AD AD6676 Wideband if receiver subsystem Datasheet

Wideband IF Receiver Subsystem
AD6676
Data Sheet
FEATURES
APPLICATIONS
High instantaneous dynamic range
Noise figure (NF) as low as 13 dB
Noise spectral density (NSD) as low as −159 dBFS/Hz
IIP3 up to 36.9 dBm with spurious tones <−99 dBFS
Tunable band-pass Σ-Δ analog-to-digital converter (ADC)
20 MHz to 160 MHz signal bandwidth
70 MHz to 450 MHz IF center frequency
Configurable input full-scale level of −2 dBm to −14 dBm
Easy to drive resistive IF input
Gain flatness of 1 dB with under 0.5 dB out-of-band peaking
Alias rejection greater than 50 dB
2.0 GSPS to 3.2 GSPS ADC clock rate
On-chip PLL clock multiplier
16-bit I/Q rate up to 266 MSPS
On-chip digital signal processing
NCO and quadrature digital downconverter (QDDC)
Selectable decimation factor of 12, 16, 24, and 32
Automatic gain control (AGC) support
On-chip attenuator with 27 dB span in 1 dB steps
Fast attenuator control via configurable AGC data port
Peak detection flags with programmable thresholds
Single or dual lane, JESD204B capable
Low power consumption: 1.20 W
1.1 V and 2.5 V supply voltage
TDD power saving up to 60%
4.3 mm × 5.0 mm WLCSP
Wideband cellular infrastructure equipment and repeaters
Point-to-point microwave equipment
Instrumentation
Spectrum and communication analyzers
Software defined radio
GENERAL DESCRIPTION
The AD66761 is a highly integrated IF subsystem that can
digitize radio frequency (RF) bands up to 160 MHz in width
centered on an intermediate frequency (IF) of 70 MHz to
450 MHz. Unlike traditional Nyquist IF sampling ADCs, the
AD6676 relies on a tunable band-pass Σ-Δ ADC with a high
oversampling ratio to eliminate the need for band specific IF
SAW filters and gain stages, resulting in significant simplification of
the wideband radio receiver architecture. On-chip quadrature
digital downconversion followed by selectable decimation filters
reduces the complex data rate to a manageable rate between
62.5 MSPS to 266.7 MSPS. The 16-bit complex output data is
transferred to the host via a single or dual lane JESD204B interface
supporting line rates of up to 5.333 Gbps.
FUNCTIONAL BLOCK DIAGRAM
VSS2IN VSS2OUT VDD2NV
AGC4, AGC3
AGC2, AGC1
VDDIO RESETB
–2.0V
REG
VIN+
BAND-PASS
Σ-∆ ADC
VIN–
SCLK
SDIO
SDO
VDDHSI
QDDC +
NCO
I
I
Mx
Q
L+
L–
CLOCK
SYNTHESIZER
SPI
CLOCK
GENERATION
M = 12,
16, 24,
32
Q
JESD204B
SERIALIZER
Tx OUTPUTS
27dB ATTENUATOR
(1dB STEPS)
CSB
AGC
SUPPORT
JESD204B
SUBCLASS 1
CONTROL
SERDOUT0+
SERDOUT0–
SERDOUT1+
SERDOUT1–
SYNCINB±
SYSREF±
VDDQ VDDC
CLK+ CLK–
VDD2 VDDL VDD1 VSSA
VDDD VSSD
12348-001
AD6676
Figure 1.
1
This product is protected by U.S. and international patents.
Rev. D
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AD6676
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Attenuator.................................................................................... 33
Applications ....................................................................................... 1
Clock Synthesizer ....................................................................... 35
General Description ......................................................................... 1
Digital Processing Blocks .............................................................. 38
Functional Block Diagram .............................................................. 1
Digital Signal Processing Path .................................................. 39
Revision History ............................................................................... 3
AGC Features and Peak Detection........................................... 42
Product Highlights ........................................................................... 4
GPIO Functionality .................................................................... 44
Specifications..................................................................................... 5
Power Saving Modes .................................................................. 44
Digital High Speed SERDES Specifications .............................. 7
Introduction to the JESD204B Interface ................................. 45
CLK± to SYSREF± Timing Diagram ......................................... 8
Functional Overview ................................................................. 47
Digital CMOS Input/Output Specifications ............................. 8
JESD204B Link Establishment ................................................. 47
Absolute Maximum Ratings............................................................ 9
Physical Layer Input/Outputs ................................................... 49
Thermal Resistance ...................................................................... 9
Configuring the JESD204B Link .............................................. 50
ESD Caution .................................................................................. 9
Synchronization Using SYSREF± ............................................. 51
Pin Configuration and Function Descriptions ........................... 10
Applications Information .............................................................. 53
Typical Performance Characteristics ........................................... 12
Analog Input Considerations ................................................... 53
Nominal Performance for IF = 115 MHz (Direct Sampling
VHF Receiver) ............................................................................ 12
Clock Input Considerations ...................................................... 54
Nominal Performance for IF = 140 MHz (μW Point-to-Point
Receivers)..................................................................................... 14
PCB Design Guidelines ............................................................. 57
Nominal Performance for IF = 181 MHz (Wireless
Infrastructure Receiver)............................................................. 15
AD6676 Start-Up Initialization ................................................ 61
IF Frequency Planning .............................................................. 56
Powering the AD6676................................................................ 59
Nominal Performance for IF = 250 MHz AND BW = 75 MHz
....................................................................................................... 17
Serial Port Interface (SPI) .............................................................. 64
Nominal Performance for IF = 350 MHz AND BW =
160 MHz ...................................................................................... 19
SPI Operation ............................................................................. 64
Register Memory Map and Details .............................................. 66
Equivalent Circuits ......................................................................... 21
Register Memory Map ............................................................... 66
Terminology .................................................................................... 22
Register Details ........................................................................... 68
Theory of Operation ...................................................................... 23
Outline Dimensions ....................................................................... 90
Overview...................................................................................... 23
Ordering Guide .......................................................................... 90
SPI Register Map Description .................................................. 64
Band-Pass Σ-Δ ADC Architecture ........................................... 24
Σ-Δ ADC Configuration Considerations................................ 28
Rev. D | Page 2 of 90
Data Sheet
AD6676
REVISION HISTORY
5/2017—Rev. C to Rev. D
Change to Differential Output Voltage Parameter, Table 2 ......... 7
Changes to Figure 147 ....................................................................65
3/2017—Rev. B to Rev. C
Added Endnote 1, Table 12 ............................................................36
Changes to Synchronization Using SYSREF ± Section ..............51
Added Table 123; Renumbered Sequentially ...............................87
4/2016—Rev. A to Rev. B
Changes to Figure 3 and Table 6 ...................................................10
Changes to Clock Input Considerations Section and
Figure 133 .........................................................................................55
9/2015—Rev. 0 to Rev. A
Changes to Product Highlights Section ......................................... 4
Changes to Clock Synthesizer Enabled Parameter, Table 1 and
Out-of-Range Recovery Time Parameter Unit, Table 1 ............... 5
Changes to Differential Output Voltage, Table 2 .......................... 7
Changes to Table 3 ............................................................................ 8
Changes to Figure 3.........................................................................10
Changes to Figure 4, Figure 8 Caption, and Figure 9 .................12
Changes to Figure 26 ......................................................................15
Changes to Figure 36 and Figure 38 .............................................17
Changes to Figure 40, Figure 41, and Figure 44 ..........................18
Changes to Figure 50 ......................................................................19
Changes to Attenuator Section ......................................................33
Changes to Table 12 ........................................................................36
Changes to Phase Noise Performance Section, Figure 101, and
Figure 102 .........................................................................................37
Changes to Quadrature Digital Downconversion Section ........39
Changes to Synchronization Using SYSREF± Section ............... 51
Added Figure 127; Renumbered Sequentially ............................. 52
Changes to Input Driver Filter Considerations Section and
Figure 130 ......................................................................................... 54
Changes to Clock Input Considerations Section and Figure 133
to Figure 135 .................................................................................... 55
Changes to PCB Design Guidelines Section ............................... 57
Added Figure 141; Renumbered Sequentially ............................. 58
Changes to Power the AD6676 Section and Figure 142 ............ 59
Changes to AD6676 Start-Up Initialization Section and
Table 25 ............................................................................................. 61
Changes to Table 26 ........................................................................ 62
Changes to Table 27 and Table 29 ................................................. 63
Changes to Table 32 ........................................................................ 66
Changes to Coarse NCO Tuning Register Section and
Table 57 ............................................................................................. 72
Changes to Fine NCO Tuning Register Section and Table 58 .. 73
Changes to Table 70 to Table 72 .................................................... 75
Changes to Table 73 ........................................................................ 76
Changes to Table 109 ...................................................................... 84
Added Physical Control 1 Register Section and Table 116 ........ 85
Changes to Table 120 ...................................................................... 86
Changes to Table 121 and Table 123, and Table 125 .................. 87
Changes to CLKSYN Reference Divider and SYSREF Control
Register Section, Table 128, CLKSYN Status Register Section,
and Table 129 ................................................................................... 88
JESDSYN Status Register Section, Table 130, and Table 131 to
Table 133 ........................................................................................... 89
10/2014—Revision 0: Initial Version
Rev. D | Page 3 of 90
AD6676
Data Sheet
The band-pass Σ-Δ ADC of the AD6676, which operates
between 2.0 GHz to 3.2 GHz, provides exceptional instantaneous
dynamic range and inherent antialiasing capability. Its in-band
frequency response typically maintains better than 1 dB pass
band flatness with out-of-band peaking better than 0.5 dB. An
integrated digital peak detector enables the instantaneous signal
power to be monitored over a wide band (shortly after digitization),
thus providing AGC capability to cope quickly with large in-band
or out-of-band blockers.
The AD6676 includes various AGC monitoring and control
features along with an internal 27 dB step attenuator in 1 dB
steps. A flexible AGC port with digital input/output pins allows
fast control of the AD6676 on-chip step attenuator and/or
updates on the input signal via status flags. These features,
along with the high instantaneous dynamic range, can
significantly simplify AGC implementation compared to
traditional narrow-band IF approaches that often require
separate AGC capability for RF and IF protection.
In addition to reducing system complexity, the AD6676 enables
significant space and power consumption savings for next
generation multiple input/multiple output (MIMO) receiver
architectures. The AD6676 is available in an 8 × 10 ball array
WLCSP package that is approximately 4.3 mm × 5.0 mm, with
a JESD204B serial interface that allows simple interfacing to the
host processor.
Its low power consumption of 1.2 W compares favorably to IF
sampling ADCs with similar bandwidth (BW) and dynamic
range capabilities even without considering the added power
savings from the elimination of an entire IF strip. The AD6676
features multichip synchronization that allows synchronization
to within a fraction of an output data sample. For time-domain
duplex (TDD) applications, the AD6676 features a fast powerup/power-down mode that further reduces power consumption
while still maintaining multichip synchronization. Power
savings of up to 60% or 42% is achievable with recovery times of
11.5 μs or 2.5 μs, depending on the device configuration.
Auxiliary blocks include an on-chip PLL clock multiplier to
generate the Σ-Δ ADC clock. For applications that require
better phase noise performance, an external differential RF
clock source may also be used. The SPI port programs numerous
parameters of the AD6676, allowing the device to be optimized
for a variety of applications.
The AD6676 is available in an 80-ball WLCSP package with an
optimized pinout that enables low cost printed circuit board
(PCB) manufacturing. The device operates from a 1.1 V and
2.5 V supply with a total typical power consumption of 1.2 W at
3.2 GSPS operation. This product is protected by several United
States patents. Contact Analog Devices, Inc., for further
information.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
5.
6.
7.
8.
Rev. D | Page 4 of 90
Industry leading dynamic range enables high performance,
reconfigurable heterodyne (or direct sampling VHF)
software defined radios with high AGC-free range.
Continuous time, band-pass Σ-Δ ADC supports IFs from
70 MHz to 450 MHz with IF signal bandwidths of up to
160 MHz and reduces IF filtering requirements.
The high instantaneous dynamic range and oversampling
nature of the Σ-Δ ADC significantly reduces the IF filter
complexity.
On-chip 27 dB digital attenuator with easy to drive resistive
input simplifies interface to RF/IF components.
Small 4.3 mm × 5.0 mm package, simple interface, and
integrated digital attenuator and clock synthesizer save
PCB space.
Low input full-scale level of −2 dBm (or less) enables 3.3 V
RF/IF component lineups at reduced P1dB and power.
Fast power saving mode supports TDD protocols.
Unique profile mode allows the AD6676 to switch between
up to four different ADC IF/BW configurations in 1 μs.
Data Sheet
AD6676
SPECIFICATIONS
VDD1 = VDDL = VDDC = VDDQ = 1.1 V, VDDD = VDDHSI = 1.1 V, VDD2 = 2.5 V, VDDIO = 1.8 V, FIF = 250 MHz, BW = 75 MHz,
FADC = 3.2 GHz, attenuator = 0 dB, L± (inductor values) = 19 nH, maximum PIN_0dBFS setting with IDAC1FS = 4 mA, fDATA_IQ =
200 MSPS, shuffler enabled (every clock cycle) with default threshold of 5, unless otherwise noted.
Table 1.
Parameter
SYSTEM DYNAMIC PERFORMANCE
Full-Scale Input Power Level (PIN_0dBFS)1
Maximum Continuous Wave (CW) Input
Power2
Noise Figure (NF)
Worst In-Band Noise Spectral Density
Noise Figure at IF Center (NF)
In-Band Noise Spectral Density (NSD)
Input Second-Order Intercept (IIP2)
Second-Order Intermodulation
Distortion (IMD) (IMD2)
Input Third-Order Intercept (IIP3)
Third-Order IMD (IMD3)
Worst In-Band Spur for Swept CW Tone
In-Band Noise
Gain Variation
IF INPUT (VIN±)
Input Span
0 dB Attenuator Setting
12 dB Attenuator Setting
Common-Mode Input Voltage
Differential Input Impedance
Common-Mode Input Impedance
Full-Scale Input Power Adjustment
(PIN_0dBFS)
DIGITAL STEP ATTENUATOR (VIN±)
Attenuation Range
Step Size
Input Return Loss
Input Return Loss Variation vs. Attenuator
Setting
CLOCK INPUT (CLK±)
Clock Synthesizer Disabled
Frequency Range
Amplitude Range
Differential Input Impedance
Common Mode Impedance
Input Return Loss
Common-Mode Voltage
Clock Synthesizer Enabled
Frequency Range3
Amplitude Range
CLK+ Input Impedance
Minimum Slew Rate
Common-Mode Voltage
Temperature
Full
Full
Full
Full
Full
Full
Full
Test Conditions/Comments
Min
Typ
−2
−2
−1
No signal and measured
Over a 5 MHz bandwidth
No signal and measured
Over a 5 MHz bandwidth
−6 dBFS tones
See Table 20
17
−155
13
−159
60
−68.3
−8 dBFS tones
−8 dBFS tones
−2 dBFS tone
−10 dBFS tone
−2 dBFS tone
No CW tone
36.9
−95
−99
−109.6
−75.5
−78.5
0.5
Max
Unit
dBm
dBFS
−152.5
−84.2
−93.5
−73.7
−76.5
dB
dBFS/Hz
dB
dBFS/Hz
dBm
dBc
dBm
dBc
dBFS
dBFS
dBFS
dBFS
dB
0 dBFS
Self biased
25°C
25°C
IDAC1FS span of 1 mA to 4 mA
Full
Full
Full
Full
Full
Full
25°C
25°C
25°C
25°C
2.0
0.4
At 3 GHz
At 3 GHz
With 1:2 balun
Self biased
Full
Full
25°C
Single-ended into CLK+
25°C
Self biased
Rev. D | Page 5 of 90
10
0.4
0.48
1.92
1.0
60||2
3.5
12
V p-p
V p-p
V
Ω||pF
kΩ
dB
27
1
20
2
dB
dB
dB
dB
0.8
86||0.3
700||0.8
15
0.70
0.8
1.4||1.0
12
0.55
3.2
2.0
GHz
V p-p
Ω||pF
Ω||pF
dB
V
320
1.1
MHz
V p-p
kΩ||pF
V/μs
V
AD6676
Parameter
CLOCK SYNTHESIZER
Phase Detector Frequency
Minimum Charge Pump Output Current
Maximum Charge Pump Output Current
VCO Tuning Range
Σ-∆ ADC AND DIGITAL DOWNCONVERTER
Resolution
Clock Frequency (FADC)
IF Center Frequency (FIF)
IF Bandwidth
IF Pass Band Gain Flatness
Out-of-Band Peaking
Alias Rejection
Fixed Decimation Factors
Data Sheet
Temperature
Full
Full
Full
Full
Full
Digital Supply Voltage (VDDD)
JESD204B Supply Voltage (VDDHSI)
SPI Interface Supply Voltage (VDDIO)
Analog Supply Current
IVDD1 + IVDDL
IVDDC + IVDDQ
IVDDC4 + IVDDQ
IVDD2 + IVDD2NV
Digital Supply Current (IVDDD)
JESD204B Supply Current (IVDDHSI)
SPI Interface Supply Current (IVDDIO)
Power Consumption
With CLK SYN Disabled
With CLK SYN Enabled
Standby5
Power-Down
OPERATING TEMPERATURE RANGE
Min
2.94
Unit
80
MHz
mA
mA
GHz
3.2
16
Maximum BW applies to
higher FIF
FADC, FIF, and BW dependent
Depends on FADC, FIF, and BW
Regions of FADC ± FIF
2.0
70
0.005
× FADC
dB
dB
dB
1/FADC
1.1
2.5
−2.0
1.1275
2.5625
V
V
V
1.0725
1.0725
1.7
1.1
1.1
1.8
1.1275
1.1275
2.5625
V
V
V
368
57
93
145
141
164
0.4
397
68
106
165
208
190
1
mA
mA
mA
mA
mA
mA
mA
1.16
1.20
0.44
66
1.31
1.34
W
W
W
mW
°C
CLK synthesizer disabled
CLK synthesizer enabled
Full
Full
−40
1
Bits
GHz
MHz
1.0725
2.4375
Use on-chip regulator, tie to
VSS2OUT
Full
Full
Full
3.2
450
0.05 ×
FADC
1.0
0.5
51
12, 16, 24,
32
FADC/3072
FADC/4096
52
Decimate by 12 or 24
Decimate by 16 or 32
Relative to ADC clock cycles
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Max
0.1
6.4
Full
Full
Typ
10
Full
Full
Full
NCO Tuning Resolution
Out-of-Range Recovery Time
POWER SUPPLY AND CONSUMPTION
Analog Supply Voltage
VDD1, VDDL, VDDQ, VDDC
VDD2, VDD2NV
VSS2IN
Test Conditions/Comments
177
+85
Extrapolated input power level is measured at the center of IF pass band that results in a 0 dBFS power level.
The overload level of the Σ-Δ ADC for a CW tone is guaranteed up to −2 dBFS back off from full scale but typically exceeds −1 dBFS. Input signals that have a higher
peak-to-average ratio (PAR) than a CW tone (PAR = 3 dB) must apply additional back off based on the difference in PAR.
3
The clock synthesizer reference divider (Register 0x2BB, Bits[7:6]) must be set to divide by 4 or by 2 to ensure that its phase detector frequency remains ≤40 MHz.
4
fCLK = 200 MHz, FADC = 3.2 GHz.
5
The AD6676 is configured for recovery time of 11.5 μs with VSS2 generator/ digital data in standby (Register 0x150 = 0x40) and low power ADC state (Register 0x250 = 0x95).
2
Rev. D | Page 6 of 90
Data Sheet
AD6676
DIGITAL HIGH SPEED SERDES SPECIFICATIONS
VDD1 = VDDL = VDDC = VDDQ = 1.1 V, VDDD = VDDHSI = 1.1 V, VDD2 = 2.5 V, VDDIO = 1.8 V, unless otherwise noted.
Table 2.
Parameter
HIGH SPEED SERIAL INPUT/OUTPUT
Line Rate
Dual Lane Data Output Period or Unit Interval
Single Lane Data Output Period or Unit Interval
Data Output Duty Cycle
Data Valid Time
PLL Lock Time
Wake-Up Time (Standby)
Wake-Up Time (Power-Down)
Pipeline Delay (Latency)
Deterministic Jitter
Random Jitter at 5.333 Gbps
Output Rise/Fall Time
SYNCINB± Falling Edge to First K.28 Characters
CGS Phase K.28 Characters Duration
DIGITAL OUTPUTS (SERDOUT0±, SERDOUT1±)
Logic Compliance
Differential Output Voltage
Output Offset Voltage, ANSI Mode
Differential Termination Impedance
SYSREF INPUT (SYSREF±)
Logic Compliance
Differential Input Voltage
Differential Input Impedance2
Input Common-Mode Voltage
SYNCIN INPUT (SYNCINB+, SYNCINB−)
Logic Compliance3
CMOS Input Voltage High
CMOS Input Voltage Low
LVDS Differential Input Voltage
LVDS Differential Input Impedance
LVDS Input Common-Mode Voltage
LVDS Input Common-Mode Impedance
SYSREF (SYSREF±) TIMING REQUIREMENTS4
Clock Synthesizer Disabled
Setup Time
Hold Time
Clock Synthesizer Enabled
Setup Time
Hold Time
Symbol
Temp.
UI
UI
Full
Full
25°C
25°C
25°C
25°C
25°C
Full
25°C
25°C
25°C
25°C
25°C
Min
Typ
1.6668
VOD
VOS
Full
Full
Full
25°C
Full
25°C
Max
Unit
5.333
Gbps
sec
sec
%
UI
μs
μs
ms
1/fDATA_IQ1
ps
ps rms
ps
Multiframes
Multiframes
750
1.05
mV p-p
V
Ω
1.8
V p-p
kΩ||pF
V
1/(20 × fDATA_IQ)1
1/(40 × fDATA_IQ)1
50
0.78
4
5
2.5
32.3
9
0.7
45
4
1
CML
360
0.75
0.6
0.8
VDDHSI/2
100
LVDS/PECL
1.2
35/2
0.85
2.0
25°C
CMOS/LVDS
0.65 × VDDIO
0.35 × VDDIO
1.2
100||1
0.85
1||1
tSU_SR
tH_SR
25°C
25°C
0.16
0.84
ns
ns
tSU_SR
tH_SR
25°C
25°C
0.5
0.5
ns
ns
VIH
VIL
Full
25°C
0.6
0.8
1
1.8
2.0
V
V
V p-p
Ω||pF
V
kΩ||pF
FDATA_IQ corresponds to the complex output data rate (that is, FADC/DEC_FACTOR). Latency specification also includes ADC and digital filters delays. See Table 15
The SYSREF± input requires an external differential resistor for proper termination.
3
Set via Register 0x1E7, Bit 2, with CMOS being the default setting.
4
SYSREF± setup and hold times are defined with respect to the rising SYSREF± edge and rising clock edge. Positive setup time leads the clock edge. Positive hold time
also lags the clock rising edge. Note that the hold time takes into consideration that the internal clock signal used to sample SYSREF operates at FADC/2; thus, SYSREF±
must remain high for at least two FADC clock cycles.
2
Rev. D | Page 7 of 90
AD6676
Data Sheet
CLK± TO SYSREF± TIMING DIAGRAM
CLK–
CLK+
tSU_SR
tH_SR
12348-102
SYSREF–
SYSREF+
Figure 2. SERDES CLK+ to SYSREF+ Timing
DIGITAL CMOS INPUT/OUTPUT SPECIFICATIONS
VDD1 = VDDL = VDDC = VDDQ = VDDD = VDDHSI = 1.1 V, VDD2 = 2.5 V, VDDIO = 1.8 V, unless otherwise noted.
Table 3.
Parameter
CMOS INPUT/OUTPUT LEVELS
Input Voltage High
Input Voltage Low
Output Voltage High
SDIO/SDO
AGCx
Output Voltage Low
SDIO/SDO
AGCx
Input Capacitance
SPI TIMING
SCLK Frequency
SCLK Period
SCLK Pulse Width High
SCLK Pulse Width Low
SDIO Setup Time
SDIO Hold Time
SPI_RESET Setup Time1
SCLK Falling Edge to SDO Valid
Propagation Delay
CSB Rising Edge to SDIO High-Z
CSB Fall to SCLK Rise Setup Time
SCLK Fall to CSB Rise Hold Time
1
Symbol
Test Conditions/Comments
VIH
VIL
VOH
Min
Typ
Max
Unit
VDDIO × 0.35
V
V
VDDIO × 0.65
IOH = 3 mA
IOH = 0.5 mA
VDDIO × 0.7
VDDIO × 0.7
V
V
VOL
VOL
IOL = 3 mA
IOL = 0.5 mA
0.4
0.4
V
V
pF
25
10
MHz
ns
ns
ns
ns
ns
ms
ns
10
2
2
ns
ns
ns
1
See Figure 148, Figure 149, and Figure 150
fSCLK
tSCLK
tHIGH
tLOW
tDS
tDH
tSPI_RST
tACCESS
40
10
10
2
2
Not shown in Figure 148 to Figure 150
tZ
tS
tH
This is the time required after a software or hardware reset until SPI access is available again.
Rev. D | Page 8 of 90
2
Data Sheet
AD6676
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
VDD1, VDDC, VDDL, VDDQ to VSSA
VDD2 to VSSA
VDD2NV to VSSA
VSS2IN, VSS2OUT to VSSA
VDDD, VDDHSI to VSSD
VDDIO to VSSD
VIN+, VIN− to VSSA
L+, L− to VSSA
CLK+, CLK− to VSSA
SYSREF+, SYSREF−, SERDOUT0+,
SERDOUT0−, SERDOUT1+,
SERDOUT1− to VSSD
SYNCINB+, SYNCINB− to VSSD
CSB, SDO, SDIO, SCLK, RESETB, AGC1,
AGC2, AGC3, AGC4 to VSSD
Normal Operating Temperature Range
Maximum Junction Temperature
Under Bias
Storage Temperature Range
Rating
−0.2 V to +1.2 V
−0.3 V to +3.0 V
−0.3 V to +3.0 V
−2.5 V to +0.3 V
−0.2 V to +1.2 V
−0.3 V to +3.0 V
−0.3 V to VDD2 + 0.3 V
−0.3 V to VDD2 + 0.3 V
−0.3 V to VDDC + 0.3 V
−0.3 V to VDDHSI + 0.3 V
Typical θJA is specified for a 4-layer printed circuit board (PCB)
with a solid ground plane in conformance to JESD51-9 2s2p. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the value of θJA.
Table 5. Thermal Resistance
Package Type
4.3 mm × 5.0 mm WLCSP
ESD CAUTION
−0.3 V to VDDIO + 0.3 V
−0.3 V to VDDIO + 0.3 V
−40°C to +85°C
125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 9 of 90
JA
26
JC
0.2
JB
4.5
Unit
°C/W
AD6676
Data Sheet
1
2
3
4
5
6
7
8
A
VDDQ
VDD1
VSSA
VDD1
VDD2
L+
L–
VSSA
B
CLK+
VDD1
VDD1
VSSA
VDD1
VDD2
VDD2
VIN+
C
CLK–
VDDC
VDD1
VDD1
VSSA
VDD1
VSSA
VIN–
D
VDDC
VDDC
VDD1
VDDL
VDDL
VSSA
VDD1
VSSA
E
VSSA
VSSA
VSSA
VSSA
VSSA
VSSA
VDD2
VDD2
F
VSSA
VSSA
VSSA
VSSD
VSSD
VSS2IN
VDD2NV
VSSA
G
SYSREF+
VSSD
VSSD
VSSD
VSSD
RESETB
VSS2OUT
VDDIO
H
SYSREF–
VSSD
VDDD
VDDD
VDDD
SDO
AGC4
AGC2
J
VDDHSI
VDDHSI
VDDD
VDDD
VDDD
CSB
AGC3
AGC1
K
SERDOUT0–
SERDOUT0+
SERDOUT1–
SERDOUT1+
SYNCINB+
SYNCINB–
SCLK
SDIO
1.1V ANALOG SUPPLY
ANALOG SUPPLY GROUND
1.1V DIGITAL SUPPLY
2.5V ANALOG SUPPLY
DIGITAL SUPPLY GROUND
–2V ANALOG SUPPLY
1.8V TO 2.5V DIGITAL I/O
ANALOG SUPPLY
JESD204B INTERFACE
AGC I/O
SPI INTERFACE
ADC I/O
12348-003
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration (Top View, Not to Scale)
Table 6. Pin Function Descriptions
Pin No.
Σ-Δ ADC Modulator
B8, C8
A6, A7
B1, C1
Mnemonic
Description
VIN+, VIN−
L+, L−
CLK+, CLK−
Analog Inputs with Nominal 60 Ω Differential Input Termination.
Analog Outputs for External Inductor.
Clock Inputs, Nominal 100 Ω Differential Input Termination When the Clock
Synthesizer is Disabled. When the clock synthesizer is enabled, each input is
1.2 kΩ; therefore, an external, 100 Ω differential termination is recommended if the
clock source is LVDS or PECL. For a CMOS source driving a long trace, the addition of
a series 33 Ω resistor next to the source reduces overshoot seen at CLK+ input pin.
JESD204B Interface
K1, K2
K3, K4
G1, H1
K5, K6
SERDOUT0−, SERDOUT0+
SERDOUT1−, SERDOUT1+
SYSREF+, SYSREF−
SYNCINB+, SYNCINB−
Lane 0 JESD204B Digital CML Outputs.
Lane 1 JESD204B Digital CML Outputs.
JESD204B SYSREF Inputs. Note that these pins have no differential termination.
JESD204B CMOS or LVDS SYNC Inputs. Selectable via Register 0x1E7, Bit 2.
Default CMOS mode uses the SYNCINB+ pin only. LVDS mode has a 100 Ω
differential termination.
Rev. D | Page 10 of 90
Data Sheet
Pin No.
CMOS Input/Outputs
J8, H8, J7, H7
J6
K8
H6
K7
G6
Power Supplies
G8
J1, J2
H3 to H5, J3 to J5
F4, F5, G2 to G5, H2
A1
C2, D1, D2
D4, D5
A2, A4, B2, B3, B5, C3, C4,
C6, D3, D7
A5, B6, B7, E7, E8
A3, A8, B4, C5, C7, D6,
D8, E1 to E6, F1 to F3,
F8
Negative Voltage Regulator
F7
G7
F6
AD6676
Mnemonic
Description
AGC1, AGC2, AGC3, AGC4
AGC Bidirectional Inputs/Outputs. By default, AGC2 and AGC1 are inputs,
whereas AGC4 and AGC3 are outputs. If the AGC2 and AGC1 pins are unused,
connect them to VSSD via a 100 kΩ resistor.
Serial Port Enable Input. Active low.
Serial Port Input/Output.
Serial Port Output.
Serial Clock Input.
Active Low Reset Input. This pin places digital logic and SPI registers into a
known default state. Leave this pin open if unused because it has an internal
pull-up resistor.
CSB
SDIO
SDO
SCLK
RESETB
VDDIO
VDDHSI
VDDD
VSSD
VDDQ
VDDC
VDDL
VDD1
Digital Supply Input for CMOS Input/Outputs (1.8 V to 2.5 V).
Digital 1.1 V Supply Input for the High Speed Serial Interface.
Digital 1.1 V Supply Input.
Digital Supply Return.
Analog 1.1 V Supply Input for the CLK Synthesizer Charge Pump and Dividers.
Analog 1.1 V Supply Input for the CLK Synthesizer VCO.
Analog 1.1 V Supply Input for the ADC.
Analog 1.1 V Supply Input for the ADC.
VDD2
VSSA
Analog 2.5 V Supply Input.
Analog Supply Return.
VDD2NV
VSS2OUT
VSS2IN
Analog 2.5 V Supply Input.
Internal −2.0 V Supply Output. Connect this pin to VSS2IN.
Analog −2.0 V Supply Input. Connect this pin to VSS2OUT.
Rev. D | Page 11 of 90
AD6676
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
NOMINAL PERFORMANCE FOR IF = 115 MHz (DIRECT SAMPLING VHF RECEIVER)
5
0.25
0
0
–0.25
–0.50
–0.75
–1.00
–1.25
–1.50
80
90
100
110
120
130
140
150
FREQUENCY (MHz)
–5
–10
–15
–20
–25
–30
–35
0
50
100 150 200 250 300 350 400 450 500 550 600
FREQUENCY (MHz)
Figure 4. IF Pass Band Flatness (Includes Digital Filter)
12348-610
NORMALIZED STF RESPONSE (dBFS)
0.50
12348-607
NORMALIZED STF RESPONSE (dBFS)
FIF = 115 MHz, BW = 20 MHz, FADC = 2.4 GHz, attenuator = 0 dB, LEXT = 100 nH, maximum PIN_0dBFS setting, fDATA_IQ = 75 MSPS,
nominal supplies, shuffler enabled (every 4 clock cycles), with default threshold settings, unless otherwise noted.
Figure 7. Wideband Frequency Response (Before Digital Filter)
–153
–153
–154
–154
–155
–155
–156
–156
NSD (dBFS/Hz)
NSD (dBFS/Hz)
PIN_0dBFS = –2.9dBm
–157
–158
–159
–157
SHUFFLE-EVERY-4TH CLOCK
–158
–159
–160
–160
–161
–161
SHUFFLER DISABLED
115
120
125
INPUT FREQUENCY (MHz)
–163
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
0
–85
PIN_0dBFS = –2.9dBm
–10
–1dBFS
AT 108MHz
–87
SHUFFLE-EVERY-4TH CLOCK
–40
–88
–50
–89
IBN (dBFS)
AMPLITUDE (dBFS/NBW)
–86
–30
–60
–70
–80
–90
–91
SHUFFLER DISABLED
–90
–92
–100
IF PASS BAND REGION
–110
–93
NBW = 3.4kHz
–94
–120
110
115
INPUT FREQUENCY (MHz)
120
125
–95
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-609
–130
105
–2
Figure 8. NSD vs. CW Input Power, CW at 108 MHz
(NSD Measured at IF Center of 115 MHz)
Figure 5. NSD With and Without Full-Scale CW at 108 MHz
–20
–5
INPUT POWER (dBm)
12348-611
110
Figure 6. Spectral Plot of IF Pass Band Region with −1 dBFS CW at 108 MHz
INPUT POWER (dBm)
–5
–2
12348-612
–163
105
–162
NSD (–1dBFS SIGNAL)
NSD (NO SIGNAL)
12348-608
–162
Figure 9. Integrated In-Band Noise (IBN) in IF Pass Band Region of 10 MHz vs.
Swept Single Tone Input Power with CW at 130 MHz
Rev. D | Page 12 of 90
Data Sheet
AD6676
0
–100
–30
WORST PASS BAND SPUR (dBFS)
–1dBFS
AT 101.6MHz
–20
AMPLITUDE (dBFS)
–1dBFS
–6dBFS
–12dBFS
–18dBFS
IF PASS BAND
REGION = 20MHz
–10
–40
–50
–60
WORST SWEPT
SPUR FOR
–1dBFS CW
AT –3dBm
–70
2 × fDATA-IQ
CLOCK SPUR
AT 150MHz, AT –87dBFS
–80
–90
–111dBFS
–100
–110
–103
–106
–109
–112
–115
90
100
110
120
130
140
150
INPUT FREQUENCY (MHz)
Figure 10. Worst Spur Falling in 75 MHz Pass Band for Swept CW from
77.5 MHz to 152.5 MHz
77.5
0
–10
–20
117.5
127.5
137.5
147.5 152.5
–20
TWO TONES AT
–8dBFS (–10.9dBm)
AT 114MHz AND 116MHz
AMPLITUDE (dBFS/NBW)
AMPLITUDE (dBFS/NBW)
107.5
Figure 13. Worst Pass Band Spur with Swept CW from 77.5 MHz to 150 MHz, over
PIN = −1 dBFS, −6 dBFS, −12 dBFS, and −18 dBFS
0
–40
97.5
INPUT FREQUENCY (MHz)
–10
–30
87.5
12348-616
80
–50
–60
–70
–95dBFS
–80
–94dBFS
–90
–100
NBW = 3.4kHz
–110
TWO TONES AT
–8dBFS (–10.9dBm)
AT 108MHz AND 110MHz
–30
–40
–50
–60
–70
–80
–95dBFS
–95dBFS
–90
–100
NBW = 3.4kHz
–110
–120
–120
110
115
120
125
INPUT FREQUENCY (MHz)
–130
105
12348-614
–130
105
110
115
120
125
INPUT FREQUENCY (MHz)
Figure 11. Two-Tone IMD Performance
(f1 = 114 MHz, f2 = 116 MHz)
12348-617
–130
12348-613
–120
Figure 14. Two-Tone IMD Performance
(f1 = 108 MHz, f2 = 110 MHz)
–80
–80
–85
–85
WORST IMD3 (dBFS)
–95
–100
–105
–110
–115
–8dBFS
–90
–95
–20dBFS
–100
–14dBFS
–120
–105
–130
–39
–36
–33
–30
–27
–24
–21
–18
–15
–12
–9
–6
INPUT AMPLITUDE (dBFS)
Figure 12. Swept Two-Tone Worst IMD3 vs. Tone Input Amplitude
(f1 = 113 MHz, f2 =118 MHz)
–110
110
115
120
125
FREQUENCY (MHz)
130
135
12348-618
–125
12348-615
WORST IMD3 (dBFS)
–90
Figure 15. Swept Two Tone Worst IMD3 vs. Frequency over Pass Band (∆f =
5 MHz for Two Tones, PIN = −8 dBFS, −14 dBFS, and −20 dBFS)
Rev. D | Page 13 of 90
AD6676
Data Sheet
NOMINAL PERFORMANCE FOR IF = 140 MHz (μW POINT-TO-POINT RECEIVERS)
FIF = 140 MHz, BW = 56 MHz or 112 MHz, FADC = 3.2 GHz, attenuator = 0 dB, LEXT = 43 nH, maximum PIN_0dBFS setting, fDATA_IQ =
200 MSPS, nominal supplies, shuffler enabled (every clock cycle), with default threshold settings, unless otherwise noted.
0.5
5
–0.5
–1.0
112MHz BW SETTING
–1.5
–2.0
80
90
100 110 120 130 140 150 160 170 180 190 200
FREQUENCY (MHz)
–15
–20
–25
–30
50
100 150 200 250 300 350 400 450 500 550 600
FREQUENCY (MHz)
Figure 19. Wideband Frequency Response (Before Digital Filter)
–75
PIN_0dBFS = –2.7dBm
–148
–80
CH BW = 56MHz
–150
IBN (dBFS)
NSD (dBFS/Hz)
56MHz BW SETTING
–10
0
BW SETTING OF 112MHz
(IBN = –72.2dBFS)
BW SETTING OF 56MHz
(IBN = –80.5dBFS)
–146
–5
–35
Figure 16. IF Pass Band Flatness (Includes Digital Filter)
–144
0
12348-622
NORMALIZED STF RESPONSE (dBFS)
0
12348-619
NORMALIZED STF RESPONSE (dBFS)
112MHz BW SETTING
56MHz BW SETTING
–152
–154
–85
–156
CH BW = 28MHz
CH BW = 14MHz
–158
–90
CH BW = 7MHz
–160
90
100 110 120 130 140 150 160 170 180 190 200
INPUT FREQUENCY (MHz)
–95
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-620
Figure 17. NSD with No Signal, IBN = 112 MHz and 56 MHz
0
0
–19.7dBm CW INTERFERER TONE AT –22dBFS
–10
2.5× CH BW =
35MHZ
–20
–20
–30
–30
–40
–40
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–2
Figure 20. IBN vs. Swept Single Tone Input Power over Channel BW = 7 MHz,
14 MHz, 28 MHz, and 56 MHz, CW Blocker at 350 MHz
–10
–50
14MHz
–60
QAM1024
AT –52dBFS
CNR = 36dB
–70
–80
–90
IBN = –88dBFS
TWO TONES AT
–8dBFS (–10.7dBm)
AT 137.5MHz
AND 142.5MHz
–50
–60
–70
–80
–100dBFS
–101dBFS
–90
–100
–100
–110
–110
–120
60
80
100
120
140
160
180
INPUT FREQUENCY (MHz)
200
220
240
12348-621
NBW = 9.2kHz
–120
40
–5
INPUT POWER (dBm)
Figure 18. Spectral Plot of CW Interferer Dynamic Range for QAM1024,
Channel BW = 14 MHz at Sensitivity Level with CW Interferer 30 dB Higher at
35 MHz Offset
Rev. D | Page 14 of 90
NBW = 9.6kHz
–130
115
120
125
130
135
140
145
150
155
INPUT FREQUENCY (MHz)
Figure 21. Two-Tone IMD Performance
(f1 = 137.5 MHz, f2 = 142.5 MHz)
160
165
12348-624
80
12348-623
–162
Data Sheet
AD6676
NOMINAL PERFORMANCE FOR IF = 181 MHz (WIRELESS INFRASTRUCTURE RECEIVER)
FIF = 181 MHz, BW = 75 MHz, FADC = 2.94912 GHz, attenuator = 0 dB, LEXT = 43 nH, maximum PIN_0dBFS setting, fDATA_IQ =
122.88 MSPS, shuffler enabled (every clock cycle), with default threshold settings, unless otherwise noted.
5
0
–0.25
–0.50
–0.75
–1.00
140 145 150 155 160 165 170 175 180 185 190 195 200 205 210 215 220
FREQUENCY (MHz)
–10
–15
–20
–25
–30
50
100 150 200 250 300 350 400 450 500 550 600
FREQUENCY (MHz)
–150
–152
–151
–153
–154
PIN_0dBFS = –2.5dBm
216MHz
–155
NSD (dBFS)
–153
–154
–155
–156
–156
–157
146MHz
–158
–159
–157
181MHz
–160
–158
NSD (–1dBFS SIGNAL)
NSD (NO SIGNAL)
155
165
175
185
195
205
215
INPUT FREQUENCY (MHz)
–162
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-626
0
–75.0
–10
PIN_0dBFS = –2.5dBm
–75.5
–1dBFS (–3.5dBm) AT 220MHz
–76.0
–30
–76.5
–50
–77.0
IBN (dBFS)
–40
–60
–70
–80
–77.5
–78.0
75MHz IF PASS BAND REGION
–90
–78.5
–100
–79.0
–110
–79.5
–120
NBW = 5.6kHz
150
160
170
180
190
200
INPUT FREQUENCY (MHz)
210
220 225
–80.0
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-627
–130
140
–2
Figure 26. NSD vs. CW Input Power, CW = 210 MHz
(NSD Measured at 181 MHz as well as 146 MHz and 216 MHz Band Edges)
Figure 23. NSD With and Without Full-Scale CW at 210 MHz
–20
–5
INPUT POWER (dBm)
Figure 24. Spectral Plot of IF Pass Band Region with −1 dBFS CW at 220 MHz
INPUT POWER (dBm)
–5
–2
12348-630
145
12348-629
–161
–159
–160
0
Figure 25. Wideband Frequency Response (Before Digital Filter)
–152
NSD (dBFS/Hz)
–5
–35
Figure 22. IF Pass Band Flatness (Includes Digital Filter)
AMPLITUDE (dBFS/NBW)
0
12348-628
NORMALIZED STF RESPONSE (dBFS)
0.25
12348-625
NORMALIZED STF RESPONSE (dBFS)
0.50
Figure 27. IBN in IF Pass Band Region (BW = 75 MHz) vs. Swept Single Tone
Input Power with CW at 220 MHz
Rev. D | Page 15 of 90
AD6676
Data Sheet
–94
–1dBFS
–6dBFS
–12dBFS
–18dBFS
–30
IF PASS BAND
REGION = 75MHz
–40
–50
–60
WORST SWEPT
PASS BAND
SPUR FOR
–1dBFS CW
AT –3.5dBm
–70
–80
–97dBFS
–90
–100
–110
–120
NBW = 5.6kHz
125 135 145 155 165 175 185 195 205 215 225 235
INPUT FREQUENCY (MHz)
Figure 28. Worst Spur Falling in 75 MHz Pass Band for Swept CW from
122.88 MHz to 245.76 MHz
–103
–106
–109
–112
0
–10
AMPLITUDE (dBFS/NBW)
–50
–60
–70
–94dBFS
–80
–96dBFS
–90
–100
–110
185
205
225
245
TWO TONES AT
–8dBFS (–10.5dBm)
AT 169MHz
AND 193MHz
–30
–40
–50
–60
–70
–90dBFS
–92dBFS
–80
–90
–100
–110
–120
–120
NBW = 5.6kHz
145
155
165
175
185
195
205
215
INPUT FREQUENCY (MHz)
–130
12348-632
–130
165
–20
TWO TONES
AT –8dBFS (–10.5dBm)
AT 178.5MHz
AND 183.5MHz
–40
145
Figure 31. Swept Worst Pass Band Spur with CW Swept from 122.88 MHz to
245.76 MHz, over PIN = −1 dBFS, −6 dBFS, −12 dBFS, and −18 dBFS
0
–30
125
INPUT FREQUENCY (MHz)
–10
–20
AMPLITUDE (dBFS/NBW)
–100
–115
12348-631
–130
–97
NBW = 5.6kHz
145
155
165
175
185
195
205
215
INPUT FREQUENCY (MHz)
Figure 29. Two-Tone IMD Performance
(f1 = 178.5 MHz, f2 = 183.5 MHz)
12348-635
AMPLITUDE (dBFS/NBW)
–20
WORST PASS BAND SPUR (dBFS)
–1dBFS
AT 185MHz
12348-634
0
–10
Figure 32. Two-Tone IMD Performance
(f1 = 169 MHz, f2 = 193 MHz)
–80
–80
–85
–85
WORST IMD3 (dBFS)
–95
–100
–105
–110
–115
–20dBFS
–90
–95
–8dBFS
–100
–105
–14dBFS
–120
–125
–130
–39
–36
–33
–30
–27
–24
–21
–18
–15
–12
–9
–6
INPUT AMPLITUDE (dBFS)
Figure 30. Swept Two-Tone Worst IMD3 vs. Tone Level (dBFS)
(f1 = 178.5 MHz, f2 = 183.5 MHz)
–115
140
150
160
170
180
190
200
FREQUENCY (MHz)
210
220
230
12348-636
–110
12348-633
WORST IMD3 (dBFS)
–90
Figure 33. Swept Two-Tone Worst IMD3 vs. Frequency over Pass Band (∆f =
5 MHz for Two Tones, PIN = −8 dBFS, −14 dBFS, and −20 dBFS)
Rev. D | Page 16 of 90
Data Sheet
AD6676
NOMINAL PERFORMANCE FOR IF = 250 MHz AND BW = 75 MHz
FIF = 250 MHz, BW = 75 MHz, FADC = 3.2 GHz, attenuator = 0 dB, LEXT = 19 nH, maximum PIN_0dBFS setting, fDATA_IQ = 200 MSPS,
nominal supplies, shuffler enabled (every clock cycle), with default threshold settings, unless otherwise noted.
5
–0.25
220
230
240
250
260
270
280
290
FREQUENCY (MHz)
–15
–20
–25
100
200
300
400
500
600
700
Figure 37. Wideband Frequency Response (Before Digital Filter)
–150
NSD
(–1 dBFS SIGNAL)
PIN_0dBFS = –2.3dBm
–151
–152
–153
–153
–154
–154
NSD (dBFS)
–152
–155
–156
287.5MHz
–155
212.5MHz
–156
–157
–157
–158
–158
NSD
(NO SIGNAL)
220
230
240
250
260
270
280
250MHz
–159
290
INPUT FREQUENCY (MHz)
–160
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-638
–159
–160
210
0
FREQUENCY (MHz)
–150
NSD (dBFS/Hz)
–10
–30
Figure 34. IF Pass Band Flatness (Includes Digital Filter)
–151
–5
Figure 35. NSD With and Without Full-Scale CW at 243 MHz
–5 –3
INPUT POWER (dBm)
12348-641
–0.50
210
0
12348-640
NORMALIZED STF RESPONSE (dBFS)
0
12348-637
NORMALIZED STF RESPONSE (dBFS)
0.25
Figure 38. NSD vs. CW Input Power, CW at 243 MHz
(NSD Measured at 250 MHz as well as 212.5 MHz and 287.5 MHz Band Edges)
0
–75.0
PIN_0dBFS = –2.3dBm
–75.5
–1 dBFS
AT 288MHz
–76.0
–76.5
–40
IBN (dBFS)
AMPLITUDE (dBFS/NBW)
–20
–60
–80
NBW = 9.2kHz
–77.0
–77.5
–78.0
–78.5
IF PASS BAND REGION
–79.0
–100
220
230
240
250
260
INPUT FREQUENCY (MHz)
270
280
290
–80.0
–45 –42 –39 –36 –33 –30 –27 –24 –21 –18 –15 –12 –9
12348-639
–120
210
Figure 36. Spectral Plot of IF Pass Band Region with −1 dBFS CW at 288 MHz
INPUT POWER (dBm)
–6
–3
12348-642
–79.5
Figure 39. IBN in the Pass Band Region (BW = 75 MHz) vs. Swept Single Tone
Input Power with CW at 288 MHz
Rev. D | Page 17 of 90
AD6676
Data Sheet
0
–80
IF PASS BAND
REGION
WORST SPUR (dBFS/NBW)
WORST SWEPT SPUR FOR
–1dBFS CW AT
–3.4dBm < –88dBFS
–40
–60
WORST PASS BAND SPUR (dBFS)
–1dBFS
AT 315MHz
–20
–79dBFS
AT 200MHz
CLOCK SPUR
–88dBFS
–80
–100
–85
–1dBFS
–6dBFS
–12dBFS
–18dBFS
–90
–95
–100
–105
–110
170
190
210
230
250
270
290
310
330
350
INPUT FREQUENCY (MHz)
–115
150
12348-643
Figure 40. Worst Spur Falling in 75 MHz Pass Band for Swept CW from
150 MHz to 300 MHz
190
210
230
250
270
290
330
350
Figure 43. Swept Worst Pass Band Spur with CW Swept from 150 MHz to
300 MHz for PIN = −1 dBFS, −6 dBFS, −12 dBFS, and −18 dBFS
0
–20
–20
AMPLITUDE (dBFS/NBW)
2 TONE AT –8dBFS (–10.4dBm)
AT 247.5MHz AND 252.2MHz
–40
–60
–80
–94dBFS
–102dBFS
2 TONE AT –8dBFS
(–10.4dBm)
AT 238MHz AND 262MHz
–40
–60
–80
–91dBFS
–91dBFS
–100
–100
NBW = 9.2kHz
220
230
240
250
260
270
280
NBW = 9.2kHz
290
INPUT FREQUENCY (MHz)
–120
210
12348-644
–120
210
310
INPUT FREQUENCY (MHz)
0
WORST SPUR (dBFS/NBW)
170
220
230
240
250
260
270
280
290
INPUT FREQUENCY (MHz)
Figure 41. Two-Tone IMD Performance
(f1 = 247.5 MHz, f2 = 252.5 MHz)
12348-647
–120
150
12348-646
NBW = 9.2kHz
Figure 44. Two-Tone IMD Performance
(f1 = 238 MHz, f2 = 262 MHz)
–80
–80
–85
–85
WORST IMD3 (dBFS)
–95
–100
–105
–110
–115
–120
–90
–20dBFS
–95
–100
–8dBFS
–105
–14dBFS
–130
–39
–36
–33
–30
–27
–24
–21
–18
–15
–12
–9
–6
INPUT AMPLITUDE (dBFS)
Figure 42. Swept Two-Tone Worst IMD3 vs. Tone Level (dBFS)
(f1 = 252.5 MHz, f2 = 257.5 MHz)
–110
210
220
230
240
250
260
270
FREQUENCY (MHz)
280
290
300
12348-648
–125
12348-645
WORST IMD3 (dBFS)
–90
Figure 45. Swept Two-Tone Worst IMD3 vs. Frequency over Pass Band
(∆f = 5 MHz for Two Tones, PIN =−8 dBFS, −14 dBFS, and −20 dBFS )
Rev. D | Page 18 of 90
Data Sheet
AD6676
NOMINAL PERFORMANCE FOR IF = 350 MHZ AND BW = 160 MHZ
FIF = 350 MHz, BW = 160 MHz, FADC = 3.2 GHz, attenuator = 0 dB, LEXT = 10 nH, maximum PIN_0dBFS setting, fDATA_IQ = 266.7 MSPS,
shuffler enabled (every clock cycle), with default threshold settings, unless otherwise noted.
0.75
0.50
0.25
0
–0.25
–0.50
270
290
310
330
350
370
390
410
430
FREQUENCY (MHz)
0
–5
–10
–15
–20
–25
–30
–35
0
200
300
400
500
600
700
800
900
1000
FREQUENCY (MHz)
Figure 46. IF Pass Band Flatness (Includes Digital Filter)
Figure 49. Wideband Frequency Response (Before Digital Filter)
–140
–140
NSD
(–1 dBFS SIGNAL)
–142
100
12348-652
NORMALIZED STF RESPONSE (dBFS)
5
12348-649
NORMALIZED STF RESPONSE (dBFS)
1.00
PIN_0dBFS = –2.3dBm
–142
–144
–146
–146
NSD (dBFS)
–148
–150
–148
–150
350MHz
–152
–152
NSD
(NO SIGNAL)
–156
270
290
310
330
350
370
390
–154
410
430
INPUT FREQUENCY (MHz)
–156
–44 –41 –38 –35 –32 –29 –26 –23 –20 –17 –14 –11 –8
12348-650
–154
Figure 47. NSD With and Without Full-Scale CW at 355 MHz
Figure 50. NSD vs. CW Input Power, CW at 355 MHz
(NSD Measured at 350 MHz as well as 350 MHz and 400 MHz Band Edges)
–60
PIN_0dBFS = –2.3dBm
–61
–1 dBFS
AT 431MHz
–20
–5 –3
INPUT POWER (dBm)
0
–62
–63
–40
IBN (dBFS)
AMPLITUDE (dBFS/NBW)
400MHz
12348-653
NSD (dBFS)
310MHz
–144
–60
NBW = 12.2kHz
–80
–64
–65
–66
–67
IF PASS BAND REGION
–68
–100
280
300
320
340
360
380
INPUT FREQUENCY (MHz)
400
420
440
–70
–45 –42 –39 –36 –33 –30 –27 –24 –21 –18 –15 –12 –9
12348-651
–120
260
Figure 48. Spectral Plot of IF Pass Band Region with −1 dBFS CW at 431 MHz
INPUT POWER (dBm)
–6
–3
12348-654
–69
Figure 51. IBN in IF Pass Band Region (BW = 160 MHz) vs. Swept Single Tone
Input Power with CW at 431 MHz
Rev. D | Page 19 of 90
AD6676
Data Sheet
–80
–40
WORST SWEPT SPUR FOR
–1dBFS CW AT –3.3dBm
–60
–83dBFS
IMAGE SPUR
–77dBFS
AT 267MHz
CLOCK SPUR
–80
NBW = 12.2kHz
–120
220 240 260 280 300 320 340 360 380 400 420 440 460 480
INPUT FREQUENCY (MHz)
Figure 52. Worst Spur Falling in 160 MHz Pass Band for Swept CW from
217 MHz to 484 MHz
–95
–100
220 240 260 280 300 320 340 360 380 400 420 440 460 480
INPUT FREQUENCY (MHz)
0
–20
–20
TWO TONE AT –8dBFS
(–10.4dBm)
AT 340MHz AND
360MHz
–40
WORST SPUR (dBFS/NBW)
–60
–87dBFS
–93dBFS
–80
–40
NBW = 12.2kHz
310
330
350
370
390
410
430
–87dBFS
–80
–120
270
12348-656
290
INPUT FREQUENCY (MHz)
NBW = 12.2kHz
290
310
330
–75
–85
–80
WORST IMD3 (dBFS)
–90
–95
–100
–105
–27
–24
–21
–18
–15
–12
–9
–6
410
430
–85
–90
–14dBFS
–95
INPUT AMPLITUDE (dBFS)
Figure 54. Swept Two-Tone Worst IMD3 vs. Tone Level (dBFS)
(f1 = 347.5 MHz, f2 = 352.5 MHz)
–105
270
12348-657
–30
390
–20dBFS
–100
–110
–33
370
Figure 56. Two-Tone IMD Performance
(f1 = 325 MHz, f2 = 375 MHz)
–80
–36
350
INPUT FREQUENCY (MHz)
Figure 53. Two-Tone IMD Performance
(f1 = 340 MHz, f2 = 360 MHz)
WORST IMD3 (dBFS)
–74dBFS
–60
–100
–100
–115
–39
TWO TONE
AT –8dBFS
(–10.4dBm)
AT 325MHz AND
375MHz
12348-659
WORST SPUR (dBFS/NBW)
–90
Figure 55. Swept Worst Pass Band Spur with CW Swept from 217 MHz to 484 MHz
over PIN = −1 dBFS, −6 dBFS, −12 dBFS, and −18 dBFS
0
–120
270
–85
–105
12348-655
–100
–1dBFS
–6dBFS
–12dBFS
–18dBFS
–8dBFS
290
310
330
350
370
FREQUENCY (MHz)
390
410
430
12348-660
WORST SPUR (dBFS/NBW)
–20
–1dBFS
AT 372MHz
WORST PASS BAND SPUR (dBFS)
IF PASS BAND
REGION
12348-658
0
Figure 57. Swept Two-Tone Worst IMD3 vs. Frequency over Pass Band
(∆f = 5 MHz for Two Tones, PIN =−8 dBFS, −14 dBFS, and −20 dBFS)
Rev. D | Page 20 of 90
Data Sheet
AD6676
EQUIVALENT CIRCUITS
VDDIO
VDDIO
VDDIO
ESD
PROTECTED
I/O
SDIO
OR
AGCx
1kΩ
12348-017
1kΩ
ESD
PROTECTED
Figure 58. Equivalent CSB or SCLK Input Circuit
12348-015
CSB, SCLK
OR SDI
Figure 62. Equivalent SDIO or AGCx Input/Output Circuit
RIN = 60Ω
VCM = 1.0V
VIN+
VDDIO
VIN–
25kΩ
AC
1kΩ
12348-016
Figure 59. Equivalent Analog Input
Figure 63. Equivalent RESETB Input Circuit
VDDIO
NC
VDD1
SYNCINB+
TO CLK SYN
CLK+
+
CLK–
–
DGND
TO BAND-PASS
Σ-∆ ADC
50Ω
VDDIO
SYNCINB–
Figure 60. Equivalent Clock Input Circuit
VCM
SYNCINB± PIN
CONTROL (SPI)
Figure 64. Equivalent SYNCINB± Input
VDDHSI
EMPHASIS/SWING
CONTROL (SPI)
1kΩ
VDDHSI
LEVEL
TRANSLATOR
VDDHSI
SERDOUTx+
x = 0, 1
DATA+
OUTPUT
DRIVER
VCM = 0.55V
10kΩ
DATA–
VDDHSI
SERDOUTx–
x = 0, 1
12348-012
1kΩ
Figure 61. Equivalent SYSREF± Input
Figure 65. Digital CML Output Circuit
Rev. D | Page 21 of 90
12348-014
10kΩ
SYSREF–
VCM = 0.85V
20kΩ
1kΩ
DGND
SYSREF+
20kΩ
LEVEL
TRANSLATOR
12348-011
50Ω
1kΩ
12348-013
DC
12348-401
RESETB
AD6676
Data Sheet
TERMINOLOGY
Noise Figure (NF)
NF is the degradation in SNR performance (in dB) of an input
signal having a noise density of −174 dBm/Hz after it passes
through a component or system. Mathematically,
NF = 10 × log(SNRIN/SNROUT)
The noise figure of the AD6676 is determined by the equation
NF = PIN − (10 × log(BW)) − (−174.0 dBm/Hz) − SNR
where:
PIN is the input power of an unmodulated carrier.
BW is the noise measurement bandwidth.
−174.0 dBm/Hz is the thermal noise floor at 290 K.
SNR is the measured signal-to-noise ratio in dB of the AD6676.
Note that PIN is set to a low level (that is, <−40 dBm) to
minimize any degradation in measured SNR due to phase noise
from either the input signal or Σ-Δ ADC clock source.
Noise Spectral Density (NSD)
NSD is the noise power normalized to 1 Hz bandwidth (at a
particular frequency) relative to the full scale of the ADC (dBFS)
and hence is given in units of dBFS/Hz. The AD6676, being a
Σ-Δ ADC, displays a uneven NSD across its IF pass band. Both
the worst-case NSD as well as NSD at the pass band center are
reported. Note that NSD is calculated from the IBN measured
over a 5 MHz bandwidth.
In-Band Noise (IBN)
IBN is the integrated noise power measured over a user defined
bandwidth relative to the full scale of the ADC (dBFS). This
bandwidth is typically equal to the IF pass band setting (BW) of
the AD6676, unless otherwise noted.
Input Third-Order Intercept (IIP3)
IIP3 is a figure of merit used to quantify the third-order
intermodulation distortion (IMD3) of a component or system.
Two equal amplitude unmodulated carriers at specified frequencies
(f1 and f2) injected into a nonlinear system exhibiting third-order
nonlinearities produce IMD components at 2 f1 − f2 and 2 f2 − f1.
IIP3 is the extrapolated tone power at which the intermodulation
terms and the input tones have equal amplitude.
IIP3 = PIN – IMD3/2
Note that the third-order IMD performance of an ADC does
not necessarily follow the 3:1 rule that is typical of RF/IF linear
devices. IMD performance is dependent on the dual tone
frequencies, signal input levels, and ADC clock rate.
Worst In-Band Spur (SFDR)
Worst in-band spur is the worst spur falling in the IF pass band
relative to the full scale of the ADC (dBFS) when a single tone
with defined power level is stepped (typically 1 MHz increments)
across a user defined frequency range. Note that this worst spur
can often be an image (or clock) related spur depending on the
IF, BW, and IQ output data rate setting of the AD6676 and on
the sweep range.
Signal Transfer Function (STF)
STF is the frequency response of the output signal of the ADC
relative to a swept single tone at its input. The STF presented for
different AD6676 setup conditions in the Typical Performance
Characteristics section shows the STF over the IF pass band
after the digital filter to highlight pass band flatness. The
wideband STF response is measured before the digital filter to
highlight the pass band response of the AD6676 Σ-Δ ADC.
Input Second-Order Intercept (IIP2)
IIP2 is a figure of merit used to quantify the second-order
intermodulation distortion (IMD2) of a component or system.
Two equal amplitude unmodulated carriers at specified
frequencies (f1 and f2) injected into a nonlinear system exhibiting
second-order nonlinearities produce IMD components at f1 − f2
and f1 + f2. For the AD6676, the two frequencies are situated
at ½ the IF frequency (with a 2 MHz offset) at a power level
corresponding to −6 dBFS at the IF center frequency with
only the intermodulation term at f1 + f2 considered. IIP2 is
the extrapolated tone power at which the intermodulation
terms and the input tones have equal amplitude.
IIP2 = PIN − IMD2
Rev. D | Page 22 of 90
Data Sheet
AD6676
THEORY OF OPERATION
On-chip digital signal processing blocks include a quadrature
digital downconverter (QDDC) followed by selectable decimation
filters supporting decimation factors of 12, 16, 24, or 32. The
QDDC performs a complex shift of the desired IF pass band
such that it is centered about dc, that is, zero IF. Cascaded
decimation filters remove the inherent out-of-band noise of the
ADC along with any other out-of-band signal content such that
the 16-bit complex IQ data is reduced to a more manageable data
rate for transfer to the host via a single or dual lane JESD204B
interface supporting up to 5.333 Gbps lane rates.
OVERVIEW
The AD6676 is a highly integrated and flexible IF subsystem
capable of digitizing IF signals. The ability to tune the IF
frequency and bandwidth allows the Σ-Δ ADC to be optimized
for different applications while trading off bandwidth for dynamic
range. To facilitate its evaluation and design in, a software tool
that is part of the AD6676EBZ development platform must be
used to configure and evaluate the device. This tool saves the
SPI initialization and configuration sequence to a file for later
use. A screenshot of the GUI front panel (see Figure 66) shows the
different user specified application parameters that configure
the AD6676. The following discussion provides more insight
into the device operation and how these application parameters
affect performance.
12348-018
The AD6676 also includes features for AGC support and/or levelplanning optimization. AGC support includes the ability to
monitor peak power at the Σ-Δ ADC output or rms power after
the first internal decimation stage. The host can initiate fast AGC
action by configuring various flags whose status are made available
on the AGC4 to AGC1 pins. Flags can be set with programmable
thresholds indicating whether the signal level is above or below
a defined level. A 27 dB attenuator with a step size of 1 dB is
available for IF AGC control or level planning optimization during
initial system calibration. Alternatively, the nominal 0 dBFS
full-scale input power level (PIN_0dBFS) of −2 dBm can be
reduced by up to 12 dB thus further reducing the RF/IF gain
requirements. The SPI programs numerous parameters of the
AD6676, allowing the device to be optimized for a variety of
applications.
Figure 66. Screenshot of AD6676 GUI Software Tool that Facilitates Device
Configuration and Evaluation
A functional block diagram of the AD6676 is shown Figure 67.
The focal point of the AD6676 is its continuous time, band-pass
Σ-Δ ADC that operates with a clock rate between 2.0 GHz and
3.2 GHz. An on-chip controller configures the Σ-Δ ADC based
on the user specified application parameters. The Σ-Δ ADC
provides exceptional dynamic range and pass band flatness
within the desired IF span while limiting out-of-band peaking
to less than 0.5 dB. An on-chip clock synthesizer supplies a
2.94 GHz to 3.2 GHz Σ-Δ ADC clock. Alternatively, an external
clock can be supplied for lower clock rates or improved phase
noise performance.
VSS2IN VSS2OUT VDD2NV
AGC4, AGC3
AGC2, AGC1
VDDIO RESETB
–2.0V
REG
VIN+
BAND-PASS
Σ-∆ ADC
VIN–
SCLK
SDIO
SDO
VDDHSI
QDDC +
NCO
I
I
Mx
Q
L+
L–
CLOCK
GENERATION
CLOCK
SYNTHESIZER
SPI
M = 12,
16, 24,
32
Q
JESD204B
SERIALIZER
Tx OUTPUTS
27dB ATTENUATOR
(1dB STEPS)
CSB
AGC
SUPPORT
JESD204B
SUBCLASS 1
CONTROL
SERDOUT0+
SERDOUT0–
SERDOUT1+
SERDOUT1–
SYNCINB±
SYSREF±
VDDQ VDDC
CLK+ CLK–
VDD2 VDDL VDD1 VSSA
Figure 67. Functional Block Diagram
Rev. D | Page 23 of 90
VDDD VSSD
12348-400
AD6676
AD6676
Data Sheet
G53
RESON1
CARRAY
RESON2
C3
LEXT
AV
C4
C5
G43
–G56
G54
C6
G65
17-LEVEL
FLASH
ADC
17
ENCODER
5
DOUT
17
12348-020
IDAC6
IDAC5
IDAC4
IDAC1FS
ADJUST
IDAC3
RIN
IDAC1
VIN
G31
–G34
RESON3
OPTIONAL
SHUFFLER
Figure 68. Simplified Single-Ended Representation of the Band-Pass Σ-Δ ADC Modulator
BAND-PASS Σ-Δ ADC ARCHITECTURE
Figure 68 shows a simplified single-ended representation of the
AD6676 band-pass Σ-Δ ADC. It is a sixth-order modulator
consisting of three cascaded second-order continuous-time
resonators with feedback DACs and an oversampling quantizer.
The first resonator (RESON1) is based on a LC tank with its
resonant frequency tuned via CARRAY to the IF center while the
second and third resonators (RESON2 and RESON3) are active
RC-based with their resonant frequencies tuned to frequencies
offset symmetrically about the IF. These resonant frequencies
correspond to the zero locations of the Σ-Δ ADC quantization
noise and are set according to the user defined IF frequency
and bandwidth.
A 17-level flash ADC oversamples the analog output of RESON3
with the digital output of the flash ADC feeding back to each of
the resonators via current mode DACs (IDACx). Note that because
the ADC thermometer code output can range from −8 to +8, it is
represented by five bits that are passed to the AD6676 digital path.
The IDAC1 full-scale current setting (IDAC1FS) sets the maximum
full-scale input power level (PIN_0DBFS). The full-scale settings of
the other IDACs set the pole location of the modulator to achieve a
flat pass band response. Lastly, a programmable shuffler follows
the flash ADC to improve the linearity performance of the
AD6676 under large signal conditions.
The tunable nature of the Σ-Δ ADC is a result of the full-scale
current of the feedback DACs, as well as the conductances (G)
and capacitances (C) associated with each resonator. The value
of these programmable components are calculated from the
user specified application parameters listed in Table 7. The
impact of each of these parameters on the performance of the
AD6676 is described in subsequent sections.
Table 7. List of User Specified Application Parameters That
Determine the Σ-Δ ADC Internal Settings
Application
Parameter
FIF
BW
FADC
LEXT
MRGN
IDAC1FS
Description
IF center frequency in MHz
IF pass band bandwidth in MHz
Σ-Δ ADC clock rate in MHz
External inductor value in nH
Margin offset to set resonator
frequency in MHz
Full-scale current of IDAC1 that
sets PIN_0dBFS level
SPI Register(s)
0x102, 0x103
0x104, 0x105
0x100, 0x101
0x106
0x107 to 0x109
0x10A
The on-chip controller is used only during device initialization
and performs the following tasks:




Power-up negative regulator (used by IDACs)
Calibrate RESON1 and 17-level flash ADC
Tune Σ-Δ ADC based on user input parameters
Set up PLL used by JESD204B PHY
After device initialization, the on-chip controller is disabled; it
is not used during normal device operation.
Signal and Noise Transfer Functions
The frequency domain response of a Σ-Δ ADC is defined by its
signal and noise transfer functions (STF and NTF). Figure 69
shows a simplified feedback model of a Σ-Δ modulator with the
ADC quantization error modeled as an additive noise source
(E) after the loop filter (H). The STF is the frequency response
of the output signal (V) relative to a swept single tone at its input
(U) while the NTF is the frequency response of the ADC
quantization noise (that is, V/E) that undergoes noise shaping
due to of the loop filter of the ADC. Note that the ADC and
DACs within the feedback loop operate at a much higher clock
rate than a traditional open-loop ADC in which only the
Nyquist criterion must be satisfied (FADC = 2 × BW).
The oversampling ratio (OSR) is a key parameter of any Σ-Δ
ADC and is defined as follows:
OSR = FADC/(2 × BW)
Rev. D | Page 24 of 90
(1)
Data Sheet
–60
ADC
NBW = 146.5kHz
V
–
NOISE (dBFS/NBW)
DAC
E
U
–120
–70
+
H(z)
V
–
ADC
–80
–130
OBSERVED
NSD
–140
–90
THEORETICAL
NSD FROM
ADC QUANTIZATION
–100
–160
–110
DAC
–120
H(z)
1
U(z) +
E(z)
1 + H(z)
1 + H(z)
STF
NTF
–130
100
In the case of the AD6676, the loop filter consists of three cascaded
resonators to implement a sixth-order band-pass response, thus
allowing the oversampling ratio of the AD6676 to be kept to
moderate levels (≥10) such that useable bandwidths of up to
160 MHz can be realized. The loop filter utilizes a feedback
architecture so that the STF has minimal out-of-band gain
peaking while the NTF suppresses the in-band quantization
noise. Figure 70 shows an example of the STF and the shaped
noise of the Σ-Δ ADC when it is configured for BW = 80 MHz,
FIF = 300 MHz, and FADC = 3.2 GHz. Note that the NSD near FIF
is much lower than the NSD elsewhere and that the STF is quite
broadband.

NBW = 146.5kHz
NOISE (dBFS/NBW)

–40
–60
NTF
SHAPED NOISE
–80
–100
400
600
800
1000
1200
1400
1600
FREQUENCY (MHz)
12348-022
NSD = –161.5dBFS/Hz
200
200
250
300
–180
350
400
450
500
Unlike conventional ADCs, the NSD of a Σ-Δ ADC is not flat due
to its frequency dependent loop filter, H(s), which shapes the
quantization noise as well as various other noise sources. Because
the Σ-Δ ADC is highly programmable, its NSD can be optimized
for the user specified application parameter settings. In general, the
NSD performance varies based on the application parameter
settings in the following ways:
STF
0
150
Figure 71. Measured vs. Ideal NTF
(FIF = 300 MHz, BW = 80 MHz, FADC = 3.2 GHz, LEXT = 19 nH)
0
–120
–170
RESON3
FREQUENCY (MHz)
Figure 69. Simplified Model of a Σ-Δ ADC Showing Origins of STF and NTF
–20
RESON2
RESON1
12348-021
V(z) =
–150
(dBFS/Hz)
LOOP FILTER
H(s)
+
12348-023
U
AD6676

Figure 70. STF and NTF Shaped Noise of the Σ-Δ ADC
(FIF = 300 MHz, BW = 80 MHz, FADC = 3.2 GHz, LEXT = 19 nH)
Figure 71 focuses on the IF pass band region to compare the
measured vs. ideal shaped noise with the theoretical NSD curve
accounting only for the ideal ADC quantization effect. The
resonator zero locations are highlighted on the theoretical trace
and are recognizable in the measured response. Note that the
region with the lowest NSD performance or the deepest notch is
always centered about the FIF setting. This is because the gain of
RESON1 peaks at FIF and the noise from stages which follow
RESON1 is input referred by dividing by the gain of RESON1.
Rev. D | Page 25 of 90
Operating with a high oversampling ratio (OSR > 20) results
in the lowest and flattest NSD performance. This is because
the resonant frequencies (or zero locations) associated with
RESON1, RESON2, and RESON3 are close together when the
oversampling ratio is high thereby reducing the quantization
noise to the point where thermal noise from the first stage
IDAC1 dominates.
Operating at reduced oversampling ratio (oversampling
ratio < 20) causes the quantization noise contribution to
become more significant, causing humps to appear in the
NSD. Bumpiness in the NSD occurs because the resonant
frequencies associated RESON2 and RESON3 are further
offset from RESON1 to accommodate the increase in BW;
therefore, resulting in less overall loop gain to suppress this
increasingly dominant noise source. The effect of different
oversampling ratios on the NSD is shown in Figure 72.
Operating at a lower FIF while keeping the same oversampling
ratio results in degraded NSD performance at the pass band
edges, as shown in Figure 73.
AD6676
Data Sheet
STF and NTF Repeatability
–130
OSR = 10
(BW = 160MHz)
OSR = 20
(BW = 80MHz)
OSR = 40
(BW = 40MHz)
OSR = 80
(BW = 20MHz)
–140
–145
–150
–160
200
220
240
260
280
300
320
340
360
380
400
FREQUENCY (MHz)
12348-024
–155
Figure 72. NSD vs. Oversampling Ratio (FIF = 300 MHz, FADC = 3.2 GHz, LEXT = 19 nH)
–140
–142
–144
–148
The following application parameters were used to demonstrate
STF and NTF repeatability: fCLK = 3.2 GHz, FIF = 250 MHz, BW =
75 MHz, LEXT = 19 nH, IDAC1FS = 4 mA, MRGN = default.
Figure 74 and Figure 75 demonstrate the repeatability and
temperature stability of the STF and NTF responses of single
devices for five consecutive power-up initialization operations
in which the device is calibrated at 25°C and then allowed to
drift to −40°C and +85°C.
–150
0.2
–152
–154
–160
–100
IF = 100MHz
WITH LEXT = 100nH
IF = 200MHz
WITH LEXT = 43nH
–80
–60
–40
IF = 300MHz
WITH LEXT = 19nH
–20
0
20
40
60
NORMALIZED ZERO IF FREQUENCY (MHz)
80
100
12348-025
–158
Figure 73. NSD at Pass Band Edge Improvement as FIF Is Increased from
100 MHz to 300 MHz with Fixed Oversampling Ratio = 16
(BW = 100 MHz, FADC = 3.2 GHz)
NORMALIZED STF (dBFS)
0
–156
–0.2
–0.4
–0.6
–0.8
–1.0
200
TA = +85°C
TA = +25°C
TA = –40°C
210
220
230
240
250
260
270
280
290
300
FREQUENCY (MHz)
Figure 74. STF Variation over Temperature for a Single Device for Five
Consecutive Power-Up Initialization Operations
–146
TA = +85°C
TA = +25°C
TA = –40°C
–148
–150
NSD (dBFS)
The impact of a uneven NSD profile on a particular application
depends on the bandwidth and modulation characteristics of
the IF signal being digitized and demodulated. For example, a
multimode software defined radio containing narrow-band
carriers situated anywhere across the pass band must consider
the NSD performance at the highest levels across the pass band
because this represents the worst-case NSD when calculating
the in-band noise for a narrow-band signal in this region.
Conversely, a single wideband QAM signal falling at the center of
the IF pass band benefits from excellent in-band noise performance
because the NSD remains the lowest in this region. Note that
the AD6676 specified NF is measured in the region where its
NSD is highest.
12348-700
NOISE (dBFS/Hz)
–146
After the application parameters have been determined, the STF
and NTF characteristics of the AD6676 remain repeatable and
stable over temperature and among devices. The on-chip
calibration performed during the power-up initialization phase
reduces the device-to-device variation that may otherwise exist
due to tolerances associated with the device process or the external
inductor, LEXT. It is worth noting that that the small variation in
STF and NTF that does exist is likely to be less than traditional
receiver solutions employing low oversampling ADCs with
aggressive high order LC antialiasing filters. L and C component
tolerances as well as variation in active device source and load
impedances must be considered in the Monte Carlo analysis.
–152
–154
–156
–158
–160
200
210
220
230
240
250
260
FREQUENCY (MHz)
270
280
290
300
12348-701
NOISE (dBFS/Hz)
–135
Figure 75. NTF Variation over Temperature for a Single Device for Five Consecutive
Power-Up Initialization Operations
Rev. D | Page 26 of 90
Data Sheet
AD6676
Figure 76 to Figure 79 show the measured overload recovery
response for each of the decimation filter modes (DEC_MODE)
when driven by a periodic pulsed CW waveform of 10 ns duration
and 2% duty cycle. The narrow pulse region of the waveform
was set to be only 1 dB higher than the other region with its peak
power adjusted slightly above the overload threshold level
resulting in an occasional overload event.
The AD6676 was configured for FIF = 300 MHz, BW =
100 MHz, and FADC = 3.2 GHz.
The absolute settling response for any decimation factor scales
with fDATA_IQ. For example, the settling time shown in Figure 77
is an additional seven samples at fDATA_IQ = 200 MSPS, thus
the absolute settling time is 35 ns (7 × 1/200 MSPS).
Selecting a decimation factor of 12 or 16 improves the absolute
settling time because it reduces the additive delay caused
by the last stage decimation filter.


LARGE SCALE SETTLING
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
NO OVERLOAD/
RECOVERY
OVERLOAD/
RECOVERY
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.95
95
ZOOM-IN OF LARGE SCALE
SETTLING RESPONSE FOR 1% SETTLING
7 SAMPLES
@ 266.7MSPS
97
99
101
103
105
107
109
111
113
115
SAMPLES
12348-030
Second, to ensure that the ADC does not become stuck in a self
sustaining overload condition, the AD6676 includes the means
to detect overload, reset the Σ-Δ ADC, and quickly return it to
normal operation. An overload condition is declared if more
than five out of eight samples from the quantizer are equal to a
positive or negative full-scale value. After overload is detected,
the internal nodes within the Σ-Δ ADC are reset to their zero
state and the attenuation setting is temporarily increased by
6 dB. The ADC reset is removed after 16 FADC clock cycles and
over the next 48 FADC clock cycles, the attenuation is returned
to its original value. If the input signal is such that an overload
occurs again, this process repeats until the signal falls within
the no overload range of the Σ-Δ ADC. Although the Σ-Δ
ADC produces good data within 64 FADC clock cycles of the
signal falling within the no overload range, the bad data
associated with an overload event must be flushed out of the
decimation filters before the output of the AD6676 is completely
clean of any memory effects.

Figure 76. Comparison of Normalized IQ Magnitude Response for Decimate
by 12 Case When a Pulsed CW Waveform (10 ns Width) Is Just Below and
Above Peak Power Level, Resulting in ADC Overload
LARGE SCALE SETTLING
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
NO OVERLOAD/
RECOVERY
OVERLOAD/
RECOVERY
ZOOM-IN OF LARGE SCALE
SETTLING RESPONSE FOR 1% SETTLING
1.08
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
7 SAMPLES
@ 200MSPS
0
2
4
6
8
10
SAMPLES
12
14
16
18
20
12348-031
First, to make the no overload range with continuous wave
tones approach levels near 0 dBFS, the AD6676 uses a 5-bit
quantizer. The AD6676 is specified to remain unconditionally
stable for continuous wave levels below −2 dBFS over its full
operation range, with a typical overload level of −0.5 dBFS. In
practice, the large signal waveform characteristics that determine
the occurrence and duration of its peaks affect the overload
threshold. A continuous wave tone is close to the worst-case
scenario for overload because the peak levels have the highest
probability of occurrence. Alternatively, a signal that has a much
higher crest factor and a more Gaussian-like histogram is less
likely to cause overload due to the short duration of its peak
excursions. For this reason, for systems employing AGC, consider
the waveform characteristics when setting the AGC threshold.
Note the following:
NORMALIZED IQ MAGNITUDE RESPONSE
The Σ-Δ ADC is a sixth-order modulator employing negative
feedback to reduce the noise contribution of its internal quantizer.
Like any ADC, the quantizer is driven into overload under large
signal conditions, causing its output to be a poor representation
of its input. However, unlike traditional ADCs that operate in
open-loop, a Σ-Δ ADC can be driven into overload with signals
slightly below its 0 dBFS full-scale input level and the feedback
loop can become unstable and may not return to normal operation
when the overload condition is removed. A typical unstable Σ-Δ
ADC produces a digital output that varies between plus or minus
full scale. The AD6676 employs several techniques to solve
these problems.
Each plot compares the envelope response between a pulse that
results in an overload event to a pulse where the Σ-Δ ADC remains
stable and includes a zoom in region showing settling time to
within 1% following the large scale settling plot. Because the
phase response recovers two to three samples before the
envelope response, the phase response is not shown.
NORMALIZED IQ MAGNITUDE RESPONSE
Σ-Δ ADC Overload and Recovery
Figure 77. Comparison of Normalized IQ Magnitude Response for Decimate
by 16 Case When a Pulsed CW Waveform (10 ns Width) Is Just Below and
Above Peak Power Level, Resulting in ADC Overload
Rev. D | Page 27 of 90
AD6676
Data Sheet
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.95
Ultimately, the maximum feedback signal current that can be
generated by IDAC1 is limited by its full-scale setting, IDAC1FS,
thus setting the 0 dBFS level on which feedback can no longer
cancel any further increase in input signal level (or power). For
example, the AD6676 nominal setting for IDAC1FS at 4 mA
equates to a PIN_0dBFS of −3 dBm, resulting in a differential
voltage swing of ±240 mV peak.
NO OVERLOAD/
RECOVERY
OVERLOAD/
RECOVERY
ZOOM-IN OF LARGE SCALE
SETTLING RESPONSE FOR 1% SETTLING
6 SAMPLES
@ 266.7MSPS
0
2
4
6
8
10
Equation 2 assumes that the attenuator setting is 0 dB. Any
setting beyond 0 dB increases the effective PIN_0dBFS measured at
the input of the attenuator by an amount equal to the attenuator
setting.
12
14
16
18
20
SAMPLES
12348-032
NORMALIZED IQ MAGNITUDE RESPONSE
LARGE SCALE SETTLING
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
LARGE SCALE SETTLING
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
The range of permissible values for LEXT depends on the following
application parameters: FIF, FADC, and IDAC1FS. Figure 80 shows
the upper and lower settings (LMAX and LMIN) when IDAC1FS is
set to its default settings of 4 mA. Note that the LMAX limit is set
by the largest voltage swing across the LC tank and the LMIN
limit is set by the maximum tuning capacitance available from
an internal capacitor array.
NO OVERLOAD/
RECOVERY
OVERLOAD/
RECOVERY
ZOOM-IN OF LARGE SCALE
SETTLING RESPONSE FOR 1% SETTLING
200
ABSOLUTE MAXIMUM
MAXIMUM FOR FADC = 3.2GHz
MAXIMUM FOR FADC = 2.6GHz
MAXIMUM FOR FADC = 2.0GHz
MINIMUM
5 SAMPLES
@ 100MSPS
100
0
2
4
6
8
10
12
14
16
18
20
SAMPLES
LEXT (nH)
1.08
1.07
1.06
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
LEXT Selection
12348-033
NORMALIZED IQ MAGNITUDE RESPONSE
Figure 78. Comparison of Normalized IQ Magnitude Response for Decimate
by 24 Case When a Pulsed CW Waveform (10 ns Width) Is Just Below and
Above Peak Power Level, Resulting in ADC Overload
In practice, the actual measured PIN_0dBFS may vary a few tenths
of a decibel for different application parameter settings due to some
amount of pass band tilt. For this reason, PIN_0dBFS is defined at
the IF center.
20
Figure 79. Comparison of Normalized IQ Magnitude Response for Decimate
by 32 Case When a Pulsed CW Waveform (10 ns Width) Is Just Below and
Above Peak Power Level, Resulting in ADC Overload
15
10
Maximum Input Power (PIN_0dBFS and IDAC1FS)
5
The AD6676 maximum full-scale input power (PIN_0dBFS) for
a sinusoidal input signal is dependent on the IDAC1 peak fullscale output current (IDAC1FS) and the RIN of the attenuator
(that is, 60 Ω) as shown in the equation below.
PIN_0dBFS = 10 × log10(1/2 × RIN × IDAC1FS2)
(2)
The derivation of this equation becomes apparent when
considering the AD6676 input stage consisting of RESON1,
IDAC1, and RIN, as shown in Figure 68. RIN is the input resistance
of the attenuator. The cascode transistor associated with IDAC1
and RIN establishes a low impedance node serving as a current
mode summing junction whereby the input signal (equal to
VIN±/RIN) is compared to the feedback signal from IDAC1.
Note that the feedback loop of the Σ-Δ modulator attempts to
generate an equal but opposite feedback current to cancel the
signal current appearing at this summing junction.
0
50
100
150
200
250
300
350
FIF (MHz)
400
450
500
12348-034
Σ-Δ ADC CONFIGURATION CONSIDERATIONS
Figure 80. Maximum External Inductor Value as a Function of IF Frequency
and Clock Rate for IDAC1FS = 4 mA
Note the following points when selecting LEXT:


Rev. D | Page 28 of 90
Larger values of LEXT result in larger voltage swings across
the LC tank. Selecting a value that is approximately 55% to
80% of the LMAX value can be considered with a lower value,
typically resulting in improved IMD performance due to
reduced voltage swing across the inductor. Conversely, a
higher value may lead to a slight improvement in noise
performance (mostly near the IF center), but at the expense
of IMD performance.
Inductor accuracy of 10% is sufficient because it falls well
within the calibration range of the AD6676 during its
initialization phase on power-up.
Data Sheet

–145
IDAC1 FS = 1mA, LEXT = 39nH
(IBN = –67.9dBFS)
IDAC1 FS = 2mA, LEXT = 39nH
(IBN = –72.5dBFS)
The following example highlights how LEXT can be determined
with the following application parameters: FIF = 150 MHz, FADC =
3.0 GHz and IDAC1FS = 4 mA. Referring to Figure 80, the LMAX
and LMIN range is from 20 nH to 70 nH. A value of 43 nH
represents 61% of LMAX and thus is suitable. Note that if the
IDAC1FS is reduced to 2 mA, this value can be increased to
86 nH because this value is below the absolute maximum.
Reduced PIN_0dBFS Operation via Scaling IDAC1FS
–160
250
280
290
300
310
320
330
340
350
–80
IDAC1 FS = 1mA
(39nH)
–82
–84
–86
IDAC1 FS = 2mA
(39nH)
–88
–90
–92
–94
IDAC1 FS = 4mA
(19nH)
–96
–98
250
(4)
260
270
280
290
300
310
320
330
340
350
FREQUENCY (MHz)
where IDAC1_FS is the decimal equivalent of the value in
Register 0x10A.
Figure 82. Swept Dual-Tone IMD vs. IDAC1FS Setting with Decimate by 16, I/Q
Output, Dual Tones Set to −8 dBFS (IF = 300 MHz, BW = 100 MHz, FADC = 3.2 GHz)
The LEXT value can be increased proportionally to any reduction
in IDAC1FS to maintain similar voltage swings across the LC tank.
With an IF of 300 MHz, the absolute maximum inductor is
39 nH; therefore, this inductor value is selected for both
IDAC1FS = 2.0 mA and 1.0 mA.
Reducing IDAC1FS from 4.0 mA to 2.0 mA and doubling
LEXT lowers the PIN_0dBFS by 6 dB but increases the
average in-band noise, IBN, by only 1.8 dB. The noise
figure of the ADC therefore improves by 4.2 dB.
Reducing IDAC1FS from 2.0 mA to 1.0 mA lowers the ADC
full scale by a further 6 dB and increases the average inband noise by only 4.6 dB. In this case, the noise figure
improvement is a modest 1.4 dB.
0.5
NORMALIZED STF RESPONSE (dBFS)
The NSD and IMD performance are shown in Figure 81 and
Figure 82 for IDAC1FS settings of 4.0 mA, 2.0 mA, and 1.0 mA.
Figure 83 shows the STF response for each of these cases. Note
the following observations from this example:

270
Figure 81. NSD vs. IDAC1FS Setting with Decimate by 16, I/Q Output (IF =
300 MHz, BW = 100 MHz, FADC = 3.2 GHz)
The PIN_0dBFS can be reduced by up to 12 dB because IDAC1FS is
adjustable over a 4 mA to 1 mA span as defined by Equation 4.

