AD ADM3073EYRZ 3.3 v, 15,-15 kv esd-protected Datasheet

3.3 V, ±15 kV ESD-Protected, Half- and
Full-Duplex, RS-485/RS-422 Transceivers
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
VCC
ADM3070E/
ADM3073E/
ADM3076E
R
RO
DE
Z
D
Y
The devices have a ⅛ unit load receiver input impedance, which
allows up to 256 transceivers on a bus. Because only one driver
should be enabled at any time, the output of a disabled or powereddown driver is tristated to avoid overloading the bus.
06285-001
DI
GND
Figure 1.
VCC
ADM3071E/
ADM3074E/
ADM3077E
R
RO
DI
D
A
B
Z
Y
GND
Figure 2.
VCC
ADM3072E/
ADM3075E/
ADM3078E
GENERAL DESCRIPTION
The ADM307xE are 3.3 V, low power data transceivers with
±15 kV ESD protection suitable for full- and half-duplex
communication on multipoint bus transmission lines. They
are designed for balanced data transmission, and they comply
with TIA/EIA standards: RS-485 and RS-422.
B
RE
APPLICATIONS
Power/energy metering
Industrial control
Lighting systems
Telecommunications
Security systems
Instrumentation
A
06285-002
TIA/EIA RS-485/RS-422 compliant
±15 kV ESD protection on RS-485 input/output pins
Data rates
ADM3070E/ADM3071E/ADM3072E: 250 kbps
ADM3073E/ADM3074E/ADM3075E: 500 kbps
ADM3076E/ADM3077E/ADM3078E: 16 Mbps
Half- and full-duplex options
True fail-safe receiver inputs
Up to 256 nodes on the bus
−40°C to +125°C temperature option
Hot-swap input structure on DE and RE pins
Reduced slew rates for low EMI
Low power shutdown current (all except ADM3071E/
ADM3074E/ADM3077E)
Outputs high-Z when disabled or powered off
Common-mode input range: −7 V to +12 V
Thermal shutdown and short-circuit protection
8-lead and 14-lead narrow SOIC packages
FUNCTIONAL BLOCK DIAGRAMS
RO
R
RE
A
DE
B
DI
D
GND
06285-003
FEATURES
Figure 3.
The receiver inputs have a true fail-safe feature, which eliminates
the need for external bias resistors and ensures a logic high
output level when the inputs are open or shorted. This guarantees that the receiver outputs are in a known state before
communication begins and when communication ceases.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2009 Analog Devices, Inc. All rights reserved.
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ........................................... 12
Applications ....................................................................................... 1
Circuit Description......................................................................... 15
General Description ......................................................................... 1
Function Tables........................................................................... 15
Functional Block Diagrams ............................................................. 1
Receiver Fail-Safe ....................................................................... 15
Revision History ............................................................................... 2
Hot-Swap Capability .................................................................. 16
Specifications..................................................................................... 4
Line Length vs. Data Rate ......................................................... 16
Timing Specifications—
ADM3070E/ADM3071E/ADM3072E....................................... 5
±15 kV ESD Protection ............................................................. 16
Timing Specifications—
ADM3073E/ADM3074E/ADM3075E....................................... 6
256 Transceivers on the Bus ...................................................... 16
Timing Specifications—
ADM3076E/ADM3077E/ADM3078E....................................... 7
Low Power Shutdown Mode ..................................................... 17
Absolute Maximum Ratings............................................................ 8
ESD Caution .................................................................................. 8
Pin Configurations and Function Descriptions ........................... 9
Test Circuits and Switching Characteristics ................................ 10
Human Body Model .................................................................. 16
Reduced EMI and Reflections .................................................. 16
Driver Output Protection .......................................................... 17
Typical Applications ................................................................... 17
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 20
REVISION HISTORY
8/09—Rev. D to Rev. E
Changes to Ordering Guide .......................................................... 20
4/09—Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 20
1/09—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 20
8/08—Rev. A to Rev. B
Changes to Table 3 ............................................................................ 5
Changes to Figure 36 ...................................................................... 18
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 20
10/06—Rev. 0 to Rev. A
Added ADM3077E and ADM3078E ............................... Universal
Changes to Figure 2 and Figure 3 ................................................... 1
Changes to Figure 5 and Figure 6 ................................................... 9
Changes to Figure 34 and Figure 35 ............................................. 17
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 20
8/06—Revision 0: Initial Version
Rev. E | Page 2 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
The driver outputs of the 250 kbps and 500 kbps devices are slew
rate limited to reduce EMI and data errors caused by reflections
from improperly terminated buses. Excessive power dissipation
caused by bus contention or by output shorting is prevented
with a thermal shutdown circuit.
The parts are fully specified over the industrial temperature
ranges and are available in 8-lead and 14-lead narrow SOIC
packages.
Table 1. Selection Table
Part No.
ADM3070E
ADM3071E
ADM3072E
ADM3073E
ADM3074E
ADM3075E
ADM3076E
ADM3077E
ADM3078E
Half/Full
Duplex
Full
Full
Half
Full
Full
Half
Full
Full
Half
Data Rate
(Mbps)
0.25
0.25
0.25
0.5
0.5
0.5
16
16
16
Slew Rate
Limited
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Driver/Receiver
Enable
Yes
No
Yes
Yes
No
Yes
Yes
No
Yes
Rev. E | Page 3 of 20
Low Power
Shutdown
Yes
No
Yes
Yes
No
Yes
Yes
No
Yes
Nodes on
Bus
256
256
256
256
256
256
256
256
256
±15 kV ESD
on Bus Pins
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Pin
Count
14
8
8
14
8
8
14
8
8
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
SPECIFICATIONS
VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted.
Table 2. ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
Parameter
DRIVER
Differential Outputs
Differential Output Voltage
Symbol
Min
VOD
2.0
1.5
Δ|VOD| for Complementary Output States 1
Common-Mode Output Voltage
Δ|VOC| for Complementary Output States1
Short-Circuit Output Current
ΔVOD
VOC
ΔVOC
IOSD
Short-Circuit Foldback Output Current
IOSDF
Output Leakage (Y, Z) Full Duplex
IO
Typ
VCC/2
40
−250
20
Max
Unit
Test Conditions/Comments
VCC
VCC
VCC
0.2
3
0.2
250
−40
V
V
V
V
V
V
mA
mA
mA
mA
μA
μA
RL = 100 Ω (RS-422) (see Figure 7)
RL = 54 Ω (RS-485) (see Figure 7)
No load
RL = 54 Ω or 100 Ω (see Figure 7)
RL = 54 Ω or 100 Ω (see Figure 7)
RL = 54 Ω or 100 Ω (see Figure 7)
0 V < VOUT < 12 V
−7 V < VOUT < VCC
(VCC − 1 V) < VOUT < 12 V
−7 V < VOUT < +1 V
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V
V
V
mV
μA
kΩ
°C
°C
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE
mV
mV
kΩ
μA
μA
−7 V < VCM < +12 V
V A + VB = 0 V
−7 V < VCM < +12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V
0.4
±80
±1
V
V
mA
μA
IOUT = −1 mA
IOUT = 1 mA
0 V < VRO < VCC
VCC = 3.6 V, 0 V < VOUT < VCC
1.5
1.5
1.5
10
mA
mA
mA
μA
No load, DE = VCC, RE = 0 V
No load, DE = VCC, RE = VCC
No load, DE = 0 V, RE = 0 V
DE = 0 V, RE = VCC
kV
kV
Human body model
Human body model
−20
125
−100
Logic Inputs
Input High Voltage
Input Low Voltage
Input Hysteresis
Logic Input Current
Input Impedance First Transition
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Input Hysteresis
Input Resistance (A, B)
Input Current (A, B)
VIH
VIL
VHYS
IIN
2.0
0.8
100
±1
10
1
TTS
TTSH
VTH
ΔVTH
RIN
IA, IB
175
15
−200
−125
15
−50
96
125
−100
RO Logic Output
Output High Voltage
Output Low Voltage
Short-Circuit Output Current
Tristate Output Leakage Current
POWER SUPPLY
Supply Current
Shutdown Current
ESD PROTECTION
A, B, Y, Z Pins
All Pins Except A, B, Y, Z Pins
1
VOH
VOL
IOSR
IOZR
ICC
ISHDN
VCC − 0.6
0.8
0.8
0.8
0.05
±15
±4
Δ|VOD| and Δ|VOC| are the changes in VOD and VOC, respectively, when the DI input changes state.
Rev. E | Page 4 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TIMING SPECIFICATIONS—ADM3070E/ADM3071E/ADM3072E
VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
Rise Time/Fall Time
|tDPLH − tDPHL| Differential Driver Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
RECEIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
|tRPLH − tRPHL| Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
TIME TO SHUTDOWN
1
Symbol
tDPLH
tDPHL
tDR/tDF
tDSKEW
tDZH
tDZL
tDLZ
tDHZ
tDZH(SHDN)
tDZL(SHDN)
Min
Typ
250
250
250
350
Max
Unit
Test Conditions/Comments
1500
1500
1600
200
2500
2500
100
100
5500
5500
kbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9) 1
See Figure 10
See Figure 11
See Figure 11
See Figure 10
See Figure 10
See Figure 11
200
200
30
50
50
50
50
4000
4000
600
kbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
250
tRPLH
tRPHL
tRSKEW
tRZH
tRZL
tRLZ
tRHZ
tRZH(SHDN)
tRZL(SHDN)
tSHDN
50
200
VCC = 3.3 V.
