CERAMIC CHIP INDUCTORS C1 SERIES 1. PART NO. EXPRESSION : C1-1N0S-10 (a) Series code (a) (b) Inductance code : 1N0 = 1.0nH (b) (c) (d) (d) 10 : Lead Free (c) Tolerance code : S = ±0.3nH, J = ±5% 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B C D 1.0±0.05 0.5±0.05 0.5±0.05 0.1 ~ 0.3 3. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -10°C to +40°C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265°C.6secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C1 SERIES 6. ELECTRICAL CHARACTERISTICS : EIA Size Inductance ( nH ) Q Min. Test Frequency ( MHz ) SRF ( GHz ) Min. DCR (ȍ) Max. Rated Current ( mA ) Max. C1-1N0S-10 0402 1.0 8 100 10 0.08 300 C1-1N2S-10 0402 1.2 8 100 10 0.09 300 C1-1N5S-10 0402 1.5 8 100 6 0.10 300 C1-1N8S-10 0402 1.8 8 100 6 0.12 300 C1-2N0S-10 0402 2.0 8 100 6 0.12 300 C1-2N2S-10 0402 2.2 8 100 6 0.13 300 C1-2N4S-10 0402 2.4 8 100 6 0.13 300 C1-2N7S-10 0402 2.7 8 100 6 0.13 300 C1-3N0S-10 0402 3.0 8 100 6 0.16 300 C1-3N3S-10 0402 3.3 8 100 6 0.16 300 C1-3N9S-10 0402 3.9 8 100 4 0.21 300 C1-4N7S-10 0402 4.7 8 100 4 0.21 300 C1-5N6S-10 0402 5.6 8 100 4 0.23 300 C1-6N8J-10 0402 6.8 8 100 3.9 0.25 300 C1-8N2J-10 0402 8.2 8 100 3.6 0.28 300 C1-10NJ-10 0402 10 8 100 3.2 0.31 300 C1-12NJ-10 0402 12 8 100 2.7 0.40 300 C1-15NJ-10 0402 15 8 100 2.3 0.46 300 C1-18NJ-10 0402 18 8 100 2.1 0.55 300 C1-22NJ-10 0402 22 8 100 1.9 0.60 300 C1-27NJ-10 0402 27 8 100 1.6 0.70 300 C1-33NJ-10 0402 33 8 100 1.3 0.80 200 C1-39NJ-10 0402 39 8 100 1.2 0.90 200 C1-47NJ-10 0402 47 8 100 1.0 1.00 200 C1-56NJ-10 0402 56 8 100 0.75 1.00 200 C1-68NJ-10 0402 68 8 100 0.75 1.20 180 C1-82NJ-10 0402 82 8 100 0.60 1.30 150 C1-R10J-10 0402 100 8 100 0.60 1.50 150 C1-R12J-10 0402 120 8 100 0.60 1.60 150 Part Number Tolerance code : S : ±0.3nH J : ±5% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C1 SERIES 7. CHARACTERISTICS CURVES : Inductance vs. Frequency Q vs. Frequency NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C1 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Solder Heat Resistance PERFORMANCE TEST CONDITION Appearance : Cracks should not be allowed. More than 75% of the terminal electrode should be covered with new solder. Preheat : 100~150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 265±3°C Flux : Rosin Dip Time : 6±1sec. Preheating Dipping 265°C 150°C Solderability Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 240±5°C Flux : Rosin Dip Time : 3±1sec. 240°C More than 90% of the terminal electrode should be covered with new solder. 150°C Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 60 seconds 6±1 seconds Preheating Dipping 60 seconds Natural cooling Natural cooling 3±1.0 seconds For C Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 8 2.0 Time (sec) > 25 Solder a chip on a test substrate, bend the substrate by 3mm (0.118in) for 10secs and return. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C1 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. 1.0(0.039) R0.5(0.02) Chip A High Temperature Resistance Appearance : No damage. Inductance : Within ±20% of initial value. Humidity : 90~95% RH. Temperature : 60±2°C Applied Current : rated current (max.) Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Humidity Resistance Thermal Shock Appearance : Cracking, chipping or any other defects that are harmful to the characteristics shall not be allowed. Inductance : Within ±20% of initial value. Low temperature storage test Temperature : 85±5°C Applied Current : rated current Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Phase Temperature (°C) Times (min.) 1 -40±2°C 30 2 +85±5°C 30 Measured : 100 times For C Series : Condition for 1 cycle Step1 : -40±2°C 30 min. Step2 : +85±5°C 30 min. Number of cycles : 100 Measurement : After placing for at least 24hrs. Temperature : -40±2°C Duration : 1008±12hrs Measurement : After placing for at least 24hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C1 SERIES 9. SOLDERING : 9-1. Reflow soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. A TEMPERATURE °C main heating 1 to 5 °C/sec Heat time 50 to 150 sec Heat temperature 120 to 180 °C C Slope of temp. rise 1 to 5 °C/sec D Time over 230°C 90 ~ 120 sec Peak temperature 255 ~ 260 °C Peak hold time 10 max. sec No. of mounting 3 times E 230°C B 180°C pre-heating 120°C normal temperature A B C E D TIME(sec.) Slope of temp. rise (Melting area of solder) 9-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs. 9-3. Solder Volume : t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side. Upper limit Recommendable NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C1 SERIES 10. PACKAGING INFORMATION : 10-1. Carrier Tape Packaging P0 D0 t B W F E P2 P1 A Ko Unreeling direction A(mm) B(mm) W(mm) F(mm) E(mm) P1(mm) P2(mm) P0(mm) 0.65±0.1 1.15±0.1 8±0.2 3.5±0.05 1.75±0.1 4±0.1 2±0.05 4±0.1 D0(mm) 1.5 +0.1 -0 Ko(mm) t(mm) 0.8±0.05 0.2±0.05 10-2. Leader And Trailer Tape 500 to 560mm Blank 10 to 20 pitches Blank 440mm Min. Components Leader End 110mm or more Unreeling direction 10-3. Configuration W t 2±0.5 ±0.8 A(mm) N(mm) W(mm) t(mm) Qty (pcs) 178±2.0 Ø60±2 10±1.5 2±0.5 10000/Reel A N 1 3 .0 ± 21 8 0. R1.0 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7