The device is fully specified over the extended
industrial range (–55°C to 210°C) and is available in
an 84-pin HFQ package and a KGD chiptray option.
Custom temperature ranges available
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2012, Texas Instruments Incorporated
ADS1278-HT
SBAS447C – MARCH 2009 – REVISED AUGUST 2012
www.ti.com
VREFP VREFN AVDD
Input1
DS
Input2
DS
Input3
DS
Input4
DS
Input5
DS
Input6
DS
Input7
DS
Input8
DS
AGND
DVDD
IOVDD
SPI
and
FrameSync
Interface
DRDY/FSYNC
SCLK
DOUT[8:1]
DIN
Control
Logic
TEST[1:0]
FORMAT[2:0]
CLK
SYNC
PWDN[8:1]
CLKDIV
MODE[1:0]
Eight
Digital
Filters
DGND
ADS1278
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION (1)
TA
–55°C to 210°C
(1)
(2)
2
PACKAGE (2)
ORDERABLE PART NUMBER
HFQ
ADS1278SHFQ
HKP
ADS1278SHKP
CHIPTRAY (bare die)
ADS1278SKGDA
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
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SBAS447C – MARCH 2009 – REVISED AUGUST 2012
PIN OUT
HFQ OR HKP PACKAGE
(TOP VIEW)
21 20 19 18 17 16 15 14 13 12 11 10 9 8
7
6
5 4
3
2
1
22
84
23
83
24
82
25
81
26
80
27
79
28
78
29
77
30
76
31
75
32
74
33
73
34
72
35
71
36
70
37
69
38
68
39
67
40
66
41
65
42
64
43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63
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BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
15 mils
Silicon with backgrind
GND
AlCu
Origin
a
c
b
d
Table 2. Bond Pad Coordinates in Microns - Rev A (1)
(1)
4
DISCRIPTION
PAD NUMBER
a
b
c
d
Do not connect
1
5.00
4455.65
70.00
4520.65
AINP2
2
5.00
4355.65
70.00
4420.65
AINN2
3
5.00
4255.65
70.00
4320.65
Do not connect
4
5.00
4155.65
70.00
4220.65
Do not connect
5
5.00
4038.30
70.00
4103.30
AINP1
6
5.00
3938.30
70.00
4003.30
AINN1
7
5.00
3838.30
70.00
3903.30
Do not connect
8
5.00
3738.30
70.00
3803.30
AVDD
9
5.00
3373.30
70.00
3678.30
AGND
10
5.00
3033.30
70.00
3338.30
Do not connect
11
5.00
2853.30
70.00
2998.30
DGND
12
5.00
1911.65
70.00
1976.65
TEST0
13
5.00
1760.45
70.00
1825.45
Do not connect
14
5.00
1648.95
70.00
1713.95
TEST1
15
5.00
1536.60
70.00
1601.60
CLKDIV
16
5.00
1385.40
70.00
1450.40
SYNC
17
5.00
1234.20
70.00
1299.20
DIN
18
5.00
1083.00
70.00
1148.00
DOUT8
19
5.00
780.60
70.00
845.60
DOUT7
20
5.00
629.40
70.00
694.40
DOUT6
21
5.00
478.20
70.00
543.20
DOUT5
22
5.00
275.80
70.00
340.80
DOUT4
23
275.80
5.00
340.80
70.00
DOUT3
24
745.40
5.00
810.40
70.00
DOUT2
25
1099.30
5.00
1164.30
70.00
DOUT1
26
1250.50
5.00
1315.50
70.00
DGND
27
1525.25
5.00
1590.25
70.00
IOVDD
28
1691.00
5.00
1756.00
70.00
IOVDD
29
1842.20
5.00
1907.20
70.00
For signal descriptions see the Pin Descriptions table.
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SBAS447C – MARCH 2009 – REVISED AUGUST 2012
Table 2. Bond Pad Coordinates in Microns - Rev A(1) (continued)
DISCRIPTION
PAD NUMBER
a
b
c
d
IOVDD
30
2068.10
5.00
2133.10
70.00
IOVDD
31
2292.45
5.00
2597.45
70.00
DGND
32
2632.45
5.00
2697.45
70.00
DGND
33
2732.45
5.00
3277.45
70.00
DGND
34
3312.45
5.00
3457.45
70.00
DVDD
35
3492.45
5.00
3797.45
70.00
CLK
36
3869.40
5.00
3934.40
70.00
SCLK
37
4201.90
5.00
4266.90
70.00
DRDY/FSYNC
38
4423.90
5.00
4488.90
70.00
FORMAT2
39
4866.90
5.00
4931.90
70.00
FORMAT1
40
5199.40
5.00
5264.40
70.00
FORMAT0
41
5669.00
5.00
5734.00
70.00
MODE1
42
5939.80
275.80
6004.80
340.80
MODE0
43
5939.80
478.20
6004.80
543.20
PWDN8
44
5939.80
629.40
6004.80
694.40
PWDN7
45
5939.80
780.60
6004.80
845.60
PWDN6
46
5939.80
1083.00
6004.80
1148.00
PWDN5
47
5939.80
1234.20
6004.80
1299.20
PWDN4
48
5939.80
1385.40
6004.80
1450.40
PWDN3
49
5939.80
1536.60
6004.80
1601.60
Do not connect
50
5939.80
1648.95
6004.80
1713.95
PWDN2
51
5939.80
1760.45
6004.80
1825.45
PWDN1
52
5939.80
1911.65
6004.80
1976.65
Do not connect
53
5939.80
2853.30
6004.80
2998.30
AGND
54
5939.80
3033.30
6004.80
3338.30
AVDD
55
5939.80
3373.30
6004.80
3678.30
Do not connect
56
5939.80
3738.30
6004.80
3803.30
AINP8
57
5939.80
3838.30
6004.80
3903.30
AINN8
58
5939.80
3938.30
6004.80
4003.30
Do not connect
59
5939.80
4038.30
6004.80
4103.30
Do not connect
60
5939.80
4155.65
6004.80
4220.65
AINP7
61
5939.80
4255.65
6004.80
4320.65
AINN7
62
5939.80
4355.65
6004.80
4420.65
Do not connect
63
5939.80
4455.65
6004.80
4520.65
Do not connect
64
5664.20
4726.45
5729.20
4791.45
AINP6
65
5564.20
4726.45
5629.20
4791.45
AINN6
66
5464.20
4726.45
5529.20
4791.45
Do not connect
67
5364.20
4726.45
5429.20
4791.45
Do not connect
68
4925.95
4726.45
4990.95
4791.45
AINP5
69
4825.95
4726.45
4890.95
4791.45
AINN5
70
4725.95
4726.45
4790.95
4791.45
Do not connect
71
4625.95
4726.45
4690.95
4791.45
AVDD
72
4337.40
4726.45
4402.40
4791.45
AVDD
73
4077.40
4726.45
4302.40
4791.45
AGND
74
3817.40
4726.45
4042.40
4791.45
Do not connect
75
3717.40
4726.45
3782.40
4791.45
VCOM
76
3617.40
4726.45
3682.40
4791.45
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Table 2. Bond Pad Coordinates in Microns - Rev A(1) (continued)
6
DISCRIPTION
PAD NUMBER
a
b
c
d
Do not connect
77
3517.40
4726.45
3582.40
4791.45
VCOM
78
3417.40
4726.45
3482.40
4791.45
Do not connect
79
3317.40
4726.45
3382.40
4791.45
VREFP
80
3022.40
4726.45
3247.40
4791.45
VREFN
81
2762.40
4726.45
2987.40
4791.45
AGND
82
2537.40
4726.45
2602.40
4791.45
AGND
83
2277.40
4726.45
2502.40
4791.45
AGND
84
1967.40
4726.45
2192.40
4791.45
AVDD
85
1707.40
4726.45
1932.40
4791.45
AVDD
86
1607.40
4726.45
1672.40
4791.45
Do not connect
87
1318.85
4726.45
1383.85
4791.45
AINP4
88
1218.85
4726.45
1283.85
4791.45
AINN4
89
1118.85
4726.45
1183.85
4791.45
Do not connect
90
1018.85
4726.45
1083.85
4791.45
Do not connect
91
580.60
4726.45
645.60
4791.45
AINP3
92
480.60
4726.45
545.60
4791.45
AINN3
93
380.60
4726.45
445.60
4791.45
Do not connect
94
280.60
4726.45
345.60
4791.45
Do not connect
95
5939.80
377.00
6004.80
442.00
Do not connect
96
5939.80
175.80
6004.80
240.80
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-
-
SBAS447C – MARCH 2009 – REVISED AUGUST 2012
-
www.ti.com
-
-
-
-
-
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ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range, unless otherwise noted (1)
UNIT
AVDD to AGND
–0.3 to 6.0
V
DVDD, IOVDD to DGND
–0.3 to 3.6
V
AGND to DGND
–0.3 to 0.3
V
100
mA
Momentary
Input current
10
mA
Analog input to AGND
–0.3 to AVDD + 0.3
V
Digital input or output to DGND
–0.3 to DVDD + 0.3
V
Operating temperature range
–55 to 210
°C
Storage temperature range
–60 to 150
°C
(1)
Continuous
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
ELECTRICAL CHARACTERISTICS
All specifications at TA = –55°C to 210°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
TA = 210°C (1)
TA = –55°C to 125°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
AVDD +
0.1
AGND –
0.1
TYP
MAX
UNIT
Analog Inputs
Full-scale input voltage (FSR (2))
VIN = (AINP – AINN)
Absolute input voltage
AINP or AINN to AGND
Common-mode input voltage (VCM)
VCM = (AINP + AINN)/2
Differential input
impedance
±VREF
AGND –
0.1
±VREF
V
AVDD +
0.1
V
2.5
2.5
V
High-Speed mode
14
14
kΩ
High-Resolution mode
14
14
kΩ
Low-Power mode
28
28
kΩ
Low-Speed mode
140
140
kΩ
fCLK = 32.768MHz (3)
128,000
128,000
SPS
fCLK = 27MHz
DC Performance
Resolution
No missing codes
High-Speed mode
Data rate (fDATA)
24
Bits
105,469
105,469
SPS (4)
High-Resolution mode
52,734
52,734
SPS
Low-Power mode
52,734
52,734
SPS
Low-Speed mode
10,547
10,547
SPS
Integral nonlinearity (INL)
(5)
Differential input, VCM =
2.5V
±0.0003
±0.0012
±0.0014
Offset error
0.25
2
2
Offset drift
0.8
Gain error
0.1
Gain drift
1.3
Noise
(2)
(3)
(4)
(5)
8
mV
μV/°C
0.5
0.5
% FSR
ppm/°C
High-Speed mode
Shorted input
8.5
21
21
μV, rms
High-Resolution mode
Shorted input
5.5
13
13
μV, rms
Low-Power mode
Shorted input
8.5
21
21
μV, rms
Low-Speed mode
Shorted input
8.0
21
21
μV, rms
Common-mode rejection
(1)
% FSR (2)
fCM = 60Hz
90
108
90
dB
Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature.
Production test limits with statistical guardbands are used to ensure high temperature performance.
FSR = full-scale range = 2VREF.
fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to FrameSync mode and VREF ≤ 2.6V.
SPS = samples per second.
Best fit method.
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ELECTRICAL CHARACTERISTICS (continued)
All specifications at TA = –55°C to 210°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
TA = 210°C (1)
TA = –55°C to 125°C
PARAMETER
TEST CONDITIONS
MIN
AVDD
Power-supply
rejection
DVDD
fPS = 60Hz
IOVDD
VCOM output voltage
No load
TYP
MAX
MIN
TYP
MAX
UNIT
80
80
dB
85
85
dB
105
102
dB
AVDD/2
AVDD/2
V
AC Performance
f = 1kHz, –0.5dBFS (6)
Crosstalk
High-Speed mode
Signal-to-noise
ratio (SNR) (7)
(unweighted)
High-Resolution mode
VREF = 2.5V
–107
106
96
dB
101
110
101
dB
VREF = 3V
111
98
106
97
Low-Speed mode
98
107
98
VIN = 1kHz, –0.5dBFS
–108
Spurious-free dynamic range
Passband ripple
Passband
–3dB Bandwidth
High-Resolution mode
Settling time
(latency)
dB
dB
–96
-96
All other modes
dB
109
dB
±0.005
dB
0.453
fDATA
Hz
0.49 fDATA
Hz
95
dB
100
High-Resolution mode
0.547
fDATA
127.453
fDATA
Hz
All other modes
0.547
fDATA
63.453
fDATA
Hz
Stop band
Group delay
dB
Low-Power mode
Total harmonic distortion (THD) (8)
Stop band
attenuation
dB
98
High-Resolution mode
39/fDATA
s
All other modes
38/fDATA
s
High-Resolution mode
Complete settling
78/fDATA
s
All other modes
Complete settling
76/fDATA
s
Voltage Reference Inputs
fCLK = 27MHz
0.5
2.5
3.1
0.5
2.5
3.1
V
fCLK = 32.768MHz (9)
0.5
2.5
2.6
0.5
2.5
2.6
V
Negative reference input (VREFN)
AGND –
0.1
AGND +
0.1
AGND –
0.1
AGND +
0.1
V
Positive reference input (VREFP)
VREFN +
0.5
AVDD +
0.1
VREFN +
0.5
AVDD +
0.1
V
Reference input voltage (VREF)
(VREF = VREFP – VREFN)
Reference Input
impedance
High-Speed mode
0.65
0.65
kΩ
High-Resolution mode
0.65
0.65
kΩ
Low-Power mode
1.3
1.3
kΩ
Low-Speed mode
6.5
6.5
kΩ
Digital Input/Output (IOVDD = 1.8V to
3.6V)
VIH
0.7
IOVDD
IOVDD
0.7
IOVDD
IOVDD
V
VIL
DGND
0.3
IOVDD
DGND
0.3
IOVDD
V
VOH
IOH = 4mA
0.8
IOVDD
IOVDD
0.8
IOVDD
IOVDD
V
VOL
IOL = 4mA
DGND
0.2
IOVDD
DGND
0.2
IOVDD
V
(6)
(7)
(8)
(9)
Worst-case channel crosstalk between one or more channels.
Minimum SNR is ensured by the limit of the DC noise specification.
THD includes the first nine harmonics of the input signal; Low-Speed mode includes the first five harmonics.
fCLK = 32.768MHz max for High-Speed mode, and 27MHz max for all other modes. When fCLK > 27MHz, operation is limited to FrameSync mode and VREF ≤ 2.6V.
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ELECTRICAL CHARACTERISTICS (continued)
All specifications at TA = –55°C to 210°C, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V,
VREFN = 0 V, and all channels active, unless otherwise noted.
TA = 210°C (1)
TA = –55°C to 125°C
PARAMETER
Input leakage
TEST CONDITIONS
MIN
TYP
0 < VIN DIGITAL < IOVDD
Master clock rate (fCLK)
MAX
MIN
TYP
MAX
UNIT
μA
±10
High-Speed mode (9)
0.1
32.768
0.1
32.768
MHz
Other modes
0.1
27
0.1
27
MHz
Power Supply
AVDD
4.75
5
5.25
4.75
5
5.25
V
DVDD
1.65
1.8
1.95
1.65
1.8
1.95
V
IOVDD
1.65
3.6
1.65
Power-down
current
AVDD current
DVDD current
IOVDD current
Power dissipation
3.6
V
AVDD
1
10
65
μA
DVDD
1
50
200
μA
IOVDD
1
11
25
High-Speed mode
97
145
135
185
mA
High-Resolution mode
97
145
135
185
mA
Low-Power mode
44
64
60
84
mA
Low-Speed mode
9
14
12
22
mA
High-Speed mode
23
30
24
31
mA
High-Resolution mode
16
20
17
20
mA
Low-Power mode
12
17
13
17
mA
Low-Speed mode
2.5
4.5
3
5
mA
High-Speed mode
0.25
1
0.3
1.15
mA
High-Resolution mode
0.125
0.6
0.2
0.75
mA
Low-Power mode
0.125
0.6
0.2
0.75
mA
Low-Speed mode
0.035
0.3
0.1
0.45
mA
High-Speed mode
530
785
985
mW
High-Resolution mode
515
765
985
mW
Low-Power mode
245
355
455
mW
Low-Speed mode
50
80
120
mW
μA
PIN DESCRIPTIONS
10
PIN NAME
FUNCTION
AGND
Analog ground
AINP1
Analog input
AINP2
Analog input
AINP3
Analog input
AINP4
Analog input
AINP5
Analog input
AINP6
Analog input
AINP7
Analog input
AINP8
Analog input
DESCRIPTION
Analog ground; connect to DGND using a single plane.
AINP[8:1] Positive analog input, channels 8 through 1.
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PIN DESCRIPTIONS (continued)
PIN NAME
FUNCTION
AINN1
Analog input
AINN2
Analog input
AINN3
Analog input
AINN4
Analog input
AINN5
Analog input
AINN6
Analog input
AINN7
Analog input
DESCRIPTION
AINN[8:1] Negative analog input, channels 8 through 1.
AINN8
Analog input
AVDD
Analog power supply
VCOM
Analog output
VREFN
Analog input
Negative reference input.
VREFP
Analog input
Positive reference input.
CLK
Digital input
Master clock input.
CLKDIV
Digital input
DGND
Digital ground
DIN
Digital input
DOUT1
Digital output
DOUT2
Digital output
DOUT3
Digital output
DOUT4
Digital output
DOUT5
Digital output
DOUT6
Digital output
DOUT7
Digital output
DOUT8
Digital output
DRDY/
FSYNC
Digital input/output
DVDD
Digital power supply
FORMAT0
Digital input
FORMAT1
Digital input
FORMAT2
Digital input
IOVDD
Digital power supply
MODE0
Digital input
MODE1
Digital input
PWDN1
Digital input
PWDN2
Digital input
PWDN3
Digital input
PWDN4
Digital input
PWDN5
Digital input
PWDN6
Digital input
PWDN7
Digital input
Analog power supply (4.75V to 5.25V).
AVDD/2 Unbuffered voltage output.
CLK input divider control:
1 = 32.768MHz (High-Speed mode only) / 27MHz
0 = 13.5MHz (low-power) / 5.4MHz (low-speed)
Digital ground power supply.
Daisy-chain data input.
DOUT1 is TDM data output (TDM mode).
DOUT[8:1] Data output for channels 8 through 1.
Frame-Sync protocol: frame clock input; SPI protocol: data ready output.
Digital core power supply (+1.65V to +1.95V).
FORMAT[2:0] Selects Frame-Sync/SPI protocol, TDM/discrete data outputs, fixed/dynamic
position TDM data, and modulator mode/normal operating mode.
I/O power supply (+1.65V to +3.6V).
MODE[1:0] Selects High-Speed, High-Resolution, Low-Power, or Low-Speed mode operation.
PWDN[8:1] Power-down control for channels 8 through 1.
PWDN8
Digital input
SCLK
Digital input/output
SYNC
Digital input
Synchronize input (all channels).
TEST0
Digital input
TEST[1:0] Test mode select:
TEST1
Digital input
Serial clock input, Modulator clock output.
00 = Normal operation
11 = Test mode
01 = Do not use
10 = Do not use
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TIMING CHARACTERISTICS: SPI FORMAT
tCLK
tCPW
CLK
· · ·
tCPW
tCD
tCONV
DRDY
tSD
tDS
tSCLK
tSPW
SCLK
tSPW
tMSBPD
DOUT
Bit 23 (MSB)
tDOPD
tDOHD
Bit 22
tDIST
Bit 21
tDIHD
DIN
TIMING REQUIREMENTS: SPI FORMAT (1)
For TA = –40°C to 105°C, IOVDD = 1.65 V to 3.6 V, and DVDD = 1.65 V to 1.95 V.
SYMBOL
PARAMETER
tCLK
CLK period (1/fCLK) (2)
37
tCPW
CLK positive or negative pulse width
15
tCONV
Conversion period (1/fDATA)
MIN
(3)
(4)
Falling edge of CLK to falling edge of DRDY
tDS
(4)
Falling edge of DRDY to rising edge of first SCLK to retrieve data
tSD
tSCLK
(5)
tSPW
SCLK period
16
tCLK
0.4
10
tDOPD
(4)
SCLK falling edge to new DOUT valid (propagation delay)
12
ns
tCLK
SCLK falling edge to new DOUT invalid (hold time)
(1)
(2)
(3)
(4)
(5)
(6)
ns
1
SCLK positive or negative pulse width
(6)
tCLK
tCLK
18
(4) (6)
tDIST
ns
ns
1
tDOHD
tDIHD
2560
22
Falling edge of SCLK to rising edge of DRDY
UNIT
ns
DRDY falling edge to DOUT MSB valid (propagation delay)
(4)
MAX
10,000
256
tCD
tMSBPD
TYP
ns
32
ns
New DIN valid to falling edge of SCLK (setup time)
6
ns
Old DIN valid to falling edge of SCLK (hold time)
6
ns
Timing parameters are characerized or guranteed by design for specified temperature but not production tested.
fCLK = 27MHz maximum.
