CMPWR025 Dual Input SmartORt Power Switch Product Description The SmartORt CMPWR025 is a dual input power switch that selects between two different power inputs and delivers it to one output. The device integrates two very low impedance power switches and automatically implements an OR function that selects the higher of the two inputs. Hysteresis is built in (and is user selectable) to prevent switch chatter. The CMPWR025 is a much−improved solution over simply ORing two diodes, due to the greatly reduced losses of the CMPWR025 when compared to low forward drop Schottky diodes. The CMPWR025 is designed to operate above the 1 W (375 mA at 3.3 V) sleep mode rating stated in the PCI Rev 2.2 spec. In fact the CMPWR025 current rating is dependent upon the power dissipation resulting from the voltage drop across the internal switch elements. See the Typical DC Characteristics section in this data sheet for details. For IAPC (Instantly Available Personal Computer) applications see ON Semiconductor Application Note “Instantly Available PCI Card Power Management”. The CMPWR025 is housed in a 8−lead MSOP package and is available with RoHS compliant lead−free finishing. http://onsemi.com MSOP 8 R SUFFIX CASE 846AD MARKING DIAGRAM R025 R025 = CMPWR025R Features Implements Logical “Input VCC1 OR Input VCC2” Integrated Low Impedance Switches (0.2 W TYP) Operating Supply Range from 2.8 V to 5.5 V Provides Up to 600 mA Output Current Glitch−Free Output During Supply Switching Transitions Low Operating Supply Current of 20 mA (TYP) User−Selectable Hysteresis for Supply Selection 8−Pin MSOP Package These Devices are Pb−Free and are RoHS Compliant ORDERING INFORMATION Device Package Shipping† CMPWR025R MSOP 8 (Pb−Free) 4000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Applications PCI Cards for Wake−On−LAN/Wake−On−Ring Dual Power Systems Systems with Standby Capabilities Battery Backup Systems See also Application Note AP−211 USB Enabled Mobile Electronics such as MP3 Players, PDAs, Digital Cameras and Wireless Handsets Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 4 1 Publication Order Number: CMPWR025/D CMPWR025 TYPICAL APPLICATION CIRCUIT SIMPLIFIED ELECTRICAL SCHEMATIC SW1 0.2 W CMPWR025 VCC1 VCC1 5V− VOUT VCC2 + VCC2 + 5V − HYS GND VCC1 VOUT + + COUT 10 mF - SW2 0.2 W VOUT VCC2 GND HYS GND PACKAGE / PINOUT DIAGRAM Top View 1 8 HYS VCC1 2 7 VOUT VCC2 3 6 VOUT VCC2 4 5 GND R025 VCC1 8−Pin MSOP CMPWR025R Table 1. PIN DESCRIPTIONS Pin(s) Name Description 1, 2 VCC1 VCC1 is the primary power source, which is given priority when present. If pin 8 (HYS) is unconnected, then the hysteresis level is 75 mV (typ.). Whenever the primary power source drops below the secondary supply VCC2 by more than 125 mV, it will immediately become deselected. When the primary power source is restored to within 50 mV of the secondary supply, the primary power source will once again be selected and provide all the output current. When VCC1 is selected, it will supply all the internal current requirements which are typically 20 mA. When VCC1 is not selected, there will be no current loading on this input. Pins 1 & 2 must be connected together externally. 3, 4 VCC2 VCC2 is the secondary power source and is selected when the primary source has fallen below it by more than 125 mV (or 200 mV if pin 8 is grounded). The secondary source will be deselected immediately once the primary source is restored to within 50 mV of VCC2. When VCC2 is selected, it will supply all the internal current requirements which are typically 20 mA. When VCC2 is not selected, there will be no current loading on this input. Pins 3 & 4 must be connected together externally. 5 GND Negative reference for all voltages. 