Data Sheet, V2.1, April 2009 BGF128 HDMI Interface ESD Protection RF & Protection Devices Edition 2009-04-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF128 HDMI Interface ESD Protection BGF128 Revision History: 2009-04-01, V2.1 Previous Version: 2009-03-02, V2.0 Page Subjects (major changes since last revision) 4 Marking updated 6 Figure 3 added Data Sheet 3 V2.1, 2009-04-01 BGF128 HDMI Interface ESD Protection BGF128 BGF128 Features • ESD protection circuit for control data lines of an HDMI interface • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs • Wafer level package with SnAgCu solder balls • 400 µm solder ball pitch • RoHS and WEEE compliant package WLP-8-9-N-3D Description BGF128 is an ESD protection circuit for control data lines of an HDMI interface. All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.15 mm and a total height of 0.6 mm. A2 A1 A3 R1, 1750 Ω B3 R2, 1750 Ω C1 C3 R3, 100 kΩ B2 (GND) C2 (GND) BGF 128_schematic .vsd Figure 1 Schematic Type Package Marking Chip BGF128 WLP-8-9 28 N0747 Table 1 Maximum Ratings Parameter Symbol Values Min. Voltage at all pins to GND Operating temperature range Storage temperature range Summed up input power for all pins VP TOP TSTG Pin Typ. Unit Note / Test Condition Max. 0 – 5 V – -40 – +85 °C – -65 – +150 °C – – – 60 mW TS < 70 °C -2 – 2 kV – -15 – 15 kV – Electrostatic Discharge According to IEC61000-4-2 Contact discharge at internal pin C1 to any other pin VESD Contact discharge at external pins A1, A2, A3, VESD B3, C3 to GND Data Sheet 4 V2.1, 2009-04-01 BGF128 HDMI Interface ESD Protection BGF128 Electrical Characteristics1) Table 2 Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. 1575 1750 1925 Ω – 80 100 120 kΩ – Leakage current of ESD protection diodes R1,2 R3 IR – – 1 2 100 200 nA nA Breakdown voltage of ESD diodes2) V(BR) – 18.5 -12.5 – V V=3V V=5V I(BR) = 1 mA I(BR) = -1 mA Line capacitance A1, A2, A3, B3, C33) 1) at TA = 25 °C CT 8 10 12 pF Resistors R1, R2 Resistor R3 V=0V 2) after snap-back 3) Capacitance measured from designated pin to GND. Pin C1 connected to GND. Package Outlines Solder balls face up 0.6 ±0.05 B 0.4 C (0.175 ±0.05) C1 0.4 2 x 0.4 = 0.8 (0.175 ±0.05) A1 C2 C3 B2 B3 A2 A3 2 x 0.4 = 0.8 8x 0.08 C 8x COPLANARITY ø0.05 M A B 0.25 ±0.04 1) A 1.15 ±0.05 0.1 C (0.175 ±0.05) Pin 1 Corner Index Area 2) SEATING PLANE 3) 0.2 ±0.05 STANDOFF 1.15 ±0.05 (0.175 ±0.05) Solder balls face down 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-8-9-N-PO V01 Figure 2 Data Sheet Package WLP-8-9 5 V2.1, 2009-04-01 BGF128 HDMI Interface ESD Protection BGF128 Footprint 0.8 0.8 0.4 0.4 0.25 WLP-8-9-N-FP V01 Figure 3 Recommended PCB pad design for reflow soldering Tape 0.25 Pin 1 Corner Index Area Figure 4 1.33 8 1.33 4 0.75 WLP-8-9-N-TP V01 Tape for WLP-8-9 You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 6 V2.1, 2009-04-01