Rev. E | Page 5 of 20
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TIMING SPECIFICATIONS—ADM3073E/ADM3074E/ADM3075E
VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted.
Table 4.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
Rise Time/Fall Time
|tDPLH − tDPHL| Differential Driver Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
RECEIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
|tRPLH − tRPHL| Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
TIME TO SHUTDOWN
Symbol
tDPLH
tDPHL
tDR/tDF
tDSKEW
tDZH
tDZL
tDLZ
tDHZ
tDZH(SHDN)
tDZL(SHDN)
Min
Typ
500
180
180
200
Max
Unit
Test Conditions/Comments
800
800
800
100
2500
2500
100
100
4500
4500
kbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
See Figure 10
See Figure 11
See Figure 11
See Figure 10
See Figure 10
See Figure 11
200
200
30
50
50
50
50
4000
4000
600
kbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
500
tRPLH
tRPHL
tRSKEW
tRZH
tRZL
tRLZ
tRHZ
tRZH(SHDN)
tRZL(SHDN)
tSHDN
50
200
Rev. E | Page 6 of 20
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TIMING SPECIFICATIONS—ADM3076E/ADM3077E/ADM3078E
VCC = 3.3 V ± 10%, TA = TMIN to TMAX, unless otherwise noted.
Table 5.
Parameter
DRIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
Rise Time/Fall Time
|tDPLH − tDPHL| Differential Driver Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
RECEIVER
Maximum Data Rate
Propagation Delay, Low-to-High Level
Propagation Delay, High-to-Low Level
|tRPLH − tRPHL| Output Skew
Enable to Output High
Enable to Output Low
Disable Time from Low
Disable Time from High
Enable Time from Shutdown to High
Enable Time from Shutdown to Low
TIME TO SHUTDOWN
Symbol
Min
Typ
Max
Unit
Test Conditions/Comments
1250
1250
50
50
15
8
150
150
100
100
1800
1800
Mbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
CL = 50 pF, RL = 54 Ω (see Figure 8 and Figure 9)
See Figure 10
See Figure 11
See Figure 11
See Figure 10
See Figure 10
See Figure 11
75
75
8
50
50
50
50
1800
1800
600
Mbps
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
16
tDPLH
tDPHL
tDR/tDF
tDSKEW
tDZH
tDZL
tDLZ
tDHZ
tDZH(SHDN)
tDZL(SHDN)
16
tRPLH
tRPHL
tRSKEW
tRZH
tRZL
tRLZ
tRHZ
tRZH(SHDN)
tRZL(SHDN)
tSHDN
40
40
50
200
Rev. E | Page 7 of 20
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
CL = 15 pF (see Figure 12 and Figure 13)
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
See Figure 14
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VCC to GND
Digital Input/Output Voltage (DE, RE, DI)
Receiver Output Voltage (RO)
Driver Output (A, B, Y, Z)/Receiver
Input (A, B) Voltage
Driver Output Current
Operating Temperature Range
ADM307xEA
ADM307xEY
Storage Temperature Range
θJA Thermal Impedance
8-Lead SOIC_N
14-Lead SOIC_N
Lead Temperature, Soldering (20 sec)
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to (VCC + 0.3 V)
−8 V to +13 V
±250 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
158°C/W
120°C/W
260°C
Rev. E | Page 8 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC 1
14 VCC
RO 2
13 NC
GND 6
TOP VIEW
(Not to Scale)
GND 7
12 A
11 B
VCC 1
10 Z
9
Y
8
NC
NC = NO CONNECT
RO 2
DI 3
GND 4
Figure 4. ADM3070E/ADM3073E/ADM3076E
Pin Configuration
ADM3071E/
ADM3074E/
ADM3077E
8
A
RO 1
7
B
RE 2
TOP VIEW
(Not to Scale)
6
Z
DE 3
5
Y
Figure 5. ADM3071E/ADM3074E/ADM3077E
Pin Configuration
DI 4
ADM3072E/
ADM3075E/
ADM3078E
TOP VIEW
(Not to Scale)
8
VCC
7
B
6
A
5
GND
06285-006
DI 5
ADM3070E/
ADM3073E/
ADM3076E
06285-005
DE 4
06285-004
RE 3
Figure 6. ADM3072E/ADM3075E/ADM3078E
Pin Configuration
Table 7. Pin Function Descriptions
ADM3070E/
ADM3073E/
ADM3076E
Pin No.
2
ADM3071E/
ADM3074E/
ADM3077E
Pin No.
2
ADM3072E/
ADM3075E/
ADM3078E
Pin No.
