Serial Memory Products Serial Memory Products ■ Serial EEPROM ■ Serial SRAM www.microchip.com/memory Serial Memory Products A broad portfolio of high performance, best-in-class Serial Memory Products to meet all your design requirements. Microchip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating voltage (1.7 to 5.5V) and temperature ranges (up to 150ºC). Innovative low-power designs and extensive testing have ensured industry leading endurance and best-in-class quality at low costs. SPI-compatible Serial SRAM devices are available in 64 and 256 Kbit options and up to 20 MHz. These low power devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin packages. Microchip Supports Your Designs Throughout The Product Life Cycle 2 Serial Memory Products Serial Memory Advantages Serial Memory Products Outstanding Quality Innovative Products Reliable Supply Serial EEPROM ■ ■ ■ ■ Serial SRAM ■ ■ ■ ■ SPI, I2C™, Microwire, UNI/O® Bus Non-Volatile Memory 128 bits-1Mbit 1.7V-5.5V ■ 1M Cycles E/W Endurance ■ Fast Read/Write Times ■ Low Power Consumption SPI Bus, 20 MHz Volatile Memory 8, 32 Kbytes 1.5V-1.95V; 2.7V-3.6V ■ Infinite Endurance ■ Zero Write Speeds ■ Low Power Key Features Key Benefits ■ ■ ■ ■ ■ ■ ■ ■ ■ Lower system costs – innovative products, tiny packages, low power consumption, fewer I/O pins, small form factor ■ Save I/O pins on the MCU – more compact designs, add additional features ■ Secure data with write-protect options ■ Highest quality EEPROMs – Zero PPM initiatives – Triple-test flow – >1M cycles E/W endurance ■ Faster time to market – Short lead times – Complete tools support ■ Robust designs – broad operating conditions ■ Long product life cycles ■ Global sales & engineering support Serial architecture – I2C, SPI, UNI/O, Microwire Broad range of densities Tiny 3, 5, 6 and 8-pin packages, die & wafer Innovative, low power designs Industry leading endurance Wide temperature and voltage range Fast read and write times Flexible: – Byte write capability – Package options – Custom programming options – Application-specific serial memory ■ Microchip owned fabs, In-house testing ■ Automotive flow on all products Serial EEPROM Bus Comparison Parameter I2 C Microwire UNI/O SPI Density Range 128b-1 Mbit 1 Kb-16 Kb 1 Kb-16 Kbit 1Kb-1 Mbit Speed Up to 1 MHz Up to 3 MHz Up to 100 KHz Up to 20 MHz 2: Clock, Data 4: Clock, CS, DI, DO 1: Clock/Data 4: SCK, CS, DI, DO Package Options PDIP, SOIC, SOIJ, TSSOP, MSOP, 2x3 T-DFN, 6x5 DFN, SOT-23, SC70, WLCSP PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN, SOT-23 PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN, SOT-23, TO92, WLCSP PDIP, SOIC, SOIJ, TSSOP, MSOP, 2x3 T-DFN, 6x5 DFN, SOT-23 Security Options HW HW SW HW, SW I/O Pins Pricing Least Expensive Most Expensive Serial Memory Products 3 Serial EEPROM Innovative designs combined with in-house fabrication and outstanding testing methodology has helped create the industry’s highest quality Serial EEPROM. Microchip offers a broad selection of standard and application specific Serial EEPROM devices that are available in all the standard serial busses – I2C, SPI, Microwire and the new single I/O UNI/O® bus. Serial EEPROMs Standard EEPROMs Specialty/Application Specific EEPROMs I2C™ UNI/O® Bus MAC Address Chips 128b-1 Mb; 1.7V-5.5V 1 Kb-16 Kb; 1.8V-5.5V EUI-48™ & EUI-64™ Node Address Microwire SPI Partial Array Write Protect 1 Kb-16 Kb; 1.8V-5.5V 1 Kb-1 Mb; 1.8V-5.5V ½, ¼ and Whole Array WP Options DIMM-DDR2/3 Packages Reversible S/W Write Protect; I2C Extended Temperature . . 5-SC70 (LT) 2 x 2 mm 3-SOT (TT) 3 x 2.5 mm 5 & 6-SOT (OT) 3 x 3 mm . . . 8-TDFN (MC/MNY) 2 x 3 mm 8-MSOP (MS) 3 x 5 mm 8-TSSOP (ST) 3 x 6.5 mm -55ºC to 150ºC VESA Monitors DDC1™/DDC2™ Interface Very Low Voltage 8-SOIC (SN) 5 x 6 mm 8-DFN (MF) 5 x 6 mm 8-SOIC (SM) 5 x 8 mm 8-PDIP (P) 8 x 9.5 mm 1.5V EEPROM Die/Wafer WL-CSP Robust Design Quality ■ ESD Protection > 4000V Human Body Model (HBM) > 400V Machine Model (MM) > 1000V Charged Device Model ■ Latch-up protection > 200 mA on all pins ■ ESD Induced Latch-up > 100V (MM) on VDD; >400V on all I/O > 1M cycles Endurance and > 200 years data retention ■ Up to 150°C Operation (reads and writes) ■ Power-On Reset (POR) and Brown-Out Reset (BOR) – Effective protection against noisy automotive environments – Eliminates false writes ■ Schmitt Trigger input filters for noise reduction ■ Complete traceability including die location on wafer ■ Microchip delivers highest quality EEPROMs in the world ■ World-class line yields (over 99%) ■ ISO/TS16949-compliant ■ Industry leader with triple test flow – every cell of every part is tested three times ■ Near zero PPM field bit fails ■ Statistical process control and continuous improvement procedures in all facilities ■ Robustness and reliability designed in ■ Automotive grade/flow 4 Serial Memory Products Memory Package Matrix Memory Packages – more memory in less space! Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize your design – save board space and cost! ■ WLCSP – die-sized package – smallest form factor EEPROM package in the world! ■ SC70 – smallest 5-lead EEPROM package! ■ 5-SOT-23 available up to 64 Kbit; 8-TDFN up to 128 Kbit, 8-SOIC up to 1 Mbit (I2C) Density I2C™ Max Speed SOIC SN SOT-23 OT/TT TSSOP TS TDFN MNY/MC PDIP P MSOP MS SOIJ SM DFN MF SC70 LT 5x6 3x3 3x6.5 2x3 8x9.5 3x5 5x8 5x6 TO92 TO Wafer W/S/WF WLCSP CS 2x2 Die Die 5 X Bus 1.7V-5.5V 128bit-2K 400 KHz X 5 X X X X 4K-32K 400 KHz X 5 X X X X 64K 1 MHz X 5 X X X X X 128K 1 MHz X X X X X X 256K 1 MHz X X X X 512K 1 MHz X X 1 Mbit 1 MHz X X X X X X X X X X X X X X X X X X X Microwire Bus 1.8V-5.5V 1K-16K 3 MHz X 6 X X X X X 6 X X X X X X X X X SPI Bus 1.8V-5.5V 1K-4K 10 MHz X 8K-64K 10 MHz X X 128K, 256K 10 MHz X X X X X X 512K 20 MHz X 14 X X X X 1 Mbit 20 MHz X X X X UNI/O® Single-Wire Bus 1.8V-5.5V 1K-16K 100 KHz X 3 X X X X X X Package Sizes . . 5-SC70 (LT) 2 x 2 mm 3-SOT (TT) 3 x 2.5 mm . . 5 & 6-SOT (OT) 3 x 3 mm . . . 8-TDFN (MC/MNY) 2 x 3 mm 8-MSOP (MS) 3 x 5 mm 8-TSSOP (ST) 3 x 6.5 mm 8-SOIC (SN) 5 x 6 mm WLCSP – World’s Smallest EEPROM Package WLCSP from Microchip is bumped die with a redistribution layer to route the bond pads to the bumps. ■ True ‘die-sized’ packages ■ Industry’s smallest package, form factor ■ Lowest profile package ■ Available in I2C, UNI/O buses ■ Compatible with standard surface mount assembly lines ■ Fit a large density into a small space ■ Applications: mobile phones, security cameras, sensors, servers, networking, RF, medical, portable electronics 8-DFN (MF) 5 x 6 mm 8-SOIC (SM) 5 x 8 mm 8-PDIP (P) 8 x 9.5 mm Die/Wafer WL-CSP Wafer Level Chip Scale Packaging Actual Size Enlarged to Show Detail WLCSP 4 Kbit I2C <1 x 1 mm Serial Memory Products 5 Application-Specific EEPROMs Innovative EEPROM options to help you get to market faster and deliver the highest performance at lowest costs. Serial Memory Products – Application Examples Automotive Quality, PPAP, long product life cycles, AEC Q-100 & TSO-16949 compliant, in-house testing, triple-test flow Transmission, ABS, Power Train, Airbag, Entertainment System, Mirror Controllers, GPS, Steering Control Medical Outstanding quality, and reliability, tiny packages, low power, Microchip owned fabs Blood Glucose Meters, Hearing Aid, Medical Imaging Devices, XRAY, Oxygen Concentrator, ECG Industrial Applications Robust designs, high endurance, wide operating range, custom part options Metering, Industrial Control, Security Systems, Alarm Systems, Sensor Networks, Battery Chargers Consumer Microchip Strengths Short lead times, excellent supply, innovative packages, application specific options, low power LCD TV, Set Top Box, Printers, Blue Tooth, Wireless, Laptop, Mouse, Networking, DDR2/3, Camera, POS, Appliances Specialty EEPROM Applications Application/Market Design Challenge Solution Products Benefits Monitors, Projectors, Flat Panel Display DDC1™ & DDC2™, EDID & E-EDID specification Vesa products 24LCS21A, 24LCS22A Quick, easy plug & play options Networking, Ethernet, Wi-Fi, ZigBee® EUI-48™/EUI-64™ MAC Address MAC address chips 24AA02E48, 11AA02E48, 25AA02E48 Easy access, Low-cost, Plug & play, Additional EEPROM PCs and Laptops – DRAM DIMM Modules DDR1/2/3 Specification DIMM SPD products, 24LCS52, 34XX02, Temp sensor with EEPROM MCP98242 Industrial, Consumer Electronics Systems that require locked and/or re-writeable memory Write-protect options I2C, SPI, UNI/O and Microwire Options available One lower cost device replace two stand-alone parts HDCP Chipset (TV) Adding HDCP keys to your chipset Secure wafer programming service 4K/8K – I2C, SPI, Microwire Secure, No code duplication, Lower overall costs, Factory-programmed serialization Industrial Need devices to operate beyond -40C to +125C Automotive Automotive Qualification Consumer Electronics, Need Very Low Voltage Medical 6 Serial Memory Products High temp. EEPROMs: up to 150°C 1 Kbit, I2C and Low temp EEPROMs: 1-256 Kbit SPI down to -55°C Special manufacturing flow All Very Low Voltage EEPROMs Customizable software enabled WP Robust design, Reduce chances of field failures Robust design, Hassle-free solution 24VL014, 24VL024, Low power operation, Reduced 34VL02 system voltage More Speciality EEPROMs EUI-48™/EUI-64™ MAC Address Chips Need fast, easy and inexpensive access to MAC addresses? Use pre-programmed MAC address chips from Microchip. No serialization needed; unique ID. EUI-48 Programmed Serial EEPROMs provide low cost and easy access to IEEE MAC Addresses. These plug-and-play devices allow you to quickly add a MAC address to your networking application eliminating the need for programming and serialization on the MCU – helping you save cost and get to market quicker. For more information visit: www.microchip.com/MAC 24AA02E48 100 KHz 25AA02E48 10 MHz 11AA02E48 100 KHz I2C SPI UNI/O Plug-and-Play Devices Flexibility and Low Cost Access EUI-48 address embedded in a 2K-bit Serial EEPROM Quickly add EUI-48 to your networking application and get to market faster ■ Quick and easy access to IEEE MAC addresses – ■ Buy code only when needed. Read code directly off Serial EEPROM 2 ■ No added programming and serialization cost – ■ Available in SPI, I C and UNI/O bus Reduce System Costs ■ At least 1.5 Kb of Serial EEPROM memory ■ Come with no volume restrictions. ■ Available in SOIC and SOT-23 packages ■ Additional EEPROM to store configuration settings ■ Write-protected codes ■ Unique ID ■ EUI-48 and EUI-64 compatible – EUI-48: Networking, Ethernet, Wi-Fi (IEEE 802.11), Bluetooth – EUI-64: ZigBee (IEEE802.15.4), MiWi™, FireWire, IPv6 ■ Can be custom programmed in any memory density. Contact Microchip sales for more information. Partial Array Write-Protect I2C EEPROMs Microchip’s family of partial array write-protect (WP) EEPROMs offers hardware write-protect capability for only a part of the memory array. These I2C EEPROM devices are available from 1 Kb-64 Kbit. 1/2 Array WP 1/4 Array WP User data, real-time updates, data that changes Calibration parameters, unique ID, data that never changes 1 Kbit-16 Kbit 32 & 64 Kbit I2C and SPI Serial EEPROMs with Optional Range from -55°C to +150°C ■ ■ ■ ■ Automotive turbo chargers and exhaust gas recirculation Automotive fan motors, air valves, flaps and spark plugs Aerospace Mining (certifications for use in explosive atmospheres available) 150oC Serial Memory Products 7 UNI/O® EEPROM Using UNI/O EEPROM can free up MCU pins for new features. Microchip’s new UNI/O Serial EEPROM uses only ONE connection to the host microcontroller. This compares to two or three pins for I2C, and three to six pins for Microwire or SPI buses. This new, proprietary bus offers advanced features like a status register and write-protection on demand, along with all I/O and memory array and command functions through a single pin. 2.5-5.5V 11LC010 11LC020 11LC040 11LC080 11LC160 1.8-5.5V 11AA010 11AA020 11AA040 11AA080 11AA160 1 Kb 2 Kb 4 Kb 8 Kb 16 Kb Single I/O EEPROM Save I/O Pins One I/O for clock, data & control A single I/O EEPROM can simplify your design and reduce system cost ■ ■ ■ ■ ■ ■ ■ Single I/O interface 1-16 Kbit memory densities 1.8-5.5V operating voltage 10-100 KHz operating frequency Status register, SW write-protect 3-pin SOT-23, 8-pin SOIC, MSOP & TDFN 1M Erase/Write cycles ■ Free up pins on the MCU – Add new features to your application – Move to a smaller MCU – reduce cost ■ Free up pins on your connector – Smaller connector – lower cost ■ Single I/O interface – more compact design The UNI/O Advantage UNI/O® VCC VCC VCC SDA SCL WP MCU R2 I2C™ R1 VCC SDA SCL WP MCU Single I/O, No pull-up resistors needed. UNI/O® I2C™ VCC ■ Save board space ■ Save pins on the MCU ■ Add additional features ■ UNI/O software drivers available for many popular microcontrollers See Ap Note section for more information. ■ Convert UNI/O from 3-pins to 2-pins – check out Ap Note AN1213. www.microchip.com/unio 8 Serial Memory Products Serial SRAM Do you need a simple, inexpensive way to add RAM to your application? Microchip offers external RAM where you need it. Microchip’s new serial SRAM family provides a way to easily and inexpensively add external RAM to almost any application. These serial devices use less power and fewer I/O connections than traditional parallel SRAM. And, they allow designers to use a smaller microcontroller rather than moving to a larger microcontroller just to get more on-board RAM. 256 Kb 23A256 16 MHz 23K256 20 MHz 64 Kb 23A640 16 MHz 23K640 20 MHz 1.5V-1.95V 2.7V-3.6V ■ Applications: metering, POS terminals, printers, internet radio, ethernet, Wi-Fi ■ Replace parallel RAM ■ Any application needing low cost RAM Increased Performance Flexible RAM Expansion Quickly and easily add external high-speed SRAM ■ ■ ■ ■ ■ ■ 8 and 32 Kbyte options 20 MHz clock speed Low standby and operating currents Fast writes with zero latency Unlimited endurance 8-SOIC, 8-TSSOP, 8-PDIP Add features to your current microcontroller and get to market faster ■ ■ ■ ■ ■ Add functionality to your current design No need to buy a large microcontroller just for the RAM Familiar 4-pin SPI interface Cost reduce your current design Scratchpad, buffering, high endurance applications The Serial Advantage – Not Just Price Feature Traditional Parallel SRAM Microchip Serial SRAM I/O Connection to MCU 16-20 4 Standby Current 3 mA 1 μA Active Current 50 mA 1-10 mA 3.0V 1.7V Lowest Operating Voltage Footprint Smallest Packages 100 mm2 20 mm2 28-TSSOP, 28-SOIC 8-TSSOP, 8-SOIC Parallel SRAM www.microchip.com/sram Serial Memory Products 9 Wafer-Level Burn-In Microchip’s best-in-class field performance is the combined result of world class manufacturing, wafer level burn-in and wafer probe quality screens. Microchip’s Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the industry. It tests each cell of each die three times and also performs extensive endurance and data retention tests to ensure quality and reliability. Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing, excellent fabrication and highly reliable memory cell design. Microchip’s Triple Test and Wafer-level Burn-in Procedure Traditional Burn-in (Old Technology) General purpose non-specific testing procedure for random logic cells ■ Non-specific and untargeted testing mechanism – Increases failure rates. ■ Expensive, time consuming and inefficient. ■ Introduces defect modes like bent leads and EOS that sometimes go undetected. Moving beyond traditional burn-in to wafer level burn-in with the Triple Test Flow specifically targeted for memory cells has helped create the industry’s most reliable memory products. ■ Extensive Testing – Every cell in every die is tested three times, including specific endurance and data retention tests to ensure highest quality. ■ HVST, LVHF and TVPP tests target specific defects. ■ Maverick, SBY and GBN target overall failure patterns and trends. ■ Insight into failure modes along with flexible test flow ensures continues improvement. Triple Test Flow Microchip tests every cell in wafer form twice, then performs a final test after assembly. Retention Bake 1: Wafer Probe Full functional tests on 100% of die and bits; 85ºC or 