Altera EPF10K100A Embedded programmable logic device family Datasheet

Includes
FLEX 10KA
FLEX 10K
Embedded Programmable
Logic Device Family
®
January 2003, ver. 4.2
Features...
Data Sheet
■
■
■
The industry’s first embedded programmable logic device (PLD)
family, providing System-on-a-Programmable-Chip (SOPC)
integration
–
Embedded array for implementing megafunctions, such as
efficient memory and specialized logic functions
–
Logic array for general logic functions
High density
–
10,000 to 250,000 typical gates (see Tables 1 and 2)
–
Up to 40,960 RAM bits; 2,048 bits per embedded array block
(EAB), all of which can be used without reducing logic capacity
System-level features
–
MultiVoltTM I/O interface support
–
5.0-V tolerant input pins in FLEX® 10KA devices
–
Low power consumption (typical specification less than 0.5 mA
in standby mode for most devices)
–
FLEX 10K and FLEX 10KA devices support peripheral
component interconnect Special Interest Group (PCI SIG) PCI
Local Bus Specification, Revision 2.2
–
FLEX 10KA devices include pull-up clamping diode, selectable
on a pin-by-pin basis for 3.3-V PCI compliance
–
Select FLEX 10KA devices support 5.0-V PCI buses with eight or
fewer loads
–
Built-in Joint Test Action Group (JTAG) boundary-scan test
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
without consuming any device logic
Table 1. FLEX 10K Device Features
Feature
EPF10K10
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K40
Typical gates (logic and RAM) (1)
10,000
20,000
30,000
40,000
50,000
Maximum system gates
31,000
63,000
69,000
93,000
116,000
Logic elements (LEs)
576
1,152
1,728
2,304
2,880
Logic array blocks (LABs)
72
144
216
288
360
Embedded array blocks (EABs)
Total RAM bits
Maximum user I/O pins
Altera Corporation
DS-F10K-4.2
EPF10K50
EPF10K50V
3
6
6
8
10
6,144
12,288
12,288
16,384
20,480
150
189
246
189
310
1
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 2. FLEX 10K Device Features
Feature
EPF10K70
EPF10K100
EPF10K100A
EPF10K130V
EPF10K250A
Typical gates (logic and
RAM) (1)
70,000
100,000
130,000
250,000
Maximum system gates
118,000
158,000
211,000
310,000
3,744
4,992
6,656
12,160
LABs
468
624
832
1,520
EABs
9
12
16
20
18,432
24,576
32,768
40,960
358
406
470
470
LEs
Total RAM bits
Maximum user I/O pins
Note to tables:
(1)
The embedded IEEE Std. 1149.1 JTAG circuitry adds up to 31,250 gates in addition to the listed typical or maximum
system gates.
...and More
Features
–
–
–
–
–
Devices are fabricated on advanced processes and operate with
a 3.3-V or 5.0-V supply voltage (see Table 3
In-circuit reconfigurability (ICR) via external configuration
device, intelligent controller, or JTAG port
ClockLockTM and ClockBoostTM options for reduced clock
delay/skew and clock multiplication
Built-in low-skew clock distribution trees
100% functional testing of all devices; test vectors or scan chains
are not required
Table 3. Supply Voltages for FLEX 10K & FLEX 10KA Devices
2
5.0-V Devices
3.3-V Devices
EPF10K10
EPF10K20
EPF10K30
EPF10K40
EPF10K50
EPF10K70
EPF10K100
EPF10K10A
EPF10K30A
EPF10K50V
EPF10K100A
EPF10K130V
EPF10K250A
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
■
■
■
■
■
■
Altera Corporation
Flexible interconnect
–
FastTrack® Interconnect continuous routing structure for fast,
predictable interconnect delays
–
Dedicated carry chain that implements arithmetic functions such
as fast adders, counters, and comparators (automatically used by
software tools and megafunctions)
–
Dedicated cascade chain that implements high-speed,
high-fan-in logic functions (automatically used by software tools
and megafunctions)
–
Tri-state emulation that implements internal tri-state buses
–
Up to six global clock signals and four global clear signals
Powerful I/O pins
–
Individual tri-state output enable control for each pin
–
Open-drain option on each I/O pin
–
Programmable output slew-rate control to reduce switching
noise
–
FLEX 10KA devices support hot-socketing
Peripheral register for fast setup and clock-to-output delay
Flexible package options
–
Available in a variety of packages with 84 to 600 pins (see
Tables 4 and 5)
–
Pin-compatibility with other FLEX 10K devices in the same
package
–
FineLine BGATM packages maximize board space efficiency
Software design support and automatic place-and-route provided by
Altera development systems for Windows-based PCs and Sun
SPARCstation, HP 9000 Series 700/800 workstations
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
3
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 4. FLEX 10K Package Options & I/O Pin Count
Device
84-Pin
PLCC
EPF10K10
100-Pin
TQFP
Note (1)
144-Pin TQFP
208-Pin
PQFP
RQFP
102
134
102
134
59
EPF10K10A
66
EPF10K20
102
EPF10K30
EPF10K30A
102
EPF10K40
240-Pin
PQFP
RQFP
147
189
147
189
147
189
147
189
EPF10K50
189
EPF10K50V
189
EPF10K70
189
EPF10K100
EPF10K100A
189
EPF10K130V
EPF10K250A
Table 5. FLEX 10K Package Options & I/O Pin Count (Continued)
Device
503-Pin 599-Pin
PGA
PGA
256-Pin
FineLine BGA
356-Pin
BGA
Note (1)
484-Pin
FineLine BGA
600-Pin
BGA
403-Pin
PGA
EPF10K10
EPF10K10A
150
150 (2)
EPF10K20
EPF10K30
246
EPF10K30A
191
246
246
EPF10K40
EPF10K50
274
EPF10K50V
274
EPF10K70
358
EPF10K100
406
EPF10K100A
4
274
310
369
406
EPF10K130V
470
470
EPF10K250A
470
470
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
FLEX 10K and FLEX 10KA device package types include plastic J-lead chip carrier (PLCC), thin quad flat pack
(TQFP), plastic quad flat pack (PQFP), power quad flat pack (RQFP), ball-grid array (BGA), pin-grid array (PGA),
and FineLine BGATM packages.
This option is supported with a 256-pin FineLine BGA package. By using SameFrame pin migration, all FineLine
BGA packages are pin compatible. For example, a board can be designed to support both 256-pin and 484-pin
FineLine BGA packages. The Altera software automatically avoids conflicting pins when future migration is set.
General
Description
Altera’s FLEX 10K devices are the industry’s first embedded PLDs. Based
on reconfigurable CMOS SRAM elements, the Flexible Logic Element
MatriX (FLEX) architecture incorporates all features necessary to
implement common gate array megafunctions. With up to 250,000 gates,
the FLEX 10K family provides the density, speed, and features to integrate
entire systems, including multiple 32-bit buses, into a single device.
FLEX 10K devices are reconfigurable, which allows 100% testing prior to
shipment. As a result, the designer is not required to generate test vectors
for fault coverage purposes. Additionally, the designer does not need to
manage inventories of different ASIC designs; FLEX 10K devices can be
configured on the board for the specific functionality required.
Table 6 shows FLEX 10K performance for some common designs. All
performance values were obtained with Synopsys DesignWare or LPM
functions. No special design technique was required to implement the
applications; the designer simply inferred or instantiated a function in a
Verilog HDL, VHDL, Altera Hardware Description Language (AHDL), or
schematic design file.
Table 6. FLEX 10K & FLEX 10KA Performance
Application
16-bit loadable
counter (1)
Resources
Used
Performance
Units
LEs
EABs
-1 Speed
Grade
-2 Speed
Grade
-3 Speed
Grade
-4 Speed
Grade
16
0
204
166
125
95
MHz
MHz
16-bit accumulator (1)
16
0
204
166
125
95
16-to-1 multiplexer (2)
10
0
4.2
5.8
6.0
7.0
ns
256 × 8 RAM read
cycle speed (3)
0
1
172
145
108
84
MHz
256 × 8 RAM write
cycle speed (3)
0
1
106
89
68
63
MHz
Notes:
(1)
(2)
(3)
The speed grade of this application is limited because of clock high and low specifications.
This application uses combinatorial inputs and outputs.
This application uses registered inputs and outputs.
Altera Corporation
5
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
The FLEX 10K architecture is similar to that of embedded gate arrays, the
fastest-growing segment of the gate array market. As with standard gate
arrays, embedded gate arrays implement general logic in a conventional
“sea-of-gates” architecture. In addition, embedded gate arrays have
dedicated die areas for implementing large, specialized functions. By
embedding functions in silicon, embedded gate arrays provide reduced
die area and increased speed compared to standard gate arrays. However,
embedded megafunctions typically cannot be customized, limiting the
designer’s options. In contrast, FLEX 10K devices are programmable,
providing the designer with full control over embedded megafunctions
and general logic while facilitating iterative design changes during
debugging.
Each FLEX 10K device contains an embedded array and a logic array. The
embedded array is used to implement a variety of memory functions or
complex logic functions, such as digital signal processing (DSP),
microcontroller, wide-data-path manipulation, and data-transformation
functions. The logic array performs the same function as the sea-of-gates
in the gate array: it is used to implement general logic, such as counters,
adders, state machines, and multiplexers. The combination of embedded
and logic arrays provides the high performance and high density of
embedded gate arrays, enabling designers to implement an entire system
on a single device.
FLEX 10K devices are configured at system power-up with data stored in
an Altera serial configuration device or provided by a system controller.
Altera offers the EPC1, EPC2, EPC16, and EPC1441 configuration devices,
which configure FLEX 10K devices via a serial data stream. Configuration
data can also be downloaded from system RAM or from Altera’s
BitBlasterTM serial download cable or ByteBlasterMVTM parallel port
download cable. After a FLEX 10K device has been configured, it can be
reconfigured in-circuit by resetting the device and loading new data.
Because reconfiguration requires less than 320 ms, real-time changes can
be made during system operation.
FLEX 10K devices contain an optimized interface that permits
microprocessors to configure FLEX 10K devices serially or in parallel, and
synchronously or asynchronously. The interface also enables
microprocessors to treat a FLEX 10K device as memory and configure the
device by writing to a virtual memory location, making it very easy for the
designer to reconfigure the device.
6
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
f
For more information, see the following documents:
■
■
■
■
Configuration Devices for APEX & FLEX Devices Data Sheet
BitBlaster Serial Download Cable Data Sheet
ByteBlasterMV Parallel Port Download Cable Data Sheet
Application Note 116 (Configuring APEX 20K, FLEX 10K & FLEX 6000
Devices)
FLEX 10K devices are supported by Altera development systems; single,
integrated packages that offer schematic, text (including AHDL), and
waveform design entry, compilation and logic synthesis, full simulation
and worst-case timing analysis, and device configuration. The Altera
software provides EDIF 2 0 0 and 3 0 0, LPM, VHDL, Verilog HDL, and
other interfaces for additional design entry and simulation support from
other industry-standard PC- and UNIX workstation-based EDA tools.
The Altera software works easily with common gate array EDA tools for
synthesis and simulation. For example, the Altera software can generate
Verilog HDL files for simulation with tools such as Cadence Verilog-XL.
Additionally, the Altera software contains EDA libraries that use devicespecific features such as carry chains which are used for fast counter and
arithmetic functions. For instance, the Synopsys Design Compiler library
supplied with the Altera development systems include DesignWare
functions that are optimized for the FLEX 10K architecture.
The Altera development systems run on Windows-based PCs and Sun
SPARCstation, and HP 9000 Series 700/800 workstations.
f
Functional
Description
See the MAX+PLUS II Programmable Logic Development System & Software
Data Sheet for more information.
Each FLEX 10K device contains an embedded array to implement
memory and specialized logic functions, and a logic array to implement
general logic.
The embedded array consists of a series of EABs. When implementing
memory functions, each EAB provides 2,048 bits, which can be used to
create RAM, ROM, dual-port RAM, or first-in first-out (FIFO) functions.
When implementing logic, each EAB can contribute 100 to 600 gates
towards complex logic functions, such as multipliers, microcontrollers,
state machines, and DSP functions. EABs can be used independently, or
multiple EABs can be combined to implement larger functions.
Altera Corporation
7
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
The logic array consists of logic array blocks (LABs). Each LAB contains
eight LEs and a local interconnect. An LE consists of a 4-input look-up
table (LUT), a programmable flipflop, and dedicated signal paths for carry
and cascade functions. The eight LEs can be used to create medium-sized
blocks of logic—8-bit counters, address decoders, or state machines—or
combined across LABs to create larger logic blocks. Each LAB represents
about 96 usable gates of logic.
Signal interconnections within FLEX 10K devices and to and from device
pins are provided by the FastTrack Interconnect, a series of fast,
continuous row and column channels that run the entire length and width
of the device.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer and a flipflop that can be used as either an output
or input register to feed input, output, or bidirectional signals. When used
with a dedicated clock pin, these registers provide exceptional
performance. As inputs, they provide setup times as low as 1.6 ns and
hold times of 0 ns; as outputs, these registers provide clock-to-output
times as low as 5.3 ns. IOEs provide a variety of features, such as JTAG
BST support, slew-rate control, tri-state buffers, and open-drain outputs.
Figure 1 shows a block diagram of the FLEX 10K architecture. Each group
of LEs is combined into an LAB; LABs are arranged into rows and
columns. Each row also contains a single EAB. The LABs and EABs are
interconnected by the FastTrack Interconnect. IOEs are located at the end
of each row and column of the FastTrack Interconnect.
8
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 1. FLEX 10K Device Block Diagram
Embedded Array Block (EAB)
I/O Element
(IOE)
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
Column
Interconnect
Logic Array
EAB
Logic Array
Block (LAB)
IOE
IOE
IOE
IOE
Logic Element (LE)
Row
Interconnect
EAB
Local Interconnect
Logic
Array
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
Embedded Array
FLEX 10K devices provide six dedicated inputs that drive the flipflops’
control inputs to ensure the efficient distribution of high-speed, low-skew
(less than 1.5 ns) control signals. These signals use dedicated routing
channels that provide shorter delays and lower skews than the FastTrack
Interconnect. Four of the dedicated inputs drive four global signals. These
four global signals can also be driven by internal logic, providing an ideal
solution for a clock divider or an internally generated asynchronous clear
signal that clears many registers in the device.
Embedded Array Block
The EAB is a flexible block of RAM with registers on the input and output
ports, and is used to implement common gate array megafunctions. The
EAB is also suitable for functions such as multipliers, vector scalars, and
error correction circuits, because it is large and flexible. These functions
can be combined in applications such as digital filters and
microcontrollers.
Altera Corporation
9
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Logic functions are implemented by programming the EAB with a readonly pattern during configuration, creating a large LUT. With LUTs,
combinatorial functions are implemented by looking up the results, rather
than by computing them. This implementation of combinatorial functions
can be faster than using algorithms implemented in general logic, a
performance advantage that is further enhanced by the fast access times
of EABs. The large capacity of EABs enables designers to implement
complex functions in one logic level without the routing delays associated
with linked LEs or field-programmable gate array (FPGA) RAM blocks.
For example, a single EAB can implement a 4 × 4 multiplier with eight
inputs and eight outputs. Parameterized functions such as LPM functions
can automatically take advantage of the EAB.
The EAB provides advantages over FPGAs, which implement on-board
RAM as arrays of small, distributed RAM blocks. These FPGA RAM
blocks contain delays that are less predictable as the size of the RAM
increases. In addition, FPGA RAM blocks are prone to routing problems
because small blocks of RAM must be connected together to make larger
blocks. In contrast, EABs can be used to implement large, dedicated blocks
of RAM that eliminate these timing and routing concerns.
EABs can be used to implement synchronous RAM, which is easier to use
than asynchronous RAM. A circuit using asynchronous RAM must
generate the RAM write enable (WE) signal, while ensuring that its data
and address signals meet setup and hold time specifications relative to the
WE signal. In contrast, the EAB’s synchronous RAM generates its own WE
signal and is self-timed with respect to the global clock. A circuit using the
EAB’s self-timed RAM need only meet the setup and hold time
specifications of the global clock.
When used as RAM, each EAB can be configured in any of the following
sizes: 256 × 8, 512 × 4, 1,024 × 2, or 2,048 × 1. See Figure 2.
Figure 2. EAB Memory Configurations
256 × 8
10
512 × 4
1,024 × 2
2,048 × 1
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Larger blocks of RAM are created by combining multiple EABs. For
example, two 256 × 8 RAM blocks can be combined to form a
256 × 16 RAM block; two 512 × 4 blocks of RAM can be combined to form
a 512 × 8 RAM block. See Figure 3.
Figure 3. Examples of Combining EABs
256 × 16
512 × 8
256 × 8
512 × 4
256 × 8
512 × 4
If necessary, all EABs in a device can be cascaded to form a single RAM
block. EABs can be cascaded to form RAM blocks of up to 2,048 words
without impacting timing. Altera’s software automatically combines
EABs to meet a designer’s RAM specifications.
EABs provide flexible options for driving and controlling clock signals.
Different clocks can be used for the EAB inputs and outputs. Registers can
be independently inserted on the data input, EAB output, or the address
and WE inputs. The global signals and the EAB local interconnect can drive
the WE signal. The global signals, dedicated clock pins, and EAB local
interconnect can drive the EAB clock signals. Because the LEs drive the
EAB local interconnect, the LEs can control the WE signal or the EAB clock
signals.
Each EAB is fed by a row interconnect and can drive out to row and
column interconnects. Each EAB output can drive up to two row channels
and up to two column channels; the unused row channel can be driven by
other LEs. This feature increases the routing resources available for EAB
outputs. See Figure 4.
Altera Corporation
11
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 4. FLEX 10K Embedded Array Block
Dedicated Inputs &
Global Signals
Chip-Wide
Reset
Row Interconnect
(1)
2, 4, 8, 16
6
D
Q
Data
In
Data
Out
D
24
Q
8, 4, 2, 1
2, 4, 8, 16
Address
D
Q
8, 9, 10, 11
RAM/ROM
256 × 8
512 × 4
1,024 × 2
2,048 × 1
Column
Interconnect
WE
D
Q
EAB Local Interconnect (1)
Note:
(1)
EPF10K10, EPF10K10A, EPF10K20, EPF10K30, EPF10K30A, EPF10K40, EPF10K50, and EPF10K50V devices have
22 EAB local interconnect channels; EPF10K70, EPF10K100, EPF10K100A, EPF10K130V, and EPF10K250A devices
have 26.
12
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Logic Array Block
Each LAB consists of eight LEs, their associated carry and cascade chains,
LAB control signals, and the LAB local interconnect. The LAB provides
the coarse-grained structure to the FLEX 10K architecture, facilitating
efficient routing with optimum device utilization and high performance.
See Figure 5.
Figure 5. FLEX 10K LAB
Dedicated Inputs &
Global Signals
(1)
LAB Local
Interconnect (2)
Row Interconnect
6
16
4
See Figure 11
for details.
4
LAB Control
Signals
4
Carry-In &
Cascade-In
2
4
LE1
4
LE2
4
LE3
4
LE4
4
LE5
4
LE6
4
LE7
4
LE8
8
2
8
24
Column-to-Row
Interconnect
Column
Interconnect
8
16
Carry-Out &
Cascade-Out
Notes:
(1)
(2)
EPF10K10, EPF10K10A, EPF10K20, EPF10K30, EPF10K30A, EPF10K40, EPF10K50, and EPF10K50V devices have
22 inputs to the LAB local interconnect channel from the row; EPF10K70, EPF10K100, EPF10K100A, EPF10K130V,
and EPF10K250A devices have 26.
EPF10K10, EPF10K10A, EPF10K20, EPF10K30, EPF10K30A, EPF10K40, EPF10K50, and EPF10K50V devices have
30 LAB local interconnect channels; EPF10K70, EPF10K100, EPF10K100A, EPF10K130V, and EPF10K250A devices
have 34 LABs.
Altera Corporation
13
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Each LAB provides four control signals with programmable inversion
that can be used in all eight LEs. Two of these signals can be used as clocks;
the other two can be used for clear/preset control. The LAB clocks can be
driven by the dedicated clock input pins, global signals, I/O signals, or
internal signals via the LAB local interconnect. The LAB preset and clear
control signals can be driven by the global signals, I/O signals, or internal
signals via the LAB local interconnect. The global control signals are
typically used for global clock, clear, or preset signals because they
provide asynchronous control with very low skew across the device. If
logic is required on a control signal, it can be generated in one or more LEs
in any LAB and driven into the local interconnect of the target LAB. In
addition, the global control signals can be generated from LE outputs.
Logic Element
The LE, the smallest unit of logic in the FLEX 10K architecture, has a
compact size that provides efficient logic utilization. Each LE contains a
four-input LUT, which is a function generator that can quickly compute
any function of four variables. In addition, each LE contains a
programmable flipflop with a synchronous enable, a carry chain, and a
cascade chain. Each LE drives both the local and the FastTrack
Interconnect. See Figure 6.
Figure 6. FLEX 10K Logic Element
Carry-In
data1
data2
data3
data4
Look-Up
Table
(LUT)
Carry
Chain
Cascade-In
Cascade
Chain
Register Bypass
D
PRN
Q
Programmable
Register
To FastTrack
Interconnect
ENA
CLRN
To LAB Local
Interconnect
labctrl1
labctrl2
Clear/
Preset
Logic
Chip-Wide
Reset
Clock
Select
labctrl3
labctrl4
Carry-Out
14
Cascade-Out
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
The programmable flipflop in the LE can be configured for D, T, JK, or SR
operation. The clock, clear, and preset control signals on the flipflop can
be driven by global signals, general-purpose I/O pins, or any internal
logic. For combinatorial functions, the flipflop is bypassed and the output
of the LUT drives the output of the LE.
The LE has two outputs that drive the interconnect; one drives the local
interconnect and the other drives either the row or column FastTrack
Interconnect. The two outputs can be controlled independently. For
example, the LUT can drive one output while the register drives the other
output. This feature, called register packing, can improve LE utilization
because the register and the LUT can be used for unrelated functions.
The FLEX 10K architecture provides two types of dedicated high-speed
data paths that connect adjacent LEs without using local interconnect
paths: carry chains and cascade chains. The carry chain supports highspeed counters and adders; the cascade chain implements wide-input
functions with minimum delay. Carry and cascade chains connect all LEs
in an LAB and all LABs in the same row. Intensive use of carry and
cascade chains can reduce routing flexibility. Therefore, the use of these
chains should be limited to speed-critical portions of a design.
Carry Chain
The carry chain provides a very fast (as low as 0.2 ns) carry-forward
function between LEs. The carry-in signal from a lower-order bit drives
forward into the higher-order bit via the carry chain, and feeds into both
the LUT and the next portion of the carry chain. This feature allows the
FLEX 10K architecture to implement high-speed counters, adders, and
comparators of arbitrary width efficiently. Carry chain logic can be
created automatically by the Compiler during design processing, or
manually by the designer during design entry. Parameterized functions
such as LPM and DesignWare functions automatically take advantage of
carry chains.
Carry chains longer than eight LEs are automatically implemented by
linking LABs together. For enhanced fitting, a long carry chain skips
alternate LABs in a row. A carry chain longer than one LAB skips either
from even-numbered LAB to even-numbered LAB, or from oddnumbered LAB to odd-numbered LAB. For example, the last LE of the
first LAB in a row carries to the first LE of the third LAB in the row. The
carry chain does not cross the EAB at the middle of the row. For instance,
in the EPF10K50 device, the carry chain stops at the eighteenth LAB and a
new one begins at the nineteenth LAB.
Altera Corporation
15
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 7 shows how an n-bit full adder can be implemented in n + 1 LEs
with the carry chain. One portion of the LUT generates the sum of two bits
using the input signals and the carry-in signal; the sum is routed to the
output of the LE. The register can either be bypassed for simple adders or
be used for an accumulator function. The carry chain logic generates the
carry-out signal, which is routed directly to the carry-in signal of the nexthigher-order bit. The final carry-out signal is routed to an LE, where it can
be used as a general-purpose signal.
Figure 7. Carry Chain Operation (n-bit Full Adder)
Carry-In
a1
b1
LUT
s1
Register
Carry Chain
LE1
a2
b2
LUT
s2
Register
Carry Chain
LE2
an
bn
LUT
sn
Register
Carry Chain
LEn
LUT
Register
Carry-Out
Carry Chain
LEn + 1
16
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Cascade Chain
With the cascade chain, the FLEX 10K architecture can implement
functions that have a very wide fan-in. Adjacent LUTs can be used to
compute portions of the function in parallel; the cascade chain serially
connects the intermediate values. The cascade chain can use a logical AND
or logical OR (via De Morgan’s inversion) to connect the outputs of
adjacent LEs. Each additional LE provides four more inputs to the
effective width of a function, with a delay as low as 0.7 ns per LE. Cascade
chain logic can be created automatically by the Compiler during design
processing, or manually by the designer during design entry.
Cascade chains longer than eight bits are implemented automatically by
linking several LABs together. For easier routing, a long cascade chain
skips every other LAB in a row. A cascade chain longer than one LAB
skips either from even-numbered LAB to even-numbered LAB, or from
odd-numbered LAB to odd-numbered LAB (e.g., the last LE of the first
LAB in a row cascades to the first LE of the third LAB). The cascade chain
does not cross the center of the row (e.g., in the EPF10K50 device, the
cascade chain stops at the eighteenth LAB and a new one begins at the
nineteenth LAB). This break is due to the EAB’s placement in the middle
of the row.
Figure 8 shows how the cascade function can connect adjacent LEs to form
functions with a wide fan-in. These examples show functions of 4n
variables implemented with n LEs. The LE delay is as low as 1.6 ns; the
cascade chain delay is as low as 0.7 ns. With the cascade chain, 3.7 ns is
needed to decode a 16-bit address.
Figure 8. Cascade Chain Operation
AND Cascade Chain
d[3..0]
OR Cascade Chain
d[3..0]
LUT
LUT
LE1
d[7..4]
LE1
d[7..4]
LUT
LUT
LE2
d[(4n-1)..(4n-4)]
d[(4n-1)..(4n-4)]
LUT
LEn
Altera Corporation
LE2
LUT
LEn
17
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
LE Operating Modes
The FLEX 10K LE can operate in the following four modes:
■
■
■
■
Normal mode
Arithmetic mode
Up/down counter mode
Clearable counter mode
Each of these modes uses LE resources differently. In each mode, seven
available inputs to the LE—the four data inputs from the LAB local
interconnect, the feedback from the programmable register, and the
carry-in and cascade-in from the previous LE—are directed to different
destinations to implement the desired logic function. Three inputs to the
LE provide clock, clear, and preset control for the register. The Altera
software, in conjunction with parameterized functions such as LPM and
DesignWare functions, automatically chooses the appropriate mode for
common functions such as counters, adders, and multipliers. If required,
the designer can also create special-purpose functions which use a specific
LE operating mode for optimal performance.
The architecture provides a synchronous clock enable to the register in all
four modes. The Altera software can set DATA1 to enable the register
synchronously, providing easy implementation of fully synchronous
designs.
Figure 9 shows the LE operating modes.
18
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 9. FLEX 10K LE Operating Modes
Normal Mode
Cascade-In (1)
Carry-In
LE-Out to FastTrack
Interconnect
data1
data2
4-Input
LUT
data3
D
PRN
Q
LE-Out to Local
Interconnect
ENA
CLRN
data4
Cascade-Out
Arithmetic Mode
Carry-In
Cascade-In
LE-Out
data1
data2
PRN
D
Q
3-Input
LUT
ENA
CLRN
3-Input
LUT
Cascade-Out
Carry-Out
Up/Down Counter Mode
Cascade-In
Carry-In
data1 (ena)
data2 (u/d)
3-Input
LUT
1
D
PRN
Q
LE-Out
0
data3 (data)
ENA
CLRN
3-Input
LUT
data4 (nload)
Carry-Out
Cascade-Out
Clearable Counter Mode
Carry-In
data1 (ena)
data2 (nclr)
3-Input
LUT
D
1
PRN
Q
LE-Out
0
data3 (data)
ENA
CLRN
3-Input
LUT
data4 (nload)
Carry-Out
Cascade-Out
Note:
(1)
Packed registers cannot be used with the cascade chain.
Altera Corporation
19
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Normal Mode
The normal mode is suitable for general logic applications and wide
decoding functions that can take advantage of a cascade chain. In normal
mode, four data inputs from the LAB local interconnect and the carry-in
are inputs to a four-input LUT. The Compiler automatically selects the
carry-in or the DATA3 signal as one of the inputs to the LUT. The LUT
output can be combined with the cascade-in signal to form a cascade chain
through the cascade-out signal. Either the register or the LUT can be used
to drive both the local interconnect and the FastTrack Interconnect at the
same time.
The LUT and the register in the LE can be used independently; this feature
is known as register packing. To support register packing, the LE has two
outputs; one drives the local interconnect and the other drives the
FastTrack Interconnect. The DATA4 signal can drive the register directly,
allowing the LUT to compute a function that is independent of the
registered signal; a three-input function can be computed in the LUT, and
a fourth independent signal can be registered. Alternatively, a four-input
function can be generated, and one of the inputs to this function can be
used to drive the register. The register in a packed LE can still use the clock
enable, clear, and preset signals in the LE. In a packed LE, the register can
drive the FastTrack Interconnect while the LUT drives the local
interconnect, or vice versa.
Arithmetic Mode
The arithmetic mode offers 2 three-input LUTs that are ideal for
implementing adders, accumulators, and comparators. One LUT
computes a three-input function, and the other generates a carry output.
As shown in Figure 9 on page 19, the first LUT uses the carry-in signal and
two data inputs from the LAB local interconnect to generate a
combinatorial or registered output. For example, in an adder, this output
is the sum of three signals: a, b, and carry-in. The second LUT uses the
same three signals to generate a carry-out signal, thereby creating a carry
chain. The arithmetic mode also supports simultaneous use of the cascade
chain.
20
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Up/Down Counter Mode
The up/down counter mode offers counter enable, clock enable,
synchronous up/down control, and data loading options. These control
signals are generated by the data inputs from the LAB local interconnect,
the carry-in signal, and output feedback from the programmable register.
The Up/down counter mode uses 2 three-input LUTs: one generates the
counter data, and the other generates the fast carry bit. A 2-to-1
multiplexer provides synchronous loading. Data can also be loaded
asynchronously with the clear and preset register control signals, without
using the LUT resources.
Clearable Counter Mode
The clearable counter mode is similar to the up/down counter mode, but
supports a synchronous clear instead of the up/down control. The clear
function is substituted for the cascade-in signal in the up/down counter
mode. Clearable counter mode uses 2 three-input LUTs: one generates the
counter data, and the other generates the fast carry bit. Synchronous
loading is provided by a 2-to-1 multiplexer. The output of this multiplexer
is ANDed with a synchronous clear signal.
Internal Tri-State Emulation
Internal tri-state emulation provides internal tri-stating without the
limitations of a physical tri-state bus. In a physical tri-state bus, the
tri-state buffers’ output enable (OE) signals select which signal drives the
bus. However, if multiple OE signals are active, contending signals can be
driven onto the bus. Conversely, if no OE signals are active, the bus will
float. Internal tri-state emulation resolves contending tri-state buffers to a
low value and floating buses to a high value, thereby eliminating these
problems. The Altera software automatically implements tri-state bus
functionality with a multiplexer.
Clear & Preset Logic Control
Logic for the programmable register’s clear and preset functions is
controlled by the DATA3, LABCTRL1, and LABCTRL2 inputs to the LE. The
clear and preset control structure of the LE asynchronously loads signals
into a register. Either LABCTRL1 or LABCTRL2 can control the
asynchronous clear. Alternatively, the register can be set up so that
LABCTRL1 implements an asynchronous load. The data to be loaded is
driven to DATA3; when LABCTRL1 is asserted, DATA3 is loaded into the
register.
Altera Corporation
21
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
During compilation, the Compiler automatically selects the best control
signal implementation. Because the clear and preset functions are activelow, the Compiler automatically assigns a logic high to an unused clear or
preset.
The clear and preset logic is implemented in one of the following six
modes chosen during design entry:
■
■
■
■
■
■
Asynchronous clear
Asynchronous preset
Asynchronous clear and preset
Asynchronous load with clear
Asynchronous load with preset
Asynchronous load without clear or preset
In addition to the six clear and preset modes, FLEX 10K devices provide a
chip-wide reset pin that can reset all registers in the device. Use of this
feature is set during design entry. In any of the clear and preset modes, the
chip-wide reset overrides all other signals. Registers with asynchronous
presets may be preset when the chip-wide reset is asserted. Inversion can
be used to implement the asynchronous preset. Figure 10 shows examples
of how to enter a section of a design for the desired functionality.
22
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 10. LE Clear & Preset Modes
Asynchronous Clear
Asynchronous Preset
Asynchronous Clear & Preset
labctrl1
VCC
PRN
D
Q
Chip-Wide Reset
labctrl1 or
labctrl2
D
D
PRN
Q
PRN
Q
CLRN
CLRN
labctrl1 or
labctrl2
Chip-Wide Reset
labctrl2
Chip-Wide Reset
CLRN
VCC
Asynchronous Load without Clear or Preset
Asynchronous Load with Clear
NOT
NOT
labctrl1
(Asynchronous
Load)
labctrl1
(Asynchronous
Load)
data3
(Data)
D
NOT
PRN
Q
data3
(Data)
D
PRN
Q
CLRN
CLRN
labctrl2
(Clear)
Chip-Wide Reset
NOT
Chip-Wide Reset
Asynchronous Load with Preset
NOT
labctrl1
(Asynchronous
Load)
labctrl2
(Preset)
D
data3
(Data)
PRN
Q
CLRN
NOT
Chip-Wide Reset
Asynchronous Clear
The flipflop can be cleared by either LABCTRL1 or LABCTRL2. In this
mode, the preset signal is tied to VCC to deactivate it.
Altera Corporation
23
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Asynchronous Preset
An asynchronous preset is implemented as either an asynchronous load,
or with an asynchronous clear. If DATA3 is tied to VCC, asserting
LABCTRL1 asynchronously loads a one into the register. Alternatively, the
Altera software can provide preset control by using the clear and
inverting the input and output of the register. Inversion control is
available for the inputs to both LEs and IOEs. Therefore, if a register is
preset by only one of the two LABCTRL signals, the DATA3 input is not
needed and can be used for one of the LE operating modes.
Asynchronous Preset & Clear
When implementing asynchronous clear and preset, LABCTRL1 controls
the preset and LABCTRL2 controls the clear. DATA3 is tied to VCC,
therefore, asserting LABCTRL1 asynchronously loads a one into the
register, effectively presetting the register. Asserting LABCTRL2 clears the
register.
Asynchronous Load with Clear
When implementing an asynchronous load in conjunction with the clear,
LABCTRL1 implements the asynchronous load of DATA3 by controlling
the register preset and clear. LABCTRL2 implements the clear by
controlling the register clear; LABCTRL2 does not have to feed the preset
circuits.
Asynchronous Load with Preset
When implementing an asynchronous load in conjunction with preset, the
Altera software provides preset control by using the clear and inverting
the input and output of the register. Asserting LABCTRL2 presets the
register, while asserting LABCTRL1 loads the register. The Altera software
inverts the signal that drives DATA3 to account for the inversion of the
register’s output.
Asynchronous Load without Preset or Clear
When implementing an asynchronous load without preset or clear,
LABCTRL1 implements the asynchronous load of DATA3 by controlling
the register preset and clear.
24
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
FastTrack Interconnect
In the FLEX 10K architecture, connections between LEs and device I/O
pins are provided by the FastTrack Interconnect, which is a series of
continuous horizontal and vertical routing channels that traverse the
device. This global routing structure provides predictable performance,
even in complex designs. In contrast, the segmented routing in FPGAs
requires switch matrices to connect a variable number of routing paths,
increasing the delays between logic resources and reducing performance.
The FastTrack Interconnect consists of row and column interconnect
channels that span the entire device. Each row of LABs is served by a
dedicated row interconnect. The row interconnect can drive I/O pins and
feed other LABs in the device. The column interconnect routes signals
between rows and can drive I/O pins.
A row channel can be driven by an LE or by one of three column channels.
These four signals feed dual 4-to-1 multiplexers that connect to two
specific row channels. These multiplexers, which are connected to each
LE, allow column channels to drive row channels even when all eight LEs
in an LAB drive the row interconnect.
Each column of LABs is served by a dedicated column interconnect. The
column interconnect can then drive I/O pins or another row’s
interconnect to route the signals to other LABs in the device. A signal from
the column interconnect, which can be either the output of an LE or an
input from an I/O pin, must be routed to the row interconnect before it
can enter an LAB or EAB. Each row channel that is driven by an IOE or
EAB can drive one specific column channel.
Access to row and column channels can be switched between LEs in
adjacent pairs of LABs. For example, an LE in one LAB can drive the row
and column channels normally driven by a particular LE in the adjacent
LAB in the same row, and vice versa. This routing flexibility enables
routing resources to be used more efficiently. See Figure 11.
Altera Corporation
25
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 11. LAB Connections to Row & Column Interconnect
Column
Channels
To Other
Columns
Row Channels
At each intersection,
four row channels can
drive column channels.
Each LE can drive two
row channels.
From Adjacent LAB
To Adjacent LAB
LE 1
Each LE can switch
interconnect access
with an LE in the
adjacent LAB.
LE 2
LE 8
To LAB Local
Interconnect
26
To Other Rows
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
For improved routing, the row interconnect is comprised of a combination
of full-length and half-length channels. The full-length channels connect
to all LABs in a row; the half-length channels connect to the LABs in half
of the row. The EAB can be driven by the half-length channels in the left
half of the row and by the full-length channels. The EAB drives out to the
full-length channels. In addition to providing a predictable, row-wide
interconnect, this architecture provides increased routing resources. Two
neighboring LABs can be connected using a half-row channel, thereby
saving the other half of the channel for the other half of the row.
Table 7 summarizes the FastTrack Interconnect resources available in
each FLEX 10K device.
Table 7. FLEX 10K FastTrack Interconnect Resources
Device
Rows
Channels per
Row
Columns
Channels per
Column
EPF10K10
EPF10K10A
3
144
24
24
EPF10K20
6
144
24
24
EPF10K30
EPF10K30A
6
216
36
24
EPF10K40
EPF10K50
EPF10K50V
EPF10K70
8
216
36
24
10
216
36
24
9
312
52
24
EPF10K100
EPF10K100A
12
312
52
24
EPF10K130V
16
312
52
32
EPF10K250A
20
456
76
40
In addition to general-purpose I/O pins, FLEX 10K devices have six
dedicated input pins that provide low-skew signal distribution across the
device. These six inputs can be used for global clock, clear, preset, and
peripheral output enable and clock enable control signals. These signals
are available as control signals for all LABs and IOEs in the device.
The dedicated inputs can also be used as general-purpose data inputs
because they can feed the local interconnect of each LAB in the device.
However, the use of dedicated inputs as data inputs can introduce
additional delay into the control signal network.
Altera Corporation
27
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 12 shows the interconnection of adjacent LABs and EABs with row,
column, and local interconnects, as well as the associated cascade and
carry chains. Each LAB is labeled according to its location: a letter
represents the row and a number represents the column. For example,
LAB B3 is in row B, column 3.
Figure 12. Interconnect Resources
See Figure 15
for details.
I/O Element (IOE)
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
IOE
Row
Interconnect
LAB
A1
LAB
A2
See Figure 14
for details.
LAB
A3
Column
Interconnect
To LAB A5
To LAB A4
IOE
IOE
IOE
IOE
LAB
B1
LAB
B2
Cascade &
Carry Chains
LAB
B3
To LAB B5
To LAB B4
IOE
28
IOE
IOE
IOE
IOE
IOE
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
I/O Element
An I/O element (IOE) contains a bidirectional I/O buffer and a register
that can be used either as an input register for external data that requires
a fast setup time, or as an output register for data that requires fast clockto-output performance. In some cases, using an LE register for an input
register will result in a faster setup time than using an IOE register. IOEs
can be used as input, output, or bidirectional pins. For bidirectional
registered I/O implementation, the output register should be in the IOE
and, the data input and output enable register should be LE registers
placed adjacent to the bidirectional pin. The Compiler uses the
programmable inversion option to invert signals from the row and
column interconnect automatically where appropriate. Figure 13 shows
the bidirectional I/O registers.
Altera Corporation
29
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 13. Bidirectional I/O Registers
Row and Column
Interconnect
2 Dedicated
Clock Inputs
4 Dedicated
Inputs
Peripheral
Control Bus
2
4
OE Register
12
D
Q
ENA
CLRN
VCC
Chip-Wide
Reset
VCC
Chip-Wide
Output Enable
OE[7..0]
VCC
Output Register
D
Q
CLK[1..0]
ENA
CLRN
CLK[3..2]
VCC
Open-Drain
Output
Slew-Rate
Control
ENA[5..0]
VCC
CLRN[1..0]
Chip-Wide
Reset Input Register
D
Q
VCC
ENA
CLRN
Chip-Wide
Reset
30
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Each IOE selects the clock, clear, clock enable, and output enable controls
from a network of I/O control signals called the peripheral control bus.