1
Mnemonic
RO
3
N/A
2
RE
4
N/A
3
DE
5
3
4
DI
6, 7
9
N/A
12
10
N/A
11
14
1, 8, 13
4
5
N/A
8
6
N/A
7
1
N/A
5
N/A
6
N/A
N/A
7
N/A
8
N/A
GND
Y
A
A
Z
B
B
VCC
NC
Description
Receiver Output. When enabled, if (A − B) ≥ −50 mV, RO is high. If
(A − B) ≤ −200 mV, RO is low.
Receiver Output Enable. A low level enables the receiver output.
A high level places it in a high impedance state. If RE is high and DE
is low, the device enters a low power shutdown mode.
Driver Output Enable. A high level enables the driver differential
A and B outputs. A low level places it in a high impedance state. If
RE is high and DE is low, the device enters a low power shutdown mode.
Driver Input. With a half-duplex part when the driver is enabled, a
logic low on DI forces A low and B high; a logic high on DI forces
A high and B low. With a full-duplex part when the driver is enabled,
a logic low on DI forces Y low and Z high; a logic high on DI forces
Y high and Z low.
Ground.
Noninverting Driver Output.
Noninverting Receiver Input A and Noninverting Driver Output A.
Noninverting Receiver Input A.
Inverting Driver Output.
Inverting Receiver Input B and Inverting Driver Output B.
Inverting Receiver Input B.
Power Supply, 3.3 V ± 10%. Bypass VCC to GND with a 0.1 μF capacitor.
No Connect. Not internally connected; can be connected to GND.
Rev. E | Page 9 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TEST CIRCUITS AND SWITCHING CHARACTERISTICS
VCC
RL
500Ω
S1
Y
0V OR 3V
RL/2
D
06285-007
VOC
RL/2
Z
GENERATOR
OUT
+ CL
50pF
VOD
50Ω
Figure 7. Driver DC Test Load
VCC
3V
DE
VCC/2
tDZL, tDZL(SHDN)
DE
0V
tDLZ
Y
CL
RL
VCC
VOM = (VOL + VCC)/2
OUT
VOL
06285-008
Z
06285-011
VOD
DI
0.25V
Figure 11. Driver Enable and Disable Times (tDZL, tDLZ, tDZL(SHDN))
Figure 8. Driver Timing Test Circuit
VCC
DI
VCC/2
0V
tDPLH
tDPHL
1/2VO
Z
VO
Y
1/2VO
90%
10%
ATE
10%
tDF
VID
tDSKEW = |tDPLH – tDPHL |
R
A
06285-009
tDR
RECEIVER
OUTPUT
B
90%
06285-012
VDIFF = V (Y) – V (Z)
+VO
VDIFF 0V
–VO
Figure 12. Receiver Propagation Delay Test Circuit
Figure 9. Driver Propagation Delays
S1
0V OR 3V
GENERATOR
D
+ CL
50pF
OUT
RL
500Ω
50Ω
+1V
A
VCC
B
VCC/2
tDZH, tDZH(SHDN)
VOH
RO
0V
06285-010
VOM = (0 + VOH)/2
tDHZ
tRPHL
VOH
0.25V
OUT
–1V
tRPLH
0V
VOL
1.5V
NOTES
1. THE RISE TIME AND FALL TIME OF INPUT A AND INPUT B < 4ns.
Figure 13. Receiver Propagation Delays
Figure 10. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN))
Rev. E | Page 10 of 20
06285-013
DE
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
+1.5V
S3
–1.5V
S1
VID
GENERATOR
S1 OPEN
S2 CLOSED
S3 = +1.5V
VCC
1kΩ
+ CL
15pF
S2
50Ω
S1 CLOSED
S2 OPEN
S3 = –1.5V
3V
3V
1.5V
RE
RE
0V
0V
tRZL, tRZL(SHDN)
VOH
VOH/2
RO
VCC
RO
(VOL + VCC)/2
VOL
0V
S1 OPEN
S2 CLOSED
S3 = +1.5V
RE
S1 CLOSED
S2 OPEN
S3 = –1.5V
3V
RE
1.5V
0V
0V
tRLZ
tRHZ
VCC
VOH
RO
3V
1.5V
0.25V
RO
VOL
0V
0.25V
Figure 14. Receiver Enable and Disable Times
Rev. E | Page 11 of 20
06285-014
tRZH, tRZH(SHDN)
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
TYPICAL PERFORMANCE CHARACTERISTICS
1.2
3.30
3.25
OUTPUT HIGH VOLTAGE (V)
1.0
0.9
0.8
0.7
3.10
20
50
110
80
3.00
–50
TEMPERATURE (°C)
–25
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 15. Supply Current vs. Temperature
06285-023
–10
06285-020
0.5
–40
Figure 18. Receiver Output High Voltage vs. Temperature
0.7
–18
–16
IRO = 1mA
0.6
OUTPUT LOW VOLTAGE (V)
–14
–12
–10
–8
–6
–4
0.5
0.4
0.3
0.2
0.1
–2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT HIGH VOLTAGE (V)
0
–50
06285-021
0
–25
0
25
50
75
100
125
06285-024
OUTPUT CURRENT (mA)
3.15
3.05
0.6
0
3.20
3.5
06285-025
SUPPLY CURRENT (mA)