125ºC 5000 erase/write cycles on all bits 2: Wafer Probe 2nd 100% bit test (25ºC) full-functional screen Main Goals – Zero Defects 3: Assembly & Final Test ■ Full verification of data sheet parameters for functional compliance at die and package level. ■ Removal of manufacturing defects to ensure highest quality and reliability. ■ Screening out of functional devices that may fail in the future. • 250ºC up to 24 hours • Equivalent to 100 years at 85ºC Key Aspects: Endurance Testing MAVERICK HVST TVPP Any die with charge loss in any cell between the 2 probes is rejected to prevent infant mortality Key Aspects: Functional Test Verify Margins GBN EDIO LVHF SBY Wafer Probe Quality Screens Microchip performs additional in-house testing during wafer probe to ensure quality and eliminate any devices that are outside the normal distribution or might possibly fail in the future. High Voltage Stress Test (HVST) HVST targets weak devices with oxide defects in RAM and logic circuits by stressing the oxides at higher than normal voltages. Time at Vpp (TVPP) TVPP targets oxide defects in EEPROM cells, charge pumps and other high-voltage circuits. Programming voltages (VPP) are applied to the memory array for an extended period of time in order to highlight any weak devices. Low Voltage High Frequency (LVHF) LVHF targets signal paths that are partially blocked and therefore more resistive than normal. LVHF eliminates these devices by requiring them to operate faster than specified and at voltages lower than specified. 10 Serial Memory Products Good Die in a Bad Neighborhood (GBN) and Edge Die Ink Out (EDIO) Special algorithms target devices that function, but are suspect because of their proximity to clusters of failing devices or edge die. Failing Die Rejected by GBN screen Passing Die Rejected by EDIO screen Rejected by EDIO screen (Concept) What Does All of This Mean? ■ <<1 PPM Field Failures ■ Best-in-class endurance ■ Industry-leading data retention Consistent, Reliable Supply of the Highest Quality Products Microchip: A leader in non-volatile memory for over 20 years. Perfected testing mechanisms along with streamlined in-house fabrication ensures the highest efficiency, shortest lead times and lowest costs. “Quality Comes First” is at the top of the list of Guiding Values for Microchip Technology. As an ISO/TS-16949 certified supplier since 2003, Microchip’s Aggregate System uniquely supports our commitment to exceptional quality. In an environment where enterprise-wide commitment to continuous improvement is demonstrated and every employee is responsible for quality. ■ EEPROMs built at Microchip owned fabs (Gresham, OR, Tempe, AZ) ■ No obsolescence policy – industry’s longest product life cycles ■ 100% in-house testing on all of our products ■ AECQ100, TS19649 and automotive grade compliant ■ Industry’s shortest lead times ■ Excellent global sales and technical support With more than 20 years of experience in serving the demanding requirements of customers worldwide, Microchip Technology has a proven track record of success in delivering the total product solution to our valued customers that is cost effective and reliable. Corporate Headquarters Chandler, Arizona Fab 4 Gresham, Oregon Fab 2 Tempe, Arizona Product Assembly/Test Bangkok, Thailand www.microchip.com/quality Serial Memory Products 11 Resources to Get You Started Quickly Reduce development time and cost with our development tools. Competitive market conditions force businesses to examine every aspect of their product life cycle to maximize productivity and minimize expense. Easy-to-learn, low-cost common development tools are one way to reduce risk and get to market quicker. MPLAB® Starter Kit for Serial Memory Products UNI/O® Bus Parasitic Power Demo Board (DV243003) (AC243004) Reduce time to market and create a rock-solid design using the MPLAB Starter Kit for Serial Memory Products. It includes everything necessary to quickly develop a robust and reliable Serial EEPROM design, and greatly reduces the time required for