The peripheral control bus uses high-speed drivers to minimize signal
skew across devices; it provides up to 12 peripheral control signals that
can be allocated as follows:
■
■
■
■
Up to eight output enable signals
Up to six clock enable signals
Up to two clock signals
Up to two clear signals
If more than six clock enable or eight output enable signals are required,
each IOE on the device can be controlled by clock enable and output
enable signals driven by specific LEs. In addition to the two clock signals
available on the peripheral control bus, each IOE can use one of two
dedicated clock pins. Each peripheral control signal can be driven by any
of the dedicated input pins or the first LE of each LAB in a particular row.
In addition, an LE in a different row can drive a column interconnect,
which causes a row interconnect to drive the peripheral control signal.
The chip-wide reset signal will reset all IOE registers, overriding any other
control signals.
Tables 8 and 9 list the sources for each peripheral control signal, and the
rows that can drive global signals. These tables also show how the output
enable, clock enable, clock, and clear signals share 12 peripheral control
signals.
Altera Corporation
31
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 8. EPF10K10, EPF10K20, EPF10K30, EPF10K40 & EPF10K50 Peripheral Bus Sources
Peripheral
Control Signal
EPF10K10
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K40
EPF10K50
EPF10K50V
OE0
Row A
Row A
Row A
Row A
Row A
OE1
Row A
Row B
Row B
Row C
Row B
OE2
Row B
Row C
Row C
Row D
Row D
OE3
Row B
Row D
Row D
Row E
Row F
OE4
Row C
Row E
Row E
Row F
Row H
OE5
Row C
Row F
Row F
Row G
Row J
CLKENA0/CLK0/GLOBAL0
Row A
Row A
Row A
Row B
Row A
CLKENA1/OE6/GLOBAL1
Row A
Row B
Row B
Row C
Row C
CLKENA2/CLR0
Row B
Row C
Row C
Row D
Row E
CLKENA3/OE7/GLOBAL2
Row B
Row D
Row D
Row E
Row G
CLKENA4/CLR1
Row C
Row E
Row E
Row F
Row I
CLKENA5/CLK1/GLOBAL3
Row C
Row F
Row F
Row H
Row J
Table 9. EPF10K70, EPF10K100, EPF10K130V & EPF10K250A Peripheral Bus Sources
Peripheral
Control Signal
32
EPF10K70
EPF10K100
EPF10K100A
EPF10K130V
EPF10K250A
OE0
Row A
Row A
Row C
Row E
OE1
Row B
Row C
Row E
Row G
OE2
Row D
Row E
Row G
Row I
OE3
Row I
Row L
Row N
Row P
OE4
Row G
Row I
Row K
Row M
OE5
Row H
Row K
Row M
Row O
CLKENA0/CLK0/GLOBAL0
Row E
Row F
Row H
Row J
CLKENA1/OE6/GLOBAL1
Row C
Row D
Row F
Row H
CLKENA2/CLR0
Row B
Row B
Row D
Row F
CLKENA3/OE7/GLOBAL2
Row F
Row H
Row J
Row L
CLKENA4/CLR1
Row H
Row J
Row L
Row N
CLKENA5/CLK1/GLOBAL3
Row E
Row G
Row I
Row K
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Signals on the peripheral control bus can also drive the four global signals,
referred to as GLOBAL0 through GLOBAL3 in Tables 8 and 9. The
internally generated signal can drive the global signal, providing the same
low-skew, low-delay characteristics for an internally generated signal as
for a signal driven by an input. This feature is ideal for internally
generated clear or clock signals with high fan-out. When a global signal is
driven by internal logic, the dedicated input pin that drives that global
signal cannot be used. The dedicated input pin should be driven to a
known logic state (such as ground) and not be allowed to float.
When the chip-wide output enable pin is held low, it will tri-state all pins
on the device. This option can be set in the Global Project Device Options
menu. Additionally, the registers in the IOE can be reset by holding the
chip-wide reset pin low.
Row-to-IOE Connections
When an IOE is used as an input signal, it can drive two separate row
channels. The signal is accessible by all LEs within that row. When an IOE
is used as an output, the signal is driven by a multiplexer that selects a
signal from the row channels. Up to eight IOEs connect to each side of
each row channel. See Figure 14.
Figure 14. FLEX 10K Row-to-IOE Connections
The values for m and n are provided in Table 10.
IOE1
m
Row FastTrack
Interconnect
n
n
n
IOE8
m
Each IOE is driven by an
m-to-1 multiplexer.
Each IOE can drive up to two
row channels.
Altera Corporation
33
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 10 lists the FLEX 10K row-to-IOE interconnect resources.
Table 10. FLEX 10K Row-to-IOE Interconnect Resources
Device
Channels per Row (n)
Row Channels per Pin (m)
144
18
EPF10K10
EPF10K10A
EPF10K20
144
18
EPF10K30
EPF10K30A
216
27
EPF10K40
216
27
EPF10K50
EPF10K50V
216
27
EPF10K70
312
39
EPF10K100
EPF10K100A
312
39
EPF10K130V
312
39
EPF10K250A
456
57
Column-to-IOE Connections
When an IOE is used as an input, it can drive up to two separate column
channels. When an IOE is used as an output, the signal is driven by a
multiplexer that selects a signal from the column channels. Two IOEs
connect to each side of the column channels. Each IOE can be driven by
column channels via a multiplexer. The set of column channels that each
IOE can access is different for each IOE. See Figure 15.
34
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 15. FLEX 10K Column-to-IOE Connections
The values for m and n are provided in Table 11.
Each IOE is driven by
an m-to-1 multiplexer.
Column
Interconnect
m
IOE1
m
IOE1
n
n
n
Each IOE can drive up to
two column channels.
Table 11 lists the FLEX 10K column-to-IOE interconnect resources.
Table 11. FLEX 10K Column-to-IOE Interconnect Resources
Altera Corporation
Device
Channels per Column (n)
Column Channel per Pin (m)
EPF10K10
EPF10K10A
24
16
EPF10K20
24
16
EPF10K30
EPF10K30A
24
16
EPF10K40
24
16
EPF10K50
EPF10K50V
24
16
EPF10K70
24
16
EPF10K100
EPF10K100A
24
16
EPF10K130V
32
24
EPF10K250A
40
32
35
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
SameFrame
Pin-Outs
FLEX 10KE devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ballcount packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPF10K10A device in a 256-pin
FineLine BGA package to an EPF10K100A device in a 484-pin
FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 16).
Figure 16. SameFrame Pin-Out Example
Printed Circuit Board
Designed for 484-PinFineLine BGA Package
256-Pin
FineLine
BGA
256-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
36
484-Pin
FineLine
BGA
484-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
ClockLock &
ClockBoost
Features
To support high-speed designs, selected FLEX 10K devices offer optional
ClockLock and ClockBoost circuitry containing a phase-locked loop (PLL)
that is used to increase design speed and reduce resource usage. The
ClockLock circuitry uses a synchronizing PLL that reduces the clock delay
and skew within a device. This reduction minimizes clock-to-output and
setup times while maintaining zero hold times. The ClockBoost circuitry,
which provides a clock multiplier, allows the designer to enhance device
area efficiency by sharing resources within the device. The ClockBoost
feature allows the designer to distribute a low-speed clock and multiply
that clock on-device. Combined, the ClockLock and ClockBoost features
provide significant improvements in system performance and
bandwidth.
The ClockLock and ClockBoost features in FLEX 10K devices are enabled
through the Altera software. External devices are not required to use these
features. The output of the ClockLock and ClockBoost circuits is not
available at any of the device pins.
The ClockLock and ClockBoost circuitry locks onto the rising edge of the
incoming clock. The circuit output can only drive the clock inputs of
registers; the generated clock cannot be gated or inverted.
The dedicated clock pin (GCLK1) supplies the clock to the ClockLock and
ClockBoost circuitry. When the dedicated clock pin is driving the
ClockLock or ClockBoost circuitry, it cannot drive elsewhere in the device.
In designs that require both a multiplied and non-multiplied clock, the
clock trace on the board can be connected to GCLK1. With the Altera
software, GCLK1 can feed both the ClockLock and ClockBoost circuitry in
the FLEX 10K device. However, when both circuits are used, the other
clock pin (GCLK0) cannot be used. Figure 17 shows a block diagram of
how to enable both the ClockLock and ClockBoost circuits in the Altera
software. The example shown is a schematic, but a similar approach
applies for designs created in AHDL, VHDL, and Verilog HDL. When the
ClockLock and ClockBoost circuits are used simultaneously, the input
frequency parameter must be the same for both circuits. In Figure 17, the
input frequency must meet the requirements specified when the
ClockBoost multiplication factor is two.
Altera Corporation
37
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 17. Enabling ClockLock & ClockBoost in the Same Design
CLOCKBOOST=1
INPUT_FREQUENCY=50
CLKLOCK
a
D
Q
aout
D
Q
bout
gclk1
CLOCKBOOST=2
INPUT_FREQUENCY=50
CLKLOCK
b
To use both the ClockLock and ClockBoost circuits in the same design,
designers must use Revision C EPF10K100GC503-3DX devices and
MAX+PLUS II software versions 7.2 or higher. The die revision is
indicated by the third digit of the nine-digit code on the top side of the
device.
Output
Configuration
This section discusses the peripheral component interconnect (PCI)
pull-up clamping diode option, slew-rate control, open-drain output
option, MultiVolt I/O interface, and power sequencing for FLEX 10K
devices. The PCI pull-up clamping diode, slew-rate control, and
open-drain output options are controlled pin-by-pin via Altera logic
options. The MultiVolt I/O interface is controlled by connecting VCCIO to
a different voltage than VCCINT. Its effect can be simulated in the Altera
software via the Global Project Device Options dialog box (Assign
menu).
PCI Clamping Diodes
The EPF10K10A and EPF10K30A devices have a pull-up clamping diode
on every I/O, dedicated input, and dedicated clock pin. PCI clamping
diodes clamp the transient overshoot caused by reflected waves to the
VCCIO value and are required for 3.3-V PCI compliance. Clamping diodes
can also be used to limit overshoot in other systems.
Clamping diodes are controlled on a pin-by-pin basis via a logic option in
the Altera software. When VCCIO is 3.3 V, a pin that has the clamping
diode turned on can be driven by a 2.5-V or 3.3-V signal, but not a 5.0-V
signal. When VCCIO is 2.5 V, a pin that has the clamping diode turned on
can be driven by a 2.5-V signal, but not a 3.3-V or 5.0-V signal. However,
a clamping diode can be turned on for a subset of pins, which allows
devices to bridge between a 3.3-V PCI bus and a 5.0-V device.
38
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Slew-Rate Control
The output buffer in each IOE has an adjustable output slew rate that can
be configured for low-noise or high-speed performance. A slower slew
rate reduces system noise and adds a maximum delay of approximately
2.9 ns. The fast slew rate should be used for speed-critical outputs in
systems that are adequately protected against noise. Designers can specify
the slew rate on a pin-by-pin basis during design entry or assign a default
slew rate to all pins on a device-wide basis. The slow slew rate setting
affects only the falling edge of the output.
Open-Drain Output Option
FLEX 10K devices provide an optional open-drain (electrically equivalent
to an open-collector) output for each I/O pin. This open-drain output
enables the device to provide system-level control signals (e.g., interrupt
and write enable signals) that can be asserted by any of several devices. It
can also provide an additional wired-OR plane. Additionally, the Altera
software can convert tri-state buffers with grounded data inputs to opendrain pins automatically.
Open-drain output pins on FLEX 10K devices (with a pull-up resistor to
the 5.0-V supply) can drive 5.0-V CMOS input pins that require a VIH of
3.5 V. When the open-drain pin is active, it will drive low. When the pin is
inactive, the trace will be pulled up to 5.0 V by the resistor. The open-drain
pin will only drive low or tri-state; it will never drive high. The rise time
is dependent on the value of the pull-up resistor and load impedance. The
IOL current specification should be considered when selecting a pull-up
resistor.
Output pins on 5.0-V FLEX 10K devices with VCCIO = 3.3 V or 5.0 V (with
a pull-up resistor to the 5.0-V supply) can also drive 5.0-V CMOS input
pins. In this case, the pull-up transistor will turn off when the pin voltage
exceeds 3.3 V. Therefore, the pin does not have to be open-drain.
MultiVolt I/O Interface
The FLEX 10K device architecture supports the MultiVolt I/O interface
feature, which allows FLEX 10K devices to interface with systems of
differing supply voltages. These devices have one set of VCC pins for
internal operation and input buffers (VCCINT) and another set for I/O
output drivers (VCCIO).
Altera Corporation
39
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 12 describes the FLEX 10K device supply voltages and MultiVolt
I/O support levels.
Table 12. Supply Voltages & MultiVolt I/O Support Levels
Devices
Supply Voltage (V)
MultiVolt I/O Support Levels (V)
VCCINT
VCCIO
5.0
5.0
3.3 or 5.0
5.0
5.0
3.3
3.3 or 5.0
3.3 or 5.0
EPF10K50V (1)
3.3
3.3
3.3 or 5.0
3.3 or 5.0
EPF10K130V
3.3
3.3
3.3 or 5.0
3.3 or 5.0
FLEX 10KA (1)
3.3
3.3
2.5, 3.3, or 5.0
3.3 or 5.0
3.3
2.5
2.5, 3.3, or 5.0
2.5
FLEX 10K (1)
Input
Output
Note
(1)
240-pin QFP packages do not support the MultiVolt I/O features, so they do not have separate VCCIO pins.
Power Sequencing & Hot-Socketing
Because FLEX 10K devices can be used in a multi-voltage environment,
they have been designed specifically to tolerate any possible power-up
sequence. The VCCIO and VCCINT power supplies can be powered in any
order.
Signals can be driven into FLEX 10KA devices before and during power
up without damaging the device. Additionally, FLEX 10KA devices do
not drive out during power up. Once operating conditions are reached,
FLEX 10KA devices operate as specified by the user.
IEEE Std.
1149.1 (JTAG)
Boundary-Scan
Support
40
All FLEX 10K devices provide JTAG BST circuitry that complies with the
IEEE Std. 1149.1-1990 specification. All FLEX 10K devices can also be
configured using the JTAG pins through the BitBlaster serial download
cable, or ByteBlasterMV parallel port download cable, or via hardware
that uses the JamTM programming and test language. JTAG BST can be
performed before or after configuration, but not during configuration.
FLEX 10K devices support the JTAG instructions shown in Table 13.
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 13. FLEX 10K JTAG Instructions
JTAG Instruction
Description
SAMPLE/PRELOAD
Allows a snapshot of signals at the device pins to be captured and examined during
normal device operation, and permits an initial data pattern output at the device pins.
EXTEST
Allows the external circuitry and board-level interconnections to be tested by forcing a
test pattern at the output pins and capturing test results at the input pins.
BYPASS
Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST
data to pass synchronously through a selected device to adjacent devices during normal
device operation.
USERCODE
Selects the user electronic signature (USERCODE) register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted out of TDO.
IDCODE
Selects the IDCODE register and places it between TDI and TDO, allowing the IDCODE
to be serially shifted out of TDO.
ICR Instructions
These instructions are used when configuring a FLEX 10K device via JTAG ports with a
BitBlaster, or ByteBlasterMV or MasterBlaster download cable, or using a Jam File
(.jam) or Jam Byte-Code File (.jbc) via an embedded processor.
The instruction register length of FLEX 10K devices is 10 bits. The
USERCODE register length in FLEX 10K devices is 32 bits; 7 bits are
determined by the user, and 25 bits are predetermined. Tables 14 and 15
show the boundary-scan register length and device IDCODE information
for FLEX 10K devices.
Table 14. FLEX 10K Boundary-Scan Register Length
Device
EPF10K10, EPF10K10A
480
EPF10K20
624
EPF10K30, EPF10K30A
768
EPF10K40
864
EPF10K50, EPF10K50V
EPF10K70
Altera Corporation
Boundary-Scan
Register Length
960
1,104
EPF10K100, EPF10K100A
1,248
EPF10K130V
1,440
EPF10K250A
1,440
41
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 15. 32-Bit FLEX 10K Device IDCODE
Note (1)
Device
IDCODE (32 Bits)
Version
(4 Bits)
Part Number
(16 Bits)
Manufacturer’s Identity 1 (1 Bit)
(11 Bits)
(2)
EPF10K10, EPF10K10A
0000
0001 0000 0001 0000
00001101110
1
EPF10K20
0000
0001 0000 0010 0000
00001101110
1
EPF10K30, EPF10K30A
0000
0001 0000 0011 0000
00001101110
1
EPF10K40
0000
0001 0000 0100 0000
00001101110
1
EPF10K50, EPF10K50V
0000
0001 0000 0101 0000
00001101110
1
EPF10K70
0000
0001 0000 0111 0000
00001101110
1
EPF10K100, EPF10K100A
0000
0000 0001 0000 0000
00001101110
1
EPF10K130V
0000
0000 0001 0011 0000
00001101110
1
EPF10K250A
0000
0000 0010 0101 0000
00001101110
1
Notes:
(1)
(2)
The most significant bit (MSB) is on the left.
The least significant bit (LSB) for all JTAG IDCODEs is 1.
FLEX 10K devices include weak pull-ups on JTAG pins.
f
For more information, see the following documents:
■
■
■
■
42
Application Note 39 (IEEE 1149.1 (JTAG) Boundary-Scan Testing in
Altera Devices)
BitBlaster Serial Download Cable Data Sheet
ByteBlasterMV Parallel Port Download Cable Data Sheet
Jam Programming & Test Language Specification
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 18 shows the timing requirements for the JTAG signals.
Figure 18. JTAG Waveforms
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSH
tJSSU
Signal
to Be
Captured
Signal
to Be
Driven
tJSCO
tJSZX
tJSXZ
Table 16 shows the timing parameters and values for FLEX 10K devices.
Table 16. JTAG Timing Parameters & Values
Symbol
Altera Corporation
Parameter
Min
Max
100
Unit
tJCP
TCK clock period
tJCH
TCK clock high time
50
ns
ns
tJCL
TCK clock low time
50
ns
tJPSU
JTAG port setup time
20
ns
tJPH
JTAG port hold time
45
ns
tJPCO
JTAG port clock to output
25
tJPZX
JTAG port high impedance to valid output
25
ns
tJPXZ
JTAG port valid output to high impedance
25
ns
tJSSU
Capture register setup time
20
ns
tJSH
Capture register hold time
45
ns
tJSCO
Update register clock to output
35
ns
tJSZX
Update register high-impedance to valid output
35
ns
tJSXZ
Update register valid output to high impedance
35
ns
ns
43
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Generic Testing
Each FLEX 10K device is functionally tested. Complete testing of each
configurable SRAM bit and all logic functionality ensures 100% yield.
AC test measurements for FLEX 10K devices are made under conditions
equivalent to those shown in Figure 19. Multiple test patterns can be used
to configure devices during all stages of the production flow.
Figure 19. FLEX 10K AC Test Conditions
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests must
not be performed under AC conditions.
Large-amplitude, fast-ground-current
transients normally occur as the device
outputs discharge the load capacitances.
When these transients flow through the
parasitic inductance between the device
ground pin and the test system ground,
significant reductions in observable noise
immunity can result. Numbers without
parentheses are for 5.0-V devices or outputs.
Numbers in parentheses are for 3.3-V devices
or outputs. Numbers in brackets are for
2.5-V devices or outputs.
Operating
Conditions
To Test
System
Device
Output
250 Ω
(8.06 kΩ)
[481 Ω]
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Tables 17 through 21 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 5.0-V FLEX 10K devices.
Table 17. FLEX 10K 5.0-V Device Absolute Maximum Ratings
Symbol
VCC
464 Ω
(703 Ω)
[521 Ω]
Parameter
Note (1)
Conditions
Max
Unit
V
V CC
Supply voltage
–2.0
7.0
VI
DC input voltage
–2.0
7.0
V
I OUT
DC output current, per pin
–25
25
mA
T STG
Storage temperature
No bias
–65
150
°C
T AMB
Ambient temperature
Under bias
–65
135
°C
TJ
Junction temperature
Ceramic packages, under bias
150
°C
PQFP, TQFP, RQFP, and BGA
packages, under bias
135
°C
44
With respect to ground (2)
Min
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 18. FLEX 10K 5.0-V Device Recommended Operating Conditions
Symbol
Parameter
Conditions
V CCINT Supply voltage for internal logic (3), (4)
and input buffers
V CCIO
Min
Max
Unit
4.75 (4.50)
5.25 (5.50)
V
Supply voltage for output
buffers, 5.0-V operation
(3), (4)
4.75 (4.50)
5.25 (5.50)
V
Supply voltage for output
buffers, 3.3-V operation
(3), (4)
3.00 (3.00)
3.60 (3.60)
V
–0.5
V CCINT + 0.5
V
0
V CCIO
V
0
70
°C
VI
Input voltage
VO
Output voltage
TA
Ambient temperature
TJ
Operating temperature
tR
Input rise time
tF
Input fall time
For commercial use
For industrial use
For commercial use
For industrial use
Altera Corporation
–40
85
°C
0
85
°C
–40
100
°C
40
ns
40
ns
45
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 19. FLEX 10K 5.0-V Device DC Operating Conditions
Symbol
Parameter
Notes (5), (6)
Conditions
Min
Typ
Max
Unit
2.0
V CCINT + 0.5
V
–0.5
0.8
V IH
High-level input
voltage
V IL
Low-level input voltage
V OH
5.0-V high-level TTL
output voltage
I OH = –4 mA DC, V CCIO = 4.75 V
(7)
2.4
V
3.3-V high-level TTL
output voltage
I OH = –4 mA DC, V CCIO = 3.00 V
(7)
2.4
V
V CCIO – 0.2
V
3.3-V high-level CMOS I OH = –0.1 mA DC, V CCIO = 3.00 V
output voltage
(7)
V OL
V
5.0-V low-level TTL
output voltage
I OL = 12 mA DC, V CCIO = 4.75 V
(8)
0.45
V
3.3-V low-level TTL
output voltage
I OL = 12 mA DC, V CCIO = 3.00 V
(8)
0.45
V
0.2
V
3.3-V low-level CMOS I OL = 0.1 mA DC, V CCIO = 3.00 V
(8)
output voltage
II
Input pin leakage
current
V I = V CC or ground
(9)
–10
10
µA
I OZ
Tri-stated I/O pin
leakage current
V O = V CC or ground
(9)
–40
40
µA
I CC0
V CC supply current
(standby)
V I = ground, no load
10
mA
0.5
Table 20. 5.0-V Device Capacitance of EPF10K10, EPF10K20 & EPF10K30 Devices
Symbol
Parameter
Conditions
Min
Note (10)
Max
Unit
CIN
Input capacitance
VIN = 0 V, f = 1.0 MHz
8
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
12
pF
COUT
Output capacitance
8
pF
VOUT = 0 V, f = 1.0 MHz
Table 21. 5.0-V Device Capacitance of EPF10K40, EPF10K50, EPF10K70 & EPF10K100 Devices Note (10)
Max
Unit
CIN
Symbol
Input capacitance
VIN = 0 V, f = 1.0 MHz
10
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
15
pF
COUT
Output capacitance
10
pF
46
Parameter
Conditions
VOUT = 0 V, f = 1.0 MHz
Min
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
See the Operating Requirements for Altera Devices Data Sheet.
Minimum DC input voltage is –0.5 V. During transitions, the inputs may undershoot to –2.0 V for input currents
less than 100 mA and periods shorter than 20 ns.
(3) Numbers in parentheses are for industrial-temperature-range devices.
(4) Maximum VCC rise time is 100 ms. VCC must rise monotonically.
(5) Typical values are for T A = 25° C and V CC = 5.0 V.
(6) These values are specified under the Recommended Operation Condition shown in Table 18 on page 45.
(7) The IOH parameter refers to high-level TTL or CMOS output current.
(8) The IOL parameter refers to low-level TTL or CMOS output current. This parameter applies to open-drain pins as
well as output pins.
(9) This value is specified for normal device operation. The value may vary during power-up.
(10) Capacitance is sample-tested only.
Figure 20 shows the typical output drive characteristics of FLEX 10K
devices with 5.0-V and 3.3-V VCCIO. The output driver is compliant with
the 5.0-V PCI Local Bus Specification, Revision 2.2 (for 5.0-V VCCIO).
Figure 20. Output Drive Characteristics of FLEX 10K Devices
5.0-V
3.3-V
150
120
Typical IO
Output
Current (mA)
150
IOL
120
VCCINT = 5.0 V
VCCIO = 5.0 V
Room Temperature
90
Typical IO
Output
Current (mA)
VCCINT = 5.0 V
VCCIO = 3.3 V
Room Temperature
90
60
60
IOH
IOH
45
30
30
1
2
3
4
VO Output Voltage (V)
Altera Corporation
IOL
5
1
2
3 3.3
4
5
VO Output Voltage (V)
47
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Tables 22 through 25 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for EPF10K50V and EPF10K130V devices.
Table 22. EPF10K50V & EPF10K130V Device Absolute Maximum Ratings
Symbol
Parameter
Conditions
With respect to ground (2)
Note (1)
Min
Max
Unit
V
V CC
Supply voltage
–0.5
4.6
VI
DC input voltage
–2.0
5.75
V
I OUT
DC output current, per pin
–25
25
mA
T STG
Storage temperature
No bias
–65
150
°C
T AMB
Ambient temperature
Under bias
–65
135
°C
TJ
Junction temperature
Ceramic packages, under bias
150
°C
RQFP and BGA packages, under
bias
135
°C
Table 23. EPF10K50V & EPF10K130V Device Recommended Operating Conditions
Symbol
Parameter
Conditions
V CCINT Supply voltage for internal logic (3), (4)
and input buffers
V CCIO
Supply voltage for output
buffers
(3), (4)
VI
Input voltage
(5)
VO
Output voltage
TA
Ambient temperature
For commercial use
For industrial use
TJ
Operating temperature
For commercial use
For industrial use
Min
Max
Unit
3.00 (3.00)
3.60 (3.60)
V
3.00 (3.00)
3.60 (3.60)
V
-0.5
5.75
V
0
V CCIO
V
0
70
°C
–40
85
°C
0
85
°C
–40
100
°C
tR
Input rise time
40
ns
tF
Input fall time
40
ns
48
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 24. EPF10K50V & EPF10K130V Device DC Operating Conditions
Symbol
Parameter
Conditions
Notes (6), (7)
Min
Typ
Max
Unit
V IH
High-level input voltage
2.0
5.75
V
V IL
Low-level input voltage
–0.5
0.8
V
V OH
3.3-V high-level TTL output
voltage
I OH = –8 mA DC (8)
3.3-V high-level CMOS output
voltage
I OH = –0.1 mA DC (8)
3.3-V low-level TTL output
voltage
I OL = 8 mA DC (9)
0.45
V
3.3-V low-level CMOS output
voltage
I OL = 0.1 mA DC (9)
0.2
V
V OL
2.4
V
V CCIO – 0.2
V
II
Input pin leakage current
V I = 5.3 V to –0.3 V (10)
–10
10
µA
I OZ
Tri-stated I/O pin leakage
current
V O = 5.3 V to –0.3 V (10)
–10
10
µA
I CC0
V CC supply current (standby)
V I = ground, no load
0.3
V I = ground, no load (11)
10
Table 25. EPF10K50V & EPF10K130V Device Capacitance
Parameter
Symbol
10
mA
mA
(12)
Conditions
Min
Max
Unit
CIN
Input capacitance
VIN = 0 V, f = 1.0 MHz
10
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
15
pF
COUT
Output capacitance
10
pF
VOUT = 0 V, f = 1.0 MHz
Notes to tables:
(1)
(2)
See the Operating Requirements for Altera Devices Data Sheet.
Minimum DC input voltage is –0.5 V. During transitions, the inputs may undershoot to –2.0 V or overshoot to 5.75 V
for input currents less than 100 mA and periods shorter than 20 ns.
(3) Numbers in parentheses are for industrial-temperature-range devices.
(4) Maximum VCC rise time is 100 ms. VCC must rise monotonically.
(5) EPF10K50V and EPF10K130V device inputs may be driven before VCCINT and VCCIO are powered.
(6) Typical values are for T A = 25° C and V CC = 3.3 V.
(7) These values are specified under the EPF10K50V and EPF10K130V device Recommended Operating Conditions in
Table 23 on page 48.
(8) The IOH parameter refers to high-level TTL or CMOS output current.
(9) The IOL parameter refers to low-level TTL or CMOS output current. This parameter applies to open-drain pins as
well as output pins.
(10) This value is specified for normal device operation. The value may vary during power-up.
(11) This parameter applies to -1 speed grade EPF10K50V devices, -2 speed grade EPF10K50V industrial temperature
devices, and -2 speed grade EPF10K130V devices.
(12) Capacitance is sample-tested only.
Altera Corporation
49
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 21 shows the typical output drive characteristics of EPF10K50V
and EPF10K130V devices.
Figure 21. Output Drive Characteristics of EPF10K50V & EPF10K130V Devices
60
Typical IO
Output
Current (mA)
40
IOL
Vcc = 3.3 V
Room Temperature
20
IOH
1
2
3
VO Output Voltage (V)
Tables 26 through 31 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 3.3-V FLEX 10K devices.
Table 26. FLEX 10KA 3.3-V Device Absolute Maximum Ratings
Symbol
Parameter
Note (1)
Conditions
Max
Unit
V
V CC
Supply voltage
–0.5
4.6
VI
DC input voltage
–2.0
5.75
V
I OUT
DC output current, per pin
–25
25
mA
T STG
Storage temperature
No bias
–65
150
°C
T AMB
Ambient temperature
Under bias
–65
135
°C
TJ
Junction temperature
Ceramic packages, under bias
150
°C
PQFP, TQFP, RQFP, and BGA
packages, under bias
135
°C
50
With respect to ground (2)
Min
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 27. FLEX 10KA 3.3-V Device Recommended Operating Conditions
Symbol
Parameter
Conditions
V CCINT Supply voltage for internal logic (3), (4)
and input buffers
Min
Max
Unit
3.00 (3.00)
3.60 (3.60)
V
Supply voltage for output
buffers, 3.3-V operation
(3), (4)
3.00 (3.00)
3.60 (3.60)
V
Supply voltage for output
buffers, 2.5-V operation
(3), (4)
2.30 (2.30)
2.70 (2.70)
V
VI
Input voltage
(5)
VO
Output voltage
TA
Ambient temperature
V CCIO
For commercial use
For industrial use
For commercial use
–0.5
5.75
V
0
V CCIO
V
0
70
°C
–40
85
°C
0
85
°C
–40
TJ
Operating temperature
100
°C
tR
Input rise time
40
ns
tF
Input fall time
40
ns
For industrial use
Altera Corporation
51
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 28. FLEX 10KA 3.3-V Device DC Operating Conditions
Symbol
Parameter
V IH
High-level input voltage
V IL
Low-level input voltage
V OH
3.3-V high-level TTL output
voltage
Conditions
Min
Typ
Max
Unit
1.7 or
0.5 × V CCINT,
whichever is
lower
5.75
V
–0.5
0.3 × VCCINT
V
2.4
V
V CCIO – 0.2
V
0.9 × VCCIO
V
2.5-V high-level output voltage I OH = –0.1 mA DC,
V CCIO = 2.30 V (8)
2.1
V
I OH = –1 mA DC,
V CCIO = 2.30 V (8)
2.0
V
I OH = –2 mA DC,
V CCIO = 2.30 V (8)
1.7
V
I OH = –11 mA DC,
V CCIO = 3.00 V (8)
3.3-V high-level CMOS output I OH = –0.1 mA DC,
V CCIO = 3.00 V (8)
voltage
3.3-V high-level PCI output
voltage
V OL
Notes (6), (7)
I OH = –0.5 mA DC,
V CCIO = 3.00 to 3.60 V (8)
3.3-V low-level TTL output
voltage
I OL = 9 mA DC,
V CCIO = 3.00 V (9)
0.45
V
3.3-V low-level CMOS output
voltage
I OL = 0.1 mA DC,
V CCIO = 3.00 V (9)
0.2
V
3.3-V low-level PCI output
voltage
I OL = 1.5 mA DC,
V CCIO = 3.00 to 3.60 V (9)
0.1 × VCCIO
V
2.5-V low-level output voltage I OL = 0.1 mA DC,
V CCIO = 2.30 V (9)
0.2
V
I OL = 1 mA DC,
V CCIO = 2.30 V (9)
0.4
V
I OL = 2 mA DC,
V CCIO = 2.30 V (9)
0.7
V
II
Input pin leakage current
V I = 5.3 V to –0.3 V (10)
–10
10
µA
I OZ
Tri-stated I/O pin leakage
current
V O = 5.3 V to –0.3 V (10)
–10
10
µA
I CC0
V CC supply current (standby)
52
V I = ground, no load
0.3
V I = ground, no load (11)
10
10
mA
mA
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 29. 3.3-V Device Capacitance of EPF10K10A & EPF10K30A Devices
Parameter
Symbol
Conditions
Note (12)
Min
Max
Unit
CIN
Input capacitance
VIN = 0 V, f = 1.0 MHz
8
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
12
pF
COUT
Output capacitance
8
pF
Max
Unit
VOUT = 0 V, f = 1.0 MHz
Table 30. 3.3-V Device Capacitance of EPF10K100A Devices
Parameter
Symbol
Note (12)
Conditions
Min
CIN
Input capacitance
VIN = 0 V, f = 1.0 MHz
10
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
15
pF
COUT
Output capacitance
10
pF
VOUT = 0 V, f = 1.0 MHz
Table 31. 3.3-V Device Capacitance of EPF10K250A Devices
Parameter
Max
Unit
CIN
Input capacitance
VIN = 0 V, f = 1.0 MHz
10
pF
CINCLK
Input capacitance on dedicated VIN = 0 V, f = 1.0 MHz
clock pin
15
pF
COUT
Output capacitance
10
pF
Symbol
Conditions
Note (12)
VOUT = 0 V, f = 1.0 MHz
Min
Notes to tables:
(1)
(2)
See the Operating Requirements for Altera Devices Data Sheet.
Minimum DC voltage input is –0.5 V. During transitions, the inputs may undershoot to –2.0 V or overshoot to 5.75 V
for input currents less than 100 mA and periods shorter than 20 ns.
(3) Numbers in parentheses are for industrial-temperature-range devices.
(4) Maximum VCC rise time is 100 ms, and VCC must rise monotonically.
(5) FLEX 10KA device inputs may be driven before VCCINT and VCCIO are powered.
(6) Typical values are for T A = 25° C and V CC = 3.3 V.
(7) These values are specified under the Recommended Operating Conditions shown in Table 27 on page 51.
(8) The IOH parameter refers to high-level TTL, PCI, or CMOS output current.
(9) The IOL parameter refers to low-level TTL, PCI, or CMOS output current. This parameter applies to open-drain pins
as well as output pins.
(10) This value is specified for normal device operation. The value may vary during power-up.
(11) This parameter applies to all -1 speed grade commercial temperature devices and all -2 speed grade
industrial-temperature devices.
(12) Capacitance is sample-tested only.
Altera Corporation
53
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 22 shows the typical output drive characteristics of EPF10K10A,
EPF10K30A, EPF10K100A, and EPF10K250A devices with 3.3-V and 2.5-V
V CCIO. The output driver is compliant with the 3.3-V PCI Local Bus
Specification, Revision 2.2 (with 3.3-V V CCIO ). Moreover, device analysis
shows that the EPF10K10A, EPF10K30A, and EPF 10K100A devices can
drive a 5.0-V PCI bus with eight or fewer loads.
Figure 22. Output Drive Characteristics for EPF10K10A, EPF10K30A & EPF10K100A Devices
60
60
IOL
IOL
50
50
40
Typical IO
Output
Current (mA)
VCCINT = 3.3 V
VCCIO = 3.3 V
Room Temperature
30
40
Typical IO
Output
Current (mA)
VCCINT = 3.3 V
VCCIO = 2.5 V
Room Temperature
30
20
20
10
10
IOH
1
2
3
4
VO Output Voltage (V)
IOH
1
2
3
4
VO Output Voltage (V)
Figure 23 shows the typical output drive characteristics of the
EPF10K250A device with 3.3-V and 2.5-V VCCIO.
54
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 23. Output Drive Characteristics for EPF10K250A Device
50
50
IOL
IOL
40
40
Typical IO
Output
Current (mA)
VCCINT = 3.3 V
VCCIO = 3.3 V
Room Temperature
30
Typical IO
Output
Current (mA)
VCCINT = 3.3 V
VCCIO = 2.5 V
Room Temperature
30
20
20
IOH
10
10
IOH
1
2
3
4
VO Output Voltage (V)
Timing Model
1
2
3
4
VO Output Voltage (V)
The continuous, high-performance FastTrack Interconnect routing
resources ensure predictable performance and accurate simulation and
timing analysis. This predictable performance contrasts with that of
FPGAs, which use a segmented connection scheme and therefore have
unpredictable performance.
Device performance can be estimated by following the signal path from a
source, through the interconnect, to the destination. For example, the
registered performance between two LEs on the same row can be
calculated by adding the following parameters:
■
■
■
■
LE register clock-to-output delay (tCO)
Interconnect delay (tSAMEROW)
LE look-up table delay (tLUT)
LE register setup time (tSU)
The routing delay depends on the placement of the source and destination
LEs. A more complex registered path may involve multiple combinatorial
LEs between the source and destination LEs.
Altera Corporation
55
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Timing simulation and delay prediction are available with the
MAX+PLUS II Simulator and Timing Analyzer, or with industrystandard EDA tools. The Simulator offers both pre-synthesis functional
simulation to evaluate logic design accuracy and post-synthesis timing
simulation with 0.1-ns resolution. The Timing Analyzer provides pointto-point timing delay information, setup and hold time analysis, and
device-wide performance analysis.
Figure 24 shows the overall timing model, which maps the possible paths
to and from the various elements of the FLEX 10K device.
Figure 24. FLEX 10K Device Timing Model
Dedicated
Clock/Input
Interconnect
Logic
Element
56
I/O Element
Embedded Array
Block
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figures 25 through 27 show the delays that correspond to various paths
and functions within the LE, IOE, and EAB timing models.
Figure 25. FLEX 10K Device LE Timing Model
Cascade-In
Carry-In
Register
Delays
LUT Delay
Data-In
tLUT
tRLUT
tCO
tCOMB
tSU
tH
tPRE
tCLR
tCLUT
Packed Register
Delay
tPACKED
Data-Out
Register Control
Delay
Control-In
tC
tEN
Carry Chain
Delay
tCGENR
tCASC
tCGEN
tCICO
Altera Corporation
tLABCARRY
tLABCASC
Carry-Out
Cascade-Out
57
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 26. FLEX 10K Device IOE Timing Model
Output Data
Delay
I/O Register
Delays
tIOD
tIOCO
tIOCOMB
tIOSU
tIOH
tIOCLR
Data-In
I/O Element
Control Delay
Clock Enable
Clear
Clock
Output Enable
Output
Delays
tOD1
tOD2
tOD3
tXZ
tZX1
tZX2
tZX3
tIOC
tINREG
Input Register Delay
I/O Register
Feedback Delay
Data Feedback
into FastTrack
Interconnect
tIOFD
Input Delay
tINCOMB
Figure 27. FLEX 10K Device EAB Timing Model
Data-In
Address
EAB Data Input
Delays
Input Register
Delays
RAM/ROM
Block Delays
Output Register
Delays
tEABDATA1
tEABDATA2
tEABCO
tEABBYPASS
tEABSU
tEABH
tEABCH
tEABCL
tAA
tDD
tWP
tWDSU
tWDH
tWASU
tWAH
tWO
tEABCO
tEABBYPASS
tEABSU
tEABH
tEABCH
tEABCL
Write Enable
Input Delays
WE
Input Register
Clock
Output Register
Clock
tEABWE1
tEABWE2
EAB Output
Delay
tEABOUT
Data-Out
EAB Clock
Delay
tEABCLK
Figures 28 shows the timing model for bidirectional I/O pin timing.
58
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 28. Synchronous Bidirectional Pin External Timing Model
OE Register
D
Dedicated
Clock
PRN
Q
tXZBIDIR
tZXBIDIR
CLRN
tOUTCOBIDIR
Output Register
D
PRN
Q
CLRN
Bidirectional
Pin
tINSUBIDIR
tINHBIDIR
Input Register
PRN
D
Q
CLRN
Tables 32 through 36 describe the FLEX 10K device internal timing
parameters. These internal timing parameters are expressed as worst-case
values. Using hand calculations, these parameters can be used to estimate
design performance. However, before committing designs to silicon,
actual worst-case performance should be modeled using timing
simulation and analysis. Tables 37 through 38 describe FLEX 10K external
timing parameters.
Table 32. LE Timing Microparameters (Part 1 of 2)
Symbol
Note (1)
Parameter
tLUT
LUT delay for data-in
tCLUT
LUT delay for carry-in
tRLUT
LUT delay for LE register feedback
tPACKED
Data-in to packed register delay
tEN
LE register enable delay
tCICO
Carry-in to carry-out delay
tCGEN
Data-in to carry-out delay
tCGENR
LE register feedback to carry-out delay
tCASC
Cascade-in to cascade-out delay
tC
LE register control signal delay
tCO
LE register clock-to-output delay
tCOMB
Combinatorial delay
Altera Corporation
Conditions
59
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 32. LE Timing Microparameters (Part 2 of 2)
Symbol
Note (1)
Parameter
tSU
LE register setup time for data and enable signals before clock; LE register
recovery time after asynchronous clear, preset, or load
tH
LE register hold time for data and enable signals after clock
tPRE
LE register preset delay
tCLR
LE register clear delay
tCH
Minimum clock high time from clock pin
tCL
Minimum clock low time from clock pin
Table 33. IOE Timing Microparameters
Conditions
Note (1)
Symbol
Parameter
Conditions
tIOD
IOE data delay
tIOC
IOE register control signal delay
tIOCO
IOE register clock-to-output delay
tIOCOMB
IOE combinatorial delay
tIOSU
IOE register setup time for data and enable signals before clock; IOE register
recovery time after asynchronous clear
tIOH
IOE register hold time for data and enable signals after clock
tIOCLR
IOE register clear time
tOD1
Output buffer and pad delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tOD2
Output buffer and pad delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tOD3
Output buffer and pad delay, slow slew rate = on
C1 = 35 pF (4)
tXZ
IOE output buffer disable delay
tZX1
IOE output buffer enable delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tZX2
IOE output buffer enable delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tZX3
IOE output buffer enable delay, slow slew rate = on
C1 = 35 pF (4)
tINREG
IOE input pad and buffer to IOE register delay
tIOFD
IOE register feedback delay
tINCOMB
IOE input pad and buffer to FastTrack Interconnect delay
60
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 34. EAB Timing Microparameters
Symbol
Note (1)
Parameter
Conditions
tEABDATA1
Data or address delay to EAB for combinatorial input
tEABDATA2
Data or address delay to EAB for registered input
tEABWE1
Write enable delay to EAB for combinatorial input
tEABWE2
Write enable delay to EAB for registered input
tEABCLK
EAB register clock delay
tEABCO
EAB register clock-to-output delay
tEABBYPASS
Bypass register delay
tEABSU
EAB register setup time before clock
tEABH
EAB register hold time after clock
tAA
Address access delay
tWP
Write pulse width
tWDSU
Data setup time before falling edge of write pulse
(5)
tWDH
Data hold time after falling edge of write pulse
(5)
tWASU
Address setup time before rising edge of write pulse
(5)
tWAH
Address hold time after falling edge of write pulse
(5)
tWO
Write enable to data output valid delay
tDD
Data-in to data-out valid delay
tEABOUT
Data-out delay
tEABCH
Clock high time
tEABCL
Clock low time
Altera Corporation
61
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 35. EAB Timing Macroparameters
Symbol
Notes (1), (6)
Parameter
Conditions
tEABAA
EAB address access delay
tEABRCCOMB
EAB asynchronous read cycle time
tEABRCREG
EAB synchronous read cycle time
tEABWP
EAB write pulse width
tEABWCCOMB
EAB asynchronous write cycle time
tEABWCREG
EAB synchronous write cycle time
tEABDD
EAB data-in to data-out valid delay
tEABDATACO
EAB clock-to-output delay when using output registers
tEABDATASU
EAB data/address setup time before clock when using input register
tEABDATAH
EAB data/address hold time after clock when using input register
tEABWESU
EAB WE setup time before clock when using input register
tEABWEH
EAB WE hold time after clock when using input register
tEABWDSU
EAB data setup time before falling edge of write pulse when not using input
registers
tEABWDH
EAB data hold time after falling edge of write pulse when not using input
registers
tEABWASU
EAB address setup time before rising edge of write pulse when not using
input registers
tEABWAH
EAB address hold time after falling edge of write pulse when not using input
registers
tEABWO
EAB write enable to data output valid delay
62
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 36. Interconnect Timing Microparameters
Symbol
Note (1)
Parameter
Conditions
tDIN2IOE
Delay from dedicated input pin to IOE control input
(7)
tDCLK2LE
Delay from dedicated clock pin to LE or EAB clock
(7)
tDIN2DATA
Delay from dedicated input or clock to LE or EAB data
(7)
tDCLK2IOE
Delay from dedicated clock pin to IOE clock
(7)
tDIN2LE
Delay from dedicated input pin to LE or EAB control input
(7)
tSAMELAB
Routing delay for an LE driving another LE in the same LAB
tSAMEROW
Routing delay for a row IOE, LE, or EAB driving a row IOE, LE, or EAB in the (7)
same row
tSAMECOLUMN
Routing delay for an LE driving an IOE in the same column
tDIFFROW
Routing delay for a column IOE, LE, or EAB driving an LE or EAB in a different (7)
row
tTWOROWS
Routing delay for a row IOE or EAB driving an LE or EAB in a different row
(7)
tLEPERIPH
Routing delay for an LE driving a control signal of an IOE via the peripheral
control bus
(7)
tLABCARRY
Routing delay for the carry-out signal of an LE driving the carry-in signal of a
different LE in a different LAB
tLABCASC
Routing delay for the cascade-out signal of an LE driving the cascade-in
signal of a different LE in a different LAB
Table 37. External Timing Parameters
Symbol
(7)
Notes (8), (10)
Parameter
tDRR
Register-to-register delay via four LEs, three row interconnects, and four local (9)
interconnects
tINSU
Setup time with global clock at IOE register
tINH
Hold time with global clock at IOE register
tOUTCO
Clock-to-output delay with global clock at IOE register
Table 38. External Bidirectional Timing Parameters
Symbol
Note (10)
Parameter
tINSUBIDIR
Setup time for bidirectional pins with global clock at adjacent LE register
tINHBIDIR
Hold time for bidirectional pins with global clock at adjacent LE register
tOUTCOBIDIR
Clock-to-output delay for bidirectional pins with global clock at IOE register
tXZBIDIR
Synchronous IOE output buffer disable delay
tZXBIDIR
Synchronous IOE output buffer enable delay, slow slew rate = off
Altera Corporation
Conditions
Condition
63
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements. These parameters cannot be
measured explicitly.
(2) Operating conditions: VCCIO = 5.0 V ± 5% for commercial use in FLEX 10K devices.
VCCIO = 5.0 V ± 10% for industrial use in FLEX 10K devices.
VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10KA devices.
(3) Operating conditions: VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10K devices.
VCCIO = 2.5 V ± 0.2 V for commercial or industrial use in FLEX 10KA devices.
(4) Operating conditions: VCCIO = 2.5 V, 3.3 V, or 5.0 V.
(5) Because the RAM in the EAB is self-timed, this parameter can be ignored when the WE signal is registered.
(6) EAB macroparameters are internal parameters that can simplify predicting the behavior of an EAB at its boundary;
these parameters are calculated by summing selected microparameters.
(7) These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
(8) External reference timing parameters are factory-tested, worst-case values specified by Altera. A representative
subset of signal paths is tested to approximate typical device applications.
(9) Contact Altera Applications for test circuit specifications and test conditions.
(10) These timing parameters are sample-tested only.
Figures 29 and 30 show the asynchronous and synchronous timing
waveforms, respectively, for the EAB macroparameters in Table 34.
Figure 29. EAB Asynchronous Timing Waveforms
EAB Asynchronous Read
WE
a1
a0
Address
a2
tEABAA
Data-Out
a3
tEABRCCOMB
d0
d1
d3
d2
EAB Asynchronous Write
WE
tEABWP
tEABWDSU
din0
Data-In
tEABWDH
din1
tEABWASU
tEABWAH
tEABWCCOMB
Address
a0
a1
a2
tEABDD
Data-Out
64
din0
din1
dout2
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 30. EAB Synchronous Timing Waveforms
EAB Synchronous Read
WE
Address
a0
a1
tEABDATASU
a2
a3
tEABRCREG
tEABDATAH
CLK
tEABDATACO
Data-Out
d2
d1
EAB Synchronous Write (EAB Output Registers Used)
WE
Data-In
Address
a0
din1
din2
din3
a1
a2
a3
tEABWESU
tEABDATASU
tEABDATAH
a2
tEABWEH
CLK
tEABDATACO
tEABWCREG
Data-Out
Altera Corporation
dout0
dout1
din1
din2
din3
din2
65
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Tables 39 through 47 show EPF10K10 and EPF10K20 device internal and
external timing parameters.
Table 39. EPF10K10 & EPF10K20 Device LE Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tLUT
1.4
1.7
ns
tCLUT
0.6
0.7
ns
tRLUT
1.5
1.9
ns
tPACKED
0.6
0.9
ns
tEN
1.0
1.2
ns
tCICO
0.2
0.3
ns
tCGEN
0.9
1.2
ns
tCGENR
0.9
1.2
ns
tCASC
0.8
0.9
ns
tC
1.3
1.5
ns
tCO
0.9
1.1
ns
tCOMB
0.5
0.6
ns
tSU
1.3
2.5
tH
1.4
1.6
tPRE
1.0
tCLR
1.0
ns
ns
1.2
ns
1.2
ns
tCH
4.0
4.0
ns
tCL
4.0
4.0
ns
66
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 40. EPF10K10 & EPF10K20 Device IOE Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tIOD
1.3
1.6
ns
tIOC
0.5
0.7
ns
tIOCO
0.2
0.2
ns
0.0
ns
tIOCOMB
0.0
tIOSU
2.8
3.2
tIOH
1.0
1.2
ns
ns
tIOCLR
1.0
1.2
ns
tOD1
2.6
3.5
ns
tOD2
4.9
6.4
ns
tOD3
6.3
8.2
ns
tXZ
4.5
5.4
ns
tZX1
4.5
5.4
ns
tZX2
6.8
8.3
ns
tZX3
8.2
10.1
ns
tINREG
6.0
7.5
ns
tIOFD
3.1
3.5
ns
tINCOMB
3.1
3.5
ns
Altera Corporation
67
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 41. EPF10K10 & EPF10K20 Device EAB Internal Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tEABDATA1
1.5
1.9
ns
tEABDATA2
4.8
6.0
ns
tEABWE1
1.0
1.2
ns
tEABWE2
5.0
6.2
ns
tEABCLK
1.0
2.2
ns
tEABCO
0.5
0.6
ns
tEABBYPASS
1.5
1.9
tEABSU
1.5
tEABH
2.0
1.8
2.5
8.7
tAA
ns
ns
ns
10.7
ns
tWP
5.8
7.2
ns
tWDSU
1.6
2.0
ns
tWDH
0.3
0.4
ns
tWASU
0.5
0.6
ns
tWAH
1.0
1.2
ns
tWO
5.0
6.2
ns
tDD
5.0
6.2
ns
tEABOUT
0.5
0.6
ns
tEABCH
4.0
4.0
ns
tEABCL
5.8
7.2
ns
68
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 42. EPF10K10 & EPF10K20 Device EAB Internal Timing Macroparameters
Symbol
-3 Speed Grade
Min
tEABAA
tEABRCCOMB
Max
Note (1)
-4 Speed Grade
Min
13.7
Unit
Max
17.0
ns
13.7
17.0
ns
tEABRCREG
9.7
11.9
ns
tEABWP
5.8
7.2
ns
tEABWCCOMB
7.3
9.0
ns
13.0
16.0
tEABWCREG
tEABDD
tEABDATACO
ns
10.0
12.5
ns
2.0
3.4
ns
tEABDATASU
5.3
5.6
ns
tEABDATAH
0.0
0.0
ns
tEABWESU
5.5
5.8
ns
tEABWEH
0.0
0.0
ns
tEABWDSU
5.5
5.8
ns
tEABWDH
0.0
0.0
ns
tEABWASU
2.1
2.7
ns
tEABWAH
0.0
0.0
tEABWO
Altera Corporation
9.5
ns
11.8
ns
69
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 43. EPF10K10 Device Interconnect Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
4.8
6.2
ns
tDIN2LE
2.6
3.8
ns
tDIN2DATA
4.3
5.2
ns
tDCLK2IOE
3.4
4.0
ns
tDCLK2LE
2.6
3.8
ns
tSAMELAB
0.6
0.6
ns
tSAMEROW
3.6
3.8
ns
tSAMECOLUMN
0.9
1.1
ns
tDIFFROW
4.5
4.9
ns
tTWOROWS
8.1
8.7
ns
tLEPERIPH
3.3
3.9
ns
tLABCARRY
0.5
0.8
ns
tLABCASC
2.7
3.0
ns
Table 44. EPF10K20 Device Interconnect Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
5.2
6.6
ns
tDIN2LE
2.6
3.8
ns
tDIN2DATA
4.3
5.2
ns
tDCLK2IOE
4.3
4.0
ns
tDCLK2LE
2.6
3.8
ns
tSAMELAB
0.6
0.6
ns
tSAMEROW
3.7
3.9
ns
tSAMECOLUMN
1.4
1.6
ns
tDIFFROW
5.1
5.5
ns
tTWOROWS
8.8
9.4
ns
tLEPERIPH
4.7
5.6
ns
tLABCARRY
0.5
0.8
ns
tLABCASC
2.7
3.0
ns
70
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 45. EPF10K10 & EPF10K20 Device External Timing Parameters
Symbol
-3 Speed Grade
Min
tDRR
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
16.1
20.0
ns
tINSU (2), (3)
5.5
6.0
ns
tINH (3)
0.0
0.0
ns
tOUTCO (3)
2.0
6.7
2.0
Table 46. EPF10K10 Device External Bidirectional Timing Parameters
Symbol
-3 Speed Grade
Min
tINSUBIDIR
4.5
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
8.4
Note (1)
-4 Speed Grade
Min
Unit
Max
5.6
ns
0.0
6.7
ns
ns
2.0
8.4
ns
tXZBIDIR
10.5
13.4
ns
tZXBIDIR
10.5
13.4
ns
Table 47. EPF10K20 Device External Bidirectional Timing Parameters
Symbol
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
tINSUBIDIR
4.6
5.7
tINHBIDIR
0.0
0.0
tOUTCOBIDIR
2.0
6.7
Note (1)
2.0
Unit
Max
ns
ns
8.4
ns
tXZBIDIR
10.5
13.4
ns
tZXBIDIR
10.5
13.4
ns
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Altera Corporation
71
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Tables 48 through 56 show EPF10K30, EPF10K40, and EPF10K50 device
internal and external timing parameters.
Table 48. EPF10K30, EPF10K40 & EPF10K50 Device LE Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tLUT
1.3
1.8
ns
tCLUT
0.6
0.6
ns
tRLUT
1.5
2.0
ns
tPACKED
0.5
0.8
ns
tEN
0.9
1.5
ns
tCICO
0.2
0.4
ns
tCGEN
0.9
1.4
ns
tCGENR
0.9
1.4
ns
tCASC
1.0
1.2
ns
tC
1.3
1.6
ns
tCO
0.9
1.2
ns
tCOMB
0.6
0.6
ns
tSU
1.4
1.4
tH
0.9
1.3
tPRE
0.9
tCLR
0.9
ns
ns
1.2
ns
1.2
ns
tCH
4.0
4.0
ns
tCL
4.0
4.0
ns
72
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 49. EPF10K30, EPF10K40 & EPF10K50 Device IOE Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tIOD
0.4
0.6
ns
tIOC
0.5
0.9
ns
tIOCO
0.4
0.5
ns
0.0
ns
tIOCOMB
0.0
tIOSU
3.1
3.5
tIOH
1.0
1.9
ns
ns
tIOCLR
1.0
1.2
ns
tOD1
3.3
3.6
ns
tOD2
5.6
6.5
ns
tOD3
7.0
8.3
ns
tXZ
5.2
5.5
ns
tZX1
5.2
5.5
ns
tZX2
7.5
8.4
ns
tZX3
8.9
10.2
ns
tINREG
7.7
10.0
ns
tIOFD
3.3
4.0
ns
tINCOMB
3.3
4.0
ns
Altera Corporation
73
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 50. EPF10K30, EPF10K40 & EPF10K50 Device EAB Internal Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tEABDATA1
1.5
1.9
ns
tEABDATA2
4.8
6.0
ns
tEABWE1
1.0
1.2
ns
tEABWE2
5.0
6.2
ns
tEABCLK
1.0
2.2
ns
tEABCO
0.5
0.6
ns
tEABBYPASS
1.5
1.9
tEABSU
1.5
tEABH
2.0
1.8
2.5
8.7
tAA
ns
ns
ns
10.7
ns
tWP
5.8
7.2
ns
tWDSU
1.6
2.0
ns
tWDH
0.3
0.4
ns
tWASU
0.5
0.6
ns
tWAH
1.0
1.2
ns
tWO
5.0
6.2
ns
tDD
5.0
6.2
ns
tEABOUT
0.5
0.6
ns
tEABCH
4.0
4.0
ns
tEABCL
5.8
7.2
ns
74
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 51. EPF10K30, EPF10K40 & EPF10K50 Device EAB Internal Timing Macroparameters
Symbol
-3 Speed Grade
Min
tEABAA
tEABRCCOMB
Max
-4 Speed Grade
Min
13.7
Note (1)
Unit
Max
17.0
ns
13.7
17.0
ns
tEABRCREG
9.7
11.9
ns
tEABWP
5.8
7.2
ns
tEABWCCOMB
7.3
9.0
ns
13.0
16.0
tEABWCREG
tEABDD
tEABDATACO
ns
10.0
12.5
ns
2.0
3.4
ns
tEABDATASU
5.3
5.6
ns
tEABDATAH
0.0
0.0
ns
tEABWESU
5.5
5.8
ns
tEABWEH
0.0
0.0
ns
tEABWDSU
5.5
5.8
ns
tEABWDH
0.0
0.0
ns
tEABWASU
2.1
2.7
ns
tEABWAH
0.0
0.0
tEABWO
Altera Corporation
9.5
ns
11.8
ns
75
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 52. EPF10K30 Device Interconnect Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
6.9
8.7
tDIN2LE
3.6
4.8
ns
tDIN2DATA
5.5
7.2
ns
tDCLK2IOE
4.6
6.2
ns
tDCLK2LE
3.6
4.8
ns
tSAMELAB
0.3
0.3
ns
tSAMEROW
3.3
3.7
ns
tSAMECOLUMN
2.5
2.7
ns
tDIFFROW
5.8
6.4
ns
tTWOROWS
9.1
10.1
ns
tLEPERIPH
6.2
7.1
ns
tLABCARRY
0.4
0.6
ns
tLABCASC
2.4
3.0
ns
Table 53. EPF10K40 Device Interconnect Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
ns
Note (1)
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
7.6
9.4
tDIN2LE
3.6
4.8
ns
tDIN2DATA
5.5
7.2
ns
tDCLK2IOE
4.6
6.2
ns
tDCLK2LE
3.6
4.8
ns
tSAMELAB
0.3
0.3
ns
tSAMEROW
3.3
3.7
ns
tSAMECOLUMN
3.1
3.2
ns
tDIFFROW
6.4
6.4
ns
tTWOROWS
9.7
10.6
ns
tLEPERIPH
6.4
7.1
ns
tLABCARRY
0.4
0.6
ns
tLABCASC
2.4
3.0
ns
76
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 54. EPF10K50 Device Interconnect Timing Microparameters
Symbol
-3 Speed Grade
Min
Max
Note (1)
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
8.4
10.2
ns
tDIN2LE
3.6
4.8
ns
tDIN2DATA
5.5
7.2
ns
tDCLK2IOE
4.6
6.2
ns
tDCLK2LE
3.6
4.8
ns
tSAMELAB
0.3
0.3
ns
tSAMEROW
3.3
3.7
ns
tSAMECOLUMN
3.9
4.1
ns
ns
tDIFFROW
7.2
7.8
tTWOROWS
10.5
11.5
ns
tLEPERIPH
7.5
8.2
ns
tLABCARRY
0.4
0.6
ns
tLABCASC
2.4
3.0
ns
Table 55. EPF10K30, EPF10K40 & EPF10K50 Device External Timing Parameters
Symbol
-3 Speed Grade
Min
tDRR
Max
-4 Speed Grade
Min
17.2
tINSU (2), (3)
5.7
tINH (3)
0.0
tOUTCO (3)
2.0
Note (1)
Max
21.1
6.4
2.0
ns
11.2
Table 56. EPF10K30, EPF10K40 & EPF10K50 Device External Bidirectional Timing Parameters
Symbol
-3 Speed Grade
Min
tINSUBIDIR
4.1
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
-4 Speed Grade
Min
Note (1)
Unit
ns
0.0
2.0
ns
Max
4.6
8.8
ns
ns
0.0
8.8
Unit
ns
11.2
ns
tXZBIDIR
12.3
15.0
ns
tZXBIDIR
12.3
15.0
ns
Altera Corporation
77
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 57 through 63 show EPF10K70 device internal and external timing
parameters.
Table 57. EPF10K70 Device LE Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
1.3
1.5
2.0
ns
tCLUT
0.4
0.4
0.5
ns
tRLUT
1.5
1.6
2.0
ns
tPACKED
0.8
0.9
1.3
ns
tEN
0.8
0.9
1.2
ns
tCICO
0.2
0.2
0.3
ns
tCGEN
1.0
1.1
1.4
ns
tCGENR
1.1
1.2
1.5
ns
tCASC
1.0
1.1
1.3
ns
tC
0.7
0.8
1.0
ns
tCO
0.9
1.0
1.4
ns
tCOMB
0.4
0.5
0.7
ns
tSU
1.9
tH
2.1
2.1
2.3
0.9
tPRE
tCLR
2.6
3.1
1.0
0.9
ns
1.0
ns
1.4
ns
1.4
ns
tCH
4.0
4.0
4.0
ns
tCL
4.0
4.0
4.0
ns
78
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 58. EPF10K70 Device IOE Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tIOD
0.0
0.0
0.0
ns
tIOC
0.4
0.5
0.7
ns
tIOCO
0.4
0.4
0.9
ns
0.0
ns
tIOCOMB
0.0
0.0
tIOSU
4.5
5.0
6.2
tIOH
0.4
0.5
0.7
ns
ns
tIOCLR
0.6
0.7
1.6
ns
tOD1
3.6
4.0
5.0
ns
tOD2
5.6
6.3
7.3
ns
tOD3
6.9
7.7
8.7
ns
tXZ
5.5
6.2
6.8
ns
tZX1
5.5
6.2
6.8
ns
tZX2
7.5
8.5
9.1
ns
tZX3
8.8
9.9
10.5
ns
tINREG
8.0
9.0
10.2
ns
tIOFD
7.2
8.1
10.3
ns
tINCOMB
7.2
8.1
10.3
ns
Altera Corporation
79
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 59. EPF10K70 Device EAB Internal Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
1.3
1.5
1.9
ns
tEABDATA2
4.3
4.8
6.0
ns
tEABWE1
0.9
1.0
1.2
ns
tEABWE2
4.5
5.0
6.2
ns
tEABCLK
0.9
1.0
2.2
ns
tEABCO
0.4
0.5
0.6
ns
tEABBYPASS
1.3
1.5
1.9
ns
tEABSU
1.3
tEABH
1.8
1.5
2.0
7.8
tAA
1.8
ns
2.5
8.7
ns
10.7
ns
tWP
5.2
5.8
7.2
ns
tWDSU
1.4
1.6
2.0
ns
tWDH
0.3
0.3
0.4
ns
tWASU
0.4
0.5
0.6
ns
tWAH
0.9
1.0
1.2
ns
tWO
4.5
5.0
6.2
ns
tDD
4.5
5.0
6.2
ns
tEABOUT
0.4
0.5
0.6
ns
tEABCH
4.0
4.0
4.0
ns
tEABCL
5.2
5.8
7.2
ns
80
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 60. EPF10K70 Device EAB Internal Timing Macroparameters
Symbol
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
tEABAA
tEABRCCOMB
Note (1)
Max
12.1
Max
13.7
Unit
Max
17.0
ns
12.1
13.7
17.0
ns
tEABRCREG
8.6
9.7
11.9
ns
tEABWP
5.2
5.8
7.2
ns
tEABWCCOMB
6.5
7.3
9.0
ns
tEABWCREG
11.6
13.0
16.0
ns
tEABDD
8.8
10.0
12.5
ns
tEABDATACO
1.7
2.0
3.4
ns
tEABDATASU
4.7
5.3
5.6
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
4.9
5.5
5.8
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
1.8
2.1
2.7
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
4.1
4.7
5.8
ns
tEABWAH
0.0
0.0
0.0
tEABWO
Altera Corporation
8.4
9.5
ns
11.8
ns
81
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 61. EPF10K70 Device Interconnect Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
6.6
7.3
8.8
ns
tDIN2LE
4.2
4.8
6.0
ns
tDIN2DATA
6.5
7.1
10.8
ns
tDCLK2IOE
5.5
6.2
7.7
ns
tDCLK2LE
4.2
4.8
6.0
ns
tSAMELAB
0.4
0.4
0.5
ns
tSAMEROW
4.8
4.9
5.5
ns
tSAMECOLUMN
3.3
3.4
3.7
ns
ns
tDIFFROW
8.1
8.3
9.2
tTWOROWS
12.9
13.2
14.7
ns
tLEPERIPH
5.5
5.7
6.5
ns
tLABCARRY
0.8
0.9
1.1
ns
tLABCASC
2.7
3.0
3.2
ns
Table 62. EPF10K70 Device External Timing Parameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
tDRR
Max
17.2
tINSU (2), (3)
6.6
tINH (3)
0.0
tOUTCO (3)
2.0
Max
19.1
7.3
24.2
2.0
Table 63. EPF10K70 Device External Bidirectional Timing Parameters
Note (1)
-2 Speed Grade
-3 Speed Grade
Min
Min
tINSUBIDIR
7.4
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
Max
8.1
2.0
2.0
Unit
ns
0.0
11.1
ns
Max
10.4
0.0
9.9
ns
14.3
-4 Speed Grade
Min
ns
ns
0.0
11.1
Symbol
2.0
Max
8.0
0.0
9.9
Unit
ns
14.3
ns
tXZBIDIR
13.7
15.4
18.5
ns
tZXBIDIR
13.7
15.4
18.5
ns
82
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 64 through 70 show EPF10K100 device internal and external timing
parameters.
Table 64. EPF10K100 Device LE Timing Microparameters
Symbol
-3DX Speed Grade
Min
Max
Note (1)
-3 Speed Grade
-4 Speed Grade
Min
Min
Max
Unit
Max
tLUT
1.5
1.5
2.0
ns
tCLUT
0.4
0.4
0.5
ns
tRLUT
1.6
1.6
2.0
ns
tPACKED
0.9
0.9
1.3
ns
tEN
0.9
0.9
1.2
ns
tCICO
0.2
0.2
0.3
ns
tCGEN
1.1
1.1
1.4
ns
tCGENR
1.2
1.2
1.5
ns
tCASC
1.1
1.1
1.3
ns
tC
0.8
0.8
1.0
ns
tCO
1.0
1.0
1.4
ns
tCOMB
0.5
0.5
0.7
ns
tSU
2.1
2.1
2.6
ns
tH
2.3
2.3
3.1
ns
tPRE
1.0
1.0
1.4
tCLR
1.0
1.0
1.4
ns
ns
tCH
4.0
4.0
4.0
ns
tCL
4.0
4.0
4.0
ns
Altera Corporation
83
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 65. EPF10K100 Device IOE Timing Microparameters
Symbol
-3DX Speed Grade
Min
Max
Note (1)
-3 Speed Grade
-4 Speed Grade
Min
Min
Max
Unit
Max
tIOD
0.0
0.0
0.0
ns
tIOC
0.5
0.5
0.7
ns
tIOCO
0.4
0.4
0.9
ns
0.0
ns
tIOCOMB
0.0
0.0
tIOSU
5.5
5.5
6.7
tIOH
0.5
0.5
0.7
ns
ns
tIOCLR
0.7
0.7
1.6
ns
tOD1
4.0
4.0
5.0
ns
tOD2
6.3
6.3
7.3
ns
tOD3
7.7
7.7
8.7
ns
tXZ
6.2
6.2
6.8
ns
tZX1
6.2
6.2
6.8
ns
tZX2
8.5
8.5
9.1
ns
tZX3
9.9
9.9
10.5
ns
tINREG without ClockLock or
ClockBoost circuitry
9.0
9.0
10.5
ns
tINREG with ClockLock or
ClockBoost circuitry
3.0
–
–
ns
tIOFD
8.1
8.1
10.3
ns
tINCOMB
8.1
8.1
10.3
ns
84
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 66. EPF10K100 Device EAB Internal Microparameters
Symbol
-3DX Speed Grade
Min
Max
Note (1)
-3 Speed Grade
-4 Speed Grade
Min
Min
Max
Unit
Max
tEABDATA1
1.5
1.5
1.9
ns
tEABDATA2
4.8
4.8
6.0
ns
tEABWE1
1.0
1.0
1.2
ns
tEABWE2
5.0
5.0
6.2
ns
tEABCLK
1.0
1.0
2.2
ns
tEABCO
0.5
0.5
0.6
ns
tEABBYPASS
1.5
1.5
1.9
ns
tEABSU
1.5
tEABH
2.0
1.5
2.0
8.7
tAA
1.8
ns
2.5
8.7
ns
10.7
ns
tWP
5.8
5.8
7.2
ns
tWDSU
1.6
1.6
2.0
ns
tWDH
0.3
0.3
0.4
ns
tWASU
0.5
0.5
0.6
ns
tWAH
1.0
1.0
1.2
ns
tWO
5.0
5.0
6.2
ns
tDD
5.0
5.0
6.2
ns
tEABOUT
0.5
0.5
0.6
ns
tEABCH
4.0
4.0
4.0
ns
tEABCL
5.8
5.8
7.2
ns
Altera Corporation
85
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 67. EPF10K100 Device EAB Internal Timing Macroparameters
Symbol
-3DX Speed Grade
Min
tEABAA
tEABRCCOMB
Max
Note (1)
-3 Speed Grade
-4 Speed Grade
Min
Min
13.7
Max
13.7
Unit
Max
17.0
ns
13.7
13.7
17.0
ns
tEABRCREG
9.7
9.7
11.9
ns
tEABWP
5.8
5.8
7.2
ns
tEABWCCOMB
7.3
7.3
9.0
ns
tEABWCREG
13.0
tEABDD
tEABDATACO
13.0
16.0
ns
10.0
10.0
12.5
ns
2.0
2.0
3.4
ns
tEABDATASU
5.3
5.3
5.6
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
5.5
5.5
5.8
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
5.5
5.5
5.8
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
2.1
2.1
2.7
ns
tEABWAH
0.0
0.0
0.0
tEABWO
86
9.5
9.5
ns
11.8
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 68. EPF10K100 Device Interconnect Timing Microparameters
Symbol
-3DX Speed Grade
Min
Max
Note (1)
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
10.3
10.3
12.2
ns
tDIN2LE
4.8
4.8
6.0
ns
tDIN2DATA
7.3
7.3
11.0
ns
tDCLK2IOE without ClockLock or
ClockBoost circuitry
6.2
6.2
7.7
ns
tDCLK2IOE with ClockLock or ClockBoost
circuitry
2.3
–
–
ns
tDCLK2LE without ClockLock or
ClockBoost circuitry
4.8
4.8
6.0
ns
tDCLK2LE with ClockLock or ClockBoost
circuitry
2.3
–
–
ns
tSAMELAB
0.4
0.4
0.5
ns
tSAMEROW
4.9
4.9
5.5
ns
tSAMECOLUMN
5.1
5.1
5.4
ns
tDIFFROW
10.0
10.0
10.9
ns
tTWOROWS
14.9
14.9
16.4
ns
tLEPERIPH
6.9
6.9
8.1
ns
tLABCARRY
0.9
0.9
1.1
ns
tLABCASC
3.0
3.0
3.2
ns
Altera Corporation
87
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 69. EPF10K100 Device External Timing Parameters
Symbol
-3DX Speed Grade
Min
tDRR
Max
-3 Speed Grade
-4 Speed Grade
Min
Min
19.1
tINSU (2), (3), (4)
7.8
tOUTCO (3), (4)
2.0
tINH (3)
0.0
tINSU (2), (3), (5)
6.2
tOUTCO (3), (5)
2.0
Note (1)
Max
19.1
7.8
11.1
2.0
0.0
-3DX Speed Grade
Min
Max
2.0
-3 Speed Grade
Min
Max
ns
ns
14.3
ns
ns
–
–
Table 70. EPF10K100 Device External Bidirectional Timing Parameters
Symbol
24.2
0.0
–
6.7
Max
8.5
11.1
Unit
ns
–
ns
Note (1)
-4 Speed Grade
Min
Unit
Max
tINSUBIDIR (4)
8.1
8.1
10.4
ns
tINHBIDIR (4)
0.0
0.0
0.0
ns
tOUTCOBIDIR (4)
2.0
tXZBIDIR (4)
11.1
2.0
15.3
tZXBIDIR (4)
11.1
2.0
15.3
15.3
15.3
14.3
ns
18.4
ns
18.4
ns
tINSUBIDIR (5)
9.1
–
–
ns
tINHBIDIR (5)
0.0
–
–
ns
tOUTCOBIDIR (5)
2.0
–
ns
tXZBIDIR (5)
14.3
7.2
–
–
–
–
–
ns
tZXBIDIR (5)
14.3
–
–
ns
Notes to tables:
(1)
(2)
(3)
(4)
(5)
88
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
This parameter is measured without the use of the ClockLock or ClockBoost circuits.
This parameter is measured with the use of the ClockLock or ClockBoost circuits.
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Tables 71 through 77 show EPF10K50V device internal and external
timing parameters.
Table 71. EPF10K50V Device LE Timing Microparameters
Symbol
-1 Speed Grade
Min
Max
-2 Speed Grade
Min
Max
Note (1)
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
Unit
Max
tLUT
0.9
1.0
1.3
1.6
ns
tCLUT
0.1
0.5
0.6
0.6
ns
tRLUT
0.5
0.8
0.9
1.0
ns
tPACKED
0.4
0.4
0.5
0.7
ns
tEN
0.7
0.9
1.1
1.4
ns
tCICO
0.2
0.2
0.2
0.3
ns
tCGEN
0.8
0.7
0.8
1.2
ns
tCGENR
0.4
0.3
0.3
0.4
ns
tCASC
0.7
0.7
0.8
0.9
ns
tC
0.3
1.0
1.3
1.5
ns
tCO
0.5
0.7
0.9
1.0
ns
tCOMB
0.4
0.4
0.5
0.6
ns
tSU
0.8
1.6
2.2
2.5
ns
tH
0.5
0.8
1.0
1.4
ns
tPRE
0.8
0.4
0.5
0.5
ns
tCLR
0.8
0.4
0.5
0.5
ns
tCH
2.0
4.0
4.0
4.0
ns
tCL
2.0
4.0
4.0
4.0
ns
Altera Corporation
89
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 72. EPF10K50V Device IOE Timing Microparameters
Symbol
-1 Speed Grade
Min
Max
-2 Speed Grade
Min
Max
Note (1)
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
Unit
Max
tIOD
1.2
1.6
1.9
2.1
ns
tIOC
0.3
0.4
0.5
0.5
ns
tIOCO
0.3
0.3
0.4
0.4
ns
0.0
ns
tIOCOMB
0.0
0.0
0.0
tIOSU
2.8
2.8
3.4
3.9
tIOH
0.7
0.8
1.0
1.4
ns
ns
tIOCLR
0.5
0.6
0.7
0.7
ns
tOD1
2.8
3.2
3.9
4.7
ns
tOD2
–
–
–
–
ns
tOD3
6.5
6.9
7.6
8.4
ns
tXZ
2.8
3.1
3.8
4.6
ns
tZX1
2.8
3.1
3.8
4.6
ns
tZX2
–
–
–
–
ns
tZX3
6.5
6.8
7.5
8.3
ns
tINREG
5.0
5.7
7.0
9.0
ns
tIOFD
1.5
1.9
2.3
2.7
ns
tINCOMB
1.5
1.9
2.3
2.7
ns
90
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 73. EPF10K50V Device EAB Internal Microparameters
Symbol
-1 Speed Grade
Min
Max
-2 Speed Grade
Min
Max
Note (1)
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
Unit
Max
tEABDATA1
1.7
2.8
3.4
4.6
ns
tEABDATA2
4.9
3.9
4.8
5.9
ns
tEABWE1
0.0
2.5
3.0
3.7
ns
tEABWE2
4.0
4.1
5.0
6.2
ns
tEABCLK
0.4
0.8
1.0
1.2
ns
tEABCO
0.1
0.2
0.3
0.4
ns
tEABBYPASS
0.9
1.1
1.3
1.6
tEABSU
0.8
tEABH
0.8
1.5
1.6
5.5
tAA
1.8
2.2
2.0
8.2
2.5
10.0
ns
ns
ns
12.4
ns
tWP
6.0
4.9
6.0
7.4
ns
tWDSU
0.1
0.8
1.0
1.2
ns
tWDH
0.1
0.2
0.3
0.4
ns
tWASU
0.1
0.4
0.5
0.6
ns
tWAH
0.1
0.8
1.0
1.2
ns
tWO
2.8
4.3
5.3
6.5
ns
tDD
2.8
4.3
5.3
6.5
ns
tEABOUT
0.5
0.4
0.5
0.6
ns
tEABCH
2.0
4.0
4.0
4.0
ns
tEABCL
6.0
4.9
6.0
7.4
ns
Altera Corporation
91
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 74. EPF10K50V Device EAB Internal Timing Macroparameters
Symbol
-1 Speed Grade
Min
tEABAA
Max
-2 Speed Grade
Min
9.5
Max
Note (1)
-3 Speed Grade
Min
13.6
Max
-4 Speed Grade
Min
16.5
Unit
Max
20.8
ns
tEABRCCOMB
9.5
13.6
16.5
20.8
ns
tEABRCREG
6.1
8.8
10.8
13.4
ns
tEABWP
6.0
4.9
6.0
7.4
ns
tEABWCCOMB
6.2
6.1
7.5
9.2
ns
tEABWCREG
12.0
11.6
14.2
17.4
ns
tEABDD
6.8
9.7
11.8
14.9
ns
tEABDATACO
1.0
1.4
1.8
2.2
ns
tEABDATASU
5.3
4.6
5.6
6.9
ns
tEABDATAH
0.0
0.0
0.0
0.0
ns
tEABWESU
4.4
4.8
5.8
7.2
ns
tEABWEH
0.0
0.0
0.0
0.0
ns
tEABWDSU
1.8
1.1
1.4
2.1
ns
tEABWDH
0.0
0.0
0.0
0.0
ns
tEABWASU
4.5
4.6
5.6
7.4
ns
tEABWAH
0.0
0.0
0.0
0.0
tEABWO
92
5.1
9.4
11.4
ns
14.0
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 75. EPF10K50V Device Interconnect Timing Microparameters
Symbol
-1 Speed Grade
Min
Max
-2 Speed Grade
Min
Max
Note (1)
-3 Speed Grade
Min
Max
-4 Speed Grade
Min
Unit
Max
tDIN2IOE
4.7
6.0
7.1
8.2
ns
tDIN2LE
2.5
2.6
3.1
3.9
ns
tDIN2DATA
4.4
5.9
6.8
7.7
ns
tDCLK2IOE
2.5
3.9
4.7
5.5
ns
tDCLK2LE
2.5
2.6
3.1
3.9
ns
tSAMELAB
0.2
0.2
0.3
0.3
ns
tSAMEROW
2.8
3.0
3.2
3.4
ns
tSAMECOLUMN
3.0
3.2
3.4
3.6
ns
tDIFFROW
5.8
6.2
6.6
7.0
ns
tTWOROWS
8.6
9.2
9.8
10.4
ns
tLEPERIPH
4.5
5.5
6.1
7.0
ns
tLABCARRY
0.3
0.4
0.5
0.7
ns
tLABCASC
0.0
1.3
1.6
2.0
ns
Table 76. EPF10K50V Device External Timing Parameters
Symbol
-1 Speed Grade
Min
tDRR
Max
-2 Speed Grade
Min
11.2
tINSU (2), (3)
5.5
tINH (3)
0.0
tOUTCO (3)
2.0
Max
-3 Speed Grade
Min
14.0
4.2
2.0
Max
2.0
-1 Speed Grade
Min
tINSUBIDIR
2.0
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
-2 Speed Grade
Min
Max
2.8
2.0
Max
3.5
0.0
5.9
-3 Speed Grade
Min
2.0
ns
11.1
ns
Note (1)
-4 Speed Grade
Min
2.0
Unit
Max
ns
0.0
9.5
ns
ns
4.1
0.0
7.8
21.1
2.0
Unit
Max
0.0
9.5
Table 77. EPF10K50V Device External Bidirectional Timing Parameters
Symbol
Min
6.9
0.0
7.8
-4 Speed Grade
17.2
5.2
0.0
5.9
Note (1)
ns
11.1
ns
tXZBIDIR
8.0
9.8
11.8
14.3
ns
tZXBIDIR
8.0
9.8
11.8
14.3
ns
Altera Corporation
93
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 78 through 84 show EPF10K130V device internal and external
timing parameters.