1.1
IRO = –1mA
TEMPERATURE (°C)
Figure 16. Output Current vs. Receiver Output High Voltage
Figure 19. Receiver Output Low Voltage vs. Temperature
25
100
90
OUTPUT CURRENT (mA)
80
15
10
5
70
60
50
40
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT LOW VOLTAGE (V)
06285-022
OUTPUT CURRENT (mA)
20
Figure 17. Output Current vs. Receiver Output Low Voltage
0
0
0.5
1.0
1.5
2.0
2.5
3.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
Figure 20. Driver Output Current vs. Differential Output Voltage
Rev. E | Page 12 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
0.9
RL = 54Ω
2.5
0.8
SHUTDOWN CURRENT (µA)
2.4
2.3
2.2
2.1
2.0
1.9
1.8
0.7
0.6
0.5
0.4
0.3
0.2
1.6
–50
–25
0
25
50
75
125
100
TEMPERATURE (°C)
0
–50
120
1200
100
1000
PROPAGATION DELAY (ns)
50
75
100
125
80
60
40
tDPHL
800
tDPLH
600
400
–6
–5
–4
–3
–2
–1
0
1
2
3
4
OUTPUT HIGH VOLTAGE (V)
0
06285-027
0
–7
–40
25
125
TEMPERATURE (°C)
Figure 22. Output Current vs. Driver Output High Voltage
06285-030
200
Figure 25. ADM3070E/ADM3071E/ADM3072E Driver
Propagation Delay vs. Temperature (250 kbps)
700
120
600
PROPAGATION DELAY (ns)
100
80
60
40
20
tDPHL
500
tDPLH
400
300
200
0
2
4
6
8
10
OUTPUT LOW VOLTAGE (V)
12
06285-028
100
0
–40
25
125
TEMPERATURE (°C)
Figure 26. ADM3073E/ADM3074E/ADM3075E Driver
Propagation Delay vs. Temperature (500 kbps)
Figure 23. Output Current vs. Driver Output Low Voltage
Rev. E | Page 13 of 20
06285-031
OUTPUT CURRENT (mA)
25
Figure 24. Shutdown Current vs. Temperature
20
OUTPUT CURRENT (mA)
0
TEMPERATURE (°C)
Figure 21. Driver Differential Output Voltage vs. Temperature
0
–25
06285-029
0.1
1.7
06285-026
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.6
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
35
tDPLH
PROPAGATION DELAY (ns)
30
DI
tDPHL
3
25
20
M1
15
VY – VZ
10
–25
0
25
50
75
125
100
TEMPERATURE (°C)
CH3 2.0V
M400s 125MS/s
MATH1 2.01V 400ns
06285-032
0
–50
06285-036
5
Figure 27. ADM3076E/ADM3077E/ADM3078E Driver
Propagation Delay vs. Temperature (16 Mbps)
8ns/pt
A CH2
1.24V
Figure 30. ADM3073E/ADM3074E/ADM3075E Driver
Propagation Delay (500 kbps)
70
tDPLH
PROPAGATION DELAY (ns)
60
tDPHL
50
M1
VY – VZ
40
30
20
3
–25
0
25
50
75
125
100
TEMPERATURE (°C)
CH3 2.0V Ω
MATH1 1.0V
06285-033
0
–50
DI
06285-037
10
M20ns 1.25GS/s
20ns
IT 400ps/pt A CH3
1.64V
Figure 31. ADM3076E/ADM3077E/ADM3078E Driver
Propagation Delay (16 Mbps)
Figure 28. Receiver Propagation Delay vs. Temperature
DI
3
VA – VB
M1
M1
VY – VZ
CH3 2.0V
M1.0µs 50MS/s
MATH1 2.01V 1.0µs
20ns/pt
A CH2
06285-035
06285-034
RO
3
CH3 2.0V Ω M200ns 250MS/s
MATH1 2.01V 200ns
1.24V
4ns/pt
A CH2
Figure 32. Receiver Propagation Delay
Figure 29. ADM3070E/ADM3071E/ADM3072E Driver
Propagation Delay (250 kbps)
Rev. E | Page 14 of 20
1.24V
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
CIRCUIT DESCRIPTION
The ADM307xE series are high speed transceivers for RS­485
and RS-422 communications. Each device contains one driver
and one receiver. All devices feature fail-safe circuitry, which
guarantees a logic high receiver output when the receiver inputs
are open or shorted or when they are connected to a terminated
transmission line with all drivers disabled (see the Receiver FailSafe section). The ADM307xE also feature a hot-swap capability,
allowing line insertion without erroneous data transfer (see the
Hot-Swap Capability section). The ADM3070E/ADM3071E/
ADM3072E feature reduced slew rate drivers that minimize
EMI and reduce reflections caused by improperly terminated
cables, allowing for error-free data transmission at rates up to
250 kbps.
The ADM3073E/ADM3074E/ADM3075E also offer slew rate
limits, allowing transmit speeds up to 500 kbps. The ADM3076E/
ADM3077E/ADM3078E driver slew rates are not limited, making
possible transmit speeds of up to 16 Mbps. The ADM3072E/
ADM3075E/ADM3078E are half-duplex transceivers; the
ADM3070E/ADM3071E/ADM3073E/ADM3074E/ADM3076E/
ADM3077E are each full-duplex transceivers. All devices operate
from a single 3.3 V supply. Drivers are output short-circuit
current limited, and thermal shutdown circuitry protects
drivers against excessive power dissipation. When activated,
the thermal shutdown circuitry places the driver outputs into
a high impedance state.
FUNCTION TABLES
ADM3071E/ADM3074E/ADM3077E
Table 10. Transmitting Truth Table
Transmitting Input
DI
1
0
Receiving Input
A−B
≥ −50 mV
≤ −200 mV
Open/shorted
Transmitting Inputs
DE
DI
1
1
0
0
ADM3072E/ADM3075E/ADM3078E
Table 12. Transmitting Truth Table
RE
X1
X1
0
1
1
2
2
Transmitting Outputs
Y
Z
1
0
X1
X1
1
0
High-Z2
Shutdown
0
1
High-Z2
Shutdown
X = don't care.
High-Z = high impedance.
Receiving Inputs
DE
A−B
Receiving Outputs
RO
0
0
0
1
X1
X1
X1
1
≥ −50 mV
≤ −200 mV
Open/shorted
X1
1
0
1
High-Z2
1
0
X1
Shutdown
1
2
X = don't care.
High-Z = high impedance.
Transmitting Outputs
A, Y
B, Z
1
0
0
1
High-Z2
High-Z2
Shutdown
Shutdown
0
0
0
1
1
1
Receiving Inputs
DE
A−B
0
≥ −50 mV
0
≤ −200 mV
0
Open/shorted
1
X1
0
X1
Receiving Output
RO
1
0
1
High-Z2
Shutdown
X = don't care.
High-Z = high impedance.
RECEIVER FAIL-SAFE
Table 9. Receiving Truth Table
RE
Transmitting Inputs
DE
DI
1
1
1
0
0
X1
0
X1
X = don't care.
High-Z = high impedance.
RE
2
1
Receiving Output
RO
1
0
1
Table 13. Receiving Truth Table
Table 8. Transmitting Truth Table
X1
X1
0
1
Transmitting Outputs
Z
0
1
Table 11. Receiving Truth Table
ADM3070E/ADM3073E/ADM3076E
RE
Y
1
0
The ADM307xE family guarantees a logic high receiver output
when the receiver inputs are shorted, open, or connected to a
terminated transmission line with all drivers disabled. This is
done by setting the receiver input threshold between −50 mV
and −200 mV. If the differential receiver input voltage (A − B)
is greater than or equal to −50 mV, RO is logic high. If A − B
is less than or equal to −200 mV, RO is logic low. In the case
of a terminated bus with all transmitters disabled, the receiver
differential input voltage is pulled to 0 V by the termination.
With the receiver thresholds of the ADM307xE family, this
results in a logic high with a 50 mV minimum noise margin.
Rev. E | Page 15 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
HOT-SWAP CAPABILITY
(ALL EXCEPT ADM3071E/ADM3074E/ADM3077E)
Hot-Swap Inputs
When a circuit board is inserted into a hot (or powered) backplane, differential disturbances to the data bus can lead to data
errors. During this period, processor logic output drivers are
high impedance and are unable to drive the DE and RE inputs
of the RS-485 transceivers to a defined logic level. Leakage currents
up to ±10 μA from the high impedance state of the processor
logic drivers can cause standard CMOS enable inputs of a transceiver to drift to an incorrect logic level. Additionally, parasitic
circuit board capacitance can cause coupling of VCC or GND to
the enable inputs. Without the hot-swap capability, these factors
can improperly enable the driver or receiver of the transceiver.
When VCC rises, an internal pull-down circuit holds DE low and
RE high. After the initial power-up sequence, the pull-down
circuit becomes transparent, resetting the hot-swap tolerable input.
carried out while device power is applied. This type of testing
is more representative of a real-world input/output discharge,
which occurs when equipment is operating normally.
The transmitter outputs and receiver inputs of the ADM307xE
family are characterized for protection to a ±15 kV limit using
the human body model.