Depends on MODE[1:0] and CLKDIV selection. See Table 8 (fCLK/fDATA).
Load on DRDY and DOUT = 20pF.
For best performance, limit fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc.
tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4ns.
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Figure 1. TIMING CHARACTERISTICS: FRAME-SYNC FORMAT
tCPW
tCLK
CLK
tCPW
tCS
tFRAME
tFPW
tFPW
FSYNC
tFS
tSCLK
tSPW
tSF
SCLK
tSPW
tMSBPD
DOUT
tDOHD
Bit 23 (MSB)
Bit 22
tDIST
tDOPD
Bit 21
tDIHD
DIN
TIMING REQUIREMENTS: FRAME-SYNC FORMAT (1)
For TA = –40°C to 105°C, IOVDD = 1.65 V to 3.6 V, and DVDD = 1.65 V to 1.95 V.
SYMBOL
PARAMETER
MIN
All modes
37
TYP
MAX
UNIT
10,000
ns
tCLK
CLK period (1/fCLK)
tCPW
CLK positive or negative pulse width
tCS
Falling edge of CLK to falling edge of SCLK
tFRAME
Frame period (1/fDATA) (2)
tFPW
FSYNC positive or negative pulse width
1
tSCLK
tFS
Rising edge of FSYNC to rising edge of SCLK
5
ns
tSF
Rising edge of SCLK to rising edge of FSYNC
5
ns
tSCLK
SCLK period (3)
1
tCLK
SCLK positive or negative pulse width
0.4
tCLK
SCLK falling edge to old DOUT invalid (hold time)
10
ns
tSPW
tDOHD
(4)
tDOPD
(5)
(5)
High-Speed mode only
30.5
ns
12
ns
–0.25
0.25
256
2560
tCLK
tCLK
SCLK falling edge to new DOUT valid (propagation delay)
31
ns
tMSBPD
FSYNC rising edge to DOUT MSB valid (propagation delay)
31
ns
tDIST
New DIN valid to falling edge of SCLK (setup time)
6
ns
Old DIN valid to falling edge of SCLK (hold time)
6
ns
tDIHD
(1)
(2)
(3)
(4)
(5)
(4)
Timing parameters are characerized or guranteed by design for specified temperature but not production tested.
Depends on MODE[1:0] and CLKDIV selection. See Table 8 (fCLK/fDATA).
SCLK must be continuously running and limited to ratios of 1, 1/2, 1/4, and 1/8 of fCLK.
tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is >4 ns.
Load on DOUT = 20 pF.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
RθJA
Junction-to-free air thermal resistance
Board mounted, per JESD 51-5 methodology
RθJC
Junction-to-case thermal resistance
MIL-STD-883 test method 1012
TYP
UNIT
21.813
°C/W
0.849
°C/W
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1000000
100000
Hours in Estimated Life
10000
1000
100
10
1
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
Continuous TJ (°C)
Figure 2. ADS1278 Operating Life Derating Chart
Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Sillicon operating life design goal is 10 years at 110°C junction temperature.
14
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TYPICAL CHARACTERISTICS
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
0
OUTPUT SPECTRUM
0
High-Speed Mode
fIN = 1kHz, -0.5dBFS
32,768 Points
-20
-40
-40
Amplitude (dB)
Amplitude (dB)
High-Speed Mode
fIN = 1kHz, -20dBFS
32,768 Points
-20
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
10
100
1k
Frequency (Hz)
10k
100k
10
100
1k
Frequency (Hz)
Figure 3.
NOISE HISTOGRAM
25k
Number of Occurrences
High-Speed Mode
Shorted Input
262,144 Points
-20
-40
Amplitude (dB)
100k
Figure 4.
OUTPUT SPECTRUM
0
10k
-60
-80
-100
-120
-140
High-Speed Mode
Shorted Input
262,144 Points
20k
15k
10k
5k
-160
35
28
21
OUTPUT SPECTRUM
0
High-Resolution Mode
fIN = 1kHz, -0.5dBFS
32,768 Points
-20
High-Resolution Mode
fIN = 1kHz, -20dBFS
32,768 Points
-40
Amplitude (dB)
-40
Amplitude (dB)
14
Figure 6.
OUTPUT SPECTRUM
-20
7
Output (mV)
Figure 5.
0
0
100k
-7
10k
-14
100
1k
Frequency (Hz)
-21
10
-35
1
-28
0
-180
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
10
100
1k
Frequency (Hz)
10k
100k
10
Figure 7.
100
1k
Frequency (Hz)
10k
100k
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
0
NOISE HISTOGRAM
25k
-20
Number of Occurrences
High-Resolution Mode
Shorted Input
262,144 Points
Amplitude (dB)
-40
-60
-80
-100
-120
-140
High-Resolution Mode
Shorted Input
262,144 Points
20k
15k
10k
5k
OUTPUT SPECTRUM
21.0
24.5
17.5
10.5
14.0
Low-Power Mode
fIN = 1kHz, -20dBFS
32,768 Points
-20
-40
Amplitude (dB)
Amplitude (dB)
3.5
OUTPUT SPECTRUM
0
-40
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
10
100
1k
Frequency (Hz)
10k
100k
10
100
1k
Frequency (Hz)
Figure 11.
100k
NOISE HISTOGRAM
25k
Low-Power Mode
Shorted Input
262,144 Points
Number of Occurrences
-20
10k
Figure 12.
OUTPUT SPECTRUM
0
-40
Amplitude (dB)
7.0
Figure 10.
Low-Power Mode
fIN = 1kHz, -0.5dBFS
32,768 Points
-20
0
Output (mV)
Figure 9.
0
-3.5
100k
-7.0
10k
-10.5
100
1k
Frequency (Hz)
-17.5
10
-14.0
1
-21.0
0
-180
-24.5
-160
-60
-80
-100
-120
-140
20k
Low-Power Mode
Shorted Input
262,144 Points
15k
10k
5k
32
37
26
21
16
5
11
0
Output (mV)
Figure 13.
16
-5
100k
-11
10k
-16
100
1k
Frequency (Hz)
-26
10
-32
1
-37
0
-180
-21
-160
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OUTPUT SPECTRUM
0
OUTPUT SPECTRUM
0
Low-Speed Mode
fIN = 100Hz, -0.5dBFS
32,768 Points
-20
-20
-40
Amplitude (dB)
-40
Amplitude (dB)
Low-Speed Mode
fIN = 100Hz, -20dBFS
32,768 Points
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
1
10
100
Frequency (Hz)
1k
10k
1
10
100
Frequency (Hz)
Figure 15.
NOISE HISTOGRAM
25k
Number of Occurrences
Low-Speed Mode
Shorted Input
262,144 Points
-20
-40
Amplitude (dB)
10k
Figure 16.
OUTPUT SPECTRUM
0
1k
-60
-80
-100
-120
-140
20k
Low-Speed Mode
Shorted Input
262,144 Points
15k
10k
5k
-160
THD, THD+N (dB)
-20
35
28
21
14
7
0
-7
10k
-14
1k
-21
10
100
Frequency (Hz)
Output (mV)
Figure 17.
Figure 18.
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
TOTAL HARMONIC DISTORTION
vs
INPUT AMPLITUDE
0
High-Speed Mode
VIN = -0.5dBFS
-20
THD, THD+N (dB)
0
1
-35
0.1
-28
0
-180
-40
-60
-80
THD+N
-100
High-Speed Mode
fIN = 1kHz
-40
-60
-80
THD+N
-100
THD
-120
-120
THD
-140
10
100
1k
Frequency (Hz)
10k
100k
-140
-120
Figure 19.
-100
-80
-60
-40
Input Amplitude (dBFS)
-20
0
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
THD, THD+N (dB)
-20
0
High-Resolution Mode
VIN = -0.5dBFS
-20
THD, THD+N (dB)
0
TOTAL HARMONIC DISTORTION
vs
INPUT AMPLITUDE
-40
-60
-80
THD+N
-100
THD
-120
-140
10
THD, THD+N (dB)
-20
1k
Frequency (Hz)
10k
-100
THD+N
-120
THD
-100
0
Low-Power Mode
VIN = -0.5dBFS
-20
-80
THD+N
-40
-60
-80
THD+N
THD
THD
-120
-140
100
0
Low-Power Mode
fIN = 1kHz
-100
10
-20
TOTAL HARMONIC DISTORTION
vs
INPUT AMPLITUDE
-120
1k
Frequency (Hz)
10k
-140
-120
100k
-100
-80
-60
-40
Input Amplitude (dBFS)
-20
Figure 23.
Figure 24.
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
TOTAL HARMONIC DISTORTION
vs
INPUT AMPLITUDE
0
Low-Speed Mode
VIN = -0.5dBFS
0
Low-Speed Mode
THD, THD+N (dB)
-20
-40
-60
-80
THD+N
-100
-40
-60
-80
THD+N
-100
THD
THD
-120
-120
-140
10
100
1k
10k
-140
-120
Frequency (Hz)
Figure 25.
18
-80
-60
-40
Input Amplitude (dBFS)
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
-100
THD, THD+N (dB)
-80
Figure 22.
-60
-20
-60
Figure 21.
-40
0
-40
-140
-120
100k
THD, THD+N (dB)
0
100
High-Resolution Mode
fIN = 1kHz
-100
-80
-60
-40
Input Amplitude (dBFS)
-20
0
Figure 26.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
OFFSET DRIFT HISTOGRAM
25 units based on
20°C intervals over the
range -40°C to +105°C.
800
700
Number of Occurrences
350
Number of Occurrences
GAIN DRIFT HISTOGRAM
900
Multi-lot data based on
20°C intervals over the
range -40°C to +105°C.
300
250
200
150
100
600
500
400
300
200
100
0
0
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
50
Outliers: T < -20°C
-15
-14
-13
-12
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
400
Offset Drift (mV/°C)
Gain Drift (ppm/°C)
Figure 27.
Figure 28.
OFFSET WARMUP DRIFT RESPONSE BAND
GAIN WARMUP DRIFT RESPONSE BAND
40
40
ADS1278 High-Speed and High-Resolution Modes
ADS1274/78 High-Speed and High-Resolution Modes
Normalized Gain Error (ppm)
Normalized Offset (mV)
30
ADS1278 Low-Power Mode
20
10
0
-10
-20
ADS1278 Low-Speed Mode
-30
30
ADS1278 Low-Power Mode
20
10
0
-10
-20
ADS1278 Low-Speed Mode
-30
ADS1274 High-Speed and High-Resolution Modes
-40
-40
0
50
100
150
200
250
Time (s)
300
350
400
0
50
100
150
Figure 29.
