CPC1726 Single-Pole, Normally Open DC Power SIP Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 1 0.75 Description Units VP ADC IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. As part of that family, the CPC1726 is a normally open (1-Form-A) solid state relay. The CPC1726 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. Features • • • • • • • • Handle Load Currents Up to 1ADC 2500Vrms Input/Output Isolation Power SIP Package High Reliability Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V-0 The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capabilities makes the relay suitable for a variety of high performance switching applications. Applications • • • • • • • • • • • • Approvals Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) IC Equipment Home Appliances • UL 508 Certified Component: File E69938 • CSA Certified Component: Certificate 1172007 Ordering Information Part # CPC1726Y Description 4-Pin (8-Pin Body) Power SIP Package (25 per tube) Pin Configuration Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1726-R04 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1726 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 250 5 50 1 150 1600 2500 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 3.33 mW / ºC Derate linearly 16.667 mW / ºC 2 Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current, Continuous Peak Load Current On-Resistance1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input to Output 1 Conditions Symbol Min Typ Max Units Free air t=10ms IL=1A VL=250VP IL ILPK RON ILEAK - 0.64 - 1 3 0.75 1 ADC A µA IF=0mA, VL=50V, f=1MHz ton toff COFF - 0.67 0.04 60 5 2 - IL=1A IF=5mA VR=5V IF IF VF IR 0.6 0.9 - 1.8 1.2 - 10 1.4 10 mA mA V µA VIO=0V, f=1MHz CIO - 2 - pF Conditions Symbol Min Typ Max Units - RJC - 1.5 - °C/W IF=10mA, VL=10V ms pF Measurement taken within 1 second of on-time. Thermal Characteristics Parameter Thermal Impedance (junction to case) 2 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1726 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 15 10 5 25 25 20 20 Device Count (N) Device Count (N) 20 15 10 5 0 0.55 0.61 0.67 0.73 0.79 Turn-On Time (ms) 0.035 0.85 25 25 20 15 10 285 288 291 294 297 Blocking Voltage (VP) 700 20 15 10 1.230 1.235 1.240 1.245 LED Forward Voltage (V) 0.62 0.63 0.64 0.65 0.66 On Resistance (:) 0.67 1.6 1.5 IF=50mA 1.4 IF=20mA 1.3 IF=10mA 1.2 1.1 -40 1.250 Typical Turn-On Time vs. Temperature (IF=10mA, VL=10V, RL=1k:) 1.1 3.6 -20 0 20 40 60 Temperature (ºC) 80 100 Typical IF for Switch Operation vs. Temperature (IL=500mA) Turn-On Time (ms) 500 400 300 200 LED Current (mA) 1.0 600 Turn-On Time (Ps) 5 Typical LED Forward Voltage vs. Temperature Typical LED Forward Voltage Drop (N=50, IF=5mA) 300 Typical Turn-On Time vs. LED Forward Current (VL=10V, RL=1k:) 10 0.61 0 0 15 0.050 5 5 0.9 0.8 0.7 0.6 0.5 3.2 2.8 2.4 2.0 0.4 1.6 -40 0.3 100 0 10 20 30 40 LED Forward Current (mA) -40 50 Typical Turn-Off Time vs. LED Forward Current (VL=10V, RL=1k:) 0.055 Turn-Off Time (ms) 60 Turn-Off Time (Ps) 0.038 0.041 0.044 0.047 Turn Off Time (ms) LED Forward Voltage (V) 30 Device Count (N) Device Count (N) Typical Blocking Voltage Distribution (N=50) 30 Typical On-Resistance Distribution (N=50, IF=10mA, IL=1A) 0 0 0.49 55 50 45 40 0 10 20 30 40 LED Forward Current (mA) 50 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Turn-Off Time vs. Temperature (IF=10mA, VL=10V, RL=1k:) 0 20 40 60 Temperature (ºC) 80 100 2.2 0.050 2.1 0.045 0.040 0.035 0.030 0.025 -40 -20 Typical IF for Switch Dropout vs. Temperature LED Current (mA) Device Count (N) Typical Turn-Off Time Distribution (N=50, IF=10mA, VL=10V) Typical Turn-OnTime Distribution (N=50, IF=10mA, VL=10V) 2.0 1.9 1.8 1.7 -20 0 20 40 60 Temperature (ºC) 80 100 1.6 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1726 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical Load Current vs. Load Voltage (IF=10mA) 1100 800 600 400 200 900 800 700 600 0.2 0.3 0.4 0.5 0.6 Load Voltage (V) 0.7 -40 0.8 Typical Blocking Voltage vs. Temperature 30 315 Leakage Current (nA) 310 305 300 295 290 285 280 275 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1.0 0.9 0.8 0.7 0.6 -20 0 20 40 60 Temperature (ºC) 80 100 0.4 -40 Leakage Current vs. Temperature Measured Across Pins 3 & 4 (VL=250V) 0 20 40 60 Temperature (ºC) 80 100 10s 100s 8 7 25 20 15 10 5 0 -40 -20 Energy Rating Curve Free air, No Heat Sink Load Current (A) 0.1 1.1 0.5 500 0.0 Typical On-Resistance vs. Temperature (IF=10mA, IL=500mA) 1.2 1000 0 Blocking Voltage (VP) 1.3 On-Resistance (:) 1000 Load Current (mADC) Load Current (mA) 1200 Maximum Load Current vs. Temperature (IF=10mA) 6 5 4 3 2 1 -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1726 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1726Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1726Y 245ºC 30 seconds 1 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1726 MECHANICAL DIMENSIONS 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Note: Pin-to-pin tolerances are non-cumulative. Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1726-R04 ©Copyright 2016, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 5/4/2016