260
IDAC1 FS = 4mA, LEXT = 19nH
(IBN = –74.3dBFS)
INPUT FREQUENCY (MHz)
WORST IMD SPUR (dBFS)
Tie the two external inductors, LEXT, to the VDD2 supply via a
10 Ω resistor that includes a 0.1 μF decoupling capacitor, as
shown in Figure 93.

–155
(3)
The minimum capacitance contribution of the array can be up to
6.6 pF due to ±20 process variation. An additional 0.5 pF of PCB
parasitic capacitance is also included, thus a value of 7.1 pF is used.
IDAC1FS = 4 mA × (IDAC1_FS/64)
–150
12348-035
LMAX_TUNE = ((2π × FIF) × 7.1 pF)
−1
The swept IMD performance shows a degradation at
reduced IDAC1FS settings.
The STF response remains largely unaffected by reduced
IDAC1FS settings.
12348-036
2

0.4
0.3
0.2
IDAC1FS = 1mA
(39nH)
0.1
0
–0.1
IDAC1 FS = 2mA
(39nH)
–0.2
–0.3
–0.4
–0.5
250
IDAC1 FS = 4mA
(19nH)
260
270
280
290
300
310
FREQUENCY (MHz)
320
330
340
350
12348-037

Surface mount inductors can be either wire-wound or
multilayer. The lower cost multilayer inductors typically
have quality factors below 20 that may have a slight impact
on the AD6676 NSD performance. Compare performance
between the two inductor types before making a decision to
select a lower cost multilayer type.
Because the voltage swing across the LC tank scales
proportionally with IDAC1FS, which sets PIN_0dBFS, a
reduction in IDAC1FS allows an inversely proportional
increase of LEXT to maintain a similar voltage swing. Note
that the minimum tuning capacitance from the internal
capacitor array along with any parasitic PCB capacitance
sets largest the LEXT as defined in Equation 3.
NSD (dBFS/Hz)

AD6676
Figure 83. STF vs. IDAC1FS Setting with Decimate by 16, I/Q Output, Dual
Tones Set to −8 dBFS (IF = 300 MHz, BW = 100 MHz, FADC = 3.2 GHz)
Rev. D | Page 29 of 90
AD6676
Data Sheet
Some applications may benefit from a reduced IDAC1FS setting
because a reduction in the PIN_0dBFS levels results in a decibel
per decibel reduction in the gain and linearity (P1dB, IIP3)
requirements of the front-end driver. This enables a lower
power RF line-up with the possibility of 3.3 V operations.
Alternatively, it can allow a greater IF AGC operation range
from the AD6676 when the previous stages output (P1dB) level
is set by its power supply setting. Carefully evaluate the tradeoff in the ac performance of the AD6676 when deciding to
operate at reduced IDAC1FS settings.
Table 8. Resonator Frequencies vs. MRGN Settings
(FADC = 3.2 GHz, FIF = 300 MHz, BW = 160 MHz)
MRGN_L
5
10
15
8
MRGN_U
5
10
15
16
MRGN_IF
0
0
0
2
RESON2
(MHz)
233
229
227
230
RESON1
(MHz)
298
299
298
306
RESON3
(MHz)
365
370
373
374
–140
MRGN = [15 15 0]
Using the MRGN Parameter to Optimize NTF
–150
–155
220
240
260
280
300
320
340
360
380
INPUT FREQUENCY (MHz)
12348-038
MRGN = [5 5 0]
Figure 84. NSD Performance for MRGN Settings Shown in Table 8
Maintaining a flat STF across the pass band is also desirable
when modifying the MRGN settings. Figure 84 shows how each
of the different MRGN settings affects the STF. Note that the
asymmetrical MRGN setting of [8 16 2] results in an STF that is
slightly skewed above IF center but still maintains ±0.5 dB flatness.
0.25
MRGN = [5 5 0]
0
–0.25
–0.50
MRGN = [10 10 2]
–0.75
MRGN = [15 15 2]
MRGN = [8 16 2]
–1.00
–1.25
220
240
260
280
300
320
340
360
FREQUENCY (MHz)
380
12348-039
The following example using a low oversampling ratio of 10
highlights the effects of the MRGN parameters on the NTF and
STF. In this example, the goal is to optimize the worst-case NSD
performance across a 160 MHz pass band region with FADC =
3.2 GHz and IF = 300 MHz while trying to preserve a flat STF.
Figure 84 shows the corresponding NTF performance for different
MRGN settings, and Table 8 lists the resonant frequencies of
RESON1, RESON3, and RESON3 that pertain to these settings.
Note that the default setting of [5 5 0] results in the upper half of
the pass band having the worst NSD (−141 dBFS/Hz at 380 MHz).
Symmetrical MRGN settings of [10 10 0] and [15 15 0] are shown
to highlight how the NTF varies as only the resonant frequencies
of RESON2 and RESON3 are increasingly offset symmetrically
about the IF center of 300 MHz. To improve on the default setting
of [5 5 0], an asymmetrical setting of [8 16 2] that is weighted
towards the upper half of the pass band region was found to
achieve a more distributed worst-case NSD of −145 dBFS/Hz.
–145
MRGN = [8 16 2]
NORMALIZED STF RESPONSE (dBFS)
The MRGN_L, MRGN_U, and MRGN_IF parameters are
located in Register 0x107 through Register 0x109. MRGN_L
and MRGN_U specify the number of megahertz by which the
lower and upper edges of the target pass band are extended,
whereas MRGN_IF specifies the resonance frequency offset of
RESON1 from the center of the target pass band. The maximum
setting in these registers must be in the range of 10 MHz to
20 MHz because higher offset settings can adversely affect the
STF. The MRGN parameter is represented as an array equal to
[MRGN_L, MRGN_U, MRGN_IF].
NSD (dBFS/Hz)
MRGN = [10 10 0]
The MRGN application parameters provide an additional degree
of freedom when trying to optimize the NTF for a particular
application. This feature is particularly useful when the AD6676
operates with a low oversampling ratio where the quantization
noise contribution begins to limit the NSD performance. In such
cases, the default MRGN settings may not be adequate, resulting
in regions of the pass band (typically at the edges) where the
worst-case NSD is higher than in other regions. For these cases,
the NTF can be optimized by adjusting the Σ-Δ ADC resonator
frequencies in such a way that that result in a more optimally
distributed NSD over the entire pass band.
Figure 85. STF for Four Different MRGN Settings
Whereas the previous example represents an extreme case, other
cases having higher oversampling ratio can also potentially benefit
from optimization. After the values of fCLK, IF, and BW have been
determined for a particular application, it may be advantageous
to explore whether a different MRGN setting yields any
improvement. It is important to note that this sort of
optimization is based on an iterative trial and error method.
However, after the MRGN setting has been determined, both
the STF and NTF remain repeatable.
Rev. D | Page 30 of 90
Data Sheet
AD6676
Σ-Δ ADC Adaptive Shuffler
Table 9. Default SPI Register Settings for Adaptive Shuffling
The AD6676 includes a programmable adaptive shuffler that
improves the SFDR and IMD performance of the Σ-Δ ADC
under large signal conditions. As shown in Figure 68, the adaptive
shuffler randomizes the selection of the unit elements used by
the feedback DACs to reconstruct the output signal of the
quantizer. Both static and dynamic mismatch errors associated
with the quantizer and feedback DACs are dithered such that
the spurious contribution is spread across a wider frequency
span. Figure 86 compares the improved IMD performance for a
two tone excitation when the shuffler is enabled and disabled.
Shuffling Rate
FADC
FADC/2
FADC/3
FADC/4
Disable shuffler
AMPLITUDE (dBFS)
0
ADAPTIVE SHUFFLING
DISABLED
–20
–40
–60
–80
–100
–120
Register 0x342
0xF5
0x5F
0xFF
0xFF
0xFF
Register 0x343
0xFF
0xFF
0xF5
0x5F
0xFF
Table 10. Threshold Setting Values that Trigger the Shuffler
for a Continuous Wave Tone
PIN (dBFS)
−3
−5
−7
−10
−14
−20
Threshold Setting
8
7
6
5
4
3
ADAPTIVE SHUFFLING ENABLED
SHUFFLE EVERY
ONE ADC CLOCK CYCLE
(0x342 = 0xF5, 0x343 = 0xFF)
–40
–60
–80
–100
–120
140
150
160
170
180
190
FREQUENCY (MHz)
200
210
220
12348-040
AMPLITUDE (dBFS)
0
–20
Figure 86. IMD Performance when Shuffler Is Disabled vs. Enabled for Two
CW Tones at −8 dBFS, (FIF = 180 MHz, BW = 80 MHz, FADC = 3.2 GHz, LEXT = 43 nH)
Although the shuffler improves the SFDR and IMD performance,
it does so at the expense of the in-band NSD performance. For
this reason, both the degree of shuffling as well as the enabling
threshold relative to the quantizer output code is user programmable,
allowing optimization for a target application. The shuffling rate
is variable from 1 to 4 ADC clock cycles (1/FADC). The shuffler
remains enabled for a fixed amount of clock cycles from the
instant that the input signal falls below this threshold and
remains below it.
The enabling threshold is relative to the quantizer code and
represents the peak absolute value that triggers the shuffler. The
quantizer can produce an output code ranging from −8 to +8,
therefore the threshold can assume a value between 0 to 8. The
4-bit value is set via Register 0x342 or Register 0x343. A
hexadecimal value of 0x0 sets the shuffler to always enabled
whereas a value of 0xF effectively disables the shuffler.
The 4-bit fields in Register 0x342 and Register 0x343 set the
threshold value based on the shuffling rate selected. Set only the
4-bit field pertaining to the selected shuffling rate while the
remaining nonapplicable 4-bit fields set to 0xF. Disable the shuffler
by setting all the 4-bit fields to 0xF, the highest threshold setting.
Table 9 shows the SPI register settings for the various shuffling
modes when the threshold is set to its default setting of 5. Other
threshold values ranging from 3 to 8 are also possible. Table 10
shows the input power level that triggers the shuffler for different
threshold value settings when driven by a continuous wave tone.
When enabled, the shuffler can introduce colored noise into the
pass band spectrum. This additional noise is a result of the
increased switching activity within the Σ-Δ ADC core along
with the pseudorandom element selection process, thus resulting
in signal level dependent colored noise at frequency offsets related
to the shuffling rate. Figure 87 highlights the effect of the colored
noise between shuffle every four clock cycles vs. one cycle with
and without a large signal continuous wave tone present and the
shuffling threshold set to 0.
Typically, the shuffling threshold is set in the range of 4 to 6. This
example serves to highlight the colored noise effects of shuffling.
Selecting a higher threshold setting is preferable when trying to
preserve the NSD performance. For this reason, the AD6676
default threshold setting is 5 with the shuffle every clock cycle
option.
The four-cycle option introduces visible noise humps with a
−1 dBFS signal level. This colored noise is at an offset of
fCLK/128, resulting from the pseudorandom element selection
process. Other shuffling options also introduce colored noise
but at a greater frequency offset that are related to the shuffling
rate factor (SRF) as described by the following equation:
Frequency Offset = fCLK/(32 × SRF)
(5)
The effect of this colored noise is worthy of consideration when
selecting the shuffling rate and threshold. For example, sweeping
a −1 dBFS continuous wave tone across the usable IF pass band
region while monitoring the NSD characteristics is helpful to
identify what shuffling rate may have the least impact on the
NSD performance.
Rev. D | Page 31 of 90
AD6676
Data Sheet
–140
–74
SHUFFLE EVERY 1 ADC CYCLE
IBN = –75.5dBFS
SHUFFLE EVERY 4 ADC CYCLES
IBN = –76.3dBFS
SHUFFLE DISABLED
IBN = –77.4dBFS
–142
–144
SHUFFLING EVERY 1 ADC CYCLE
–75
SHUFFLING EVERY 2 ADC CYCLES
–76
–148
IBN (dBFS)
NOISE (dBFS/Hz)
–146
–150
–152
–77
SHUFFLING EVERY 4 ADC CYCLES
–78
–154
SHUFFLING EVERY 3 ADC CYCLES
SHUFFLING DISABLED
–156
–79
150
160
170
180
190
200
210
220
INPUT FREQUENCY (MHz)
Figure 87. NSD Performance of the Various Shuffling Settings with No Signal;
Threshold Set to 0 (Shuffler Is Always Enabled); FIF = 180 MHz, BW = 80 MHz,
FADC = 3.2 GHz, LEXT = 43 nH
–140
–142
SHUFFLE DISABLED
IBN = –74.6dBFS
–800
–40
12348-094
–160
140
–30
–20
–15
–10
–5
0
Figure 89. Pass Band Degradation in IBN (dBFS) as a Continuous Wave Tone
at 225 MHz, Swept from −40 dBFS to −1 dBFS with Different Shuffling Rate
Settings, Threshold Set to 0, FIF = 180 MHz, BW = 80 MHz,
FADC = 3.2 GHz, LEXT = 43 nH
–74
–75
SHUFFLING EVERY 2 ADC CYCLES
THRESHOLD = 4
–146
–148
–76
IBN (dBFS)
NOISE (dBFS/Hz)
–25
INPUT POWER (dBFS)
SHUFFLE EVERY
1 ADC CYCLE
IBN = –73.6dBFS
SHUFFLE EVERY
4 ADC CYCLES
IBN = –74.0dBFS
–144
–35
12348-042
–158
–150
–152
–154
SHUFFLING EVERY 2 ADC CYCLES
THRESHOLD = 5
–77
–78
–156
SHUFFLING DISABLED
–158
150
160
170
180
190
INPUT FREQUENCY (MHz)
200
210
220
Figure 88. NSD Performance of the Various Shuffling Settings with a −1 dBFS
Signal; Threshold Set to 0 (Shuffler Is Always Enabled); FIF = 180 MHz, BW =
80 MHz, FADC = 3.2 GHz, LEXT = 43 nH
The degradation in NSD performance is also dependent on the
input signals amplitude; thus, it is important to select a shuffling
rate and threshold setting that result in an optimum trade-off
between large signal linearity performance and low signal level
in-band noise performance. Figure 89 shows how the in-band
noise (dBFS) degrades at increasing signal levels for the same
settings used in Figure 87. In this example, a continuous wave
tone is placed just above the pass band with its power swept
from −40 dBFS to −1 dBFS. At low signal levels (less than
−20 dBFS), the degradation in in-band noise performance is
dependent on the shuffling rate. At higher signal levels (greater
than−20 dBFS), the degradation is a result of increased colored
noise falling in the pass band. Selecting a shuffle rate of every
two ADC cycles with a threshold in the range of 4 or 5 is a good
compromise, as shown in Figure 90.
–80
–40
–35
–30
–25
–20
–15
INPUT POWER (dBFS)
–10
–5
0
12348-043
–79
12348-041
–160
140
Figure 90. IBN vs. Input Power Performance for Threshold Settings of 4 and 5
When Configured for Shuffle Every Two ADC Cycles
After a particular shuffling configuration is selected, the effects
on the Σ-Δ ADC performance remain repeatable over time and
among different devices
Σ-Δ ADC Profile Feature
The AD6676 includes a feature that allows the Σ-Δ ADC to
store up to four different profile settings that can be recalled
quickly via Register 0x118 without recalibrating the Σ-Δ ADC.
Calibration of each of the different profiles specified in
Register 0x115 occurs during the device initialization phase
with each profile consisting of the following various application
parameters: BW, FIF, IDAC1FS, and MRGN. FADC, along with the
decimation filter and JESD204B settings, remains common to
ensure that the JESD204B link is maintained when switching
between profile settings. Note that the Σ-Δ ADC is operational
with the updated profile settings within 1 μs upon receipt of the
SPI command.
Rev. D | Page 32 of 90
Data Sheet
AD6676
The following example highlights how this feature is used for
applications that require wide bandwidth capability but not
necessarily instantaneous bandwidth. In these applications, it
may be possible to divide the required IF bandwidth into
narrow subbands where the Σ-Δ ADC can provide higher
dynamic range. For instance, in an application that requires
120 MHz of IF bandwidth, consider dividing this bandwidth
into three contiguous blocks of 40 MHz, with each IF being
offset by 40 MHz. Figure 91 shows that the worst-case NSD is
limited to −149 dBFS/Hz when the AD6676 is configured for the
wider bandwidth of 120 MHz. Figure 92 shows how the NSD
performance is improved by 10 dB when the 120 MHz
bandwidth is subdivided into three 40 MHz bands.
The AD6676 includes an on-chip differential 27 dB attenuator with
a resolution of 1 dB. The attenuator can be used to rescale the fullscale input level into the ADC for system calibration or for
optimization purposes or to prevent possible overload of the Σ-Δ
ADC when used with external AGC control. Figure 93 shows a
simplified equivalent circuit of the AD6676 input stage, which
includes RESON1 and IDAC1. The attenuator provides a
nominal input resistance (RIN) of 60 Ω to the signal source to
facilitate its interface to external driver circuitry. The attenuator is
configurable via Register 0x181 to Register 0x183 and includes
options for fast external gain control via the AGC pins. Note that
the latency from when an external CMOS signal is applied to the
AGC pins to when the attenuator changes state is within 5 ns.
10Ω
0.1µF
–149dBFS/Hz
–150
LEXT
L–
AD6676
–155
CARRAY
PROFILE = 0
(IF = 260MHz, BW = 120MHz)
220
240
260
280
300
RIN = 60Ω
VCM = 1.0V
320
INPUT FREQUENCY (MHz)
VIN–
REG 0x180
TO 0x181
PROFILE = 2
(IF = 300MHz,
BW = 40MHz)
PROFILE = 1
(IF = 260MHz,
BW = 40MHz)
SUMMING
JUNCTION
VIN+
Figure 91. NSD Performance with Wideband Profile (FIF = 260 MHz, BW =
120 MHz, FADC = 3.2 GHz, LEXT = 27 nH)
–145
ATTENUATOR
0dB TO 27dB
∆ = 1dB
IDAC1
AC
DC
12348-044
–160
200
Figure 93. Simplified Equivalent Input
–150
PROFILE = 0
(IF = 220MHz,
BW = 40MHz)
–155
–159dBFS/Hz
–160
200
220
240
260
280
INPUT FREQUENCY (MHz)
300
320
12348-101
NOISE SPECTRAL DENSITY (dBFS/Hz)
VDD2 = 2.5V
LEXT
L+
12348-100
NOISE SPECTRAL DENSITY (dBFS/Hz)
–145
ATTENUATOR
Figure 92. NSD Performance with Narrow-Band Profiles (FIF = 220 MHz,
260 MHz, and 300 MHz, BW = 120 MHz, FADC = 3.2 GHz, LEXT = 27 nH)
In this example, the frequency and phase settings of the digital
mixer remained common among the various profiles such that
it remained centered upon 260 MHz. It is also possible to
provide a unique digital mixer setting for each profile if it is
desirable to re-center the digital IF frequency. This feature is
desirable in instances where the range of IFs cannot be supported
by the pass band response of the digital decimation filter.
Attenuation is achieved by a programmable shunt and series
resistor network that steers some designated amount of input
current away from the summing junction while keeping the
nominal input resistance near 60 Ω over the full attenuation
span. For a 0 dB setting, no shunt resistance exists; therefore,
all of the input current is fed into the summing junction. For a
6 dB setting, the attenuator is configured with a 120 Ω shunt
resistor operating in parallel with two 60 Ω series resistors such
that half of the signal input current is directed into the summing
junction while maintaining a nominal 60 Ω input resistance.
Other settings function in a similar manner with resistor values
modified to achieve the desired attenuation value while
maintaining the nominal RIN. Figure 94 shows the differential
S11 of the AD6676 input for different attenuator settings.
Rev. D | Page 33 of 90
AD6676
Data Sheet
Note the following conditions and observations:
0dB
2dB
4dB
6dB
8dB
10dB
12dB
14dB
–12
–14
–18
The AD6676 is configured as follows: IF = 180 MHz, BW =
80 MHz, and fCLK = 3.2 GHz. Tones are situated at 177.5 MHz
and 182.5 MHz.
The PIN_0dBFS level is reduced by 6 dB when IDAC1FS is
reduced to 2 mA.
The IMD performance remains below −80 dBc until an
attenuator setting of 9 dB.
Further increases in the two-tone power lead to a
corresponding steady decline in the IMD performance due
to the nonlinearity of the attenuator.
Although not shown, the NSD performance centered about
the IF improves a few dB with increased attenuation.

–20

–22

–24
–26
–30
0
100
200
300
400
500
600
700
800
900
1000
FREQUENCY (MHz)
12348-702
–28

17
Figure 94. Differential S11 vs. Frequency for Different Attenuator Settings
0.10
+85°C
+25°C
–40°C
0.08
14
11
PIN_0dBFS (dBm)
The accuracy of the attenuator is an important consideration in
applications implementing AGC or system calibration. The
attenuator remains monotonic over its full operating range.
Figure 95, which shows a typical devices attenuation error vs.
attenuation state at −40°C, +25°C, and +85°C, demonstrates the
near instrumentation level accuracy of the AD6676 attenuator.
STEP SIZE ERROR (dB)
0.06
0
PIN_0dBFS_IDAC1FS = 2mA
PIN_0dBFS_IDAC = 4mA
IMD_IDAC1FS = 4mA
IMD_ IDAC1FS = 2mA
–10
–20
8
–30
5
–40
2
–50
–1
–60
–4
–70
–7
–80
0.04
–10
0.02
3
6
9
12
15
18
–90
21
ATTENUATOR SETTING (dB)
0
Figure 96. IMD Component Degradation as Two-Tone Centered at an IF of
180 MHz Is Increased 1 dB for Every 1 dB Increase in Attenuator Setting, Such
That Two-Tone Level Remains at −8 dBFS
–0.02
–0.04
–0.06
0
3
6
9
12
15
18
ATTENUATOR SETTING (dB)
21
24
27
12348-046
–0.08
–0.10
0
12348-047
S11 (dB)
–16

WORST IMD (dBc)
–10
Figure 95. Typical Attenuation Step Size Error vs. Setting over Temperature
The linearity performance of the attenuator is another
consideration when determining the largest input drive levels
before its nonlinearity may dominate over that of the Σ-Δ ADC.
The effective PIN_0dFS level of the AD6676 is increased decibelper-decibel by the attenuator setting. At large attenuator settings,
the peak-to-peak voltage swing seen at the VIN+ and VIN− pins
increases as well as the current that is steered into the attenuator
shunt resistance. At a certain level, the IMD contribution from
the attenuator begins to dominate over the Σ-Δ ADC contribution.
Figure 96 plots the worst third-order IMD spurious vs. attenuator
setting for IDAC1FS of 4 mA and 2 mA with the power of the
dual tones increased to maintain a constant −8 dBFS level
measured by the Σ-Δ ADC. The effective PIN_0dBFS is also
plotted to show the maximum continuous wave signal level
into the device that results in a 0 dBFS level.
The effects of switching transients are another important
consideration for AGC implementations that digitally calibrate
gain changes in the signal path of the receiver that can otherwise
degrade the demodulation of the desired signals.
Figure 97 and Figure 98 show the IQ envelope response when
the attenuator state is switched between 0 dB and 6 dB via an
external control signal using the AGC2 input pin at a rate of
3.3 MHz. Note that the settling response is dominated by the
response of the digital filter (decimate by 12) and shows no
signs of glitch.
Rev. D | Page 34 of 90
Data Sheet
AD6676
CLOCK SYNTHESIZER
The AD6676 includes an on-chip clock synthesizer capable of
generating the clock for the Σ-Δ ADC and digital circuitry. The
entire synthesizer is integrated on-chip, including the loop filter
and VCO. Figure 99 shows a functional block diagram of the
various synthesizer subblocks along with the relevant SPI registers.
The clock synthesizer uses a standard integer-N architecture to
generate a 2.94 GHz to 3.2 GHz ADC clock from a 10 MHz to
320 MHz reference input.
0.75
0.50
0.25
0
40
60
80
100
120
140
160
SAMPLE
12348-048
NORMALIZED I/Q MAGNITUDE (dB)
1.00
Figure 97. Wide Envelope Response for 6 dB Attenuator Step Change with
fDATA_IQ = 250 MSPS, Resulting Sample Period of 4 ns
Note that if the clock synthesizer is used to supply the ADC clock,
the clock synthesizer must be configured first, before any other
blocks are enabled. Also note that because the clock synthesizer
sequence involves calibrations, wait intervals or polling loops
are needed to ensure that each calibration step completes before
issuing the next SPI command. Table 27 lists an example SPI
sequence for a particular case where the reference frequency (fCLK)
and ADC clock rate (FADC) are 200 MHz and FADC = 3200 MHz,
respectively. The remainder of this section describes the
configuration of the clock synthesizer in detail.
0.75
0.50
0.25
0
32
33
34
35
36
37
38
39
40
41
42
43
SAMPLE
12348-049
NORMALIZED I/Q MAGNITUDE (dB)
1.00
Configuring the clock synthesizer requires numerous SPI
commands to program settings and to initiate calibrations. The
SPI sequence to configure the AD6676 for a particular operating
mode, including the SPI operations associated with the clock
synthesizer, is most easily obtained from the software tool that
comes with the AD6676EBZ development platform. This tool
allows the SPI sequence used to configure the AD6676 to be
saved to a file for later use.
Figure 98. Zoom In Envelope Response for 6 dB Attenuator Step Change with
fDATA_IQ = 250 MSPS, Resulting Sample Period of 4 ns
VDDQ
VDDQ
fPFD =
10MHz TO 80MHz
CHARGE PUMP
REG 0x2AC
REG 0x2AD
REG 0x2BC
R-DIVIDER
÷2
VCO
5.9GHz TO 8.0GHz
REG 0x2AA
REG 0x2B7
DIRECT RF
CLK OPTION
UP
÷2
DN
INTEGRATED
LOOP FILTER
REG 0x2BB
TO Σ-∆ ADC
AND DIGITAL
REG 0x2A5
INITIAL CAL
AUTOMATIC
LEVEL
CONTROL
CAL
VDDQ
REG 0x2AB
REG 0x2BC
N COUNTER
REG 0x2A1 (LSB)
REG 0x2A2 (MSB)
Figure 99. CLK Synthesizer Block Diagram
Rev. D | Page 35 of 90
12348-050
÷4
×2
PFD
CLK = 10MHz
TO 320MHz
VDDC
ENABLE CLK SYN
REG 0x2AO
AD6676
Data Sheet
R and N Dividers
VCO Configuration and Calibration
The phase/frequency detector (PFD) requires a 10 MHz to 80 MHz
clock. When fCLK = 200 MHz, the R divider must be set to divide by
4 so that fPFD = fCLK/RDIV = 50 MHz, which is within the supported
range. Table 11 shows the mapping from RDIV to the value of
Register 0x2BB. This register is set in Step 6 of Table 27.
VCO configuration consists of writing to the SPI registers in
Table 12 that control the VCO core bias, temperature compensation,
and varactor settings. These settings depend on the VCO
frequency and are optimized via characterization to ensure
proper operation of the PLL over supply and temperature.
Table 11. R Divider Settings for Register 0x2BB
Table 12. VCO Configuration Settings vs. FADC
RDIV
1
2
4
0.5
FADC (MHz)
2940 to 2950
2950 to 3100
3100 to 32001
Register 0x2BB [7:6]
0b00
0b01
0b10
0b11
1.
Note that operating with the highest permissible fPFD minimizes
the clock synthesizer reference spur because the PLL filter
bandwidth is fixed at 200 kHz. For a sinusoidal clock input
signal that has a limited input slew rate, operation with an input
frequency that is 2× or 4× the desired fPFD can also result in a
slight improvement in phase noise performance.
Because the ADC clock is obtained by dividing the VCO clock
by 2, the N-divider must be set according to
N = 2FADC/fPFD =2 × 3.2 GHz/50 MHz =128 = 0x80
The value of N is programmed by writing the LSB (0x80) to
Register 0x2A1 and the MSB (0x00) to Register 0x2A2 and is set
in Step 1 of Table 27.
The VCO also must be calibrated during the clock synthesizer
initialization phase to ensure proper operation over its full
temperature range. VCO calibration is triggered via
Register 0x2AB with the amount of time required to complete
the calibration again being inversely proportional to the PFD
frequency. Specifically, fPFD = 10 MHz requires a 2 ms wait
period whereas fPFD = 80 MHz decreases the wait period by a
factor of 8 to 0.25 ms. Alternatively, poll Bit 1 of Register 0x2BC;
VCO calibration is complete when this bit is clear.
After the initialization process is complete, verify that Bit 3 of
Register 0x2BC is set to confirm that the PLL is locked.
The charge pump current setting (Register 0x2AC) is given by
1.33  1028
 1))
f PFD  FADC 2
Register 0x2B7
0xF0
0xE0
0xD0
Operation at 3200 MHz requires the following modification to the KVCO and
charge pump resistor settings: Register 0x2A9 = 0x2A and Register 0x2AC =
0x12.
Charge Pump Current and Calibration
I CP  round(min(63,
Register 0x2AA
0x37
0x37
0x37
(6)
For the FADC and fPFD values used in this example, ICP evaluates
to 25, or 0x19; this value is programmed in Step 4 of Table 27.
The charge pump also must be calibrated during the clock
synthesizer initialization phase. Calibration is triggered via
Register 0x2AD The time required to complete the calibration
is inversely proportional to the PFD frequency. For example,
using fPFD = 10 MHz requires a maximum 4 ms wait period but
increasing fPFD to 80 MHz decreases the maximum wait period
by a factor of 8 to 0.5 ms. Alternatively, poll Bit 0 of Register 0x2BC;
charge pump calibration is complete when this bit is set.
Rev. D | Page 36 of 90
Data Sheet
AD6676
–128
Phase Noise Performance
–130
(7)
–134
For example, the phase noise at 1 MHz offset for an FADC of
3.2 GHz is approximately −124 dBc/Hz. An IF input frequency
of 200 MHz results in a 24 dB improvement, thus the expected
phase noise at 1 MHz offset is −148 dBc/Hz.
2.95GHz
3.00GHz
3.10GHz
3.20GHz
0.4
0.6
600kHz
–140.93
0.11
0.32
800kHz
–144.14
0.11
0.37
1MHz
–146.48
0.10
0.39
–136
–138
–140
–142
–144
–146
–148
–150
–152
–154
–156
0.2
0.8
1
2
3
–109
–111
Figure 101. Power Cycle Repeatability (10 Attempts) of Phase Noise
Measurement for an IF Input Frequency of 225 MHz and fCLK = 2.94912 GHz
with PLL PFD = 61.44 MHz
–113
–115
–117
–119
–123
–125
–127
–129
–131
0.4
0.6
0.8
1
2
FREQUENCY OFFSET (MHz)
5
12348-051
–133
PHASE NOISE (dBc/Hz)
–121
Figure 100. Clock Synthesizers Typical Phase Noise for Various FADC Values
The repeatability of a device that is power cycled 10 times is shown
in Figure 101. Note that the measured data in this figure aligns with
the expected results based on Equation 5 and Figure 100. The
phase noise variation over temperature of a nominal device is
shown in Figure 102.
–120
–122
–124
–126
–128
–130
–132
–134
–136
–138
–140
–142
–144
–146
–148
–150
–152
–154
–156
0.2
+85°C
+25°C
–40°C
0.4
0.6
0.8
1
ZERO IF FREQUENCY OFFSET (MHz)
2
3
12348-053
–107
CLK SYN PHASE NOISE @ fCLK (dBc/Hz)
100kHz
–125.81
0.23
0.71
ZERO IF FREQUENCY OFFSET (MHz)
–105
–135
0.2
MEAN
STD
PK-PK
12348-052
PNfIN_OFFSET = PNfCLK_OFFSET + 20 × log (FIF/FADC)
–132
PHASE NOISE (dBc/Hz)
Above the PLL filter bandwidth of 200 kHz, the internal VCO
limits the overall phase noise of the clock synthesizer. The VCO
phase noise performance shows a slight improvement at its low
end of its FADC operating range, as shown in Figure 100 The phase
noise for a particular IF input frequency can be calculated using
Equation 5.
Figure 102. Typical Temperature Stability of Clock Synthesizer with the Same
Conditions as Figure 101
Rev. D | Page 37 of 90
AD6676
Data Sheet
DIGITAL PROCESSING BLOCKS
The AD6676 includes the following digital blocks between the
Σ-Δ ADC output and JESD204B transmitter core:


An ADC overload and recovery block immediately follows
the ADC. This circuitry quickly detects any ADC instability
from an overload event while ensuring fast recovery.
A digital signal processing block translates the real IF
signal from the Σ-Δ ADC to a complex zero IF, suitable for
postprocessing by the host without loss of any dynamic
range. This block includes both coarse and fine QDDCs,
along with a selectable FIR decimation filter stage that
provides decimation factors of 12, 16, 24, and 32.
A peak detection and AGC support block facilitates the
implementation of an external AGC control loop under the
control of the host. Note that the AGC pins can also be
repurposed for GPIO functions.
AGC4, AGC3
AGC2, AGC1
GPIO CONTROL OPTION
REG 0x1B0
TO 0x1B4
ATTENUATOR CONTROL
REG 0x180 TO 0x184
RESET
REG 0x188
TO 0x18B,
0x18F
ADC
OVERLOAD
RECOVERY
AGC
SUPPORT
PEAK DETECTOR INPUT
REG 0x193
TO 0x19E
MIX1
COARSE
QDDC
BAND-PASS
Σ-∆ ADC
27dB ATTENUATOR
(1dB STEPS)
MIX2
FINE
QDDC
3×
OR 4×
5 BITS
2×
16 BITS
2×
2×
2×
DEC_MODE =
12, 16, 24 OR 32
REG 0x140
NCO
NCO
REG 0x141
REG 0x143
REG 0x142
REG 0x144
REG 0x145
Figure 103. Simplified Block Diagram of Digital Processing Blocks
Rev. D | Page 38 of 90
2×
16 BITS
12348-054

Figure 103 shows a diagram of the digital functional blocks
along with the SPI configurable registers pertaining to these
blocks. The following sections provide more insight into the
operation of each of these functional blocks. More information
pertaining to these SPI registers can be found in Table 32 through
Table 135.
Data Sheet
AD6676
DIGITAL SIGNAL PROCESSING PATH
The Σ-Δ ADC provides a highly oversampled 5-bit digital
output representing the desired IF signal pass band as well as the
out-of-band shaped noise described earlier. Referring to Figure 104,
the digital signal processing path translates this oversampled
real IF signal to a complex dc centered IF signal, having a more
manageable data rate suitable for transfer via the JESD204B
interface. The QDDC performs the real-to-complex frequency
translation followed by digital filtering to remove the ADC
out-of-band noise, as well as any other undesired signal content,
before decimation to a lower data rate without any loss of
dynamic range.
ADC REAL OUTPUT
IMAGE
SIGNAL
–FADC /2
DESIRED
SIGNAL
–fIF DC
ADC NOISE
fIF
FADC /2
COMPLEX OUTPUT AFTER QDDC
Table 13. Finite Composite Tuning Resolution of Coarse and
Fine NCO
DEC_MODE
(Register 0x140,
Bits[2:0])
1
2
3
4
Decimation
Factor
32
24
16
12
DC
FADC /2
DIGITAL FILTER RESPONSE

 F
MIX1  

MIX2  Round M   IF 

64  
 FADC

FADC /2
DC
fDATA_IQ /2
12348-055
COMPLEX OUTPUT AFTER DECIMATION
–fDATA_IQ /2




(8)
where:
MIX1 is a 6-bit binary number representing the NCO frequency
setting in MIX1_TUNING.
FIF is the desired carrier frequency in hertz (Hz).
FADC is the ADC clock rate in hertz (Hz).
COMPLEX OUTPUT AFTER FILTERING
–FADC /2
Tuning Res.
(MHz) at FADC =
3.072 GSPS
0.75
1.00
0.75
1.00
The tuning frequency settings of the combined coarse and
fine NCO (SPI Register 0x141 and SPI Register 0x142) are
automatically calculated and set by the AD6676 during the
device SPI initialization phase. The user defined FADC and IF
settings (SPI Register 0x100 thru SPI Register 0x103) are used
to calculate the settings such that the center of the IF pass band
is centered about dc. The coarse tuning NCO is set via
MIX1_TUNING[5:0], whereas the fine tuning NCO is set via
MIX2_TUNING[7:0]. The decimal equivalent frequency setting
of each NCO register is based on the following equations.

F
MIX1  Round 64  IF
F
ADC

–FADC /2
Tuning
Resolution
FADC/4096
FADC/3072
FADC/4096
FADC/3072
Figure 104. Digital Signal Processing Path Performs Frequency Translation to
a Zero IF as well as Filtering and Downsampling
Quadrature Digital Downconversion
Digital downconversion occurs in two stages using a coarse and
a fine QDDC. As shown in Figure 103, the coarse QDDC
resides immediately after the Σ-Δ ADC and the fine QDDC
follows the first decimation stage. The coarse QDDC provides
6-bit tuning resolution whereas the fine QDDC provides 10-bit
tuning resolution. The composite tuning resolution is either
FADC/3072 or FADC/4096, depending on whether the first
decimation stage is configured for 3× or 4× decimation, which
in turn depends on the decimation mode selected as described
in Table 13. For applications requiring finer tuning resolution to
position the IF signal exactly about dc, consider adding a finer
resolution QDDC in the host processor.
(9)
where:
MIX2 is a 8-bit twos complement number representing the
NCO frequency setting in MIX2_TUNING.
M is 3072 for DEC_MODE = 2 and 4, or 4096 for DEC_MODE =
1 and 3.
It is important to note the residue, fOFFSET, between the desired
FIF and the AD6676 composite NCO setting, FIF_NCO, because
any offset may need to be compensated with an additional fine
QDDC located in the host processor. Use the following
equations to calculate both parameters:
Rev. D | Page 39 of 90
FIF _ NCO  

MIX1 MIX2 

  FADC
64
M 
fOFFSET = FIF – FIF_NCO
(10)
(11)
AD6676
Data Sheet

Example
Calculate the NCO MIX1 and MIX2 values along with FIF_NCO
and fOFFSET with the following AD6676 configuration: FIF =
140 MHz, FADC = 3200 MHz, and decimation factor of 16 (that
is, fDATA_IQ = 200 MSPS).




Substituting FIF and FADC values in Equation 8 results in
MIX1 = 3.
Substituting these values in Equation 9 (noting that M =
4096 for DEC_MODE = 3 results in MIX2 = −13).
Substituting MIX1 and MIX2 values into Equation 10
results in FIF_NCO = 139.84375 MHz.
Substituting FIF and FIF_NCO values in Equation 11 results in
fOFFSET = 156.25 kHz.
NCO Phase Synchronization
The AD6676 coarse and fine tuning NCOs can be set to an
initial phase after synchronization with an external SYSREF
signal. The initial phase of the coarse tuning NCO is set via
MIX1_INIT, with an LSB corresponding to 1/64th of a cycle. The
initial phase of the fine tuning NCO is set via MIX2_INIT_x,
with an LSB corresponding to 1/1024th of a cycle.
Digital Filter Modes
The AD6676 digital filter path is designed to provide sufficient
stop band rejection of the Σ-Δ ADC shaped out-of-band noise
as well as any spurious noise that otherwise might alias back
into the desired pass band region after decimation and limit the
actual NSD performance. The filter path supports decimation
factors of 12, 16, 24, and 32 depending on the DEC_MODE
setting. The complex output of the coarse QDDC feeds a pair of
symmetrical FIR decimation filters divided into three stages, as
shown in Figure 103. The first stage is a decimate by 3 or by 4
filter, depending on whether the desired decimation factor is
divisible by three. The second and third stages consists of two
cascaded decimate by 2 filters with the third stage outputs
supporting the decimate by 12 and by 16 options. A bypassable
fourth stage provides the decimate by 24 and by 32 options.
The normalized pass band and wideband folded frequency
response for each filter mode are shown in Figure 105 through
Figure 113. Note the following observations:




Wide IF bandwidths (MHz) are supported when operating
at lower decimation factors along with a high FADC.
It is worth noting that many applications requiring wider
IF bandwidth may tolerate reduced ripple and rejection as
the digital filter response enters its transition region. The
reason is that the Σ-Δ ADC achievable NSD performance
at the IF pass band edges also degrades as its oversampling
ratio is reduced, thus still dominating relative to any
aliased noise due to reduced filter stop band rejection.
Table 14. Usable Normalized Complex Bandwidth vs.
Decimation Factor
DEC_MODE
1
2
3
4
Decimation
Factor
32
24
16
12
fDATA_IQ
1
1
1
1
BW (>85 dB
Rejection)
0.814
0.814
0.571
0.571
BW (>60 dB
Rejection)
0.834
0.834
0.617
0.617
Total Pipeline Latency
The digital filter path dominates the latency of the AD6676
whereas the JESD204B PHY adds a few samples of delay and
the ADC delay is a fraction of an output sample. The latency
between the ADC and digital filter output is fixed with the only
nondeterministic delay being associated with the JESD204B
PHY clock and lane FIFOs before synchronization. See the
Synchronization Using SYSREF section for additional
information. Table 15 provides the nominal pipeline delay
associated with each DEC_MODE. Note that although all
DEC_MODE settings provide similar delays relative to the
output data rate, fDATA_IQ, applications that require shorter
absolute time delays may consider using a lower decimation
factor to reduce the absolute delay by 2×.
Table 15. Nominal Pipeline Latency vs. DEC_MODE
(Sample Delay Relative to 1/fDATA_IQ)
DEC_MODE
1
2
3
4
All filter responses provide a linear phase response over its
pass band.
The usable IF bandwidth depends on the DEC_MODE as
well as the minimum acceptable pass band ripple and stop
band rejection requirements. Table 14 provides the
normalized usable complex bandwidth vs. DEC_MODE for
stop band rejections of greater than 85 dB and 60 dB.
The last filter stage sets the usable bandwidth and stop
band rejection because it has the most aggressive transition
band specifications. For this reason, the decimation factors
of 12 and 16 have the same normalized usable bandwidths
as does decimation factors of 24 and 32.
Rev. D | Page 40 of 90
Decimation
Factor
32
24
16
12
JESD204B
Lanes
1
1
2
2
IQ Data Output
Sample Delay
34.2
34.2
32.3
32.3
Data Sheet
AD6676
0.5
0
0.4
–20
0.3
MAGNITUDE (dB)
MAGNITUDE (dB)
0.2
0.1
0
–0.1
–0.2
–0.3
–40
–60
–80 MINIMUM ALIAS ATTENUATION 85.5dB
–100
–120
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
12348-056
–0.5
Figure 105. Pass Band Frequency Response of Decimate by 12
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
12348-059
–0.4
Figure 108. Folded Frequency Response of Decimate by 12 Shows Alias
Rejection
0.5
0
0.4
–20
0.3
MAGNITUDE (dB)
MAGNITUDE (dB)
0.2
0.1
0
–0.1
–0.2
–0.3
–40
–60
–80 MINIMUM ALIAS ATTENUATION 85.5dB
–100
–120
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
12348-057
–0.5
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
12348-060
–0.4
Figure 109. Folded Frequency Response of Decimate by 16 Shows Alias
Rejection
Figure 106. Pass Band Frequency Response of Decimate by 16
0.5
0
0.4
–20
0.3
MAGNITUDE (dB)
0.1
0
–0.1
–0.2
–0.3
–40
–60
–80 MINIMUM ALIAS ATTENUATION 85.5dB
–100
–0.5
–120
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
Figure 107. Pass Band Frequency Response of Decimate by 24
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
FREQUENCY NORMALIZED TO fDATA_IQ
0.45
0.50
12348-061
–0.4
12348-058
MAGNITUDE (dB)
0.2
Figure 110. Folded Frequency Response of Decimate by 24 Shows Alias
Rejection
Rev. D | Page 41 of 90
AD6676
Data Sheet
0.5
Peak Detection and AGC Flags
0.4
Peak detection occurs at the output of the second stage decimation
filter, as shown in Figure 103. Detection at this stage represents a
compromise between the accuracy of the peak detector, delay time
and ability to measure large out-of-band signals. At this stage, the
Σ-Δ ADC output signal has been frequency translated to dc and its
out-of-band noise sufficiently filtered for reasonable threshold
detection accuracy down to −12 dBFS peak signal levels. Note that
the peak detector monitors the peak power envelope response of
the IF input signal and calculates the peak power (that is, I2 + Q2)
expressed in dBFS with 12-bit resolution.
0.3
MAGNITUDE (dB)
0.2
0.1
0
–0.1
–0.2
–0.3
–0.5
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
FREQUENCY NORMALIZED TO fDATA_IQ
12348-062
–0.4
Figure 111. Pass Band Frequency Response of Decimate by 32
0
MAGNITUDE (dB)
–20
–40
–60
–80
MINIMUM ALIAS ATTENUATION 88dB
–100
Because the peak detector is monitoring the peak power at the
output of the second stage decimation filter, it provides a wider
frequency range than what can be observed in the final IQ data
output. The first stage filter is decimate by 3 or by 4; therefore,
the output of the second stage filter can be 1/6th or 1/8th of FADC.
Figure 113 shows the normalized measurement bandwidth relative
to the output rate of the second stage filter centered about its zero
IF. Table 16 references the measurement bandwidth to fDATA_IQ for
the different decimation factors such that its absolute bandwidth
can be easily determined. For example, the −1 dB bandwidth for an
fDATA_IQ of 100 MSPS with decimate by 24 or by 32 is 200 MHz and
remains at 200 MHz if the decimation factor is reduced to decimate
by 12 or by 16. Any droop occurring at the pass band edges, as well
as the Σ-Δ ADC STF, must be considered when setting thresholds.
0.10
0.15
0.20
0.25
0.30
0.35
0.40
FREQUENCY NORMALIZED TO fDATA_IQ
0.45
0.50
Figure 112. Folded Frequency Response of Decimate by 32 Shows Alias
Rejection
AGC FEATURES AND PEAK DETECTION
In receiver applications, it is desirable to have a mechanism to
reliably determine when the converter is about to be overdriven.
The AD6676 Σ-Δ ADC is based on a feedback loop that can be
overdriven into a nonlinear region, resulting in oscillation. This
oscillation persists until the Σ-Δ ADC is reset and the overload
condition is removed. Typically, a receiver lineup employs some
form of AGC that attempts to avoid this scenario.
The AD6676 pipeline latency along with any additional
overhead associated with the host processor (JESD204B Rx
PHY) may limit the ability to design a fast reacting digital-based
AGC required by some applications. For this reason, the
AD6676 includes the AGCx pins that serve as digital input/
outputs to facilitate the implementation of a fast AGC control
loop under the control of the host. The AGC4 and AGC3 pins
can be allocated to provide flag outputs after a programmable
threshold has been exceeded, including an ADC reset event,
while the AGC2 and AGC1 pins can be used to control the onchip attenuator. Register 0x18F and Register 0x193 through
Register 0x19E are used for AGC purposes.
0
–0.5
–1.0
–1.5
–2.0
–2.5
–3.0
–0.35
–0.25
–0.15
–0.05
0.05
0.15
0.25
0.35
FREQUENCY OFFSET FROM IF CENTER
(NORMALIZED TO FIQ@2ND STAGE FILTER)
12348-064
0.05
MAGNITUDE (dBFS)
0
12348-063
0.5
–120
Figure 113. Normalized Pass Band Filter Response Seen by the Peak Detector
Table 16. Normalized Measurement Bandwidth of Peak
Detector Relative to Output Data Rate, fDATA_IQ
DEC_
MODE
1
2
3
4
Rev. D | Page 42 of 90
Decimation
Factor
32
24
16
12
Normalized Measurement Bandwidth
Relative to fDATA_IQ
−0.5
−1.0
−2.0
−3.0
dBFS
dBFS
dBFS
dBFS
1.76
2.00
2.40
2.64
1.76
2.00
2.40
2.64
0.88
1.00
1.20
1.32
0.88
1.00
1.20
1.32
Data Sheet
AD6676
The AD6676 allows the user to set three threshold settings that
can trigger one of two possible flags. PKTHRH0 and PKTHRH1
are two upper threshold settings while LOWTHRH is a lower
threshold setting. The threshold settings are 12 bits with an
MSB and LSB register assigned to each threshold. The 12-bit
decimal equivalent value can be calculated using Equation 12.
Threshold = 3584 + (Threshold Setting in dBFS) × 256/3
(12)
where 0 dBFS corresponds to 3584 (0xE00) and −6 dBFS
corresponds to 3072 (0xC00).
In the time domain, a 0 dBFS setting corresponds to a signal
whose peaks observed at the I and Q outputs can reach plus or
minus full scale. Meaning, if the 16-bit I and Q output data are
normalized such that its peak values correspond to ±1, a 0 dBFS
setting corresponds to a signal whose peak can reach the unit
circle of a normalized I/Q constellation diagram.
The LOWTHRH_x register has an associated dwell time of
which the signal must remain below this threshold before a flag
can be set. The dwell time is represented in exponential form to
realize long dwell periods because the counter operates at
FADC/12 for decimate by 12 or 24 settings or FADC/16 for decimate
by 16 or 32 settings. The dwell time is set in the DWELL_TIME_
MANTISSA register and DWELL_TIME_EXP register using
Equation 13 relative to 1/FADC.
Dwell Time = N × [DWELL_TIME_MANTISSA] ×
2(DWELL_TIME_EXP)
(13)
where:
N = 12 for decimate by 12 or 24.
N = 16 for decimate by 16 or 32.
Note that the EN_FLAGx bits provide the additional option of
logically OR’ing an ADC reset event with an upper peak
threshold event to provide an even faster output flag to the host
processor indicating that the attenuation must be applied. This
scenario applies to the extreme case where the envelope
response of a blocker is exceedingly fast, such that the AGC
cannot react fast enough to the upper peak threshold setting
flag to prevent overloading the Σ-Δ ADC.
Figure 114 provides an example of how the Flag 0 and Flag 1
assigned pins behave to the envelope response of an arbitrary IF
input signal. Flag 1 is assigned an upper threshold set by
PKTHRH1_x, and Flag 0 is assigned a lower threshold and
dwell time set by LOWTHRH_x and DWELL_TIME_x. The
Flag 1 indicator goes high when the PKTTHR1_x threshold is
exceeded and returns low when the signal envelope falls below
this threshold. The Flag 0 indicator goes high only when the
envelope of the signal remains below the LOWTHRH_x
threshold for the designated dwell time. If the signal level
exceeds the LOWTHRH_x threshold before the dwell time
counter has expired, the dwell time counter resets again and the
Flag 0 indicator remains low until the conditions has been met.
By offsetting the PKTTHR1_x and LOWTHRH_x threshold
settings as well as optimizing the dwell time setting, it may be
possible to optimize the operation of an AGC so that it reacts to
signal strength variation due to fading conditions as opposed to the
peak to minimum response associated with digital modulated
signals.
IF Attenuator Control via the AGC2 and AGC1 Pins
A flag function can be assigned using the FLAG0_SEL register
and FLAG1_SEL register to indicate when any of the thresholds
have been exceeded or if an ADC reset event has occurred.
These flags must also be enabled via the EN_FLAG register
such that a CMOS level signal appears on the AGC4 and AGC3
pins where a logic high indicates when a threshold has been
exceeded.
The delay relative to the ADC input when an AGC threshold is
exceeded to when the flag signal goes high is dependent on the
DEC_MODE setting selected. For a DEC_MODE value of 1 or
2 (decimate by 32 or 24), the delay equates to 8 to 9 output
samples (1/fDATA_IQ). For DEC_MODE values of 3 or 4 (decimate
by 16 or 12), the delay is 16 to 18 samples. The delay associated
with an ADC reset event is much shorter because it avoids the
digital filter path. This delay is 1 sample for DEC_MODE values
of 1 or 2 and 2 samples for DEC_MODE values of 3 and 4.
Many AGC implementations require fast gain control if the
AGC threshold is exceeded. The AD6676 provides two modes in
which the IF attenuator can be quickly changed via the AGCx pins.
Use Register 0x180, Bit 0, to select the mode. The first mode uses
the AGC2 pin to switch between two attenuator settings that are
user defined in Register 0x181 and Register 0x182. The second
mode uses the AGC2 and AGC1 pins to decrement and increment
respectively the attenuation value in 1 dB steps with pulsed inputs.
The starting attenuator value is defined in Register 0x183. The
actual attenuator value can be read back via Register 0x184.
The first mode is used for the default AD6676 power-up setting
with both Register 0x181 and Register 0x182 set to 0x0C. For
applications that do not require IF attenuator control but
require a different attenuator setting, update both registers with
the desired attenuator setting value such that the attenuator
remains independent of the AGC2 pin state, if it is left floating.
Note that connecting the unused AGC2 and AGC1 pins to
VSSD via 100 kΩ pull-down resistors is still the preferred
method if these pins are unused.
Rev. D | Page 43 of 90
AD6676
Data Sheet
UPPER THRESHOLD (PKTTHR1)
DWELL TIME
TIMER RESET BY
RISE ABOVE
LOWER
THRESHOLD
MIDSCALE
LOWER THRESHOLD (LOWTHRH)
DWELL TIME
TIMER COMPLETES BEFORE
SIGNAL RISES ABOVE
LOWER THRESHOLD
12348-065
FLAG1
FLAG0
Figure 114. Example of Flag Behavior as Signal Envelope Crosses Upper and Lower Threshold Settings
Table 17. Power Saving for 3.0 GSPS Operation with CLKSYN Enabled and 125 MSPS IQ Rate (Single JESD204B Lane)
Power State at 3 GSPS
STDBY_SLOW
STDBY_FAST
Power Down
Power Up
IVDD2 (mA)
18
95
2.6
146
IVDD1+, IVDDC+ IVDDL (mA)
162
175
25
433
GPIO FUNCTIONALITY
The AGCx pins can also be configured for basic GPIO
functionality via Register 0x1B0 to Register 0x1B4. Register 0x1B0
determines which pins are used for GPIO functionality, whereas
Register 0x1B1 determines if an AGC pin serves as input or
output. If the pin serves as an output, Register 0x1B2 determines
the high or low state, and Register 0x1B3 reads back the state of
these designated output pins. Lastly, if an AGCx pin serves as an
input, Register 0x1B4 reads back the state of this pin.
POWER SAVING MODES
The AD6676 features two SPI configurable and selectable power
savings modes. The first mode is a sleep mode where the AD6676
is placed in a low power state for extended periods, and the
second mode is a standby mode where the AD6676 enters a
reduced power state but still keeps the JESD204B link and digital
clocks active to ensure multichip synchronization (or fixed
latency) during fast power cycling. Both sleep mode and standby
mode can be entered via a SPI write operation to the PD_MODE
bits in the DEVICE_CONFIG register (Register 0x002; Bits[1:0]).
Note that, depending on whether sleep or standby mode is
selected, various functional blocks within the Σ-Δ ADC itself
are either powered down, placed in a low bias state, or remain
powered.
The standby mode is also controllable via a user designated
AGCx pin for faster and more precise power cycling. This
feature is particularly useful for TDD-based communication
protocols, allowing the host processor to quickly power cycle
the AD6676 during transmit bursts. The PD_PIN_CTRL
register (Register 0x152) enables this feature as well as
designates the AGC pin.
IVDDD (mA)
216
221
29
310
PTOTAL (mW)
461
673
64
1182
Percent (%) Power Savings
61
43
Not applicable
Not applicable
The standby register (Register 0x150) powers down different
functional blocks during standby mode. However, all functional
blocks that affect the clock generation, distribution and the
JESD204B link remain enabled to maintain constant latency
while in standby. The only exception is STBY_VSS2GEN
(Register 0x150, Bit 6) where a trade-off exists in power savings
vs. wake-up time, depending on whether the negative voltage
generator is placed in standby.
Table 17 shows the realized power savings for the different
power savings modes at 3.0 GSPS operation with the AD6676
configured for 125 MSPS IQ output and the internal clock
synthesizer enabled. Note that STDBY_FAST and STDBY_SLOW
correspond to whether the STBY_VSS2GEN bit is enabled or
disabled during standby. Note that an additional 18% power
savings can be achieved when powering down the
STBY_VSS2GEN bit.
Although the AD6676 can enter into standby quickly, it does
require a few microseconds to exit standby. Figure 115 shows
that the AD6676 can achieve a low power state within 100 ns.
Figure 116 and Figure 117 show the wake-up time between the
STDBY_FAST and STDBY_SLOW cases to achieve 1% envelope
settling accuracy being around 2.5 μs and 11.5 μs, respectively.
The phase response is not shown because it settles faster than
the envelope response. Note that the digital data path is enabled
for these time domain figures such that the setting time
responses can be observed.
Rev. D | Page 44 of 90
Data Sheet
AD6676
1.0
INTRODUCTION TO THE JESD204B INTERFACE
NORMALIZED ENVELOPE OUTPUT
0.9
The JESD204B interface reduces the PCB area for data interface
routing yet enabling the use of smaller packages for converter
and logic devices. The AD6676 digital output complies with the
JEDEC Standard No. JESD204B, Serial Interface for Data
Converters. JESD204B is a protocol to link the AD6676 to a
digital processing device over a serial interface. The AD6676
supports link rates of up 5.333 Gbps while operating with two
output lanes in support of a maximum I/Q data rate (fDATA_IQ)
of 266.67 MSPS. Note that a two output lane configuration is
always required for decimation factors of 12 and 16.
0.8
0.7
AD6676
ENTERS STANDBY
WITHIN 100ns
0.6
0.5
0.4
0.3
0.2
0
10.0
10.0
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
11.0
TIME (µs)
12348-066
0.1
Figure 115. Fast Power-Down Response When the AD6676 Is Placed in
Standby
1.0
1% SETTLING TIME = 2.5µs
NORMALIZED ENVELOPE OUTPUT
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0
14.0
14.5
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
19.0
TIME (µs)
12348-067
0.1
Figure 116. Settling Time for STDBY_FAST with the STBY_VSS2GEN Enabled
for Fastest Recovery, Approximately 2.5 μs to 1 %
JESD204B data transmit block assembles the parallel data
from the ADC into frames and uses 8-bit/10-bit encoding as
well as optional scrambling to form serial output data. Lane
synchronization is supported through the use of special
characters during the initial establishment of the link and
additional synchronization is embedded in the data stream
thereafter. A JESD204B receiver is required to complete the
serial link. For additional details on the JESD204B interface,
refer to the JESD204B standard.
Because the AD6676 provides 16-bit complex IQ data, its
JESD204B transmit block effectively maps the output of two
virtual ADCs (M = 2) over a link. The link is configurable for
either single or dual lanes with each lane providing a serial data
stream via a differential output. The JESD204B specification
refers to a number of parameters to define the link and these
parameters must match between the AD6676 JESD204B
transmitter and receiver.
The following parameters describe a JESD204B link:

1.0
0.9
NORMALIZED ENVELOPE OUTPUT
JESD204B Overview
1% SETTLING TIME = 11.5µs

0.8
0.7

0.6
0.5



0.4
0.3
0.2

0
0
2
4
6
8
10
TIME (µs)
12
14
16
18
20
12348-068
0.1
Figure 117. Settling Time for STDBY_SLOW with STBY_VSS2GEN in Standby
for Additional Power Savings, Approximately 11.5 μs to 1 %





Rev. D | Page 45 of 90
S = samples transmitted per single converter per frame
cycle (AD6676 value = 1)
M = number of converters per converter device (AD6676
value = 2)
L = number of lanes per converter device (AD6676 value
can be 1 or 2)
N = converter resolution (AD6676 value = 16)
N’ = total number of bits per sample (AD6676 value = 16)
CF = number of control words per frame clock cycle per
converter device (AD6676 value = 0)
CS = number of control bits per conversion sample
(AD6676 value = 0)
K = number of frames per multiframe (configurable on the
AD6676 up to 32)
HD = high density mode (AD6676 value = 0)
F = octets per frame (AD6676 value = 2 or 4, dependent on
L = 2 or 1)
T = tail bit (AD6676 value = 0)
SCR = scrambler enable or disable (configurable on the
AD6676)
AD6676
Data Sheet
The scrambler uses a self synchronizing polynomial-based
algorithm defined by the equation 1 + x14 + x15. The descrambler
in the receiver must be a self synchronizing version of the
scrambler polynomial.
Figure 118 shows a simplified block diagram of the AD6676
JESD204B link mapping the 16-bit I and Q outputs onto the two
separate lanes. Other configurations are also possible, such as
combining the I and Q outputs onto a single lane (fDATA_IQ ≤
153.6 MSPS) or changing the mapping of the I and Q output
paths. In any case, the 16-bit I and Q data are each broken into
two octets (eight bits of data). Bit 15 (MSB) through Bit 8 are in
the first octet. The second octet contains Bit 7 through Bit 0
(LSB). The four resulting octets (2 I octets and 2 Q octets) may
be scrambled. Scrambling is optional but is available to avoid
spectral peaks when transmitting similar digital data patterns.
The four octets are then encoded with an 8-bit/10-bit encoder. The
8-bit/10-bit encoder takes eight bits of data (an octet) and encodes
them into a 10-bit symbol. Figure 119 shows how the 16-bit I or
Q data is taken from the final decimation stage, formed into
octets, the two octets are scrambled, and how the octets are
encoded into two 10-bit symbols.
I
CONVERTER 0
JESD204B LINK
CONTROL
(L.M.F.M.S)
(SPI REG 0x1C3
TO 0x1C9)
FRAMER
SWAP
(SPI
REG 0x1E1)
ADC
SERDOUT0–,
SERDOUT0+
LANE SWAP
(SPI REG 0x1E1)
SERDOUT1–,
SERDOUT1+
12348-069
Q
CONVERTER 1
SYSREF±
SYNCINB±
Figure 118. Transmit Link Simplified Block Diagram
ADC TEST PATTERNS
(REG 0x1E5)
JESD204B SAMPLE
CONSTRUCTION
ADC
16-BIT
JESD204B TEST
PATTERNS
(REG 0x1E5,
REG 0x1F8 TO
REG 0x1FF)
FRAME
CONSTRUCTION
SCRAMBLER
1 + x14 + x15
(OPTIONAL
VIA 0x1C3)
JESD204B TEST
PATTERNS
(REG 0x1E5,
REG 0x1F8
TO REG 0x1FF)
SERIALIZER
8-BIT/10-BIT
ENCODER
(0x1E4)
a b
a b c d e f g h i j
SERDOUT0±
SERDOUT1±
i j a b
SYMBOL0
i j
SYMBOL1
a b c d e f g h i j
12348-070
JESD204B TEST
PATTERNS
(0x1E5)
Figure 119. Digital Formatting of JESD204B Lanes
PROCESSED
SAMPLES
FROM ADC
SAMPLE
CONSTRUCTION
FRAME
CONSTRUCTION
DATA LINK
LAYER
SCRAMBLER
ALIGNMENT
CHARACTER
GENERATION
8-BIT/10-BIT
ENCODER
PHYSICAL
LAYER
CROSSBAR
MUX
SERIALIZER
Tx
OUTPUT
12348-071
TRANSPORT
LAYER
SYSREF±
SYNCINB±
Figure 120. Data Flow
Rev. D | Page 46 of 90
Data Sheet
AD6676
FUNCTIONAL OVERVIEW
The flowchart in Figure 120 shows the flow of data through the
JESD204B hardware from the sample input to the physical output.
The processing is divided into layers that are derived from the
OSI model widely used to describe the abstraction layers of
communications systems. These are the transport layer, the data
link layer, and the physical layer (serializer and output driver).
Transport Layer
The transport layer packs the data into JESD204B frames,
which are mapped to 8-bit octets that are sent to the data link
layer. The transport layer mapping is controlled by rules derived
from the link parameters. The AD6676 uses no tail bits in the
transport layer because the output of its IQ digital data path is
considered two virtual 16-bit converters.
Data Link Layer
The data link layer is responsible for the low level functions of
passing data across the link. These include optional data
scrambling, inserting control characters for lane alignment/
monitoring, and encoding 8-bit octets into 10-bit symbols. The
data link layer also sends the initial lane alignment sequence
(ILAS), which contains the link configuration data, and is used
by the receiver to verify the settings in the transport layer.
The SYNCINB± pin operation options are controllable via SPI
registers. Although the SYNCINB input is configured for a
CMOS logic level on its positive pin by default, it can also be
configured for a differential LVDS input signal on its positive/
negative pins via Register 0x1E7. The polarity of the SYNCINB
input signal can also be inverted via Register 0x1E4.
Initial Lane Alignment Sequence (ILAS)
The ILAS phase follows the CGS phase and begins on the next
LMFC boundary. The ILAS consists of four multiframes, with a
/R/ character marking the beginning and an /A/ character
marking the end. The ILAS begins by sending an /R/ character
followed by a data ramp starting with the value, 0, over four
multiframes. On the second multiframe, the link configuration
data is sent, starting with the third character. The second character
in the second multiframe is a /Q/ character to confirm that the
link configuration data follows. All undefined data slots are
filled with ramp data. The ILAS sequence is never scrambled.
The ILAS sequence construction is shown in Figure 121. The
four multiframes include the following:


Physical Layer
The physical layer consists of the high speed circuitry clocked at
the serial clock rate. For the AD6676, the 16-bit I and Q data are
converted into one or two lanes of high speed differential serial data.
JESD204B LINK ESTABLISHMENT
The AD6676 JESD204B Tx interface operates in Subclass 0 or
Subclass 1 as defined in the JEDEC Standard No. 204B (July 2011)
specification. The link establishment process is divided into the
following steps: code group synchronization, ILAS, and user data.
Code Group Synchronization (CGS) and SYNCINB
Code group synchronization (CGS) is the process where the
JESD204B receiver finds the boundaries between the 10-bit
symbols in the stream of data. During the CGS phase, the
JESD204B transmit (JESD Tx) block transmits /K28.5/ characters.
The receiver must locate /K28.5/ characters in its input data
stream using clock and data recovery (CDR) techniques.


Multiframe 1: Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
Multiframe 2: Begins with an /R/ character followed by a
/Q/ (/K28.4/) character, followed by link configuration
parameters over 14 configuration octets (see Table 18), and
ends with an /A/ character. Many of the parameter values
are of the notation of n − 1.
Multiframe 3: Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
Multiframe 4: Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
User Data and Error Detection
After the ILAS is complete, the user data is sent. Normally, in a
frame all characters are user data. However, to monitor the
frame clock and multiframe clock synchronization, there is a
mechanism for replacing characters with /F/ or /A/ alignment
characters when the data meets certain conditions. These
conditions are different for unscrambled and scrambled data.
The scrambling operation is disabled by default, but may be
enabled via Register 0x1C3.
The receiver issues a synchronization request by asserting a low
signal on the SYNCINB± pins of the AD6676. The JESD Tx
begins to send /K/ characters. After the receiver has synchronized,
it then deasserts its SYNCINB signal, causing it to go high. The
AD6676 then transmits an ILAS on the following LMFC boundary.
For more information on the CGS phase, see the JEDEC
Standard No. 204B (July 2011), Section 5.3.3.1.
Rev. D | Page 47 of 90
AD6676
Data Sheet
For scrambled data, any 0xFC character at the end of a frame is
replaced by an /F/ and any 0x7C character at the end of a
multiframe is replaced with an /A/. The JESD204B receiver
checks for /F/ and /A/ characters in the received data stream
and verifies that they only occur in the expected locations. If an
unexpected /F/ or /A/ character is found, the receiver uses
dynamic realignment or asserts the SYNCINB± signal for more
than four frames to initiate a resynchronization. For
unscrambled data, if the final character of two subsequent
frames is equal, the second character is replaced with an /F/ if it
is at the end of a frame, and an /A/ if it is at the end of a
multiframe.
K K R D
D A R Q C
C D
Insertion of alignment characters may be modified using SPI.
The frame alignment character insertion is enabled by default.
More information on the link controls is available in the SPI
register descriptions for Register 0x1E0 to Register 0x1E6.
8-Bit/10-Bit Encoder
The 8-bit/10-bit encoder converts 8-bit octets into 10-bit
symbols and inserts control characters into the stream when
needed. The control characters used in JESD204B are shown in
Table 18. The 8-bit/10-bit encoding ensures that the signal is dc
balanced by using the same number of ones and zeroes across
multiple symbols. Note that the 8-bit/10-bit interface has an
invert option available in Register 0x1E4 that has the same
effect of swapping the differential output data pins.
D A R D
D A R D
D A D
START OF
ILAS
START OF LINK
CONFIGURATION DATA
START OF
USER DATA
12348-072
END OF
MULTIFRAME
Figure 121. Initial Lane Alignment Sequence
Table 18. Control Characters used in JESD204B Including Running Disparity Values
Abbreviation
/R/
/A/
/Q/
/K/
/F/
Control Symbol
K28.0
K28.3
K28.4
K28.5
K28.7
8-Bit Value
000 11100
011 11100
100 11100
101 11100
111 11100
10-Bit Value (RD = −1)
001111 0100
001111 0011
001111 0010
001111 1010
001111 1000
Rev. D | Page 48 of 90
10-Bit Value (RD = +1)
110000 1011
110000 1100
110000 1101
110000 0101
110000 0111
Description
Start of multiframe
Lane alignment
Start of link configuration data
Group synchronization
Frame alignment
Data Sheet
AD6676
Digital Outputs, Timing and Controls
The AD6676 physical layer consists of digital drivers that are
defined in the JEDEC Standard No. 204B (July 2011). These
CML drivers are powered up by default via Register 0x1E2. The
drivers utilize a dynamic 100 Ω internal termination to reduce
unwanted reflections. A 100 Ω differential termination resistor
at each receiver input results in a nominal 300 mV p-p swing at
the receiver.
The AD6676 JESD204B differential outputs can interface with
custom ASICs and FPGA receivers, providing superior switching
performance in noisy environments. Single point-to-point
network topologies are recommended with receiver inputs having
a nominal differential 100 Ω termination. The common mode
of the digital output automatically biases itself to half the VDDHSI
supply of 1.1 V (VCM = 0.55 V), thus making ac coupling the
preferred coupling method to the receiver logic as shown
Figure 122. DC coupling can be considered if the receiver device
shares the same VDDHSI supply and input common-mode range.
SERDOUTx–
–100
–300
EYE: ALL BITS, OFFSET: –0.0055
UIs: 4000; 1059998, TOTAL: 4000; 1059998
–400
–150
–100
–50
0
50
100
150
TIME (ps)
Figure 123. Digital Outputs Data Eye with External 100 Ω Terminations at
5.333 Gbps in Accordance to LV-OIF-11G-SR Mask
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
–5
–4
–3
–2
–1
0
1
2
3
4
5
TIME (ps)
Figure 124. Digital Outputs Histogram with External 100 Ω Terminations at
5.333 Gbps
1
1–2
1–4
RECEIVER
1–6
0.1µF
OUTPUT SWING = 300mV
0
VCM = VDDHSI/2
1–8
1–10
Figure 122. AC-Coupled Digital Output Termination Example
1–12
Timing errors caused by a degraded eye diagram at the receiver
input can often be attributed to poor far end termination or
differential trace routing. These potential error sources can be
reduced by using well controlled differential 100 Ω traces with
lengths below six inches that connect to receivers with integrated
differential 100 Ω resistors.
1–14
1–16
–0.5
–0.4
–0.3
–0.2
–0.1
0
UIs
0.1
0.2
0.3
0.4
0.5
12348-505
100Ω
100
–200
BER
SERDOUTx+
200
100Ω
DIFFERENTIAL
TRACE
PAIR
0.1µF
12348-073
VDDHSI
300
12348-503
The optional SYSREF± input can be used for multichip
synchronization or establishing a repeatable latency between
the AD6676 and its host. The SYSREF± receiver circuit must be
disabled if not used (Register 0x1E7 = 0x04) to prevent
potential false triggering if the input pins are left open. The
SYSREF± input does not include an internal 100 Ω termination
resistor; thus, an external differential termination resistor must
be included if this input is used. The SYSREF± input is logic
complaint to LVPECL, LVDS, and CMOS.
400
12348-504
The AD6676 physical layer consists of consists of two digital
differential inputs, SYSREF± and SYNCINB±, whose equivalent
input circuits are shown in Figure 61 and Figure 64. These inputs
must be dc-coupled to their respective drivers because they are
or can be aperiodic. The SYNCINB± input is logic compliant to
both CMOS and LVDS via Register 0x1E7, Bit 2, with CMOS
being the default. Note that the SYNCINB± input includes an
internal 100 Ω termination resistor when LVDS is selected.
VOLTAGE (mV)
Digital Inputs
Figure 123, Figure 124, and Figure 125 show examples of the
digital output data eye, time interval error (TIE) jitter
histogram, and bathtub curve for one AD6676 lane running at
5.333 Gbps with Register 0x1EC set to 0xBD. The format of the
output data is twos complement by default. The output data
format can be changed via Register 0x146.
HITS
PHYSICAL LAYER INPUT/OUTPUTS
Figure 125. Digital Outputs Data Bathtub with External 100 Ω Terminations
at 5.333 Gbps
Rev. D | Page 49 of 90
AD6676
Data Sheet
Preemphasis
CONFIGURING THE JESD204B LINK
Preemphasis enables the receiver eye diagram mask to be met in
conditions where the interconnect insertion loss does not meet
the JESD204B specification. The preemphasis feature is controlled
via Register 0x1EF and must be used only when the receiver
cannot recover the clock due to excessive insertion loss. Under
normal conditions, it is disabled to conserve power. Additionally,
enabling and setting too high a deemphasis value on a short link
may cause the receiver eye diagram to fail or lead to potential
EMI issues. For these reasons, consider the use of preemphasis
only in instances where meeting the receiver eye diagram mask
is a challenge. See the Register Memory Map section for details.
The AD6676 has one JESD204B link. The serial outputs
(SERDOUT0± and SERDOUT1±) are part of one JESD204B
link. The basic parameters that determine the link setup are:
Serializer PLL
This PLL generates the serializer clock that is equal to the
JESD204B lane rate. The on-chip controller automatically
configures the PLL parameters based on the user specified IQ
data rate (FADC/M) and number of lanes. The status of the PLL
lock can be checked via the PLL_LCK status bit in Register 0x2DC.
This read only bit lets the user know if the PLL has achieved a
lock for the specific setup.



L is the number of lanes per link
M is the number of converters per link
F is the number of octets per frame
The maximum and minimum specified lane rates for the
AD6676 are 5.333 Gbps and 3.072 Gbps, respectively. For this
reason, the AD6676 supports a single lane interface for IQ data
rates (fDATA_IQ) from 76.8 MSPS to 133.3 MSPS and a two lane
interface from 153.6 MSPS to 266.7 MSPS.
The lane line rate is related to the JESD204B parameters using
the following equation:
Lane Line Rate 
40  F
DATA_IQ

(14)
L
where:
FDATA_IQ 
FADC
DEC
The decimation ratio (DEC) is the parameter programmed into
Register 0x140.
Table 19 shows the JESD204B output configurations supported
based on fDATA_IQ.
Table 19. JESD204B Output Configurations
No. Virtual Converters
Supported (same as M)
2
fDATA_IQ (MSPS)
76.8 to 133.3
153.6 to 266.7
JESD Serial Line Rate
40 × fDATA_IQ
20 × fDATA_IQ
L
1
2
Rev. D | Page 50 of 90
M
2
2
F
4
2
S
1
1
HD
0
0
N
16
16
N'
16
16
K
For F = 4, K ≥ 5
For F = 2, K ≥ 9
Data Sheet
AD6676
SYNCHRONIZATION USING SYSREF±
The AD6676 uses the SYSREF± input to provide synchronization
for the JESD204B serial output and to establish a fixed phase
reference for the decimation filters and the NCO within the QDDC.
Synchronization options are configurable via Register 0x1E8.
When initially synchronizing, the absolute phase offset relative
to the input clock applied to the CLK± pins depends on internal
clock phases and therefore has an uncertainty of ±1 ADC clock
cycles.

A clock tree diagram is shown in Figure 126 with an internal
clock signal, DIG_CLK, used to ultimately sample the SYSREF±
signal. Note that the SYSREF± setup and hold times are defined
with respect to the rising SYSREF± edge and rising CLK± (or
CLK+ with the clock synthesizer disabled) edge, as shown in
Figure 2. After the SYSREF± signal is sampled, the phase remains
locked to the same relative internal ADC_CLK phase offset
until the AD6676 is intentionally reset or its clock or power
interrupted.

Note the following considerations when using SYSREF± for
synchronization.



The SYSREF± pulse width must be at least two ADC_CLK
periods.
Bit 3 of Register 0x2BB must be set low when synchronizing
with the clock synthesizer enabled. In this case, that SYSREF±
is sampled on the rising edge of REF_CLK to allow for
significant margin in setup and hold time. This
synchronization signal is then sampled again with the
internally generated DIG_CLK.
Because SYSREF± is ultimately sampled with an internal
clock greater than 1 GHz, it can be difficult to maintain
synchronization of the clock and SYSREF± distribution in
a system over supply and temperature variations, as well as

REG 0x2A5
RF_CLK
CLK±
ADC_CLK
CLOCK
SYNTHESIZER
fOUT =
5.9GHz TO 6.4GHz
TO Σ-∆ ADC
AND DIGITAL
÷2
÷2
DIG_CLK
TO DIGITAL
REF_CLK
Q
REG 0x2BB
SYSREF±
Q
D
Q
D
Q
TO SYNCHRONIZATION
CIRCUITRY
12348-131


cumulative jitter affects. Use the one shot with the second
SYSREF pulse to avoid unnecessary resetting of the
JES204B link by setting Register 0x1E8 to 0x06. A
minimum of two SYSREF pulses are required.
The coarse and fine digital NCOs can be reset to an initial
phase defined in Register 0x143 through Register 0x145
upon receiving SYSREF±. For the recommended one shot
with the second SYSREF pulse, set Register 0x1E8 to 0x26
so that the same SYSREF pulse that is used to reset the
JESD204 internal dividers is used to reset the NCO phases.
If continuous SYSREF± is still preferred, it is recommended to
use the SYSREF_WIN_NEG and SYSREF_WIN_POS bits
in Register 0x1EA to allow for slight variation in SYSREF±
timing relative to DIG_CLK.
A phase variance of ±1 ADC clock cycles ultimately results
in fractions of a sample when referenced to the IQ output
data rate, fDATA_IQ, depending on the decimation factor. For
example, for a decimation factor of 32, the phase uncertainty
is expressed as ±1/32 samples relative to fDATA_IQ.
The course and fine digital NCOs are also set to an initial
phase up defined in Register 0x143 thru Register 0x145
upon receiving SYSREF±.
Figure 127 shows how the HMC7044 (or the AD9528) can
be used for mulichip synchronization. The HMC7044 is best
suited for delivering a low phase noise RF clock source for
each AD6676 (refer to Figure 135). In addition, its ability
to individually control the delays of both the CLK and
SYSREF signals to each AD6676 device allows
compensation of PCB skew delays.
Figure 126. Block Diagram Showing Options of Sampling the SYSREF Input Signal with the Clock Synthesizer Disabled or Enabled
Rev. D | Page 51 of 90
AD6676
Data Sheet
HMC7044
(OR AD9528)
1nF
CLKOUT0
CLKOUT
AD6676
CLK+
1nF
CLK–
CLKOUT0
240Ω
240Ω
1nF
SCLKOUT1
SYSREF+
SYSREF
1nF
SCLKOUT1
SYSREF–
240Ω
240Ω
1nF
CLKOUT2
AD6676
CLK+
1nF
CLK–
CLKOUT2
240Ω
240Ω
1nF
SCLKOUT3
SYSREF+
1nF
240Ω
240Ω
12348-727
SYSREF–
SCLKOUT3
Figure 127. Example of Multichip Synchronization of the AD6676 Using the HMC7044 or the AD9528
Rev. D | Page 52 of 90
Data Sheet
AD6676
APPLICATIONS INFORMATION
ANALOG INPUT CONSIDERATIONS
Table 20. Harmonic Levels When Dual Tones = −6 dBFS of
PIN_0dBFS Level is Situated at IF/2
Equivalent Input Impedance and S11
10
61
9
60
8
59
7
58
6
57
5
SHUNT
SHUNT
SHUNT
SHUNT
56
55
54
R WITH ATTENUATOR = 0dB
R WITH ATTENUATOR = 6dB
C WITH ATTENUATOR = 0dB
C WITH ATTENUATOR = 6dB
4
3
2
53
52
IF
(MHz)
200
250
300
350
400
LEXT
(nH)
43
19
19
10
10
PIN_0dBFS
(dBm)
−2.5
−2.2
−2.2
−2.2
−2.2
Dual Tone
Input Power
(dBm)
−8.5
−8.2
−8.2
−8.2
−8.2
f1 + f2
Spur
(dBc)
−69.5
−68.3
−73
−66.3
−68.5
Equivalent
IP2 (dBm)
61
60
65
58.5
60
Above the IF pass band, the AD6676 is sensitive to high frequency
blockers that can increase the noise floor due to jitter or generate an
image component that falls back into the pass band. The AD6676 is
also fairly insensitive to spurious tones falling in the alias regions
occurring at FADC ± FIF because the AD6676 provides over 50 dB
of alias rejection. Table 21 shows the typical alias rejection for
different FADC and IF combinations. Because mixers often produce
fixed large spurious at M × LO as well as its sum term of LO +
FRF, determine if any of these spurs can fall in the alias regions and
if so, add the appropriate level of filtering to suppress them below
the receivers required spurious level.
SHUNT C (pF)
62
1
0
100
200
300
400
500
600
700
FREQUENCY (MHz)
800
900
0
1000
12348-703
SHUNT R (Ω)
The AD6676 benign input structure along with its low drive
level requirements facilitates interfacing it to external driver
circuitry. Figure 128 shows the equivalent parallel impedance
for attenuator settings of 0 dB and 6 dB. Note that the slight
variation in impedance between the different attenuator settings
is an error source affecting the absolute accuracy of the attenuator
settings. The AD6676 input also displays excellent S11 return
loss over a wide frequency range, as shown in Figure 94.
Figure 128. Typical Equivalent Parallel Impedance of AIN for Attenuator = 0
and 6 dB Settings
Input Driver and Filter Considerations
The input driver requirements, along with any additional
filtering, are application dependent. Additional filtering maybe
considered if any large signal content or blockers falling above
or below the IF pass band of interest can cause desensitization
by either increasing the ADC noise or spur floor. Below the IF
pass band, the AD6676 is most sensitive to second harmonic
content that is typically induced by the driver stage itself due
to its limited IP2 performance. The AD6676 second-order
nonlinearity contribution is typically on par with a balanced
mixer and well below the contribution of a single-ended amplifier
stage (with output balun) used for VHF applications. Table 20
shows the measured f1 + f2 spurious level and equivalent IIP2
for different IFs when dual tones are injected at −6 dBFS levels
and at IF/2.
Table 21. Typical Alias Rejection for Different IF and ADC
Combinations
FADC (MHz)
2000
2400
2800
3200
IF (MHz)
150
200
300
400
FADC − IF Alias
Rejection (dBc)
58
53
51
51
FADC + IF Alias
Rejection (dBc)
59
54
59
59
Because the required attenuation of out-of-band signal signals is
application dependent, evaluate the AD6676 under the desired
application conditions to understand the effects and determine
what amount of filtering is required. In practice, a simple thirdorder low-pass roofing filter can provide adequate additional
suppression against spurs falling in the alias regions as well as
large signal signals falling a few 100 MHz above the IF pass
band. Note that the AD6676EBZ includes an optional 500 MHz
third-order low-pass filter (TDK MEA1210D501R) that may
suffice for many applications. This small, 0302 size differential
filter is also available with lower frequency options. Its effect on
the pass band flatness is mimimal but provides provides additional
suppression beyond 700 MHz. as shown in Figure 129 as well as
in the alias region as shown in Table 22.
Rev. D | Page 53 of 90
AD6676
Data Sheet
harmonics that are sensitive to balance fall outside the pass band.
Note that the second harmonic of the gain block still must fall
outside the VHF pass band so that it can also be digitally filtered.
0
–5
Some additional considerations pertaining to the analog input
are as follows:
–10
–15

WITHOUT
TDK LPF
–20
–25
WITH TDK LPF
–30
–35
0
100
200
300
400
500
600
700
800
900
1000
FREQUENCY (MHz)
12348-704
NORMALIZED STF RESPONSE (dBFS)
5

Figure 129. TDK Filter Has Minimal Effect on the Pass Band IF Response
Table 22. Typical Alias Rejection for Different IF and ADC
Combinations with TDK 500 MHz Low-Pass Filter Added
FADC (MHz)
2000
2400
2800
3200
IF (MHz)
150
200
300
400
FADC − IF Alias
Rejection (dBc)
82
77
71
74