system integration and hardware/software fine-tuning. ■ 3.3V and 5.0V on-board voltage selection ■ Supports Microchip UNI/O bus, I²C, SPI and Microwire Serial EEPROMs ■ 1.8V to 5.5V external voltage support ■ Includes free copy of MPLAB IDE ■ USB interconnect The UNI/O Bus Parasitic Power Demo Board is designed to illustrate how a standard half-wave rectifier and capacitor circuit can be used to parasitically extract power for a UNI/O device from the SCIO signal as described in application note, AN1213 “Powering a UNI/O® Bus Device Through SCIO”. This reduces the number of connections necessary for adding a UNI/O device to your application down to two: SCIO and VSS. Total Endurance™ Software Total Endurance Software provides a comprehensive model that helps estimate the endurance and reliability of Microchip Serial EEPROM devices. By providing operating conditions based on your application, all design trade-offs affecting reliability can be accurately estimated both graphically and numerically in PPM, FIT and MTBF modes, saving time and ensuring a truly robust design. www.microchip.com/devtools 12 Serial Memory Products Serial EEPROM PIM PICtail™ Pack (AC243003) The Serial EEPROM PIM PICtail Modules are a series of boards designed around Microchip Serial EEPROM devices. The boards are designed to interface with the PICtail Plus connector as well as the MPLAB Starter Kit for Serial Memory Products and the PICkit 3, allowing you to get started right out of the box. ■ Plug-and-play with PICtail Plus connector and PICkit 3 connector ■ Test points for oscilloscope connections for firmware debugging (I²C and UNI/O only) ■ Microwire Buses are included for maximum flexibility in developing your application Reference Code Resources Looking for reference code to interface with our serial memory? Select your serial protocol, microcontroller and preferred implementation below. Memory Application Notes – PIC® MCUs Protocol UNI/O Bus Memory Type EEPROM Recommended Usage Implementation PIC10 PIC12 PIC16 PIC18 AN1194 (General Usage) Assembly – Firmware Delay AN11741 AN11741 AN11882 AN11741 AN11882 AN1183 Assembly – Hardware Delay AN11962 AN11962 AN1187 C – Hardware Delay AN12512 AN12512 AN1191 AN982 AN974 AN979 AN976 AN989 AN1213 (Parasitic Power) Assembly – Bit Bang Assembly – Hardware Port I²C EEPROM AN982 PIC32 AN1236 AN1028 C – Bit Bang C – Hardware Port Microwire PIC24/ dsPIC33 EEPROM AN997 AN1100 AN991 AN1079 Assembly – Bit Bang AN993 AN999 Assembly – Hardware Port AN975 AN1020 AN1029 C – Bit Bang AN1004 C – Hardware Port EEPROM AN1023 Assembly – Bit Bang AN909 AN1006 Assembly – Hardware Port AN966 AN1000 AN1040 SPI SRAM All EEPROMs C – Bit Bang AN1018 AN1096 C – Hardware Port AN1040 AN1069 AN1269 AN1262 AN1245 – AN1019 EEPROM Endurance Tutorial AN1287 AN536 Basic Serial EEPROM Operation AN603 Continuous Improvement AN1277 Note 1: Written for baseline (12-bit program word) cores. 2: Written for mid-range (14-bit program word) cores. Memory Application Notes – Third-Party MCUs Protocol Implementation 8051 Assembly – Hardware Delay AN1184 C – Hardware Delay AN1185 Assembly – Bit Bang AN1147 Assembly – Hardware Port AN1190 C – Bit Bang AN1195 C – Hardware Port AN1113 Assembly – Bit Bang AN1198 Assembly – Hardware Port AN1197 C – Bit Bang AN1193 C – Hardware Port AN1073 MSP430 UNI/O Bus AN1186 I²C SPI www.microchip.com/appnotes Serial Memory Products 13 Product Specifications I2C™ Memory Products Device Density (Organization) 24XX00 Max Clock Frequency Operating Voltage (AA, LC, C) Temperature (I, E, H) Endurance (E/W Cycles) Data Retention Write Protect (Hardware) Packages 128 bits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years No 24XX01/014 1 Kbit (x8) 400 kHz 1.7V-5.5V -40°C to +150ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70 24XX02/024 2 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70 24XX04 4 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX08 8 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 24XX16 16 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX32 