TI1 DLP4500FQD Wxga Datasheet

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DLP4500
DLPS028B – APRIL 2013 – REVISED JANUARY 2016
DLP4500 0.45 WXGA DMD
1 Features
2 Applications
•
•
1
•
•
•
•
0.45-Inch Diagonal Micromirror Array
– 912 × 1140 Resolution Array (>1 Million
Micromirrors)
– Diamond Array Orientation Supports Side
Illumination for Simplified, Efficient Optics
Designs
– Capable of WXGA Resolution Display
– 7.6-μm Micromirror Pitch
– ±12° Tilt Angle
– 5-µs Micromirror Crossover Time
Highly-Efficient Steering of Visible Light
– Window Transmission Efficiency 96% Nominal
(420 to 700 nm, Single Pass Through Two
Window Surfaces)
– Polarization Independent Aluminum
Micromirrors
– Array Fill Factor 92% Nominal
Dedicated DLPC350 Controller for Reliable
Operation
– Binary Pattern Rates up to 4 kHz
– Pattern Sequence Mode for Control Over Each
Micromirror in Array
Integrated Micromirror Driver Circuitry
9.10-mm × 20.7-mm Package Footprint for
Portable Instruments
– FQE Package With Simple Connector
Interface
– FQD Package With Enhanced Thermal
Interface
•
•
•
•
•
•
Machine Vision
– 3D Depth Measurement
– Robotic Guidance
– Inline Surface Inspection
– Pick and Place
– 3D Capture
– Defect Rejection
Medical Instruments
– 3D Dental Scanners
– Vascular Imaging
3D Biometrics
– Fingerprint Identification
– Facial Recognition
Virtual Gauges
Augmented Reality
Interactive Display
Microscopes
3 Description
The DLP4500 digital micromirror device (DMD) acts
as a spatial light modulator (SLM) to steer visible light
and create patterns with speed, precision, and
efficiency. Featuring high resolution and high
brightness in a compact form factor, the DLP4500
DMD is well-suited for very accurate, portable 3D
machine vision and display solutions used in
industrial, medical, and security applications.
Device Information
PART NUMBER
Simplified Diagram
DLP4500
DC Power
LED
Drivers
RGB Interface
LVDS Interface
USB Interface
DLPC350
I2C Interface
LEDs
PACKAGE
LCCC (80) (2)
LCCC (98)
(3)
(1)
THERMAL
INTERFACE AREA
None
7 mm x 7 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) FQE package drawing
(3) FQD package drawing
Light
Sensor
GPIO Interface
DDR Interface
OSC
JTAG
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLP4500
DLPS028B – APRIL 2013 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 3
Specifications....................................................... 11
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
7
Absolute Maximum Ratings ................................... 11
Storage Conditions.................................................. 11
ESD Ratings .......................................................... 11
Recommended Operating Conditions..................... 12
Thermal Information ................................................ 14
Electrical Characteristics......................................... 14
Timing Requirements .............................................. 15
System Mounting Interface Loads .......................... 17
Micromirror Array Physical Characteristics ............. 18
Micromirror Array Optical Characteristics ............. 19
Typical Characteristics .......................................... 20
Detailed Description ............................................ 21
7.1 Overview ................................................................. 21
7.2 Functional Block Diagram ....................................... 21
7.3 Feature Description................................................. 22
7.4 Device Functional Modes........................................ 24
7.5 Micromirror Array Temperature Calculation............ 24
7.6 Micromirror Landed-on/Landed-Off Duty Cycle ...... 27
8
Application and Implementation ........................ 29
8.1 Application Information............................................ 29
8.2 Typical Application .................................................. 29
9
Power Supply Recommendations...................... 34
9.1 Power Supply Sequencing Requirements .............. 34
9.2 DMD Power Supply Power-Up Procedure .............. 34
9.3 DMD Power Supply Power-Down Procedure ......... 34
10 Layout................................................................... 36
10.1 Layout Guidelines ................................................. 36
10.2 Layout Example .................................................... 41
11 Device and Documentation Support ................. 46
11.1
11.2
11.3
11.4
11.5
11.6
Device Support......................................................
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
46
47
47
47
47
48
12 Mechanical, Packaging, and Orderable
Information ........................................................... 48
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2013) to Revision B
Page
•
Added ESD Ratings table, Storage Conditions table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section ..................................... 1
•
Updated images with a simplified diagram............................................................................................................................. 1
•
Assigned FQE Test Pads as Unused pins. ............................................................................................................................ 6
•
Assigned FQD Test Pads as unused pins............................................................................................................................ 10
•
Absolute Maximum Ratings specifications updated. ............................................................................................................ 11
•
Recommended Operating Conditions specifications updated.............................................................................................. 12
•
Added Temperature Derating Curve. ................................................................................................................................... 13
•
Timing Requirements specifications updated....................................................................................................................... 15
•
System Mounting Interface Loads moved to Specifications................................................................................................. 17
•
Optical Characteristics moved to Specifications................................................................................................................... 19
•
Added DMD Window Transmittance curve........................................................................................................................... 20
•
Functional Block Diagram updated....................................................................................................................................... 21
•
Operating Modes and Pattern Data Rates table added. ...................................................................................................... 24
•
Micromirror Array Temperature Calculation reformatted. ..................................................................................................... 26
•
Micromirror Landed-On/Landed-Off Duty Cycle section added. .......................................................................................... 27
•
Application NOTE added to Application and Implementation............................................................................................... 29
•
Typical Application description and schematic updated....................................................................................................... 29
•
Package Specific Information table updated. ....................................................................................................................... 46
•
Removed link to the chipset datasheet in Releated Documents.......................................................................................... 47
2
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
5 Pin Configuration and Functions
Package Connector for Signal Names- FQE Package
LCCC (80)
Bottom View
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DLP4500
DLPS028B – APRIL 2013 – REVISED JANUARY 2016
www.ti.com
Connector Pins for FQE
PIN
NAME
NO.
TYPE
SIGNAL
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
TRACE (mm)
(2)
DATA INPUTS
DATA(0)
C12
Input
LVCMOS
DDR
none
Input data bus, bit 0, LSB
8.11
DATA(1)
C10
Input
LVCMOS
DDR
none
Input data bus, bit 1
7.82
DATA(2)
C9
Input
LVCMOS
DDR
none
Input data bus, bit 2
7.88
DATA(3)
C7
Input
LVCMOS
DDR
none
Input data bus, bit 3
7.84
DATA(4)
C4
Input
LVCMOS
DDR
none
Input data bus, bit 4
8.10
DATA(5)
C6
Input
LVCMOS
DDR
none
Input data bus, bit 5
7.89
DATA(6)
C3
Input
LVCMOS
DDR
none
Input data bus, bit 6
7.87
DATA(7)
C13
Input
LVCMOS
DDR
none
Input data bus, bit 7
7.84
DATA(8)
C15
Input
LVCMOS
DDR
none
Input data bus, bit 8
8.13
DATA(9)
C16
Input
LVCMOS
DDR
none
Input data bus, bit 9
8.00
DATA(10)
C18
Input
LVCMOS
DDR
none
Input data bus, bit 10
8.12
DATA(11)
C19
Input
LVCMOS
DDR
none
Input data bus, bit 11
8.08
DATA(12)
C21
Input
LVCMOS
DDR
none
Input data bus, bit 12
9.27
DATA(13)
C22
Input
LVCMOS
DDR
none
Input data bus, bit 13
9.47
DATA(14)
D22
Input
LVCMOS
DDR
none
Input data bus, bit 14
9.46
DATA(15)
D21
Input
LVCMOS
DDR
none
Input data bus, bit 15
8.73
DATA(16)
D19
Input
LVCMOS
DDR
none
Input data bus, bit 16
8.10
DATA(17)
D4
Input
LVCMOS
DDR
none
Input data bus, bit 17
8.02
DATA(18)
D9
Input
LVCMOS
DDR
none
Input data bus, bit 18
8.07
DATA(19)
D10
Input
LVCMOS
DDR
none
Input data bus, bit 19
7.91
DATA(20)
D6
Input
LVCMOS
DDR
none
Input data bus, bit 20
8.52
DATA(21)
D16
Input
LVCMOS
DDR
none
Input data bus, bit 21
9.10
DATA(22)
D7
Input
LVCMOS
DDR
none
Input data bus, bit 22
8.00
DATA(23)
D15
Input
LVCMOS
DDR
none
Input data bus, bit 23, MSB
8.61
DCLK
D13
Input
LVCMOS
DDR
none
Input data bus clock
8.63
DATA CONTROL INPUTS
LOADB
D12
Input
LVCMOS
DDR
none
Parallel-data load enable
8.65
TRC
D3
Input
LVCMOS
DDR
none
Input-data toggle-rate control
4.67
SCTRL
D18
Input
LVCMOS
DDR
none
Serial control bus
9.40
6.56
SAC_BUS
D33
Input
LVCMOS
—
none
Stepped address-control serialbus data
SAC_CLK
D29
Input
LVCMOS
—
none
Stepped address-control serial
bus clock
8.07
MIRROR RESET CONTROL INPUTS
DRC_BUS
C29
Input
LVCMOS
—
none
DMD reset-control serial bus
8.24
C33
Input
LVCMOS
—
none
Active-low output enable signal
for internal DMD reset driver
circuitry
4.43
DRC_OE
DRC_STROBE
C36
Input
LVCMOS
—
none
Strobe signal for DMD reset
control inputs
9.20
(1)
(2)
4
(a) DDR = Double data rate
(b) SDR = Single data rate
(c) Refer to Timing Requirements for specifications and relationships.
Net trace lengths inside the package:
(a) Relative dielectric constant for the FQE package is 9.8.
(b) Propagation speed = 11.8 / √(9.8) = 3.769 inches/ns.
(c) Propagation delay = 0.265 ns/inch = 265 ps/inch = 10.43 ps/mm.
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
Connector Pins for FQE (continued)
PIN
NAME
POWER INPUTS
NO.
TYPE
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
TRACE (mm)
(2)
(3)
VBIAS
C31
Power
VBIAS
C32
Power
VOFFSET
D25
Power
VOFFSET
D26
Power
VRESET
D31
Power
VRESET
D32
Power
VREF
C25
Power
VREF
C26
Power
VCC
C1
Power
VCC
C2
Power
VCC
C34
Power
VCC
C35
Power
VCC
C37
Power
VCC
C38
Power
VCC
C39
Power
VCC
C40
Power
VCC
D1
Power
VCC
D2
Power
VCC
D34
Power
VCC
D35
Power
VCC
D37
Power
VCC
D38
Power
VCC
D39
Power
VCC
D40
Power
(3)
SIGNAL
none
Mirror-reset bias voltage
none
Mirror-reset offset voltage
none
Mirror-reset voltage
none
Power supply for low-voltage
CMOS double-data-rate (DDR)
interface
none
Power supply for LVCMOS logic
The following power supplies are all required to operate the DMD: VSS, VCC, VOFFSET, VBIAS, VRESET.
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
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Connector Pins for FQE (continued)
PIN
NAME
NO.
TYPE
VSS
C5
Power
VSS
C8
Power
VSS
C11
Power
VSS
C14
Power
VSS
C17
Power
VSS
C20
Power
VSS
C23
Power
VSS
C24
Power
VSS
C27
Power
VSS
C28
Power
VSS
C30
Power
VSS
D5
Power
VSS
D8
Power
VSS
D11
Power
VSS
D14
Power
VSS
D17
Power
VSS
D20
Power
VSS
D23
Power
VSS
D24
Power
VSS
D27
Power
VSS
D28
Power
VSS
D30
Power
SIGNAL
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
none
Ground – Common return for all
power inputs
TRACE (mm)
(2)
Pin Configuration and Functions – Test Pads for FQE Package
NAME
PIN
SIGNAL
DESCRIPTION
Test Pads
Do not connect
A1 thru A25
B1 thru B25
UNUSED
D36
E1 thru E25
F1 thru F25
6
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
Package Connector for Signal Names - FQD Package
LCCC (98)
Bottom View
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
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Connector Pins for FQD
PIN
NAME
NO.
