DRV102
DRV
102
DRV
102
SBVS009B – JANUARY 1998 – REVISED MAY 2009
www.ti.com
PWM SOLENOID/VALVE DRIVER
FEATURES
APPLICATIONS
● HIGH OUTPUT DRIVE: 2.7A
● WIDE SUPPLY RANGE: +8V to +60V
● COMPLETE FUNCTION
PWM Output
Internal 24kHz Oscillator
Digital Control Input
Adjustable Delay and Duty Cycle
Over/Under Current Indicator
● FULLY PROTECTED
Thermal Shutdown with Indicator
Internal Current Limit
● POWER PACKAGES: 7-Lead TO-220 and
7-Lead Surface-Mount DDPAK
● ELECTROMECHANICAL DRIVERS:
Solenoids
Positioners
Actuators
High Power Relays/Contactors
Valves
Clutches/Brakes
● SOLENOID OVERHEAT PROTECTORS
● FLUID AND GAS FLOW CONTROLLERS
● PART HANDLERS
● ELECTRICAL HEATERS/COOLERS
● MOTOR SPEED CONTROLLERS
● INDUSTRIAL CONTROL
● FACTORY AUTOMATION
● MEDICAL ANALYSIS
● PHOTOGRAPHIC PROCESSING
DESCRIPTION
The DRV102 can be set to provide a strong initial
closure, automatically switching to a soft hold mode for
power savings. Duty cycle can be controlled by a
resistor, analog voltage, or digital-to-analog converter
for versatility. A flag output indicates thermal shutdown
and over/under current limit. A wide supply range
allows use with a variety of actuators.
The DRV102 is available in a 7-lead staggered TO-220
package and a 7-lead surface-mount DDPAK plastic
power package. It operates from –55°C to +125°C.
The DRV102 is a high-side power switch employing a
pulse-width modulated (PWM) output. Its rugged design is optimized for driving electromechanical devices
such as valves, solenoids, relays, actuators, and
positioners. The DRV102 is also ideal for driving
thermal devices such as heaters and lamps. PWM
operation conserves power and reduces heat rise in
the device, resulting in higher reliability. In addition,
adjustable PWM allows fine control of the power
delivered to the load. Time from dc output to PWM
output is externally adjustable.
Flag
7
DRV102
Thermal Shutdown
Over/Under Current
5
Input
1
PWM
On (TTL-Compatible)
Off
(+8V to +60V)
VS
24kHz
Oscillator
6
Delay
Out
Load
Gnd(1) 4
2
3
Delay
Adjust
Duty Cycle
Adjust
(Gnd electrically
connected to tab)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 1998-2009, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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SPECIFICATIONS
At TC = +25°C, VS = +24V, load = series diode MUR415 and 100Ω, and 4.99kΩ Flag pull-up to +5V, unless otherwise noted.
DRV102T, F
PARAMETER
OUTPUT
Output Saturation Voltage, Source
Current Limit
Under-Scale Current
Leakage Current
DIGITAL CONTROL INPUT(1)
VCTR Low (output disabled)
VCTR High (output enabled)
ICTR Low (output disabled)
ICTR High (output enabled)
Propagation Delay: On-to-Off
Off-to-On
DELAY TO PWM(3)
Delay Equation(4)
Delay Time
Minimum Delay Time(5)
DUTY CYCLE ADJUST
Duty Cycle Range
Duty Cycle Accuracy
vs Supply Voltage
Nonlinearity(6)
DYNAMIC RESPONSE
Output Voltage Rise Time
Output Voltage Fall Time
Oscillator Frequency
FLAG
Normal Operation
Fault(7)
Sink Current
Under-Current Flag: Set
Reset
Over-Current Flag: Set
Reset
CONDITIONS
MIN
TYP
MAX
UNITS
2
+1.7
+1.3
2.7
16
±0.01
+2.2
+1.7
3.4
V
V
A
mA
mA
IO = 1A
IO = 0.1A
Output Transistor Off, VS = +60V, VO = 0V
0
+2.2
TEMPERATURE RANGE
Specified Range
Storage Range
Thermal Resistance, θJC
7-Lead DDPAK, 7-Lead TO-220
Thermal Resistance, θJA
7-Lead DDPAK, 7-Lead TO-220
+1.2
VS
–80(2)
20(2)
0.9
1.8
VCTR = 0V
VCTR = +5V
V
V
µA
µA
µs
µs
dc to PWM Mode
CD = 0.1µF
CD = 0
Delay to PWM ≈ CD • 106 (CD in F)
80
97
110
15
49% Duty Cycle, RPWM = 25.5kΩ
49% Duty Cycle, VS = 8V to 60V
20% to 80% Duty Cycle
VO = 10% to 90% of VS
VO = 90% to 10% of VS
19
20kΩ Pull-Up to +5V, IO < 1.5A
Sinking 1mA
VFLAG = 0.4V
+4
THERMAL SHUTDOWN
Junction Temperature
Shutdown
Reset from Shutdown
POWER SUPPLY
Specified Operating Voltage
Operating Voltage Range
Quiescent Current
±2
10 to 90
±1
±1
±2
±7
±5
%
%
%
% FSR
0.25
0.25
24
2.5
2.5
29
µs
µs
kHz
+4.9
+0.2
2
5.2
11
5.2
11.5
+0.4
+24
+8
6.5
–55
–55
No Heat Sink
V
V
mA
µs
µs
µs
µs
°C
°C
+165
+150
IO = 0
s
ms
µs
+60
9
V
V
mA
+125
+125
°C
°C
3
°C/W
65
°C/W
NOTES: (1) Logic high enables output (normal operation). (2) Negative conventional current flows out of the terminals. (3) Constant dc output to PWM (pulse-width
modulated) time. (4) Maximum delay is determined by an external capacitor. Pulling the Delay Adjust pin low corresponds to an infinite (continuous) delay.
(5) Connecting the Delay Adjust pin to +5V reduces delay time to 3µs. (6) VIN at pin 3 to percent of duty cycle at pin 6. (7) A fault results from over-temperature,
over-current, or under-current conditions.
2
DRV102
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SBVS009B
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS(1)
Top Front View
TO-220, DDPAK
7-Lead
Stagger-Formed
TO-220
1 2 3 4 5 6 7
7-Lead
DDPAK
Surface-Mount
PWM
VS
Delay Gnd
PWM
VS
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Vapor-phase or IR reflow techniques are recommended for soldering the DRV102F surface-mount package. Wave soldering
is not recommended due to excessive thermal shock and “shadowing” of
nearby devices.
ELECTROSTATIC
DISCHARGE SENSITIVITY
1 2 3 4 5 6 7
In
In
Supply Voltage, VS .............................................................................. 60V
Input Voltage .......................................................................... –0.2V to VS
PWM Adjust Input ................................................ –0.2V to VS (24V max)
Delay Adjust Input ................................................ –0.2V to VS (24V max)
Operating Temperature Range ...................................... –55°C to +125°C
Storage Temperature Range ......................................... –55°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s)(2) ........................................... +300°C
Flag
Out
Flag
Delay Gnd Out
NOTE: Tabs are electrically connected to ground (pin 4).
This integrated circuit can be damaged by ESD. Texas Instruments
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see the Package Ordering Addendum at the end of this data sheet.
DRV102
SBVS009B
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3
PIN DESCRIPTIONS
PIN #
NAME
DESCRIPTION
Pin 1
Input
The input is compatible with standard TTL levels. The device output becomes enabled when the input voltage is driven above
the typical switching threshold, 1.7V. Below this level, the output is disabled. With no connection to the pin, the input level rises
to 3.4V. Input current is 20µA when driven high and 80µA with the input low. The input may be driven to the power supply (VS)
without damage.
Pin 2
Delay Adjust
This pin sets the duration of the initial 100% duty cycle before the output goes into PWM mode. Leaving this pin floating results
in a delay of approximately 15µs, which is internally limited by parasitic capacitance. Minimum delay may be reduced to less
than 3µs by tying the pin to 5V. This pin connects internally to a 3µA current source from VS and to a 3V threshold comparator.
When the pin voltage is below 3V, the output device is 100% on. The PWM oscillator is not synchronized to the Input (pin 1),
so the first pulse may be extended by any portion of the programmed duty cycle.
Pin 3
Duty Cycle Adjust
(PWM)
Internally, this pin connects to the input of a comparator and a 19kΩ resistor to ground. It is driven by a 200µA current source
from VS. The voltage at this node linearly sets the duty cycle. Duty cycle can be programmed with a resistor, analog voltage,
or output of a D/A converter. The active voltage range is from 0.55V to 3.7V to facilitate the use of single-supply control
electronics. At 0.56V (or RPWM = 4.4kΩ), duty cycle is near 90%. Swing to ground should be limited to no lower than 0.1V. PWM
frequency is a constant 24kHz.
Pin 4
Ground
This pin is electrically connected to the package tab. It must be connected to system ground for the DRV102 to function. It
carries the 6.5mA quiescent current.
Pin 5
VS
This is the power supply pin. Operating range is +8V to +60V.
Pin 6
Out
The output is the emitter of a power npn with the collector connected to VS. Low power dissipation in the DRV102 is obtained
by low saturation voltage and fast switching transitions. Rise time is less than 250ns, fall time depends on load impedance.
A flyback diode is (D1) needed with inductive loads to conduct the load current during the off cycle. The external diode should
be selected for low forward voltage. The internal clamp diode provides protection but should not be used to conduct load
currents. An additional diode (D2), located in series with Out pin, is required for inductive loads.
Pin 7
Flag
Normally high (active low), the Flag signals either an over-temperature, over-current, or under-current fault. The over/undercurrent flags are true only when the output is on (constant dc output or the “on” portion of PWM mode). A thermal fault (thermal
shutdown) occurs when the die surface reaches approximately 165°C and latches until the die cools to 150°C. Its output
requires a pull-up resistor. It can typically sink two milliamps, sufficient to drive a low-current LED.
LOGIC BLOCK DIAGRAM
Flag
7
DRV102
Over/Under Current
5
VS
Thermal
Shutdown
Input
1
PWM
On
Off
(+8V to +60V)
6
Delay
Out
(2)
D2
D1
2
CD
3
Gnd
(1)
Load
4
RPWM
NOTES: (1) Schottky Power Rectifier for low
power dissipation. (2) Schottky or appropriately
rated silicon diode.
4
DRV102
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SBVS009B
TYPICAL PERFORMANCE CURVES
At TC = +25°C and VS = +24V, unless otherwise noted.
DUTY CYCLE vs TEMPERATURE
DUTY CYCLE and DUTY CYCLE ERROR vs VOLTAGE
90
RPWM = 25.5kΩ
6
70
4
IO = 0.1A
60
2
Error
50
0
40
–2
IO = 1A
30
–4
53
VS = +8V
Duty Cycle (%)
Duty Cycle
Duty Cycle Error (%)
80
Duty Cycle (%)
54
8
IO = 0.1A to 1A
20
0.5
1.0
1.5
2.0
2.5
3.0
3.5
50
VS = +60V
48
–8
0
VS = +24V
51
49
–6
10
52
–75
4.0
–50
–25
0
25
50
75
100
125
Temperature (°C)
VPWM (V)
CURRENT LIMIT vs TEMPERATURE
OUTPUT SATURATION VOLTAGE vs TEMPERATURE
3.25
2.25
VS = +8V, Load = 1Ω
3
IO = 2A
IO = 1.5A
1.75
IO = 1A
1.5
1.25
IO = 0.1A
Current Limit (mA)
Saturation Voltage (V)
2
VS = +60V, Load = 5Ω
2.75
2.5
VS = +24V, Load = 5Ω
2.25
1
2
0.75
–75
–50
–25
0
25
50
75
100
–75
125
–50
–25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
QUIESCENT CURRENT vs TEMPERATURE
UNDER-SCALE CURRENT vs TEMPERATURE
20
8
7.5
Under-Scale Current (mA)
Quiescent Current (mA)
VS = +8V to +60V
VS = +60V
7
VS = +24V
6.5
6
18
16
14
12
VS = +8V
10
5.5
–75
–50
–25
0
25
50
75
100
125
–75
Temperature (°C)
–25
0
25
50
75
100
125
Temperature (°C)
DRV102
SBVS009B
–50
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5
TYPICAL PERFORMANCE CURVES
(CONT)
At TC = +25°C and VS = +24V, unless otherwise noted.
FLAG OPERATION
OVER-CURRENT LIMIT
(VS = +60V, CD = 220pF, RPWM = 25.5kΩ, Load = 350mH || 47Ω)
Onset of current limit where
VOUT begins to drop
60V
VIN
VOUT
60V
FLAG OPERATION
UNDER-CURRENT
(VS = +60V, CD = 120pF, RPWM = 25.5kΩ, No Load)
40V
20V
20V
VFLAG
4V
2V
Flag only set during
constant output mode
or “ON” portion of
PWM mode
Flag only on during constant output
or “ON” portion of PWM mode
0
4V
VFLAG
0
40V
2V
0
0
Constant Output
50µs/div
50µs/div
DC TO PWM MODE
DRIVING INDUCTIVE LOAD
(VS = +60V, CD = 120pF, RPWM = 30.1kΩ, Load = 350mH)
TYPICAL SOLENOID CURRENT WAVEFORM
(VS = +60V, CD = 0.1µF, RPWM = 30.1kΩ, Load = 350mH)
4V
VIN
VOUT
60V
40V
0
Solenoid
Motion
Period
20V
{
1A
0.5A
0
Inductive load ramp current
Solenoid Current
0
ISUPPLY
PWM Mode
1A
PWM Mode
0.5A
0
Solenoid Closure
25ms/div
50µs/div
CURRENT LIMIT REPSONSE
(Load = 1Ω, 2kΩ pull-up to +5V on Flag pin)
OSCILLATOR FREQUENCY vs TEMPERATURE
5V
Oscillator Frequency (kHz)
VFLAG
24.2
2.5V
0
IOUT
3A
2A
1A
0
24.0
VS = +8V
23.8
23.6
VS = +60V
23.4
–75 –55 –35
10µs/div
–15
5
25
45
65
85
105 125
Temperature (°C)
6
DRV102
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SBVS009B
TYPICAL PERFORMANCE CURVES
(CONT)
At TC = +25°C and VS = +24V, unless otherwise noted.
NOMINAL DELAY TIME TO PWM vs TEMPERATURE
OUTPUT LEAKAGE CURRENT vs TEMPERATURE
103
–200
Output Transistor Off
VO = 0V
–175
99
–150
Delay (ms)
Leakage Current (µA)
CD = 0.1µF
VS = +8V
101
VS = +60V
–125
VS = +24V
97
95
VS = +24V
VS = +60V
–100
93
VS = +8V
–75
91
–75 –55 –35
–15
5
25
45
65
85
–75
105 125
–25
0
25
50
75
Temperature (°C)
CURRENT LIMIT
PRODUCTION DISTRIBUTION
DELAY TIME TO PWM
PRODUCTION DISTRIBUTION
100
125
60
40
Typical distribution
of packaged units.
DRV102F and
DRV102T included.
30
Typical distribution
of packaged units.
DRV102F and
DRV102T included.
CD = 0.1µF
50
Percent of Units (%)
35
Percent of Units (%)
–50
Temperature (°C)
25
20
15
10
40
30
20
10
5
0
0
80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110
2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
Delay Time to PWM (ms)
Current Limit (A)
DUTY CYCLE ACCURACY
PRODUCTION DISTRIBUTION
30
Nominal Duty Cycle = 49%
RPWM = 25.5kΩ
Percent of Units (%)
25
Typical distribution
of packaged units.
DRV102F and
DRV102T included.
20
15
10
5
0
–7
–6 –5
–4 –3
–2 –1
0
1
2
3
4
5
6
7
Duty Cycle Accuracy (%)
DRV102
SBVS009B
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7
BASIC OPERATION
pin connected to 0.1µF and duty cycle set for 25%. See the
“Delay Adjust” and “Duty Cycle Adjust” text for equations
and further explanation.
The DRV102 is a high-side, bipolar power switch employing a pulse-width modulated (PWM) output for driving
electromechanical and thermal devices. Its design is optimized for two types of applications: a two-state driver
(open/close) for loads such as solenoids and actuators, and
a linear driver for valves, positioners, heaters, and lamps. Its
wide supply range, adjustable delay to PWM mode, and
adjustable duty cycle make it suitable for a wide range of
applications. Figure 1 shows the basic circuit connections to
operate the DRV102. A 0.1µF bypass capacitor is shown
connected to the power supply pin.
Ground (pin 4) is electrically connected to the package tab.
This pin must be connected to system ground for the
DRV102 to function. This serves as the DRV102 reference
ground.
The load (solenoid, valve, etc.) is connected between the
output (pin 6) and ground. For an inductive load, an external
flyback diode (D1 in Figure 1a) across the output is required.
The diode serves to maintain the hold force during PWM
operation. Depending on the application, the flyback diode
should be placed near the DRV102 or close to the solenoid
(see “Flyback Diode” text). The device’s internal clamp
diode, connected between the output and ground, should not
be used to carry load current. When driving inductive loads,
an additional diode in series with the out pin, D2, is required
(see “Series Diode” text).
The Input (pin 1) is compatible with standard TTL levels.
Input voltages between +2.2V and +5.5V turn the device
output on, while pulling the pin low (0V to +1.2V), shuts the
DRV102 output off. Input current is typically 80µA.
Delay Adjust (pin 2) and Duty Cycle Adjust (pin 3) allow
external adjustment of the PWM output signal. The Delay
Adjust pin can be left floating for minimum delay to PWM
mode (typically 15µs) or a capacitor can be used to set the
delay time. Duty cycle of the PWM output can be controlled
by a resistor, analog voltage, or D/A converter. Figure 1b
provides an example timing diagram with the Delay Adjust
The Flag (pin 7) provides fault status for under-current,
over-current, and thermal shutdown conditions. This pin is
active low with pin voltage typically +0.2V during a fault
condition. A small value capacitor may be needed between
Flag and ground for noisy applications.
1a). Basic Circuit Connections
Flag
7
VS
DRV102
Thermal Shutdown
Over/Under Current
5
24kHz
Oscillator
1
VS
PWM
Input
(TTL-Compatible)
6
Out
Delay
On
Off
CD
2
3
Delay
Adjust
Duty
Cycle
Adjust
RPWM
(+8V to +60V)
0.1µF
Gnd
4
D2
(Gnd electrically
connected to tab)
D1
(1)
Load
NOTE: (1) External flyback diode required for inductive loads to conduct load current during the off cycle.
Flyback diode shown near DRV102. For some applications with remotely located load, it may be desirable
to place the diode near the solenoid—see “Flyback Diode” text. Motorola MSRS1100T3 (1A, 100V) or
MBRS360T3 (3A, 60V).
1b). Simplified Timing Diagram
CD = 0.1µF (92ms constant dc output before PWM)
RPWM = 90.9kΩ
+2.2V to +5.5V
•••
INPUT
0V to +1.2V
VS
OUTPUT
0
CD = 0.1µF
92ms
tON
tP
Initial dc Output
PWM Mode
(set by value (resistor or voltage
controlled)
of CD)
•••
RPWM = 90.9kΩ
tON ≈ 10.4µs
tP ≈ 41.6µs (1/24kHz)
t
Duty Cycle = ON = 25%
tP
FIGURE 1. Basic Circuit Connections and Timing Diagram.
8
DRV102
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SBVS009B
APPLICATIONS INFORMATION
POWER SUPPLY
The DRV102 operates from a single +8V to +60V supply
with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are
shown in the Typical Performance Curves.
CONNECTIONS TO LOAD
The PWM switching voltage and currents can cause electromagnetic radiation. Proper physical layout of the load current will help minimize radiation. Load current flows from
the DRV102 output terminal to the load and returns through
the ground return path. This current path forms a loop. To
minimize radiation, make the area of the enclosed loop as
small as possible. Twisted pair leading to the load is excellent. If the ground return current must flow through a chassis
ground, route the output current line directly over the chassis
surface in the most direct path to the load.
FLYBACK DIODE LOCATION
Physical location of the flyback diode may affect electromagnetic radiation. With most solenoid loads, inductance is
large enough that load current is virtually constant during
PWM operation. When the switching transistor is off, load
current flows though the flyback diode. If the flyback diode
is located near the DRV102 (Figure 2a), the current flowing
in long lines to the load is virtually constant. If the flyback
diode is, instead, located directly across the load (Figure 2b),
pulses of current must flow from the DRV102 to the distant
load. While theory seems to favor placing the diode at the
DRV102 output (constant current in the long lines), indi2a) Flyback Diode Near DRV102
DRV102
5
vidual situations may defy logic; if one location seems to
create noise problems, try the other.
SERIES DIODE FOR INDUCTIVE LOADS
An additional bias diode, located in series with the output, is
required when driving inductive loads. Any silicon diode,
such as the 1N4002, appropriately rated for current will
work. The diode biases the emitter of the internal power
device such that it can be fully shut off during the “off”
portion of the PWM cycle. Note that the voltage at the load
drops below ground due to the flyback diode. If it is not used,
apparent leakage current can rise to hundreds of milliamps,
resulting in unpredictable operation and thermal shutdown.
ADJUSTABLE INITIAL 100% DUTY CYCLE
A unique feature of the DRV102 is its ability to provide an
initial constant dc output (100% duty cycle) and then switch
to PWM mode to save power. This function is particularly
useful when driving solenoids which have a much higher
pull-in current requirement than hold current requirement.
The duration of this constant dc output (before PWM output
begins) can be externally and independently controlled with
a capacitor connected from Delay Adjust (pin 2) to ground
according to the following equation:
Delay Time ≈ CD • 106
(time in seconds, CD in Farads)
Leaving the Delay Adjust pin open results in a constant
output time of approximately 15µs. The duration of this
initial output can be reduced to less than 3µs by connecting
the pin to 5V. Table I provides examples of desired “delay”
times (constant output before PWM mode) and the appropriate capacitor values or pin connection.
CONSTANT OUTPUT DURATION
(Delay Time to PWM Mode)
CD
3µs
15µs
97µs
0.97ms
97ms
Pin Connected to 5V
Pin Open
100pF
1nF
0.1µF
VS
6
Out
TABLE I. Delay Adjust Pin Connections.
Load
4
The internal Delay Adjust circuitry is composed of a 3µA
current source and a 3V comparator as shown in Figure 3.
Thus, when the pin voltage is less than 3V, the output device
is 100% on (dc output mode).
2b) Flyback Diode Near Load
DRV102
DRV102
5
VS
3V Reference
VS
3µA
6
Out
Comparator
4
Load
2
Delay Adjust
FIGURE 2. Location of External Flyback Diode.
FIGURE 3. Simplified Circuit Model of the Delay Adjust Pin.
DRV102
SBVS009B
CD
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9
ADJUSTABLE DUTY CYCLE
Voltage-Controlled Duty Cycle
The DRV102’s externally adjustable duty cycle provides an
accurate means of controlling power delivered to the load.
Duty cycle can be set from 10% to 90% with an external
resistor, analog voltage, or the output of a D/A converter.
Reduced duty cycle results in reduced power dissipation.
This keeps the DRV102 and load cooler, resulting in increased reliability for both devices. PWM frequency is a
constant 24kHz.
Duty cycle can also be programmed with an analog voltage,
VPWM. With VPWM ≈ 0.5V, duty cycle is 100%. Increasing
this voltage results in decreased duty cycles. For 0% duty
cycle, VPWM is approximately 4V. Table II provides VPWM
values for typical duty cycles. See the “Duty Cycle vs
Voltage” typical performance curve for additional duty cycle
values.
Resistor-Controlled Duty Cycle
Duty cycle is independently programmed with a resistor
(RPWM) connected between the Duty Cycle Adjust pin and
ground. Increased resistor values correspond to decreased
duty cycles. Table II provides resistor values for typical duty
cycles. Resistor values for additional duty cycles can be
obtained from Figure 4. For reference purposes, the equation
for calculating RPWM is included in Figure 4.
The Duty Cycle Adjust pin should not be driven below 0.1V.
If the voltage source used can go between 0.1V and ground,
a 1kΩ series resistor between the voltage source and the Duty
Cycle Adjust pin (Figure 5) is required to limit swing. If the
pin is driven below 0.1V, the output will be unpredictable.
DRV102
5
DUTY CYCLE
RESISTOR(1)
RPWM (kΩ)
VOLTAGE(2)
VPWM (V)
10
20
30
40
50
60
70
80
90
536
137
66.5
39.2
24.9
16.2
10.5
6.65
4.42
3.67
3.31
2.91
2.49
2.07
1.66
1.26
0.88
0.56
PWM
VPWM
3
VS
6
Out
Gnd 4
D/A
Converter
(or analog
voltage)
1kΩ(1)
NOTES: (1) Resistor values listed are nearest 1% standard values. (2) Do not
drive pin below 0.1V. For additional values, see “Duty Cycle vs Voltage” typical
performance curve.
TABLE II. Duty Cycle Adjust. TA= +25°C, VS = +24V.
NOTE: (1) Required if voltage source can go below 0.1V.
FIGURE 5. Using a Voltage Source to Program Duty Cycle.
The DRV102’s internal 24kHz oscillator sets the PWM
period. This frequency is not externally adjustable. Duty
Cycle Adjust (pin 3) is internally driven by a 200µA current
source and connects to the input of a comparator and a 19kΩ
resistor as shown in Figure 6. The DRV102’s PWM control
design is inherently monotonic. That is, a decreased voltage
(or resistor value) always produces an increased duty cycle.
1000
RPWM (kΩ)
100
10
3.8V
f = 24kHz
1
0.7V
10
20
40
60
80
100
VS
Duty Cycle (%)
Comparator
200µA
RPWM = [ a + b (DC) + c (DC)2 + d (DC)3 + e (DC)4]–1
where: a = –4.9686 x 10–8
b = –5.9717 x 10–8
c = 2.9889 x 10–8
d = –5.4837 x 10–10
e = 5.9361 x 10–12
19kΩ
DRV102
3
DC = duty cycle in %
For 50% duty cycle:
RPWM = [–4.9686 x 10–8 + (–5.9717 x 10–8) (50) + (2.9889 x 10–8) (50)2
+ (–5.4837 x 10–10) (50)3 + (5.9361 x 10–12) (50)4]–1
Duty Cycle
Adjust
NOTE: (1) Do not drive pin below 0.1V.
= 24.9kΩ
FIGURE 4. RPWM versus Duty Cycle.
10
Resistor or
Voltage Source(1)
FIGURE 6. Simplified Circuit Model of the Duty Cycle
Adjust Pin.
DRV102
www.ti.com
SBVS009B
STATUS FLAG
Flag (pin 7) provides fault indication for under-current,
over-current, and thermal shutdown conditions. During a
fault condition, Flag output is driven low (pin voltage
typically drops to 0.2V). A pull-up resistor, as shown in
Figure 7, is required to interface with standard logic. A small
value capacitor may be needed between Flag and ground in
noisy applications.
+5V
5kΩ
(LED)
HLMP-Q156
Figure 7 gives an example of a non-latching fault monitoring
circuit, while Figure 8 provides a latching version. The Flag
pin can sink several milliamps, sufficient to drive external
logic circuitry or an LED (Figure 9) to indicate when a fault
has occurred. In addition, the Flag pin can be used to turn off
other DRV102’s in a system for chain fault protection.
Flag
7
Thermal Shutdown
Over/Under Current
5
6
DRV102
VS
Out
Gnd 4
+5V
5kΩ
Pull-Up
Flag
TTL or HCT
FIGURE 9. LED to Indicate Fault Condition.
7
Over/Under Current Fault
Thermal Shutdown
Over/Under Current
5
6
DRV102
An over-current fault occurs when the output current exceeds the current limit. All units are guaranteed to drive 2A
without current limiting. Typically, units will limit at 2.7A.
The status flag is not latched. Since current during PWM
mode is switched on and off, the flag output will be modulated with PWM timing (see flag waveforms in the Typical
Performance Curves).
VS
Out
Gnd 4
An under-current fault occurs when the output current is
below the under-scale current threshold (typically 16mA).
For example, this function indicates when the load is disconnected. Again, the flag output is not latched, so an undercurrent condition during PWM mode will produce a flag
output that is modulated by the PWM waveform. An initial,
brief under-current flag normally appears driving inductive
loads and may be avoided by adding a parallel resistor
sufficient to move the initial current above the under-current
threshold. Avoid adding capacitance to pin 6 (Out) as it may
cause momentary current limiting.
FIGURE 7. Non-Latching Fault Monitoring Circuit.
+5V
74XX76A
VS
Flag
Q
Flag
Q
Flag Reset
20kΩ
J
CLR
CLK
(1)
GND
K
Over-Temperature Fault
Flag
7
Thermal Shutdown
Over/Under Current
5
6
DRV102
VS
Out
A thermal fault occurs when the die reaches approximately
165°C, producing a similar effect as pulling the input low.
Internal shutdown circuitry disables the output and resets the
Delay Adjust pin. The Flag is latched in the low state (fault
condition) until the die has cooled to approximately 150°C.
A thermal fault can occur in any mode of operation. Recovery from thermal fault will start in delay mode (constant dc
output).
Gnd 4
NOTE: (1) Small capacitor (10pF) may be required in noisy environments.
FIGURE 8. Latching Fault Monitoring Circuit.
DRV102
SBVS009B
www.ti.com
11
For best thermal performance, the tab of the DDPAK surface-mount version should be soldered directly to a circuit
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
PACKAGE MOUNTING
Figure 10 provides recommended PCB layouts for both the
TO-220 and DDPAK power packages. The tab of both
packages is electrically connected to ground (pin 4). It may
be desirable to isolate the tab of TO-220 package from its
mounting surface with a mica (or other film) insulator (see
Figure 11). For lowest overall thermal resistance, it is best to
isolate the entire heat sink/DRV102 structure from the
mounting surface rather than to use an insulator between the
semiconductor and heat sink.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. Power dissipation is equal to the product of
7-Lead DDPAK(1)
KTW Package(2)
7-Lead TO-220
KVT Package(2)
0.45
0.085
0.15
0.335
0.51
0.04
0.2
0.05
0.05
Mean dimensions given in inches. Refer to the end of
this data sheet for tolerances and detailed package
drawings. For further information on solder pads for
surface-mount devices, consult Application Bulletin
AB-132 (SBFA015), available for download at
www.ti.com.
0.035
0.105
NOTES: (1) For improved thermal performance increase footprint area.
See Figure 11, Thermal Resistance vs Circuit Board Copper Area.
(2) Refer to the mechanical drawings at the end of this document.
FIGURE 10. TO-220 and DDPAK Solder Footprints.
THERMAL RESISTANCE
vs ALUMINUM PLATE AREA
Aluminum Plate Area
Thermal Resistance θJA (°C/W)
18
Vertically Mounted
in Free Air
Flat, Rectangular
Aluminum Plate
16
14
0.030
12
0.050
10
Aluminum Plate
Thickness (inches)
0.062
8
0
1
2
3
4
5
6
7
8
Aluminum Plate Area (inches2)
Optional mica or film insulator
for electrical isolation. Adds
DRV102
approximately 1°C/W.
TO-220 Package
FIGURE 11. TO-220 Thermal Resistance versus Aluminum Plate Area.
12
DRV102
www.ti.com
SBVS009B
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
Thermal Resistance, θJA (°C/W)
50
DRV102
DDPAK
Surface-Mount Package
1oz. copper
40
Circuit Board Copper Area
30
20
10
0
0
1
2
Copper Area
3
4
DRV102
DDPAK
Surface-Mount Package
5
(inches2)
FIGURE 12. DDPAK Thermal Resistance versus Circuit Board Copper Area.
output current times the voltage across the conducting output transistor times the duty cycle. Power dissipation can be
minimized by using the lowest possible duty cycle necessary
to assure the required hold force.
low as possible for increased reliability. Junction temperature can be determined according to the equation:
TJ = TA + PDθJA
(1)
where, θJA = θJC + θCH + θHA
(2)
THERMAL PROTECTION
Any tendency to activate the thermal protection circuit
indicates excessive power dissipation or an inadequate heat
sink. For reliable operation, junction temperature should be
limited to +125°C, maximum. To estimate the margin of
safety in a complete design (including heat sink), increase
the ambient temperature until the thermal protection is
triggered. Use worst-case load and signal conditions. For
good reliability, thermal protection should trigger more than
40°C above the maximum expected ambient condition of
your application. This produces a junction temperature of
125°C at the maximum expected ambient condition.
The internal protection circuitry of the DRV102 was designed
to protect against overload conditions. It was not intended to
replace proper heat sinking. Continuously running the
DRV102 into thermal shutdown will degrade reliability.
TJ =
TA =
PD =
θJC =
θCH =
θHA =
θJA =
Junction Temperature (°C)
Ambient Temperature (°C)
Power Dissipated (W)
Junction-to-Case Thermal Resistance (°C/W)
Case-to-Heat Sink Thermal Resistance (°C/W)
Heat Sink-to-Ambient Thermal Resistance (°C/W)
Junction-to-Air Thermal Resistance (°C/W)
Figure 13 shows maximum power dissipation versus ambient temperature with and without the use of a heat sink.
Using a heat sink significantly increases the maximum
power dissipation at a given ambient temperature as shown.
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
10
Power Dissipation (Watts)
Power dissipated in the DRV102 will cause the junction
temperature to rise. The DRV102 has thermal shutdown
circuitry that protects the device from damage. The thermal
protection circuitry disables the output when the junction
temperature reaches approximately +165°C, allowing the device to cool. When the junction temperature cools to approximately +150°C, the output circuitry is again enabled. Depending on load and signal conditions, the thermal protection
circuit may cycle on and off. This limits the dissipation of the
driver but may have an undesirable effect on the load.
TO-220 with Thermalloy
6030B Heat Sink
θJA = 16.5°C/W
8
With infinite heat sink
( θJA = 3°C/W),
max PD = 33W
at TA = 25°C
6
4
DDPAK
θJA = 26°C/W (3 in2 1 oz.
copper mounting pad)
2
DDPAK or TO-220
θJA = 65°C/W (no heat sink)
0
0
HEAT SINKING
Most applications will not require a heat sink to assure that
the maximum operating junction temperature (125°C) is not
exceeded. However, junction temperature should be kept as
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 13. Maximum Power Dissipation versus Ambient
Temperature.
DRV102
SBVS009B
PD = (TJ (max) – TA) / θ JA
TJ (max) = 125°C
www.ti.com
13
The difficulty in selecting the heat sink required lies in
determining the power dissipated by the DRV102. For dc
output into a purely resistive load, power dissipation is simply
the load current times the voltage developed across the
conducting output transistor times the duty cycle. Other loads
are not as simple. Once power dissipation for an application
is known, the proper heat sink can be selected.
Heat Sink Selection Example
A TO-220 package’s maximum dissipation is 2 Watts. The
maximum expected ambient temperature is 80°C. Find the
proper heat sink to keep the junction temperature below
125°C.
Combining Equations 1 and 2 gives:
TJ = TA + PD(θJC + θCH + θHA)
(3)
TJ, TA, and PD are given. θJC is provided in the Specifications table, 3°C/W. θCH can be obtained from the heat sink
manufacturer. Its value depends on heat sink size, area, and
material used. Semiconductor package type, mounting screw
torque, insulating material used (if any), and thermal
joint compound used (if any) also affect θCH. A typical θCH
for a TO-220 mounted package is 1°C/W. Now we can solve
for θHA:
θ HA =
θ HA =
14
TJ – TA
– (θ JC + θ CH )
PD
To maintain junction temperature below 125°C, the heat
sink selected must have a θHA less than 18.5°C/W. In other
words, the heat sink temperature rise above ambient must be
less than 37°C (18.5°C/W • 2W). For example, at 2 Watts
Thermalloy model number 6030B has a heat sink
temperature rise of about 33°C above ambient, which is
below the 37°C required in this example. Figure 13 shows
power dissipation versus ambient temperature for a TO-220
package with a 6030B heat sink.
Another variable to consider is natural convection versus
forced convection air flow. Forced-air cooling by a small fan
can lower θCA (θCH + θHA) dramatically. Heat sink manufacturers provide thermal data for both of these cases. For
additional information on determining heat sink requirements, consult Application Bulletin AB-038.
As mentioned earlier, once a heat sink has been selected, the
complete design should be tested under worst-case load and
signal conditions to ensure proper thermal protection.
(4)
125°C – 80°C
– (3°C/ W + 1°C/ W ) = 18.5°C/ W
2W
DRV102
www.ti.com
SBVS009B
APPLICATION CIRCUITS
+5V
5kΩ
Flag
Can drive most types
of solenoid-actuated
valves and actuators
7
5
Thermal Shutdown
Over/Under Current
VS
VS
Pinch Valve
24kHz
Oscillator
Microprocessor
TTL Control Input
1
Flexible Tube
PWM
6
On
Delay
DRV102
Off
2
Delay
Adjust
3
CD RPWM
NOTE: (1) Duty cycle can be programmed by
a resistor, analog voltage, or D/A converter.
Do not drive below 0.1V.
4
Plunger
Out
Gnd
Solenoid Coil
Duty Cycle
Adjust(1)
(10% to 90%)
FIGURE 14. Fluid Flow Control System.
Brighter light results in
increased duty cycle
DRV102
5
DRV102
5
On/Off
Input
(On/Off)
VS
1
VS
1
6
Out
6
Out
3
2
4
2
3
4
(1)
Coil
Delay
Adjust
Lamp
Delay
Adjust
100Ω
Duty Cycle Adjust
Aimed at
ambient
light
Cadmium Sulfide
Optical Detector
(Clairex CL70SHL
or CLSP5M)
λ
4-20mA
Twisted Pair
10kΩ
FIGURE 15. Instrument Light Dimmer Circuit.
NOTE: (1) Rectifier diode required for inductive
loads to conduct load current during the off cycle.
FIGURE 16. 4-20mA Input to PWM Output.
DRV102
SBVS009B
187Ω
www.ti.com
15
Reduced mechanical actuation delay with high voltage pull-in followed by low duty cycle
DRV102
5
On/Off
+40V (max for TPIC6273)
VS
1
6
Out
3
2
4
RPWM
150kΩ
(25% Duty Cycle)
CD
0.047µF
Full power pulse width is control
plus interval set by CD.
74LS05
+5V
4
5
6
7
14
15
16
17
20
TI TPIC6273
(Octal Power Switch)
•••
10
2
11
•••
3
8
9
12
13
18
Control
19
TTL/CMOS Solenoid Selection Inputs
FIGURE 17. Improved Switching Time When Driving Multiple Loads.
16
DRV102
www.ti.com
SBVS009B
a)
VS
DRV102
5
1
On/Off
Delay
Adjust
Higher temperature results
in lower duty cycle.
6
2
Out
3
4
Heating
Element
Gnd
Thermistor
Duty
Cycle
Adjust
R1
R2
b)
VS
10µF
DRV102
1
5
On/Off
0.1µF
Delay
Adjust
REF200
2
6
7, 8
Out
3
4
Gnd
Heating
Element
2µF Film
100µA
100µA
1
2
0.1µF VS
7
Duty Cycle
Adjust
1kΩ
6
2
OPA134
10MΩ
3
4
10kΩ
4.7V
or
Thermistor
5kΩ at +25°C
IN4148(1)
Temperature
Control
Higher temperature results
in lower duty cycle.
