ASM3P2108A November 2006 rev 0.4 Peak EMI Reducing Solution Features savings by reducing the number of circuit board layers ferrite beads, shielding and other passive components • FCC approved method of EMI attenuation. • Generates a 1X low EMI spread spectrum clock of the input frequency. • Input frequency range: 25MHz to 45MHz. • Internal loop filter minimizes external that are traditionally required to pass EMI regulations. The ASM3P2108A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. components and board space. • Frequency deviation: - 1.3%( Typ) @32MHz. • Low cycle-to-cycle jitter. • 5.0V ± 5% operating voltage range. • TTL or CMOS compatible outputs. • Available in 8-pin SOIC and TSSOP Packages. The ASM3P2108A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced Product Description by oscillators and most frequency generators. Lowering The ASM3P2108A is a versatile spread spectrum spectrum clock generation’. EMI by increasing a signal’s bandwidth is called ‘spread frequency modulator designed specifically for input clock frequencies from 25MHz to 45MHz. The ASM3P2108A Applications can generate an EMI reduced clock from crystal, ceramic The ASM3P2108A is targeted towards EMI management resonator, or system clock. for high speed digital applications such as PC peripheral The ASM3P2108A reduces electromagnetic interference devices, consumer electronics and embedded controller (EMI) at the clock source, allowing system wide reduction systems. of EMI of down stream clock and data dependent signals. The ASM3P2108A allows significant system cost Block Diagram VDD PLL Modulation XIN Crystal Oscillator XOUT Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider CLOCKOUT GND PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P2108A November 2006 rev 0.4 Pin Configuration XIN / CLKIN 1 XOUT 2 ASM3P2108A GND 3 NC 4 8 NC 7 NC 6 VDD 5 CLOCKOUT Pin Description Pin# Pin Name Type Description 1 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 GND P Ground to entire chip. 4 NC - No connect. 5 CLOCKOUT O Spread spectrum low EMI output. 6 VDD P Power supply for the entire chip (5V). 7 NC - No connect. 8 NC - No connect. Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 7 ASM3P2108A November 2006 rev 0.4 Absolute Maximum Ratings Symbol Parameter VDD, VIN TSTG Rating Unit Voltage on any pin with respect to Ground -0.5 to +7.0 V Storage temperature -65 to +125 °C TA Operating temperature 0 to 70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV Static Discharge Voltage TDV (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input low voltage GND – 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - 44 - µA IIH Input high current - 66 - µA IXOL XOUT output low current (@ 0.4, VDD = 5V) - 3 - mA IXOH XOUT output high current (@2.5V, VDD = 5V) - 3 - mA VOL Output low voltage (VDD = 5V, IOL = 20mA) - - 0.4 V VOH Output high voltage (VDD = 5V, IOH = 20mA) Dynamic supply current normal mode (5V, 32MHz and 15pF loading) Static supply current standby mode 2.5 - - V - 40 - mA - 40 - µA VDD Operating voltage 4.75 5.0 5.25 V tON Power up time (first locked clock cycle after power up) - 0.18 - mS Clock out impedance - 50 - Ω ICC IDD ZOUT AC Electrical Characteristics Symbol fIN MODOUT Parameter Min Typ Max Unit Input frequency 25 - 45 MHz Output frequency 25 - -1.98 -0.60 440 45 - MHz - 300 - pS - - 360 pS 45 50 55 % tLH* Input Frequency =25MHz Frequency Deviation Input Frequency =45MHz Output rise time (measured at 0.8V to 2.0V) tHL* Output fall time (measured at 2.0V to 0.8V) tJC Jitter (cycle to cycle) tD Output duty cycle fd % pS * VDD = +5V, Input Frequency = 32MHz, tLH and tHL are measured into a capacitive load of 15pF Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 7 ASM3P2108A November 2006 rev 0.4 Package Information 8-Pin SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Millimeters Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 7 ASM3P2108A November 2006 rev 0.4 8-Pin TSSOP Package H E D A2 A C θ e A1 L B Dimensions Symbol Inches Millimeters Min Max Min Max A …… 0.043 ….. 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 7 ASM3P2108A November 2006 rev 0.4 Ordering Codes Marking Part Number Package Temperature ASM3P2108AF-08-SR 3P2108AF 8-PIN SOIC, TAPE AND REEL, Pb Free Commercial ASM3P2108AF-08-ST 3P2108AF 8-PIN SOIC, TUBE, Pb Free Commercial ASM3P2108AF-08-TR 3P2108AF 8-PIN TSSOP, TAPE AND REEL, Pb Free Commercial ASM3P2108AF-08-TT 3P2108AF 8-PIN TSSOP, TUBE, Pb Free Commercial ASM3P2108AG-08-SR 3P2108AG 8-PIN SOIC, TAPE AND REEL, Green Commercial ASM3P2108AG-08-ST 3P2108AG 8-PIN SOIC, TUBE, Green Commercial ASM3P2108AG-08-TR 3P2108AG 8-PIN TSSOP, TAPE AND REEL, Green Commercial ASM3P2108AG-08-TT 3P2108AG 8-PIN TSSOP, TUBE, Green Commercial Device Ordering Information A S M 3 P 2 1 0 8 A G - 0 8 - S T R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 7 ASM3P2108A November 2006 rev 0.4 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P2108A Document Version: v0.4 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 7