400
Number of Occurrences
80
30
25
20
15
10
High-Speed Mode
25 Units
70
60
50
40
30
20
5
10
0
0
-4000
-3600
-3200
-2800
-2400
-2000
-1600
-1200
-800
-400
0
400
800
1200
1600
2000
2400
2800
3200
3600
4000
High-Speed Mode
25 Units
Offset (mV)
350
GAIN ERROR HISTOGRAM
90
-1000
-900
-800
-700
-600
-500
-400
-300
-200
-100
0
100
200
300
400
500
600
700
800
900
1000
Number of Occurrences
35
300
Figure 30.
OFFSET ERROR HISTOGRAM
40
200
250
Time (s)
Gain Error (ppm)
Figure 31.
Figure 32.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
CHANNEL GAIN MATCH HISTOGRAM
90
CHANNEL OFFSET MATCH HISTOGRAM
70
High-Speed Mode
10 Units
60
Number of Occurrences
Number of Occurrences
80
70
60
50
40
30
20
50
40
30
20
10
10
0
-1500
-1400
-1300
-1200
-1100
-1000
-900
-800
-700
-600
-500
-400
-300
-200
-100
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
0
High-Speed Mode
10 Units
Channel Gain Match (ppm)
- 1500
- 1400
- 1300
- 1200
- 1100
- 1000
- 900
- 800
- 700
- 600
- 500
- 400
- 300
- 200
- 100
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
100
Channel Offset Match (mV)
Figure 33.
Figure 34.
OFFSET AND GAIN
vs
TEMPERATURE
VCOM VOLTAGE OUTPUT HISTOGRAM
600
400
18
Offset
300
100
200
0
100
0
-100
-100
-200
Gain
-300
-55 -35
-15
5
25
AVDD = 5V
25 Units, No Load
16
14
12
10
8
6
4
-200
2
-300
45 65 85 105 125 145 165 185 205
Temperature (°C)
0
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
2.56
2.57
2.58
2.59
2.60
200
Number of Occurrences
400
Normalized Gain Error (ppm)
500
300
Normalized Offset (mV)
20
SAMPLING MATCH ERROR HISTOGRAM
REFERENCE INPUT DIFFERENTIAL
IMPEDANCE
vs
TEMPERATURE
40
30 units over 3 production lots,
inter-channel combinations.
Number of Occurrences
35
30
25
20
15
10
5
0.68
6.8
0.67
6.7
0.66
6.6
0.65
6.5
0.64
6.4
High Speed and
High Resolution
6.3
0.63
700
600
650
500
550
400
450
300
350
200
250
100
150
Low Speed Mode
50
0
Reference Input Impedance (kW)
Figure 36.
Reference Input Impedance (kW)
VCOM Voltage Output (V)
Figure 35.
0.62
-55
-40
-20
0
25
45 65 85 105
Temperature (°C)
125 140
6.2
155 210
Sampling Match Error (ps)
Figure 37.
20
Figure 38.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
28.6
14.2
28.4
14.1
28.2
14
28
13.9
27.8
13.8
27.6
13.7 High Speed and
13.6 High Resolution
27.4
13.5
27
13.4
26.8
27.2
13.3
26.6
Low Power Mode
13.2
170
Analog Input Impedance (kW)
14.3
ANALOG INPUT DIFFERENTIAL IMPEDANCE
vs
TEMPERATURE
Analog Input Impedance (kW)
Analog Input Impedance (kW)
ANALOG INPUT DIFFERENTIAL IMPEDANCE
vs
TEMPERATURE
160
Low-Speed Mode
150
140
130
120
26.4
13.1
-55 -35
110
-55 -35
26.2
-15
5
25
45 65 85 105 125 145 165 185 205
Temperature (°C)
-15
5
25
45 65 85 105 125 145 165 185 205
Temperature (°C)
Figure 39.
Figure 40.
INTEGRAL NONLINEARITY
vs
TEMPERATURE
LINEARITY ERROR
vs
INPUT LEVEL
10
10
8
6
Linearity Error (ppm)
6
4
4
2
T = +105°C
T = +25°C
0
-2
-4
-6
2
T = -40°C
T = +125°C
-8
0
-55 -35
5
25
-10
-2.5 -2.0 -1.5 -1.0 -0.5
45 65 85 105 125 145 165 185 205
Temperature (°C)
0
0.5
VIN (V)
1.0
1.5
Figure 41.
Figure 42.
LINEARITY AND TOTAL HARMONIC DISTORTION
vs
REFERENCE VOLTAGE
NOISE AND LINEARITY
vs
INPUT COMMON-MODE VOLTAGE
2.0
2.5
14
14
12
-104
12
12
10
-108
10
THD
8
-112
6
-116
4
Linearity
2
0
0.5
1.0
1.5
2.0
VREF (V)
2.5
3.0
3.5
10
Noise
8
8
6
6
Linearity
-120
4
4
-124
2
2
-128
0
-0.5 0
See Electrical Characteristics for VREF Operating Range.
0
RMS Noise (mV)
-100
THD: fIN = 1kHz, VIN = -0.5dBFS
THD (dB)
Linearity (ppm)
14
-15
INL (ppm of FSR)
INL (ppm of FSR)
8
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common-Mode Voltage (V)
Figure 43.
Figure 44.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
NOISE
vs
TEMPERATURE
NOISE
vs
REFERENCE VOLTAGE
12
12
High-Speed
Low Power Mode
High Speed Mode
Low-Power
10
8
8
Noise (mV)
RMS Noise (mV)
10
Low Speed Mode
6
Low-Speed
6
4
4
High-Resolution
High Resolution Mode
2
2
0
-55 -35
25
0
1.0
1.5
2.0
VREF (V)
2.5
3.0
Figure 46.
TOTAL HARMONIC DISTORTION AND NOISE
vs
CLK
COMMON-MODE REJECTION
vs
INPUT FREQUENCY
12
10
8
Noise
6
-80
THD
-100
4
-120
2
0
100M
-140
10k
100k
1M
CLK (Hz)
10M
3.5
0
14
-60
-20
-40
-60
-80
-100
-120
10
100
1k
10k
Input Frequency (Hz)
Figure 47.
Figure 48.
POWER-SUPPLY REJECTION
vs
POWER-SUPPLY FREQUENCY
AVDD CURRENT
vs
TEMPERATURE
0
100k
1M
160
140
-20
AVDD Current (mA)
Power-Supply Rejection (dB)
0.5
Figure 45.
Noise RMS (mV)
-40
0
45 65 85 105 125 145 165 185 205
Temperature (°C)
High-Speed Mode
fCLK > 32.768MHz: VREF = 2.048V, DVDD = 2.1V
THD: AIN = fCLK/5120, -0.5dBFS
Noise: Shorted Input
-20
THD (dB)
5
Common-Mode Rejection (dB)
0
See Electrical Characteristics for VREF Operating Range.
-15
-40
-60
AVDD
-80
High Speed and High Resolution Modes
120
100
80
Low Power Mode
60
40
DVDD
Low Speed Mode
-100
20
IOVDD
-120
10
100
1k
10k
100k
Power-Supply Modulation Frequency (Hz)
1M
0
-55 -35
Figure 49.
22
-15
5
25
45 65 85 105 125 145 165 185 205
Temperature (°C)
Figure 50.
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TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, High-Speed mode, AVDD = 5 V, DVDD = 1.8 V, IOVDD = 3.3 V, fCLK = 27 MHz, VREFP = 2.5 V, and
VREFN = 0 V, unless otherwise noted.
DVDD CURRENT
vs
TEMPERATURE
IOVDD CURRENT
vs
TEMPERATURE
0.5
30
High Speed Mode
0.4
IOVDD Current (mA)
DVDD Current (mA)
25
20
High Resolution Mode
15
10
Low Power Mode
0.3
High Speed Mode
0.2
High Resolution and Low Power Modes
0.1
5
Low Speed Mode
0
-55 -35
-15
5
25
Low Speed Mode
0
-55 -35
45 65 85 105 125 145 165 185 205
Temperature (°C)
-15
5
25
Figure 51.
45 65 85 105 125 145 165 185 205
Temperature (°C)
Figure 52.
POWER DISSIPATION
vs
TEMPERATURE
800
Power Dissipation (mW)
700
600
High Speed Mode
500
400
High Resolution Mode
300
Low Power Mode
200
100
Low Speed Mode
0
-55 -35
-15
5
25
45 65 85 105 125 145 165 185 205
Temperature (°C)
Figure 53.
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OVERVIEW
High-Speed, High-Resolution, Low-Power, and LowSpeed. Table 3 summarizes the performance of each
mode.
The ADS1278 is an octal 24-bit, delta-sigma ADC
based on the single-channel ADS1271. It offers the
combination of outstanding dc accuracy and superior
ac performance. Figure 54 shows the block diagram.
The converter is comprised of eight advanced, 6thorder, chopper-stabilized, delta-sigma modulators
followed by low-ripple, linear phase FIR filters. The
modulators measure the differential input signal, VIN =
(AINP – AINN), against the differential reference,
VREF = (VREFP – VREFN). The digital filters receive
the modulator signal and provide a low-noise digital
output. To allow tradeoffs among speed, resolution,
and power, four operating modes are supported:
VREFP
AVDD
The ADS1278 is configured by simply setting the
appropriate I/O pins—there are no registers to
program. Data are retrieved over a serial interface
that supports both SPI and Frame-Sync formats. The
ADS1278 has a daisy-chainable output and the ability
to synchronize externally, so it can be used
conveniently in systems requiring more than eight
channels.
DVDD
VREFN
IOVDD
Mod 1
Mod 2
S
R
In High-Speed mode, the maximum data rate is 128
kSPS (when operating at 128 kSPS, Frame-Sync
format must be used). In High-Resolution mode, the
SNR = 111dB (VREF = 3.0 V); in Low-Power mode,
the power dissipation is 31 mW/channel; and in LowSpeed mode, the power dissipation is only 7
mW/channel at 10.5 kSPS. The digital filters can be
bypassed, enabling direct access to the modulator
output.