Integrator improves accuracy
NOTE: (1) Or any common silicon diode suited
to the mechanical mounting requirements.
20kΩ
FIGURE 18. (a) Constant Temperature Controller. (b) Improved Accuracy Constant Temperature Controller.
DRV102
SBVS009B
www.ti.com
17
DRV102
5
+12V
1
Input
(On/Off)
dc Tachometer
Coupled to Motor
6
Out
3
2
4
M
Delay
Adjust
R1
T
R2
Speed Control(1)
NOTE: (1) Select R1/R2 ratio based on tachometer output voltage.
FIGURE 19. Constant Speed Motor Control.
5
Open circuit will
provide 3.4V
“on” signal
+40V
DRV102
1
6
2
40kΩ
Speed Control Input
0V to +10V
+15V
3
4
M
Delay Adjust
0.5µF
1kΩ
+15V
22kΩ
470kΩ
1nF
100kΩ
Frequency In
2N2222
T
VOUT
One-Shot
47kΩ
10kΩ
AC
Tachometer
VFC32
Coupled to Motor
–15V
5nF
NP0
FIGURE 20. DC Motor Speed Control Using AC Tachometer.
18
DRV102
www.ti.com
SBVS009B
VZ
+24V
DRV102
2kΩ
5
VS
5.1V
Zener
25kΩ
1
0.1µF
100kΩ
On
Off
2
3
6
1kΩ
Out
Current Set
VZ
100kΩ
OPA237
4
Load
Duty Cycle
Adjust
Delay
Adjust
RSHUNT
0.1Ω
0.1µF
5kΩ
0.6V gives ~ 90% Duty Cycle
3.7V gives ~ 10% Duty Cycle
FIGURE 21. Constant Current Output Drive.
Only one DRV102 is
turned on at sequence time.
5
Phase 2
Stepper
Logic In
VS
5
VS
DRV102
Phase 3
Stepper
Logic In
DRV102
6
6
Motor
5
Phase 1
Stepper
Logic In
VS
DRV102
6
FIGURE 22. Three-Phase Stepper Motor Driver Provides High-Stepping Torque.
DRV102
VS = +8V to +60V
5
R1
VS
1
R2
6
Out
Select R1 and R2 to divide
down VS to 5.5V max.
For example: with VS = 60V
R1 = 11kΩ, R2 = 1kΩ
VIN =
2
3
4
Delay Adjust
C1
20µF
R3
4.87kΩ
1kΩ
• 60V = 5V
1kΩ + 11kΩ
Duty Cycle Adjust
after soft start
+
4.3V
DIN5229
R4
4.87kΩ
Sets start-up
duty cycle
FIGURE 23. Soft-Start Circuit for Incandescent Lamps and Other Sensitive Loads.
DRV102
SBVS009B
www.ti.com
19
Revision History
DATE
REVISION
5/09
B
PAGE
SECTION
1
Front Page
12
Package Mounting
DESCRIPTION
Updated front page appearance.
Changed Figure 10 to show TI package designator.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
20
DRV102
www.ti.com
SBVS009B
PACKAGE OPTION ADDENDUM
www.ti.com
10-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
DRV102F
OBSOLETE
DDPAK/
TO-263
KTW
7
DRV102F/500
ACTIVE
DDPAK/
TO-263
KTW
7
DRV102FKTWT
ACTIVE
DDPAK/
TO-263
KTW
DRV102FKTWTG3
ACTIVE
DDPAK/
TO-263
DRV102T
ACTIVE
DRV102TG3
ACTIVE
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TBD
Call TI
Call TI
500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
DRV102F
7
50
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
DRV102F
KTW
7
50
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
DRV102F
TO-220
KVT
7
50
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
DRV102T
TO-220
KVT
7
50
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
DRV102T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Apr-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Dec-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DRV102F/500
DDPAK/
TO-263
KTW
7
500
330.0
24.4
DRV102FKTWT
DDPAK/
TO-263
KTW
7
50
330.0
24.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.95
16.5
5.15
16.0
24.0
Q2
10.6
15.6
4.9
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Dec-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV102F/500
DDPAK/TO-263
KTW
7
500
346.0
346.0
41.0
DRV102FKTWT
DDPAK/TO-263
KTW
7
50
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MPSF015 – AUGUST 2001
KTW (R-PSFM-G7)
PLASTIC FLANGE-MOUNT
0.410 (10,41)
0.385 (9,78)
0.304 (7,72)
–A–
0.006
–B–
0.303 (7,70)
0.297 (7,54)
0.0625 (1,587) H
0.055 (1,40)
0.0585 (1,485)
0.300 (7,62)
0.064 (1,63)
0.045 (1,14)
0.252 (6,40)
0.056 (1,42)
0.187 (4,75)
0.370 (9,40)
0.179 (4,55)
0.330 (8,38)
H
0.296 (7,52)
A
0.605 (15,37)
0.595 (15,11)
0.012 (0,305)
C
0.000 (0,00)
0.019 (0,48)
0.104 (2,64)
0.096 (2,44)
H
0.017 (0,43)
0.050 (1,27)
C
C
F
0.034 (0,86)
0.022 (0,57)
0.010 (0,25) M
B
0.026 (0,66)
0.014 (0,36)
0°~3°
AM C M
0.183 (4,65)
0.170 (4,32)
4201284/A 08/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead width and height dimensions apply to the
plated lead.
D. Leads are not allowed above the Datum B.
E. Stand–off height is measured from lead tip
with reference to Datum B.
F. Lead width dimension does not include dambar
protrusion. Allowable dambar protrusion shall not
cause the lead width to exceed the maximum
dimension by more than 0.003”.
G. Cross–hatch indicates exposed metal surface.
H. Falls within JEDEC MO–169 with the exception
of the dimensions indicated.
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