TYPE
SIGNAL
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
PACKAGE NET
LENGTH (mm)
(2)
DATA INPUTS
DATA(0)
A1
Input
LVCMOS
DDR
none
Input data bus, bit 0, LSB
3.77
DATA(1)
A2
Input
LVCMOS
DDR
none
Input data bus, bit 1
3.77
DATA(2)
A3
Input
LVCMOS
DDR
none
Input data bus, bit 2
3.73
DATA(3)
A4
Input
LVCMOS
DDR
none
Input data bus, bit 3
3.74
DATA(4)
B1
Input
LVCMOS
DDR
none
Input data bus, bit 4
3.79
DATA(5)
B3
Input
LVCMOS
DDR
none
Input data bus, bit 5
3.75
DATA(6)
C1
Input
LVCMOS
DDR
none
Input data bus, bit 6
3.72
DATA(7)
C3
Input
LVCMOS
DDR
none
Input data bus, bit 7
3.75
DATA(8)
C4
Input
LVCMOS
DDR
none
Input data bus, bit 8
3.78
DATA(9)
D1
Input
LVCMOS
DDR
none
Input data bus, bit 9
3.75
DATA(10)
D4
Input
LVCMOS
DDR
none
Input data bus, bit 10
3.77
DATA(11)
E1
Input
LVCMOS
DDR
none
Input data bus, bit 11
3.75
DATA(12)
E4
Input
LVCMOS
DDR
none
Input data bus, bit 12
3.71
DATA(13)
F1
Input
LVCMOS
DDR
none
Input data bus, bit 13
3.76
DATA(14)
F3
Input
LVCMOS
DDR
none
Input data bus, bit 14
3.73
DATA(15)
G1
Input
LVCMOS
DDR
none
Input data bus, bit 15
3.72
DATA(16)
G2
Input
LVCMOS
DDR
none
Input data bus, bit 16
3.77
DATA(17)
G4
Input
LVCMOS
DDR
none
Input data bus, bit 17
3.73
DATA(18)
H1
Input
LVCMOS
DDR
none
Input data bus, bit 18
3.74
DATA(19)
H2
Input
LVCMOS
DDR
none
Input data bus, bit 19
3.76
DATA(20)
H4
Input
LVCMOS
DDR
none
Input data bus, bit 20
3.70
DATA(21)
J1
Input
LVCMOS
DDR
none
Input data bus, bit 21
3.77
DATA(22)
J3
Input
LVCMOS
DDR
none
Input data bus, bit 22
3.76
DATA(23)
J4
Input
LVCMOS
DDR
none
Input data bus, bit 23, MSB
3.77
DCLK
K1
Input
LVCMOS
DDR
none
Input data bus clock
3.74
DATA CONTROL INPUTS
LOADB
K2
Input
LVCMOS
DDR
none
Parallel-data load enable
3.74
TRC
K4
Input
LVCMOS
DDR
none
Input-data toggle rate control
4.70
SCTRL
K3
Input
LVCMOS
DDR
none
Serial-control bus
3.75
3.77
SAC_BUS
C20
Input
LVCMOS
—
none
Stepped address-control serialbus data
SAC_CLK
C22
Input
LVCMOS
—
none
Stepped address-control serialbus clock
1.49
LVCMOS
—
none
DMD reset-control serial bus
3.73
3.74
3.73
MIRROR RESET CONTROL INPUTS
DRC_BUS
B21
Input
DRC_OE
A20
Input
LVCMOS
—
none
Active-low output enable signal
for internal DMD reset driver
circuitry
DRC_STROBE
A22
Input
LVCMOS
—
none
Strobe signal for DMD resetcontrol inputs
(1)
(2)
8
(a) DDR = Double data rate
(b) SDR = Single data rate
(c) Refer to Timing Requirements for specifications and relationships.
Net trace lengths inside the package:
(a) Relative dielectric constant for the FQD ceramic package is 9.8.
(b) Propagation speed = 11.8 / sqrt(9.8) = 3.769 inches/ns.
(c) Propagation delay = 0.265 ns/inch = 265 ps/inch = 10.43 ps/mm.
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DLPS028B – APRIL 2013 – REVISED JANUARY 2016
Connector Pins for FQD (continued)
PIN
NAME
POWER INPUTS
NO.
TYPE
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
PACKAGE NET
LENGTH (mm)
(2)
(3)
VBIAS
C19
Power
VBIAS
D19
Power
VOFFSET
A19
Power
VOFFSET
K19
Power
VRESET
E19
Power
VRESET
F19
Power
VREF
B19
Power
VREF
J19
Power
VCC
B22
Power
VCC
C2
Power
VCC
D21
Power
VCC
E2
Power
VCC
E20
Power
VCC
E22
Power
VCC
F21
Power
VCC
G3
Power
VCC
G19
Power
VCC
G20
Power
VCC
G22
Power
VCC
H19
Power
VCC
H21
Power
VCC
J20
Power
VCC
J22
Power
VCC
K21
Power
(3)
SIGNAL
Mirror-reset bias voltage
Mirror-reset offset voltage
Mirror-reset voltage
Power supply for LVCMOS
double-data-rate (DDR)
interface
Power supply for LVCMOS logic
The following power supplies are all required to operate the DMD: VSS, VCC, VOFFSET, VBIAS, VRESET.
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Connector Pins for FQD (continued)
PIN
NAME
NO.
TYPE
VSS
A21
Power
VSS
B2
Power
VSS
B4
Power
VSS
B20
Power
VSS
C21
Power
VSS
D2
Power
VSS
D3
Power
VSS
D20
Power
VSS
D22
Power
VSS
E3
Power
VSS
E21
Power
VSS
F2
Power
VSS
F4
Power
VSS
F20
Power
VSS
F22
Power
VSS
G21
Power
VSS
H3
Power
VSS
H20
Power
VSS
H22
Power
VSS
J2
Power
VSS
J21
Power
VSS
K20
Power
SIGNAL
DATA RATE
(1)
INTERNAL
TERMINATION
DESCRIPTION
PACKAGE NET
LENGTH (mm)
(2)
Ground – Common return for all
power inputs
Pin Configuration and Functions – Test Pads for FQD Package
10
NAME
PIN
SIGNAL
DESCRIPTION
UNUSED
A5, A18, B5, B18, C5, C18, D5, D18, E5,
E18, F5, F18, G5, G18, H5, H18, J5, J18,
K22
Test Pads
Do not connect
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
SUPPLY VOLTAGES
(1)
MIN
MAX
UNIT
(2)
VCC
Supply voltage for LVCMOS core logic
–0.5
4
V
VREF
Supply voltage for LVCMOS DDR interface
–0.5
4
V
VOFFSET
Supply voltage for high voltage CMOS and micromirror electrode
–0.5
8.75
V
Supply voltage for micromirror electrode
–0.5
17
V
Supply voltage for micromirror electrode
–11
0.5
V
8.75
V
VREF + 0.5
V
VBIAS
(3)
VRESET
|VBIAS - VOFFSET|
(3)
INPUT VOLTAGES
(2)
Supply voltage delta (absolute value)
Input voltage to all other input pins
–0.5
INPUT CURRENTS
Current required from a high-level output
VOH = 1.4 V
–9
mA
Current required from a low-level output
VOL = 0.4 V
18
mA
80
120
MHz
-20
90
°C
-40
90
°C
CLOCKS
fCLK
DCLK clock frequency
ENVIRONMENTAL
Case temperature - operational
TCASE
(4)
Case temperature - non-operational
TDP
(4)
Dew Point (operation and non-operational)
Operating Relative Humidity (non-condensing)
(1)
(2)
(3)
(4)
0
81
°C
95
%RH
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device is not implied at these or any conditions beyond those indicated under Recommended
Operating Conditions. Exposure above Recommended Operating Conditions for extended periods may affect device reliability.
All voltage values are referenced to common ground VSS. Supply voltages VCC, VREF, VOFFSET, VBIAS, and VRESET are all
required for proper DMD operation. VSS must also be connected.
To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than the specified limit.
DMD Temperature is the worst-case of any test point shown in Figure 9 or Figure 10, or the active array as calculated by the
Micromirror Array Temperature Calculation, or any point along the Window Edge as defined in Figure 9 or Figure 10. The locations of
thermal test point TP2 is intended to measure the highest window edge temperature. If a particular application causes another point on
the window edge to be at a higher temperature, a test point should be added to that location.
6.2 Storage Conditions
applicable before the DMD is installed in the final product
Storage temperature
Storage humidity, non-condensing
Tstg
(1)
(2)
(3)
(1)
MIN
MAX
UNIT
–40
85
°C
0
(1)
95
%RH
Long-term storage dew point
(1) (2)
24
°C
Short-term storage dew point
(1) (3)
28
°C
As a best practice, TI recommends storing the DMD in a temperature and humidity controlled environment.
Long-term is defined as the average over the usable life.
Short-term is defined as <60 cumulative days over the usable life of the device.
6.3 ESD Ratings
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
(2) (3)
VALUE
UNIT
±2000
V
ESD Ratings are applicable before the DMD is installed in final product.
All CMOS devices require proper Electrostatic Discharge (ESD) handling procedures.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
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6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
SUPPLY VOLTAGES
MIN
NOM
MAX
UNIT
2.375
2.5
2.625
V
1.6
1.9
2
V
8.25
8.5
8.75
V
(1)
VCC
Supply voltage for LVCMOS core logic
VREF
Supply voltage for LVCMOS DDR interface
VOFFSET
Supply voltage for HVCMOS and micromirror electrode
VBIAS
Supply voltage for micromirror electrode
VRESET
Supply voltage for micromirror electrode
|VBIAS –
VOFFSET|
Supply voltage delta (absolute value)
(2) (3)
(2)
15.5
16
16.5
V
–9.5
–10
–10.5
V
8.75
V
(2)
VOLTAGE RANGE
VT+
Positive-going threshold voltage
0.4 × VREF
0.7 × VREF
V
VT–
Negative-going threshold voltage
0.3 × VREF
0.6 × VREF
V
Vhys
Hysteresis voltage (VT+ – VT–)
0.1 × VREF
0.4 × VREF
V
80
120
CLOCK FREQUENCY
ƒ(CLK)
DCLK clock frequency
ENVIRONMENTAL
DMD temperature - operational, long-term
TDMD
(5) (6)
TWindow
DMD window temperature - operational
TCERAMIC-
DMD |ceramic TP1 - window| temperature delta - operational
(8) (9)
DMD long-term dewpoint (operational, non-operational)
DMD short-term dewpoint (operational, non-operational)
(7)
°C
-20
65
°C
0
90
°C
0
30
°C
24
°C
28
°C
10
DMD temperature - operational, short-term
WINDOW-DELTA
MHz
(4)
(10)
40 to 65
ILLUMINATION
ILLUV-VIS
ILLVIS
ILLIR
0.68
mW/cm2
Illumination power - spectral region 420 to 700 nm, FQE
package
Thermally
Limited (11)
mW/cm2
Illumination power - spectral region 420 to 700 nm, FQD
package
Thermally
Limited (11)
mW/cm2
10
mW/cm2
Illumination power - spectral region <420 nm
Illumination power - spectral region >700 nm
(1)
Supply voltages VCC, VREF, VOFFSET, VBIAS, and VRESET are all required for proper DMD operation. All voltage values are
referenced to common ground VSS.
(2) To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit.
(3) VOFFSET supply transients must fall within specified max voltages.
(4) Optimal long-term performance and optical efficiency of the Digital Micromirror Device (DMD) can be affected by various application
parameters, including illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (storage
and operating), DMD temperature, ambient humidy (storage and operating), and power on or off duty cycle.
(5) DMD temperature is the worst-case of any test point shown in Figure 9 or Figure 10, or the active array as calculated by the Micromirror
Array Temperature Calculation, or any point along the Window Edge as defined in Figure 9 or Figure 10. The locations of thermal test
point TP2 in Figure 9 or Figure 10 is intended to measure the highest window edge temperature. If a particular application causes
another point on the window edge to be at a higher temperature, a test point should be added to that location.
(6) Long-term is defined as the average over the usable life.
