Superworld C1-82NJ-10 Ceramic chip inductor Datasheet

CERAMIC CHIP INDUCTORS
C1 SERIES
1. PART NO. EXPRESSION :
C1-1N0S-10
(a) Series code
(a)
(b) Inductance code : 1N0 = 1.0nH
(b) (c)
(d)
(d) 10 : Lead Free
(c) Tolerance code : S = ±0.3nH, J = ±5%
2. CONFIGURATION & DIMENSIONS :
A
D
C
B
Unit:m/m
A
B
C
D
1.0±0.05
0.5±0.05
0.5±0.05
0.1 ~ 0.3
3. GENERAL SPECIFICATION :
a) Operating temp. : -40°C to +85°C
b) Storage temp. : -10°C to +40°C
c) Humdity range : 70% RH Max.
d) Resistance to solder heat : 265°C.6secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C1 SERIES
6. ELECTRICAL CHARACTERISTICS :
EIA
Size
Inductance
( nH )
Q
Min.
Test
Frequency
( MHz )
SRF
( GHz )
Min.
DCR
(ȍ)
Max.
Rated Current
( mA )
Max.
C1-1N0S-10
0402
1.0
8
100
10
0.08
300
C1-1N2S-10
0402
1.2
8
100
10
0.09
300
C1-1N5S-10
0402
1.5
8
100
6
0.10
300
C1-1N8S-10
0402
1.8
8
100
6
0.12
300
C1-2N0S-10
0402
2.0
8
100
6
0.12
300
C1-2N2S-10
0402
2.2
8
100
6
0.13
300
C1-2N4S-10
0402
2.4
8
100
6
0.13
300
C1-2N7S-10
0402
2.7
8
100
6
0.13
300
C1-3N0S-10
0402
3.0
8
100
6
0.16
300
C1-3N3S-10
0402
3.3
8
100
6
0.16
300
C1-3N9S-10
0402
3.9
8
100
4
0.21
300
C1-4N7S-10
0402
4.7
8
100
4
0.21
300
C1-5N6S-10
0402
5.6
8
100
4
0.23
300
C1-6N8J-10
0402
6.8
8
100
3.9
0.25
300
C1-8N2J-10
0402
8.2
8
100
3.6
0.28
300
C1-10NJ-10
0402
10
8
100
3.2
0.31
300
C1-12NJ-10
0402
12
8
100
2.7
0.40
300
C1-15NJ-10
0402
15
8
100
2.3
0.46
300
C1-18NJ-10
0402
18
8
100
2.1
0.55
300
C1-22NJ-10
0402
22
8
100
1.9
0.60
300
C1-27NJ-10
0402
27
8
100
1.6
0.70
300
C1-33NJ-10
0402
33
8
100
1.3
0.80
200
C1-39NJ-10
0402
39
8
100
1.2
0.90
200
C1-47NJ-10
0402
47
8
100
1.0
1.00
200
C1-56NJ-10
0402
56
8
100
0.75
1.00
200
C1-68NJ-10
0402
68
8
100
0.75
1.20
180
C1-82NJ-10
0402
82
8
100
0.60
1.30
150
C1-R10J-10
0402
100
8
100
0.60
1.50
150
C1-R12J-10
0402
120
8
100
0.60
1.60
150
Part Number
Tolerance code :
S : ±0.3nH
J : ±5%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
C1 SERIES
7. CHARACTERISTICS CURVES :
Inductance vs. Frequency
Q vs. Frequency
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C1 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Solder Heat Resistance
PERFORMANCE
TEST CONDITION
Appearance : Cracks should not be allowed.
More than 75% of the terminal electrode
should be covered with new solder.
Preheat : 100~150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 265±3°C
Flux : Rosin
Dip Time : 6±1sec.
Preheating Dipping
265°C
150°C
Solderability
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 240±5°C
Flux : Rosin
Dip Time : 3±1sec.
240°C
More than 90% of the terminal electrode
should be covered with new solder.
150°C
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
60
seconds
6±1
seconds
Preheating Dipping
60
seconds
Natural
cooling
Natural
cooling
3±1.0
seconds
For C Series :
Size
Force (Kfg)
1
0.2
2
0.5
3
0.6
4
1.0
5
1.0
6
1.0
7
1.5
8
2.0
Time (sec)
> 25
Solder a chip on a test substrate, bend the substrate
by 3mm (0.118in) for 10secs and return.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C1 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Bending Strength
PERFORMANCE
TEST CONDITION
The ferrite should not be damaged by forces
applied on the right condition.
1.0(0.039)
R0.5(0.02)
Chip
A
High Temperature Resistance
Appearance : No damage.
Inductance : Within ±20% of initial value.
Humidity : 90~95% RH.
Temperature : 60±2°C
Applied Current : rated current (max.)
Duration : 1008±12hrs
Measurement : After placing for at least 24hrs.
Humidity Resistance
Thermal Shock
Appearance : Cracking, chipping or any other
defects that are harmful to the characteristics
shall not be allowed.
Inductance : Within ±20% of initial value.
Low temperature storage test
Temperature : 85±5°C
Applied Current : rated current
Duration : 1008±12hrs
Measurement : After placing for at least 24hrs.
Phase
Temperature (°C)
Times (min.)
1
-40±2°C
30
2
+85±5°C
30
Measured : 100 times
For C Series :
Condition for 1 cycle
Step1 : -40±2°C 30 min.
Step2 : +85±5°C 30 min.
Number of cycles : 100
Measurement : After placing for at least 24hrs.
Temperature : -40±2°C
Duration : 1008±12hrs
Measurement : After placing for at least 24hrs.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
C1 SERIES
9. SOLDERING :
9-1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
A
TEMPERATURE °C
main heating
1 to 5
°C/sec
Heat time
50 to 150
sec
Heat temperature
120 to 180
°C
C
Slope of temp. rise
1 to 5
°C/sec
D
Time over 230°C
90 ~ 120
sec
Peak temperature
255 ~ 260
°C
Peak hold time
10 max.
sec
No. of mounting
3
times
E
230°C
B
180°C
pre-heating
120°C
normal
temperature
A
B
C
E
D
TIME(sec.)
Slope of temp. rise
(Melting area of solder)
9-2. Soldering Iron
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 3.0mm tip diameter (max)
e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm
f) Limit soldering time to 3 secs.
9-3. Solder Volume :
t
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance. Solder shall be used not to be exceed as shown in right side.
Upper limit
Recommendable
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
C1 SERIES
10. PACKAGING INFORMATION :
10-1. Carrier Tape Packaging
P0
D0
t
B
W
F
E
P2
P1
A
Ko
Unreeling direction
A(mm)
B(mm)
W(mm)
F(mm)
E(mm)
P1(mm)
P2(mm)
P0(mm)
0.65±0.1
1.15±0.1
8±0.2
3.5±0.05
1.75±0.1
4±0.1
2±0.05
4±0.1
D0(mm)
1.5
+0.1
-0
Ko(mm)
t(mm)
0.8±0.05
0.2±0.05
10-2. Leader And Trailer Tape
500 to 560mm
Blank
10 to 20 pitches
Blank
440mm Min.
Components
Leader
End
110mm or more
Unreeling direction
10-3. Configuration
W
t
2±0.5
±0.8
A(mm)
N(mm)
W(mm)
t(mm)
Qty (pcs)
178±2.0
Ø60±2
10±1.5
2±0.5
10000/Reel
A
N
1 3 .0
±
21
8
0.
R1.0
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
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