Modulator
Output
VCOM
VREF
R
AINP1
S
VIN1
AINN1
AINP2
S
VIN2
AINN2
Mod 8
DS
Modulator1
Digital
Filter1
DS
Modulator2
DRDY/FSYNC
SPI
and
Frame-Sync
Interface
SCLK
DOUT [8:1]
DIN
Digital
Filter2
TEST[1:0]
FORMAT[2:0]
CLK
Control
Logic
AINP8
AINN8
S
VIN4/8
DS
Modulator8
SYNC
PWDN [8:1]
Digital
Filter8
CLKDIV
MODE[1:0]
AGND
DGND
Figure 54. Block Diagram
Table 3. Operating Mode Performance Summary
24
MODE
MAX DATA RATE (SPS)
PASSBAND (kHz)
SNR (dB)
NOISE (μVRMS)
POWER/CHANNEL (mW)
High-Speed
128,000
57,984
106
8.5
70
High-Resolution
52,734
23,889
110
5.5
64
Low-Power
52,734
23,889
106
8.5
31
Low-Speed
10,547
4,798
107
8.0
7
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FUNCTIONAL DESCRIPTION
SAMPLING APERTURE MATCHING
The ADS1278 is a delta-sigma ADC consisting of
eight independent converters that digitize eight input
signals in parallel.
The ADS1278 converter operates from the same CLK
input. The CLK input controls the timing of the
modulator sampling instant. The converter is
designed such that the sampling skew, or modulator
sampling aperture match between channels, is
controlled. Furthermore, the digital filters are
synchronized to start the convolution phase at the
same modulator clock cycle. This design results in
excellent phase match among the ADS1278
channels.
The converter is composed of two main functional
blocks to perform the ADC conversions: the
modulator and the digital filter. The modulator
samples the input signal together with sampling the
reference voltage to produce a 1s density output
stream. The density of the output stream is
proportional to the analog input level relative to the
reference voltage. The pulse stream is filtered by the
internal digital filter where the output conversion
result is produced.
In operation, the input signal is sampled by the
modulator at a high rate (typically 64x higher than the
final output data rate). The quantization noise of the
modulator is moved to a higher frequency range
where the internal digital filter removes it.
Oversampling results in very low levels of noise
within the signal passband.
Since the input signal is sampled at a very high rate,
input signal aliasing does not occur until the input
signal frequency is at the modulator sampling rate.
This architecture greatly relaxes the requirement of
external antialiasing filters because of the high
modulator sampling rate.
Figure 37 shows the inter-device channel sample
matching for the ADS1278.
FREQUENCY RESPONSE
The digital filter sets the overall frequency response.
The filter uses a multi-stage FIR topology to provide
linear phase with minimal passband ripple and high
stop band attenuation. The filter coefficients are
identical to the coefficients used in the ADS1271. The
oversampling ratio of the digital filter (that is, the ratio
of the modulator sampling to the output data rate, or
fMOD/fDATA) is a function of the selected mode, as
shown in Table 4.
Table 4. Oversampling Ratio versus Mode
MODE SELECTION
OVERSAMPLING RATIO (fMOD/fDATA)
High-Speed
64
High-Resolution
128
Low-Power
64
Low-Speed
64
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High-Speed, Low-Power, and Low-Speed Modes
0
-1
-2
Amplitude (dB)
The digital filter configuration is the same in HighSpeed, Low-Power, and Low-Speed modes with the
oversampling ratio set to 64. Figure 55 shows the
frequency response in High-Speed, Low-Power, and
Low-Speed modes normalized to fDATA. Figure 56
shows the passband ripple. The transition from
passband to stop band is shown in Figure 57. The
overall frequency response repeats at 64x multiples
of the modulator frequency fMOD, as shown in
Figure 58.
-3
-4
-5
-6
-7
-8
-9
-10
0.45
0
0.47
0.49
0.51
0.53
0.55
Normalized Input Frequency (fIN/fDATA)
Amplitude (dB)
-20
Figure 57. Transition Band Response for HighSpeed, Low-Power, and Low-Speed Modes
-40
-60
-80
20
-100
0
-120
-20
0
0.2
0.6
0.4
0.8
1.0
Normalized Input Frequency (fIN/fDATA)
Figure 55. Frequency Response for High-Speed,
Low-Power, and Low-Speed Modes
Gain (dB)
-40
-140
-60
-80
-100
-120
-140
-160
0.02
0
16
32
48
64
Input Frequency (fIN/fDATA)
Amplitude (dB)
0
Figure 58. Frequency Response Out to fMOD for
High-Speed, Low-Power, and Low-Speed Modes
-0.02
-0.04
-0.06
-0.08
-0.10
0
0.1
0.2
0.3
0.4
0.5
0.6
Normalized Input Frequency (fIN/fDATA)
Figure 56. Passband Response for High-Speed,
Low-Power, and Low-Speed Modes
These image frequencies, if present in the signal and
not externally filtered, will fold back (or alias) into the
passband, causing errors. The stop band of the
ADS1278 provides 100 dB attenuation of frequencies
that begin just beyond the passband and continue out
to fMOD. Placing an antialiasing, low-pass filter in front
of the ADS1278 inputs is recommended to limit
possible high-amplitude, out-of-band signals and
noise. Often, a simple RC filter is sufficient. Table 5
lists the image rejection versus external filter order.
Table 5. Antialiasing Filter Order Image Rejection
26
IMAGE REJECTION (dB)
(f–3dB at fDATA)
ANTIALIASING
FILTER ORDER
HS, LP, LS
HR
1
39
45
2
75
87
3
111
129
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High-Resolution Mode
0
-1
-2
Amplitude (dB)
The oversampling ratio is 128 in High-Resolution
mode. Figure 59 shows the frequency response in
High-Resolution mode normalized to fDATA. Figure 60
shows the passband ripple, and the transition from
passband to stop band is shown in Figure 61. The
overall frequency response repeats at multiples of the
modulator frequency fMOD (128 × fDATA), as shown in
Figure 62. The stop band of the ADS1278 provides
100 dB attenuation of frequencies that begin just
beyond the passband and continue out to fMOD.
Placing an antialiasing, low-pass filter in front of the
ADS1278 inputs is recommended to limit possible
high-amplitude out-of-band signals and noise. Often,
a simple RC filter is sufficient. Table 5 lists the image
rejection versus external filter order.
-3
-4
-5
-6
-7
-8
-9
-10
0.45
0.47
0.49
0.51
0.53
0.55
Normalized Input Frequency (fIN/fDATA)
Figure 61. Transition Band Response for HighResolution mode
-20
20
-40
0
-60
-20
-40
-80
Gain (dB)
Amplitude (dB)
0
-100
-120
-60
-80
-100
-120
-140
0
0.50
0.25
0.75
1
Normalized Input Frequency (fIN/fDATA)
-140
-160
0
Figure 59. Frequency Response for HighResolution Mode
32
64
96
128
Normalized Input Frequency (fIN/fDATA)
Figure 62. Frequency Response Out to fMOD for
High-Resolution Mode
0.02
Amplitude (dB)
0
-0.02
-0.04
-0.06
-0.08
-0.10
0
0.1
0.2
0.3
0.4
0.5
0.6
Normalized Input Frequency (fIN/fDATA)
Figure 60. Passband Response for HighResolution Mode
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Table 6. Ideal Output Code versus Input Signal
PHASE RESPONSE
The ADS1278 incorporates a multiple stage, linear
phase digital filter. Linear phase filters exhibit
constant delay time versus input frequency (constant
group delay). This characteristic means the time
delay from any instant of the input signal to the same
instant of the output data is constant and is
independent of input signal frequency. This behavior
results in essentially zero phase errors when
analyzing multi-tone signals.
INPUT SIGNAL VIN
(AINP – AINN)
IDEAL OUTPUT CODE(1)
≥ +VREF
7FFFFFh
) VREF
2 23 * 1
000001h
0
000000h
* VREF
2 23 * 1
FFFFFFh
ǒ2 2* 1Ǔ
v −VREF
SETTLING TIME
As with frequency and phase response, the digital
filter also determines settling time. Figure 63 shows
the output settling behavior after a step change on
the analog inputs normalized to conversion periods.
The X-axis is given in units of conversion. Note that
after the step change on the input occurs, the output
data change very little prior to 30 conversion periods.
The output data are fully settled after 76 conversion
periods for High-Speed and Low-Power modes, and
78 conversion periods for High-Resolution mode.
Final Value
Settling (%)
100
23
23
800000h
(1) Excludes effects of noise, INL, offset, and gain errors.
ANALOG INPUTS (AINP, AINN)
The ADS1278 measures each differential input signal
VIN = (AINP – AINN) against the common differential
reference VREF = (VREFP – VREFN). The most
positive measurable differential input is +VREF, which
produces the most positive digital output code of
7FFFFFh. Likewise, the most negative measurable
differential input is –VREF, which produces the most
negative digital output code of 800000h.
For optimum performance, the inputs of the ADS1278
are intended to be driven differentially. For singleended applications, one of the inputs (AINP or AINN)
can be driven while the other input is fixed (typically
to AGND or 2.5 V). Fixing the input to 2.5 V permits
bipolar operation, thereby allowing full use of the
entire converter range.
Fully Settled Data
at 76 Conversions
(78 Conversions for
High-Resolution mode)
Initial Value
0
0
10
20
30
40
50
60
70
80
Conversions (1/fDATA)
Figure 63. Step Response
–0.1 V < (AINN or AINP) < AVDD + 0.1 V
DATA FORMAT
The ADS1278 outputs 24 bits of data in twos
complement format.
A positive full-scale input produces an ideal output
code of 7FFFFFh, and the negative full-scale input
produces an ideal output code of 800000h. The
output clips at these codes for signals exceeding fullscale. Table 6 summarizes the ideal output codes for
different input signals.
28
While the ADS1278 measures the differential input
signal, the absolute input voltage is also important.
This value is the voltage on either input (AINP or
AINN) with respect to AGND. The range for this
voltage is:
If either input is taken below –0.4 V or above
(AVDD + 0.4 V), ESD protection diodes on the inputs
may turn on. If these conditions are possible, external
Schottky clamp diodes or series resistors may be
required to limit the input current to safe values (see
the Absolute Maximum Ratings table).
The ADS1278 is a very high-performance ADC. For
optimum performance, it is critical that the appropriate
circuitry be used to drive the ADS1278 inputs. See
the Application Information section for several
recommended circuits.
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The ADS1278 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are
charged by the inputs and then discharged. Figure 64
shows a conceptual diagram of these circuits. Switch
S2 represents the net effect of the modulator circuitry
in discharging the sampling capacitor; the actual
implementation is different. The timing for switches S1
and S2 is shown in Figure 65. The sampling time
(tSAMPLE) is the inverse of modulator sampling
frequency (fMOD) and is a function of the mode, the
CLKDIV input, and CLK frequency, as shown in
Table 7.
Zeff = 14kW ´ (6.75MHz/fMOD)
AINN
Figure 66. Effective Input Impedances
VOLTAGE REFERENCE INPUTS
(VREFP, VREFN)
AVDD AGND
S1
AINP
AINP
9pF
S2
AINN
S1
AGND AVDD
ESD Protection
Figure 64. Equivalent Analog Input Circuitry
The voltage reference for the ADS1278 ADC is the
differential voltage between VREFP and VREFN:
VREF = (VREFP – VREFN). The voltage reference is
common to all channels. The reference inputs use a
structure similar to that of the analog inputs with the
equivalent circuitry on the reference inputs shown in
Figure 67. As with the analog inputs, the load
presented by the switched capacitor can be modeled
with an effective impedance, as shown in Figure 68.
However, the reference input impedance depends on
the number of active (enabled) channels in addition to
fMOD. As a result of the change of reference input
impedance caused by enabling and disabling
channels, the regulation and setting time of the
external reference should be noted, so as not to
affect the readings.
tSAMPLE = 1/fMOD
S1
VREFP
ON
VREFN
OFF
S2
ON
AGND
AGND
AVDD
AVDD
OFF
Figure 65. S1 and S2 Switch Timing for Figure 64
ESD
Protection
Table 7. Modulator Frequency (fMOD) Mode
Selection
MODE SELECTION
CLKDIV
fMOD
High-Speed
1
fCLK/4
High-Resolution
1
fCLK/4
1
fCLK/8
Low-Power
Low-Speed
0
fCLK/4
1
fCLK/40
0
fCLK/8
Figure 67. Equivalent Reference Input Circuitry
VREFP
The average load presented by the switched
capacitor input can be modeled with an effective
differential impedance, as shown in Figure 66. Note
that the effective impedance is a function of fMOD.
Zeff =
VREFN
5.2kW
´ (6.75MHz/fMOD)
N
N = number of active channels.
Figure 68. Effective Reference Impedance
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ESD diodes protect the reference inputs. To keep
these diodes from turning on, make sure the voltages
on the reference pins do not go below AGND by
more than 0.4 V, and likewise do not exceed AVDD
by 0.4 V. If these conditions are possible, external
Schottky clamp diodes or series resistors may be
required to limit the input current to safe values (see
the Absolute Maximum Ratings table).
Note that the valid operating range of the reference
inputs is limited to the following parameters:
Table 8. Clock Input Options
MODE
SELECTION
MAX fCLK
(MHz)
CLKDIV
fCLK/fDATA
DATA RATE
(SPS)
High-Speed
32.768
1
256
128,000
High-Resolution
27
1
512
52,734
27
1
512
13.5
0
256
27
1
2,560
5.4
0
512
Low-Power
Low-Speed
52,734
10,547
–0.1 V ≤ VREFN ≤ +0.1 V
MODE SELECTION (MODE)
VREFN + 0.5 V ≤ VREFP ≤ AVDD + 0.1 V
The ADS1278 supports four modes of operation:
High-Speed, High-Resolution, Low-Power, and LowSpeed. The modes offer optimization of speed,
resolution, and power. Mode selection is determined
by the status of the digital input MODE[1:0] pins, as
shown in Table 9. The ADS1278 continually monitors
the status of the MODE pin during operation.
CLOCK INPUT (CLK)
The ADS1278 requires a clock input for operation.
The individual converters of the ADS1278 operate
from the same clock input. At the maximum data rate,
the clock input can be either 27 MHz or 13.5 MHz for
Low-Power mode, or 2 7MHz or 5.4 MHz for LowSpeed mode, determined by the setting of the
CLKDIV input. For High-Speed mode, the maximum
CLK input frequency is 32.768 MHz. For HighResolution mode, the maximum CLK input frequency
is 27 MHz. The selection of the external clock
frequency (fCLK) does not affect the resolution of the
ADS1278. Use of a slower fCLK can reduce the power
consumption of an external clock buffer. The output
data rate scales with clock frequency, down to a
minimum clock frequency of fCLK = 100 kHz. Table 8
summarizes the ratio of the clock input frequency
(fCLK) to data rate (fDATA), maximum data rate and
corresponding maximum clock input for the four
operating modes.
As with any high-speed data converter, a high-quality,
low-jitter clock is essential for optimum performance.
Crystal clock oscillators are the recommended clock
source. Make sure to avoid excess ringing on the
clock input; keeping the clock trace as short as
possible, and using a 50-Ω series resistor placed
close to the source end, often helps.
30
Table 9. Mode Selection
MODE[1:0]
MODE SELECTION
MAX fDATA (1)
00
High-Speed
128,000
01
High-Resolution
52,734
10
Low-Power
52,734
11
Low-Speed
10,547
(1) fCLK = 27 MHz max (32.768MHz max in High-Speed mode).
When using the SPI protocol, DRDY is held high after
a mode change occurs until settled (or valid) data are
ready; see Figure 69 and Table 10.
In Frame-Sync protocol, the DOUT pins are held low
after a mode change occurs until settled data are
ready; see Figure 69 and Table 10. Data can be read
from the device to detect when DOUT changes to
logic 1, indicating that the data are valid.
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MODE[1:0]
Pins
ADS1278
Mode
Previous
Mode
New Mode
tNDR-SPI
SPI
Protocol
DRDY
New Mode
Valid Data Ready
tNDR-FS
Frame-Sync DOUT
Protocol
New Mode
Valid Data on DOUT
Figure 69. Mode Change Timing
Table 10. New Data After Mode Change
SYMBOL
DESCRIPTION
MIN
tNDR-SPI
Time for new data to be ready (SPI)
tNDR-FS
Time for new data to be ready (Frame-Sync)
SYNCHRONIZATION (SYNC)
The ADS1278 can be synchronized by pulsing the
SYNC pin low and then returning the pin high. When
the pin goes low, the conversion process stops, and
the internal counters used by the digital filter are
reset. When the SYNC pin returns high, the
conversion process restarts. Synchronization allows
the conversion to be aligned with an external event,
such as the changing of an external multiplexer on
the analog inputs, or by a reference timing pulse.
Because the ADS1278 converters operate in parallel
from the same master clock and use the same SYNC
input control, they are always in synchronization with
each other. The aperture match among internal
channels is typically less than 500 ps. However, the
synchronization of multiple devices is somewhat
different. At device power-on, variations in internal
reset thresholds from device to device may result in
uncertainty in conversion timing.
The SYNC pin can be used to synchronize multiple
devices to within the same CLK cycle. Figure 70
illustrates the timing requirement of SYNC and CLK
in SPI format.
127
TYP
MAX
UNITS
129
Conversions (1/fDATA)
128
Conversions (1/fDATA)
See Figure 71 for the Frame-Sync format timing
requirement.
After synchronization, indication of valid data
depends on whether SPI or Frame-Sync format was
used.
In the SPI format, DRDY goes high as soon as SYNC
is taken low; see Figure 70. After SYNC is returned
high, DRDY stays high while the digital filter is
settling. Once valid data are ready for retrieval,
DRDY goes low.
In the Frame-Sync format, DOUT goes low as soon
as SYNC is taken low; see Figure 71. After SYNC is
returned high, DOUT stays low while the digital filter
is settling. Once valid data are ready for retrieval,
DOUT begins to output valid data. For proper
synchronization, FSYNC, SCLK, and CLK must be
established before taking SYNC high, and must then
remain running. If the clock inputs (CLK, FSYNC or
SCLK) are subsequently interrupted or reset, reassert the SYNC pin.
For consistent performance, re-assert SYNC after
device power-on when data first appear.
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tCSHD
CLK
tSCSU
tSYN
SYNC
tNDR
DRDY
Figure 70. Synchronization Timing (SPI Protocol)
Table 11. SPI Protocol
SYMBOL
DESCRIPTION
MIN
TYP
MAX
UNITS
tCSHD
CLK to SYNC hold time
10
ns
tSCSU
SYNC to CLK setup time
5
ns
tSYN
Synchronize pulse width
1
tNDR
Time for new data to be ready
CLK periods
129
Conversions (1/fDATA)
tCSHD
CLK
tSCSU
tSYN
SYNC
FSYNC
tNDR
Valid Data
DOUT
Figure 71. Synchronization Timing (Frame-Sync Protocol)
Table 12. Frame-Sync Protocol
SYMBOL
32
DESCRIPTION
MIN
TYP
MAX
UNITS
tCSHD
CLK to SYNC hold time
10
tSCSU
SYNC to CLK setup time
5
ns
tSYN
Synchronize pulse width
1
CLK periods
tNDR
Time for new data to be ready
127
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ns
128
Conversions (1/fDATA)
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POWER-DOWN (PWDN)
The channels of the ADS1278 can be independently
powered down by use of the PWDN inputs. To enter
the power-down mode, hold the respective PWDN pin
low for at least two CLK cycles. To exit power-down,
return the corresponding PWDN pin high. Note that
when all channels are powered down, the ADS1278
enters a microwatt (μW) power state where all
internal biasing is disabled. In this state, the
TEST[1:0] input pins must be driven; all other input
pins can float. The ADS1278 outputs remain driven.
As shown in Figure 72 and Table 13, a maximum of
130 conversion cycles must elapse for SPI interface,
and 129 conversion cycles must elapse for FrameSync, before reading data after exiting power-down.
Data from channels already running are not affected.
The user software can perform the required delay
time in any of the following ways:
1. Count the number of data conversions after
taking the PWDN pin high.
3. Detect for non-zero data in the powered-up
channel.
After powering up one or more channels, the
channels are synchronized to each other. It is not
necessary to use the SYNC pin to synchronize them.
When a channel is powered down in TDM data
format, the data for that channel are either forced to
zero (fixed-position TDM data mode) or replaced by
shifting the data from the next channel into the
vacated data position (dynamic-position TDM data
mode).
In Discrete data format, the data are always forced to
zero. When powering-up a channel in dynamicposition TDM data format mode, the channel data
remain packed until the data are ready, at which time
the data frame is expanded to include the justpowered channel data. See the Data Format section
for details.
2. Delay 129/fDATA or 130/fDATA after taking the
PWDN pins high, then read data.