(7) Per Figure 1, the maximum operational case temperature at test points TP1 and TP2 as shown in Figure 9 or Figure 10 should be
derated based on the micromirror landed duty cycle that the DMD experiences in the end application. Refer to Micromirror Landedon/Landed-Off Duty Cycle for a definition of landed duty cycle.
(8) Between any two points on or within the package including the mirror array.
(9) Ceramic package and window temperature as measured at test points TP1 and TP2 in Figure 9 or Figure 10.
(10) Dew points beyond the specified long-term dew point (operating, non-operating, or storage) are for short-term conditions only, where
short-term is defined as <60 cumulative days over the useful life of the device.
(11) Refer to Micromirror Array Temperature Calculation and Temperature Calculation for information related to calculating the micromirror
array temperature.
12
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Max Recommended DMD Temperature –
Operational (°C)
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80
70
60
50
40
30
0/100 5/95 10/90 15/85 20/80 25/75 30/70 35/65 40/60 45/55 50/50
100/0
95/5
90/10
85/15
80/20
75/25
70/30
65/35
Micromirror Landed Duty Cycle
60/40
55/45
D001
Figure 1. Max Recommended DMD Temperature – Derating Curve
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6.5 Thermal Information
over operating free-air temperature range (unless otherwise noted)
DLP4500
THERMAL METRIC
Thermal resistance - Active area to case ceramic
(1)
FQE (LCCC)
FQD (LCCC)
80 PINS
98 PINS
2
2
(1)
UNIT
°C/W
The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of
maintaining the package within the temperature range specified in the Recommended Operating Conditions. The total heat load on the
DMD is largely driven by the incident light absorbed by the active area; although other contributions include light energy absorbed by the
window aperture and electrical power dissipation of the array. Optical systems should be designed to minimize the light energy falling
outside the window clear aperture since any additional thermal load in this area can significantly degrade the reliability of the device.
6.6 Electrical Characteristics
over the range of recommended supply voltage and recommended case operating temperature (unless otherwise noted)
PARAMETER
IIL
TEST CONDITIONS
Low-level input current
(1)
VREF = 2.00 V
VI = 0 V
(1)
VREF = 2.00 V
VI = VREF
IREF
Current into VREF pin
VREF = 2.00 V
fDCLK = 120 MHz
ICC
Current into VCC pin
VCC = 2.75 V
fDCLK = 120 MHz
IOFFSET
Current into VOFFSET
pin (2)
VOFFSET = 8.75
V
Three global resets within
time period = 200 μs
(3)
VBIAS = 16.5 V
Three global resets within
time period = 200 μs
Current into VRESET pin
VRESET = –10.5 V
High-level input current
IIH
MIN
NOM
MAX
–50
UNIT
nA
50
nA
2.15
2.75
mA
125
160
mA
3
3.3
mA
2.55
6.5
mA
2.45
3.1
mA
135.15
175.65
mA
CURRENT
Current into VBIAS pin
IBIAS
IRESET
(2)
ITOTAL
POWER
PREF
Power into VREF pin
(4)
(4)
PCC
Power into VCC pin
POFFSET
Power into VOFFSET pin
PBIAS
Power into VBIAS pin
PRESET
(4)
(4)
Power into VRESET pin
(4)
VREF = 2.00 V
fDCLK = 120 MHz
4.15
5.5
mW
VCC = 2.75 V
fDCLK = 120 MHz
343.75
440
mW
VOFFSET = 8.75
V
Three global resets within
time period = 200 μs
26.25
28.9
mW
VBIAS = 16.5 V
Three global resets within
time period = 200 μs
42.1
58.6
mW
25.71
32.6
mW
442
566
mW
VRESET = –10.5 V
PTOTAL
CAPACITANCE
CI
Input capacitance
ƒ = 1 MHz
10
pF
CO
Output capacitance
ƒ = 1 MHz
10
pF
(1)
(2)
(3)
(4)
14
Applies to LVCMOS pins only. LVCMOS pins do not have pullup or pulldown configurations.
Exceeding the maximum allowable absolute voltage difference between VBIAS and VOFFSET may result in excess current draw. See
the Absolute Maximum Ratings for further details.
When DRC_OE = High, the internal reset drivers are 3-stated and IBIAS standby current is 6.5 mA.
In some applications, the total DMD heat load can be dominated by the amount of incident light energy absorbed. See the Micromirror
Array Temperature Calculation for further details.
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6.7 Timing Requirements
Over operating free-air temperature range (unless otherwise noted). This data sheet provides timing at the device pin.
MIN
Setup time: DATA before rising or falling edge of DCLK
tsu(1)
(1)
Setup time: SCTRL before rising or falling edge of DCLK
tsu(2)
Setup time: LOADB low before rising edge of DCLK
0.7
(1)
(1)
(1)
Setup time: SAC_BUS low before rising edge of SAC_CLK
tsu(4)
Setup time: DRC_BUS high before rising edge of SAC_CLK
tsu(5)
Setup time: DRC_STROBE high before rising edge of SAC_CLK
Hold time: DATA after rising or falling edge of DCLK
Hold time: TRC after rising or falling edge of DCLK
0.7
ns
1
ns
1
ns
2
ns
0.7
0.7
(1)
th(3)
Hold time: SAC_BUS low after rising edge of SAC_CLK
th(4)
Hold time: DRC_BUS after rising edge of SAC_CLK
th(5)
Hold time: DRC_STROBE after rising edge of SAC_CLK
ns
0.7
(1)
Hold time: LOADB low after falling edge of DCLK
tf
(1)
(1)
th(2)
tr
(1)
(1)
Hold time: SCTRL after rising or falling edge of DCLK
ns
0.7
tsu(3)
th(1)
MAX UNIT
0.7
(1)
Setup time: TRC before rising or falling edge of DCLK
NOM
(1)
(1)
(1)
0.7
ns
1
ns
1
ns
2
ns
Rise time (20% to 80%): DCLK / SAC_CLK
VREF = 1.8 V
1.08
Rise time (20% to 80%): DATA / TRC / SCTRL / LOADB
VREF = 1.8 V
1.08
Fall time (20% to 80%): DCLK / SAC_CLK
VREF = 1.8 V
1.08
Fall time (20% to 80%): DATA / TRC / SCTRL / LOADB
1.08
ns
ns
tc1
Clock cycle: DCLK
8.33
10
12.5
ns
tc3
Clock cycle: SAC_CLK
12.5
13.33
14.3
ns
tw1
Pulse width high or low: DCLK
3.33
ns
tw2
Pulse width low: LOADB
4.73
ns
tw3
Pulse width high or low: SAC_CLK
5
ns
tw5
Pulse width high: DRC_STROBE
7
ns
(1)
Setup and hold times shown are for fast input slew rates >1 V/ns. For slow slew rates >0.5 V/ns and < 1 V/ns, the setup and hold times
are longer. For every 0.1 V/ns decrease in slew rate from 1 V/ns, add 150 ps on setup and hold.
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Figure 2. Timing Diagram
16
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6.8 System Mounting Interface Loads
MIN
Static load applied to the package
electrical connector area (1)
Static load applied to the DMD
mounting area (1)
Load applied to the thermal interface
area (2)
Load applied to the electrical interface
areas (2)
(1)
(2)
FQE package
FQD package
NOM
MAX
UNIT
110
N
110
N
Uniformly distributed over Thermal
Interface area
62
N
Uniformly distributed over each of the
two areas
55
N
Uniformly distributed across the three
datum-A areas and the datum-E area.
See Figure 3 and Mechanical, Packaging, and Orderable Information for diagrams.
See Figure 3 and Figure 4 for diagrams.
SPACER
Datum 'A' area (3 places)
Datum 'A' area (3 places)
Datum 'E' (1 place)
Datum 'E' area (1 place)
Connector Area
Thermal Interface Area
DMD Mounting Areas
(3 places opposite Datum 'A'
1 place opposite Datum 'E')
Electrical Interface
Area Number 1
Figure 3. System Interface Loads for FQE
Electrical Interface
Area Number 2
Figure 4. System Interface Loads for FQD
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6.9 Micromirror Array Physical Characteristics
Number of active micromirror rows
(1)
Number of active micromirror columns
Micromirror pitch, diagonal
(1)
(1)
(1)
Micromirror pitch, vertical and horizontal
Micromirror active array height
Micromirror active array width
Micromirror array border
(1)
(2)
(3)
(2)
(2)
(3)
VALUE
UNIT
1140
micromirrors
912
micromirrors
7.6
µm
10.8
µm
1140
micromirrors
6161.4
µm
912
micromirrors
9855
µm
10
mirrors/side
See Micromirror Array, Pitch, and Hinge-Axis Orientation.
See Micromirror Active Area in Figure 5.
The mirrors that form the array border are hard-wired to tilt in the –12° (“Off”) direction once power is applied to the DMD (see
Micromirror Array, Pitch, and Hinge-Axis Orientation and Micromirror Landed Positions and Light Paths).
Figure 5. DLP4500 Micromirror Active Area
18
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6.10 Micromirror Array Optical Characteristics
TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical
performance involves making trade-offs between numerous component and system design parameters. See the related
application reports in Related Documentation for guidelines.
PARAMETER
α
Micromirror tilt angle
β
Micromirror tilt angle variation
TEST CONDITIONS
(1) (5) (7) (8) (9)
Micromirror crossover time
(10) (11)
Micromirror switching time
(11)
Non-operating micromirrors
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
, see
(4)
DMD landed state
(1) (5) (6)
, see
(4)
(4)
NOM
MAX
0
11
12
–1
1
(14) (15)
420 nm to 700 nm
°
16
μs
10
0
89
f/3 illumination at 24 degree angle,
mirrors tilted toward illumination
°
μs
Adjacent micromirrors
(13)
13
UNIT
5
Non-adjacent micromirrors
(14) (15) (16)
Mirror metal specular reflectivity
(1) (2) (3)
See
(12)
Orientation of the micromirror axis-of-rotation
Micromirror array fill factor
MIN
DMD parked state
90
91
micromirrors
°
92%
89%
Window material
Corning Eagle XG
Window aperture
See
(17)
Measured relative to the plane formed by the overall micromirror array.
Parking the micromirror array returns all of the micromirrors to a relatively flat (0˚) state (as measured relative to the plane formed by the
overall micromirror array).
When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.
See Figure 8.
Additional variation exists between the micromirror array and the package datums.
When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS
memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in an nominal angular
position of +12°. A binary value of 0 results in a micromirror landing in an nominal angular position of –12°.
Represents the landed tilt angle variation relative to the nominal landed tilt angle
Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different
devices.
For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some
system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field
reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in
colorimetry variations or system contrast variations.
Micromirror crossover time is primarily a function of the natural response time of the micromirrors.
Performance as measured at the start of life.
Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the –12° position to +12° or vice versa.
Measured relative to the package datums B and C, shown in the Package Mechanical Data section in Mechanical, Packaging, and
Orderable Information.
The nominal DMD total optical efficiency results from the following four components:
(a) Micromirror array fill factor
(b) Micromirror array diffraction efficiency
(c) Micromirror surface reflectivity (very similar to the reflectivity of bulk Aluminum)
(d) Window Transmission (single pass through two surfaces for incoming light, and single pass through two surfaces for reflected light)
The DMD diffraction efficiency and total optical efficiency observed in a specific application depends on numerous application-specific
design variables, such as:
(a) Illumination wavelength, bandwidth or line-width, degree of coherence
(b) Illumination angle, plus angle tolerence
(c) Illumination and projection aperture size, and location in the system optical path
(d) Illumination overfill of the DMD micromirror array
(e) Aberrations present in the illumination source or path, or both
(f) Aberrations present in the projection path
Does not account for the effect of micromirror switching duty cycle, which is application dependent. Micromirror switching duty cycle
represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection
path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.
The Micromirror array fill factor depends on numerous application-specific design variables, such as:
(a) Illumination angle, plus angle tolerance
(b) Illumination and projection aperture size, and location in the system optical path
See the Package Mechanical Characteristics in Mechanical, Packaging, and Orderable Information for details regarding the size and
location of the window aperture.
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Micromirror Array Optical Characteristics (continued)
TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical
performance involves making trade-offs between numerous component and system design parameters. See the related
application reports in Related Documentation for guidelines.
PARAMETER
Illumination Overfill
TEST CONDITIONS
MIN
(18)
NOM
See
Window Transmittance (single pass through two
window surfaces) (14) (15)
MAX
UNIT
(18)
96%
420 nm to 700 nm, See Figure 6
(18) The active area of the DLP4500 device is surrounded by an aperture on the inside of the DMD window surface that masks structures of
the DMD device assembly from normal view. The aperture is sized to anticipate several optical conditions. Overfill light illuminating the
area outside the active array can scatter and create adverse effects to the performance of an end application using the DMD. The
illumination optical system should be designed to limit light flux incident outside the active array to less than 10% of the light flux level in
the active area. Depending on the particular system's optical architecture and assembly tolerances, the amount of overfill light on the
outside of the active array may cause system performance degradation .
6.11 Typical Characteristics
Single pass, through two window surfaces.
110
100
Transmittance (%)
90
80
70
60
50
40
30
20
10
0 Degrees AOI
30 Degrees AOI
0
200 250 300 350 400 450 500 550 600 650 700 750 800
Wavelength (nm)
D001
Figure 6. DLP4500 DMD Window Transmittance
20
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7 Detailed Description
7.1 Overview
Electrically, the DLP4500 device consists of a two-dimensional array of 1-bit CMOS memory cells, organized in a
grid of 912 memory cell columns by 1140 memory cell rows. The CMOS memory array is addressed on a
column-by-column basis, over a 24-bit DDR bus. Addressing is handled through a serial control bus. The specific
CMOS memory access protocol is handled by the DLPC350 digital controller.
Optically, the DLP4500 device consists of 1039680 highly reflective, digitally switchable, micrometer-sized
mirrors (micromirrors) organized in a two-dimensional array. The micromirror array consists of 912 micromirror
columns by 1140 micromirror rows in diamond pixel configuration (Figure 7). Due to the diamond pixel
configuration, the columns of each odd row are offset by half a pixel from the columns of the even row.
SCTRL
SAC_BUS
SAC_CLK
DCLK
TRC
LOADBZ
VCC
VSS
Data (23:0)
7.2 Functional Block Diagram
High Speed Interface
Misc
Column Write
Control
Bit Lines
(0,0)
Voltage
Generators
Voltages
Micromirror Array
Word Lines
Row
(911,1139)
Control
Column Read
Control
VRef
DRC_BUS
DRC_OEZ
DRC_STROBE
VBIAS
VCC
VSS
VRESET
VOFFSET
Low Speed Interface
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7.3 Feature Description
Each aluminum micromirror is approximately 7.6 microns in size and arranged in row and columns as shown in
Figure 7. Due to the diamond pixel array of the DMD, the pixel data does not appear on the DMD exactly as it
would in an orthogonal pixel arrangement. Pixel arrangement and numbering for the DLP4500 is shown in
Figure 7.
Each micromirror is switchable between two discrete angular positions: –12° and 12°. The angular positions α
and β are measured relative to a 0° flat reference when the mirrors are parked in their inactive state, parallel to
the array plane (see Figure 8). The parked position is not a latched position. Individual micromirror angular
positions are relatively flat, but do vary. The tilt direction is perpendicular to the hinge-axis. The on-state landed
position is directed toward the left side of the package (see Figure 8).
Figure 7. Micromirror Array, Pitch, and Hinge-Axis Orientation
22
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Feature Description (continued)
Figure 8. Micromirror Landed Positions and Light Paths
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Feature Description (continued)
Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a
specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell
contents, after the mirror clocking pulse is applied. The angular position (–12° or 12°) of the individual
micromirrors changes synchronously with a micromirror clocking pulse, rather than being coincident with the
CMOS memory cell data update. Therefore, writing a logic 1 into a memory cell followed by a mirror clocking
pulse results in the corresponding micromirror switching to a 12° position. Writing a logic 0 into a memory cell
followed by a mirror clocking pulse results in the corresponding micromirror switching to a –12° position.
Updating the angular position of the micromirror array consists of two steps.
1. Update the contents of the CMOS memory.
2. Applying a mirror clocking pulse to the entire micromirror array.
Mirror reset pulses are generated internally by the DLP4500 DMD, with initiation of the pulses being coordinated
by the DLPC350 controller. For timing specifications, see Timing Requirements.
Around the perimeter of the 912 × 1140 array of micromirrors is a uniform band of border micromirrors. The
border micromirrors are not user-addressable. The border micromirrors land in the –12° position after power has
been applied to the device. There are 10 border micromirrors on each side of the 912 × 1140 active array.
7.4 Device Functional Modes
DLP4500 is part of the chipset comprising of the DLP4500 DMD and DLPC350 display controller. To ensure
reliable operation, the DLP4500 DMD must always be used with the DLPC350 display controller. DMD functional
modes are controlled by the DLPC350 digital display controller. See the DLPC350 data sheet listed in Related
Documentation.
7.4.1 Operating Modes
The DLPC350 is capable of sending patterns to the DLP4500 DMD in two different streaming modes. The first
mode is continuous streaming mode, where the DLPC350 uses the parallel RGB interface to stream the 24-bit
patterns to the DMD. The second mode is burst mode, where the DLPC350 loads up to 48 binary patterns from
flash storage into internal memory, and then streams those patterns to the DMD. Table 1 shows the maximum
pattern and data rates for both modes of operation.
Table 1. Pattern and Data Rates
(1)
(2)
OPERATING MODE
PATTERN RATE (Hz)
DATA RATE (Gbps)
MAXIMUM BINARY PATTERNS
Continuouse Streaming (1)
2880
2.99
Unlimited
Burst (2)
4220
4.39
48
Continuous streaming mode uses patterns from RGB interface.
Burst mode uses patterns from internal memory.
7.5 Micromirror Array Temperature Calculation
Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the
maximum temperature of any individual micromirror in the active array, the maximum temperature of the window
aperture, and the temperature gradient between any two points on or within the package.
See the Absolute Maximum Ratings and Recommended Operating Conditions for applicable temperature limits.
7.5.1 Package Thermal Resistance
The DMD is designed to conduct the absorbed and dissipated heat back to the package where it can be
removed by an appropriate thermal management system. The thermal management system must be capable of
maintaining the package within the specified operational temperatures at the Thermal test point location, see
Figure 9. The total heat load on the DMD is typically driven by the incident light absorbed by the active area;
although other contributions can include light energy absorbed by the window aperture, electrical power
dissipation of the array, and/or parasitic heating.
24
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Micromirror Array Temperature Calculation (continued)
7.5.2 Case Temperature
The temperature of the DMD case can be measured directly. For consistency, a thermal test point location TP1
representing the case temperature is defined as shown in Figure 9 and Figure 10.
Figure 9. Thermal Test Point Location - FQE Package
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Micromirror Array Temperature Calculation (continued)
Figure 10. Thermal Test Point Location - FQD Package
7.5.2.1 Temperature Calculation
Micromirror array temperature cannot be measured directly. Therefore, it must be computed analytically from:
• Thermal test point location (see Figure 9 or Figure 10)
• Package thermal resistance
• Electrical power dissipation
• Illumination heat load
The relationship between the micromirror array and the case temperature is provided by the following equations:
TArray = TCeramic + (QArray × RArray-To-Ceramic)
QArray = QElec + QIllum
QIllum = CL2W × SL
(1)
(2)
where
•
•
•
•
•
•
•
•
26
TArray = Computed micromirror array temperature (°C)
TCeramic = Ceramic case temperature (°C) (TP1 location)
QArray = Total DMD array power (electrical + absorbed) (W)
RArray-to-Ceramic = Thermal resistance of DMD package from array to TP1 (°C/W)
QElec = Nominal electrical power (W)
QIllum = Absorbed illumination heat (W)
CL2W = Lumens-to-watts constant, estimated at 0.00293 W/lm, based on array characteristics. It assumes a
spectral efficiency of 300 lm/W for the projected light, illumination distribution of 83.7% on the active array, and
16.3% on the array border and window aperture
SL = Screen lumens
(3)
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Micromirror Array Temperature Calculation (continued)
An example calculation is provided in Equation 4 and Equation 5. DMD electrical power dissipation varies and
depends on the voltage, data rates, and operating frequencies. The nominal electrical power dissipation is used
in this calculation with nominal screen lumens of 200 lm and a ceramic case temperature at TP1 of 55°C. Using
these values in the previous equations, the following values are computed:
QArray = QElec + CL2W × SL = 0.442 W + (0.00293 W/lm × 200 lm) = 1.028 W
TArray = TCeramic + (QArray × RArray-To-Ceramic) = 55°C + (1.028 W × 2°C/W) = 57.1°C
(4)
(5)
7.6 Micromirror Landed-on/Landed-Off Duty Cycle
7.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
The micromirror landed-on/landed-off duty cycle (landed duty cycle) denotes the amount of time (as a
percentage) that an individual micromirror is landed in the On–state versus the amount of time the same
micromirror is landed in the Off–state.
As an example, a landed duty cycle of 100/0 indicates that the referenced micromirror is in the On–state 100% of
the time (and in the Off–state 0% of the time); whereas 0/100 would indicate that the micromirror is in the
Off–state 100% of the time. Likewise, 50/50 indicates that the micromirror is On 50% of the time and Off 50% of
the time.
Note that when assessing landed duty cycle, the time spent switching from one state (ON or OFF) to the other
state (OFF or ON) is considered negligible and is thus ignored.
Since a micromirror can only be landed in one state or the other (On or Off), the two numbers (percentages)
always add to 100.
7.6.2 Landed Duty Cycle and Useful Life of the DMD
Knowing the long-term average landed duty cycle (of the end product or application) is important because
subjecting all (or a portion) of the DMD’s micromirror array (also called the active array) to an asymmetric landed
duty cycle for a prolonged period of time can reduce the DMD’s usable life.
The symmetry of the landed duty cycle is determined by how close the On-state and Off-state percentages are to
being equal. For example, a landed duty cycle of 50/50 is perfectly symmetrical whereas a landed duty cycle of
100/0 or 0/100 is perfectly asymmetrical.
7.6.3 Landed Duty Cycle and Operational DMD Temperature
Operational DMD Temperature and Landed Duty Cycle interact to affect the DMD’s usable life, and this
interaction can be exploited to reduce the impact that an asymmetrical Landed Duty Cycle has on the DMD’s
usable life. This is quantified in the de-rating curve shown in Figure 1. The importance of this curve is that:
• All points along this curve represent the same usable life.
• All points above this curve represent lower usable life (and the further away from the curve, the lower the
usable life).
• All points below this curve represent higher usable life (and the further away from the curve, the higher the
usable life).
In practice, this curve specifies the Maximum Operating DMD Temperature that the DMD should be operated at
for a given long-term average Landed Duty Cycle.
7.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
During a given period of time, the Landed Duty Cycle of a given micromirror follows from the image content being
displayed by that micromirror.
For example, in the simplest case, when displaying pure-white on a given micromirror for a given time period,
that micromirror will experience a 100/0 Landed Duty Cycle during that time period. Likewise, when displaying
pure-black, the micromirror will experience a 0/100 Landed Duty Cycle.
Between the two extremes (ignoring for the moment color and any image processing that may be applied to an
incoming image), the Landed Duty Cycle tracks one-to-one with the linear gray scale value, as shown in Table 2.
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Table 2. Grayscale Value and Landed Duty Cycle
GRAYSCALE VALUE
LANDED DUTY CYCLE
0%
0/100
10%
10/90
20%
20/80
30%
30/70
40%
40/60
50%
50/50
60%
60/40
70%
70/30
80%
80/20
90%
90/10
100%
100/0
Accounting for color rendition (but still ignoring image processing) requires knowing both the color intensity (from
0% to 100%) for each constituent primary color (red, green, and/or blue) for the given micromirror as well as the
color cycle time for each primary color, where “color cycle time” is the total percentage of the frame time that a
given primary must be displayed in order to achieve the desired white point.
During a given period of time, the landed duty cycle of a given micromirror can be calculated as follows:
Landed Duty Cycle = (Red_Cycle_% × Red_Scale_Value) + (Green_Cycle_% × Green_Scale_Value) + (Blue_Cycle_%
× Blue_Scale_Value)
where
•
Red_Cycle_%, Green_Cycle_%, and Blue_Cycle_%, represent the percentage of the frame time that Red,
Green, and Blue are displayed (respectively) to achieve the desired white point.
(6)
For example, assume that the red, green and blue color cycle times are 50%, 20%, and 30% respectively (in
order to achieve the desired white point), then the Landed Duty Cycle for various combinations of red, green,
blue color intensities would be as shown in Table 3.
Table 3. Example Landed Duty Cycle for Full-Color
28
RED CYCLE PERCENTAGE
50%
GREEN CYCLE PERCENTAGE
20%
BLUE CYCLE PERCENTAGE
30%
RED SCALE VALUE
GREEN SCALE VALUE
BLUE SCALE VALUE
LANDED DUTY CYCLE
0%
0%
0%
0/100
100%
0%
0%
50/50
0%
100%
0%
20/80
0%
0%
100%
30/70
12%
0%
0%
6/94
0%
35%
0%
7/93
0%
0%
60%
18/82
100%
100%
0%
70/30
0%
100%
100%
50/50
100%
0%
100%
80/20
12%
35%
0%
13/87
0%
35%
60%
25/75
12%
0%
60%
24/76
100%
100%
100%
100/0
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
For reliable operation, the DLP4500 DMD must be coupled with the DLPC350 controller. The DMD is a spatial
light modulator which reflects incoming light from an illumination source to one of two directions, with the primary
direction being into a projection or collection optic. Each application is derived primarily from the optical
architecture of the system and the format of the data coming into the DLPC350. Applications of interest include
3D measurement systems, spectrometers, medical systems, and compressive sensing.
8.2 Typical Application
Figure 11 shows a typical embedded system application using the DLPC350 controller and DLP4500 DMD. In
this configuration, the DLPC350 controller supports a 24-bit parallel RGB input, typical of LCD interfaces, from an
external source or processor. This system supports both still and motion video sources. However, the controller
only supports sources with periodic synchronization pulses. This is ideal for motion video sources, but can also
be used for still images by maintaining periodic syncs and only sending a new frame of data when needed. The
still image must be fully contained within a single video frame and meet the frame timing constraints. The
DLPC350 controller refreshes the displayed image at the source frame rate and repeats the last active frame for
intervals in which no new frame has been received.
DC Power
RGB Interface
LED Enables
LVDS Interface
Lamp
Driver
USB Interface
Control Processor
LEDs
I2C
Digital Pattern
Creation
Hardware Triggers
System Control
DLPC350
GPIO Interface
Illumination
Optics
Light
Sensor
DMD Control
DLP4500
DMD Data
FLASH
JTAG
VBIAS
VOFF
VRST
FAN
CTL
Camera
OSC
DMD Voltage
Supplies
Figure 11. Typical Application Schematic
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Typical Application (continued)
8.2.1 Design Requirements
All applications using the DLP4500 chipset require both the controller and DMD components for operation. The
system also requires an external parallel flash memory device loaded with the DLPC350 configuration and
support firmware. The chipset has several system interfaces and requires some support circuitry. The following
interfaces and support circuitry are required:
• DLPC350 system interfaces:
– Control interface
– Trigger interface
– Input data interface
– Illumination interface
• DLPC350 support circuitry and interfaces:
– Reference clock
– PLL
– Program memory flash interface
• DMD interfaces:
– DLPC350 to DMD digital data
– DLPC350 to DMD control interface
– DLPC350 to DMD micromirror reset control interface
8.2.2 Detailed Design Procedure
8.2.2.1 DLPC350 System Interfaces
The DLP4500 chipset supports a 30-bit parallel RGB interface for image data transfers from another device and
a 30-bit interface for video data transfers. The system input requires proper generation of the PWRGOOD and
POSENSE inputs to ensure reliable operation. The two primary output interfaces are the illumination driver
control interface and sync outputs.
8.2.2.1.1 Control Interface
The DLP4500 chipset accepts control interface commands via the I2C or USB input buses. The control interface
allows another master processor to send commands to the DLP4500 chipset to query system status or perform
realtime operations such as programming LED driver current settings.
The DLPC350 controller offers two different sets of slave addresses. The I2C_ADDR_SEL pin provides the
ability to select an alternate set of 7-bit I2C slave addresses only during power-up. If the I2C_ADDR_SEL pin is
set low (logic '0'), then the DLPC350 slave addresses are 0x34 and 0x35. If the I2C-ADDR_SEL pin is set high
(logic '1'), then the DLPC350 slave address is 0x3A and 0x3B. The I2C_ADDR_SEL pin also changes the serial
number for the USB device so that two DLPC350s can be connected to one computer through USB. Once the
system initialization is complete, this pin will be available as a GPIO. See the DLPC350 Programmer's Guide
(listed in Related Documentation) for detailed information about these operations.
Table 4 lists a description for active signals used by the DLPC350 to support the I2C interface.
Table 4. Active Signals – I2C Interface
Signal Name
Description
2
30
I2C1_SCL
I C clock. Bidirectional open-drain signal. I2C slave clock input from the external
processor.
I2C1_SDA
I2C data. Bidirectional open-drain signal. I2C slave to accept command or transfer data
to and from the external processor.
I2C0_SCL
I2C bus 0, clock; I2C master for on-board peripherals
I2C0_SDA
I2C bus 0, data; I2C master for on-board peripherals
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8.2.2.1.2 Input Data Interface
The data interface has two input data ports: a parallel RGB-input port and an FPD-Link LVDS input port. Both
input ports can support up to 30 bits and have a nominal I/O voltage of 3.3 V. See the DLPC350 controller data
sheet (listed in Related Documentation) for details relating to maximum and minimum input timing specifications.
The parallel RGB port can support up to 30 bits in video mode. In pattern mode, only the upper 8 bits of each
color are recognized, thereby creating a 24 bit bus from the 30 bit input bus.
The FPD-Link input port can be configured to connect to a video decoder device or an external processor
through a 24-, 27-, or 30-bit interface.
Table 5 provides a description of the signals associated with the data interface.
Table 5. Active Signals – Data Interface
SIGNAL NAME
DESCRIPTION
RGB Parallel Interface
P1_(A, B, C)_[0:9]
30-bit data inputs 10 bits for each of the red, green, and blue channels). If
interfacing to a system with less than 10-bits per color, connect the bus of the
red, green, and blue channels to the upper bits of the DLPC350 10-bit bus.
P1A_CLK
Pixel clock; all input signals on data interface are synchronized with this clock.
P1_VSYNC
Vertical sync
P1_HSYNC
Horizontal sync
P1_DATAEN
Input data valid
FPD-Link LVDS Input
RCK
Differential input signal for clock
RA_IN
Differential input signal for data channel A
RB_IN
Differential input signal for data channel B
RC_IN
Differential input signal for data channel C
RD_IN
Differential input signal for data channel D
RE_IN
Differential input signal for data channel E
The A, B, and C input data channels of Port 1 can be internally swapped for optimum board layout.
8.2.2.2 DLPC350 System Output Interfaces
8.2.2.2.1 Illumination Interface
An illumination interface is provided that supports an LED driver with up to 3 individual channels.
Table 6 describes the active signals for the illumination interface.
Table 6. Active Signals – Illumination Interface
SIGNAL NAME
DESCRIPTION
HEARTBEAT
LED blinks continuously to indicate system is running fine
FAULT_STATUS
LED off indicates system fault
LEDR_EN
Red LED enable
LEDG_EN
Green LED enable
LEDB_EN
Blue LED enable
LEDR_PWM
Red LED PWM signal used to control the LED current
LEDG_PWM
Green LED PWM signal used to control the LED current
LEDB_PWM
Blue LED PWM signal used to control the LED current
8.2.2.2.2 Trigger Interface (Sync Outputs)
The DLPC350 controller outputs a set of trigger signals for synchronizing displayed patterns with a camera,
sensor, or other peripherals. The DLPC350 also has input triggers, where an external processor controls when
the patterns are displayed.
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Table 7. Active Signals – Trigger and Sync Interface
SIGNAL NAME
DESCRIPTION
P1_HSYNC
Horizontal sync
P1_VSYNC
Vertical sync
TRIG_IN_1
Advances the pattern display or displays two alternating patterns, depending on the
mode
TRIG_IN_2
Pauses the pattern display or advances the pattern by two, depending on the mode
TRIG_OUT_1
Active high during pattern exposure
TRIG_OUT_2
Active high to indicate first pattern display
8.2.2.3 DLPC350 System Support Interfaces
8.2.2.3.1 Reference Clock
The DLPC350 controller requires a 32-MHz 3.3-V external input from an oscillator. This signal serves as the
DLP4500 chipset reference clock from which the majority of the interfaces derive their timing. This includes DMD
interfaces and serial interfaces.
8.2.2.3.2 PLL
The DLPC350 controller contains two PLLs (PLLM and PLLD), each of which have dedicated 1.2-V digital and
1.8-V analog supplies. These 1.2-V PLL pins should be individually isolated from the main 1.2-V system supply
via a ferrite bead. The impedance of the ferrite bead should be much greater than the capacitor at frequencies
where noise is expected. The impedance of the ferrite bead must also be less than 0.5 Ω in the frequency range
of 100 to 300 kHz and greater than 10 Ω at frequencies greater than 100 MHz.
As a minimum, the 1.8-V analog PLL power and ground pins should be isolated using an LC filter with a ferrite
bead serving as the inductor and a 0.1-µF capacitor on the DLPC350 side of the ferrite bead. TI recommends
that this 1.8-V PLL power be supplied from a dedicated linear regulator and each PLL should be individually
isolated from the regulator. The same ferrite recommendations described for the 1.8-V analog PLL supply apply
to the 1.2-V digital PLL supply.
When designing the overall supply filter network, care must be taken to ensure that no resonances occur. Take
special care when using the 1- to 2-MHz band because this coincides with the PLL natural loop frequency.
8.2.2.3.3 Program Memory Flash Interface
The DLPC350 controller provides two external program memory chip selects:
• PM_CS_1 must be used as the chip select for the boot flash device. (Standard NOR Flash ≤ 128 Mb).
• PM_CS_2 is available for an optional flash device (≤128 Mb).
The flash access timing is fixed at 100.5 ns for read timing, and 154.1 ns for write timing. In standby mode, these
values change to 803.5 ns for read timing and 1232.1 ns for write timing.
These timing values assume a maximum single direction trace length of 75 mm. When an additional flash is used
in conjunction with the boot flash, stub lengths must be kept short and located as close as possible to the flash
end of the route.
The DLPC350 controller provides enough program memory address pins to support a flash device up to 128 Mb.
PM_ADDR_22 and PM_ADDR_21 are tri-stated GPIO pins during reset, so they require board-level pulldown
resistors to prevent the flash address bits from floating during initial bootload.
8.2.2.4 DMD Interfaces
8.2.2.4.1 DLPC350 to DMD Digital Data
The DLPC350 controller provides the pattern data to the DMD over a double data rate (DDR) interface. Data is
clocked on both rising and falling edges of the DCLK.
Table 8 describes the signals used for this interface.
32
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Table 8. Active Signals – DLPC350 to DMD Digital Data Interface
DLPC350 SIGNAL NAME
DMD SIGNAL NAME
DMD_D(23:0)
DATA(23:0)
DMD_DCLK
DCLK
8.2.2.4.2 DLPC350 to DMD Control Interface
The DLPC350 controller provides the control data to the DMD over a serial bus.
Table 9 describes the signals used for this interface.
