Microchip DSC2311KE1-R0002T Crystal-lessâ ¢ configurable two-output clock generator Datasheet

DSC2311
Crystal-less™ Configurable Two-Output Clock Generator
Features
General Description
• Two Simultaneous CMOS Outputs
- Output 1 Range: 2.3 MHz to 170 MHz
- Output 2 Range: 2.3 MHz to 170 MHz
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive: –40°C to +125°C
- Ext. Industrial –40°C to +105°C
- Industrial –40°C to +85°C
- Ext. Commercial –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• High Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x higher MTBF than crystal-based clock
generator designs
• Supply Range of 2.25V to 3.6V
• Lead Free and RoHS-Compliant
The DSC2311 is a crystal-less™ clock generator that is
factory-configurable to simultaneously output two
separate frequencies from 2.3 MHz to 170 MHz. The
clock generator uses proven silicon MEMS technology
to provide low jitter and high frequency stability across
a wide range of supply voltages and temperatures. By
eliminating the external quartz crystal, crystal-less
clock generators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
consumer electronics, communications, and storage
applications.
DSC2311 has an Output Enable/Disable feature that
allows it to disable the outputs when OE is low. The
device is available in a space-saving 6-pin 2.5 mm x
2.0 mm crystal-less VDFN package that uses only a
single external bypass capacitor. This requires a PCB
footprint equivalent to that of a 1.0 mm x 1.0 mm
crystal-based clock generator.
Applications
•
•
•
•
•
Consumer Electronics
Camera and Imaging Modules
Home Automation
Industrial and Power Conversion
Mobile Communications, Internet, and Sensor
Devices
• Solid State, Hard Drive, and Flash Drive Storage
Block Diagram
Control Circuitry
MEMS
OE
 2016 Microchip Technology Inc.
PLL
Output
Control
and
Divider
FOUT1
FOUT2
DS20005611A-page 1
DSC2311
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .......................................................................................................................................–0.3V to VDD+0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.6
V
Supply Current (Note 2)
IDD
—
21
23
mA
EN pin low. All outputs
disabled.
—
—
±25
—
—
±50
ppm
Includes frequency
variations due to initial
tolerance, temperature, and
power supply voltage.
One year at +25°C
—
Frequency Stability (Note 3)
∆f
Aging
∆f
—
—
±5
ppm
Start-up Time (Note 4)
tSU
—
—
5
ms
VIH
0.75 x VDD
—
—
VIL
—
—
0.25 x VDD
Output Disable Time
tDA
—
—
5
ns
—
Output Enable Time
tEN
—
—
20
ns
—
Pull-Up Resistor (Note 2)
—
—
40
—
kΩ
Pull-up exists on all digital
IO
VOH
0.9 x VDD
—
—
VOL
—
—
0.1 x VDD
tR
—
1.1
2.0
Input Logic Levels
Output Logic Levels
tF
Note 1:
2:
3:
4:
5:
V
ns
Output Transition Time
Frequency
V
f0
T = +25°C
Input logic high
Input logic low
Output logic high, I = ±6 mA
Output logic low, I = ±6 mA
Rise time. 20% to 80%;
CL = 15 pF
—
1.4
2.0
Fall time. 20% to 80%;
CL = 15 pF
2.3
—
170
Commercial/Industrial temp.
range
3.3
—
100
3.3
—
170
MHz
Automotive temp. range
Extended Industrial temp.
range
Pin 4 VDD should be filtered with a 0.01 µF capacitor.
Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
For other ppm stabilities, please contact the factory.
tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
Period jitter includes crosstalk from adjacent output.
DS20005611A-page 2
 2016 Microchip Technology Inc.
DSC2311
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters
Sym.
Min.
Typ.
Max.
Units
Output Duty Cycle
SYM
45
—
55
%
Period Jitter (Note 5)
JPER
—
3
—
psRMS
—
0.3
—
—
0.38
—
—
1.7
2
Integrated Phase Noise
Note 1:
2:
3:
4:
5:
JCC
Conditions
—
FO1 = FO2 = 25 MHz
200 kHz to 20 MHz @
25 MHz
psRMS
100 kHz to 20 MHz @
25 MHz
12 kHz to 20 MHz @
25 MHz
Pin 4 VDD should be filtered with a 0.01 µF capacitor.
Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
For other ppm stabilities, please contact the factory.
tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
Period jitter includes crosstalk from adjacent output.
 2016 Microchip Technology Inc.
DS20005611A-page 3
DSC2311
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TA
–20
—
+70
°C
Ordering Option E
TA
–40
—
+85
°C
Ordering Option I
TA
–40
—
+105
°C
Ordering Option L
Temperature Ranges
Operating Temperature Range (T)
TA
–40
—
+125
°C
Ordering Option M
Junction Temperature
TJ
—
—
+150
°C
—
Storage Temperature Range
TS
–40
—
+150
°C
—
Soldering Temperature Range
—
—
—
+260
°C
40 sec. max.
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005611A-page 4
 2016 Microchip Technology Inc.
DSC2311
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
ENABLE
Description
Output Enable for both CLK0 and CLK1.
2
N/C
3
GROUND
4
CLK0
5
CLK1
Clock Output 1 (CMOS).
6
VDD
Supply Voltage.
 2016 Microchip Technology Inc.
Do not connect.
