Freescale ATC100B130JT500XT Rf power ldmos transistor Datasheet

Freescale Semiconductor
Technical Data
Document Number: MRF6V3090N
Rev. 1, 12/2011
RF Power LDMOS Transistors
MRF6V3090NR1
MRF6V3090NR5
MRF6V3090NBR1
MRF6V3090NBR5
Enhancement--Mode Lateral MOSFETs
Designed for commercial and industrial broadband applications with
frequencies from 470 to 860 MHz. Devices are suitable for use in broadcast
applications.
• Typical Performance (Narrowband Test Circuit): VDD = 50 Volts, IDQ =
350 mA, 64 QAM, Input Signal PAR = 9.5 dB @ 0.01% Probability on CCDF.
Signal Type
Pout
(W)
f
(MHz)
Gps
(dB)
ηD
(%)
ACPR
(dBc)
DVB--T (8k OFDM)
18 Avg.
860
22.0
28.5
--62.0
• Typical Performance (Broadband Reference Circuit): VDD = 50 Volts,
IDQ = 450 mA, 64 QAM, Input Signal PAR = 9.5 dB @ 0.01% Probability
on CCDF.
Signal Type
Pout
(W)
f
(MHz)
Gps
(dB)
ηD
(%)
Output
Signal PAR
(dB)
IMD
Shoulder
(dBc)
DVB--T (8k OFDM)
18 Avg.
470
21.6
26.8
8.6
--31.8
650
22.9
28.0
8.7
--34.4
860
21.9
28.3
7.9
--29.2
470--860 MHz, 90 W, 50 V
BROADBAND
RF POWER LDMOS TRANSISTORS
CASE 1486--03, STYLE 1
TO--270 WB--4
PLASTIC
MRF6V3090NR1(NR5)
Features
• Capable of Handling 10:1 VSWR, All Phase Angles, @ 50 Vdc, 860 MHz,
90 Watts CW Output Power
• Characterized with Series Equivalent Large--Signal Impedance Parameters
• Internally Input Matched for Ease of Use
• Qualified Up to a Maximum of 50 VDD Operation
• Integrated ESD Protection
• Excellent Thermal Stability
• Greater Negative Gate--Source Voltage Range for Improved Class C
Operation
• 225°C Capable Plastic Package
• In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13 inch Reel.
R5 Suffix = 50 Units, 56 mm Tape Width, 13 inch Reel.
CASE 1484--04, STYLE 1
TO--272 WB--4
PLASTIC
MRF6V3090NBR1(NBR5)
PARTS ARE SINGLE--ENDED
Gate
Drain
Gate
Drain
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
VDSS
--0.5, +110
Vdc
Drain--Source Voltage
Gate--Source Voltage
VGS
--6.0, +10
Vdc
Storage Temperature Range
Tstg
-- 65 to +150
°C
Case Operating Temperature
TC
150
°C
Operating Junction Temperature (1,2)
TJ
225
°C
(Top View)
Note: Exposed backside of the package is
the source terminal for the transistor.
Figure 1. Pin Connections
Table 2. Thermal Characteristics
Characteristic
Symbol
Thermal Resistance, Junction to Case
Case Temperature 76°C, 18 W CW, 50 Vdc, IDQ = 350 mA, 860 MHz
Case Temperature 80°C, 90 W CW, 50 Vdc, IDQ = 350 mA, 860 MHz
RθJC
Value (2,3)
0.79
0.82
Unit
°C/W
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
© Freescale Semiconductor, Inc., 2010--2011. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
1
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
2 (2001--4000 V)
Machine Model (per EIA/JESD22--A115)
B (201--400 V)
Charge Device Model (per JESD22--C101)
IV (>1000 V)
Table 4. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
3
260
°C
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
IGSS
—
—
0.5
μAdc
V(BR)DSS
115
—
—
Vdc
Zero Gate Voltage Drain Leakage Current
(VDS = 50 Vdc, VGS = 0 Vdc)
IDSS
—
—
10
μAdc
Zero Gate Voltage Drain Leakage Current
(VDS = 100 Vdc, VGS = 0 Vdc)
IDSS
—
—
20
μAdc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 200 μAdc)
VGS(th)
0.9
1.6
2.4
Vdc
Gate Quiescent Voltage
(VDD = 50 Vdc, ID = 350 mAdc, Measured in Functional Test)
VGS(Q)
2.0
2.7
3.5
Vdc
Drain--Source On--Voltage
(VGS = 10 Vdc, ID = 0.5 Adc)
VDS(on)
—
0.2
—
Vdc
Reverse Transfer Capacitance
(VDS = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Crss
—
41
—
pF
Output Capacitance
(VDS = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Coss
—
65.4
—
pF
Input Capacitance (1)
(VDS = 50 Vdc, VGS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)
Ciss
—
591
—
pF
Characteristic
Off Characteristics
Gate--Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
Drain--Source Breakdown Voltage
(ID = 50 mA, VGS = 0 Vdc)
On Characteristics
Dynamic Characteristics
Functional Tests (In Freescale DVB--T Narrowband Test Fixture, 50 ohm system) VDD = 50 Vdc, IDQ = 350 mA, Pout = 18 W Avg.,
f = 860 MHz, DVB--T (8k OFDM) Single Channel. ACPR measured in 7.61 MHz Channel Bandwidth @ ±4 MHz Offset @ 4 kHz Bandwidth.
Power Gain
Gps
21.0
22.0
24.0
dB
Drain Efficiency
ηD
27.5
28.5
—
%
ACPR
—
--62.0
--60.0
dBc
IRL
—
--14
--9
dB
Adjacent Channel Power Ratio
Input Return Loss
1. Part internally input matched.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
2
RF Device Data
Freescale Semiconductor, Inc.
VBIAS
C8
+
C1
R1
C2
Z2
Z3
Z4
Z5
Z6
Z9
Z12
Z13
Z14
Z15 Z16
Z17
Z7
C5
Z18
RF
OUTPUT
C14
C15
C6
C10
Z10
C4 R2
Z1
C9
C3
Z8
RF
INPUT
VSUPPLY
+
C11
C12
C13
DUT
C7
Z11
+
C16
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
0.266″ × 0.067″ Microstrip
0.331″ × 0.067″ Microstrip
0.598″ × 0.067″ Microstrip
0.315″ × 0.276″ Microstrip
0.054″ × 0.669″ Microstrip
0.419″ × 0.669″ Microstrip
0.256″ × 0.669″ Microstrip
0.986″ × 0.071″ Microstrip
0.201″ × 0.571″ Microstrip
Z10, Z11
Z12
Z13
Z14
Z15
Z16
Z17
Z18
C17
C18
1.292″ × 0.079″ Microstrip
0.680″ × 0.571″ Microstrip
0.132″ × 0.117″ Microstrip
0.705″ × 0.117″ Microstrip
0.159″ × 0.117″ Microstrip
0.140″ × 0.067″ Microstrip
0.077″ × 0.067″ Microstrip
0.163″ × 0.067″ Microstrip
Figure 2. MRF6V3090NR1(NBR1) 860 MHz Narrowband Test Circuit Schematic
Table 6. MRF6V3090NR1(NBR1) 860 MHz Narrowband Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1
22 μF, 35 V Tantalum Capacitor
T491X226K035AT
Kermet
C2, C9, C17
10 μF, 50 V Chip Capacitors
GRM55DR61H106KA88L
Murata
C3, C5, C8, C14, C16
43 pF Chip Capacitors
ATC100B430JT500XT
ATC
C4
6.2 pF Chip Capacitor
ATC100B6R2BT500XT
ATC
C6
2.2 pF Chip Capacitor
ATC100B2R2JT500XT
ATC
C7
9.1 pF Chip Capacitor
ATC100B9R1CT500XT
ATC
C10, C18
220 μF, 100 V Electrolytic Capacitors
EEVFK2A221M
Panasonic--ECG
C11, C15
7.5 pF Chip Capacitors
ATC100B7R5CT500XT
ATC
C12
3.0 pF Chip Capacitor
ATC100B3R0CT500XT
ATC
C13
0.7 pF Chip Capacitor
ATC100B0R7BT500XT
ATC
R1
10 kΩ, 1/4 W Chip Resistor
CRCW120610KOJNEA
Vishay
R2
10 Ω, 1/4 W Chip Resistor
CRCW120610ROJNEA
Vishay
PCB
0.030″, εr = 3.5
RF--35
Taconic
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
3
-C1
C10
C8
C2
C3
C4
C5
C6
C7
MRF6V3090N
Rev. 0
C11
R2
C15
CUT OUT AREA
R1
C9
C16
C14
C12
C13
C17
C18
--
Figure 3. MRF6V3090NR1(NBR1) 860 MHz Narrowband Test Circuit Component Layout
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
4
RF Device Data
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS
24
Ciss
70
VDD = 50 Vdc, IDQ = 350 mA, f = 860 MHz
100
Coss
Crss
0
10
20
22
50
21
40
20
30
19
20
ηD
10
17
40
30
60
Gps
18
Measured with ±30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc
10
50
10
1
100
0
200
VDS, DRAIN--SOURCE VOLTAGE (VOLTS)
Pout, OUTPUT POWER (WATTS)
Figure 4. Capacitance versus Drain--Source Voltage
Figure 5. CW Power Gain and Drain Efficiency
versus Output Power (Narrowband Test Circuit)
56
P3dB = 51.28 dBm (134.3 W)
55
54
52
24
P2dB = 51.06 dBm (127.6 W)
23
P1dB = 50.7 dBm (117.5 W)
Actual
51
50
49
48
--6
--5
--4
--3
--2
--1
1
0
2
3
22
21
20
19
50 V
18
45 V
17
VDD = 50 Vdc, IDQ = 350 mA, f = 860 MHz
47
IDQ = 350 mA, f = 860 MHz
VDD = 40 V
16
4
10 20 30 40
50 60
70 80 90 100 110 120 130 140 150
Pin, INPUT POWER (dBm)
Pout, OUTPUT POWER (WATTS)
Figure 6. CW Output Power versus Input Power
(Narrowband Test Circuit)
Figure 7. CW Power Gain versus Output Power
(Narrowband Test Circuit)
25
VDD = 50 Vdc, IDQ = 350 mA, f = 860 MHz
TC = --30_C
Gps, POWER GAIN (dB)
24
60
Gps
23
TC = --30_C
85_C
50
25_C
22
40
21
85_C
30
25_C
ηD
20
20
10
19
18
70
1
10
100
ηD, DRAIN EFFICIENCY (%)
53
25
Ideal
Gps, POWER GAIN (dB)
Pout, OUTPUT POWER (dBm)
Gps, POWER GAIN (dB)
C, CAPACITANCE (pF)
23
ηD, DRAIN EFFICIENCY (%)
1000
0
200
Pout, OUTPUT POWER (WATTS)
Figure 8. CW Power Gain and Drain Efficiency versus
Output Power (Narrowband Test Circuit)
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
5
TYPICAL CHARACTERISTICS — TWO--TONE (NARROWBAND TEST CIRCUIT)
--20
IMD, INTERMODULATION DISTORTION (dBc)
IMD, INTERMODULATION DISTORTION (dBc)
--10
VDD = 50 Vdc, IDQ = 350 mA, f1 = 854 MHz
f2 = 860 MHz, Two--Tone Measurements
--20
--30
3rd Order
--40
5th Order
--50
--60
7th Order
--70
10
1
100
--30
3rd Order
--35
--40
5th Order
--45
--50
--55
7th Order
--60
--65
200
1
90
10
Pout, OUTPUT POWER (WATTS) PEP
TWO--TONE SPACING (MHz)
Figure 9. Intermodulation Distortion Products
versus Output Power
Figure 10. Intermodulation Distortion
Products versus Two--Tone Spacing
23.5
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
--10
23
Gps, POWER GAIN (dB)
VDD = 50 Vdc, Pout = 90 W (PEP), IDQ = 350 mA
f = 860 MHz, Two--Tone Measurements
--25
IDQ = 450 mA
22.5
22
350 mA
21.5
300 mA
21 250 mA
VDD = 50 Vdc, f1 = 854 MHz, f2 = 860 MHz
Two--Tone Measurements, 6 MHz Tone Spacing
20.5
VDD = 50 Vdc, f1 = 854 MHz, f2 = 860 MHz
Two--Tone Measurements, 6 MHz Tone Spacing
--20
--30
IDQ = 250 mA
--40
300 mA
--50
1
10
100
200
450 mA
350 mA
--60
20
1
Pout, OUTPUT POWER (WATTS) PEP
Figure 11. Two--Tone Power Gain versus
Output Power
10
100
200
Pout, OUTPUT POWER (WATTS) PEP
Figure 12. Third Order Intermodulation
Distortion versus Output Power
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
6
RF Device Data
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS — DVB--T (8k OFDM)
100
--20
7.61 MHz
--30
10
--50
DVB--T (8k OFDM)
64 QAM Data Carrier Modulation
5 Symbols
0.01
--90
--110
2
0
4
6
8
10
12
--3
--2
--1
0
1
2
3
4
Figure 13. Single--Carrier DVB--T (8k OFDM)
Figure 14. DVB--T (8k OFDM) Spectrum
350 mA
300 mA
VDD = 50 Vdc, f = 860 MHz
DVB--T (8k OFDM), 64 QAM Data
Carrier Modulation, 5 Symbols
20.5
10
1
40
--54
VDD = 50 Vdc, f = 860 MHz
--56 DVB--T (8k OFDM), 64 QAM Data
Carrier Modulation, 5 Symbols
--58
--60
IDQ = 250 mA
--62
300 mA
--64
350 mA
--66
450 mA
--68
Gps, POWER GAIN (dB)
Figure 16. Single--Carrier DVB--T (8k OFDM) ACPR
versus Output Power (Narrowband Test Circuit)
50
--30_C
VDD = 50 Vdc, IDQ = 350 mA
f = 860 MHz, DVB--T (8k OFDM)
64 QAM Data Carrier Modulation
5 Symbols
85_C
--45
--50
ηD
25_C
30
20
--55
85_C
Gps
--60
TC = --30_C
25_C
ACPR
--65
10
0
--70
1
40
Pout, OUTPUT POWER (WATTS) AVG.
Figure 15. Single--Carrier DVB--T (8k OFDM) Power Gain
versus Output Power (Narrowband Test Circuit)
ηD, DRAIN
EFFICIENCY (%)
10
1
Pout, OUTPUT POWER (WATTS) AVG.
40
5
10
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
250 mA
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
Gps, POWER GAIN (dB)
--4
f, FREQUENCY (MHz)
22.5
21
--5
PEAK--TO--AVERAGE (dB)
IDQ = 450 mA
21.5
DVB--T (8k OFDM)
64 QAM Data Carrier Modulation, 5 Symbols
--100
23
22
4 kHz BW
ACPR Measured at 4 MHz Offset
from Center Frequency
--70
--80
0.001
0.0001
4 kHz BW
--60
0.1
(dB)
PROBABILITY (%)
--40
1
40
Pout, OUTPUT POWER (WATTS) AVG.
Figure 17. Single--Carrier DVB--T (8k OFDM) Drain
Efficiency, Power Gain and ACPR versus Output Power
(Narrowband Test Circuit)
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
7
TYPICAL CHARACTERISTICS
109
VDD = 50 Vdc
Pout = 18 W Avg.
ηD = 28.5%
MTTF (HOURS)
108
107
106
105
104
90
110
130
150
170
190
210
230
250
TJ, JUNCTION TEMPERATURE (°C)
MTTF calculator available at http://www.freescale.com/rf. Select
Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
Figure 18. MTTF versus Junction Temperature -- CW
VDD = 50 Vdc, IDQ = 350 mA, Pout = 18 W Average
f
MHz
Zsource
Ω
Zload
Ω
860
1.58 -- j0.89
3.51 -- j3.98
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
= Test circuit impedance as measured from
drain to ground.
Output
Matching
Network
Device
Under
Test
Input
Matching
Network
Z
source
Z
load
Figure 19. Series Equivalent Source and Load Impedance (Narrowband Test Circuit)
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
8
RF Device Data
Freescale Semiconductor, Inc.
470--860 MHz BROADBAND REFERENCE CIRCUIT
VDD = 50 Volts, IDQ = 450 mA, Channel Bandwidth = 8 MHz, Input
Signal PAR = 9.5 dB @ 0.01% Probability on CCDF.
Signal Type
Pout
(W)
f
(MHz)
Gps
(dB)
ηD
(%)
Output
PAR
(dB)
IMD
Shoulder
(dBc)
DVB--T (8k OFDM)
4.5 Avg.
470
21.5
11.6
9.9
--37.5
650
22.8
11.8
9.9
--41.7
860
21.8
11.9
9.8
--40.3
470
21.6
18.2
9.5
--37.4
650
22.8
18.6
9.7
--40.2
860
21.8
18.9
9.5
--39.0
470
21.6
26.8
8.6
--31.8
650
22.9
28.0
8.7
--34.4
860
21.9
28.3
7.9
--29.2
9 Avg.
18 Avg.
R1
VDD
VGG
C14
C15
C16 C17
C13
C20
C5
C4
C7
C1
C12
C9
C2
C8
C6
C18 C19
C3
C11
C10
Q1
MRF6V3090N
Rev. 2
Figure 20. MRF6V3090NR1(NBR1) 470--860 MHz Broadband 2″ × 3″ Compact Reference Circuit Component Layout
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
9
470--860 MHz BROADBAND REFERENCE CIRCUIT
Table 7. MRF6V3090NR1(NBR1) 470--860 MHz Broadband 2″ × 3″ Reference Circuit Component Designations and
Values
Part
Description
Part Number
Manufacturer
C1, C12
100 pF Chip Capacitors
ATC100B101JT500XT
ATC
C2
1.8 pF Chip Capacitor
ATC100B1R8BT500XT
ATC
C3
6.2 pF Chip Capacitor
ATC100B6R2BT500XT
ATC
C4, C5, C6
13 pF Chip Capacitors
ATC100B130JT500XT
ATC
C7, C8, C11
2.2 pF Chip Capacitors
ATC100B2R2JT500XT
ATC
C9
15 pF Chip Capacitor
ATC100B150JT500XT
ATC
C10
3.9 pF Chip Capacitor
ATC100B3R9CT500XT
ATC
C13
47 μF, 16 V Tantalum Capacitor
T491D476K016AS
Kemet
C14, C17, C19
2.2 μF, 100 V Chip Capacitors
C3225X7R2A225KT
TDK
C15, C16, C18
220 pF Chip Capacitors
ATC100B221JT200XT
ATC
C20
470 μF, 63 V Electrolytic Capacitor
MCGPR63V477M13X26--RH
Multicomp
Q1
RF High Power Transistor
MRF6V3090NBR1
Freescale
R1
10 Ω, 1/4 W Chip Resistor
CRCW120610RJ
Vishay
PCB
0.030″, εr = 3.5
RO4350B
Rogers
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
10
RF Device Data
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS — 470--860 MHz BROADBAND REFERENCE CIRCUIT
23
Gps, POWER GAIN (dB)
60
VDD = 50 Vdc, IDQ = 450 mA, DVB--T (8k OFDM)
64 QAM Data Carrier Modulation, 5 Symbols
50
Gps
22
Pout = 4.5 W
9W
18 W
21
40
30
18 W
ηD
20
ηD, DRAIN EFFICIENCY (%)
24
20
9W
19
4.5 W
18
450
500
550
600
650
700
750
800
10
0
900
850
f, FREQUENCY (MHz)
Figure 21. Single--Carrier DVB--T (8k OFDM) Power Gain and Drain
Efficiency versus Frequency (Broadband Reference Circuit)
12
0
Pout = 4.5 W
OUTPUT PAR (dB)
10
9W
9
PAR
8
18 W
7
6
18 W
IMD(1)
5
9W
4
3
450
4.5 W
495
540
585
630
675
720
765
810
855
--5
--10
--15
--20
--25
--30
--35
IMD, INTERMODULATION
DISTORTION SHOULDER (dBc)
VDD = 50 Vdc, IDQ = 450 mA, DVB--T (8k OFDM)
11 64 QAM Data Carrier Modulation, 5 Symbols
--40
--45
900
f, FREQUENCY (MHz)
(1) Intermodulation distortion shoulder measurement made using
delta marker at 4.2 MHz offset from center frequency.
