ASM3P2879A January 2007 rev 1.5 Low Power Peak Reducing EMI Solution Features • The ASM3P2879A uses the most efficient and optimized modulation profile approved by the FCC and is Generates an EMI optimized clock signal at the implemented by using a proprietary all digital method. output. • Integrated loop filter components. • Operates with a 3.3V /2.5V Supply. • Operating current less than 4mA. • Low power CMOS design. • Input frequency range: 13MHz to 30MHz for 2.5V The ASM3P2879A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced : 13MHz to 30MHz for 3.3V • by oscillators and most frequency generators. Lowering Generates a 1X low EMI spread spectrum clock of EMI by increasing a signal’s bandwidth is called ‘spread the input frequency. spectrum clock generation’. • Frequency deviation: ±1% @ 24MHz • Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin Applications TSSOP packages. The ASM3P2879A is targeted towards all portable Product Description devices with very low power requirements like MP3 The ASM3P2879A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2879A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock players, Notebooks and digital still cameras. Key Specifications Description Specification Supply voltages VDD = 2.5V / 3.3V system cost savings by reducing the number of circuit Cycle-to-Cycle Jitter 200pS (Max) board layers ferrite beads, shielding that are traditionally Output Duty Cycle 45/55% required to pass EMI regulations. Modulation Rate Equation FIN/640 Frequency Deviation ±1% @ 24MHz dependent signals. The ASM3P2879A allows significant Block Diagram VDD XOUT PLL Modulation XIN Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider REFOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ModOUT ASM3P2879A January 2007 rev 1.5 Pin Configuration (6-pin TSOT-23 Package) REFOUT 1 XOUT 2 6 VSS 5 ModOUT 4 VDD ASM3P2879A XIN/CLKIN 3 Pin Description Pin# Pin Name Type Description 1 REFOUT O Buffered output of the input frequency. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 4 VDD P Power supply for the entire chip (3.3V) 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. Pin Configuration (8-pin SOIC and TSSOP Packages) XIN/CLKIN 1 XOUT 2 8 VDD ASM3P2879A REFOUT 3 NC 4 7 NC 6 ModOUT 5 VSS Pin Description Pin# Pin Name Type Description 1 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 REFOUT O Buffered output of the input frequency. 4 NC - No connect. 5 VSS P Ground connection. 6 ModOUT O Spread spectrum clock output. 7 NC - No connect. 8 VDD P Power supply for the entire chip Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 12 ASM3P2879A January 2007 rev 1.5 Modulation Profile Specifications Description Frequency Range Specification For 2.5V Supply 13MHz < CLKIN < 30MHz For 3.3V Supply 13MHz < CLKIN < 30MHz Modulation Equation FIN/640 Frequency Deviation ±1% @ 24MHz Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TSTG TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 12 ASM3P2879A January 2007 rev 1.5 DC Electrical Characteristics for 2.5V Supply (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Min Typ Max Unit VIL Input low voltage Parameter VSS - 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - - -35 µA IIH Input high current - - 35 µA IXOL XOUT output low current (@0.5V, VDD=2.5V) - 3 - mA IXOH XOUT output high current (@1.8V, VDD=2.5V) - 3 - mA VOL Output low voltage (VDD = 2.5 V, IOL = 8mA) - - 0.6 V VOH Output high voltage (VDD = 2.5 V, IOH = 8mA) 1.8 - - V IDD Static supply current * - 1.2 - mA ICC Dynamic supply current (2.5V, 24MHz and with no load) VDD tON ZOUT - 3.5 - mA 2.375 2.5 2.625 V Power-up time (first locked cycle after power-up) - - 5 mS Output impedance - 50 - Ω Operating Voltage * XIN/CLKIN pin is pulled low AC Electrical Characteristics for 2.5V Supply Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 13 - 30 MHz Output frequency 13 - 30 MHz Input Frequency = 13MHz - ±1.75 - Input Frequency = 30MHz - ±0.80 - Frequency Deviation % tLH* Output rise time (measured from 0.7V to 1.7V) 0.8 1.7 1.9 nS tHL* Output fall time (measured from 1.7V to 0.7V) 0.5 0.9 1.2 nS tJC Jitter (cycle to cycle) - - 200 pS tD Output duty cycle 45 50 55 % * tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 12 ASM3P2879A January 2007 rev 1.5 DC Electrical Characteristics for 3.3V Supply (Test condition: All parameters are measured at room temperature (+ 25°C) unless otherwise stated) Symbol Min Typ Max Unit VIL Input low voltage Parameter VSS - 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - - -35 µA IIH Input high current - - 35 µA IXOL XOUT output low current (@0.4V, VDD=3.3V) - 3 - mA IXOH XOUT output high current (@2.5V, VDD=3.3V) - 3 - mA VOL Output low voltage (VDD = 3.3 V, IOL = 8mA) - - 0.4 V VOH Output high voltage (VDD = 3.3 V, IOH = 8mA) 2.5 - - V IDD Static supply current * - 1.2 - mA ICC Dynamic supply current (3.3V, 24MHz and with no load) VDD - 4.5 - mA 2.7 3.3 3.6 V Power-up time (first locked cycle after power-up) - - 5 mS Clock output impedance - 45 - Ω Operating Voltage tON ZOUT * XIN/CLKIN pin is pulled low AC Electrical Characteristics for 3.3V Supply Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 13 - 30 MHz Output frequency 13 - 30 MHz Input Frequency = 13MHz - ±1.75 - Input Frequency = 30MHz - ±0.80 - Frequency Deviation % tLH* Output rise time (measured from 0.8 to 2.0V) 0.6 1.6 1.8 nS tHL* Output fall time (measured at 2.0V to 0.8V) 0.4 1.0 1.2 nS tJC Jitter (cycle to cycle) - - 200 pS tD Output duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 12 ASM3P2879A January 2007 rev 1.5 Typical Crystal Oscillator Circuit Crystal R1 = 510Ω C1 = 27 pF C2 = 27 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 14.31818MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance 18pF Shunt capacitance 7pF maximum ESR 25Ω Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 12 ASM3P2879A January 2007 rev 1.5 Package Information 6-pin TSOT-23 Package Dimensions Symbol Inches Min A Max Millimeters Min Max 0.04 1.00 A1 0.00 0.004 0.00 0.10 A2 0.033 0.036 0.84 0.90 b 0.012 0.02 0.30 0.50 H 0.005 BSC 0.127 BSC D 0.114 BSC 2.90 BSC B 0.06 BSC 1.60 BSC e 0.0374 BSC 0.950 BSC C 0.11 BSC 2.80 BSC L 0.0118 0.02 0.30 0.50 θ 0° 4° 0° 4° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 12 ASM3P2879A January 2007 rev 1.5 8-Pin SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Millimeters Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 8 of 12 ASM3P2879A January 2007 rev 1.5 8-Pin TSSOP Package H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 9 of 12 ASM3P2879A January 2007 rev 1.5 Ordering Information Part Number Marking ASM3P2879AF-06OR D4LL ASM3P2879AF-08TT Package Type Temperature 6-Pin TSOT-23, TAPE & REEL, Pb Free Commercial 3P2879AF 8-Pin TSSOP, TUBE, Pb Free Commercial ASM3P2879AF-08TR 3P2879AF 8-Pin TSSOP, TAPE & REEL, Pb Free Commercial ASM3P2879AF-08ST 3P2879AF 8-Pin SOIC, TUBE, Pb Free Commercial ASM3P2879AF-08SR 3P2879AF ASM3P2879AG-06OR D3LL ASM3P2879AG-08TT 8-Pin SOIC, TAPE & REEL, Pb Free Commercial 6-Pin TSOT-23, TAPE & REEL, Green Commercial 3P2879AG 8-Pin TSSOP, TUBE, Green Commercial ASM3P2879AG-08TR 3P2879AG 8-Pin TSSOP, TAPE & REEL, Green Commercial ASM3P2879AG-08ST 3P2879AG 8-Pin SOIC, TUBE, Green Commercial ASM3P2879AG-08SR 3P2879AG 8-Pin SOIC, TAPE & REEL, Green Commercial ASM3I2879AF-06OR D5LL ASM3I2879AF-08TT ASM3I2879AF-08TR 6-Pin TSOT-23, TAPE & REEL, Pb Free Industrial 3I2879AF 8-Pin TSSOP, TUBE, Pb Free Industrial 3I2879AF 8-Pin TSSOP, TAPE & REEL, Pb Free Industrial ASM3I2879AF-08ST 3I2879AF 8-Pin SOIC, TUBE, Pb Free Industrial ASM3I2879AF-08SR 3I2879AF 8-Pin SOIC, TAPE & REEL, Pb Free Industrial ASM3I2879AG-06OR D6LL 6-Pin TSOT-23, TAPE & REEL, Green Industrial ASM3I2879AG-08TT 3I2879AG 8-Pin TSSOP, TUBE, Green Industrial ASM3I2879AG-08TR 3I2879AG 8-Pin TSSOP, TAPE & REEL, Green Industrial ASM3I2879AG-08ST 3I2879AG 8-Pin SOIC, TUBE, Green Industrial ASM3I2879AG-08SR 3I2879AG 8-Pin SOIC, TAPE & REEL, Green Industrial Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 10 of 12 ASM3P2879A January 2007 rev 1.5 Device Ordering Information A S M 3 P 2 8 7 9 A F - 0 8 T R R = Tape & Reel, T = Tube or Tray O = TSOT23 S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 J=TSOT26 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 11 of 12 ASM3P2879A January 2007 rev 1.5 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2879A Document Version: 1.5 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 12 of 12