Ground.
Clock Output 0 (CMOS).
DS20005611A-page 5
DSC2311
3.0
OUTPUT WAVEFORM
tR
tF
VOH
Output
VOL
tEN
1/fo
tDA
VIH
Enable
FIGURE 3-1:
DS20005611A-page 6
VIL
OE Function and Output Waveform: LVCMOS.
 2016 Microchip Technology Inc.
DSC2311
4.0
CURRENT CONSUMPTION
Total Current = Disabled Current + ∆IDD FOUT1 + ∆IDD FOUT2
18
16
14
ΔIDD (mA)
12
10
3 pF
8
5 pF
10 pF
6
15 pF
4
2
0
0
20
40
60
80
100
120
140
FOUT (MHz)
FIGURE 4-1:
∆IDD / Output vs. Frequency and Load @ 3.3V VDD
 2016 Microchip Technology Inc.
DS20005611A-page 7
DSC2311
SOLDER REFLOW PROFILE
.
5.0
EC
.M
AX
3°
C/
S
60-150
SECONDS
AX
M
C.
3°
C/
SE
REFLOW
PRE-HEAT
.
60-180
SECONDS
AX
150°C
M
C.
.
217°C
200°C
/SE
6°C
TEMPERATURE (°C)
260°C
20-40
SECONDS
COOL
25°C
8 MINUTES MAX.
TIME
6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
Time within 5°C of Actual Peak
3°C/sec. max.
60-180 sec.
60-150 sec.
255°C to 260°C
20-40 sec.
Ramp-Down Rate
6°C/sec. max.
Time 25°C to Peak Temperature
8 minutes max.
DS20005611A-page 8
 2016 Microchip Technology Inc.
DSC2311
6.0
PACKAGE MARKING INFORMATION
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
C
A
A1
SEATING
PLANE
6X
0.08 C
SIDE VIEW
2X b2
1
2
L2
5X L1
N
4X b1
0.10
0.05
e
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1005A Sheet 1 of 2
 2016 Microchip Technology Inc.
DS20005611A-page 9
DSC2311
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
Overall Length
D
Overall Width
E
b1
Terminal Width
Terminal Width
b2
Terminal Length
L1
Terminal Length
L2
MILLIMETERS
MAX
NOM
6
0.825 BSC
0.80
0.90
0.85
0.05
0.02
0.00
2.50 BSC
2.00 BSC
0.60
0.70
0.65
0.20
0.25
0.30
0.60
0.70
0.80
0.665
0.865
0.765
MIN
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1005A Sheet 2 of 2
DS20005611A-page 10
 2016 Microchip Technology Inc.
DSC2311
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
2
1
Y
G2 C
6
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Width (X4)
X1
Contact Pad Width (X2)
X2
Contact Pad Length (X6)
Y
Contact Pad Spacing
C
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
MIN
MILLIMETERS
NOM
0.825 BSC
MAX
0.65
0.25
0.85
1.45
0.38
0.60
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3005A
 2016 Microchip Technology Inc.
DS20005611A-page 11
DSC2311
NOTES:
DS20005611A-page 12
 2016 Microchip Technology Inc.
DSC2311
APPENDIX A:
REVISION HISTORY
Revision A (September 2016)
• Converted Micrel data sheet DSC2311 to Microchip DS20005611A.
• Minor text changes throughout.
• Package name updated to VDFN.
 2016 Microchip Technology Inc.
DS20005611A-page 13
DSC2311
NOTES:
DS20005611A-page 14
 2016 Microchip Technology Inc.
DSC2311
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
X
X
X
X
-Rxxxx
Examples:
a)
DSC2311KE1-RxxxxT: Crystal-less Configurable
Package Temperature Stability Frequency Package
Range
Device:
DSC2311:
Package:
K
=
6-LEAD 2.5 mm x 2.0 mm VDFN
Temperature
Range:
E
I
L
M
=
=
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
–40C to +105C (Extended Industrial)
–40C to +125C (Automotive)
Stability:
1
2
=
=
±50 ppm
±25 ppm
Frequency:
Rxxxx
Packing Option:
Blank
T
Two-Output Clock Generator, 6-LD VDFN, Extended
Commercial Temp. Range,
±50 ppm Stability, Custom
Frequency (FOUT1 and
FOUT2), Tape & Reel
Crystal-less Configurable Two-Output Clock
Generator
b)
=
=
=
DSC2311KM2-Rxxxx:
Crystal-less Configurable
Two-Output Clock Generator, 6-LD VDFN, Automotive
Temp. Range, ±25 ppm Stability, Custom Frequency
(FOUT1 and FOUT2), Tube
Custom Frequency Code
Tube
Tape & Reel
Output Clock Frequencies
Output frequencies are factory-configured to individual customer
and product requirements, subject to output control and divider limitations. Contact sales with your custom frequency needs.
Frequency Code
FOUT1 (MHz)
FOUT2 (MHz)
R0001
127
127
R0002
25
125
 2016 Microchip Technology Inc.
DS20005611A-page 15
DSC2311
NOTES:
DS20005611A-page 16
 2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
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QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2016 Microchip Technology Inc.
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ISBN: 978-1-5224-0986-1
DS20005611A-page 17
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06/23/16
DS20005611A-page 18
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