Table 9. Active Signals – DLPC350 to DMD Control Interface
DLPC350
SIGNAL NAME
DMD
SIGNAL NAME
DMD_SAC_BUS
SAC_BUS
DMD stepped-address control (SAC) bus data
DMD_SAC_CLK
SAC_CLK
DMD stepped-address control (SAC) bus clock
DMD_LOADB
LOADB
DMD data load signal
DMD_SCTRL
SCTRL
DMD data serial control signal
DMD_TRC
TRC
DMD data toggle rate control
DESCRIPTION
8.2.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
The DLPC350 controls the micromirror clock pulses in a manner to ensure proper and reliable operation of the
DMD.
Table 10 describes the signals used for this interface.
Table 10. Active Signals – DLPC350 to DMD Micromirror Reset Control Interface
DLPC350
SIGNAL NAME
DMD
SIGNAL NAME
DMD_DRC_BUS
DRC_BUS
DMD_DRC_OE
DRC_OE
DMD_DRC_STRB
DRC_STRB
DESCRIPTION
DMD reset control serial bus
DMD reset control output enable
DMD reset control strobe
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9 Power Supply Recommendations
9.1 Power Supply Sequencing Requirements
The DLP4500 DMD includes five voltage-level supplies (VCC, VREF, VOFFSET, VBIAS, and VRESET), all referenced to
VSS ground. For reliable operation of the DLP4500 DMD, the following power supply sequencing requirements
must be followed.
CAUTION
Reliable performance of the DMD requires that the following conditions be met:
1. The VCC, VREF, VOFFSET, VBIAS, and VRESET power supply inputs must all be present
during operation. All voltages must be referenced to DMD ground (VSS).
2. The VCC, VREF, VOFFSET, VBIAS, and VRESET power supplies must be sequenced on
and off in the manner prescribed.
Repeated failure to adhere to the prescribed power-up and power-down procedures
may affect device reliability
9.2 DMD Power Supply Power-Up Procedure
1. Power up VCC and VREF in any order.
2. Wait for VCC and VREF to each reach a stable level within their respective recommended operating ranges.
3. Power up VBIAS, VOFFSET, and VRESET in any order, provided that the maximum delta-voltage between VBIAS
and VOFFSET is not exceeded (see Absolute Maximum Ratings for details).
NOTE
During the power-up procedure, the DMD LVCMOS inputs should not be driven high
until after step 2 is complete.
NOTE
Power supply slew rates during power up are unrestricted, provided that all other
conditions are met.
9.3 DMD Power Supply Power-Down Procedure
1. Command the chipset controller to execute a mirror-parking sequence. See the controller data sheet (listed
in Related Documentation) for details.
2. Power down VBIAS, VOFFSET, and VRESET in any order, provided that the maximum delta voltage between
VBIAS and VOFFSET is not exceeded (see Absolute Maximum Ratings for details).
3. Wait for VBIAS, VOFFSET, and VRESET to each discharge to a stable level within 4 V of the reference ground.
4. Power down VCC and VREF in any order.
NOTE
During the power-down procedure, the DMD LVCMOS inputs should be held at a
level less than VREF + 0.3 V.
NOTE
Power-supply slew rates during power down are unrestricted, provided that all other
conditions are met.
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DMD Power Supply Power-Down Procedure (continued)
Figure 12. Power-Up and Power-Down Timing
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10 Layout
10.1 Layout Guidelines
10.1.1 DMD Interface Design Considerations
The DMD interface is modeled after the low-power DDR-memory (LPDDR) interface. To minimize power
dissipation, the LPDDR interface is defined to be unterminated. As a result, PCB signal-integrity management is
imperative. Impedance control and crosstalk mitigation is critical to robust operation. LPDDR board design
recommendations include trace spacing that is three times the trace width, impedance control within 10%, and
signal routing directly over a neighboring reference plane (ground or 1.9-V plane).
DMD interface performance is also a function of trace length; therefore the length of the trace limits performance.
The DLPC350 controller only works over a narrow range of DMD signal routing lengths at 120 MHz. Ensuring
positive timing margins requires attention to many factors.
As an example, the DMD interface system timing margin can be calculated as follows.
Setup Margin = (DLPC350 Output Setup) – (DMD Input Setup) – (PCB Routing Mismatch) – (PCB SI Degradation) (7)
Hold-Time Margin = (DLPC350 Output Hold) – (DMD Input Hold) – (PCB Routing Mismatch) – (PCB SI Degradation) (8)
PCB signal integrity degradation can be minimized by reducing the affects of simultaneously switching output
(SSO) noise, crosstalk, and inter-symbol interface (ISI). Additionally, PCB routing mismatch can be budgeted via
controlled PCB routing.
In an attempt to minimize the need for signal integrity analysis that would otherwise be required, the following
PCB design guidelines are provided. They describe an interconnect system that satisfies both waveform quality
and timing requirements (accounting for both PCB routing mismatch and PCB SI degradation). Variation from
these recommendations may also work, but should be confirmed with PCB signal integrity analysis or lab
measurements.
10.1.2 DMD Termination Requirements
Table 11 lists the termination requirements for the DMD interface. These series resistors should be placed as
close to the DLPC350 pins as possible while following all PCB guidelines.
Table 11. Termination Requirements for DMD Interface
SIGNALS
36
SYSTEM TERMINATION
DMD_D(23:0), DMD_TRC, DMD_SCTRL,
DMD_LOADB, DMD_DRC_STRB,
DMD_DRC_BUS, DMD_SAC_CLK, and
DMD_SAC_BUS
External 5-Ω series termination at the transmitter
DMD_DCLK
External 5-Ω series termination at the transmitter
DMD_DRC_OE
External 0-Ω series termination. This signal must be
externally pulled-up to VDD_DMD via a 30-kΩ to
51-kΩ resistor
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DMD_CLK and DMD_SAC_CLK clocks should be equal lengths, as shown in Figure 13.
Figure 13. Series-Terminated Clocks
10.1.3 Decoupling Capacitors
The decoupling capacitors should be given placement priority. The supply voltage pin of the capacitor should be
located close to the DLPC350 supply voltage pin or pins. Decoupling capacitors should have two vias connecting
the capacitor to ground and two vias connecting the capacitor to the power plane, but if the trace length is less
than 0.05 inches, the device can be connected directly to the decoupling capacitor. The vias should be located
on opposite sides of the long side of the capacitor, and those connections should be less than 0.05 inches as
well.
10.1.4 Power Plane Recommendations
For best performance, TI recommends the following:
• Two power planes
– One solid plane for ground (GND)
– One split plane for other voltages with no signal routing on the power planes
• Power and ground pins should be connected to these planes through a via for each pin.
• All device pin and via connections to these planes should use a thermal relief with a minimum of four spokes.
• Trace lengths for the component power and ground pins should be minimized to 0.03 inches or less.
• Vias should be spaced out to avoid forming slots on the power planes.
• High speed signals should not cross over a slot in the adjacent power planes.
• Vias connecting all the digital layers should be placed around the edge of the rigid PCB regions 0.03 inches
from the board edges with 0.1 inch spacing prior to routing.
• Placing extra vias is not required if there are sufficient ground vias due to normal ground connections of
devices.
• All signal routing and signal vias should be inside the perimeter ring of ground vias.
10.1.5 Signal Layer Recommendations
The PCB signal layers should follow typical good practice guidelines including:
• Layer changes should be minimized for single-ended signals.
• Individual differential pairs can be routed on different layers, but the signals of a given pair should not
change layers.
• Stubs should be avoided.
• Only voltage or low-frequency signals should be routed on the outer layers, except as noted previously in
this document.
• Double data rate signals should be routed first for best impedance and trace length matching.
The PCB should have a solder mask on the top and bottom layers. The mask should not cover the vias.
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•
•
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Except for fine pitch devices (pitch ≤ 0.032 inches), the copper pads and the solder mask cutout should
be of the same size.
Solder mask between pads of fine pitch devices should be removed.
In the BGA package, the copper pads and the solder mask cutout should be of the same size.
10.1.6 General Handling Guidelines for CMOS-Type Pins
To avoid potentially damaging current caused by floating CMOS input-only pins, TI recommends that unused
input pins be tied through a pullup resistor to its associated power supply, or a pulldown to ground. For inputs
with internal pullup or pulldown resistors, adding an external pullup or pulldown resistor is unnecessary unless
specified in the Pin Configuration and Functions section. Note that internal pullup and pulldown resistors are
weak and should not be expected to drive an external line.
After power-up or device reset, bidirectional pins are configured as inputs as a reset default until directed
otherwise.
Unused output-only pins can be left open.
10.1.7 PCB Manufacturing
The DLPC350 Controller and DMD are a high-performance (high-frequency and high-bandwidth) set of
components. This section provides PCB guidelines to help ensure proper operation of these components.
The DLPC350 main board is a multi-layer PCB with surface mount components on both sides. The majority of
large surface mount components are placed on the top side of the PCB. Circuitry is high speed digital logic. The
high speed interfaces include:
• 120-MHz DDR interface from DLPC350 to DMD
• 150-MHz LVTTL interface from a video decoder to the DLPC350
• 150-MHz pixel clock supporting 30-bit parallel RGB interface
• LVTTL parallel memory interface between the DLPC350 controller and flash with 70-ns access time
• LVDS flat panel display port to DLPC350
The PCB should be designed to IPC2221 and IPC2222, Class 2, Type Z, at level B producibility and built to
IPC6011 and IPC6012, Class 2.
10.1.7.1 General Guidelines
Table 12. PCB General Recommendations
DESCRIPTION
RECOMMENDATION
Configuration
Asymmetric dual stripline
Etch thickness (T)
1.0-oz. (1.2-mil thick) copper
Single-ended signal impedance
50 Ω (±10%)
Differential signal impedance
100 Ω differential (±10%)
10.1.7.2 Trace Widths and Minimum Spacings
For best performance, TI recommends the trace widths and minimum spacings shown in Table 13.
Table 13. Trace Widths and Minimum Spacings
38
SIGNAL NAME
TRACE WIDTH (inches)
MINIMUM TRACE SPACING
(inches)
P1P2, P1P2V_PLLM, P1P2V_PLLD,
P2P5V, P3P3V, P1P9V, A1P8V,
A1P8V_PLLD, A1P8V_PLLM
0.02
0.010
VRST, VBIAS, VOFFSET
0.02
0.010
VSS (GND)
0.02
0.005
FANx_OUT
0.02
0.020
DMD_DCLK
0.030
P1A_CLK, P1B_CLK, P1C_CLK
0.030
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Table 13. Trace Widths and Minimum Spacings (continued)
SIGNAL NAME
TRACE WIDTH (inches)
MINIMUM TRACE SPACING
(inches)
MOSC, MOSCN
0.030
10.1.7.3 Routing Constraints
In order to meet the specifications listed in the following tables, typically the PCB designer must route these
signals manually (not using automated PCB routing software). In case of length matching requirements, routing
traces in a serpentine fashion may be required. Keep the number of turns to a minimum and the turn angles no
sharper than 45°. Traces must be 0.1 inches from board edges when possible; otherwise they must be 0.05
inches minimum from the board edges. Avoid routing long traces all around the PCB. PCB layout assumes
adjacent trace spacing is twice the trace width. However, three times the trace width will reduce crosstalk and
significantly help performance.
The maximum and minimum signal routing trace lengths include escape routing.
Table 14. Signal Length Routing Constraints for DMD Interface
MINIMUM SIGNAL
ROUTING LENGTH (1)
MAXIMUM SIGNAL
ROUTING LENGTH (2)
DMD_D(23:0), DMD_DCLK, DMD_TRC,
DMD_SCTRL, DMD_LOADB,
2480 mil
(63 mm)
2953 mil
(75 mm)
DMD_OE, DMD_DRC_STRB, DMD_DRC_BUS,
DMD_SAC_CLK, and DMD_SAC_BUS
512 mil
(13 mm)
5906 mil
(150 mm)
SIGNALS
(1)
(2)
Signal lengths below the stated minimum will likely result in overshoot or undershoot.
DMD-DDR maximum signal length is a function of the DMD_DCLK rate.
Each high-speed, single-ended signal should be routed in relation to its reference signal, such that a constant
impedance is maintained throughout the routed trace. Avoid sharp turns and layer switching while keeping total
trace lengths to a minimum. The following signals should follow the signal matching requirements described in
Table 15.
