34.00mm [1.339"] OTQ - 64 - 0.8 -02 34.00mm [1.339"] Top View 1 25.91mm[1.020"] assembled 3 8.32mm[0.328"] assembled 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Contact material- BeCu; finish 0.25µm [10µ"] Au over 2.54µm [100µ"] Ni (min. ). Side View Description: Carrier Adaptor 64 position (0.8mm pitch) QFP ZIF socket to 64 position surface mountable QFP emulator foot. The 2 piece adaptor interconnects via a gold plated (1.27mm[0.050"] center) Mini-grid socket interface. Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. CA-QFE64SA-L-Z-01 Drawing © 2000 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale 2:1 Rev: A Drawing: W. Watson Date: 4/3/00 File: CA-QFE64SA-L-Z-01 Dwg Modified: