AD AD7441BRMZ Pseudo differential input, 1 msps, 10-/12-bit adcs in an 8-lead sot-23 Datasheet

Pseudo Differential Input, 1 MSPS,
10-/12-Bit ADCs in an 8-Lead SOT-23
AD7441/AD7451
FEATURES
FUNCTIONAL BLOCK DIAGRAM
VDD
Fast throughput rate: 1 MSPS
Specified for VDD of 2.7 V to 5.25 V
Low power at maximum throughput rate:
4 mW maximum at 1 MSPS with VDD = 3 V
9.25 mW maximum at 1 MSPS with VDD = 5 V
Pseudo differential analog input
Wide input bandwidth:
70 dB SINAD at 100 kHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface:
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
Power-down mode: 1 μA maximum
8-lead SOT-23 and MSOP packages
VIN+
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
T/H
VIN–
VREF
SCLK
AD7441/AD7451
CONTROL LOGIC
SDATA
APPLICATIONS
03153-001
CS
GND
Transducer interface
Battery-powered systems
Data acquisition systems
Portable instrumentation
Figure 1.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD7441/AD7451 1 are, respectively, 10-/12-bit high speed,
low power, single-supply, successive approximation (SAR),
analog-to-digital converters (ADCs) that feature a pseudo
differential analog input. These parts operate from a single
2.7 V to 5.25 V power supply and achieve very low power
dissipation at high throughput rates of up to 1 MSPS.
1.
Operation with 2.7 V to 5.25 V Power Supplies.
2.
High Throughput with Low Power Consumption.
With a 3 V supply, the AD7441/AD7451 offer 4 mW maximum power consumption for a 1 MSPS throughput rate.
3.
Pseudo Differential Analog Input.
4.
Flexible Power/Serial Clock Speed Management.
The conversion rate is determined by the serial clock,
allowing the power to be reduced as the conversion time
is reduced through the serial clock speed increase. These
parts also feature a shutdown mode to maximize power
efficiency at lower throughput rates.
5.
Variable Voltage Reference Input.
6.
No Pipeline Delays.
7.
Accurate Control of Sampling Instant via CS Input and
Once-Off Conversion Control.
ENOB > 10 Bits Typically with 500 mV Reference.
The AD7441/AD7451 contain a low noise, wide bandwidth,
differential track-and-hold (T/H) amplifier that handles input
frequencies up to 3.5 MHz. The reference voltage for these
devices is applied externally to the VREF pin and can range from
100 mV to VDD, depending on the power supply and what suits
the application.
The conversion process and data acquisition are controlled
using CS and the serial clock, allowing the device to interface
with microprocessors or DSPs. The input signals are sampled
on the falling edge of CS when the conversion is initiated.
The SAR architecture of these parts ensures that there are no
pipeline delays.
1
8.
Protected by U.S. Patent Number 6,681,332.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Fax: 781.461.3113 ©2003–2010 Analog Devices, Inc. All rights reserved.
AD7441/AD7451
TABLE OF CONTENTS
Features .............................................................................................. 1
ADC Transfer Function ............................................................. 13
Applications ....................................................................................... 1
Typical Connection Diagram ................................................... 14
Functional Block Diagram .............................................................. 1
Analog Input ............................................................................... 14
General Description ......................................................................... 1
Analog Input Structure .............................................................. 14
Product Highlights ........................................................................... 1
Digital Inputs .............................................................................. 15
Revision History ............................................................................... 2
Reference ..................................................................................... 15
Specifications..................................................................................... 3
Serial Interface ............................................................................ 16
Timing Specifications .................................................................. 7
Modes of Operation ....................................................................... 18
Timing Diagrams.......................................................................... 7
Normal Mode.............................................................................. 18
Absolute Maximum Ratings............................................................ 8
Power-Down Mode .................................................................... 18
ESD Caution .................................................................................. 8
Power vs. Throughput Rate ....................................................... 20
Pin Configurations and Function Descriptions ........................... 9
Microprocessor and DSP Interfacing ...................................... 20
Typical Performance Characteristics ........................................... 10
Grounding and Layout Hints.................................................... 22
Terminology .................................................................................... 12
Evaluating Performance ............................................................ 22
Theory of Operation ...................................................................... 13
Outline Dimensions ....................................................................... 23
Circuit Information .................................................................... 13
Ordering Guide .......................................................................... 24
Converter Operation .................................................................. 13
REVISION HISTORY
3/10—Rev. C to Rev. D
Changes to IDD Normal Mode (Operational) Parameter .................. 6
Updated Outline Dimensions ............................................................23
Changes to Ordering Guide ...............................................................24
3/07—Rev. B to Rev. C
Changes to Table 5 ................................................................................. 9
Updated Layout ....................................................................................12
Changes to Terminology Section.......................................................12
Updated Outline Dimensions ............................................................23
Changes to Ordering Guide ...............................................................24
2/05—Rev. A to Rev. B
Changes to Ordering Guide ...............................................................24
2/04—Rev. 0 to Rev. A
Updated Format .....................................................................Universal
Changes to General Description ....................................................... 1
Changes to Table 1 Footnotes ............................................................ 4
Changes to Table 2 Footnotes ............................................................ 6
Changes to Table 3 Footnotes ............................................................ 7
Changes to Table 5 .............................................................................. 9
Updated Figures 7, 8, and 9 .............................................................. 13
Changes to Figure 23......................................................................... 16
Changes to Reference Section .......................................................... 17
9/03—Revision 0: Initial Version
Rev. D | Page 2 of 24
AD7441/AD7451
SPECIFICATIONS
VDD = 2.7 V to 5.25 V; fSCLK = 18 MHz; fS = 1 MSPS; VREF = 2.5 V; TA = TMIN to TMAX, unless otherwise noted. Temperature ranges for A, B
versions: −40°C to +85°C.
Table 1. AD7451
Parameter
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio (SNR) 1
Signal-to-(Noise + Distortion) (SINAD)1
Total Harmonic Distortion (THD)1
Peak Harmonic or Spurious Noise1
Intermodulation Distortion (IMD)1
Second-Order Terms
Third-Order Terms
Aperture Delay1
Aperture Jitter1
Full-Power Bandwidth1, 2
DC ACCURACY
Resolution
Integral Nonlinearity (INL)1
Differential Nonlinearity (DNL)1
Offset Error1
Gain Error1
ANALOG INPUT
Full-Scale Input Span
Absolute Input Voltage
VIN+
VIN– 3
DC Leakage Current
Input Capacitance
REFERENCE INPUT
VREF Input Voltage 4
DC Leakage Current
VREF Input Capacitance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN 5
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance5
Output Coding
Test Conditions/Comments
fIN = 100 kHz
VDD = 2.7 V to 5.25 V
VDD = 2.7 V to 3.6 V
VDD = 4.75 V to 5.25 V
VDD = 2.7 V to 3.6 V; −78 dB typ
VDD = 4.75 V to 5.25 V; −80 dB typ
VDD = 2.7 V to 3.6 V; −80 dB typ
VDD = 4.75 V to 5.25 V; −82 dB typ
fa = 90 kHz; fb = 110 kHz
A Version
B Version
Unit
70
69
70
−73
−75
−73
−75
70
69
70
−73
−75
−73
−75
dB min
dB min
dB min
dB max
dB max
dB max
dB max
−80
−80
5
50
20
2.5
−80
−80
5
50
20
2.5
dB typ
dB typ
ns typ
ps typ
MHz typ
MHz typ
Guaranteed no missed codes to 12 bits
12
±1.5
±0.95
±3.5
±3
12
±1
±0.95
±3.5
±3
Bits
LSB max
LSB max
LSB max
LSB max
VIN+ − VIN–
VREF
VREF
V
VREF
−0.1 to +0.4
−0.1 to +1.5
±1
30/10
VREF
−0.1 to +0.4
−0.1 to +1.5
±1
30/10
V
V
V
μA max
pF typ
2.5
±1
10/30
2.5
±1
10/30
V
μA max
pF typ
2.4
0.8
±1
10
2.4
0.8
±1
10
V min
V max
μA max
pF max
2.8
2.4
0.4
±1
10
Straight
(natural) binary
2.8
2.4
0.4
±1
10
Straight
(natural) binary
V min
V min
V max
μA max
pF max
@ −3 dB
@ −0.1 dB
VDD = 2.7 V to 3.6 V
VDD = 4.75 V to 5.25 V
When in track-and-hold
±1% tolerance for specified performance
When in track-and-hold
Typically 10 nA, VIN = 0 V or VDD
VDD = 4.75 V to 5.25 V; ISOURCE = 200 μA
VDD = 2.7 V to 3.6 V; ISOURCE = 200 μA
ISINK = 200 μA
Rev. D | Page 3 of 24
AD7441/AD7451
Parameter
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time1
Throughput Rate
POWER REQUIREMENTS
VDD
IDD 6, 7
Normal Mode (Static)
Normal Mode (Operational)
Full Power-Down Mode
Power Dissipation
Normal Mode (Operational)
Full Power-Down
Test Conditions/Comments
A Version
B Version
Unit
888 ns with an 18 MHz SCLK
Sine wave input
Full-scale step input
16
250
290
1
16
250
290
1
SCLK cycles
ns max
ns max
MSPS max
2.7/5.25
2.7/5.25
V min/max
SCLK on or off
VDD = 4.75 V to 5.25 V
VDD = 2.7 V to 3.6 V
SCLK on or off
0.5
1.95
1.45
1
0.5
1.95
1.45
1
mA typ
mA max
mA max
μA max
VDD = 5 V; 1.55 mW typical for 100 ksps6
VDD = 3 V; 0.6 mW typical for 100 ksps6
VDD = 5 V; SCLK on or off
VDD = 3 V; SCLK on or off
9.25
4
5
3
9.25
4
5
3
mW max
mW max
μW max
μW max
1
See Terminology section.
Analog inputs with slew rates exceeding 27 V/μs (full-scale input sine wave > 3.5 MHz) within the acquisition time can cause the converter to return an incorrect result.
3
A small dc input is applied to VIN– to provide a pseudo ground for VIN+.
4
The AD7451 is functional with a reference input in the range of 100 mV to VDD.
5
Guaranteed by characterization.
6
See the Power vs. Throughput Rate section.
7
Measured with a full-scale dc input.
2
Rev. D | Page 4 of 24
AD7441/AD7451
VDD = 2.7 V to 5.25 V; fSCLK = 18 MHz; fS = 1 MSPS; VREF = 2.5 V; TA = TMIN to TMAX, unless otherwise noted. Temperature range for
B version: −40°C to +85°C.
Table 2. AD7441
Parameter
DYNAMIC PERFORMANCE
Signal-to-(Noise + Distortion) (SINAD) 1
Total Harmonic Distortion (THD)1
Peak Harmonic or Spurious Noise1
Intermodulation Distortion (IMD)1
Second-Order Terms
Third-Order Terms
Aperture Delay1
Aperture Jitter1
Full-Power Bandwidth1, 2
DC ACCURACY
Resolution
Integral Nonlinearity (INL)1
Differential Nonlinearity (DNL)1
Offset Error1
Gain Error1
ANALOG INPUT
Full-Scale Input Span
Absolute Input Voltage
VIN+
VIN– 3
DC Leakage Current
Input Capacitance
REFERENCE INPUT
VREF Input Voltage 4
DC Leakage Current
VREF Input Capacitance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN 5
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance5
Output Coding
Test Conditions/Comments
fIN = 100 kHz
B Version
Unit
61
−72
−73
−72
−74
dB min
dB max
dB max
dB max
dB max
−80
−80
5
50
20
2.5
dB typ
dB typ
ns typ
ps typ
MHz typ
MHz typ
Guaranteed no missed codes to 10 bits
10
±0.5
±0.5
±1
±1
Bits
LSB max
LSB max
LSB max
LSB max
VIN+ − VIN–
VREF
V
VREF
−0.1 to +0.4
−0.1 to +1.5
±1
30/10
V
V
V
μA max
pF typ
2.5
±1
10/30
V
μA max
pF typ
2.4
0.8
±1
10
V min
V max
μA max
pF max
2.8
2.4
0.4
±1
10
Straight (natural) binary
V min
V min
V max
μA max
pF max
2.7 V to 3.6 V; −77 dB typical
4.75 V to 5.25 V; −79 dB typical
2.7 V to 3.6 V; −80 dB typical
4.75 V to 5.25 V; −82 dB typical
fa = 90 kHz, fb = 110 kHz
@ −3 dB
@ −0.1 dB
VDD = 2.7 V to 3.6 V
VDD = 4.75 V to 5.25 V
When in track-and-hold
±1% tolerance for specified performance
When in track-and-hold
Typically 10 nA, VIN = 0 V or VDD
VDD = 4.75 V to 5.25 V; ISOURCE = 200 μA
VDD = 2.7 V to 3.6 V; ISOURCE = 200 μA
ISINK = 200 μA
Rev. D | Page 5 of 24
AD7441/AD7451
Parameter
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time1
Throughput Rate
POWER REQUIREMENTS
VDD
IDD 6, 7
Normal Mode (Static)
Normal Mode (Operational)
Full Power-Down Mode
Power Dissipation
Normal Mode (Operational)
Full Power-Down
Test Conditions/Comments
B Version
Unit
888 ns with an 18 MHz SCLK
Sine wave input
Step input
16
250
290
1
SCLK cycles
ns max
ns max
MSPS max
2.7/5.25
V min/max
SCLK on or off
VDD = 4.75 V to 5.25 V
VDD = 2.7 V to 3.6 V
SCLK on or off
0.5
1.95
1.45
1
mA typ
mA max
mA max
μA max
VDD = 5 V; 1.55 mW typ for 100 ksps6
VDD = 3 V; 0.6 mW typ for 100 ksps6
VDD = 5 V; SCLK on or off
VDD = 3 V; SCLK on or off
9.25
4
5
3
mW max
mW max
μW max
μW max
1
See the Terminology section.
Analog inputs with slew rates exceeding 27 V/μs (full-scale input sine wave > 3.5 MHz) within the acquisition time can cause the converter to return an incorrect result.
3
A small dc input is applied to VIN– to provide a pseudo ground for VIN+.
4
The AD7441 is functional with a reference input in the range 100 mV to VDD.
5
Guaranteed by characterization.
6
See the Power vs. Throughput Rate section.
7
Measured with a full-scale dc input.
2
Rev. D | Page 6 of 24
AD7441/AD7451
TIMING SPECIFICATIONS 1
VDD = 2.7 V to 5.25 V; fSCLK = 18 MHz; fS = 1 MSPS; VREF = 2.5 V; TA = TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
fSCLK 2
tCONVERT
tQUIET
t1
t2
t3 3
t4
t5
t6
t7
t8 4
tPOWER-UP 5
Limit at TMIN, TMAX
10
18
16 × tSCLK
888
60
10
10
20
40
0.4 tSCLK
0.4 tSCLK
10
10
35
1
Unit
kHz min
MHz max
Description
tSCLK = 1/fSCLK
ns max
ns min
ns min
ns min
ns max
ns max
ns min
ns min
ns min
ns min
ns max
μs max
Minimum quiet time between end of a serial read and next falling edge of CS
Minimum CS pulse width
CS falling edge to SCLK falling edge setup time
Delay from CS falling edge until SDATA three-state disabled
Data access time after SCLK falling edge
SCLK high pulse width
SCLK low pulse width
SCLK edge to data valid hold time
SCLK falling edge to SDATA, three-state enabled
SCLK falling edge to SDATA, three-state enabled
Power-up time from full power-down
1
Guaranteed by characterization. All input signals are specified with tRISE = tFALL = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. See Figure 2, Figure 3,
and the Serial Interface section.
2
Mark/space ratio for the SCLK input is 40/60 to 60/40.
3
Measured with the load circuit of Figure 4 and defined as the time required for the output to cross 0.8 V or 2.4 V with VDD = 5 V and the time required for an output to
cross 0.4 V or 2.0 V for VDD = 3 V.
4
t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 4. The measured number is then extrapolated
back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time (t8) quoted in the timing characteristics is the true bus relinquish
time of the part and is independent of the bus loading.
5
See the Power-Up Time section.
TIMING DIAGRAMS
t1
CS
1
SCLK
2
3
4
t3
5
0
0
4 LEADING ZEROS
B
13
14
0
DB11
15
t6
t7
t4
0
SDATA
tCONVERT
t5
DB10
DB2
16
t8
DB1
tQUIET
DB0
03153-002
t2
THREE-STATE
Figure 2. AD7451 Serial Interface Timing Diagram
t1
CS
1
SCLK
2
3
t3
SDATA
tCONVERT
t5
4
5
0
0
14
0
DB9
DB8
4 LEADING ZEROS
15
t6
t7
t4
0
B
13
DB0
16
t8
0
0
tQUIET
2 TRAILING ZEROS THREE-STATE
Figure 3. AD7441 Serial Interface Timing Diagram
Rev. D | Page 7 of 24
03153-003
t2
AD7441/AD7451
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
VDD to GND
VIN+ to GND
VIN– to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
VREF to GND
Input Current to any Pin Except Supplies 1
Operating Temperature Range
Commercial (A, B Version)
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
ESD
1
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
±10 mA
−40°C to +85°C
−65°C to +150°C
150°C
205.9°C/W (MSOP)
211.5°C/W (SOT-23)
43.74°C/W (MSOP)
91.99°C/W (SOT-23)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.6mA
TO OUTPUT
PIN
IOL
1.6V
CL
25pF
200µA
IOH
03153-004
TA = 25°C, unless otherwise noted.
Figure 4. Load Circuit for Digital Output Timing Specifications
ESD CAUTION
215°C
220°C
1 kV
Transient currents of up to 100 mA do not cause SCR latch-up.
Rev. D | Page 8 of 24
AD7441/AD7451
VIN+ 2
VIN– 3
AD7441/
AD7451
8
VDD
7
SCLK
6
SDATA
TOP VIEW
GND 4 (Not to Scale) 5 CS
VDD 1
SCLK 2
SDATA 3
AD7441/
AD7451
8
VREF
7
VIN+
VIN–
TOP VIEW
CS 4 (Not to Scale) 5 GND
03153-006
VREF 1
Figure 5. 8-Lead MSOP Pin Configuration
6
03153-005
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 6. 8-Lead SOT-23 Pin Configuration
Table 5. Pin Function Descriptions
Pin. No.
MSOP SOT-23
1
8
Mnemonic
VREF
2
3
7
6
VIN+
VIN–
4
5
GND
5
4
CS
6
3
SDATA
7
2
SCLK
8
1
VDD
Description
Reference Input for the AD7441/AD7451. An external reference in the range of 100 mV to VDD must be
applied to this input. The specified reference input is 2.5 V. This pin is decoupled to GND with a capacitor
of at least 0.1 μF.
Noninverting Analog Input.
Inverting Input. This pin sets the ground reference point for the VIN+ input. Connect to ground or to a dc
offset to provide a pseudo ground.
Analog Ground. Ground reference point for all circuitry on the AD7441/AD7451. All analog input signals
and any external reference signal are referred to this GND voltage.
Chip Select. Active low logic input. This input provides the dual function of initiating a conversion on
the AD7441/AD7451 and framing the serial data transfer.
Serial Data, Logic Output. The conversion result from the AD7441/AD7451 is provided on this output as
a serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream of
the AD7451 consists of four leading zeros followed by the 12 bits of conversion data that are provided
MSB first; the data stream of the AD7441 consists of four leading zeros, followed by the 10 bits of conversion data, followed by two trailing zeros. In both cases, the output coding is straight (natural) binary.
Serial Clock, Logic Input. SCLK provides the serial clock for accessing data from the part. This clock input
is also used as the clock source for the conversion process.
Power Supply Input. VDD is 2.7 V to 5.25 V. This supply is decoupled to GND with a 0.1 μF capacitor and a
10 μF tantalum capacitor.
Rev. D | Page 9 of 24
AD7441/AD7451
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, fS = 1 MSPS, fSCLK = 18 MHz, VDD = 2.7 V to 5.25 V, VREF = 2.5 V, unless otherwise noted.
75
1.0
VDD = 5.25V
0.6
DNL ERROR (LSB)
VDD = 4.75V
70
SINAD (dB)
0.8
VDD = 3.6V
65
VDD = 2.7V
0.4
0.2
0
–0.2
–0.4
60
–0.6
1000
–1.0
03153-007
100
FREQUENCY (kHz)
0
Figure 7. SINAD vs. Analog Input Frequency for the AD7451 for
Various Supply Voltages
2048
CODE
3072
4096
Figure 10. Typical DNL for the AD7451 for VDD = 5 V
1.0
0
100mV p-p SINE WAVE ON VDD
NO DECOUPLING ON VDD
0.8
–20
0.6
0.4
–60
INL ERROR (LSB)
–40
PSRR (dB)
1024
03153-010
–0.8
55
10
VDD = 3V
0
–0.2
VDD = 5V
–80
0.2
–0.4
–0.6
–100
100
200
300
400
500
600
700
800
900
1000
SUPPLY RIPPLE FREQUENCY (kHz)
–1.0
03153-008
0
0
–40
3072
4096
9949
CODES
9000
8000
7000
–60
COUNTS
SNR (dB)
10000
8192 POINT FFT
fSAMPLE = 1MSPS
fIN = 100kSPS
SINAD = 71dB
THD = –82dB
SFDR = –83dB
–20
2048
CODE
Figure 11. Typical INL for the AD7451 for VDD = 5 V
Figure 8. PSRR vs. Supply Ripple Frequency Without Supply Decoupling
0
1024
03153-011
–0.8
–120
–80
6000
5000
4000
3000
–100
2000
1000
0
100
200
300
400
FREQUENCY (kHz)
Figure 9. AD7451 Dynamic Performance for VDD = 5 V
500
0
2046
03153-009
–140
27 CODES
2047
24 CODES
2048
2049
CODES
2050
2051
03153-012
–120
Figure 12. Histogram of 10,000 Conversions of a DC Input for the AD7451
Rev. D | Page 10 of 24
AD7441/AD7451
4.0
0
3.5
8192 POINT FFT
fSAMPLE = 1MSPS
fIN = 100kSPS
SINAD = 61.7dB
THD = –81.7dB
SFDR = –82dB
–20
–40
2.5
2.0
SNR (dB)
1.5
1.0
–60
–80
POSITIVE DNL
0.5
–100
0
NEGATIVE DNL
–120
–0.5
0
1
2
3
4
5
VREF (V)
–140
03153-013
–1.0
0
100
200
300
400
500
VREF (V)
Figure 13. Change in DNL vs. VREF for VDD = 5 V
03153-016
CHANGE IN DNL (LSB)
3.0
Figure 16. AD7441 Dynamic Performance
0.5
5
0.4
4
DNL ERROR (LSB)
2
1
POSITIVE DNL
0
0.1
0
–0.1
–0.2
–0.4
0
1
2
3
4
5
VREF (V)
–0.5
0
512
CODE
768
1024
Figure 17. Typical DNL for the AD7441
Figure 14. Change in INL vs. VREF for VDD = 5 V
0.5
12
VDD = 3V
0.4
11
0.3
0.2
INL ERROR (LSB)
10
9
8
VDD = 5V
0.1
0
–0.1
–0.2
–0.3
7
6
0
1
2
3
4
VREF (V)
5
–0.5
0
256
512
CODE
768
Figure 18. Typical INL for the AD7441
Figure 15. ENOB vs. VREF for VDD = 5 V and 3 V
Rev. D | Page 11 of 24
1024
03153-018
–0.4
03153-015
EFFECTIVE NUMBER OF BITS
256
03153-017
–2
0.2
–0.3
NEGATIVE DNL
–1
03153-014
CHANGE IN INL (LSB)
0.3
3
AD7441/AD7451
TERMINOLOGY
Signal-to-(Noise + Distortion) Ratio (SINAD)
This is the measured ratio of SINAD at the output of the ADC.
The signal is the rms amplitude of the fundamental. Noise is
the sum of all nonfundamental signals up to half the sampling
frequency (fS/2), excluding dc. The ratio is dependent on the
number of quantization levels in the digitization process: the more
levels, the smaller the quantization noise. The theoretical SINAD
ratio for an ideal N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Therefore, for 12-bit converters, the SINAD is 74 dB; for 10-bit
converters, the SINAD is 62 dB.
Aperture Jitter
This is the sample-to-sample variation in the effective point in
time at which the actual sample is taken.
Full Power Bandwidth
The full power bandwidth of an ADC is that input frequency
at which the amplitude of the reconstructed fundamental is
reduced by 0.1 dB or 3 dB for a full-scale input.
Integral Nonlinearity (INL)
This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of harmonics to the
fundamental. In the AD7441/AD7451, THD is
THD (dB) = 20 log
Aperture Delay
This is the amount of time from the leading edge of the
sampling clock until the ADC actually takes the sample.
Differential Nonlinearity (DNL)
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
V2 2 + V3 2 + V4 2 + V5 2 + V6 2
V1
where:
V1 is the rms amplitude of the fundamental.
V2, V3, V4, V5, and V6 are the rms amplitudes of the second to
the sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic (spurious noise) is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2, excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is
a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, an active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb where m, n = 0,
1, 2, 3, and so on. Intermodulation distortion terms are those in
which neither m nor n are equal to zero. For example, the secondorder terms include (fa + fb) and (fa − fb), while the third-order
terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The AD7441/AD7451 are tested using the CCIF standard where
two input frequencies near the top end of the input bandwidth
are used. In this case, the second-order terms are usually distanced in frequency from the original sine waves while the
third-order terms are usually at a frequency close to the input
frequencies. As a result, the second- and third-order terms
are specified separately. The calculation of the intermodulation
distortion is as per the THD specification where it is the ratio of
the rms sum of the individual distortion products to the rms
amplitude of the sum of the fundamentals expressed in decibels.
Offset Error
This is the deviation of the first code transition (000…000 to
000…001) from the ideal (that is, AGND + 1 LSB).
Gain Error
This is the deviation of the last code transition (111…110 to
111…111) from the ideal (that is, VREF − 1 LSB) after the offset
error has been adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold acquisition time is the minimum time
required for the track-and-hold amplifier to remain in track
mode for its output to reach and settle to within 0.5 LSB of the
applied input signal.
Power Supply Rejection Ratio (PSRR)
The power supply rejection ratio is defined as the ratio of the
power in the ADC output at full-scale frequency (f) to the
power of a 100 mV p-p sine wave applied to the ADC VDD
supply of Frequency fS. The frequency of this input varies from
1 kHz to 1 MHz.
PSRR (dB) = 10log(Pf/Pfs)
where:
Pf is the power at Frequency f in the ADC output.
Pfs is the power at Frequency fs in the ADC output.
Rev. D | Page 12 of 24
AD7441/AD7451
THEORY OF OPERATION
The AD7441/AD7451 have a SAR ADC, an on-chip differential
track-and-hold amplifier, and a serial interface housed in either
an 8-lead SOT-23 or an MSOP package. The serial clock input
accesses data from the part and provides the clock source for
the SAR ADC. The AD7441/AD7451 feature a power-down
option for reduced power consumption between conversions.
The power-down feature is implemented across the standard
serial interface, as described in the Modes of Operation section.
When the ADC starts a conversion (see Figure 20), SW3 opens
and SW1 and SW2 move to Position B, causing the comparator
to become unbalanced. Both inputs are disconnected once the
conversion begins. The control logic and the charge redistribution DACs are used to add and subtract fixed amounts of charge
from the sampling capacitor arrays to bring the comparator
back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates
the ADC output code. The output impedances of the sources
driving the VIN+ and VIN– pins must be matched; otherwise the
two inputs have different settling times, resulting in errors.
CAPACITIVE
DAC
VIN+
A
SW1
A
B
SW2
VIN–
VREF
The AD7441/AD7451 are SAR ADCs based around two
capacitive DACs. Figure 19 and Figure 20 show simplified
schematics of the ADC in the acquisition and conversion phase,
respectively. The ADC is comprised of control logic, an SAR,
and two capacitive DACs. In Figure 19 (acquisition phase), SW3
is closed, SW1 and SW2 are in Position A, the comparator is
held in a balanced condition, and the sampling capacitor arrays
acquire the differential signal on the input.
CAPACITIVE
DAC
SW1
ADC TRANSFER FUNCTION
The output coding for the AD7441/AD7451 is straight (natural)
binary. The designed code transitions occur at successive LSB
values (1 LSB, 2 LSB, and so on). The LSB size of the AD7451
is VREF/4096, and the LSB size of the AD7441 is VREF/1024. The
ideal transfer characteristic of the AD7441/AD7451 is shown in
Figure 21.
A
B
SW2
CS
COMPARATOR
CAPACITIVE
DAC
03153-019
VREF
111...111
111...110
CONTROL
LOGIC
SW3
VIN–
COMPARATOR
Figure 20. ADC Conversion Phase
Figure 19. ADC Acquisition Phase
ADC CODE
A
CS
CAPACITIVE
DAC
CS
B
CONTROL
LOGIC
SW3
CONVERTER OPERATION
VIN+
CS
B
03153-020
The AD7441/AD7451 are 10-/12-bit, high speed, low power,
single-supply, successive approximation, analog-to-digital converters (ADCs) with a pseudo differential analog input. These
parts operate with a single 2.7 V to 5.25 V power supply and are
capable of throughput rates up to 1 MSPS when supplied with
an 18 MHz SCLK. The AD7441/AD7451 require an external
reference to be applied to the VREF pin.
1LSB = VREF /4096 (AD7451)
1LSB = VREF /1024 (AD7441)
111...000
011...111
000...010
000...001
000...000
0V 1LSB
VREF – 1LSB
ANALOG INPUT
03153-021
CIRCUIT INFORMATION
Figure 21. AD7441/AD7451 Ideal Transfer Characteristic
Rev. D | Page 13 of 24
AD7441/AD7451
TYPICAL CONNECTION DIAGRAM
R
0.1µF
10µF
2.7V TO 5.25V
SUPPLY
SERIAL
INTERFACE
VIN+
AD7441/
AD7451
SCLK
SDATA
DC INPUT
VOLTAGE
µC/µP
CS
VIN–
GND
VREF
2.5V
AD780
0.1µF
03153-022
VDD
VREF
p-p
Figure 22. Typical Connection Diagram
ANALOG INPUT
The AD7441/AD7451 have a pseudo differential analog input.
The VIN+ input is coupled to the signal source and must have an
amplitude of VREF p-p to make use of the full dynamic range of
the part. A dc input is applied to the VIN–. The voltage applied to
this input provides an offset from ground or a pseudo ground
for the VIN+ input. Pseudo differential inputs separate the analog
input signal ground from the ADC ground, allowing dc commonmode voltages to be cancelled.
+1.25V
0V
–1.25V
VIN+
R
VIN+
3R
AD7441/
AD7451
R
VIN–
0.1µF
VREF
03153-023
Figure 22 shows a typical connection diagram for the device.
In this setup, the GND pin is connected to the analog ground
plane of the system. The VREF pin is connected to the AD780,
a 2.5 V decoupled reference source. The signal source is connected
to the VIN+ analog input via a unity gain buffer. A dc voltage is
connected to the VIN– pin to provide a pseudo ground for the
VIN+ input. The VDD pin is decoupled to AGND with a 10 μF
tantalum capacitor in parallel with a 0.1 μF ceramic capacitor.
The reference pin is decoupled to AGND with a capacitor of at
least 0.1 μF. The conversion result is output in a 16-bit word
with four leading zeros followed by the MSB of the 12-bit or
10-bit result. The 10-bit result of the AD7441 is followed by two
trailing zeros.
2.5V
1.25V
0V
EXTERNAL
VREF (2.5V)
Figure 23. Op Amp Configuration to Level Shift a Bipolar Input Signal
ANALOG INPUT STRUCTURE
Figure 24 shows the equivalent circuit of the analog input
structure of the AD7441/AD7451. The four diodes provide
ESD protection for the analog inputs. Care must be taken to
ensure that the analog input signals never exceed the supply
rails by more than 300 mV. This causes these diodes to become
forward-biased and start conducting into the substrate. These
diodes can conduct up to 10 mA without causing irreversible
damage to the part. The C1 capacitors (see Figure 24) are
typically 4 pF and can be attributed primarily to pin capacitance. The resistors are lumped components made up of
the on resistance of the switches. The value of these resistors
is typically about 100 Ω. The C2 capacitors are the ADC
sampling capacitors and have a capacitance of 16 pF typically.
For ac applications, removing high frequency components from
the analog input signal through the use of an RC low-pass filter
on the relevant analog input pins is recommended. In applications where harmonic distortion and the signal-to-noise ratio
are critical, it is recommended that the analog input be driven
from a low impedance source. Large source impedances
significantly affect the ac performance of the ADC, which can
necessitate the use of an input buffer amplifier. The choice of
the amplifier is a function of the particular application.
Because the ADC operates from a single supply, it is necessary
to level shift ground-based bipolar signals to comply with the
input requirements. An op amp (for example, the AD8021) can
be configured to rescale and level shift a ground-based (bipolar)
signal so that it is compatible with the input range of the AD7441/
AD7451 (see Figure 23).
VDD
D
VIN+
C1
C2
R1
C2
D
VDD
D
VIN–
C1
D
03153-024
When a conversion takes place, the pseudo ground corresponds
to 0, and the maximum analog input corresponds to 4096 for
the AD7451 and 1024 for the AD7441.
R1
Figure 24. Equivalent Analog Input Circuit;
Conversion Phase—Switches Open;
Track Phase—Switches Closed
Rev. D | Page 14 of 24
AD7441/AD7451
DIGITAL INPUTS
When no amplifier is used to drive the analog input, it is
recommended that the source impedance be limited to low
values. The maximum source impedance depends on the
amount of total harmonic distortion that can be tolerated.
The THD increases as the source impedance increases and
performance degrades.
The digital inputs applied to the AD7441/AD7451 are not limited
by the maximum ratings that limit the analog inputs. Instead,
the digital inputs applied, that is, CS and SCLK, can go to 7 V
and are not restricted by the VDD + 0.3 V limits as on the analog
input. The main advantage of the inputs not being restricted to
the VDD + 0.3 V limit is that power supply sequencing issues are
avoided. If CS or SCLK are applied before VDD, there is no risk
of latch-up as there would be on the analog inputs if a signal
greater than 0.3 V were applied prior to VDD.
Figure 25 shows a graph of THD vs. analog input signal
frequency for different source impedances.
–10
TA = 25°C
VDD = 5V
REFERENCE
–20
THD (dB)
–30
–40
–50
200Ω
–60
–70
100Ω
–80
–90
100k
10Ω
1M
INPUT FREQUENCY (Hz)
03153-025
62Ω
–100
10k
An external source is required to supply the reference to the
AD7441/AD7451. This reference input can range from 100 mV
to VDD. The specified reference is 2.5 V for the power supply
range 2.7 V to 5.25 V. The reference input chosen for an application must never be greater than the power supply. Errors in
the reference source result in gain errors in the AD7441/AD7451
transfer function and add to the specified full-scale errors of the
part. A capacitor of at least 0.1 μF must be placed on the VREF
pin. Suitable reference sources for the AD7441/AD7451 include
the AD780 and the ADR421. Figure 27 shows a typical connection diagram for the VREF pin.
Figure 25. THD vs. Analog Input Frequency for Various Source Impedances
VDD
Figure 26 shows a graph of THD vs. analog input frequency for
various supply voltages while sampling at 1 MSPS with an SCLK
of 18 MHz. In this case, the source impedance is 10 Ω.
NC
VDD
–50
TA = 25°C
0.1µF
–55
THD (dB)
2 VIN
7
3 TEMP VOUT
6
NC
2.5V
4 GND
TRIM 5
NC
VREF
0.1µF
Figure 27. Typical VREF Connection Diagram for VDD = 5 V
VDD = 2.7V
VDD = 3.6V
VDD = 4.75V
–80
–85
100
INPUT FREQUENCY (kHz)
1000
03153-026
VDD = 5.25V
–90
10
0.1µF
NC
*ADDITIONAL PINS OMITTED FOR CLARITY.
–65
–75
10nF
OPSEL 8
1
NC = NO CONNECT
–60
–70
AD7441/
AD7451*
AD780
Figure 26. THD vs. Analog Input Frequency for Various Supply Voltages
Rev. D | Page 15 of 24
03153-027
0
AD7441/AD7451
SERIAL INTERFACE
Figure 2 and Figure 3 show detailed timing diagrams for the
serial interface of the AD7451 and the AD7441, respectively.
The serial clock provides the conversion clock and also controls
the transfer of data from the device during conversion.
CS initiates the conversion process and frames the data transfer.
The falling edge of CS puts the track-and-hold into hold mode
and takes the bus out of three-state. The analog input is sampled
and the conversion initiated at this point. The conversion requires
16 SCLK cycles to complete.
Once 13 SCLK falling edges have occurred, the track-and-hold
goes back into track mode on the next SCLK rising edge, as
shown at Point B in Figure 2 and Figure 3. On the 16th SCLK
falling edge, the SDATA line goes back into three-state.
If the rising edge of CS occurs before 16 SCLKs have elapsed,
the conversion is terminated and the SDATA line goes back into
three-state.
The conversion result from the AD7441/AD7451 is provided on
the SDATA output as a serial data stream. The bits are clocked
out on the falling edge of the SCLK input. The data stream of
the AD7451 consists of four leading zeros followed by 12 bits
of conversion data, provided MSB first. The data stream of the
AD7441 consists of four leading zeros, followed by the 10 bits
of conversion data, followed by two trailing zeros, which is also
provided MSB first. In both cases, the output coding is straight
(natural) binary.
Sixteen serial clock cycles are required to perform a conversion
and to access data from the AD7441/AD7451. CS going low
provides the first leading zero to be read in by the DSP or the
microcontroller. The remaining data is then clocked out on the
subsequent SCLK falling edges, beginning with the second leading
zero. Thus, the first falling clock edge on the serial clock provides the second leading zero. The final bit in the data transfer
is valid on the 16th falling edge, having been clocked out on the
previous (15th) falling edge. Once the conversion is complete
and the data has been accessed after the 16 clock cycles, it is
important to ensure that, before the next conversion is initiated,
enough time is left to meet the acquisition and quiet-time specifications (see the Timing Example 1 and Timing Example 2
sections). To achieve 1 MSPS with an 18 MHz clock, an 18-clock
burst performs the conversion and leaves enough time before the
next conversion for the acquisition and quiet time.
In applications with slower SCLKs, it is possible to read in data
on each SCLK rising edge; that is, the first rising edge of SCLK
after the CS falling edge has the leading zero provided, and the
15th SCLK edge has DB0 provided.
Rev. D | Page 16 of 24
AD7441/AD7451
Timing Example 1
Timing Example 2
Having fSCLK = 18 MHz and a throughput rate of 1 MSPS gives a
cycle time of
Having fSCLK = 5 MHz and a throughput rate of 315 kSPS gives a
cycle time of
1/Throughput = 1/315,000 = 3.174 μs
1/Throughput = 1/1,000,000 = 1 μs
A cycle consists of
A cycle consists of
t2 + 12.5 (1/fSCLK) + tACQUISITION = 3.174 μs
t2 + 12.5 (1/fSCLK) + tACQUISITION = 1 μs
Therefore, if t2 is 10 ns, then
Therefore, if t2 = 10 ns, then
10 ns + 12.5 (1/5 MHz) + tACQUISITION = 3.174 μs
tACQUISITION = 664 ns
10 ns + 12.5 (1/18 MHz) + tACQUISITION = 1 μs
tACQUISITION = 296 ns
This 296 ns satisfies the requirement of 290 ns for tACQUISITION.
This 664 ns satisfies the requirement of 290 ns for tACQUISITION.
From Figure 28, tACQUISITION comprises
From Figure 28, tACQUISITION comprises
2.5 (1/fSCLK) + t8 = tQUIET
2.5 (1/fSCLK) + t8 = tQUIET
where t8 = 35 ns. This allows a value of 129 ns for tQUIET,
satisfying the minimum requirement of 60 ns.
where t8 = 35 ns. This allows a value of 122 ns for tQUIET,
satisfying the minimum requirement of 60 ns.
As in this example and with other slower clock values, the signal
can already be acquired before the conversion is complete, but it
is still necessary to leave 60 ns minimum tQUIET between conversions. In Example 2, the signal is fully acquired at approximately
Point C in Figure 28.
CS
10ns
t2
1
2
3
4
5
B
13
C
14
t6
15
16
t8
tQUIET
12.5(1/ fSCLK )
tACQUISITION
1/THROUGHPUT
Figure 28. Serial Interface Timing Example
Rev. D | Page 17 of 24
03153-028
SCLK
tCONVERT
t5
AD7441/AD7451
MODES OF OPERATION
The operating mode of the AD7441/AD7451 is selected by
controlling the logic state of the CS signal during a conversion.
There are two operating modes: normal mode and power-down
mode. The point at which CS is pulled high after the conversion
is initiated determines whether the part enters power-down mode.
Similarly, if already in power-down, CS controls whether the
device returns to normal operation or remains in power-down.
These modes provide flexible power management options that
can optimize the power dissipation/throughput rate ratio for
differing application requirements.
NORMAL MODE
This mode is intended for fastest throughput rate performance.
The user does not have to worry about any power-up times with
the AD7441/AD7451 remaining fully powered up all the time.
Figure 29 shows the general diagram of the operation of the
AD7441/AD7451 in this mode. The conversion is initiated
on the falling edge of CS (see the Serial Interface section). To
ensure that the part remains fully powered up, CS must remain
low until at least 10 SCLK falling edges elapse after the falling
edge of CS.
If CS is brought high any time after the 10th SCLK falling edge,
but before the 16th SCLK falling edge, the part remains powered up, however the conversion is terminated and SDATA goes
back into three-state. Sixteen serial clock cycles are required to
complete the conversion and access the complete conversion
result. CS can idle high until the next conversion or can idle
low until sometime prior to the next conversion. Once a data
transfer is complete—that is, when SDATA has returned to
three-state—another conversion can be initiated after the
quiet time, tQUIET, elapses again bringing CS low.
POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required; either the ADC is powered
down between each conversion or a series of conversions can
be performed at a high throughput rate and the ADC is then
powered down for a relatively long duration between these
bursts of conversions. When the AD7441/AD7451 are in
power-down mode, all analog circuitry is powered down.
For the AD7441/AD7451 to enter power-down mode, the
conversion process must be interrupted by bringing CS high
anywhere after the second falling edge of SCLK and before
the 10th falling edge of SCLK, as shown in Figure 30.
Once CS has been brought high in this window of SCLKs, the
part enters power-down, the conversion that was initiated by
the falling edge of CS is terminated, and SDATA goes back into
three-state. The time from the rising edge of CS to SDATA
three-state enabled is never greater than t8 (see the Timing
Specifications section). If CS is brought high before the second
SCLK falling edge, the part remains in normal mode and does
not power down. This avoids accidental power-down due to
glitches on the CS line.
To exit power-down mode and power up the AD7441/AD7451
again, a dummy conversion is performed. On the falling edge
of CS, the device begins to power up and continues to do so
as long as CS is held low until after the falling edge of the 10th
SCLK. The device is fully powered up after 1 μs has elapsed and,
as shown in Figure 31, valid data results from the next
conversion.
CS
SCLK
1 2
10
SCLK
1
10
SDATA
16
THREE-STATE
4 LEADING ZEROS + CONVERSION RESULT
03153-029
Figure 30. Entering Power-Down Mode
SDATA
Figure 29. Normal Mode Operation
Rev. D | Page 18 of 24
03153-030
CS
AD7441/AD7451
tPOWER-UP
PART BEGINS
TO POWER UP
CS
A
THIS PART IS FULLY POWERED
UP WITH VIN FULLY ACQUIRED
1
10
16
1
10
16
SDATA
INVALID DATA
VALID DATA
03153-031
SCLK
Figure 31. Exiting Power-Down Mode
If CS is brought high before the 10th falling edge of SCLK, the
AD7441/AD7451 again go back into power-down. This avoids
accidental power-up due to glitches on the CS line or an inadvertent burst of eight SCLK cycles while CS is low. So although
the device may begin to power up on the falling edge of CS, it
again powers down on the rising edge of CS as long as it occurs
before the 10th SCLK falling edge.
For example, when a 5 MHz SCLK frequency is applied to the
ADC, the cycle time is 3.2 μs (that is, 1/(5 MHz) × 16). In one
dummy cycle, 3.2 μs, the part is powered up, and VIN is acquired
fully. However, after 1 μs with a five MHz SCLK, only five SCLK
cycles elapse. At this stage, the ADC is fully powered up and the
signal acquired. Therefore, in this case, the CS can be brought
high after the 10th SCLK falling edge and brought low again
after a time, tQUIET, to initiate the conversion.
Power-Up Time
The power-up time of the AD7441/AD7451 is typically 1 μs,
which means that with any frequency of SCLK up to 18 MHz,
one dummy cycle is always sufficient to allow the device to
power up. Once the dummy cycle is complete, the ADC is fully
powered up and the input signal is acquired properly. The quiet
time, tQUIET, must still be allowed—from the point at which the
bus goes back into three-state after the dummy conversion to
the next falling edge of CS.
When running at the maximum throughput rate of 1 MSPS,
the AD7441/AD7451 power up and acquire a signal within
±0.5 LSB in one dummy cycle, that is, 1 μs. When powering up
from the power-down mode with a dummy cycle, as in Figure 31,
the track-and-hold, which was in hold mode while the part was
powered down, returns to track mode after the first SCLK edge
the part receives after the falling edge of CS. This is shown as
Point A in Figure 31.
Although at any SCLK frequency one dummy cycle is sufficient
to power up the device and acquire VIN, it does not necessarily
mean that a full dummy cycle of 16 SCLKs must always elapse
to power up the device and acquire VIN fully; 1 μs is sufficient to
power up the device and acquire the input signal.
When power supplies are first applied to the AD7441/AD7451,
the ADC can power up either in power-down mode or normal
mode. For this reason, it is best to allow a dummy cycle to elapse
to ensure that the part is fully powered up before attempting a
valid conversion. Likewise, if the user wants the part to power
up in power-down mode, then the dummy cycle can be used to
ensure the device is in power-down mode by executing a cycle
such as that shown in Figure 30. Once supplies are applied to
the AD7441/AD7451, the power-up time is the same as that
when powering up from power-down mode. It takes approximately 1 μs to power up fully in normal mode. It is not necessary
to wait 1 μs before executing a dummy cycle to ensure the
desired mode of operation. Instead, the dummy cycle can
occur directly after power is supplied to the ADC. If the first
valid conversion is then performed directly after the dummy
conversion, care must be taken to ensure that adequate
acquisition time has been allowed.
As mentioned earlier, when powering up from the power-down
mode, the part returns to track mode upon the first SCLK edge
applied after the falling edge of CS. However, when the ADC
powers up initially after supplies are applied, the track-andhold is already in track mode. This means (assuming one has
the facility to monitor the ADC supply current) that if the ADC
powers up in the desired mode of operation, a dummy cycle is
not required to change mode. Thus, a dummy cycle is also not
required to place the track-and-hold into track.
Rev. D | Page 19 of 24
AD7441/AD7451
POWER VS. THROUGHPUT RATE
By using the power-down mode on the device when not converting, the average power consumption of the ADC decreases
at lower throughput rates. Figure 32 shows how, as the throughput rate is reduced, the device remains in its power-down state
longer and the average power consumption reduces accordingly.
For example, if the AD7441/AD7451 are operated in continuous
sampling mode with a throughput rate of 100 kSPS and an SCLK
of 18 MHz, and the device is placed in the power-down mode
between conversions, then the power consumption during
normal operation equals 9.25 mW maximum (for VDD = 5 V).
For optimum power performance in throughput rates above
320 kSPS, it is recommended that the serial clock frequency be
reduced.
MICROPROCESSOR AND DSP INTERFACING
The serial interface on the AD7441/AD7451 allows the part to
be connected directly to a range of different microprocessors.
This section explains how to interface the AD7441/AD7451
with some of the more common microcontroller and DSP serial
interface protocols.
AD7441/AD7451 to ADSP-21xx
If the power-up time is one dummy cycle (1 μs) and the remaining conversion time is another cycle (1 μs), then the AD7441/
AD7451 can be said to dissipate 9.25 mW for 2 μs during each
conversion cycle. (This power consumption figure assumes a
very short time to enter power-down mode. This power figure
increases as the burst of clocks used to enter power-down mode
is increased). The AD7441/AD7451 consume just 5 μW for the
remaining 8 μs.
The ADSP-21xx family of DSPs is interfaced directly to the
AD7441/AD7451 without any glue logic required. The SPORT
control register is set up as follows:
TFSW = RFSW = 1
Alternate framing
INVRFS = INVTFS = 1
Active low frame signal
DTYPE = 00
Right justify data
Calculate the power numbers in Figure 32 as follows:
SLEN = 1111
16-bit data-words
If the throughput rate = 100 kSPS, then the cycle time = 10 μs,
and the average power dissipated during each cycle is
ISCLK = 1
Internal serial clock
TFSR = RFSR = 1
Frame every word
(2/10) × 9.25 mW = 1.85 mW
IRFS = 0
For the same scenario, if VDD = 3 V, the power dissipation
during normal operation is 4 mW maximum.
ITFS = 1
The AD7441/AD7451 can now be said to dissipate 4 mW for
2 μs during each conversion cycle.
To implement power-down mode, SLEN is set to 1001 to issue
an 8-bit SCLK burst.
The average power dissipated during each cycle with a
throughput rate of 100 kSPS is, therefore,
The connection diagram is shown in Figure 33. ADSP-21xx has
the TFS and RFS of the SPORT tied together, with TFS set as an
output and RFS set as an input. The DSP operates in alternate
framing mode, and the SPORT control register is set up as
described. The frame synchronization signal generated on the
TFS is tied to CS, and, as with all signal processing applications,
equidistant sampling is necessary. However, in this example,
the timer interrupt is used to control the sampling rate of the
ADC, and, under certain conditions, equidistant sampling
cannot be achieved.
(2/10) × 4 mW = 0.8 mW
100
VDD = 5V
1
VDD = 3V
ADSP-21xx*
AD7441/
AD7451*
0.1
SCLK
SCLK
DR
SDATA
RFS
CS
0
50
100
150
200
250
THROUGHPUT (kSPS)
300
350
Figure 32. Power vs. Throughput Rate for Power-Down Mode
TFS
*ADDITIONAL PINS REMOVED FOR CLARITY.
Figure 33. Interfacing to the ADSP-21xx
Rev. D | Page 20 of 24
03153-033
0.01
03153-032
POWER (mW)
10
AD7441/AD7451
For example, the ADSP-2111 has a master clock frequency of
16 MHz. If the SCLKDIV register is loaded with the value of 3,
an SCLK of 2 MHz is obtained and eight master clock periods
elapse for every one SCLK period. If the timer registers are
loaded with the value 803, 100.5 SCLKs occur between interrupts and subsequently between transmit instructions. This
situation results in nonequidistant sampling, because the
transmit instruction occurs on an SCLK edge. If the number
of SCLKs between interrupts is a whole integer figure of N,
equidistant sampling is implemented by the DSP.
AD7441/AD7451 to DSP56xxx
The connection diagram in Figure 35 shows how the AD7441/
AD7451 can be connected to the SSI (synchronous serial interface)
of the DSP56xxx family of DSPs from Motorola. The SSI is
operated in synchronous mode (SYN bit in CRB = 1) with
internally generated 1-bit clock period frame sync for both Tx
and Rx (Bit FSL1 = 1 and Bit FSL0 = 0 in CRB). Set the word
length to 16 by setting Bit WL1 = 1 and Bit WL0 = 0 in CRA. To
implement the power-down mode on the AD7441/AD7451, the
word length can be changed to eight bits by setting B it WL1 = 0
and Bit WL0 = 0 in CRA. Note that for signal processing applications, the frame synchronization signal from the DSP56xxx must
provide equidistant sampling.
AD7441/
AD7451*
DSP56xxx*
SCLK
SCLK
SDATA
SRD
CS
SR2
*ADDITIONAL PINS REMOVED FOR CLARITY.
Figure 35. Interfacing to the DSP56xxx
AD7441/AD7451 to TMS320C5x/C54x
The serial interface on the TMS320C5x/C54x uses a continuous
serial clock and frame synchronization signals to synchronize
the data transfer operations with peripheral devices such as the
AD7441/AD7451. The CS input allows easy interfacing between
the TMS320C5x/C54x and the AD7441/AD7451 without any
glue logic required. The serial port of the TMS320C5x/C54x is
set up to operate in burst mode with internal CLKx (Tx serial
clock) and FSx (Tx frame sync). The serial port control register
(SPC) must have the following setup: FO = 0, FSM = 1, MCM = 1,
and TXM = 1. The format bit, FO, can be set to 1 to set the word
length to eight bits in order to implement the power-down
mode on the AD7441/AD7451. The connection diagram is
shown in Figure 34. Note that for signal processing applications,
the frame synchronization signal from the TMS320C5x/ C54x
must provide equidistant sampling.
AD7441/
AD7451*
SCLK
TMS320C5x/
C54x*
CLKx
CLKR
SDATA
CS
DR
FSx
*ADDITIONAL PINS REMOVED FOR CLARITY.
03153-034
FSR
Figure 34. Interfacing to the TMS320C5x/C54x
Rev. D | Page 21 of 24
03153-035
The timer registers, for example, are loaded with a value that
provides an interrupt at the required sample interval. When an
interrupt is received, a value is transmitted with TFS/DT (ADC
control word). The TFS is used to control the RFS and, therefore, the reading of data. The frequency of the serial clock is set
in the SCLKDIV register. When the instruction to transmit with
TFS is given, that is, AX0 = TX0, the state of the SCLK is checked.
The DSP waits until the SCLK has gone high, low, and high
before starting transmission. If the timer and SCLK values are
chosen such that the instruction to transmit occurs on or near
the rising edge of SCLK, then the data can either be transmitted
or wait until the next clock edge.
AD7441/AD7451
GROUNDING AND LAYOUT HINTS
The printed circuit board that houses the AD7441/AD7451
must be designed so that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be easily separated.
A minimum etch technique is generally best for ground planes,
as it gives the best shielding. Digital and analog ground planes
must be joined in only one place: a star ground point established as close to the GND pin on the AD7441/AD7451 as
possible.
Avoid running digital lines under the device, as this couples
noise onto the die. The analog ground plane must be allowed to
run under the AD7441/AD7451 to avoid noise coupling. The
power supply lines to the AD7441/AD7451 must use as large
a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line.
Fast switching signals like clocks must be shielded with digital
grounds to avoid radiating noise to other sections of the board,
and clock signals must never run near the analog inputs. Avoid
crossover of digital and analog signals. Traces on opposite sides
of the board must run at right angles to each other. This reduces
the effects of feedthrough on the board. A microstrip technique is
by far the best but is not always possible with a double-sided board.
In this technique, the component side of the board is dedicated
to ground planes while signals are placed on the solder side.
Good decoupling is also important. All analog supplies must
be decoupled with 10 μF tantalum capacitors in parallel with
0.1 μF capacitors to GND. To achieve the best from these
decoupling components, they must be placed as close as
possible to the device.
EVALUATING PERFORMANCE
The evaluation board package includes a fully assembled and
tested evaluation board, documentation, and software for controlling the board from a PC via the evaluation board controller.
The evaluation board controller can be used in conjunction with
the AD7441 and the AD7451 evaluation boards, as well as with
many other Analog Devices, Inc. evaluation boards ending with
the CB designator, to demonstrate and evaluate the ac and dc
performance of the AD7441 and the AD7451.
The software allows the user to perform ac (fast Fourier transform)
and dc (histogram of codes) tests on the AD7441/AD7451. See
the AD7441/AD7451 application note that accompanies the
evaluation kit for more information.
Rev. D | Page 22 of 24
AD7441/AD7451
OUTLINE DIMENSIONS
3.00
2.90
2.80
1.70
1.60
1.50
8
7
6
5
1
2
3
4
3.00
2.80
2.60
PIN 1
INDICATOR
0.65 BSC
1.95
BSC
0.22 MAX
0.08 MIN
1.45 MAX
0.95 MIN
0.15 MAX
0.05 MIN
8°
4°
0°
SEATING
PLANE
0.38 MAX
0.22 MIN
0.60
BSC
0.60
0.45
0.30
121608-A
1.30
1.15
0.90
COMPLIANT TO JEDEC STANDARDS MO-178-BA
Figure 36. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters
3.20
3.00
2.80
3.20
3.00
2.80
8
1
5.15
4.90
4.65
5
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.40
0.25
6°
0°
0.23
0.09
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 37. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Rev. D | Page 23 of 24
0.80
0.55
0.40
100709-B
0.15
0.05
COPLANARITY
0.10
AD7441/AD7451
ORDERING GUIDE
Model 1
AD7451ARTZ-REEL7
AD7451ARMZ
AD7451BRMZ
AD7441BRTZ-R2
AD7441BRTZ-REEL7
AD7441BRMZ
EVAL-AD7451CBZ 3
EVAL-CONTROL BRD2 4
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Linearity Error (LSB) 2
± 1.5
± 1.5
±1
± 0.5
± 0.5
± 0.5
1
Package Description
8-Lead SOT-23
8-Lead MSOP
8-Lead MSOP
8-Lead SOT-23
8-Lead SOT-23
8-Lead MSOP
Evaluation Board
Controller Board
Package Option
RJ-8
RM-8
RM-8
RJ-8
RJ-8
RM-8
Branding
C3T
C3T
C3U
C4M
C4M
C4M
Z = RoHS Compliant Part.
Linearity error here refers to integral nonlinearity error.
3
This can be used as a standalone evaluation board or in conjunction with the evaluation board controller for evaluation/demonstration purposes.
4
The evaluation board controller is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
To order a complete evaluation kit, you must order the ADC evaluation board (EVAL-AD7451CB or EVAL-AD7441CB), the EVAL-CONTROL BRD2, and a 12 V ac
transformer. See the AD7451/AD7441 application note that accompanies the evaluation kit for more information.
2
©2003–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03153-0-3/10(D)
Rev. D | Page 24 of 24