HUMAN BODY MODEL
Figure 33 shows the human body model and the current
waveform it generates when discharged into low impedance.
This model consists of a 100 pF capacitor charged to the ESD
voltage of interest, which is then discharged into the test device
through a 1.5 kΩ resistor.
HIGH
VOLTAGE
GENERATOR
R2
R1
DEVICE
UNDER
TEST
C1
LINE LENGTH vs. DATA RATE
The RS-485/RS-422 standard covers line lengths up to 4000 feet.
For line lengths greater than 4000 feet, Figure 37 illustrates an
example line repeater.
ESD TEST METHOD
R2
C1
HUMAN BODY MODEL
ESD ASSOC. STD 55.1
1.5kΩ
100pF
100%
±15 kV ESD PROTECTION
90%
Although very little energy is contained within an ESD pulse, the
extremely fast rise time, coupled with high voltages, can cause
failures in unprotected semiconductors. Catastrophic destruction can occur immediately as a result of arcing or heating.
Even if catastrophic failure does not occur immediately, the
device can suffer from parametric degradation that can result
in degraded performance. The cumulative effects of continuous
exposure can eventually lead to complete failure.
Input/output lines are particularly vulnerable to ESD damage.
Simply touching or connecting an input/output cable can result
in a static discharge that damages or completely destroys the
interface product connected to the input/output port. It is
extremely important, therefore, to have high levels of ESD
protection on the input/output lines.
The ESD discharge can induce latch-up in the device under test,
so it is important that ESD testing on the input/output pins be
IPEAK
Two coupling methods are used for ESD testing: contact
discharge and air-gap discharge. Contact discharge calls for
a direct connection to the unit being tested. Air-gap discharge
uses a higher test voltage but does not make direct contact with
the test unit. With air-gap discharge, the discharge gun is moved
toward the unit under test, developing an arc across the air gap,
thus the term air-gap discharge. This method is influenced by
humidity, temperature, barometric pressure, distance, and rate
of closure of the discharge gun. The contact discharge method,
while less realistic, is more repeatable and is gaining acceptance
and preference over the air-gap method.
36.8%
tRL
tDL
TIME t
06285-015
10%
Figure 33. Human Body Model and Current Waveform
256 TRANSCEIVERS ON THE BUS
The standard RS-485 receiver input impedance is 12 kΩ (1 unit
load), and the standard driver can drive up to 32 unit loads. The
ADM307xE family of transceivers has a ⅛ unit load receiver
input impedance (96 kΩ), allowing up to 256 transceivers to be
connected in parallel on one communication line. Any combination of these devices and other RS-485 transceivers with a
total of 32 unit loads or fewer can be connected to the line.
REDUCED EMI AND REFLECTIONS
The ADM3070E/ADM3071E/ADM3072E feature reduced
slew rate drivers that minimize EMI and reduce reflections
caused by improperly terminated cables, allowing for errorfree data transmission at rates up to 250 kbps. The ADM3073E/
ADM3074E/ADM3075E offer higher driver output slew rate
limits, allowing for transmit speeds of up to 500 kbps.
Rev. E | Page 16 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
LOW POWER SHUTDOWN MODE
(ALL EXCEPT ADM3071E/ADM3074E/ADM3077E)
Low power shutdown mode is initiated by bringing both RE
high and DE low. In shutdown mode, the device draws less
than 1 μA of supply current. RE and DE can be driven simultaneously, but the parts are guaranteed not to enter shutdown if
RE is high and DE is low for fewer than 50 ns. If the inputs are
in this state for 600 ns or more, the parts are guaranteed to enter
shutdown. Enable times tZH and tZL assume that the part was not
originally in a low power shutdown state (see the Test Circuits
and Switching Characteristics section). Enable times (tZH(SHDN)
and tZL(SHDN)) assume that the part was originally shut down. It
takes drivers and receivers longer to become enabled from low
power shutdown mode (tZH(SHDN), tZL(SHDN)) than from driver/
receiver disable mode (tZH, tZL).
DRIVER OUTPUT PROTECTION
The ADM307xE family features two methods to prevent
excessive output current and power dissipation caused by
faults or by bus contention. Current limit protection on the
output stage provides immediate protection against short
circuits over the whole common-mode voltage range (see
Figure 22 and Figure 23). In addition, a thermal shutdown
circuit forces the driver outputs into a high impedance state
if the die temperature rises excessively.
TYPICAL APPLICATIONS
The ADM3072E/ADM3075E/ADM3078E transceivers are
designed for bidirectional data communications on multipoint
bus transmission lines. Figure 34 shows a typical network
applications circuit. The ADM3071E/ADM3074E/ADM3077E
transceivers are designed for point-to-point transmission lines
(see Figure 35). The ADM3070E/ADM3073E/ADM3076E
transceivers are designed for full-duplex RS-485 networks
(see Figure 36).
