CPC1927 250V Single-Pole, Normally Open Power Relay INTEGRATED CIRCUITS DIVISION Characteristics Parameter Blocking Voltage Description Rating Units 250 VP IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. Load Current, TA=25°C: With 5°C/W Heat Sink 6.7 No Heat Sink 2.7 Arms / ADC On-Resistance (max) 0.2 Thermal Resistance, Junction-to-Case, JC 0.3 °C/W Features • • • • • • • • • • 6.7Arms Load Current with 5°C/W Heat Sink Low 0.2 On-Resistance 250VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Resistance: JC = 0.3 °C/W Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Applications • • • • Industrial Controls / Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense As part of this family, the CPC1927 single-pole normally open (1-Form-A) Solid State Power Relay is rated for up to 6.7Arms continuous load current with a 5°C/W heat sink. The CPC1927 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal resistance (0.3 °C/W). Ordering Information Part Description CPC1927J ISOPLUS-264 Package (25 per tube) Switching Characteristics Approvals Form-A • UL 508 Certified Component: File E69938 Pin Configuration IF 90% 10% ILOAD ton toff e3 DS-CPC1927-R06 www.ixysic.com 1 CPC1927 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Blocking Voltage Ratings Units 250 VP Reverse Input Voltage 5 V Input Control Current 100 mA 1 A 150 mW Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 Electrical Characteristics @ 25°C Parameter Conditions Symbol Minimum Typical Maximum Units 25 AP Output Characteristics Load Current 1 Peak Continuous Continuous Continuous 2 On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output t10ms No Heat Sink TC=25°C IL TC=99°C IL(99) IF=10mA, IL=1A RON - 0.15 0.2 VL=250VP ILEAK - - 1 A ton - 12 25 toff - 0.22 10 VL=25V, f=1MHz Cout - 1100 - pF IL=1A IF - - 10 mA IF=5mA IF 0.6 - - mA VF 0.9 1.2 1.4 V VR=5V IR - - 10 A - CI/O - 1 - pF IF=20mA, VL=10V - - 2.7 15 Arms / ADC 3.25 ms 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended. C 2 R06 www.ixysic.com 2 CPC1927 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.3 °C/W Free Air JA 33 °C/W - TJ -40 to +100 °C Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating θCA = (TJ - TA) IL(99)2 IL2 • PD(99) - θJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) θJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 3 www.ixysic.com R06 CPC1927 INTEGRATED CIRCUITS DIVISION 3 Performance Data @ 25°C (Unless Otherwise Noted) Typical Turn-On Time (N=50, IF=20mA, IL=1ADC) 35 30 30 25 20 15 10 Typical Turn-Off Time (N=50, IF=20mA, IL=1ADC) 25 Device Count (N) 35 Device Count (N) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=10mA, IL=1ADC) 25 20 15 10 5 5 0 0 1.30 1.31 1.32 1.33 9.5 1.34 10.5 11.5 12.5 35 30 30 Device Count (N) 35 25 20 5 0 14.5 0.19 0.20 0.21 0.22 0.23 0.24 Turn-Off (ms) 15 10 25 20 15 10 5 5 0 0 0.138 0.142 0.146 0.150 0.154 274 0.158 276 278 Typical Turn-On Time vs. LED Forward Current (IL=1ADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 60 1.6 50 282 280 284 286 Blocking Voltage (VP) On-Resistance (Ω) Typical Turn-Off Time vs. LED Forward Current (IL=1ADC) 0.45 0.40 1.4 IF=50mA IF=20mA IF=10mA 1.2 0.35 Turn-Off (ms) Turn-On (ms) 40 30 20 0.30 0.25 0.20 0.15 0.10 1.0 10 0.8 0.05 0.00 0 -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 LED Forward Current (mA) 10 15 20 25 30 35 40 LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=1ADC) Typical Turn-On Time vs. Temperature (IL=1ADC) Typical Turn-Off Time vs. Temperature (IL=1ADC) 0 20 40 60 80 100 0 120 35 5 10 15 20 25 30 35 40 45 50 0.45 Turn-On (ms) IF=10mA 25 20 IF=20mA 15 10 0 20 40 60 Temperature (ºC) 80 100 0 -40 IF=20mA 0.35 0.30 IF=10mA 0.25 0.20 0.15 5 -20 45 0.40 30 -40 5 50 Temperature (ºC) -20 Turn-Off (ms) LED Forward Voltage Drop (V) 10 Typical Blocking Voltage Distribution Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC) LED Current (mA) 15 Turn-On (ms) LED Forward Current (V) Device Count (N) 13.5 20 -20 0 20 40 60 80 100 0.10 -40 Temperature (ºC) -20 0 20 40 60 Temperature (ºC) 80 100 Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R06 www.ixysic.com 4 CPC1927 INTEGRATED CIRCUITS DIVISION Typical Load Current vs. Load Voltage (IF=10mA) Typical On-Resistance vs. Temperature (IF=10mA, IL=1ADC) 0.35 Load Current (A) 0.30 0.25 0.20 0.15 0.10 0.05 14 Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 1&2 (VL=250VP) 20 40 60 80 100 0.14 290 0.12 285 0.10 280 275 270 265 -0.34 0.34 -20 0 20 40 60 Temperature (ºC) 80 100 5ºC/W 8 6 10ºC/W 4 Free Air 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve Free Air, No Heat Sink 30 25 0.08 0.06 0.04 0 -40 10 0 0.51 20 15 10 5 0.02 260 1ºC/W 12 2 Temperature (ºC) 0 295 255 -40 16 0 -0.17 0.17 Load Voltage (V) -20 Leakage (μA) Blocking Voltage (VP) 0 -40 2.5 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 -0.51 Load Current (AP) On-Resistance (Ω) 0.40 Load Current (Arms) 0.45 Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) 0 -20 0 20 40 60 80 100 10µs 100µs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R06 CPC1927 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1927J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1927J 245°C for 30 seconds NOTE: The exposed surface of the DCB substrate is not to be soldered. 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3 R06 www.ixysic.com 6 CPC1927 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 1.930 ± 0.381 (0.076 ± 0.015) 26.162 ± 0.254 (1.030 ± 0.010) 17.221 ± 0.254 (0.678 ± 0.010) 20.600 ± 0.254 (0.811 ± 0.010) DCB Substrate NOTE: Not to be soldered 2.362 ± 0.381 (0.093 ± 0.015) 20.396 ± 0.508 (0.803 ± 0.020) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 15.240 ± 0.508 (0.600 ± 0.020) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Metallized external surface of DCB substrate maintains 2500Vrms isolation to device internal structure and all external pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1927-R06 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/9/2015 7 www.ixysic.com R06