Shindengen D25XB20 General purpose rectifiers(200v 25a) Datasheet

SHINDENGEN
General Purpose Rectifiers
SIL Bridges
OUTLINE DIMENSIONS
D25XB20
Case : 5S
Unit : mm
200V 25A
FEATURES
● Thin Single In-Line Package
● High current capacity with Small Package
● High IFSM
● Superior Thermal Conductivity
APPLICATION
● Switching power supply
● Home Appliances, Office Equipment
● Factory Automation, Inverter
RATINGS
●Absolute Maximum Ratings (If not specified Tc=25℃)
Item
Symbol
Conditions
Storage Temperature
Tstg
Operating Junction Temperature
Tj
VRM
Maximum Reverse Voltage
IO
Average Rectified Forward Current
50Hz sine wave, R-load With heatsink
Peak Surge Forward Current
Current Squared Time
Dielectric Strength
Mounting Torque
IFSM
I2 t
Vdis
TOR
Tc=98℃
50Hz sine wave, R-load Without heatsink Ta=25℃
50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25℃
1ms≦t<10ms Tj=25℃
Terminals to case, AC 1 minute
(Recommended torque:0.5N・m)
●Electrical Characteristics (If not specified Tc=25℃)
Item
Symbol
Conditions
VF
Forward Voltage
IF=12.5A, Pulse measurement, Rating of per diode
IR
VR=VRM, Pulse measurement, Rating of per diode
Reverse Current
θjc junction to case
With heatsink
Thermal Resistance
θjl junction to lead
Without heatsink
θja junction to ambient Without heatsink
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
Ratings
-40〜150
150
200
25
3.5
350
300
2.5
0.8
Unit
℃
℃
V
A
Ratings
Max.1.05
Max.10
Max.1.0
Max.5
Max.22
Unit
V
μA
A
A 2s
kV
N・m
℃/W
D25XBx
Forward Voltage
100
Forward Current IF [A]
10
Tc=150°C [TYP]
Tc=25°C [TYP]
1
Pulse measurement per diode
0.1
0
0.2
0.4
0.6
0.8
1
Forward Voltage VF [V]
1.2
1.4
1.6
D25XBx
Forward Power Dissipation
80
Forward Power Dissipation PF [W]
70
SIN
60
50
40
30
20
10
0
0
5
10
15
20
25
Average Rectified Forward Current IO [A]
Tj = 150°C
Sine wave
30
D25XBx
Derating Curve
35
Average Rectified Forward Current IO [A]
Heatsink
Tc
Tc
30
SIN
25
20
15
10
5
0
80
90
100
110
120
130
140
Case Temperature Tc [°C]
Sine wave
R-load
with heatsink
150
160
D25XBx
Derating Curve
Average Rectified Forward Current IO [A]
5
PCB
4
SIN
Glass-epoxy substrate
Soldering land 5mmφ
3
2
1
0
0
20
40
60
80
100
120
Ambient Temperature Ta [°C]
Sine wave
R-load
Free in air
140
160
D25XBx
Peak Surge Forward Capability
IFSM
400
10ms 10ms
Peak Surge Forward Current IFSM [A]
350
1 cycle
non-repetitive,
sine wave,
Tj=25°C before
surge current is applied
300
250
200
150
100
50
0
1
2
5
10
20
Number of Cycles [cycles]
50
100
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