Table 78. EPF10K130V Device LE Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
1.3
1.8
2.3
ns
tCLUT
0.5
0.7
0.9
ns
tRLUT
1.2
1.7
2.2
ns
tPACKED
0.5
0.6
0.7
ns
tEN
0.6
0.8
1.0
ns
tCICO
0.2
0.3
0.4
ns
tCGEN
0.3
0.4
0.5
ns
tCGENR
0.7
1.0
1.3
ns
tCASC
0.9
1.2
1.5
ns
tC
1.9
2.4
3.0
ns
tCO
0.6
0.9
1.1
ns
tCOMB
0.5
0.7
0.9
ns
tSU
0.2
tH
0.0
0.2
0.3
0.0
ns
0.0
ns
tPRE
2.4
3.1
3.9
tCLR
2.4
3.1
3.9
ns
ns
tCH
4.0
4.0
4.0
ns
tCL
4.0
4.0
4.0
ns
94
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 79. EPF10K130V Device IOE Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tIOD
1.3
1.6
2.0
ns
tIOC
0.4
0.5
0.7
ns
tIOCO
0.3
0.4
0.5
ns
0.0
ns
tIOCOMB
0.0
0.0
tIOSU
2.6
3.3
3.8
tIOH
0.0
0.0
0.0
ns
ns
tIOCLR
1.7
2.2
2.7
ns
tOD1
3.5
4.4
5.0
ns
tOD2
–
–
–
ns
tOD3
8.2
8.1
9.7
ns
tXZ
4.9
6.3
7.4
ns
tZX1
4.9
6.3
7.4
ns
tZX2
–
–
–
ns
tZX3
9.6
10.0
12.1
ns
tINREG
7.9
10.0
12.6
ns
tIOFD
6.2
7.9
9.9
ns
tINCOMB
6.2
7.9
9.9
ns
Altera Corporation
95
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 80. EPF10K130V Device EAB Internal Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
1.9
2.4
2.4
ns
tEABDATA2
3.7
4.7
4.7
ns
tEABWE1
1.9
2.4
2.4
ns
tEABWE2
3.7
4.7
4.7
ns
tEABCLK
0.7
0.9
0.9
ns
tEABCO
0.5
0.6
0.6
ns
tEABBYPASS
0.6
0.8
0.8
ns
tEABSU
1.4
tEABH
0.0
1.8
0.0
5.6
tAA
1.8
ns
0.0
7.1
ns
7.1
ns
tWP
3.7
4.7
4.7
ns
tWDSU
4.6
5.9
5.9
ns
tWDH
0.0
0.0
0.0
ns
tWASU
3.9
5.0
5.0
ns
tWAH
0.0
0.0
0.0
ns
tWO
5.6
7.1
7.1
ns
tDD
5.6
7.1
7.1
ns
tEABOUT
2.4
3.1
3.1
ns
tEABCH
4.0
4.0
4.0
ns
tEABCL
4.0
4.7
4.7
ns
96
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 81. EPF10K130V Device EAB Internal Timing Macroparameters
Symbol
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
tEABAA
tEABRCCOMB
Note (1)
Max
11.2
Max
14.2
Unit
Max
14.2
ns
11.1
14.2
14.2
ns
tEABRCREG
8.5
10.8
10.8
ns
tEABWP
3.7
4.7
4.7
ns
tEABWCCOMB
7.6
9.7
9.7
ns
14.0
17.8
17.8
tEABWCREG
tEABDD
tEABDATACO
ns
11.1
14.2
14.2
ns
3.6
4.6
4.6
ns
tEABDATASU
4.4
5.6
5.6
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
4.4
5.6
5.6
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
4.6
5.9
5.9
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
3.9
5.0
5.0
ns
tEABWAH
0.0
0.0
0.0
tEABWO
Altera Corporation
11.1
14.2
ns
14.2
ns
97
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 82. EPF10K130V Device Interconnect Timing Microparameters
Symbol
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
8.0
9.0
9.5
ns
tDIN2LE
2.4
3.0
3.1
ns
tDIN2DATA
5.0
6.3
7.4
ns
tDCLK2IOE
3.6
4.6
5.1
ns
tDCLK2LE
2.4
3.0
3.1
ns
tSAMELAB
0.4
0.6
0.8
ns
tSAMEROW
4.5
5.3
6.5
ns
tSAMECOLUMN
9.0
9.5
9.7
ns
tDIFFROW
13.5
14.8
16.2
ns
tTWOROWS
18.0
20.1
22.7
ns
tLEPERIPH
8.1
8.6
9.5
ns
tLABCARRY
0.6
0.8
1.0
ns
tLABCASC
0.8
1.0
1.2
ns
Table 83. EPF10K130V Device External Timing Parameters
Symbol
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
tDRR
Max
15.0
tINSU (2), (3)
Note (1)
6.9
tINH (3)
0.0
tOUTCO (3)
2.0
Max
19.1
8.6
2.0
-2 Speed Grade
-3 Speed Grade
Min
Min
tINSUBIDIR
6.7
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
Max
8.5
2.0
2.0
ns
11.3
ns
Note (1)
-4 Speed Grade
Min
2.0
Unit
Max
ns
0.0
8.8
ns
ns
10.8
0.0
6.9
24.2
0.0
9.9
Table 84. EPF10K130V Device External Bidirectional Timing Parameters
Symbol
Max
11.0
0.0
7.8
Unit
ns
10.2
ns
tXZBIDIR
12.9
16.4
19.3
ns
tZXBIDIR
12.9
16.4
19.3
ns
98
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 85 through 91 show EPF10K10A device internal and external
timing parameters.
Table 85. EPF10K10A Device LE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
0.9
1.2
1.6
ns
tCLUT
1.2
1.4
1.9
ns
tRLUT
1.9
2.3
3.0
ns
tPACKED
0.6
0.7
0.9
ns
tEN
0.5
0.6
0.8
ns
tCICO
02
0.3
0.4
ns
tCGEN
0.7
0.9
1.1
ns
tCGENR
0.7
0.9
1.1
ns
tCASC
1.0
1.2
1.7
ns
tC
1.2
1.4
1.9
ns
tCO
0.5
0.6
0.8
ns
tCOMB
0.5
0.6
0.8
ns
tSU
1.1
1.3
1.7
ns
tH
0.6
0.7
0.9
ns
tPRE
0.5
0.6
0.9
ns
tCLR
0.5
0.6
0.9
ns
tCH
3.0
3.5
4.0
ns
tCL
3.0
3.5
4.0
ns
Table 86. EPF10K10A Device IOE Timing Microparameters
Symbol
Note (1) (Part 1 of 2)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
1.3
1.5
2.0
ns
tIOC
0.2
0.3
0.3
ns
tIOCO
0.2
0.3
0.4
ns
tIOCOMB
0.6
0.7
0.9
tIOSU
Altera Corporation
0.8
1.0
1.3
ns
ns
99
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 86. EPF10K10A Device IOE Timing Microparameters
Symbol
tIOH
Note (1) (Part 2 of 2)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
0.8
Max
1.0
Unit
Max
1.3
ns
tIOCLR
1.2
1.4
1.9
ns
tOD1
1.2
1.4
1.9
ns
tOD2
2.9
3.5
4.7
ns
tOD3
6.6
7.8
10.5
ns
tXZ
1.2
1.4
1.9
ns
tZX1
1.2
1.4
1.9
ns
tZX2
2.9
3.5
4.7
ns
tZX3
6.6
7.8
10.5
ns
tINREG
5.2
6.3
8.4
ns
tIOFD
3.1
3.8
5.0
ns
tINCOMB
3.1
3.8
5.0
ns
100
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 87. EPF10K10A Device EAB Internal Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
3.3
3.9
5.2
ns
tEABDATA2
1.0
1.3
1.7
ns
tEABWE1
2.6
3.1
4.1
ns
tEABWE2
2.7
3.2
4.3
ns
tEABCLK
0.0
0.0
0.0
ns
tEABCO
1.2
1.4
1.8
ns
tEABBYPASS
0.1
0.2
0.2
ns
tEABSU
1.4
tEABH
0.1
1.7
0.1
4.5
tAA
2.2
ns
0.1
5.4
ns
7.3
ns
tWP
2.0
2.4
3.2
ns
tWDSU
0.7
0.8
1.1
ns
tWDH
0.5
0.6
0.7
ns
tWASU
0.6
0.7
0.9
ns
tWAH
0.9
1.1
1.5
ns
tWO
3.3
3.9
5.2
ns
tDD
3.3
3.9
5.2
ns
tEABOUT
0.1
0.1
0.2
ns
tEABCH
3.0
3.5
4.0
ns
tEABCL
3.03
3.5
4.0
ns
Altera Corporation
101
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 88. EPF10K10A Device EAB Internal Timing Macroparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tEABAA
Max
8.1
Max
9.8
Unit
Max
13.1
ns
tEABRCCOMB
8.1
9.8
13.1
ns
tEABRCREG
5.8
6.9
9.3
ns
tEABWP
2.0
2.4
3.2
ns
tEABWCCOMB
3.5
4.2
5.6
ns
tEABWCREG
9.4
11.2
14.8
ns
tEABDD
6.9
8.3
11.0
ns
tEABDATACO
1.3
1.5
2.0
ns
tEABDATASU
2.4
3.0
3.9
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
4.1
4.9
6.5
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
1.4
1.6
2.2
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
2.5
3.0
4.1
ns
tEABWAH
0.0
0.0
0.0
tEABWO
102
6.2
7.5
ns
9.9
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 89. EPF10K10A Device Interconnect Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
4.2
5.0
6.5
ns
tDIN2LE
2.2
2.6
3.4
ns
tDIN2DATA
4.3
5.2
7.1
ns
tDCLK2IOE
4.2
4.9
6.6
ns
tDCLK2LE
2.2
2.6
3.4
ns
tSAMELAB
0.1
0.1
0.2
ns
tSAMEROW
2.2
2.4
2.9
ns
tSAMECOLUMN
0.8
1.0
1.4
ns
tDIFFROW
3.0
3.4
4.3
ns
tTWOROWS
5.2
5.8
7.2
ns
tLEPERIPH
1.8
2.2
2.8
ns
tLABCARRY
0.5
0.5
0.7
ns
tLABCASC
0.9
1.0
1.5
ns
Table 90. EPF10K10A External Reference Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
tDRR
Max
10.0
tINSU (2), (3)
Note (1)
tINH (3)
0.0
tOUTCO (3)
2.0
16.0
2.1
0.0
5.8
ns
2.8
ns
0.0
2.0
6.9
ns
2.0
Table 91. EPF10K10A Device External Bidirectional Timing Parameters
Symbol
Max
12.0
1.6
Unit
9.2
ns
Note (1)
-2 Speed Grade
-3 Speed Grade
-4 Speed Grade
Min
Min
Min
tINSUBIDIR
2.4
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
Max
3.3
2.0
Max
4.5
0.0
5.8
ns
0.0
6.9
2.0
Unit
ns
9.2
ns
tXZBIDIR
6.3
7.5
9.9
ns
tZXBIDIR
6.3
7.5
9.9
ns
Altera Corporation
103
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 92 through 98 show EPF10K30A device internal and external
timing parameters.
Table 92. EPF10K30A Device LE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
0.8
1.1
1.5
ns
tCLUT
0.6
0.7
1.0
ns
tRLUT
1.2
1.5
2.0
ns
tPACKED
0.6
0.6
1.0
ns
tEN
1.3
1.5
2.0
ns
tCICO
0.2
0.3
0.4
ns
tCGEN
0.8
1.0
1.3
ns
tCGENR
0.6
0.8
1.0
ns
tCASC
0.9
1.1
1.4
ns
tC
1.1
1.3
1.7
ns
tCO
0.4
0.6
0.7
ns
tCOMB
0.6
0.7
0.9
ns
tSU
0.9
0.9
1.4
ns
tH
1.1
1.3
1.7
ns
tPRE
0.5
0.6
0.8
ns
tCLR
0.5
0.6
0.8
ns
tCH
3.0
3.5
4.0
ns
tCL
3.0
3.5
4.0
ns
Table 93. EPF10K30A Device IOE Timing Microparameters
Symbol
Note (1) (Part 1 of 2)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tIOD
2.2
2.6
3.4
ns
tIOC
0.3
0.3
0.5
ns
tIOCO
0.2
0.2
0.3
ns
tIOCOMB
0.5
0.6
0.8
ns
tIOSU
104
1.4
1.7
2.2
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 93. EPF10K30A Device IOE Timing Microparameters
Symbol
tIOH
Note (1) (Part 2 of 2)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
0.9
Max
1.1
Unit
Max
1.4
ns
tIOCLR
0.7
0.8
1.0
ns
tOD1
1.9
2.2
2.9
ns
tOD2
4.8
5.6
7.3
ns
tOD3
7.0
8.2
10.8
ns
tXZ
2.2
2.6
3.4
ns
tZX1
2.2
2.6
3.4
ns
tZX2
5.1
6.0
7.8
ns
tZX3
7.3
8.6
11.3
ns
tINREG
4.4
5.2
6.8
ns
tIOFD
3.8
4.5
5.9
ns
tINCOMB
3.8
4.5
5.9
ns
Altera Corporation
105
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 94. EPF10K30A Device EAB Internal Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
5.5
6.5
8.5
ns
tEABDATA2
1.1
1.3
1.8
ns
tEABWE1
2.4
2.8
3.7
ns
tEABWE2
2.1
2.5
3.2
ns
tEABCLK
0.0
0.0
0.2
ns
tEABCO
1.7
2.0
2.6
ns
tEABBYPASS
0.0
0.0
0.3
ns
tEABSU
1.2
tEABH
0.1
1.4
0.1
4.2
tAA
1.9
ns
0.3
5.0
ns
6.5
ns
tWP
3.8
4.5
5.9
ns
tWDSU
0.1
0.1
0.2
ns
tWDH
0.1
0.1
0.2
ns
tWASU
0.1
0.1
0.2
ns
tWAH
0.1
0.1
0.2
ns
tWO
3.7
4.4
6.4
ns
tDD
3.7
4.4
6.4
ns
tEABOUT
0.0
0.1
0.6
ns
tEABCH
3.0
3.5
4.0
ns
tEABCL
3.8
4.5
5.9
ns
106
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 95. EPF10K30A Device EAB Internal Timing Macroparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tEABAA
Max
9.7
Max
11.6
Unit
Max
16.2
ns
tEABRCCOMB
9.7
11.6
16.2
ns
tEABRCREG
5.9
7.1
9.7
ns
tEABWP
3.8
4.5
5.9
ns
tEABWCCOMB
4.0
4.7
6.3
ns
tEABWCREG
9.8
11.6
16.6
ns
tEABDD
9.2
11.0
16.1
ns
tEABDATACO
1.7
2.1
3.4
ns
tEABDATASU
2.3
2.7
3.5
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
3.3
3.9
4.9
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
3.2
3.8
5.0
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
3.7
4.4
5.1
ns
tEABWAH
0.0
0.0
0.0
tEABWO
Altera Corporation
6.1
7.3
ns
11.3
ns
107
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 96. EPF10K30A Device Interconnect Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
3.9
4.4
5.1
ns
tDIN2LE
1.2
1.5
1.9
ns
tDIN2DATA
3.2
3.6
4.5
ns
tDCLK2IOE
3.0
3.5
4.6
ns
tDCLK2LE
1.2
1.5
1.9
ns
tSAMELAB
0.1
0.1
0.2
ns
tSAMEROW
2.3
2.4
2.7
ns
tSAMECOLUMN
1.3
1.4
1.9
ns
tDIFFROW
3.6
3.8
4.6
ns
tTWOROWS
5.9
6.2
7.3
ns
tLEPERIPH
3.5
3.8
4.1
ns
tLABCARRY
0.3
0.4
0.5
ns
tLABCASC
0.9
1.1
1.4
ns
Table 97. EPF10K30A External Reference Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
tDRR
Max
11.0
tINSU (2), (3)
Note (1)
tINH (3)
0.0
tOUTCO (3)
2.0
17.0
3.1
0.0
5.4
ns
3.9
ns
0.0
2.0
6.2
ns
2.0
Table 98. EPF10K30A Device External Bidirectional Timing Parameters
Symbol
Max
13.0
2.5
Unit
8.3
ns
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tINSUBIDIR
4.2
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
Max
4.9
2.0
Max
6.8
0.0
5.4
ns
0.0
6.2
2.0
Unit
ns
8.3
ns
tXZBIDIR
6.2
7.5
9.8
ns
tZXBIDIR
6.2
7.5
9.8
ns
108
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 99 through 105 show EPF10K100A device internal and external
timing parameters.
Table 99. EPF10K100A Device LE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
1.0
1.2
1.4
ns
tCLUT
0.8
0.9
1.1
ns
tRLUT
1.4
1.6
1.9
ns
tPACKED
0.4
0.5
0.5
ns
tEN
0.6
0.7
0.8
ns
tCICO
0.2
0.2
0.3
ns
tCGEN
0.4
0.4
0.6
ns
tCGENR
0.6
0.7
0.8
ns
tCASC
0.7
0.9
1.0
ns
tC
0.9
1.0
1.2
ns
tCO
0.2
0.3
0.3
ns
tCOMB
0.6
0.7
0.8
ns
tSU
0.8
tH
0.3
1.0
0.5
0.3
tPRE
tCLR
1.2
0.5
0.3
0.3
ns
0.3
ns
0.4
ns
0.4
ns
tCH
2.5
3.5
4.0
ns
tCL
2.5
3.5
4.0
ns
Altera Corporation
109
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 100. EPF10K100A Device IOE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tIOD
2.5
2.9
3.4
ns
tIOC
0.3
0.3
0.4
ns
tIOCO
0.2
0.2
0.3
ns
0.7
ns
tIOCOMB
0.5
0.6
tIOSU
1.3
1.7
1.8
tIOH
0.2
0.2
0.3
ns
ns
tIOCLR
1.0
1.2
1.4
ns
tOD1
2.2
2.6
3.0
ns
tOD2
4.5
5.3
6.1
ns
tOD3
6.8
7.9
9.3
ns
tXZ
2.7
3.1
3.7
ns
tZX1
2.7
3.1
3.7
ns
tZX2
5.0
5.8
6.8
ns
tZX3
7.3
8.4
10.0
ns
tINREG
5.3
6.1
7.2
ns
tIOFD
4.7
5.5
6.4
ns
tINCOMB
4.7
5.5
6.4
ns
110
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 101. EPF10K100A Device EAB Internal Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
1.8
2.1
2.4
ns
tEABDATA2
3.2
3.7
4.4
ns
tEABWE1
0.8
0.9
1.1
ns
tEABWE2
2.3
2.7
3.1
ns
tEABCLK
0.8
0.9
1.1
ns
tEABCO
1.0
1.1
1.4
ns
tEABBYPASS
0.3
0.3
0.4
ns
tEABSU
1.3
tEABH
0.4
1.5
0.5
4.1
tAA
1.8
ns
0.5
4.8
ns
5.6
ns
tWP
3.2
3.7
4.4
ns
tWDSU
2.4
2.8
3.3
ns
tWDH
0.2
0.2
0.3
ns
tWASU
0.2
0.2
0.3
ns
tWAH
0.0
0.0
0.0
ns
tWO
3.4
3.9
4.6
ns
tDD
3.4
3.9
4.6
ns
tEABOUT
0.3
0.3
0.4
ns
tEABCH
2.5
3.5
4.0
ns
tEABCL
3.2
3.7
4.4
ns
Altera Corporation
111
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 102. EPF10K100A Device EAB Internal Timing Macroparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tEABAA
Max
6.8
Max
7.8
Unit
Max
9.2
ns
tEABRCCOMB
6.8
7.8
9.2
ns
tEABRCREG
5.4
6.2
7.4
ns
tEABWP
3.2
3.7
4.4
ns
tEABWCCOMB
3.4
3.9
4.7
ns
tEABWCREG
9.4
10.8
12.8
ns
tEABDD
6.1
6.9
8.2
ns
tEABDATACO
2.1
2.3
2.9
ns
tEABDATASU
3.7
4.3
5.1
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
2.8
3.3
3.8
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
3.4
4.0
4.6
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
1.9
2.3
2.6
ns
tEABWAH
0.0
0.0
0.0
tEABWO
112
5.1
5.7
ns
6.9
ns
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 103. EPF10K100A Device Interconnect Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
4.8
5.4
6.0
ns
tDIN2LE
2.0
2.4
2.7
ns
tDIN2DATA
2.4
2.7
2.9
ns
tDCLK2IOE
2.6
3.0
3.5
ns
tDCLK2LE
2.0
2.4
2.7
ns
tSAMELAB
0.1
0.1
0.1
ns
tSAMEROW
1.5
1.7
1.9
ns
tSAMECOLUMN
5.5
6.5
7.4
ns
tDIFFROW
7.0
8.2
9.3
ns
tTWOROWS
8.5
9.9
11.2
ns
tLEPERIPH
3.9
4.2
4.5
ns
tLABCARRY
0.2
0.2
0.3
ns
tLABCASC
0.4
0.5
0.6
ns
Table 104. EPF10K100A Device External Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
tDRR
Max
12.5
tINSU (2), (3)
Note (1)
tINH (3)
0.0
tOUTCO (3)
2.0
17.0
4.5
0.0
5.3
ns
5.1
ns
0.0
2.0
6.1
ns
2.0
Table 105. EPF10K100A Device External Bidirectional Timing Parameters
Symbol
Max
14.5
3.7
Unit
7.2
ns
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tINSUBIDIR
4.9
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
Max
5.8
2.0
Max
6.8
0.0
5.3
ns
0.0
6.1
2.0
Unit
ns
7.2
ns
tXZBIDIR
7.4
8.6
10.1
ns
tZXBIDIR
7.4
8.6
10.1
ns
Altera Corporation
113
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 38 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
Tables 106 through 112 show EPF10K250A device internal and external
timing parameters.