To minimize reflections, terminate the line at both ends with
a termination resistor (the value of the termination resistor
should be equal to the characteristic impedance of the cable
used) and keep stub lengths off the main line as short as
possible.
ADM3072E/
ADM3075E/
ADM3078E
R
RO
ADM3072E/
ADM3075E/
ADM3078E
A
A
RE
RT
R
RO
RE
RT
DE
DE
DI
D
B
B
A
B
A
ADM3072E/
ADM3075E/
ADM3078E
R
R
D
RE
DE
RO
DI
D
RE
DI
DE
06285-016
RO
NOTES
1. MAXIMUM NUMBER OF NODES: 256.
2. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED.
Figure 34. ADM3072E/ADM3075E/ADM3078E Typical Half-Duplex RS-485 Network
MASTER
SLAVE
ADM3071E/
ADM3074E/
ADM3077E
ADM3071E/
ADM3074E/
ADM3077E
A
Y
B
Z
Z
B
Y
A
D
R
D
R
DI
RO
06285-017
DI
DI
B
ADM3072E/
ADM3075E/
ADM3078E
RO
D
Figure 35. ADM3071E/ADM3074E/ADM3077E Full-Duplex Point-to-Point Applications
Rev. E | Page 17 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
SLAVE
MASTER
ADM3070E/
ADM3073E/
ADM3076E
R
RO
A
B
Y
RT
Z
ADM3070E/
ADM3073E/
ADM3076E
D
DE
DI
RE
DE
DI
B
Z
D
RT
Y
A
R
RO
RE
A
ADM3070E/
ADM3073E/
ADM3076E
B
R
A
Y
Z
B
R
D
RO RE DE
Z
DI
RO
Y
SLAVE
ADM3070E/
ADM3073E/
ADM3076E
D
RE DE
DI
06285-019
SLAVE
NOTES
1. MAXIMUM NUMBER OF NODES: 256.
2. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE USED.
Figure 36. ADM3070E/ADM3073E/ADM3076E Full-Duplex RS-485 Network
ADM3070E/
ADM3073E/
ADM3076E
A
R
B
RO
RT
DATA IN
RT
DATA OUT
RE
DE
Z
D
Y
NOTES
1. RT IS EQUAL TO THE CHARACTERISTIC
IMPEDANCE OF THE CABLE USED.
06285-018
DI
Figure 37. Line Repeater for ADM3070E/ADM3073E/ADM3076E
Rev. E | Page 18 of 20
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
5
1
4
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
6.20 (0.2441)
5.80 (0.2284)
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
SEATING
PLANE
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-A A
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
012407-A
4.00 (0.1574)
3.80 (0.1497)
Figure 38. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
8.75 (0.3445)
8.55 (0.3366)
8
14
1
7
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
6.20 (0.2441)
5.80 (0.2283)
0.50 (0.0197)
0.25 (0.0098)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 39. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
Rev. E | Page 19 of 20
060606-A
4.00 (0.1575)
3.80 (0.1496)
ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E
ORDERING GUIDE
Model
ADM3070EARZ 1
ADM3070EARZ-REEL71
ADM3070EYRZ1
ADM3070EYRZ-REEL71
ADM3071EARZ1
ADM3071EARZ-REEL71
ADM3071EYRZ1
ADM3071EYRZ-REEL71
ADM3072EARZ1
ADM3072EARZ-REEL71
ADM3072EYRZ1
ADM3072EYRZ-REEL71
ADM3073EARZ1
ADM3073EARZ-REEL71
ADM3073EYRZ1
ADM3073EYRZ-REEL71
ADM3074EARZ1
ADM3074EARZ-REEL71
ADM3074EYRZ1
ADM3074EYRZ-REEL71
ADM3075EARZ1
ADM3075EARZ-REEL71
ADM3075EWYRZ1
ADM3075EWYRZ-RL71
ADM3075EYRZ1
ADM3075EYRZ-REEL71
ADM3076EARZ1
ADM3076EARZ-REEL71
ADM3076EYRZ1
ADM3076EYRZ-REEL71
ADM3077EARZ1
ADM3077EARZ-REEL71
ADM3077EYRZ1
ADM3077EYRZ-REEL71
ADM3078EARZ1
ADM3078EARZ-REEL71
ADM3078EYRZ1
ADM3078EYRZ-REEL71
1
Temperature
Range
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
Package Description
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
14-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
8-Lead Standard Small Outline Package (SOIC_N)
Z = RoHS Compliant Part.
©2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06285-0-8/09(E)
Rev. E | Page 20 of 20
Package
Option
R-14
R-14
R-14
R-14
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-14
R-14
R-14
R-14
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-14
R-14
R-14
R-14
R-8
R-8
R-8
R-8
R-8
R-8
R-8
R-8
Ordering
Quantity
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000