···
CLK
tPWDN
PWDN
DRDY/FSYNC
···
tNDR
(1)
DOUT
(Discrete Data Output Mode)
Post Power-Up Data
DOUT1
(TDM Mode, Dynamic Position)
Normal Position
Data Shifts Position
Normal Position
DOUT1
(TDM Mode, Fixed Position)
Normal Position
Data Remains in Position
Normal Position
Figure 72. Power-Down Timing
Table 13. Power-Down Timing
SYMBOL
tPWDN
DESCRIPTION
MIN
PWDN pulse width to enter Power-Down mode
TYP
MAX
2
UNITS
CLK periods
tNDR
Time for new data ready (SPI)
129
130
Conversions (1/fDATA)
tNDR
Time for new data ready (Frame-Sync)
128
129
Conversions (1/fDATA)
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FORMAT[2:0]
Data can be read from the ADS1278 with two
interface protocols (SPI or Frame-Sync) and several
options of data formats (TDM/Discrete and
Fixed/Dynamic data positions). The FORMAT[2:0]
inputs are used to select among the options. Table 14
lists the available options. See the DOUT Modes
section for details of the DOUT Mode and Data
Position.
Table 14. Data Output Format
FORMAT[2:0]
INTERFACE
PROTOCOL
DOUT
MODE
DATA
POSITION
000
SPI
TDM
Dynamic
001
SPI
TDM
Fixed
010
SPI
Discrete
—
011
Frame-Sync
TDM
Dynamic
100
Frame-Sync
TDM
Fixed
101
Frame-Sync
Discrete
—
110
Modulator Mode
—
—
SERIAL INTERFACE PROTOCOLS
Data are retrieved from the ADS1278 using the serial
interface. Two protocols are available: SPI and
Frame-Sync. The same pins are used for both
interfaces: SCLK, DRDY/FSYNC, DOUT[8:1], and
DIN. The FORMAT[2:0] pins select the desired
interface protocol.
Even though the SCLK input has hysteresis, it is
recommended to keep SCLK as clean as possible to
prevent glitches from accidentally shifting the data.
SCLK may be run as fast as the CLK frequency.
SCLK may be either in free-running or stop-clock
operation between conversions. Note that one fCLK is
required after the falling edge of DRDY until the first
rising edge of SCLK. For best performance, limit
fSCLK/fCLK to ratios of 1, 1/2, 1/4, 1/8, etc. When the
device is configured for modulator output, SCLK
becomes the modulator clock output (see the
Modulator Output section).
DRDY/FSYNC (SPI Format)
In the SPI format, this pin functions as the DRDY
output. It goes low when data are ready for retrieval
and then returns high on the falling edge of the first
subsequent SCLK. If data are not retrieved (that is,
SCLK is held low), DRDY pulses high just before the
next conversion data are ready, as shown in
Figure 73. The new data are loaded within one CLK
cycle before DRDY goes low. All data must be shifted
out before this time to avoid being overwritten.
1/fDATA
1/fCLK
DRDY
SCLK
Figure 73. DRDY Timing with No Readback
SPI SERIAL INTERFACE
The SPI-compatible format is a read-only interface.
Data ready for retrieval are indicated by the falling
DRDY output and are shifted out on the falling edge
of SCLK, MSB first. The interface can be daisychained using the DIN input when using multiple
devices. See the Daisy-Chaining section for more
information.
NOTE: The SPI format is limited to a CLK input
frequency of 27 MHz, maximum. For CLK input
operation above 27 MHz (High-Speed mode only),
use Frame-Sync format.
SCLK
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. The
device shifts data out on the falling edge and the user
normally shifts this data in on the rising edge.
34
DOUT
The conversion data are output on DOUT[8:1]. The
MSB data are valid on DOUT[8:1] after DRDY goes
low. Subsequent bits are shifted out with each falling
edge of SCLK. If daisy-chaining, the data shifted in
using DIN appear on DOUT after all channel data
have been shifted out. When the device is configured
for modulator output, DOUT[8:1] becomes the
modulator data output for each channel (see the
Modulator Output section).
DIN
This input is used when multiple ADS1278s are to be
daisy-chained together. The DOUT1 pin of the first
device connects to the DIN pin of the next, etc. It can
be used with either the SPI or Frame-Sync formats.
Data are shifted in on the falling edge of SCLK. When
using only one ADS1278, tie DIN low. See the DaisyChaining section for more information.
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FRAME-SYNC SERIAL INTERFACE
DOUT
Frame-Sync format is similar to the interface often
used on audio ADCs. It operates in slave
fashion—the user must supply framing signal FSYNC
(similar to the left/right clock on stereo audio ADCs)
and the serial clock SCLK (similar to the bit clock on
audio ADCs). The data are output MSB first or leftjustified on the rising edge of FSYNC. When using
Frame-Sync format, the FSYNC and SCLK inputs
must be continuously running with the relationships
shown in the Frame-Sync Timing Requirements.
The conversion data are shifted out on DOUT[8:1].
The MSB data become valid on DOUT[8:1] after
FSYNC goes high. The subsequent bits are shifted
out with each falling edge of SCLK. If daisy-chaining,
the data shifted in using DIN appear on DOUT[8:1]
after all channel data have been shifted out. When
the device is configured for modulator output, DOUT
becomes the modulator data output (see the
Modulator Output section).
DIN
SCLK
This input is used when multiple ADS1278s are to be
daisy-chained together. It can be used with either SPI
or Frame-Sync formats. Data are shifted in on the
falling edge of SCLK. When using only one
ADS1278, tie DIN low. See the Daisy-Chaining
section for more information.
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. Even
though SCLK has hysteresis, it is recommended to
keep SCLK as clean as possible to prevent glitches
from accidentally shifting the data. When using
Frame-Sync format, SCLK must run continuously. If it
is shut down, the data readback will be corrupted.
The number of SCLKs within a frame period (FSYNC
clock) can be any power-of-2 ratio of CLK cycles (1,
1/2, 1/4, etc), as long as the number of cycles is
sufficient to shift the data output from all channels
within one frame. When the device is configured for
modulator output, SCLK becomes the modulator
clock output (see the Modulator Output section).
DOUT MODES
For both SPI and Frame-Sync interface protocols, the
data are shifted out either through individual channel
DOUT pins, in a parallel data format (Discrete mode),
or the data for all channels are shifted out, in a serial
format, through a common pin, DOUT1 (TDM mode).
TDM Mode
In TDM (time-division multiplexed) data output mode,
the data for all channels are shifted out, in sequence,
on a single pin (DOUT1). As shown in Figure 74, the
data from channel 1 are shifted out first, followed by
channel 2 data, etc. After the data from the last
channel are shifted out, the data from the DIN input
follow. The DIN is used to daisy-chain the data output
from an additional ADS1278 or other compatible
device. Note that when all channels of the ADS1278
are disabled, the interface is disabled, rendering the
DIN input disabled as well. When one or more
channels of the device are powered down, the data
format of the TDM mode can be fixed or dynamic.
DRDY/FSYNC (Frame-Sync Format)
In Frame-Sync format, this pin is used as the FSYNC
input. The frame-sync input (FSYNC) sets the frame
period, which must be the same as the data rate. The
required number of fCLK cycles to each FSYNC period
depends on the mode selection and the CLKDIV
input. Table 8 indicates the number of CLK cycles to
each frame (fCLK/fDATA). If the FSYNC period is not
the proper value, data readback will be corrupted.
SCLK
DOUT1
1
2
CH1
23
24
25
47
CH2
48
49
71
CH3
72
73
95
96
CH4
97
CH5
167
168
CH7
169
191
CH8
192
193
194
195
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 74. TDM Mode (All Channels Enabled)
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TDM Mode, Fixed-Position Data
TDM Mode, Dynamic Position Data
In this TDM data output mode, the data position of
the channels remain fixed, regardless of whether the
channels are powered down. If a channel is powered
down, the data are forced to zero but occupy the
same position within the data stream. Figure 75
shows the data stream with channel 1 and channel 3
powered down.
In this TDM data output mode, when a channel is
powered down, the data from higher channels shift
one position in the data stream to fill the vacated data
slot. Figure 76 shows the data stream with channel 1
and channel 3 powered down.
Discrete Data Output Mode
In Discrete data output mode, the channel data are
shifted out in parallel using individual channel data
output pins DOUT[8:1]. After the 24th SCLK, the
channel data are forced to zero. The data are also
forced to zero for powered down channels. Figure 77
shows the discrete data output format.
SCLK
1
DOUT1
2
23
25
24
CH1
47
48
49
CH2
71
72
73
CH3
95
96
97
CH4
167
CH5
168
169
CH7
191
192
193
CH8
194
195
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 75. TDM Mode, Fixed-Position Data (Channels 1 and 3 Shown Powered Down)
SCLK
DOUT1
1
2
CH2
23
24
25
47
CH4
48
49
50
CH5
119
120
CH7
121
143
CH8
144
145
145
146
DIN
DRDY
(SPI)
FSYNC
(Frame- Sync)
Figure 76. TDM Mode, Dynamic Position Data (Channels 1 and 3 Shown Powered Down)
36
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SCLK
1
2
22
DOUT1
CH1
DOUT2
CH2
DOUT3
CH3
DOUT4
CH4
DOUT5
CH5
DOUT6
CH6
DOUT7
CH7
DOUT8
CH8
23
24
25
26
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 77. Discrete Data Output Mode
Table 15. Maximum Channels in a Daisy-Chain
(fSCLK = fCLK) (continued)
DAISY-CHAINING
Multiple ADS1278s can be daisy-chained together to
output data on a single pin. The DOUT1 data output
pin of one device is connected to the DIN of the next
device. As shown in Figure 78, the DOUT1 pin of
device 1 provides the output data to a controller, and
the DIN of device 2 is grounded. Figure 79 shows the
data format when reading back data.
The maximum number of channels that may be
daisy-chained in this way is limited by the frequency
of fSCLK, the mode selection, and the CLKDIV input.
The frequency of fSCLK must be high enough to
completely shift the data out from all channels within
one fDATA period. Table 15 lists the maximum number
of daisy-chained channels when fSCLK = fCLK.
To increase the number of data channels possible in
a chain, a segmented DOUT scheme may be used,
producing two data streams. Figure 80 illustrates four
ADS1278s, with pairs of ADS1278s daisy-chained
together. The channel data of each daisy-chained
pair are shifted out in parallel and received by the
processor through independent data channels.
(fSCLK = fCLK)
MODE SELECTION
CLKDIV
MAXIMUM NUMBER
OF CHANNELS
High-Speed
1
10
High-Resolution
1
21
1
21
Low-Power
Low-Speed
0
10
1
106
0
21
Whether the interface protocol is SPI or Frame-Sync,
it is recommended to synchronize all devices by tying
the SYNC inputs together. When synchronized in SPI
protocol, it is only necessary to monitor the DRDY
output of one ADS1278.
In Frame-Sync interface protocol, the data from all
devices are ready after the rising edge of FSYNC.
Since DOUT1 and DIN are both shifted on the falling
edge of SCLK, the propagation delay on DOUT1
creates a setup time on DIN. Minimize the skew in
SCLK to avoid timing violations.
Table 15. Maximum Channels in a Daisy-Chain
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U1
U2
SYNC
CLK
SYNC
SYNC
CLK
CLK
DIN
SCLK
Note:
DOUT1
DRDY
DRDY Output from Device 1
DOUT1
DOUT from Devices 1 and 2
DIN
SCLK
SCLK
The number of chained devices is limited by the SCLK rate and device mode.
Figure 78. Daisy-Chaining of Two Devices, SPI Protocol (FORMAT[2:0] = 000 or 001)
SCLK
1
DOUT1
2
25
CH1, U1
26
49
CH2, U1
50
CH3, U1
73
74
97
CH4, U1
98
CH5, U1
193
194
217
CH1, U2
218
CH2, U2
385
386
DIN2
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 79. Daisy-Chain Data Format of Figure 78
SYNC
CLK
Serial Data
Devices 3 and 4
SYNC
SYNC
CLK
DIN
SYNC
CLK
DOUT1
DIN
U1
U2
U3
U4
SYNC
CLK
DOUT1
DIN
CLK
DOUT1
DIN
FSYNC
FSYNC
FSYNC
FSYNC
SCLK
SCLK
SCLK
SCLK
DOUT1
Serial Data
Devices 1 and 2
SCLK
FSYNC
Note:
The number of chained devices is limited by the SCLK rate and device mode.
Figure 80. Segmented DOUT Daisy-Chain, Frame-Sync Protocol (FORMAT[2:0] = 011 or 100)
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POWER SUPPLIES
space
The ADS1278 has three power supplies: AVDD,
DVDD, and IOVDD. AVDD is the analog supply that
powers the modulator, DVDD is the digital supply that
powers the digital core, and IOVDD is the digital I/O
power supply. The IOVDD and DVDD power supplies
can be tied together if desired (1.8 V). To achieve
rated performance, it is critical that the power
supplies are bypassed with 0.1-μF and 10-μF
capacitors placed as close as possible to the supply
pins. A single 10-μF ceramic capacitor may be
substituted in place of the two capacitors.
space
Figure 81 shows the start-up sequence of the
ADS1278. At power-on, bring up the DVDD supply
first, followed by IOVDD and then AVDD. Check the
power-supply sequence for proper order, including
the ramp rate of each supply. DVDD and IOVDD may
be sequenced at the same time if the supplies are
tied together. Each supply has an internal reset circuit
whose outputs are summed together to generate a
global power-on reset. After the supplies have
exceeded the reset thresholds, 218 fCLK cycles are
counted before the converter initiates the conversion
process. Following the CLK cycles, the data for 129
conversions are suppressed by the ADS1278 to allow
output of fully-settled data. In SPI protocol, DRDY is
held high during this interval. In frame-sync protocol,
DOUT is forced to zero. The power supplies should
be applied before any analog or digital pin is driven.
For consistent performance, assert SYNC after
device power-on when data first appear.
DVDD
IOVDD
AVDD
1V nom
The ADS1278 incorporates a 6th-order, single-bit,
chopper-stabilized modulator followed by a multistage digital filter that yields the conversion results.
The data stream output of the modulator is available
directly, bypassing the internal digital filter. The digital
filter is disabled, reducing the DVDD current, as
shown in Table 16. In this mode, an external digital
filter implemented in an ASIC, FPGA, or similar
device is required. To invoke the modulator output, tie
FORMAT[2:0], as shown in Figure 82. DOUT[8:1]
then becomes the modulator data stream outputs for
each channel and SCLK becomes the modulator
clock output. The DRDY/FSYNC pin becomes an
unused output and can be ignored. The normal
operation of the Frame-Sync and SPI interfaces is
disabled, and the functionality of SCLK changes from
an input to an output, as shown in Figure 82.
Table 16. Modulator Output Clock Frequencies
CLKDIV
MODULATOR
CLOCK OUTPUT
(SCLK)
DVDD (mA)
00
1
fCLK/4
8
01
1
fCLK/4
7
1
fCLK/8
4
0
fCLK/4
4
1
fCLK/40
1
0
fCLK/8
1
MODE
[1:0]
10
11
(1)
1V nom
MODULATOR OUTPUT
(1)
3V nom
DOUT1
DOUT2
(1)
Modulator Data Channel 1
Modulator Data Channel 2
IOVDD
Internal Reset
DIN
CLK
18
2
fCLK
FORMAT0
129 (max)
tDATA
DRDY
(SPI Protocol)
DOUT
(Frame-Sync Protocol)
FORMAT1
DOUT8
FORMAT2
SCLK
Modulator Data Channel 8
Modulator Clock Output
Figure 82. Modulator Output
Valid Data
Figure 81. Start-Up Sequence
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In modulator output mode, the frequency of the
modulator clock output (SCLK) depends on the mode
selection of the ADS1278. Table 16 lists the
modulator clock output frequency and DVDD current
versus device mode.
Figure 83 shows the timing relationship of the
modulator clock and data outputs.
The data output is a modulated 1s density data
stream. When VIN = +VREF, the 1s density is
approximately 80% and when VIN = –VREF, the 1s
density is approximately 20%.
Modulator
Clock Output
SCLK
Modulator
Data Output
DOUT
(13ns max)
Figure 83. Modulator Output Timing
PIN TEST USING TEST[1:0] INPUTS
The test mode feature of the ADS1278 allows
continuity testing of the digital I/O pins. In this mode,
the normal functions of the digital pins are disabled
and routed to each other as pairs through internal
logic, as shown in Table 17. The pins in the left
column drive the output pins in the right column.
Note: some of the digital input pins become outputs;
these outputs must be accommodated in the design.
The analog input, power supply, and ground pins all
remain connected as normal. The test mode is
engaged by setting the pins TEST [1:0] = 11. For
normal converter operation, set TEST[1:0] = 00. Do
not use '01' or '10'.
40
Table 17. Test Mode Pin Map (TEST[1:0] = 11)
TEST MODE PIN MAP
INPUT PINS
OUTPUT PINS
PWDN1
DOUT1
PWDN2
DOUT2
PWDN3
DOUT3
PWDN4
DOUT4
PWDN5
DOUT5
PWDN6
DOUT6
PWDN7
DOUT7
PWDN8
DOUT8
MODE0
DIN
MODE1
SYNC
FORMAT0
CLKDIV
FORMAT1
FSYNC/DRDY
FORMAT2
SCLK
VCOM OUTPUT
The VCOM pin provides a voltage output equal to
AVDD/2. The intended use of this output is to set the
output common-mode level of the analog input
drivers. The drive capability of the output is limited;
therefore, the output should only be used to drive
high-impedance nodes (> 1 MΩ). In some cases, an
external buffer may be necessary. A 0.1-μF bypass
capacitor is recommended to reduce noise pickup.
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OPA350
VCOM » (AVDD/2)
0.1mF
Figure 84. VCOM Output
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ADS1278-HT
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SBAS447C – MARCH 2009 – REVISED AUGUST 2012
APPLICATION INFORMATION
To obtain the specified performance from the
ADS1278, the following layout and component
guidelines should be considered.
1. Power Supplies: The device requires three
power supplies for operation: DVDD, IOVDD, and
AVDD. The allowed range for DVDD is 1.65 V to
1.95 V; the range of IOVDD is 1.65 V to 3.6 V;
AVDD is restricted to 4.75 V to 5.25 V. For all
supplies, use a 10-μF tantalum capacitor,
bypassed with a 0.1-μF ceramic capacitor, placed
close to the device pins. Alternatively, a single
10-μF ceramic capacitor can be used. The
supplies should be relatively free of noise and
should not be shared with devices that produce
voltage spikes (such as relays, LED display
drivers, etc.). If a switching power-supply source
is used, the voltage ripple should be low (less
than 2 mV) and the switching frequency outside
the passband of the converter.
2. Ground Plane: A single ground plane connecting
both AGND and DGND pins can be used. If
separate digital and analog grounds are used,
connect the grounds together at the converter.
3. Digital Inputs: It is recommended to sourceterminate the digital inputs to the device with 50Ω series resistors. The resistors should be placed
close to the driving end of digital source
(oscillator, logic gates, DSP, etc.) This placement
helps to reduce ringing on the digital lines (ringing
may lead to degraded ADC performance).
4. Analog/Digital Circuits: Place analog circuitry
(input buffer, reference) and associated tracks
together, keeping them away from digital circuitry
(DSP, microcontroller, logic). Avoid crossing
digital tracks across analog tracks to reduce
noise coupling and crosstalk.
5. Reference Inputs: It is recommended to use a
minimum 10-μF tantalum with a 0.1-μF ceramic
capacitor directly across the reference inputs,
VREFP and VREFN. The reference input should
be driven by a low-impedance source. For best
performance, the reference should have less than
3 μVRMS in-band noise. For references with noise
higher than this level, external reference filtering
may be necessary.
6. Analog Inputs: The analog input pins must be
driven differentially to achieve specified
performance. A true differential driver or
transformer (ac applications) can be used for this
purpose. Route the analog inputs tracks (AINP,
AINN) as a pair from the buffer to the converter
using short, direct tracks and away from digital
tracks. A 1-nF to 10-nF capacitor should be used
directly across the analog input pins, AINP and
AINN. A low-k dielectric (such as COG or film
type) should be used to maintain low THD.
Capacitors from each analog input to ground can
be used. They should be no larger than 1/10 the
size of the difference capacitor (typically 100 pF)
to preserve the ac common-mode performance.
7. Component Placement: Place the power supply,
analog input, and reference input bypass
capacitors as close as possible to the device
pins. This layout is particularly important for
small-value ceramic capacitors. Larger (bulk)
decoupling capacitors can be located farther from
the device than the smaller ceramic capacitors.
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PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ADS1278SHFQ
ACTIVE
CFP
HFQ
84
1
TBD
AU
N / A for Pkg Type
ADS1278SHKP
PREVIEW
CFP
HKP
84
1
TBD
Call TI
Call TI
ADS1278SKGDA
ACTIVE
XCEPT
KGD
0
180
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ADS1278-HT :
• Catalog: ADS1278
• Enhanced Product: ADS1278-EP
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
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