Datasheet Voltage Detector IC Series CMOS Over Voltage Detector IC BD71L4L-1series General Descriptions Key Specifications ROHM’s BD71L4L-1series is highly accurate and low current Over Voltage Detector IC. It is an N-Channel Open-Drain output type with detection voltage of 4.05V and hysteresis voltage of 30mV. It is most suitable for monitoring the charge of a lithium-ion battery. 4.05V (Typ.) ±0.8% 0.8μA (Typ.) -40°C to +85°C Package Features Detection Voltage: High Accuracy Detection Voltage: Ultra-Low Current Consumption: Operating Temperature Range: High Accuracy Detection Voltage Low Current Consumption N-Channel Open Drain Output Wide Operating Temperature Range Very Small and Low Height Package Package SSOP5 is similar to SOT-23-5 (JEDEC) SSOP5: 2.90mm x 2.80mm x 1.25mm HVSOF5: 1.60mm x 1.60mm x 0.60mm Applications All electronics equipment with lithium-ion battery All electronics equipment that needs over-voltage protection Typical Application Circuit VDD2 VDD1 RL BD71L4L-1 CIN RST Micro controller CL (Capacitor for noise filtering ） GND ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Connection Diagram SSOP5 HVSOF5 N.C. N.C. GND VDD 4 5 Marking Lot. No Marking 1 2 3 OUT SUB VDD Lot. No OUT VDD GND TOP VIEW TOP VIEW Pin Descriptions SSOP5 PIN No. Symbol Function PIN No. HVSOF5 Symbol Function 1 OUT Reset Output 1 OUT Reset Output 2 VDD Power Supply Voltage 2 SUB * Substrate 3 GND GND 4 N.C. Unconnected Terminal 3 4 VDD * VDD * Power Supply Voltage 5 N.C. Unconnected Terminal 5 GND GND Power Supply Voltage * The SUB pin(2pin) and the VDD pins(3pin, 4pin) must be wired together. Ordering Information B Part Number D x x Function 71 : Over Voltage Detector x Output logic L : Active Low www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 x x x Detection Voltage Value Package 4L : 4.05V G : SSOP5 HFV : HVSOF5 2/14 - 1 T R Packaging and forming specification Embossed tape and reel TR : The pin number 1 is the upper right : SSOP5 : HVSOF5 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Absolute Maximum Ratings Parameter Power Supply Voltage Output Voltage N-Channel Open Drain Output Output Current *1*3 SSOP5 Power *2*3 Dissipation HVSOF5 Operating Temperature Ambient Storage Temperature Symbol VDD-GND VOUT Io Limits -0.3 to +7 GND-0.3 to +7 70 0.540 0.530 -40 to +85 -55 to +125 Pd Topr Tstg Unit V V mA W °C °C *1 Reduced by 0.0054W/°C when used over 25°C. *2 Reduced by 0.0053W/°C when used over 25°C. *3 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board). Caution:Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Electrical Characteristics (Unless Otherwise Specified, Ta=0°C to 60°C, VDD=1.2V to 6.0V) Parameter Symbol Detection Voltage VDET Hysteresis Voltage ΔVDET Output Delay Time “L→H” TPLH Output Delay Time “H→L” TPHL Supply Current 1 Supply Current 2 Operating Voltage Range ‘Low’ Output Voltage(Nch) Output Leak Current IDD1 IDD2 VOPL VOL Ileak Conditions Ta=25°C RL=470kΩ VDD=L→H Ta =0°C to 60°C VDD=L→H→L, RL=470kΩ RＬ=100kΩ, CL=100pF *4 Vout＝GND→50% *5 RＬ=100kΩ, CL=100pF Vout＝VDD→50% VDD= VDET + 0.2V VDD= VDET - 0.2V VOUT 0.8V, RL=470kΩ VDD= VDET+0.2 V, ISINK=4.0mA VDD=VDS=3.8V Min 4.034 4.018 - Limit Typ 4.05 30 Max 4.066 4.083 40 - - 100 µs - - 100 µs 1.20 - 0.60 0.70 - 2.40 2.80 0.3 1.0 µA µA V V uA Unit V mV VDET ：Standard Detection Voltage（4.05V） RＬ ：Pull-up Resistor between VOUT and VDD. CＬ ：Capacitor to be connected between VOUT and GND. Designed Guarantee.(Outgoing inspection is not done on all products.) *4 TPLH：VDD＝（VDET typ. + 0.5V） to （VDET typ.- 0.5V） *5 TPHL：VDD＝（VDET typ - 0.5V） to （VDET typ.+ 0.5V） Block Diagram VDD VOUT Vref GND Figure 1. BD71L4L-1 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Typical Performance Curves 1.0 5.0 0.9 4.0 Circuit Current : IDD (µA) Detection Voltage : VDET[V] 【BD71L4LG-1】 【BD71L4L-1】 3.0 Ta=60°C 2.0 Ta=25°C 1.0 Ta=0°C 【BD71L4L-1】 0.8 0.7 Ta=60°C 0.6 0.5 0.4 Ta=0°C 0.3 Ta=25°C 0.2 0.1 0.0 0.0 1 2 3 4 5 6 7 0 1 2 3 4 5 Supply Voltage : VDD [V] Supply Voltage : VDD [V] Figure 2. Detection Voltage Figure 3. Circuit Current 6 7 1.0 110 100 90 80 70 60 50 40 30 20 10 0 Operating Voltage Range :VOPL[V] Low Output Voltage : VOL[mV] 0 【BD71L4L-1】 Ta=60°C Ta=25°C Ta=0°C 0 5 【BD71L4L-1】 0.8 Ta=0°C Ta=25°C 0.6 Ta=60°C 0.4 0.2 0.0 10 15 0.2 20 0.3 0.4 0.5 0.6 0.7 Supply Voltage:VDD [V] Isink[mA] Figure 5. Operating Voltage Range Figure 4. Low Output Voltage VDD=4.0V www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 0.8 Datasheet BD71L4L-1series Typical Performance Curves – continued 1.0 Operating Voltage Range : VOPL[V] Detection Voltage : VDET[V] 4.20 【BD71L4L-1】 4.15 High to Low(VDET) 4.10 4.05 4.00 Low to High (VDET-ΔVDET) 3.95 3.90 3.85 3.80 0 10 20 30 40 50 60 Temperature : Ta[°C] 0.9 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 10 20 30 40 50 60 Temperature : Ta[°C] Figure 7. Operating Voltage Range vs. Temperature Figure 6. Detection Voltage vs. Temperature 3.0 1.0 0.9 Circuit Current when On : IDD [µA] Circuit Current when Off : IDD [µA] 1.0 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.9 【BD71L4L-1】 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0 10 20 30 40 50 0 60 10 20 30 40 50 60 Temperature : Ta[°C] Figure 8. Supply Current 1 vs. Temperature Temperature : Ta[°C] Figure 9. Supply Current 2 vs. Temperature VDD=VDET-0.2V VDD=VDET+0.2V VDD=3.85V VDD=4.25V www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Typical Performance Curves – continued 20 Ooutput Delay Time : TPLH [µs] Output Delay Time : TPHL[µs] 40 【BD71L4L-1】 36 32 28 24 20 16 19 【BD71L4L-1】 18 17 16 15 14 13 12 11 10 12 0 10 20 30 40 50 0 60 10 Temperature : Ta[°C] 30 40 50 60 Figure 10. Output Delay Time (TPHL) Figure 11. Output Delay Time(TPLH) VDD=VDET-0.5V to VDET+0.5V VDD=VDET+0.5V to VDET-0.5V VDD=3.55V to 4.55V VDD=4.55V to 3.55V 100 100 90 【BD71L4L-1】 80 Pulse WIidth Hign : Wd[µs] Pulse Width High : Wd[µs] 20 Temperature : Ta[°C] 70 60 50 40 30 Output will not change when pulse width is lower or equal to these results. Pulse width above the results will cause the output to change. 20 10 90 【BD71L4L-1】 80 70 60 50 40 Output will not change when pulse width is lower or equal to these results. Pulse width above the results will cause the output to change. 30 20 10 0 0 0 10 20 30 40 50 60 0.8 1.2 1.6 2 2.4 2.8 VDD-LOW : VDD [V] Temperature : Ta[°C] Figure 12. Pulse Width vs. Voltage Level Figure 13. Pulse Width vs. Voltage Level VDD-LOW=1.2V, VDD-HIGH=4.2V, CIN=0.1uF VDD-HIGH=4.2V, CIN=0.1uF, Ta=25°C www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Application Information Explanation of Operation The detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the appropriate threshold voltage, the OUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical Characteristics for information on hysteresis. Because the BD71L4L-1 uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD R1 RL Vref VOUT R2 Q1 R3 GND Figure 14. Internal Block Diagram Timing Waveform Example: the following shows the relationship between the input voltages (VDD) and the output voltage (VOUT) when the input power supply voltage (VDD) swept up and down (the circuits are those in Figure .14). 1 VDD VDET VDET -ΔVDET VOPL 0V VOUT VOH tPHL tPLH VOL tPLH Figure 15. Timing Waveform www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 tPHL When the power supply is turned on, the output is unstable from after over the operating limit voltage (VOPL) until TPLH. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than TPLH. 2 When VDD is greater than VOPL but less than the reset detection voltage (VDET), the output voltages will switch to High. 3 If VDD exceeds the reset detection voltage (VDET), then VOUT switches from H to L. 4 If VDD drops below the release voltage (VDET+∆VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to H (with a delay of TPLH). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VDET). 7/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Circuit Applications 1) Examples of a common power supply detection reset circuit. VDD1 VDD2 RL BD71L4L-1 CIN R ST Micro controller CL ( capacitor is for noise filtering ） GND Figure 16. Open Drain Output Type CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection IC (VDD1). Use an open drain output type device with a load resistance RL attached as shown in Figure 16. CASE2: Power supply of the microcontroller (VDD1) is same as the power supply of the reset detection IC (VDD1). Use an open drain device with a pull up resistor between output and VDD1. This IC’s hysteresis between detection voltage and release voltage is 30mV(typ), so when the VOUT logic changes a chattering occur. CIN value needs more than 0.1uF to eliminate this. When a capacitance CL for noise filtering is connected to the OUT pin (the reset signal input terminal of the microcontroller), please take into account the rise and fall waveform of the output voltage (VOUT). The Electrical characteristics were measured using RL= 470kΩ and CL = 100pF. 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD3 VDD2 RL BD71L4L-1 BD71L4L-1 Microcontroller RST GND Figure 17 To reset the microcontroller when many independent power supplies are used in the system, OR connect to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Figure 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series 3) Examples of the power supply with resistor dividers In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 R2 I1 R1 VDD BD71L4L-1 VOUT CIN CL GND Figure 18 When an in-rush current (I1) flows into the circuit (Refer to Figure 18.) at the time when output switches from “Low” to “High”, a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to oscillation. It is same when only the R2 used. IDD In-rush Current 0 VDD VDET Figure 19. Current Consumption vs. Power Supply Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding Input Pins of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this IC www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 15. The VDD line impedance might cause oscillation because of the detection current. 16. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 17. Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 18. External Parameters The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 19. Power-on Reset Operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 20. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP5 12/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Package Name HVSOF5 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 13/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet BD71L4L-1series Revision History Date Revision 20.May.2013 001 24.July.2013 002 24.Oct.2013 003 31.Jan.2014 004 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release Modify the general description and applications on page 1 Changed VDET spec on pages 1 ~ 3 Changed IDD1 and IDD2 spec on page 3 Changed Ileak condition on page 3 Add 1 packages as following:HVSOF5 Modify the package on page 1 and the connection diagram on page 2 Add note of HVSOF5 on page 2 14/14 TSZ02201-0R7R0G300030-1-2 31.Jan.2014.Rev.004 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001