Table 106. EPF10K250A Device LE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tLUT
0.9
1.0
1.4
ns
tCLUT
1.2
1.3
1.6
ns
tRLUT
2.0
2.3
2.7
ns
tPACKED
0.4
0.4
0.5
ns
tEN
1.4
1.6
1.9
ns
tCICO
0.2
0.3
0.3
ns
tCGEN
0.4
0.6
0.6
ns
tCGENR
0.8
1.0
1.1
ns
tCASC
0.7
0.8
1.0
ns
tC
1.2
1.3
1.6
ns
tCO
0.6
0.7
0.9
ns
tCOMB
0.5
0.6
0.7
ns
tSU
1.2
tH
1.2
1.4
1.3
0.7
tPRE
tCLR
1.7
1.6
0.8
0.7
ns
0.8
ns
0.9
ns
0.9
ns
tCH
2.5
3.0
3.5
ns
tCL
2.5
3.0
3.5
ns
114
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 107. EPF10K250A Device IOE Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tIOD
1.2
1.3
1.6
ns
tIOC
0.4
0.4
0.5
ns
tIOCO
0.8
0.9
1.1
ns
0.8
ns
tIOCOMB
0.7
0.7
tIOSU
2.7
3.1
3.6
tIOH
0.2
0.3
0.3
ns
ns
tIOCLR
1.2
1.3
1.6
ns
tOD1
3.2
3.6
4.2
ns
tOD2
5.9
6.7
7.8
ns
tOD3
8.7
9.8
11.5
ns
tXZ
3.8
4.3
5.0
ns
tZX1
3.8
4.3
5.0
ns
tZX2
6.5
7.4
8.6
ns
tZX3
9.3
10.5
12.3
ns
tINREG
8.2
9.3
10.9
ns
tIOFD
9.0
10.2
12.0
ns
tINCOMB
9.0
10.2
12.0
ns
Altera Corporation
115
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 108. EPF10K250A Device EAB Internal Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tEABDATA1
1.3
1.5
1.7
ns
tEABDATA2
1.3
1.5
1.7
ns
tEABWE1
0.9
1.1
1.3
ns
tEABWE2
5.0
5.7
6.7
ns
tEABCLK
0.6
0.7
0.8
ns
tEABCO
0.0
0.0
0.0
ns
tEABBYPASS
0.1
0.1
0.2
ns
tEABSU
3.8
tEABH
0.7
4.3
0.8
4.5
tAA
5.0
ns
0.9
5.0
ns
5.9
ns
tWP
5.6
6.4
7.5
ns
tWDSU
1.3
1.4
1.7
ns
tWDH
0.1
0.1
0.2
ns
tWASU
0.1
0.1
0.2
ns
tWAH
0.1
0.1
0.2
ns
tWO
4.1
4.6
5.5
ns
tDD
4.1
4.6
5.5
ns
tEABOUT
0.1
0.1
0.2
ns
tEABCH
2.5
3.0
3.5
ns
tEABCL
5.6
6.4
7.5
ns
116
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 109. EPF10K250A Device EAB Internal Timing Macroparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
tEABAA
Max
6.1
Max
6.8
Unit
Max
8.2
ns
tEABRCCOMB
6.1
6.8
8.2
ns
tEABRCREG
4.6
5.1
6.1
ns
tEABWP
5.6
6.4
7.5
ns
tEABWCCOMB
5.8
6.6
7.9
ns
tEABWCREG
15.8
17.8
21.0
ns
tEABDD
5.7
6.4
7.8
ns
tEABDATACO
0.7
0.8
1.0
ns
tEABDATASU
4.5
5.1
5.9
ns
tEABDATAH
0.0
0.0
0.0
ns
tEABWESU
8.2
9.3
10.9
ns
tEABWEH
0.0
0.0
0.0
ns
tEABWDSU
1.7
1.8
2.1
ns
tEABWDH
0.0
0.0
0.0
ns
tEABWASU
0.9
0.9
1.0
ns
tEABWAH
0.0
0.0
0.0
tEABWO
Altera Corporation
5.3
6.0
ns
7.4
ns
117
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 110. EPF10K250A Device Interconnect Timing Microparameters
Symbol
Note (1)
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
Max
Unit
Max
tDIN2IOE
7.8
8.5
9.4
ns
tDIN2LE
2.7
3.1
3.5
ns
tDIN2DATA
1.6
1.6
1.7
ns
tDCLK2IOE
3.6
4.0
4.6
ns
tDCLK2LE
2.7
3.1
3.5
ns
tSAMELAB
0.2
0.3
0.3
ns
tSAMEROW
6.7
7.3
8.2
ns
tSAMECOLUMN
2.5
2.7
3.0
ns
ns
tDIFFROW
9.2
10.0
11.2
tTWOROWS
15.9
17.3
19.4
ns
tLEPERIPH
7.5
8.1
8.9
ns
tLABCARRY
0.3
0.4
0.5
ns
tLABCASC
0.4
0.4
0.5
ns
Table 111. EPF10K250A Device External Reference Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Min
Min
Min
Max
tDRR
Max
15.0
tINSU (2), (3)
Note (1)
tINH (3)
0.0
tOUTCO (3)
2.0
20.0
8.0
0.0
8.0
Min
tINSUBIDIR
9.3
tINHBIDIR
0.0
tOUTCOBIDIR
2.0
Max
8.9
-2 Speed Grade
Min
Max
10.4
ns
Note (1)
-3 Speed Grade
Min
ns
0.0
8.9
2.0
Unit
Max
12.7
0.0
2.0
ns
2.0
10.6
8.0
ns
0.0
2.0
-1 Speed Grade
ns
9.4
Table 112. EPF10K250A Device External Bidirectional Timing Parameters
Symbol
Max
17.0
6.9
Unit
ns
10.4
ns
tXZBIDIR
10.8
12.2
14.2
ns
tZXBIDIR
10.8
12.2
14.2
ns
118
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
(2)
(3)
All timing parameters are described in Tables 32 through 37 in this data sheet.
Using an LE to register the signal may provide a lower setup time.
This parameter is specified by characterization.
ClockLock &
ClockBoost
Timing
Parameters
For the ClockLock and ClockBoost circuitry to function properly, the
incoming clock must meet certain requirements. If these specifications are
not met, the circuitry may not lock onto the incoming clock, which
generates an erroneous clock within the device. The clock generated by
the ClockLock and ClockBoost circuitry must also meet certain
specifications. If the incoming clock meets these requirements during
configuration, the ClockLock and ClockBoost circuitry will lock onto the
clock during configuration. The circuit will be ready for use immediately
after configuration. Figure 31 illustrates the incoming and generated clock
specifications.
Figure 31. Specifications for the Incoming & Generated Clocks
The tI parameter refers to the nominal input clock period; the tO parameter refers to the
nominal output clock period.
tCLK1
tINDUTY
tI ± fCLKDEV
Input
Clock
tR
tF
tI
tI ± tINCLKSTB
tO
tO + tJITTER
tOUTDUTY
ClockLockGenerated
Clock
tO – tJITTER
Table 113 summarizes the ClockLock and ClockBoost parameters.
Table 113. ClockLock & ClockBoost Parameters
Symbol
(Part 1 of 2)
Max
Unit
tR
Input rise time
Parameter
Min
Typ
2
ns
tF
Input fall time
2
ns
t INDUTY
Input duty cycle
45
55
%
f CLK1
Input clock frequency (ClockBoost clock multiplication factor equals 1)
30
80
MHz
t CLK1
Input clock period (ClockBoost clock multiplication factor equals 1)
12.5
33.3
ns
fCLK2
Input clock frequency (ClockBoost clock multiplication factor equals 2)
16
50
MHz
tCLK2
Input clock period (ClockBoost clock multiplication factor equals 2)
20
62.5
ns
Altera Corporation
119
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Table 113. ClockLock & ClockBoost Parameters
Symbol
(Part 2 of 2)
Parameter
Min
Typ
Max
Unit
f CLKDEV1
Input deviation from user specification in MAX+PLUS II (ClockBoost clock
multiplication factor equals 1) (1)
±1
MHz
f CLKDEV2
Input deviation from user specification in MAX+PLUS II (ClockBoost clock
multiplication factor equals 2) (1)
±0.5
MHz
t INCLKSTB Input clock stability (measured between adjacent clocks)
t LOCK
Time required for ClockLock or ClockBoost to acquire lock (2)
t JITTER
Jitter on ClockLock or ClockBoost-generated clock (3)
tOUTDUTY Duty cycle for ClockLock or ClockBoost-generated clock
40
50
100
ps
10
µs
1
ns
60
%
Notes:
(1)
(2)
(3)
To implement the ClockLock and ClockBoost circuitry with the MAX+PLUS II software, designers must specify the
input frequency. The MAX+PLUS II software tunes the PLL in the ClockLock and ClockBoost circuitry to this
frequency. The f CLKDEV parameter specifies how much the incoming clock can differ from the specified frequency
during device operation. Simulation does not reflect this parameter.
During device configuration, the ClockLock and ClockBoost circuitry is configured before the rest of the device. If
the incoming clock is supplied during configuration, the ClockLock and ClockBoost circuitry locks during
configuration, because the tLOCK value is less than the time required for configuration.
The tJITTER specification is measured under long-term observation.
Power
Consumption
The supply power (P) for FLEX 10K devices can be calculated with the
following equation:
P = PINT + PIO = (I CCSTANDBY + ICCACTIVE) × VCC + PIO
Typical I CCSTANDBY values are shown as I CC0 in the FLEX 10K device DC
operating conditions tables on pages 46, 49, and 52 of this data sheet. The
ICCACTIVE value depends on the switching frequency and the application
logic. This value is calculated based on the amount of current that each LE
typically consumes. The PIO value, which depends on the device output
load characteristics and switching frequency, can be calculated using the
guidelines given in Application Note 74 (Evaluating Power for Altera Devices).
1
Compared to the rest of the device, the embedded array
consumes a negligible amount of power. Therefore, the
embedded array can be ignored when calculating supply
current.
The ICCACTIVE value is calculated with the following equation:
µA
ICCACTIVE = K × fMAX × N × togLC × --------------------------MHz × LE
The parameters in this equation are shown below:
120
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
fMAX
N
togLC
=
=
=
K
=
Maximum operating frequency in MHz
Total number of logic cells used in the device
Average percent of logic cells toggling at each clock
(typically 12.5%)
Constant, shown in Tables 114 and 115
Table 114. FLEX 10K K Constant Values
Device
K Value
EPF10K10
82
EPF10K20
89
EPF10K30
88
EPF10K40
92
EPF10K50
95
EPF10K70
85
EPF10K100
88
Table 115. FLEX 10KA K Constant Values
Device
K Value
EPF10K10A
17
EPF10K30A
17
EPF10K50V
19
EPF10K100A
19
EPF10K130V
22
EPF10K250A
23
This calculation provides an ICC estimate based on typical conditions with
no output load. The actual ICC should be verified during operation
because this measurement is sensitive to the actual pattern in the device
and the environmental operating conditions.
To better reflect actual designs, the power model (and the constant K in
the power calculation equations) for continuous interconnect FLEX
devices assumes that logic cells drive FastTrack Interconnect channels. In
contrast, the power model of segmented FPGAs assumes that all logic
cells drive only one short interconnect segment. This assumption may
lead to inaccurate results, compared to measured power consumption for
an actual design in a segmented interconnect FPGA.
Figure 32 shows the relationship between the current and operating
frequency of FLEX 10K devices.
Altera Corporation
121
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 32. ICCACTIVE vs. Operating Frequency (Part 1 of 3)
EPF10K10
ICC Supply
Current (mA)
EPF10K20
500
1,000
450
900
400
800
350
700
300
ICC Supply
Current (mA)
250
600
500
200
400
150
300
100
200
50
100
0
30
15
45
0
60
15
30
45
60
45
60
45
60
Frequency (MHz)
Frequency (MHz)
EPF10K30
EPF10K40
1,600
2,500
1,400
2,000
1,200
ICC Supply
Current (mA)
1,000
ICC Supply
Current (mA)
800
600
1,500
1,000
400
200
500
0
15
30
45
0
60
15
Frequency (MHz)
30
Frequency (MHz)
EPF10K70
EPF10K50
3,000
3,500
3,000
2,500
2,500
2,000
ICC Supply
Current (mA)
ICC Supply
Current (mA)
1,500
2,000
1,500
1,000
1,000
500
500
0
15
30
Frequency (MHz)
122
45
60
0
15
30
Frequency (MHz)
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 32. ICCACTIVE vs. Operating Frequency (Part 2 of 3)
EPF10K50V
EPF10K100
700
4,500
600
4,000
3,500
500
3,000
ICC Supply
Current (mA)
ICC Supply
Current (mA)
2,500
400
2,000
300
1,500
200
1,000
100
500
0
0
45
30
15
60
20
EPF10K130V
40
60
80
100
Frequency (MHz)
Frequency (MHz)
EPF10K10A
150
2,000
1,500
ICC Supply
Current (mA)
100
ICC Supply
Current (mA)
1,000
50
500
0
20
40
60
80
100
0
Frequency (MHz)
75
50
25
100
Frequency (MHz)
EPF10K30A
EPF10K100A
1,200
400
900
300
ICC Supply
Current (mA)
ICC Supply
Current (mA)
200
600
300
100
0
0
25
50
75
Frequency (MHz)
Altera Corporation
100
20
40
60
80
100
Frequency (MHz)
123
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 32. ICCACTIVE vs. Operating Frequency (Part 3 of 3)
EPF10K250A
3,500
3,000
2,500
ICC Supply
Current (mA)
2,000
1,500
1,000
500
0
20
40
60
80
100
Frequency (MHz)
Configuration &
Operation
The FLEX 10K architecture supports several configuration schemes. This
section summarizes the device operating modes and available device
configuration schemes.
f
See Application Note 116 (Configuring APEX 20K, FLEX 10K & FLEX 6000
Devices) for detailed descriptions of device configuration options, device
configuration pins, and for information on configuring FLEX 10K devices,
including sample schematics, timing diagrams, and configuration
parameters.
Operating Modes
The FLEX 10K architecture uses SRAM configuration elements that
require configuration data to be loaded every time the circuit powers up.
The process of physically loading the SRAM data into the device is called
configuration. Before configuration, as VCC rises, the device initiates a
Power-On Reset (POR). This POR event clears the device and prepares it
for configuration. The FLEX 10K POR time does not exceed 50 µs.
During initialization, which occurs immediately after configuration, the
device resets registers, enables I/O pins, and begins to operate as a logic
device. The I/O pins are tri-stated during power-up, and before and
during configuration. Together, the configuration and initialization
processes are called command mode; normal device operation is called user
mode.
124
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
SRAM configuration elements allow FLEX 10K devices to be reconfigured
in-circuit by loading new configuration data into the device. Real-time
reconfiguration is performed by forcing the device into command mode
with a device pin, loading different configuration data, reinitializing the
device, and resuming user-mode operation.
The entire reconfiguration process may be completed in less than 320 ms
using an EPF10K250A device with a DCLK frequency of 10 MHz. This
process can be used to reconfigure an entire system dynamically. In-field
upgrades can be performed by distributing new configuration files.
1
Refer to the configuration device data sheet to obtain the POR
delay when using a configuration device method.
Programming Files
Despite being function- and pin-compatible, FLEX 10KA and FLEX 10KE
devices are not programming- or configuration-file compatible with
FLEX 10K devices. A design should be recompiled before it is transferred
from a FLEX 10K device to an equivalent FLEX 10KA or FLEX 10KE
device. This recompilation should be performed to create a new
programming or configuration file and to check design timing on the
faster FLEX 10KA or FLEX 10KE device. The programming or
configuration files for EPF10K50 devices can program or configure an
EPF10K50V device. However, Altera recommends recompiling a design
for the EPF10K50V device when transferring it from the EPF10K50 device.
Configuration Schemes
The configuration data for a FLEX 10K device can be loaded with one of
five configuration schemes (see Table 116), chosen on the basis of the
target application. An EPC1, EPC2, EPC16, or EPC1441 configuration
device, intelligent controller, or the JTAG port can be used to control the
configuration of a FLEX 10K device, allowing automatic configuration on
system power-up.
Altera Corporation
125
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Multiple FLEX 10K devices can be configured in any of the five
configuration schemes by connecting the configuration enable (nCE) and
configuration enable output (nCEO) pins on each device.
Table 116. Data Sources for Configuration
Configuration Scheme
Data Source
Configuration device
EPC1, EPC2, EPC16, or EPC1441 configuration device
Passive serial (PS)
BitBlaster, MasterBlaster, or ByteBlasterMV download cable, or
serial data source
Passive parallel asynchronous (PPA)
Parallel data source
Passive parallel synchronous (PPS)
Parallel data source
JTAG
BitBlaster, MasterBlaster, or ByteBlasterMV download cable, or
microprocessor with Jam STAPL file or Jam Byte-Code file
Device PinOuts
See the Altera web site (http://www.altera.com) or the Altera Digital
Library for pin-out information.
Revision
History
The information contained in the FLEX 10K Embedded Programmable Logic
Device Family Data Sheet version 4.2 supersedes information published in
previous versions.
Version 4.2 Changes
The following change was made to version 4.2 of the FLEX 10K Embedded
Programmable Logic Device Family Data Sheet: updated Figure 13.
Version 4.1 Changes
The following changes were made to version 4.1 of the FLEX 10K
Embedded Programmable Logic Device Family Data Sheet.
■
■
■
■
■
■
■
■
126
Updated General Description section
Updated I/O Element section
Updated SameFrame Pin-Outs section
Updated Figure 16
Updated Tables 13 and 116
Added Note 9 to Table 19
Added Note 10 to Table 24
Added Note 10 to Table 28
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes:
Altera Corporation
127
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
®
101 Innovation Drive
San Jose, CA 95134
(408) 544-7000
http://www.altera.com
Applications Hotline:
(800) 800-EPLD
Customer Marketing:
(408) 544-7104
Literature Services:
[email protected]
128
Copyright © 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the
stylized Altera logo, specific device designations, and all other words and logos that are identified as
trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera
Corporation in the U.S. and other countries. All other product or service names are the property of their
respective holders. Altera products are protected under numerous U.S. and foreign patents and pending
applications, maskwork rights, and copyrights. Altera warrants performance of its semiconductor products to
current specifications in accordance with Altera's standard warranty, but reserves the right to
make changes to any products and services at any time without notice. Altera assumes no
responsibility or liability arising out of the application or use of any information, product, or
service described herein except as expressly agreed to in writing by Altera Corporation.
Altera customers are advised to obtain the latest version of device specifications before
relying on any published information and before placing orders for products or services.
Altera Corporation