32 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX64/65 64 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M/10M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX128 128 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 2x3 T-DFN, 6x5 DFN, MSOP, WLCSP 24XX256 256 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, MSOP, WLCSP 24XX512 512 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, WLCSP 24XX1025 1 Mbit (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, SOIJ, 6x5 DFN UNI/O® Bus EEPROM Products Density (Organization) Max Clock Frequency Operating Voltage (AA, LC) Temperature (I, E) Endurance (E/W Cycles) Data Retention Write Protect (Software) Packages 11XX010 1 Kbit (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX020 2 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX040 4 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP Device 11XX080 8 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX160 16 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP Microwire EEPROM Products Density (x8 or x16) Max Clock Frequency Operating Voltage (AA, LC, C) Temperature (I, E) Endurance (E/W Cycles) Data Retention Write Protect (Hardware) Read Current 93XX46A/B/C 1 Kbit 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX56A/B/C 2 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX66A/B/C 4 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX76A/B/C 8 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP 93XX86A/B/C 16 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP Device Packages A: x8 Organization, B: x16 Organization, C: Selectable x8 or x16 Organization SPI EEPROM Products Device Density (Organization) Max Clock Frequency Operating Voltage (AA, LC) Temperature (I, E, H) Endurance (E/W Cycles) Data Retention Write Protect (Software) Packages 25XX010A 1 Kbit (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX020A 2 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX040A 4 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX080C/D 8 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX160C/D 16 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX320A 32 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX640A 64 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX128 128 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN 25XX256 256 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN 25XX512 512 Kbits (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, 6x5 DFN 25XX1024 1 Mbit (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIJ, 6x5 DFN 1. Voltage Range: AA = 1.7- 5.5V; LC = 2.5-5.5V; C = 4.5-5.5V 2. I = -40ºC to 85ºC; E = -40ºC to 125ºC; H = -40ºC to 150ºC 3. Pb-Free, Halogen Free and RoHS Compliant 4. Write Protect: W = Whole Array, ½ = Half Array, ¼ = Quarter Array 5. ESD protection > 4 kV (HBM); > 400V (MM) on all pins 6. H Temp is SOIC only Serial SRAM Products Device Density Organization) Max Clock Frequency Operating Voltage (A, K) Temperature (I, E) Read Current (mA) Max Standby Current Packages 23x640 8KB (64 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP 23X256 32 KB (256 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP 1. Voltage Range: A = 1.5- 1.95V; K = 2.7V-3.6V 2. All Devices are Pb-Free, RoHS Compliant and Halogen Free For up to date product information visit: www.microchip.com/memory 14 Serial Memory Products Serial Memory Ordering Information Part Number Suffix Designations Ordering information for Microchip SEEPROM products. 24 AA 02 T - I /SN Package Type: MNY/MC/MF 8-TDFN/DFN SN 8-SOIC (150 mil) LT 5-SC70 TT/OT 3/5/6 SOT-23 W/WF/S Wafer/Die ST 8-TSSOP CS WLCSP – die size P 8-PDIP TO TO92 SM 8-SOIJ (208 mil) MS 8-MSOP Operating Temperature Range: I: Industrial (-40°C to +85°C) E: Extended Industrial Range (-40°C to +125°C) H: Extended (-40°C to +150°C) Tape and Reel T: Tape and Reel blank: Standard (bulk) Density: 00: 128 bits 32/320: 32 Kbit 01/010/014: 1 Kbit 64/640: 64 Kbit 02/020/024: 2 Kbit 128: 128 Kbit 04/040: 4 Kbit 256: 256 Kbit 08/080: 8 Kbit 512: 512 Kbit 16/160: 16 Kbit 1024/1025: 1 Mbit Voltage Range: AA 1.8V-5.5V LC 2.5V-5.5V C 4.5V-5.5V K 1.8-3.6V A 1.5-1.95V VL 1.5V-3.6V Bus Type: 24/34: I2C 25: SPI 93: Microwire 11: UNI/O Bus 23: SRAM (SPI) Programming & Special Services We can pre-program your EEPROMs before they ship. Microchip offers custom programming options in package and die: ■ QTP – All devices are programmed with same data ■ SQTP – Each device is programmed with unique data Get started today… additional resources at: Do you have special product requirements? www.microchip.com/memory Microchip offers customized versions of existing products: ■ Lower VDD (<1.5V in some cases) ■ Extreme temperature (< -55ºC to >+150ºC) ■ More endurance, up to 10M cycles ■ Lower current specs (read, write, standby) ■ Higher speed ■ Customer design modifications: – Different I2C and UNI/O addresses – Custom voltage ranges ■ ■ ■ ■ ■ ■ Datasheets and application notes (with code) Verilog, IBIS models Usage recommendation ap notes Webinars at www.microchip.com/webinars Samples at www.microchip.com/samples Tools and demo boards Serial Memory Products 15 Support Training Microchip is committed to supporting its customers in developing products faster and more efficiently. We maintain a worldwide network of field applications engineers and technical support ready to provide product and system assistance. In addition, the following service areas are available at www.microchip.com: ■ Support link provides a way to get questions answered fast: http://support.microchip.com ■ Sample link offers evaluation samples of any Microchip device: http://sample.microchip.com ■ Forum link provides access to knowledge base and peer help: http://forum.microchip.com ■ Buy link provides locations of Microchip Sales Channel Partners: www.microchip.com/sales If additional training interests you, then Microchip can help. We continue to expand our technical training options, offering a growing list of courses and in-depth curriculum locally, as well as significant online resources – whenever you want to use them. ■ Regional Training Centers: www.microchip.com/rtc ■ MASTERs Conferences: www.microchip.com/masters ■ Worldwide Seminars: www.microchip.com/seminars ■ eLearning: www.microchip.com/webseminars ■ Resources from our Distribution and Third Party Partners www.microchip.com/training Sales Office Listing AMERICAS Atlanta Tel: 678-957-9614 Boston Tel: 774-760-0087 Chicago Tel: 630-285-0071 Cleveland Tel: 216-447-0464 Dallas Tel: 972-818-7423 Detroit Tel: 248-538-2250 Kokomo Tel: 765-864-8360 Los Angeles Tel: 949-462-9523 Santa Clara Tel: 408-961-6444 Toronto Mississauga, Ontario Tel: 905-673-0699 EUROPE Austria - Wels Tel: 43-7242-2244-39 Denmark - Copenhagen Tel: 45-4450-2828 France - Paris Tel: 33-1-69-53-63-20 Germany - Munich Tel: 49-89-627-144-0 Italy - Milan Tel: 39-0331-742611 Netherlands - Drunen Tel: 31-416-690399 Spain - Madrid Tel: 34-91-708-08-90 UK - Wokingham Tel: 44-118-921-5869 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8528-2100 China - Chengdu Tel: 86-28-8665-5511 China - Hong Kong SAR Tel: 852-2401-1200 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-5407-5533 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8203-2660 China - Wuhan Tel: 86-27-5980-5300 China - Xiamen Tel: 86-592-2388138 China - Xian Tel: 86-29-8833-7252 China - Zhuhai Tel: 86-756-3210040 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-2566-1512 Japan - Yokohama Tel: 81-45-471- 6166 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-6578-300 Taiwan - Kaohsiung Tel: 886-7-536-4818 Taiwan - Taipei Tel: 886-2-2500-6610 Thailand - Bangkok Tel: 66-2-694-1351 3/26/09 The Microchip name and logo, the Microchip logo, MPLAB, PIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. PICkit, PICtail and Total Endurance is a trademark of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, All Rights Reserved. Printed in the U.S.A. 3/10 DS22239A *DS22239A* www.microchip.com Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199