Figure 22. Single--Carrier DVB--T (8k OFDM) Output PAR and IMD
Shoulder versus Frequency (Broadband Reference Circuit)
70
VDD = 50 Vdc, IDQ = 450 mA
Pulse Width = 100 μsec, 10% Duty Cycle
25
620 MHz
Gps, POWER GAIN (dB)
860 MHz
24
Gps
620 MHz
23
740 MHz
22
860 MHz
30
20
ηD
1
40
30
20
19
50
470 MHz
470 MHz
21
60
740
MHz
10
10
100
ηD, DRAIN EFFICIENCY (%)
26
0
200
Pout, OUTPUT POWER (WATTS) PULSED
Figure 23. Pulsed Power Gain and Drain Efficiency
versus Output Power (Broadband Reference Circuit)
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
11
PACKAGE DIMENSIONS
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
12
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
13
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
14
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
15
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
16
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
RF Device Data
Freescale Semiconductor, Inc.
17
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
• AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
• AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
• EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
• Electromigration MTTF Calculator
• RF High Power Model
• .s2p File
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Apr. 2010
• Initial Release of Data Sheet
1
Dec. 2011
• Changed “DVB--T OFDM” to “DVB--T (8k OFDM)” throughout
• Fig. 6, CW Output Power versus Input Power: corrected typographical error in dBm to watts conversion
values, p. 5
• Fig. 7, CW Power Gain versus Output Power (Narrowband Test Circuit): adjusted x--axis scale from 0 to
140 watts to 10 to 150 watts, p. 5
• Updated Fig. 9, Intermodulation Distortion Products versus Output Power, to correct X--axis PEP power
values, p. 6
• Fig. 10, Intermodulation Distortion Products versus Two--Tone Spacing: added f = 860 MHz to graph
callouts, p. 6
• Updated Fig. 11, Two--Tone Power Gain versus Output Power, to correct X--axis PEP power values, p. 6
• Updated Fig. 12, Third Order Intermodulation Distortion versus Output Power, to correct X--axis PEP
power values, p. 6
• Fig. 18, MTTF versus Junction Temperature -- CW: MTTF end temperature on graph changed to match
maximum operating junction temperature, p. 8
• Fig. 19, Series Equivalent Source and Load Impedance: removed plot, p. 9
• Added 470--860 MHz Broadband Reference Circuit frequency table, p. 9
• Added Fig. 20, 470--860 MHz Broadband 2″ × 3″ Compact Reference Circuit Component Layout, p. 9
• Added Table 7, 470--860 MHz Broadband 2″ × 3″ Reference Circuit Component Designations and Values,
p. 10
• Added Fig. 21, Single--Carrier DVB--T (8k OFDM) Power Gain and Drain Efficiency versus Frequency
(Broadband Reference Circuit), p. 11
• Added Fig. 22, Single--Carrier DVB--T (8k OFDM) Output PAR and IMD Shoulder versus Frequency
(Broadband Reference Circuit), p. 11
• Added Fig. 23, Pulsed Power Gain and Drain Efficiency versus Output Power (Broadband Reference
Circuit), p. 11
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
18
RF Device Data
Freescale Semiconductor, Inc.
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1--800--521--6274 or +1--480--768--2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1--8--1, Shimo--Meguro, Meguro--ku,
Tokyo 153--0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 10 5879 8000
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
1--800--441--2447 or +1--303--675--2140
Fax: +1--303--675--2150
[email protected]
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of
any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do
vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2010--2011. All rights reserved.
MRF6V3090NR1 MRF6V3090NR5 MRF6V3090NBR1 MRF6V3090NBR5
Document
Number:
RF
Device
Data MRF6V3090N
Rev. 1, 12/2011
Freescale
Semiconductor, Inc.
19
Similar pages