6, 7 VOUT Positive voltage output switched from VCC1 or VCC2 inputs. During normal operation the impedance from VOUT to the selected supply is typically less than 0.28 W, which results in minimal voltage loss from input to output. During the cold−start interval when both inputs are initially applied, the internal circuitry provides a soft turn−on for the switches, which limits peak in−rush current. Pins 6 & 7 must be connected together externally. 8 HYS HYS is the user−selectable hysteresis input. The hysteresis level is set to 150 mV when pin 8 is grounded. The default hysteresis level is set to 75 mV by leaving pin 8 unconnected. Using 150 mV hysteresis is recommended, especially in environments with noisy power supplies, high power supply resistances or high load currents. If the hysteresis level is set to 150 mV, the primary supply VCC1 must now fall 200 mV below the secondary supply VCC2 before it becomes deselected. http://onsemi.com 2 CMPWR025 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter ESD Protection (HBM) Pin Voltages VCC1 VCC2 Rating Units 2000 V V [GND − 0.5] to [+6.0] [GND − 0.5] to [+6.0] Maximum DC Output Current 750 mA Storage Temperature Range −65 to +150 C Operating Temperature Range Ambient Junction −20 to +70 −20 to +125 Power Dissipation C 0.3 W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Rating Units VCC1 and VCC2 Input Voltage 2.8 to 5.5 V Ambient Operating Temperature 0 to +70 C ILOAD 0 to 600 mA Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units VCCDES1 VCC1 Deselect VCC1 Deselect Level below VCC2; HYS Input (Pin 8) Floating 50 125 200 mV VCCDES2 VCC2 Deselect 2 VCC1 Deselect Level below VCC2; HYS Input (Pin 8) Grounded 90 200 300 mV VCC1SEL VCC1 Select Preference 10 50 100 mV 40 80 75 150 100 200 VHYS1 VHYS2 Hysteresis VCC1SEL−VCC1DES VCC1SEL−VCC1DES HYS Input (Pin 8) Floating (Note 2) HYS Input (Pin 8) Grounded (Note 2) mV tDL tDH Switching Delay VCC1,2 Falltime < 100 ns (Note 3) VCC1,2 Risetime < 100 ns (Note 3) 200 200 RSW Switch Resistance ILOAD = 0 to 600 mA; VCC1,2 = 2.8 V ILOAD = 0 to 600 mA; VCC1,2 = 5.0 V 0.28 0.21 0.4 0.3 W VSW Voltage Drop Across Switch (VCC1,2 − VOUT) IOUT = 100 mA; VCC1,2 = 2.8 V IOUT = 200 mA; VCC1,2 = 2.8 V IOUT = 600 mA; VCC1,2 = 2.8 V IOUT = 100 mA; VCC1,2 = 5.0 V IOUT = 200 mA; VCC1,2 = 5.0 V IOUT = 600 mA; VCC1,2 = 5.0 V 28 56 168 21 42 125 40 80 240 30 60 180 mV IRCC1 IRCC2 Reverse Leakage VCC1 = 0 V; VCC2 = 5.0 V VCC1 = 5.0 V; VCC2 = 0 V 100 100 mA Supply Current When Selected (IOUT = 0) When NOT Selected 20 1 Ground Pin Current VCC1 = VCC2 = 5.0 V; ILOAD = 0 mA to 600 mA 20 ICC1, ICC2 IGND ns mA 50 mA 1. Operating Characteristics are over Standard Operating Conditions unless otherwise specified. 2. Hysteresis level defines the maximum level of acceptable noise on VCC during switching. Excessive parasitic inductance on VCC board traces to the CMPWR025 may require an input capacitor to adequately filter the supply noise to below the hysteresis level. This will ensure that precise switching occurs between VCC1 and VCC2 supply inputs. 3. This is the time, after the select/deselect threshold is reached, for the switches to react. http://onsemi.com 3 CMPWR025 SELECTION THRESHOLD DIAGRAMS Figure 1. Supply Threshold Diagram (Hysteresis Input Pin Floating, See Typical Application Circuit, Page 2) Figure 2. Supply Threshold Diagram (Hysteresis Input Tied to Ground, See Typical Application Circuit, Page 2) http://onsemi.com 4 CMPWR025 CMPWR025 TYPICAL DC CHARACTERISTICS The Switch Resistance vs. Temperature curve shown in Figure 3 illustrates the switch resistance measured at 600 mA load with VCC equal to 3.3 V and 5 V. The resistance is shown at a temperatures range of −40C to 70C. When the temperature rises from 25 to 70C, the switch resistance increases by about 20%. Figure 5. Hysteresis Voltage vs. Temperature Power Dissipation and Output Current Considerations The CMPWR025 is supplied in an MSOP package which has a maximum power dissipation rating of 0.3 W. It is important that the heat generated within the part does not exceed this rating. The heat generated by the load current is given by: P DISS + V SW I LOAD or P DISS + R SW (I LOAD) 2 Figure 3. Switch Resistance vs. VCC with Temperature The Supply Current vs. Temperature curve shown in Figure 4 illustrates the internal supply current with VCC equal to 3.3 V and 5 V. This current is drawn from the selected VCC input, and is dissipated through the ground pin (pin 5). This current is independent of load current. At a typical load of 375 mA the PDISS is just 0.4 (0.375) 2 + 56mW A primary consideration is Maximum Junction Temperature, TJ(max), which can be calculated using the following formula: T J(max) + T A ) q JA P DISS Where: TA = The Ambient Temperature qJA = Thermal Resistance = 100 C/W PDISS = Power Dissipation In the above example operating at an ambient of 70C, TJ(max) would be: T J(max) + 70° C ) (0.056W)(100° CńW) + 75.6° C Maximum power dissipation, including the power from the other circuitry within the device, suggests a current rating of approximately: Figure 4. Supply Current vs. Temperature ǸP The Hysteresis Voltage vs. Temperature curve shown in Figure 5 illustrates how the hysteresis voltages vary with temperature. ‘VHYS1’ is the hysteresis value if pin 8 is left unconnected, ‘VHYS2’ is the hysteresis value if pin 8 is connected to ground. ‘VCC1sel’ is the voltage below VCC2 at which Vcc1 will be selected (refer to selection threshold diagrams on page 4). These three voltages are independent of the VCC operating voltage. * P INT + I LOAD R SW DISS Ǹ0.3W *0.4100mW + 865mA Note that this is beyond the maximum current rating of the device, which is 750 mA maximum. http://onsemi.com 5 CMPWR025 Important note: The power supply source impedance must be as low as possible to avoid chatter during power transition. When operating in a high load and long rise time power−up condition, we recommend not exceeding a value of 0.15 W on both source resistances. Typical Transient Characteristics The circuit schematic in Figure 6 below shows the transient characterization test setup. It includes the power supply source impedances RS1 and RS2, which represent the power supplies’ output impedances and interconnection parasitics to the VCC1 and VCC2 input pins. In this test set−up, the series resistances on VCC1 and VCC2 are respectively RS1 = 0.16 W, and RS2 = 0.06 W, unless specified otherwise. A load resistance RL of 11 W is used, setting a load current of about 450 mA at 5 V. The hysteresis level is increased by connecting pin 8 to ground, which will improve the transient performance in noisy environments. In the transient analysis, the rise time and fall time of VCC1 is very long, in the 20 msec range, providing a worst case situation. V HYS u I(R S ) R T) Where: VHYS = The Minimum Hysteresis Voltage = 80 mV RS = The Power Supply Output Impedance RT = The PCB Trace Impedance For a rated load of 600 mA, RS + RT < 0.15 W. RS1 VCC1 5V TR=20ms TF=20ms C1 + C2 0.1 mF 10 mF GND CMPWR025 VCC1 RS2 +V CC2 −5V VOUT VCC2 C3 + 0.1 mF C4 HYS GND VOUT C5 10 mF 0.1 mF + C6 10 mF Load 11 W GND Figure 6. Transient Characterization Test Set−Up Input and Output Capacitors VOUT provides the power for the load. To ensure the output is glitch−free during dynamic switching of the inputs, it is recommended that an external capacitor of 10 mF or greater is included. This will restrict any transient output disturbances to less than 300 mV at 600 mA loading during dynamic switching of the