CD74AC253, CD54/74ACT253 Data sheet acquired from Harris Semiconductor SCHS247A Dual 4-Input Multiplexer, Three-State August 1998 - Revised May 2000 Features Description • Buffered Inputs The CD74AC253 and ’ACT253 dual 4-input multiplexers that utilize Advanced CMOS Logic technology. One of the four sources for each section is selected by the common Select inputs, S0 and S1. When the Output Enable (1OE or 2OE) is HIGH, the output is in the high-impedance state. • Typical Propagation Delay - 6.3ns at VCC = 5V, TA = 25oC, CL = 50pF • Exceeds 2kV ESD Protection MIL-STD-883, Method 3015 Ordering Information • SCR-Latchup-Resistant CMOS Process and Circuit Design PART NUMBER • Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption CD74AC253E TEMP. RANGE (oC) 0 to 70oC, -40 to 85, PACKAGE 16 Ld PDIP -55 to 125 • Balanced Propagation Delays CD74AC253M • AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply 0 to 70oC, -40 to 85, -55 to 125 CD54ACT253F3A • ±24mA Output Drive Current - Fanout to 15 FAST™ ICs - Drives 50Ω Transmission Lines -55 to 125 16 Ld SOIC 16 Ld CERDIP CD74ACT253E 0 to 70oC, -40 to 85, -55 to 125 16 Ld PDIP CD74ACT253M 0 to 70oC, -40 to 85, -55 to 125 16 Ld SOIC NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. Pinout CD54ACT253 (CERDIP) CD74AC253, CD74ACT253 (PDIP, SOIC) TOP VIEW 1OE 1 16 VCC S1 2 15 2OE 1I3 3 14 S0 1I2 4 13 2I3 1I1 5 12 2I2 1I0 6 11 2I1 1Y 7 10 2I0 GND 8 9 2Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FAST™ is a Trademark of Fairchild Semiconductor. Copyright © 2000, Texas Instruments Incorporated. 1 CD74AC253, CD54/74ACT253 Functional Diagram 1 1OE 6 1I0 5 1I1 7 1Y SEL/MUX 4 1I2 3 1I3 S0 S1 2I0 2I1 2I2 2I3 2OE 14 2 10 11 9 2Y SEL/MUX 12 13 GND = 8 VCC = 16 15 TRUTH TABLE SELECT INPUTS DATA INPUTS ENABLE INPUTS OUTPUT S1 S0 nI0 nI1 nI2 nI3 nOE nY X X X X X X H Z L L L X X X L L L L H X X X L H L H X L X X L L L H X H X X L H H L X X L X L L H L X X H X L H H H X X X L L L H H X X X H L H Select inputs S1 and S0 are common to both sections. H = High level, L = Low inputs, X = Don’t care, Z = High impedance. 2 CD74AC253, CD54/74ACT253 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA Thermal Resistance (Typical, Note 5) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4) AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. For up to 4 outputs per device, add ±25mA for each additional output. 4. Unless otherwise specified, all voltages are referenced to ground. 5. θJA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VIH - - 1.5 1.2 - 1.2 - 1.2 - V 3 2.1 - 2.1 - 2.1 - V 5.5 3.85 - 3.85 - 3.85 - V 1.5 - 0.3 - 0.3 - 0.3 V 3 - 0.9 - 0.9 - 0.9 V 5.5 - 1.65 - 1.65 - 1.65 V 1.5 1.4 - 1.4 - 1.4 - V AC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage VIL VOH - VIH or VIL - -0.05 -0.05 3 2.9 - 2.9 - 2.9 - V -0.05 4.5 4.4 - 4.4 - 4.4 - V -4 3 2.58 - 2.48 - 2.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 3 CD74AC253, CD54/74ACT253 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Low Level Output Voltage -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V 0.05 3 - 0.1 - 0.1 - 0.1 V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 12 3 - 0.36 - 0.44 - 0.5 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V Input Leakage Current II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 V High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V ACT TYPES Low Level Output Voltage VOL VIH or VIL II VCC or GND - 5.5 - ±0.1 - ±1 - ±1 µA Three-State or Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - ±0.5 - ±5 - ±10 µA Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 mA Input Leakage Current Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load NOTES: 6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC. 4 CD74AC253, CD54/74ACT253 ACT Input Load Table INPUT UNIT LOAD S0, S1, nI0, nI1 1 nOE 0.83 NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications Table, e.g., 2.4mA max at 25oC. Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) -40oC TO 85oC PARAMETER -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS tPLH, tPHL 1.5 - - 227 - - 250 ns 3.3 (Note 9) 7.2 - 25 7 - 28 ns 5 (Note 10) 5.2 - 18.2 5 - 20 ns 1.5 - - 151 - - 166 ns 3.3 4.8 - 16.9 4.7 - 18.6 ns 5 3.4 - 12.1 3.3 - 13.3 ns 1.5 - - 131 - - 144 ns 3.3 4.5 - 15.7 4.3 - 17.3 ns 5 3 - 10.5 2.9 - 11.5 ns AC TYPES Propagation Delay, S0, S1, to Y Propagation Delay, nI to Y Propagation Delay, Output Enable, Output Disable to Y tPLH, tPHL tPLZ, tPHZ, tPZL, tPZH Three-State Output Capacitance CO - - - 15 - - 15 pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 107 - - 107 - pF Propagation Delay, S0, S1, to Y tPLH, tPHL 5 (Note 10) 5.7 - 20 5.5 - 22 ns Propagation Delay, nI to Y tPLH, tPHL 5 4.6 - 16.4 4.5 - 18 ns Propagation Delay, Output Enable, Output Disable to Y tPLZ, tPHZ, tPZL, tPZH 5 3.2 - 11.5 3.2 - 12.6 ns Three-State Output Capacitance CO - - - 15 - - 15 pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 107 - - 107 - pF Power Dissipation Capacitance ACT TYPES Power Dissipation Capacitance NOTES: 8. Limits tested 100%. 9. 3.3V Min is at 3.6V, Max is at 3V. 10. 5V Min is at 5.5V, Max is at 4.5V. 11. CPD is used to determine the dynamic power consumption per multiplexer. AC: PD = VCC2 fi (CPD + CL) ACT: PD = VCC2 fi (CPD + CL) + VCC ∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage. 5 CD74AC253, CD54/74ACT253 tr = 3ns tf = 3ns INPUT LEVEL 90% OUTPUT DISABLE VS 10% GND tPZL tPLZ VS 0.2VCC OUTPUT: LOW TO OFF TO LOW tPHZ tPZH VOH (≠ VCC) 0.8 VCC VS OUTPUT: HIGH TO OFF TO HIGH OUTPUTS ENABLED OTHER INPUTS (TIED HIGH OR LOW) OUTPUTS DISABLED OUTPUT DISABLE OUTPUTS ENABLED GND (tPHZ, tPZH) OPEN (tPHL, tPLH) 2 VCC (tPLZ, tPZL) (OPEN DRAIN) 500Ω† RL DUT WITH THREESTATE OUTPUT VOL (≠ GND) OUT 500Ω† RL CL 50pF †FOR AC SERIES ONLY: WHEN VCC = 1.5V, RL = 1kΩ FIGURE 1. THREE-STATE PROPAGATION DELAY WAVEFORMS AND TEST CIRCUIT tr = 3ns tf = 3ns INPUT LEVEL 90% VS 10% I OR S VS OUTPUT Y tPLH tPHL FIGURE 2. PROPAGATION DELAY TIMES OUTPUT RL (NOTE) 500Ω DUT OUTPUT LOAD CL 50pF NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ. AC ACT VCC 3V Input Switching Voltage, VS 0.5 VCC 1.5V Output Switching Voltage, VS 0.5 VCC 0.5 VCC Input Level FIGURE 3. PROPAGATION DELAY TIMES 6 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) CD54ACT253F3A ACTIVE CDIP J 16 1 TBD A42 SNPB CD74AC253M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC253M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC253M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC253M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC253ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC253MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT253EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT253M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT253MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC253M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT253M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC253M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT253M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated