HOTTECH CHIP CERAMIC CAPACITORS 1．PART NUMBER e.g.: C2012N680J101NT C 2012 N 680 J 101 N T Code: Size: Capacitance: Tolerance Terminal: Packing: MLCC 0603（0201） 0R5=0.5pF T: in Tape 100=10 pF N: B: in Box 1608（0603） 680=68 pF 2012（0805） 104=100nF 3216（1206） 106=10uF B=±0.1pF C=±0.25PF D=±0. 5PF F=±1% G=±2% J =±5% K=±10% M=±20% Z=-20%+80% S: in silver 1005（0402） 3225（1210） 4532（1812） Dielectric: N=COG/NPO B=X7R A=X5R F=Y5V E=Z5U Three Layers Rated Voltage: 100=10V 250=25V 101=100V 102=1000V 2．STRUCTURE 介质：Dielectric 电极：Electrode 端头：Terminal 银：Silver 镍：Nickel 锡：Tin Inner Structure Three Electrode layers GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P1 HOTTECH CHIP CERAMIC CAPACITORS 3．SIZE AND ELECTRICAL PARAMETERS SIZE (mm) DIMENSION (mm) INCH METRIC 0201 0603 0.6±0.03 0402 1005 1.00±0.05 0603 1608 1.60±0.10 L W T E 0.3±0.03 0.15±0.05 0.50±0.05 0.50±0.05 0.25±0.10 0.80±0.10 0.80±0.10 0.30±0.10 0.3±0.03 0.70±0.20 0805 2012 2.00±0.20 1.25±0.20 1.00±0.20 0.50±0.20 1.25±0.20 0.70±0.20 1206 3216 3.20±0.30 1.60±0.2 1210 3225 3.20±0.30 2.50±0.30 1812 4532 4.50±0.40 3.20±0.30 1.00±0.20 0.50±0.25 1.25±0.20 1.25±0.30 1.50±0.30 ≤2.5 GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. 0.75±0.25 0.75±0.20 Page:P11-P2 HOTTECH CHIP CERAMIC CAPACITORS 4. DIELECTRIC CHARACTERISTIC INTRODUCTION AND TEST METHOD ITEM STANDARD TEST METHOD Capacitance 0.5PF-47uF COG： Tolerance B=±0.1PF C=±0.25PF D=±0.5.PF C≤1000PF ：1MHz±10% F=±1% G=±2% J=±5% 1.0±0.2Vrms K=±10% M=±20% C＞1000PF：1KHz±10% 1.0±0.2Vrms Rated Voltage 16、25、50、100、200、500、1000、2000 V(DC) Dissipation COG/NPO DF≤0.15% Factor X7R/X5R DF ≤ 2.5%( ≥ 50V) , ≤ 3.0%(25V) , ≤ X7R/X5R： Y5V/Z5U： 3.5%(16V) Y5V/Z5U ≤ DF 7%(C ≥ 100nF) . ≤ 3.5%(C<100nF) COG/NPO 1KHz±10% 1.0±0.2Vrms 1KHz±10% 1.0±0.2Vrms ≤10uF 120Hz 0.5±0.2Vrms C≤10NF IR＞50000MΩ; Test voltage: rated C＞10NF IR＞5000ΩF Time: 1 minute C≤25NF IR＞10000MΩ; Temperature: 18-25℃ Insulation C＞25NF RXC＞100ΩF Humidity: <80% Resistance（IR） Y5V/Z5U C≤25NF IR＞4000MΩ; X7R/X5R ＞10uF C＞25NF RXC＞100ΩF Apply 2.5x rated voltage to both terminations Dielectric No damage after test for 5 seconds, charge and discharge current are withstanding less than 50mA. (This test doesn’t apply to voltage high-voltage MLCC) Termination No damage after test Test Condition: 5N 10±1S Adhesion No damage after test and capacitance tolerance shall not be After soldering capacitor on the PCB, 1mm per more than 10% 1 second of bending for this PCB shall be Bending Strength applied. 235±5℃ Temperature Solderability Time 1±1S molthen rosin for 2s and then put it in the Cover ≥95 10mm molthen solder with a temperature of to soldering Heat Time pick it up, clean the solvent and inspect it 1±1S under 10x or more microscope. Cover ≥95 △C/C ≤0.5% or 0.5PF Dielectric COG/NPO X7R/X5R Y5V/Z5U Temperature: △C/C ≤1% ≤±10% ≤±30% COG/X7R Temperature Cycling 235±5℃（265±5℃）for 2(5)s. after that 265±5℃ Tempertaure Resistance Completely immerse the capacitor in the No damage after test -55 ± 3 ℃ ~125 ± 3 ℃ -25±3℃~85±3℃ Y5V -10±3℃~85±3℃ Z5U Cycle times: 5 times per 30s Resume time: 24h GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P3 HOTTECH CHIP CERAMIC CAPACITORS Dielectric COG/NPO X7R/X5R Y5V/Z5U Permanent Moisture Humidity and △C/C ≤2% ≤10% ≤20% T=40±2℃ Moisture DF 0.03 0.05 0.07 T=21D Resistance IR RXC＞25S RXC＞25S RXC＞25S Relative Humidity: 93+2~3% Resume Time: 1-2h No damage after test T.C. characteristics dielectric △C/C COG/NPO ±30PPM +20℃ -55℃ +20℃ +125℃ X7R/X5R ±15℃ +20℃ -55℃ +20℃ +125℃ Z5U ±22%~56% +20℃ +10℃ +20℃ +85℃ Y5V ±22%~82% +20℃ -25℃ +20℃ +85℃ T.C. f=10-500Hz Vibration No damage after test Bump Life test 0.75MM/2S No damage after test 4000 times dielectric COG/NPO X7R/X5R Y5V/Z5U Temperature: +125℃ NPO/X7R △C/C ≤2% ≤±12.5% ≤±30% +85℃ Y5V/Z5U DF 0.003 0.003 0. 05 T=100 h IR RXC＞25S RXC＞25S RXC＞25S Resume time: 24h GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P4 HOTTECH CHIP CERAMIC CAPACITORS 5. T.C.CHARACTERISTICS Dielectric NPO(COG) X7R(X5R) Y5V Operating Temperature -55~125℃ -55~125(85)℃ -30~85℃ T.C.Characteristics ±30PPM/℃ ±15% -20~+80% COG8/NPO Typical Characteristics X7R/X5R Typical Characteristics Y5V Typical Characteristics GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P5 HOTTECH CHIP CERAMIC CAPACITORS 6. VOLTAGE AND CAPACITANCE ( COG/NPO) Size 0201 0402 0603 0805 1206 1210 1812 Voltage Capacitance 25V 0.5 PF -1000PF 50V 0.5 PF -680PF 25V 0.5 PF -2200PF 50V 0.5 PF -2200PF 25V 0.5 PF -10000PF 50V 0.5 PF -10000PF 25V 0.5 PF -68000PF 50V 0.5 PF -47000PF 16V 0.5 PF -100000PF 25V 0.5 PF -100000PF 50V 0.5 PF -68000PF 25V 470 PF -47000PF 50V 560 PF -56000PF 25V 1000 PF -100000PF 50V 1000 PF -47000PF GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P6 HOTTECH CHIP CERAMIC CAPACITORS （X7R/X5R） Size 0402 0603 0805 1206 1210 1812 Voltage Capacitance 6.3V 100 PF -1.0 uF 10V 100 PF -680nF 16V 100 PF -220nF 6.3V 100 PF -4.7 uF 10V 100 PF -4.7 uF 16V 100 PF -2.2 uF 25V 100 PF -2.2 uF 50V 100 PF -1.0 uF 6.3V 220 PF -10 uF 10V 220 PF -10 uF 16V 220 PF -10 uF 25V 220 PF -4.7 uF 50V 220 PF -2.2 uF 6.3V 220 PF -10 uF 10V 220 PF -10uF 16V 220 PF -10 uF 25V 220 PF -10 uF 50V 220 PF -10 uF 6.3V 1000 PF -47 uF 10V 1000 PF -22 uF 16V 1000 PF -22 uF 25V 1000 PF -22 uF 50V 1000 PF -10 uF 25V 10000 PF -47 uF 50V 10000 PF -22 uF GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P7 HOTTECH CHIP CERAMIC CAPACITORS (Y5V) Size 0402 0603 0805 1206 1210 1812 Voltage Capacitance 6.3V 100nF -1 uF 10V 100nF -1 uF 16V 22nF -680nF 50V 22nF -680nF 6.3V 680nF-4.7 uF 10V 22nF -4.7 uF 16V 22nF -4.7 uF 25V 22nF -2.2 uF 50V 22nF -1 uF 6.3V 4.7 uF -10 uF 10V 2.2 uF -10 uF 16V 22nF -4.7 uF 25V 22nF -2.2 uF 50V 22nF -1 uF 6.3V / 10V 2.2uF -22 uF 16V 1uF -10 uF 25V 22nF -10 uF 50V 22nF -10 uF 6.3V 22nF-47 uF 10V 10uF-22 uF 16V 2.2uF-10 uF 25V 220nF-2.2 uF 50V 22nF -10 uF 25V 10uF-47 uF 50V 22nF-22uF GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P8 HOTTECH CHIP CERAMIC CAPACITORS 7.Packing Information Reel Dimension 0201 A B C F W mm 178±2.0 60.0±1.0 13.5±0.5 11.4±0.1 9.00±0.3 Inch 7.008±0.079 2.362±0.039 0.531±0.020 0.449±0.039 0.354±0.012 mm 178±2.0 60.0±1.0 13.5±0.5 15.4±1.0 13.0±0.3 Inch 7.008±0.079 2.362±0.039 0.531±0.020 0.606±0.039 0.512±0.012 0402 0603 0805 1206 1210 1812 Packing Quantity Paper Tape Plastic Tape 0201 0402 0603 0805 1206 10K/15K 10K 4K 4K 4K 2K 2K 1210 1812 1K/2K 500PCS GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P9 HOTTECH CHIP CERAMIC CAPACITORS Tape Unit: mm TYPE A B W P0 P1 P2 0201 0.38±0.05 0.68±0.05 8.00±0.20 4.00±0.10 2.00±0.10 2.00±0.05 0402 0.65±0.10 1.15±0.10 8.00±0.20 4.00±0.10 2.00±0.10 2.00±0.05 0603 1.10±0.10 1.90±0.10 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05 0805 1.65±0.20 2.40±0.20 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05 1206 2.00±0.20 3.60±0.20 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05 1210 2.80±0.10 3.50±0.10 8.00±0.20 4.00±0.10 4.00±0.10 2.00±0.05 1812 3.60±0.20 4.90±0.20 12.00±0.10 4.00±0.10 4.00±0.10 2.00±0.05 GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P10 HOTTECH CHIP CERAMIC CAPACITORS 8.WELDING TEMPERATURE Suitable reflow temperature 1-2℃/Sec ramp Preheat 150-183℃：2-3 minutes Time above 183℃：60-100 seconds Peak Temperature：230±10℃ Module should only be in oven for 5.5-6 minute GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. Page:P11-P11