inputs. The test set−up used in Figure 7 and Figure 8 is described on page 5. The set−up for Figure 9 has larger series resistances on VCC1 and VCC2. VCC1 Rising from 0 V to 5 V/(VCC2 = 5 V). Figure 7 shows the primary supply VCC1 becoming selected during a 0 V to 5 V transition. The secondary supply VCC2 is set to 5 V DC. The channel 1 switch is turned on when VCC1 rises to within about 70 mV of VCC2. VCC1 drops when it is selected due to power supply source resistance RS1. A positive glitch appears on VCC2 when channel 2 switch is Filtering is typically unnecessary on the inputs, however power supply source impedance and parasitic resistance or inductance on the interconnections may result in chattering during the supply changeover. When an input is deselected and the input current drops to zero, the voltage at the input terminals will rise. If this voltage rise exceeds the hysteresis (75 mV typical), the switch may chatter. There are four ways to eliminate this chatter: 1. Connect pin 8 to GND to select 150 mV hysteresis, 2. position the device as close as possible to the power supply connectors, 3. use low−impedance PCB traces, or 4. include low−ESR input bypass capacitors at the VCC1 and VCC2 input pins. Capacitors of 10ĂmF or greater are recommended. http://onsemi.com 6 CMPWR025 VCC1 Rising (VCC2 = 5 V). Figure 9 is a bad test set−up that shows what may happen if either power supply source resistance RS1 or RS2 is too large. In this example, RS2 is increased to 0.3 W. turned off, due to power supply inductance. This has no effect on the output voltage. Figure 7. VCC1 Rising form 0 V to 5 V, VCC2 = 5 V. Ch1 and Ch2: VCC1 and VCC2, offset = 5 V. Ch3: VOUT, offset = 5 V. Figure 9. VCC1 Rising (VCC2@ = 5 V). Ch1 and Ch2: VCC1 and VCC2@, offset = 5 V. Ch3: VOUT, offset = 3.3 V. VCC1 Falling from 5 V to 0 V (VCC2 = 5 V). Figure 8 shows the primary supply VCC1 becoming deselected during a 5 V to 0 V transition. The test conditions are the same as in Figure 7. Channel 2 switch is turned on as soon as VCC2 and VCC1 are about 200 mV. A negative glitch appears on VCC2, when channel 2 is turned on. This has no effect on the output voltage. The oscillation during the power transition is caused by the cumulative voltage change across RS1 and RS2 being greater than the hysteresis. The behavior is exacerbated by: a high load current, too many parasitics on power lines, and noisy power sources. To avoid such behavior, the solution is to reduce the load or parasitic capacitance on power supply and layout, or use a more stable power supply. Parallel Operation Two CMPWR025 devices may be symmetrically ganged in parallel to increase total current capacity. Careful attention must be paid to minimizing series resistance and PCB parasitics during layout, both between the dual CMPWR025’s inputs and also between the supplies and the devices, as described above. In a well designed layout, a pair of CMPWR025’s can provide an output approaching twice that of a single device. See Application Note AP−211 for more information. Figure 8. VCC1 Falling form 0 V to 5 V (VCC2 = 5 V). Ch1 and Ch2: VCC1 and VCC2, offset = 5 V. Ch3: VOUT, offset = 5 V. http://onsemi.com 7 CMPWR025 PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O MIN NOM A1 0.05 0.10 0.15 A2 0.75 0.85 0.95 b 0.22 0.38 c 0.13 0.23 D 2.90 3.00 3.10 E 4.80 4.90 5.00 E1 2.90 3.00 3.10 SYMBOL MAX 1.10 A E E1 0.65 BSC e L 0.60 0.40 0.80 L1 0.95 REF L2 0.25 BSC θ 0º 6º TOP VIEW D A DETAIL A A2 A1 END VIEW c e b q SIDE VIEW L2 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. L1 DETAIL A SmartOR is a trademark of Semiconductor Components Industries, LCC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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