Table 15. High-Speed Signal Matching Requirements for DMD Interface
SIGNALS
DMD_D(23:0), DMD_TRC, DMD_SCTRL,
DMD_LOADB
DMD_DRC_STRB, DMD_DRC_BUS,
DMD_SAC_BUS, DMD_OE
REFERENCE SIGNAL
MAX MISMATCH
UNIT
DMD_DCLK
±200
(±5.08)
mil
(mm)
DMD_SAC_CLK
±200
(±5.08)
mil
(mm)
The values in Table 15 apply to the PCB routing only. They do not include any internal package routing
mismatch associated with the DLPC350 or DMD. Additional margin can be attained if internal DLPC350 package
skew is taken into account. Additionally, to minimize EMI radiation, serpentine routes added to facilitate trace
length matching should only be implemented on signal layers between reference planes.
Both the DLPC350 output timing parameters and the DMD input timing parameters include a timing budget to
account for their respective internal package routing skew. Thus, additional system margin can be attained by
comprehending the package variations and compensating for them in the PCB layout. To increase the system
timing margin, TI recommends that the DLPC350 package variation be compensated for (by signal group), but it
may not be desirable to compensate for DMD package skew. This is due to the fact that each DMD has a
different skew profile, making the PCB layout DMD specific. To use a common PCB design for different DMDs,
TI recommends that either the DMD package skew variation not be compensated for on the PCB, or the package
lengths for all applicable DMDs being considered. Table 16 provides the DLPC350 package output delay at the
package ball for each DMD interface signal.
The total length of all the traces in Table 16 should be matched to the DMD_DCLK trace length. Total trace
length includes package skews, PCB length, and DMD flex cable length.
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Table 16. DLPC350 Package Skew and Routing Trace Length for the DMD
Interface
SIGNAL
TOTAL DELAY (Package Skews)
PACKAGE PIN
(ps)
(mm)
DMD_D0
25.9
152.35
A8
DMD_D1
19.6
115.29
B8
DMD_D2
13.4
78.82
C8
DMD_D3
7.4
43.53
D8
DMD_D4
18.1
106.47
B11
DMD_D5
11.1
65.29
C11
DMD_D6
4.4
25.88
D11
DMD_D7
0.0
0.00
E11
DMD_D8
14.8
87.06
C7
B10
DMD_D9
18.4
108.24
DMD_D10
6.4
37.65
E7
DMD_D11
4.8
28.24
D10
DMD_D12
29.8
175.29
A6
DMD_D13
25.7
151.18
A12
DMD_D14
19.0
111.76
B12
DMD_D15
11.7
68.82
C12
DMD_D16
4.7
27.65
D12
DMD_D17
21.5
126.47
B7
DMD_D18
24.8
145.88
A10
DMD_D19
8.3
48.82
D7
DMD_D20
23.9
140.59
B6
DMD_D21
1.6
9.41
E9
DMD_D22
10.7
62.94
C10
DMD_D23
16.7
98.24
C6
DMD_DCLK
24.8
145.88
A9
DMD_LOADB
18.0
105.88
B9
DMD_SCTRL
11.4
67.06
C9
DMD_TRC
4.6
27.06
D9
Table 17. Routing Priority
ROUTING
PRIORITY
SIGNAL
DMD_DCLK
(1) (2) (3)
ROUTING
LAYER
MATCHING
REFERENCE SIGNAL
TOLERANCE
1
3
–
–
(2) (3) (4)
1
3, 4
DMD_DCLK
±150 mils
P1_A[9:0], P1_B[9:0], P1_C[9:0],
P1_HSYNC, P1_VSYNC, P1_DATAEN,
P1X_CLK
1
3, 4
P1X_CLK
±0.1 inches
R[A-E]_IN_P, R[A-E]_IN_N, RCK_IN_P,
RCK_IN_N
2
3, 4
RCK
±150 mils
Differential signals need to be
matched within ±12 mils
DMD_D[23:0], DMD_SCTRL (1)
(1)
(2)
(3)
(4)
40
Total signal length from the DLPC350 and the DMD, including flex cable traces and PCB signal trace lengths must be held to the
lengths specified in Table 14.
Switching routing layers is not permitted except at the beginning and end of a trace.
Minimize vias on DMD traces.
Matching includes PCB trace length plus the DLPC350 package length plus the DMD flex cable length.
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10.1.7.4 Fiducials
Fiducials for automatic component insertion should be 0.05 inch diameter copper with a 0.1-inch cutout (antipad).
Fiducials for optical auto insertion are placed on three corners of both sides of the PCB.
10.1.7.5 Flex Considerations
Table 18 shows the general DMD flex design recommendations. Table 19 lists the minimum flex design
requirements.
Table 18. Flex General Recommendations
DESCRIPTION
RECOMMENDATION
Configuration
Two-layer micro strip
Reference plane 1
Ground plan for proper return
Vias
Maximum two per signal
Single trace width
4-mil minimum
Etch thickness (T)
0.5-oz. (0.6 mil thick) copper
Single-ended signal impedance
50 Ω (± 10%)
Table 19. Minimum Flex Design Requirements
PARAMETER
Line width (W) (1)
Minimum line spacing to
other signals (S)
APPLICATION
SINGLE-ENDED SIGNALS
UNIT
Escape routing in ball field
4
(0.1)
mil
(mm)
PCB etch data and control
5
(0.13)
mil
(mm)
PCB etch clocks
7
(0.18)
mil
(mm)
Escape routing in ball field
4
(0.1)
mil
(mm)
PCB etch data and control
2x the line width (2)
mil
(mm)
3x the line width
mil
(mm)
PCB etch clocks
(1)
(2)
Line width is expected to be adjusted to achieve impedance requirements.
Three times the line spacing is recommended for all signals to help achieve the desired signal
integrity.
10.1.7.6 DLPC350 Thermal Considerations
The underlying thermal limitation for the DLPC350 controller is that the maximum operating junction temperature
(TJ) must not be exceeded (see Recommended Operating Conditions in Specifications). This temperature is
dependent on operating ambient temperature, airflow, PCB design (including the component layout density and
the amount of copper used), power dissipation of the DLPC350 controller, and power dissipation of surrounding
components. The DLPC350 package is designed to extract heat through the power and ground planes of the
PCB, thus copper content and airflow over the PCB are important factors.
10.2 Layout Example
10.2.1 Printed Circuit Board Layer Stackup Geometry
The DLPC350 PCB is targeted at six layers with layer stack up shown in Figure 14. The PCB layer stack may
vary depending on system design. However, careful attention is required to meet design considerations. Layers
one and six should consist of the components layers. Low-speed routing and power splits are allowed on these
layers. Layer two should consist of a solid ground plane. Layer five should be a split voltage plane. Layers three
and four should be used as the primary routing layers. Routing on external layers should be less than 0.25
inches for priority one and two signals. Refer to Table 17 for signal priority groups.
Board material should be FR-370HR or similar. PCB should be designed for lead-free assembly with the stackup
geometry shown in Figure 14.
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Layout Example (continued)
Figure 14. Layer Stackup
Table 20. PCB Layer Stackup Geometry
PARAMETER
DESCRIPTION
Reference plane 1
Ground plane for proper return
RECOMMENDATION
Reference plane 2
1.9-V DMD I/O power plane or ground
Er
Dielectric FR4
4.3 at 1 GHz (nominal)
H1
Signal trace distance to reference plane 1
5 mil (0.127 mm)
H2
Signal trace distance to reference plane 2
30.4 mil
10.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
The DLPC350 controller requires an external reference clock to feed its internal PLL. This reference may be
supplied via a crystal or oscillator. The DLPC350 controller accepts a reference clock of 32 MHz with a maximum
frequency variation of 100 ppm (including aging, temperature, and trim component variation). When a crystal is
used, several discrete components are also required, as shown in Figure 15.
42
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Figure 15. Recommended Crystal Oscillator Configuration
Table 21. Crystal Port Electrical Characteristics
PARAMETER
NOM
UNIT
MOSC to GND capacitance
3.9
pF
MOSCN to GND capacitance
3.8
pF
Table 22. Recommended Crystal Configuration
PARAMETER
Crystal circuit configuration
Crystal type
RECOMMENDED
UNIT
Parallel resonant
Fundamental (first harmonic)
Crystal nominal frequency
Crystal frequency tolerance (including accuracy,
temperature, aging and trim sensitivity)
Crystal equivalent series resistance (ESR)
Crystal load
Crystal shunt load
32
MHz
±100
PPM
50 max
Ω
10
pF
7 max
pF
Crystal frequency temperature stability
±30
PPM
RS drive resistor (nominal)
100
Ω
1
MΩ
Typical drive level with TCX9C3207001 crystal
(ESRmax = 30 Ω) = 160 µW. See Figure 15
pF
RFB feedback resistor (nominal)
CL1 external crystal load capacitor (MOSC)
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Table 22. Recommended Crystal Configuration (continued)
PARAMETER
CL2 external crystal load capacitor (MOSCN)
PCB layout
RECOMMENDED
UNIT
Typical drive level with TCX9C3207001 crystal
(ESRmax = 30 Ω) = 160 µW. See Figure 15
pF
A ground isolation ring around the crystal
If an external oscillator is used, then the oscillator output must drive the MOSC pin on the DLPC350 controller,
and the MOSCN pin should be left unconnected. The benefit of an oscillator is that it can be made to provide a
spread-spectrum clock that reduces EMI. Note that the DLPC350 controller can only accept 0%, ±0.5%, and
±1.0% (center-spread modulation), and a triangular waveform.
Similar to the crystal option, the oscillator input frequency is limited to 32 MHz.
It is assumed that the external crystal or oscillator stabilizes within 50 ms after stable power is applied.
10.2.3 Recommended DLPC350 PLL Layout Configuration
High-frequency decoupling is required for both 1.2-V and 1.8-V PLL supplies and should be provided as close as
possible to each of the PLL supply package pins as shown in the example layout in Figure 16. TI recommends
that decoupling capacitors be placed under the package on the opposite side of the board. High quality, lowESR, monolithic, surface mount capacitors should be used. Typically 0.1 µF for each PLL supply should be
sufficient. The length of a connecting trace increases the parasitic inductance of the mounting and thus, where
possible, there should be no trace, allowing the via to butt up against the land itself. Additionally, the connecting
trace should be made as wide as possible. Further improvement can be made by placing vias to the side of the
capacitor lands or doubling the number of vias.
The location of bulk decoupling depends on the system design. Typically, a good ceramic capacitor in the 10-µF
range is adequate.
44
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Figure 16. PLL Filter Layout
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
Figure 17 provides a legend for reading the complete device name for any DLP device.
Table 23. Package-Specific Information
PACKAGE TYPE
PACKAGE DRAWING
BODY SIZE
CONNECTOR
LCCC
FQE
9.1 mm x 20.7 mm
Panasonic AXT580124
LCCC
FQD
9.1 mm x 20.7 mm
Neoconix FBX0040CMFF6AU00
Figure 17. Device Nomenclature
11.1.2 Device Markings
The device marking consists of the fields shown in Figure 18.
Figure 18. Device Marking for FQE
46
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Figure 19. Device Marking for FQD
11.2 Documentation Support
11.2.1 Related Documentation
The following documents contain additional information related to the use of the DLP4500 device:
Table 24. Related Documents
DOCUMENT
DLPC350 Digital Controller data sheet
DLPS029
DLPC350 Software Programmer's Guide
DLPU010
Geometric Optics Application Note
DLPA044
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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24-Jan-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
DLP4500FQD
ACTIVE
LCCC
FQD
98
5
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NC-NC
DLP4500FQE
ACTIVE
LCCC
FQE
80
5
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NC-NC
Op Temp (°C)
Device Marking
(4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
8
5
6
7
3
4
C
NOTES UNLESS OTHERWISE SPECIFIED:
1 DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
2510852
DWG NO.
COPYRIGHT 2010 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED. REV
A
B
C
2 ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM ALLOWED VALUE OF 0.6 DEGREES.
SH
1
1
REVISIONS
DESCRIPTION
ECO 2104138 INITIAL RELEASE
ECO 2121955 CORRECT APERTURE X DIMENSIONS VIEW D
ECO 2144971 ADD (FQD PACKAGE) TO TITLE
DATE
01/20/2010
1/23/2012
9/11/2014
BY
J. HOLM
BMH
MAA
3 BOUNDARY MIRRORS SURROUNDING THE DMD ACTIVE ARRAY.
D
4 DMD MARKING TO APPEAR ON SYMBOLIZATION PAD.
D
5 NOTCH DIMENSIONS ARE DEFINED BY UPPERMOST LAYERS OF CERAMIC,
AS SHOWN IN SECTION A-A.
6 ENCAPSULANT TO BE CONTAINED WITHIN DIMENSIONS SHOWN IN VIEWS C
AND D (SHEET 2).
7 WHILE ONLY THE THREE DATUM A TARGET AREAS A1, A2, AND A3 ARE USED
FOR MEASUREMENT, ALL 4 CORNERS SHOULD BE CONTACTED, INCLUDING E1,
WHEN MOUNTING IN SYSTEM.
5
2X 0.800 0.100
4X R0.200 0.050
C
5
5
R0.600 0.100
(ILLUMINATION
DIRECTION)
5
90° 1.0°
+0.300
9.100 0.100
C
2X R0.400 0.100
5
3.000 0.075 5
A
+0.200
4.550 0.100
A
+0.200
2X 3.050 0.100
5
5
+0.200
5 1.000 - 0.100
+0.300
20.700 - 0.100
5
B
(1.600)
(3.000)
0.952 0.079
0.400 MIN TYP.
0 MIN TYP.
5
1
SECTION A-A
NOTCH OFFSETS
(1.000)
18.700 0.100

D
WINDOW
0.650 0.050
WINDOW APERTURE
A
(1.732)
0.038 A
0.020 D
ACTIVE ARRAY
B
2X ENCAPSULANT 6
3 SURFACES INDICATED
IN VIEW B (SHEET 2)
1.600 0.100
0.780 0.063
E
(SHEET 3)
E
(SHEET 3)
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
THIRD ANGLE
PROJECTION
NONE
0314DA
NEXT ASSY
USED ON
J. HOLM
12/11/2009
DATE
ENGINEER
TEXAS
INSTRUMENTS
12/11/2009
Dallas Texas
DRAWN
ANGLES 1
J. HOLM
2 PLACE DECIMALS 0.25
QA/CE
1 PLACE DECIMALS 0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
 0.050
P. KONRAD
CM
F. ARMSTRONG 1/20/2010
J. HALL
1/20/2010
APPROVED
8
7
6
5
4
3
2
ICD, MECHANICAL, DMD,
.45 WXGA-800 DDR SERIES 310
(FQD PACKAGE)
REV
DWG NO
SIZE
D
SCALE
APPLICATION
INV11-2006a
TITLE
1/20/2010
A
C
2510852
15:1
SHEET
1
1
OF
3
8
6
7
2X 0.812
5
3
4
DWG NO.
2510852
SH
1
2
4X (1.000)
2X 18.700
D
D
A2
A3
4X 2.250
C
1.500
1.500
B
4X (2.300)
6
C
6
7
E1
VIEW B
DATUMS A, B, C, AND E
0.812
C
18.700
A1
SCALE 15 : 1
(FROM SHEET 1)
B
1.500
6
9.400
1.500
4.700
C
6
B
B
VIEW C
ENCAPSULANT MAXIMUM X/Y DIMENSIONS
2X 0 MIN
A
SCALE 15 : 1
(FROM SHEET 1)
6
A
VIEW D
ENCAPSULANT MAXIMUM HEIGHT
SCALE 15 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
12/11/2009
SIZE
D
SCALE
2
DWG NO
REV
2510852
SHEET
1
2
OF
C
3
8
(9.855)
ACTIVE ARRAY
5.313 0.075
1.240 0.050
5
6
7
(0.188)
3
4
4X (0.108)
DWG NO.
2510852
SH
1
3
3
0.260 0.089
D
D
2
3.081 0.075
(8.640)
WINDOW
(6.1614)
ACTIVE ARRAY
7.400 0.050
6.421 0.089
1.500
1.500
F
B
C
(6.681)
APERTURE
C
0.376 0.089
C
10.074±0.089
(10.450)
APERTURE
CL
2.151 0.050
80X LGA PADS
CL
6.66 0.25
11.850 0.050
0.6000.060 X 0.6000.060
7 0.25

(18X TEST PADS)
(14.001)
WINDOW
0.100 A
K
VIEW D
WINDOW AND ACTIVE ARRAY
APERTURE DIMENSIONS TO CENTER
LINE OF ZIGZAG PATTERN
0.200 A B C
J
G
CL
B
F
7 0.25
(0.150) TYP.
1.500
9 x 0.742 = 6.678
B
E
D
1.500
(42°) TYP.
C
H
3.5 0.25
(FROM SHEET 1)
C
B
10X 3.339
B
A
(42°) TYP.
(0.068) TYP.
22
21
20
19
(18)
(5)
4
3
2
1
BACK INDEX MARK
(0.742)
(0.742)
CL
2.371
DETAIL F
APERTURE SHORT EDGES
3 x 0.742 = 2.226
SYMBOLIZATION PAD 4
15.727
3 x 0.742 = 2.226
SCALE 50 : 1
A
A
VIEW E-E
BACK SIDE METALLIZATION
(FROM SHEET 1)
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
12/11/2009
SIZE
D
SCALE
2
DWG NO
REV
2510852
SHEET
1
3
OF
C
3
8
5
6
7
3
4
C
NOTES UNLESS OTHERWISE SPECIFIED:
1 DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.
2511423
DWG NO.
COPYRIGHT 2010 TEXAS INSTRUMENTS
UN-PUBLISHED, ALL RIGHTS RESERVED. REV
A
B
C
2 ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION
TOLERANCE AND HAS A MAXIMUM ALLOWED VALUE OF 0.6 DEGREES.
SH
1
1
REVISIONS
DESCRIPTION
ECO #2109845 - INITIAL RELEASE
ECO #2121955 - CORRECT APERTURE X DIM'S IN VIEW D
ECO #2144972 - ADD (FQE PACKAGE) TO TITLE BLOCK
DATE
8/16/2010
1/23/2012
9/11/2014
BY
JLH
BMH
MAA
3 BOUNDARY MIRRORS SURROUNDING THE DMD ACTIVE ARRAY.
D
4 DMD MARKING TO APPEAR IN CONNECTOR RECESS.
D
5 NOTCH DIMENSIONS ARE DEFINED BY UPPERMOST LAYERS OF CERAMIC,
AS SHOWN IN SECTION A-A.
6 ENCAPSULANT TO BE CONTAINED WITHIN DIMENSIONS SHOWN IN VIEWS C
AND D (SHEET 2). NO ENCAPSULANT IS ALLOWED ON TOP OF THE WINDOW.
7 WHILE ONLY THE THREE DATUM A TARGET AREAS A1, A2, AND A3 ARE USED
FOR MEASUREMENT, ALL 4 CORNERS SHOULD BE CONTACTED, INCLUDING E1,
WHEN MOUNTING IN SYSTEM.
8 ENCAPSULANT NOT TO EXCEED THE HEIGHT OF THE WINDOW.
5
2X 0.800 0.100
4X R0.200 0.050
C
5
5
R0.600 0.100
(ILLUMINATION
DIRECTION)
5
90° 1.0°
+0.300
9.100 0.100
C
2X R0.400 0.100
5
3.000 0.075 5
A
+0.200
4.550 0.100
A
+0.200
2X 3.050 0.100
5
5
+0.200
5 1.000 - 0.100
+0.300
20.700 - 0.100
5
B
(1.600)
0.953 0.079
(3.000)
D
5
1
SECTION A-A
NOTCH OFFSETS

WINDOW
0.650 0.050
0.400 MIN TYP.
0 MIN TYP.
(1.000)
18.700 0.100
WINDOW APERTURE
A
(1.733)
0.038 A
0.020 D
ACTIVE ARRAY
B
2X ENCAPSULANT 6
3 SURFACES INDICATED
IN VIEW B (SHEET 2)
1.600 0.100
0.780 0.063
 0.050
(0.880)
E
(SHEET 3)
E
(SHEET 3)
(PANASONIC AXT680124DD1, 80-CONTACT
0.4 mm PITCH BOARD-TO-BOARD CONNECTOR HEADER)
MATES WITH PANASONIC AXT580124DD1 OR EQUIVALENT
CONNECTOR SOCKET
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
THIRD ANGLE
PROJECTION
NONE
0314DA
NEXT ASSY
USED ON
DRAWN
J. HOLM
ENGINEER
ANGLES 1
J. HOLM
2 PLACE DECIMALS 0.25
QA/CE
1 PLACE DECIMALS 0.50
DIMENSIONAL LIMITS APPLY BEFORE PROCESSES
INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME
Y14.5M-1994
REMOVE ALL BURRS AND SHARP EDGES
PARENTHETICAL INFORMATION FOR REFERENCE ONLY
DATE
7/14/2010
8
7
6
5
4
Dallas Texas
TITLE
CM
DWG NO
D
SCALE
3
ICD, MECHANICAL, DMD,
.45 WXGA-800 DDR SERIES 241
(FQE PACKAGE)
SIZE
APPROVED
2
A
TEXAS
INSTRUMENTS
7/14/2010
APPLICATION
INV11-2006a
7
15:1
REV
2511423
C
SHEET
1
1
OF
3
8
6
7
2X 0.812
5
3
4
DWG NO.
2511423
SH
1
2
4X (1.000)
2X 18.700
D
D
A2
A3
4X 2.250
C
1.500
1.500
B
4X (2.300)
6
C
6
7
E1
VIEW B
DATUMS A, B, C, AND E
0.812
C
18.700
A1
SCALE 15 : 1
(FROM SHEET 1)
B
1.500
6
9.400
1.500
4.700
C
6
B
B
VIEW C
ENCAPSULANT MAXIMUM X/Y DIMENSIONS
2X 0 MIN
A
SCALE 15 : 1
(FROM SHEET 1)
8
A
VIEW D
ENCAPSULANT MAXIMUM HEIGHT
SCALE 15 : 1
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
7/14/2010
SIZE
D
SCALE
2
DWG NO
REV
2511423
SHEET
1
2
OF
C
3
8
(9.855)
ACTIVE ARRAY
5.313 0.075
1.240 0.050
5
6
7
(0.188)
3
4
4X (0.108)
2511423
DWG NO.
SH
1
3
3
0.260 0.089
D
D
2
3.081 0.075
(8.640)
WINDOW
(6.1614)
ACTIVE ARRAY
7.400 0.050
(6.681)
APERTURE
6.421 0.089
1.500
1.500
F
B
C
C
C
0.376 0.089
10.074±0.089
(10.450)
APERTURE
CL
2.151 0.050
100X TEST PADS
CL
98X 0.5500.100 X 0.5500.100
11.850 0.050
APERTURE DIMENSIONS TO CENTER
LINE OF ZIGZAG PATTERN
0.200 A B C
0.100 A
4
(14.001)
WINDOW
VIEW D
WINDOW AND ACTIVE ARRAY

24 X 0.75 = 18.000
2X 0.550 0.100
(0.750)
F
0.750
E
(FROM SHEET 1)
CL
B
1.500
2X 3.075
(0.150) TYP.
(42°) TYP.
C
B
D
2X 0.930
1.500
C
40
(42°) TYP.
35
30
25
20
15
10
5
1
2X (1.860)
 0.4 A B C
B
B
A
(0.068) TYP.
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
CL
(17.800)
1.262
DETAIL F
APERTURE SHORT EDGES
 0.4 A B C
SCALE 50 : 1
A
A
VIEW E-E
TEST PADS AND CONNECTOR
(FROM SHEET 1)
TEXAS
INSTRUMENTS
Dallas Texas
INV11-2006a
8
7
6
5
4
3
DRAWN
J. HOLM
DATE
7/14/2010
SIZE
D
SCALE
2
DWG NO
REV
2511423
SHEET
1
3
OF
C
3
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