FADC + IF Alias
Rejection (dBc)
83
85
83
81
A 1:1 balun is required in applications where the last amplification
stage is single-ended with a ZOUT of 50 Ω. This is typically the
case in a VHF receiver application where a gain block, such as
the ADL5541 to ADL5545 series, precedes the AD6676 for
preamplification.
ADL5541
TO
ADL5545
DEVICES
VHF
SIGNAL
1:1 BALUN
(MABA-007159)
1nF
AD6676
VIN+
12348-077
VIN–
1nF
Figure 130. RF Line-Up for Direct Sampling VHF Application
For many RF receiver applications, this differential signal may
originate from a RF-to-IF mixer whose output impedance often
falls within a 50 Ω to 200 Ω range. A low order matching network
that also serves as a low-pass roofing filter can compensate for
the mismatch impedance. It is worth noting that the impedance
mismatch between a source/load mismatch of 200 Ω/60 Ω and
100 Ω/60 Ω is approximately 1.5 dB and 0.3 dB, respectively. This
low mismatch loss may be tolerable for some applications
seeking a wide, low ripple IF pass band, especially considering
the loss of a higher order matching network with finite Q
components. Lastly, it is possible to reduce the ADC maximum
input power requirements slightly to compensate for this low
loss with minimal loss in dynamic range.
Other receiver applications in the VHF band may prefer that
the AD6676 directly digitize the signal. Typically, the radio lineup
may include a low NF gain block whose single-ended output is
converted to a differential output via an ac-coupled balun. The
amplitude/phase balance requirements of balun can be relaxed
(compared to traditional pipeline ADCs) because the even order
AC coupling with 10 nF or greater capacitors to the VIN±
input is required to a maintain 1 V common-mode voltage.
Note that this capacitor provides a high-pass response with
the AD6676 input impedance and thus must be sized
accordingly for low IF applications to prevent excessive
droop on the lower pass band response.
A series 10 Ω resistor and 0.1 μF decoupling capacitor is
recommended between the 2.5 V supply and first resonators
to provide additional filtering of supply induced noise and
ADC common-mode currents.
The feedback DAC (operating up to 3.2 GHz) also
generates high frequency content (that is, images, clock
feedthrough and shaped noise) that is ideally absorbed by
the internal source follower. Due to its finite impedance at
the higher frequencies, a small amount of this undesired
signal content leaks through the attenuator path back to
the VIN± input. Passive mixers are particularly susceptible
to this signal content due to poor isolation between the IF
and RF ports while passive mixers with on-chip IF amps
and active mixers provide a greater degree of reverse
isolation. A simple third-order roofing filter typically
provides sufficient rejection to suppress these ADC
artifacts while also suppressing the larger M × N artifacts
of the mixer. Note that this filter must be designed as two
single-ended, pi network filters with shunt capacitors
located next to the VIN± pins to steer this undesired signal
content to ground. Also, use care in component selection
and layout to reduce parasitics that can cause unanticipated
peaking in the stop-band region of the filter response.
CLOCK INPUT CONSIDERATIONS
The AD6676 Σ-Δ ADC operates with an internal ADC clock
rate (FADC) between 2.0 GSPS to 3.2 GSPS. The clock signal can
originate from an external clock source or, alternatively, from its
on-chip clock synthesizer. Consider an external clock source if
the on-chip synthesizer phase noise or spurious level is not
deemed sufficient or if the desired FADC falls below the 2.94 GHz
to 3.2 GHz range of the VCO. Referring to Figure 60, the selfbiased clock receiver is configured as either a differential or singleended receiver, depending on whether the clock synthesizer is
disabled. In either case, the external clock source must be ac
coupled to the AD6676 CLK± input and meet the minimum
specified input level and slew rate. Also, clock jitter and phase
noise must always be a concern in selecting the clock source.
When the clock synthesizer is enabled, the CLK± inputs are
connected to CMOS inverters as shown in Figure 60. These
inverters are self-biased at approximately 0.55 V and present an
input resistance exceeding 1.2 kΩ when Bit 2 of Register 0x2BB
is set.
Rev. D | Page 54 of 90
Data Sheet
AD6676
When the clock synthesizer is disabled, the CLK± inputs are
connected to a high speed differential clock receiver with on-chip
100 Ω termination to simplify interfacing to CML, LVPECL, or
sinusoidal clock sources. The clock signal is typically ac-coupled to
the CLK+ and CLK− pins via an RF balun or capacitors. These
pins are biased internally (see Figure 60) at approximately 700 mV
and require no external bias. The equivalent shunt impedance of
the CLK± input is shown in Figure 131. It is recommended to
use a 100 Ω differential transmission line to route the clock signal
to the CLK+ and CLK− pins due to the high frequency nature
of the signal.
130
INSTALL 100Ω
DIFFERENTIAL RESISTOR
ONLY WHEN CLK SYN
IS ENABLED
HMC7044,
AD9528 OR
ADCLK925
CLK+
10nF
PECL
DRIVER
AD6676
10nF
CLK–
240Ω
240Ω
1.0
110
0.6
100
0.4
90
0.2
80
0
70
Figure 133. Differential PECL Sample Clock Using the HMC7044, AD9528, and
ADCLK925
0.8
CAPACITANCE (pF)
REAL SHUNT
CAPACITANCE SHUNT
120
–0.2
60
50
2.0
2.5
3.0
–0.4
4.0
3.5
FREQUENCY (GHz)
12348-705
REAL SHUNT (Ω)
A single-ended CMOS or differential ac-coupled PECL/HSTL
clock signal can be delivered via clock generation and distribution
ICs such as the Analog Devices HMC7044, AD9528, and
ADCLK925. A PECL clock signal is recommended when providing
an RF clock input signal to the AD6676 or in applications that
require deterministic latency or synchronization while using the
internal clock synthesizer of the AD6676. Figure 133 shows a
simple differential interface in which the AD6676 interfaces to
the PECL output available from these ICs. The HMC7044 is an
excellent choice for JESD204B clock generation and multichip
synchronization because it also generates a very low phase noise
RF clock from 2.4 GHz to 3.2 GHz for multiple AD6676 devices.
12348-081
A single-ended clock source need only be ac coupled to the CLK+
input because the inverter output for CLK− input is not used.
For CMOS drivers, the addition of a 33 Ω series resistor is
recommended to dampen the response for long trace lengths.
For a differential clock source, such as an LVDS or PECL source,
the addition of a 100 Ω external termination resistor across the
CLK± pins is recommended to minimize any reflections that
result from distorting the clock input waveform.
Alternatively, PLL clock synthesizers with on-chip VCOs such
as the ADF4351, the ADF4355-2, and HMC1034 also make
excellent RF clock sources when multichip synchronization is
not required. The CML outputs of these devices allow a simple
interface as shown in Figure 134. Figure 135 compares the close
in phase noise between the ADF4351, the ADF4355-2, the
HMC7044, the AD6676 clock synthesizer, and the R&S SMA100A
for a near full-scale sine wave at 300 MHz. Note that the phase
noise improvement offered by the high quality RF generator only
becomes evident below 400 kHz when compared to the ADF4351.
Figure 131. Equivalent Shunt Differential Input Impedance of the CLK± Pins
with the Clock Synthesizer Disabled
3.9nH
PLL
FREF
VCO
REFOUTA+
AD6676
CLK+
CLK–
REFOUTA–
ADF4351
ADF4355-2
1nF
REFOUTB+
REFOUTB–
1nF
0.8V p-p
12348-079
VVCO
DIV-BY-2N
Figure 132 shows a single-ended clock solution for the AD6676
when its clock synthesizer is disabled. The low phase noise singleended source can be from an external VCXO. A ceramic RF chip
1:2 ratio balun creates the differential clock input signal. The
balun must be specified to have low loss (that is, less than 2 dB)
at the clock frequency of interest. The single-ended clock source
must be capable of 0 dBm drive capability to ensure adequate
signal swing into the clock input.
Figure 134. Differential CML Driver from the ADF4351 and the ADF4355-2
100pF
100pF
AD6676
CLK+
CLK–
JT 4000BL14100 100pF
12348-078
CLOCK
INPUT
Figure 132. Balun Coupled Differential Clock
Rev. D | Page 55 of 90
AD6676
Data Sheet
–110
Figure 136 shows a normalized image graph (relative to fDATA_IQ)
showing the image location relative for a given input frequency.
ADF4351
When N > 1, spurious content is often at lower magnitude than
other spurious thus often can be ignored. The exception is when
fIN falls below the IF pass band such that its lower order harmonics
may fall within the pass band (that is, IF/2 and IF/3).
–120
–125
AD6676 CLK SYN
–130
–135
ADF4355-2
R&S SMA100A
4.5
M=3
–140
M=2
M=1
4.0
HMC7044
0.1
FREQUENCY OFFSET (MHz)
1
Figure 135. Close In Phase Noise Comparison for Different Analog Devices
Clock Sources when Compared to the R&S SMA100A and the AD6676 Clock
Synthesizer (IF = 300 MHz, BW = 40 MHz, FADC = 3.2 GHz, L = 19 nH)
IF FREQUENCY PLANNING
3.0
M=7
2.5
2.0
M=6
1.5
1.0
The Σ-Δ ADC can achieve exceptional SFDR performance over
a wide IF frequency range because its high oversampling ratio
prevents low order harmonics from aliasing into the IF pass band.
Higher order harmonics that do alias back are typically of much
lower magnitude, with the shuffling option further reducing
their levels. However, finite isolation between the Σ-Δ ADC and
the digital block causes additional spurious signals that are a
function of the output data rate, fDATA_IQ, and input frequency,
fIN. Specifically, the feedback DACs in the Σ-Δ ADC suffer from
digital contamination of its clock signal. Therefore, the same
equation used to predict spurious locations on high speed DACs
with digital interpolation filters applies.
Equation 15 defines this relationship with the spur location
falling at fMN.
fMN = ±(M × fDATA_IQ) ± (N × fIN)
M=8
3.5
(15)
where:
M is the digital induced harmonic content from internal clocks.
N is the harmonics from the Σ-Δ ADC.
When N = 0, signal independent spurs fall at integer multiples
of fDATA_IQ. Table 23 shows the measured M × fDATA_IQ spurious
levels (dBFS) for different IF frequencies and decimation factors
with fDATA_IQ equal to 100 MSPS and 200 MSPS. All of the M ×
fDATA_IQ regions display low spurious with the exception of
200 MHz. This is because a large portion of digital circuitry is
clocked at FADC/16 for DEC_MODES of 1 and 3 or FADC/12 for
DEC_MODES of 2 and 4. As a result, the M = 2 spur is dominant
when operating at the higher decimation factors of 32 and 24
whereas the M = 1 spur is dominant when operating at the
lower decimation factors of 16 and 12.
When N = 1, signal dependent spurs falls at integer multiples of
fDATA_IQ. These M × N spurs are called images because they have
a 1:1 relationship in amplitude and frequency with the input signal,
fIN. Note that the magnitude of some images can also vary slightly
between power cycles, due to different phase relationships among
internal clock dividers upon device initialization.
M=2
0.5
0.5
1.0
M=3
1.5
2.0
M=4
2.5
3.0
M=5
3.5
4.0
4.5
NORMALIZED INPUT FREQUENCY
12348-082
–150
–155
0.01
NORMALIZED IMAGE LOCATION
–145
12348-080
PHASE NOISE @ IF = 300MHz (dBc/Hz)
AVG = 300
–115
Figure 136. Image Location for Different M Factors Normalized to fDATA_IQ
Table 23. Measured Spurious Levels at Different IFs Where
M × fDATA_IQ Falls On for fDATA_IQ of 100 MSPS and 200 MSPS
fDATA_IQ
100 MSPS
DEC_MODE = 1
DEC_MODE = 2
200 MSPS
DEC_MODE = 3
DEC_MODE = 4
1
IF =
100 MHz
Spurious Levels (dBFS)
IF =
IF =
IF =
200 MHz 300 MHz 400 MHz
<−100
−100
−81
−79
<−110
<−110
−97
N/A1
<−110
<−110
−81
−77
<−110
<−110
−90
N/A1
N/A means not applicable.
Because the image spurs are also at low levels, the AD6676 offers a
wide range of suitable IFs for a given output data rate, fDATA_IQ.
Even IFs that are situated in a region where the worst M × fDATA_IQ
spurious condition described in Table 23 can be used because
they remain at a fixed location and remain signal independent.
Similar to the LO feedthrough issue in a direct conversion IQ
receiver, a slow digital tracking loop in the host processor can
be used to nullify it. Figure 137 and Figure 138 show a case where
the IF of 200 MHz was selected for an fDATA_IQ of 200 MSPS and
100 MSPS such that dominant spur falls exactly at the IF center.
As shown in Figure 136, the IF is positioned at a normalized
fDATA_IQ of 1 or 2 for 200 MSPS and 100 MSPS operation, thus
explaining why the image term is M = 2 or 4. Note that the image
spur is quite low for M = 2 and can be further improved by
selecting a higher decimation factor (DEC_MODE of 3 vs. 1)
that results in the M = 4 image.
Rev. D | Page 56 of 90
Data Sheet
AD6676
0
0
–10
–10
fIN = 180MHz
–40
–50
M = 1, N = 0 SPUR
@ –81dBFS
–60
M = 2, N = –1 SPUR
@ –88dBc
–70
–80
–90
–60
–70
–80
–90
–100
–100
–110
NBW = 9.2kHz
170
180
190
200
210
220
230
240
250
Figure 137. Image Spur for fDATA_IQ = 200 MSPS (DEC_MODE = 3) Attributed to
M = 2, N = −1
0
NBW = 9.2kHz
210
220
230
240
250
260
270
INPUT FREQUENCY (MHz)
280
290
300
Figure 139. Digital Induced Spurs for an IF That Is Centered Between fDATA_IQ
and 1.5 × fDATA_IQ with fDATA_IQ = 200 MSPS
PCB DESIGN GUIDELINES
–10
fIN = 180MHz
(–1dBFS)
–30
–40
–50
M = 1, N = 0 SPUR
@ –81dBFS
–60
–70
M = 4, N = –1 SPUR
@ –96dBc
–80
–90
–100
–110
NBW = 9.2kHz
160
170
180
190
200
210
220
230
240
INPUT FREQUENCY (MHz)
250
12348-084
–120
150
–120
200
12348-083
160
INPUT FREQUENCY (MHz)
SPUR (dBFS/NBW)
–40
–50
–110
–20
(–1dBFS)
–30
SPUR (dBFS/NBW)
SPUR (dBFS/NBW)
–30
–120
150
fIN = 238MHz
–20
(–1dBFS)
12348-085
–20
Figure 138. Reduction in Image Spur When fDATA_IQ is Reduced to 100 MSPS
IF pass band regions that remain free of any of these spurs exist
in the following regions for a swept input tone across its pass band:
(M − 0.5) × fDATA_IQ < IF Pass Band < M × fDATA_IQ
The design of the PCB is critical in achieving the full performance
of the AD6676. The AD6676EBZ evaluation board, used for
characterizing the AD6676 ac performance, serves as an example of
a possible layout that uses 0.1 mm (4 mil) through-hole vias under
the device. Figure 140 shows the top side PCB layout of the region
surrounding the AD6676 where all the critical analog input/
outputs, digital input/outputs, and passive components reside.
An alternative top side layout is shown in Figure 141 that avoids
any through-hole vias under the device. Because this modified
layout resulted in only a slight degradation in IMD performance,
consider this layout option if via placement under the device is
not possible.
Note the following:

(16)

Or
M × fDATA_IQ < IF Pass Band < (M + 0.5) × fDATA_IQ
(17)
Note that because these spur free regions have a bandwidth of
0.5 × fDATA_IQ, it is often desirable to use a higher fDATA_IQ rate (that is,
lower decimation factor) to support larger IF bands. Figure 139
shows a spur free region swept SFDR less than −95 dBFS with
fDATA_IQ = 200 MSPS and BW = 100 MHz with the IF now centered
at 250 MHz. Selecting an IF situated at 350 MHz and BW =
100 MHz also produces similar results.


Rev. D | Page 57 of 90
The PCB is a 6-layer board (1.6 mm thick) based on FR4
dielectric that avoids any expensive options, such as micro,
hidden or blind vias, thus allowing cost effective
manufacturing.
Critical analog and digital high speed signal paths are
routed on the first layer with controlled impedances. The
lower speed CMOS digital input/outputs are placed on the
back side sixth layer.
A single solid ground plane is used as the second layer
underneath the AD6676. The dielectric spacing is 8 mil
to establish controlled impedances with the critical signal
layer above.
The third and fourth layers are dedicated power planes used to
isolate the different AD6676 supply domains, and the fifth
layer is a solid ground plane. The dielectric spacing between
the second and third layer and the fourth and fifth layer is
3 mil to increase the distributed decoupling capacitance for
each supply domain.
Special consideration was given to via placement, ground fill,
and power supply plane layout to main low thermal and
electrical impedances.
AD6676


12348-086

All critical passive components, such as dc blocking and
power supply decoupling capacitors, are 0201 size and placed
on top side of the PCB. Two 0201 decoupling capacitors
(0.001 μF and 0.1 μF) are placed adjacent to supply pins
with the lower value placed closer to the AD6676.
The analog 1.1 V supply pins of the AD6676 share a common
1.1 V supply domain and are tied together below the device.
VSS2OUT (Pin G7) must be connected to VSS2IN (Pin F6)
on the top side layer of the PCB.
The alternative layout shown in Figure 141 uses 0.2 mm
through-hole vias just outside of the AD6676 package for
all supply and ground domains with all of the 1.1 V analog
supply domains (VDD1, VDDL, VDDC, and VDDQ)
connected to each other providing a low impedance path to
the critical inner VDD1 and VDDL balls. This alternative
layout also avoids any narrow signal traces to inner row balls
(with exception of CSB) by using a 3-wire SPI interface (with
the SDIO, RESETB, AGC4, and AGC3 balls left open).
Note that the thin inner trace for CSB (positioned between
the SCLK and SYNCINB− balls) could have been avoided
by running a wider straight trace instead of connecting the
CSB and SYNCINB− balls because, by default, the SYNCINB
input is configured for a CMOS input with only SYNCINB+
used for signaling (and SYNCINB− ignored).
Figure 140. AD6676EBZ PCB Top Side Layout Example
12348-800

Data Sheet
Figure 141. Alternative PCB Top Side Layout Example That Avoids a Through
Hole Via under the Device
Additional information specifically pertaining to the WLCSP
package considerations is contained in the AN-617 Application
Note. This application note covers PCB design guidelines,
assembly, reliability, and rework in detail.
Rev. D | Page 58 of 90
Data Sheet
AD6676
POWERING THE AD6676
ADP1752-1.1
The AD6676 requires the following analog and digital power
supplies with no restrictions on the power supply sequencing order:
An analog 2.5 V and 1.1 V supply
A digital 1.1 V and digital input/output supply of 1.8 V to 2.5 V
The current consumption from the different analog and digital
supply domains does not vary much over the specified 2.0 GHz
to 3.2 GHz ADC clock rate range nor the digital decimation factor
and number of JESD204B lanes used. Table 24 shows the
dependency of a typical device as these settings are modified with
the IF and BW remaining fixed at 250 MHz and 75 MHz,
respectively.
Figure 142 shows the recommended method used on the
AD6676EBZ where a universal 3.3 V supply is available. Note
that various analog and digital supply domains within the
AD6676 are grouped together to reduce the external LDO
requirements. A high efficiency step-down regulator, such as
the ADP2164, is used to generate a 1.6 V output that drives
separate low drop-out LDOs for the analog VDD1 and digital
VDDD supplies.
1.6V
ADP1752-1.1
3.3V
ADP1752-2.5
VDD2, VDD2NV
ADP1752-1.8
VDDIO
VDDD, VDDHSI
12348-087


ADP2164
VDD1, VDDL, VDDC, VDDQ
Figure 142. Low Noise Power Solution for the AD6676
Separate LDOs for the 1.1 V analog and digital supplies provide
greater isolation between these critical supply domains as well
as reduce the IR drops across ferrite beads that provide further
isolation. High quality LDOs that exhibit better PSSR characteristics
at the switching regulators operating frequency are preferable.
Note that the digital VDDIO supply of the AD6676 is only used
for the CMOS SPI and AGCx input/output pins thus it can be
tied to the same supply domain used by the host that is connected
to these pins. Alternatively, the ADP223 dual output LDO can
be used instead of the ADP1752-2.5 and ADP1752-1.8.
On the analog 1.1 V supply, amplitude modulation can result in
phase modulation via the clock supplies of the AD6676 (VDDC,
VDDQ).
Table 24. Current Consumption Variation as FADC Is Varied from 3.2 GHz to 2.0 GHz
Supply Current
IVDD1+ IVDDL
IVDDC + IVDDQ
IVDD2 + IVDD2NV
IVDDD
IVDDHSI
Conditions
Not applicable
Not applicable
Not applicable
Decimate by 16
Decimate by 32
Two lane
One lane
3.2 GHz
371
60
143
152
155
168
166
2.8 GHz
364
59
140
144
150
168
167
Rev. D | Page 59 of 90
fCLK
2.4 GHz
357
56
139
131
135
168
167
2.0 GHz
351
52
139
100
106
158
161
Unit
mA
mA
mA
mA
mA
mA
mA
AD6676
Data Sheet
–98
–100
–102
–104
–106
–78
–108
–80
–110
100
150
200
250
300
350
400
450
500
Figure 144. Sideband Spur Level for 1 mV p-p, Continuous Wave Tone
Injected on Analog 2.5 V Supply Domain
–84
–86
400MHz
800MHz
1600MHz
3200MHz
–88
–90
100
400MHz
800MHz
1600MHz
3200MHz
IF INPUT FREQUENCY (MHz)
–82
150
200
250
300
350
400
IF INPUT FREQUENCY (MHz)
450
500
12348-706
SIDEBAND LEVEL (dBc)
–76
–96
12348-707
–74
–94
SIDEBAND LEVEL (dBc)
Figure 143 and Figure 144 show the measured sideband level in
dBc that results if a 1 mV p-p continuous wave tone has frequencies
common among switching regulators are injected onto the 1.1 V
and 2.5 V analog supplies. Note that the sideband level increases
at roughly 6 dB per octave in IF frequency for the 1.1 V supply
domain case because the supply noise results in PM modulation
that affects the clock jitter.
Figure 143. Sideband Spur Level for 1 mV p-p, Continuous Wave Tone
Injected on Analog 1.1 V Supply Domain
On the digital 1.1 V supply, amplitude modulation on the
JESD204B high speed serializer supply (VDDHSI) can
negatively impact the eye opening of the digital data output
stream. For these reasons, low noise LDOs, such as the
ADP1752, that have a worst-case accuracy of 2% over line, load,
and temperature are used for the analog VDD2 and VDD1
supplies. The same regulator is used for the digital VDDD for
its low dropout characteristics, power supply rejection ratio, and
load capability. Although the digital VDDD is used for the less
critical VDDIO supply, a smaller, lower cost regulator such as
the ADP121, can also be used to supply 1.8 V.
Rev. D | Page 60 of 90
Data Sheet
AD6676
AD6676 START-UP INITIALIZATION
ALL REGISTERS
RETURNED
TO DEFAULT
HARDWARE OR
SOFTWARE
RESET
On power-up of the AD6676, a host processor is required to
initialize and configure the AD6676 via its SPI port. Figure 145
shows a flowchart of the sequential steps required to bring the
AD6676 to an operational state. The number of SPI writes and total
initialization time is dependent on whether the clock synthesizer
is used, as well as any additional configuration associated with the
AGC features or its pin configurations. Note that wait states are
required during different steps in the initialization process to
allow various actions, such as calibration and tuning, to be
completed before moving to the next step.
WAIT
(2ms)
INITIALIZE
RF CLK
PATH
NO
CLK SYN?
YES
INITIALIZE
CLK SYN
PROGRAM CONFIGURATION SETTINGS
JESD204B CONFIGURATION
ADC PARAMETERS
Table 26 shows the minimum SPI writes required to enable the
AD6676. Note the following in the sequence of steps shown in
Table 26:
RUN RESON1 CAL
WITH DEC_MODE=1

WAIT
(400ms)
CAL OK?
RESON1 TUNE ERROR
(MAKE TWO MORE
ATTEMPTS)
NO
YES
PROGRAM DECIMATION MODE
RUN ADC CAL + JESD204B
INITIALIZATION
CALIBRATION + TUNING
WAIT
(400ms)
CAL OK?
ADC CAL/TUNE ERROR
(MAKE TWO MORE
ATTEMPTS)
NO
YES
AD6676
OPERATIONAL
PROGRAM OPTIONAL SETTINGS
AGC CONFIGURATION
ADC SHUFFLER
12348-088
The example SPI writes pertain to the following settings:
FADC = 3.200 GHz, FO = 250 MHz, BW = 100 MHz, IDAC1FS =
2 mA, MRGN_L = MRGN_U = 10 MHz, MRGN_IF =
1 MHz, fDATA_IQ = 200 MSPS with decimate by 16, and fREF =
200 MHz with the clock synthesizer enabled.
 Step 3 refers to Table 28 for the necessary SPI writes when
the clock synthesizer is enabled or disabled, respectively.
Example AGC parameters are included in Table 29 but are
nonessential to device operation.
 The RESON1 calibration for the ADC occurs first with default
DEC_MODE setting. DEC_MODE is updated to the user
specified setting prior to JESD204B calibration.
 ADC and JESD204B calibration and initialization must be
successful on first attempt. However, Step 24 and Step 30 are
included to provide coverage against external events (supply
or clock glitch) that can corrupt this process.
The AD6676EVB software GUI has an option that automatically
generates and saves the series of SPI writes in the .csv file
format, as shown in Table 25, which is the preferred method for
generating the AD6676 SPI write initialization sequence. Note
the following:
 The SPI sequence can be shorter when the AD6676EVB
development platform is connected to the PC because the
software also performs a SPI read back and then only
writes to those SPI registers that have been changed from
its default setting.
 To generate a SPI initialization sequence for an alternative
development platform, ensure that the AD6676EVB
development platform is disconnected from the PC
 When the software GUI is configured for the profile feature,
Register 0x115 and Register 0x118 specify the calibration
and ADC profile, respectively, that pertain to the specific
ADC application parameter settings in Register 0x100 thru
Register 0x109 that follow. A SPI write of 0x01 to
Register 0x116 follows to initiate the ADC tuning. This
process repeats itself for the remaining specified profiles.
Figure 145. Flowchart for Initialization and Configuration of the AD6676
Table 25. Example of Saved .CSV File Format
Register Address
0x000
0x2A5
0x2A0
…
…
Rev. D | Page 61 of 90
Write
0x99
0x05
0xC0
…
…
AD6676
Data Sheet
Table 26. SPI Initialization Example, fCLK = 3.2 GHz, FIF = 250 MHz, BW = 100 MHz, IDAC1FS = 2 mA, MRGN_L = MRGN_U = 10 MHz,
MRGN_IF = 1 MHz, fDATA_IQ = 200 MSPS with Decimate by 16
Step
1
2
3
Address (Hex)1
0x000
Write Value1
0x99
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
0x1E7
0x1C0
0x1C1
0x1C3
0x1C4
0x1C5
0x1EC
0x100
0x101
0x102
0x103
0x104
0x105
0x106
0x107
0x108
0x109
0x10A
0x116
0x04
0x01
0x05
0x01
0x01
0x0F
0xBD
0x80
0x0C
0xFA
0x00
0x64
0x00
0x13
0x0a
0x0a
0x01
0x20
0x0A
0x11A
0x11A
0x01
0x00
27
0x140
0x03
28
29
0x116
0x17
0x11A
0x11A
0x01
0x00
24
25
26
30
31
32
33
1
Comments
Software reset, 4-wire SPI.
Wait 2 ms for SPI initialization after reset.
CLK path or CLK SYN initialization (see Table 28 for using external RF clock; refer to Table 27 for
using internal CLK SYN.)
Select LVDS input for SYNCINB receiver.
JESD204 (DID = 1, optional).
JESD204 (BID = 5, optional).
JESD204B (SCR = 0, L = 2).
JESD204B (F = 2).
JESD204B (K = 16).
Configure PHY output driver.
Set FADC to 3200 MHz.
Set FADC to 3200 MHz.
Set the IF to 250 MHz.
Set the IF to 250 MHz.
Set the BW_0 to 100 MHz.
Set the BW_1 to 0 MHz.
Set LEXT to 19 nH.
Set MRGN_L to 10 MHz.
Set MRGN_U to 10 MHz.
Set MRGN_IF to 1 MHz.
Set IDAC1FS to 2 mA, resulting in PIN_0dBFS = −8 dBm.
Initiate RESON1 calibration.
Wait 250 ms for fCLK = 3.2 GHz. Note that the wait time scales with fCLK proportionally such that
the wait = 400 ms for fCLK = 2 GHz.
Read back Register 0x117 to see if Bit 0 has been set to 1 indicating ADC calibration is complete. If
not, proceed to Step 25.
Force end of calibration (toggle Bit 0).
Force end of calibration (toggle Bit 0).
Return to Step 22 and attempt again. Make two attempts before breaking out of loop if the
calibration problem persists.
Set DEC_MODE to user defined setting of decimate by 16. Note that coarse and fine NCO
settings (SPI Register 0x141 and SPI Register 0x142) are automatically set based on FADC and IF
settings (Register 0x100 to Register 0x103).
Calibrate and initiate ADC; set-up and initiate JESD204B.
Wait 250 ms for fCLK = 3.2 GHz. Note that wait time scales with fCLK proportionally such that the
wait = 400 ms for fCLK = 2 GHz.
Read back Register 0x117 to see if Bit 0 has been set to 1 indicating ADC calibration is complete. If
not, proceed to Step 31.
Force end of calibration (toggle Bit 0).
Force end of calibration (toggle Bit 0).
Return to Step 28 and attempt again. Make two attempts before breaking out of loop if the
calibration problem persists.
Insert the optional AGC and nondefault shuffler settings (see Table 29 and Table 30 for an example).
Cells in the Address (Hex) column and Write Value column were left intentionally blank.
Rev. D | Page 62 of 90
Data Sheet
AD6676
Table 27. SPI CLK SYN Initialization Example, fCLK = 2.94912 GHz, fREF = 122.88 MHz (Suitable for Decimation by 24)
Step
1
2
3
4
5
6
7
8
9
Address (Hex)1
0x2A1
0x2A2
0x2A5
0x2AC
0x2B7
0x2BB
0x2A0
0x2AB
Write Value1
0x60
0x00
0x08
0x18
0xF0
0x7D
0x7D
0xC5
10
0x2AD
0x80
1
Comments
Set the integer-N value.
Set the integer-N value.
Reset VCO calibration.
Set the charge pump current (see Table 12).
Configure VCO.
Set the reference divider to DIV = 2, such that fPFD = 61.44 MHz (see Table 11).
Enable CLKSYN and the ADC clock.
Start VCO calibration.
Wait at least 400 ns because fPFD = 50 MHz.
Register 0x2BC, Bit 1 = 0 indicates that VCO calibration is done.
Start charge pump calibration.
Wait at least 800 ns because fPFD = 50 MHz.
Register 0x2BC, Bit 0 = 1 indicates that the charge pump is done.
Register 0x2BC, Bit 3 = 1 confirms that the PLL is locked.
Cells in the Address (Hex) column and Write Value column were left intentionally blank.
Table 28. SPI fCLK Initialization
Step
1
2
Address
0x2A5
0x2A0
Write Value
0x05
0xC0
Comments
Select RF clock path
Enable RF clock receiver and ADC clock
Table 29. SPI AGC Initialization Example
Step
1
2
3
Address
0x181
0x182
0x19E
Write Value
0x00
0x06
0x13
4
5
6
7
8
9
10
11
0x19B
0x19C
0x193
0x194
0x197
0x198
0x199
0x19A
0x04
0x06
0x00
0x0d
0x00
0x09
0x01
0x02
Comments
Set ATTEN_VALUE_PIN0 to 0 dB.
Set ATTEN_VALUE_PIN1 to 6 dB.
Enable FLAG1 and 0 on AGC4 and AGC3 pins, respectively. Also, logical OR of ADC reset with a
peak detect threshold flag.
Select AGC Flag 0 above Peak Threshold 0.
Select AGC Flag 1 below low threshold.
Peak Threshold 0 set to −3 dBFS.
Peak Threshold 0 set to −3 dBFS.
Low Threshold set to −15 dBFS.
Low Threshold set to −15 dBFS.
Low threshold dwell time mantissa.
Low threshold dwell time exponent.
Table 30. SPI Shuffler Initialization Example
Step
1
2
Address
0x342
0x343
Write Value
0x3F
0xFF
Comments
Shuffle every two clock cycles with a threshold of 3.
Rev. D | Page 63 of 90
AD6676
Data Sheet
SERIAL PORT INTERFACE (SPI)
SPI REGISTER MAP DESCRIPTION
SPI OPERATION
The AD6676 contains a set of programmable registers (described in
the Register Memory Map section) that initialize and configure the
device for its intended application. Note the following points
when programming the AD6676 SPI registers:
The serial port of the AD6676 shown in Figure 146 has a 3- or
4-wire SPI capability, allowing read/write access to all registers
that configure the internal parameters of the device. It provides
a flexible, synchronous serial communications port, allowing easy
interface to most industry-standard FPGAs and microcontrollers.
The 1.8 V to 2.5 V serial input/output is compatible with most
synchronous transfer formats.



Registers pertaining to similar functions are typically
grouped together and assigned adjacent addresses.
Bits that are undefined within a register must be assigned a
0 when writing to that register.
Do not write to registers that are undefined.
A hardware or software reset is recommended on powerup to place SPI registers in a known state.
SDO (PIN H6)
SDIO (PIN K8)
AD6676
SCLK (PIN K7)
SPI PORT
12348-089

CSB (PIN J6)
A SPI initialization routine is required as part of the boot
process. See Table 26 for an example procedure.
Figure 146. AD6676 SPI Port
Reset
Issuing a hardware or software reset places the AD6676 SPI
registers in a known state. Both types of resets are similar in
that they place SPI registers to their default states as described
in Table 32, with the notable exception that a software reset
does not affect Register 0x000. A hardware reset can be issued
from a host or external supervisory IC by applying a low pulse
with a minimum width of 40 ns to the RESETB pin (Pin G6).
RESETB can also kept be left open if unused because it has an
internal pull-up resistor. After issuing a reset, the SPI initialization
process need only write to registers that are required for the
boot process as well as any other register settings that must be
modified, depending on the target application.
Although the AD6676 does feature an internal power on reset
(POR), it is still recommended that a software or hardware reset
be implemented shortly after power-up. The internal reset
signal is derived from a logical OR operation from the internal
POR signal, the RESETB pin, and the software reset state. A self
clearing software reset can be issued via the reset bit (Register 0x00,
Bit 7). It is also recommended that the bit settings for Bits[7:4]
be mirrored onto Bits[3:0] for the instruction cycle that issues a
software reset.
Table 31. SPI Registers Pertaining to SPI Options
Address (Hex)
0x000
Bit
7
6
4
The default 4-wire SPI interface consists of a clock (SCLK),
serial port enable (CSB), serial data input (SDIO), and serial
data output (SDO). The inputs to SCLK, CSB, and SDIO contain
a Schmitt trigger centered about VDDIO/2. The maximum
frequency for SCLK is 40 MHz. The SDO pin is active only
during the transmission of data and remains three-stated at any
other time.
A 3-wire SPI interface can be enabled by clearing the SDIO_DIR
bit (Register 0x000, Bit 4). This causes the SDIO pin to become
bidirectional such that output data only appears on the SDIO
pin during a read operation. The SDO pin remains three-stated
in a 3-wire SPI interface.
Instruction Header Information
MSB
I_15
R/W
LSB
I_14
A14
I_13
A13
I_12
A12
…
…
…
…
I_01
A1
I_00
A0
A 16-bit instruction header must accompany each read and write
operation. The MSB is a R/W indicator bit with logic high
indicating a read operation. The remaining 15 bits specify the
address bits to be accessed during the data transfer portion. The
eight data bits immediately follow the instruction header for
both read and write operations. For write operations, registers
change immediately on writing to the last bit of each transfer byte.
Description
Software reset SPI
Enable SPI LSB first
Enable 4-wire
Rev. D | Page 64 of 90
Data Sheet
AD6676
The AD6676 serial port can support both most significant bit
(MSB) first and least significant bit (LSB) first data formats.
Figure 147 illustrates how the serial port words are formed for
the MSB first and LSB first modes. The bit order is controlled
by the LSB_FIRST bit (Register 0x000, Bit 6). The default value
is 0, MSB first. When the LSB_FIRST bit is set high, the serial
port interprets both instruction and data byte LSBs first.
INSTRUCTION CYCLE
Figure 149 illustrates the timing for a 3-wire read operation to
the SPI port. After CSB goes low, data (SDIO) pertaining to the
instruction header is read on the rising edges of SCLK. A read
operation occurs if the read/not write indicator is set high. After
the address bits of the instruction header are read, the eight data
bits pertaining to the specified register are shifted out of the
SDIO pin on the falling edges of the next eight clock cycles.
DATA TRANSFER CYCLE
SCLK
A1
A0 D7
INSTRUCTION CYCLE
CSB
D6
D1
Figure 150 illustrates the timing for a 4-wire read operation to
the SPI port. The timing is similar to the 3-wire read operation
with the exception that data appears at the SDO pin only,
whereas the SDIO pin remains at high impedance throughout
the operation. The SDO pin is an active output only during the
data transfer phase and remains three-stated at all other times.
D0
DATA TRANSFER CYCLE
SCLK
A0
A1 A2
A14 R/W D0 D1
D6
Lastly, the SPI port must not be active during periods when the
full dynamic performance of the converter is required. Because
the SCLK, CSB, and SDIO signals are typically asynchronous to
the ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD6676 to keep these signals from transitioning at the converter
input pins and causing unwanted spurious signals.
D7
12348-090
SDATA
Figure 147. SPI Timing, MSB First (Upper) and LSB First (Lower)
Figure 148 illustrates the timing requirements for a write
operation to the SPI port. After the serial port enable (CSB)
signal goes low, data (SDIO) pertaining to the instruction
header is read on the rising edges of the clock (SCLK). To
initiate a write operation, the read/not write bit is set low. After
the instruction header is read, the eight data bits pertaining to
tS tSCLK
CSB
tH
tLOW
tHIGH
SCLK
tDS
tDH
SDIO
A14
R/W
A13
A0
D7
D6 D1
D0
12348-091
R/W A14 A13
Figure 148. SPI Write Operation Timing
tS tSCLK
CSB
tLOW
tHIGH
SCLK
tDS
tACCESS
tDH
SDIO
R/W
A14 A2
A1
A0
D7
tZ
D6
D1
D0
12348-092
SDATA
Figure 149. SPI 3-Wire Read Operation Timing
tS
CSB
tSCLK
tLOW
tHIGH
SCLK
tDS
SDIO
tDH
R/W
A14 A2
A1
A0
tZ
tACCESS
SDO
D7
D6
D1
Figure 150. SPI 4-Wire Read Operation Timing
Rev. D | Page 65 of 90
D0
12348-093
CSB
the specified register are shifted into the SDIO pin on the rising
edge of the next eight clock cycles.
AD6676
Data Sheet
REGISTER MEMORY MAP AND DETAILS
REGISTER MEMORY MAP
Note that all address and bit locations that are not included in Table 32 are not currently supported for this device.
Table 32. Register Summary
Reg
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0x000 SPI_CONFIG
SW_RESET
LSB_FIRST
RESERVED
SDIO_DIR
SDIO_DIR
RESERVED
LSB_FIRST
SW_RESET
0x002 DEVICE_CONFIG
RESERVED
PD_MODE
0x003 CHIP_TYPE
CHIP_TYPE
0x004 CHIP_ID0
CHIP_ID0
0x005 CHIP_ID1
CHIP_ID1
0x006 GRADE_REVISION
REVISION
GRADE
0x00C VENDOR_ID0
VENDOR_ID0
0x00D VENDOR_ID1
VENDOR_ID1
BP Σ-Δ ADC Configuration Settings
0x100 FADC_0
FADC_0
0x101 FADC_1
FADC_1
0x102 FIF_0
FIF_0
0x103 FIF_1
FIF_1
0x104 BW_0
BW_0
0x105 BW_1
BW_1
0x106 LEXT
LEXT
0x107 MRGN_L
MRGN_L
0x108 MRGN_U
MRGN_U
0x109 MRGN_IF
MRGN_IF
0x10A IDAC1_FS
IDAC1_FS
BP Σ-Δ ADC Calibration/Profile
0x115 CAL_CTRL
RESERVED
CAL_PROFILE
0x116 CAL_CMD
RESERVED
INIT_NTF_OP
INIT_JESD
RESON1_CAL FLASH_CAL
INIT_ADC
TUNE_ADC
0x117 CAL_DONE
RESERVED
CAL_DONE
0x118 ADC_PROFILE
RESERVED
ADC_PROFILE
0x11A FORCE_END_CAL
RESERVED
FORCE_END_CAL
Digital Signal Path
0x140 DEC_MODE
RESERVED
DEC_MODE
0x141 MIX1_TUNING
RESERVED
MIX1_TUNING
0x142 MIX2_TUNING
MIX2_TUNING
0x143 MIX1_INIT
RESERVED
MIX1_INIT
0x144 MIX2_INIT_LSB
MIX2_INIT_LSB
0x145 MIX2_INIT_MSB
RESERVED
MIX2_INIT_MSB
0x146 DP_CTRL
RESERVED
NOT_2S_COMPL
Power Control
0x150 STANDBY
RESERVED
STBY_
STBY_CLK_PLL
STBY_JESD_ STBY_JESD_
STBY_FRAMER STBY_DATAPATH STBY_DIGCLK
VSS2GEN
PLL
PHY
0x151 PD_DIG
RESERVED
PD_FRAMER
PD_DATAPATH
PD_DIGCLK
0x152 PD_PIN_CTRL
RESERVED
PD_PIN_EN
RESERVED
PD_PIN_SEL
0x250 STBY_DAC
STBY_DAC
Attenuator
0x180 ATTEN_MODE
RESERVED
ATTEN_MODE
0x181 ATTEN_VALUE_PIN0
ATTEN_VALUE_PIN0
0x182 ATTEN_VALUE_PIN1
ATTEN_VALUE_PIN1
0x183 ATTEN_INIT
ATTEN_INIT
0x184 ATTEN_CTL
ATT_PIN
RESERVED
ATTEN_READ
ADC Reset Control
0x188 ADCRE_THRH
RESERVED
ADCRE_THRH
0x189 ADCRE_PULSE_LEN
RESERVED
ADCRE_PULSE_LEN
0x18A ATTEN_STEP_RE
RESERVED
ATTEN_STEP_RE
Peak Detector and AGC Flag Control
0x18F ADC_UNSTABLE
RESERVED
CLEAR_UNSTA
UNSTABLE
BLE FLAG
FLAG
0x193 PKTHRH0_LSB
PKTHRH0_LSB
0x194 PKTHRH0_MSB
RESERVED
PKTHRH0_MSB
0x195 PKTHRH1_LSB
PKTHRH1_LSB
Rev. D | Page 66 of 90
Reset
0x18
0x00
0x03
0xBB
0x00
0x00
0x56
0x04
RW
RW
R
R
R
R
R
R
0x10
0x0E
0x2C
0x01
0x3C
0x00
0x14
0x05
0x05
0x00
0x40
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
0x00
0x00
0x00
0x00
0x00
RW
RW
RW
W
RW
0x01
0x05
0x15
0x00
0x00
0x00
0x00
RW
RW
RW
RW
RW
RW
RW
0x02 RW
0x00 RW
0x00 RW
0xFF RW
0x00
0x0C
0x0C
0x00
0x0C
RW
RW
RW
RW
R
0x05 RW
0x01 RW
0x06 RW
0x00 RW
0x00 RW
0x00 RW
0x00 RW
Data Sheet
Reg
0x196
0x197
0x198
0x199
Name
Bit 7
PKTHRH1_MSB
LOWTHRH_LSB
LOWTHRH_MSB
DWELL_TIME_MANTISSA
0x19A DWELL_TIME_EXP
0x19B FLAG0_SEL
0x19C FLAG1_SEL
0x19E EN_FLAG
GPIO Configuration
0x1B0 FORCE_GPIO
0x1B1 FORCE_GPIO_OUT
0x1B2 FORCE_GPIO_VAL
0x1B3 READ_GPO
0x1B4 READ_GPI
JESD204B Interface
0x1C0 DID
0x1C1 BID
0x1C3 L
0x1C4 F
0x1C5 K
0x1C6 M
0x1C9 S
0x1CB RES1
0x1CC RES2
0x1D0 LID0
0x1D1 LID1
0x1D8 FCHK0
0x1D9 FCHK1
0x1E0 EN_LFIFO
0x1E1 SWAP
0x1E2 LANE_PD
0x1E3 MIS1
0x1E4 SYNC_PIN
0x1E5 TEST_GEN
0x1E6 KF_ILAS
0x1E7 SYNCINB_CTRL
0x1E8 MIX_CTRL
0x1E9 K_OFFSET
0x1EA SYSREF
0x1EB SER1
0x1EC SER2
0x1EF PRE-EMPHASIS
ADC Clock Synthesizer
0x2A0 CLKSYN_ENABLE
0x2A1
0x2A2
0x2A5
CLKSYN_INT_N_LSB
CLKSYN_INT_N_MSB
VCO_CAL_RESET
0x2AA
0x2AB
0x2AC
0x2AD
0x2B7
0x2BB
CLKSYN_VCO_BIAS
CLKSYN_VCO_CAL
CLKSYN_I_CP
EN_CP_CAL
CLKSYN_VCO_VAR
CLKSYN_R_DIV
0x2BC CLKSYN_STATUS
0x2DC JESDSYN_STATUS
ADC Adaptive Shuffler Control
0x340 SHUFFLE_CTRL
0x342
0x343
AD6676
SHUFFLE_THREG_0
SHUFFLE_THREG_1
Bit 6
Bit 5
RESERVED
Bit 4
Bit 3
Bit 2
Bit 1
PKTHRH1_MSB
Bit 0
LOWTHRH_LSB
RESERVED
LOWTHRH_MSB
DWELL_TIME_MANTISSA
RESERVED
RESERVED
RESERVED
RESERVED
EN_OR
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
DWELL_TIME_EXP
FLAG0_SEL
FLAG1_SEL
EN_FLAG1
EN_FLAG0
FORCE_GPIO
FORCE_GPIO_OUT
FORCE_GPIO_VAL
READ_GPO
READ_GPI
DID
RESERVED
RESERVED
SCR
BID
L
F
RESERVED
K
M
RESERVED
S
RES1
RES2
RESERVED
RESERVED
LID0
LID1
FCHK0
FCHK1
RESERVED
SWAP_CONV
RESERVED
RESERVED
RESERVED
RESERVED
ILAS_DELAY
TEST_SAMPLE_EN LSYNC_EN
SYNC_PIN_INV
TEST_GEN_SEL
RESERVED
MIX_USE_2ND MIX_NEXT
RESERVED
MIX_ALL
SER_DRV_PS
EN_EXTCK
SER_ITRIM
SER_EMP_IDAC1
EN_ADC_CK
EN_SYNTH
EN_VCO_
PTAT
EN_VCO
_ALC
INT_N_LSB[7:0]
RESERVED
RESERVED
RESERVED
EN_LFIFO
SWAP_LANE
LANE_PD
FACI_DISABLE
RESERVED
INV_10B
RESERVED
TEST_GEN_MODE
KF_ILAS
PD_SYSREF_RX LVDS_SYNCINB
RESERVED
RESERVED
USE_2ND_
NEXT_SYSREF
ALL_SYSREF
SYSREF
K_OFFSET
SYSREF_WIN_POS
RESERVED
SER_RTRIM
SER_EMP_PS0
SER_EMP_IDAC0
RESERVED
SYSREF_WIN_NEG
SER_EMP_PS1
RESERVED
RESERVED
ILAS_MODE
RESERVED
BIAS_TEMPCO
INIT_ALC_VALUE
EN_VCO
EN_OVERRIDE
BIAS
RESERVED
ID_SYNTH
I_CP
RESERVED
VCO_VAR
R_DIV
RESERVED
SYSREF_
CTRL
PLL_LCK
PLL_LCK
RESERVED
RESERVED
RESERVED
CLKIN_IMPED
RESERVED
RESERVED
RESERVED
SHUFFLE_TH2
SHUFFLE_TH4
SHUFFLE_TH1
SHUFFLE_TH3
Rev. D | Page 67 of 90
RESERVED
VCO CAL BUSY
VCO CAL BUSY
RW
RW
RW
RW
RW
0x00
0x00
0x00
0x00
RW
RW
RW
RW
0x00
0x00
0x00
0x00
0x00
RW
RW
RW
R
R
0x00
0x00
0x00
0x03
0x1F
0x01
0x00
0x00
0x00
0x00
0x01
0x44
0x45
0x00
0x00
0x00
0x14
0x00
0x00
0x00
0x00
0x00
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
0x00
0x00
0x1C
0x9B
0x00
RW
RW
RW
RW
RW
0x00 RW
0x80 RW
0x00 RW
0x00 RW
INT_N_MSB[10:8]
RESERVED
VCO_CAL_
RESET
RESERVED
ALC_DIS
RESERVED
EN_CP_CAL
EN_OVERRIDE_
CAL
Reset
0x00
0x00
0x00
0x00
0x37
0xC0
0x19
0x00
0xD0
0xB9
RW
RW
RW
RW
RW
CP CAL DONE
CP CAL DONE
0x80 R
0x80 R
EN_ADAPTIVE_
SHUFFLE
0x03 RW
0xF5
0xFF
RW
RW
AD6676
Data Sheet
REGISTER DETAILS
SPI Configuration Register
Address: 0x000, Reset: 0x18, Name: SPI_CONFIG
Table 33. Bit Descriptions for SPI_CONFIG
Bits
7
Bit Name
SW_RESET
6
4
LSB_FIRST
SDIO_DIR
Description
Self-clearing bit causing software reset when set. Software reset returns all SPI registers to
default state.
When set, causes input and output data to be orientated as LSB first, per SPI standard.
When set, causes SPI interface to be 4-wire with output data appearing on the SDO pin.
Reset
0
Access
RW
0
1
This register uses the first four bits to configure SPI interface/format thus Bit 0, Bit 1, and Bit 3 are mirror images of Bit 7, Bit 6, and Bit 4.
Device Configuration Register
Address: 0x002, Reset: 0x00, Name: DEVICE_CONFIG
Table 34. Bit Descriptions for DEVICE_CONFIG
Bits
[7:2]
Bit Name
RESERVED
[1:0]
PD_MODE
Description
Reset
0x0
Access
RW
Power-down/standby control
0x0
RW
00 = normal operation
01 = not used.
10 = standby mode
11 = sleep (power-down) mode
Chip Type Register
Address: 0x003, Reset: 0x03, Name: CHIP_TYPE
Table 35. Bit Descriptions for CHIP_TYPE
Bits
[7:0]
Bit Name
CHIP_TYPE
Description
Chip Type: High Speed ADC.
Reset
0x03
Access
R
Reset
0xBB
Access
R
Reset
0x00
Access
R
Chip ID 0 Register
Address: 0x004, Reset: 0xBB, Name: CHIP_ID0
Table 36. Bit Descriptions for CHIP_ID0
Bits
[7:0]
Bit Name
CHIP_ID0
Description
Chip ID Low Byte.
Chip ID 1 Register
Address: 0x005, Reset: 0x00, Name: CHIP_ID1
Table 37. Bit Descriptions for CHIP_ID1
Bits
[7:0]
Bit Name
CHIP_ID1
Description
Chip ID High Byte.
Rev. D | Page 68 of 90
Data Sheet
AD6676
Chip Grade/Revision Register
Address: 0x006, Reset: 0x00, Name: GRADE_REVISION
Table 38. Bit Descriptions for GRADE_REVISION
Bits
[7:4]
Bit Name
REVISION
[3:0]
GRADE
Description
Reset
0x0
Access
R
0x0
R
Reset
0x56
Access
R
Reset
0x04
Access
R
Vendor ID 0 Register
Address: 0x00C, Reset: 0x56, Name: VENDOR_ID0
Table 39. Bit Descriptions for VENDOR_ID0
Bits
[7:0]
Bit Name
VENDOR_ID0
Description
Vendor ID 1 Register
Address: 0x00D, Reset: 0x04, Name: VENDOR_ID1
Table 40. Bit Descriptions for VENDOR_ID1
Bits
[7:0]
Bit Name
VENDOR_ID1
Description
ADC CLK Frequency LSB Register
Address: 0x100, Reset: 0x10, Name: FADC_0
Table 41. Bit Descriptions for FADC_0
Bits
[7:0]
Bit Name
FADC_0
Description
Lower 8-bits of 16-bit value that defines the ADC CLK frequency to 1 MHz resolution. For example,
the FADC_1 and FADC_0 settings for a 3200 MHz CLK frequency are 0x0C and 0x80, respectively.
Reset
0x10
Access
RW
ADC CLK Frequency MSB Register 1
Address: 0x101, Reset: 0x0E, Name: FADC_1
Table 42. Bit Descriptions for FADC_1
Bits
[7:0]
Bit Name
FADC_1
Description
Upper 8-bits of 16-bit value that defines the ADC CLK frequency to 1 MHz. For example, the FADC_1
and FADC_0 settings for a 3200 MHz CLK frequency are 0x0C and 0x80, respectively.
Reset
0x0E
Access
RW
IF Frequency LSB Register 0
Address: 0x102, Reset: 0x2C, Name: FIF_0
Table 43. Bit Descriptions for FIF_0
Bits
[7:0]
Bit Name
FIF_0
Description
Lower 8-bits of 16-bit value that defines the target IF frequency to 1 MHz resolution. For example,
the FIF_1 and FIF_0 settings for a 300 MHz IF frequency are 0x01 and 0x2C, respectively.
Reset
0x2C
Access
RW
IF Frequency MSB Register 1
Address: 0x103, Reset: 0x01, Name: FIF_1
Table 44. Bit Descriptions for F0_1
Bits
[7:0]
Bit Name
FIF_1
Description
Upper 8-bits of 16-bit value that defines the target IF frequency to 1 MHz resolution. For example,
the FIF_1 and FIF_0 settings for a 300 MHz IF frequency would be 0x01 and 0x2C, respectively.
Rev. D | Page 69 of 90
Reset
0x01
Access
RW
AD6676
Data Sheet
BW LSB Register 0
Address: 0x104, Reset: 0x3C, Name: BW_0
Table 45. Bit Descriptions for BW_0
Bits
[7:0]
Bit Name
BW_0
Description
Lower 8-bits of 16-bit value that defines the target BW frequency to 1 MHz resolution. For
example, the BW_1 and BW_0 settings for a 60 MHz BW would be 0x00 and 0x3C, respectively.
Reset
0x3C
Access
RW
BW MSB Register 1
Address: 0x105, Reset: 0x00, Name: BW_1
Table 46. Bit Descriptions for BW_1
Bits
[7:0]
Bit Name
BW_1
Description
Upper 8-bits of 16-bit value that defines the target BW frequency to 1 MHz
resolution. This register should be kept to 0x00 default setting because
maximum BW should be no greater than 160 MHz.
Reset
0x00
Access
RW
External Inductance Value Register
Address: 0x106, Reset: 0x14, Name: LEXT
Table 47. Bit Descriptions for LEXT
Bits
[7:0]
Bit Name
LEXT
Description
External inductance in nH. Enter the external inductance value for the LC tank
resonator. The default value of 0x14 corresponds to 20 nH
Reset
0x14
Access
RW
Bandwidth Margin (Low End) Register
Address: 0x107, Reset: 0x05, Name: MRGN_L
Table 48. Bit Descriptions for MRGN_L
Bits
[7:0]
Bit Name
MRGN_L
Description
An 8-bit register defining the offset frequency (to 1 MHz resolution) to which the
frequency of the lower resonator is offset from its theoretical ideal value. The default
setting is 5 MHz. Increasing the value lowers the actual resonator frequency.
Reset
0x05
Access
RW
Bandwidth Margin (Upper End) Register
Address: 0x108, Reset: 0x05, Name: MRGN_U
Table 49. Bit Descriptions for MRGN_U
Bits
[7:0]
Bit Name
MRGN_U
Description
An 8-bit register defining the offset frequency (to 1 MHz resolution) to which the frequency of the
upper resonator is offset from its theoretical ideal value. The default setting is 5 MHz. Increasing
the value increases the actual resonator frequency.
Reset
0x05
Access
RW
Reset
0x00
Access
RW
Bandwidth Margin (IF) Register
Address: 0x109, Reset: 0x00, Name: MRGN_IF
Table 50. Bit Descriptions for MRGN_IF
Bits
[7:0]
Bit Name
MRGN_IF
Description
An 8-bit register defining the offset frequency (to 1 MHz resolution) to which the frequency of the
LC resonator is offset from its theoretical ideal value. The default setting is 0 MHz. Increasing the
value increases the actual resonator frequency.
Rev. D | Page 70 of 90
Data Sheet
AD6676
IDAC1FS Gain Scaling Register
Address: 0x10A, Reset: 0x40, Name: IDAC1_FS
Table 51. Bit Descriptions for IDAC1_FS
Bits
[7:0]
Bit Name
IDAC1_FS
Description
This parameter allows adjustment of the full-scale input power level of the ADC by adjusting the
full-scale current of IDAC1. The nominal setting of 0x40 sets IDAC1FS value to 4 mA and corresponds to
the largest full-scale level of approximately −3 dBm (with the IF attenuator set to 0 dB.) A setting of
0x20 or 0x10 results IDAC1FS value to 2 mA or 1 mA, thus resulting in a 6 dB or 12 dB reduction in
PIN_0dBFS. Settings resulting in more than 12 dB reduction are not recommended.
Reset
0x40
Access
RW
Calibration Control Register
Address: 0x115, Reset: 0x00, Name: CAL_CTRL
Table 52. Bit Descriptions for CAL_CTRL
Bits
[7:2]
Bit Name
RESERVED
Description
Reset
0x00
[1:0]
CAL_PROFILE
ADC profile to be calibrated. Select one of the four ADC profiles in which to store the
results of the calibration. For example, to support multiple IF settings, the four profiles
cover all registers in the range of 0x141 to 0x145.
Access
RW
RW
Calibration Command Register
Address: 0x116, Reset: 0x00, Name: CAL_CMD
Table 53. Bit Descriptions for CAL_CMD
Bits
[7:6]
5
4
3
2
1
0
Bit Name
RESERVED
INIT_NTF_OP
INIT_JESD
RESON1_CAL
FLASH_CAL
INIT_ADC
TUNE_ADC
Description
Reset
0x0
0x0
0x0
0x0
0x0
0x0
0x0
Access
RWAC
RWAC
RWAC
RWAC
RWAC
RWAC
RWAC
Setting a 1 in one or more of the bits in this register initiates the internal calibration. This register is cleared automatically at the end of
calibration or by setting the FORCE_END_CAL bit.
Calibration Done Register
Address: 0x117, Reset: 0x00, Name: CAL_DONE
Table 54. Bit Descriptions for ADC_PROFILE
Bits
[7:1]
Bit Name
RESERVED
Description
Reset
0x00
Access
RW
[0]
CAL_DONE
This bit indicates that the microcontroller has completed its calibration. It is
automatically cleared by a new CAL_CMD.
0x0
RW
Rev. D | Page 71 of 90
AD6676
Data Sheet
ADC Profile Selection Register
Address: 0x118, Reset: 0x00, Name: ADC_PROFILE
Table 55. Bit Descriptions for ADC_PROFILE
Bits
[7:2]
Bit Name
RESERVED
Description
Reset
0x00
Access
W
[1:0]
ADC_PROFILE
ADC profile. Select which one of the four ADC profiles to use in operation. The
user may switch between multiple profiles if calibration has taken place for each.
Note that the four profiles also cover SPI Register 0x141 to SPI Register 0x145 if
the digital mixer settings are varied between profiles.
0x0
W
Reset
0x00
0x0
Access
RW
RW
Force End of Calibration Register
Address: 0x11A, Reset: 0x00, Name: FORCE_END_CAL
Table 56. Bit Descriptions for FORCE_END_CAL
Bits
[7:1]
0
Bit Name
RESERVED
FORCE_END_CAL
Description
Setting this bit high and then low (two write operations) allows the user to
terminate the calibration and hand control back to the SPI. This SPI operation
should only be performed if the AD6676 fails to clear Register 0x116 after 400 ms.
This is a user accessible SPI register only when the controller is performing a calibration.
Decimation Mode Register
Address: 0x140, Reset: 0x01, Name: DEC_MODE
Table 57. Bit Descriptions for DEC_MODE
Bits
[7:3]
[2:0]
Bit Name
RESERVED
DEC_MODE
Settings
001
010
011
100
Description
Decimation Mode.
Decimate by 32.
Decimate by 24.
Decimate by 16.
Decimate by 12.
Reset
0x00
0x01
Access
RW
RW
Coarse NCO Tuning Register
Address: 0x141, Reset: 0x05, Name: MIX1_TUNING
Table 58. Bit Descriptions for MIX1_TUNING
Bits
[7:6]
[5:0]
Bit Name
RESERVED
MIX1_TUNING
Description
Mix1 Tuning. Coarse downconversion frequency, in units of FADC/64. For
example, setting bits to 000011 downconverts by FADC × (3/64).
Reset
0x0
0x5
Access
RW
RW
This register has four copies, one for each of the ADC profiles. The default for Profile 0 is 0x05; the default for the other profiles is 0x00.
At the default ADC clock rate of 3.2 GHz; the default Profile 0 downconversion frequency is (5/64) × 3.6 GHz = 250 MHz
Rev. D | Page 72 of 90
Data Sheet
AD6676
Fine NCO Tuning Register
Address: 0x142, Reset: 0x15, Name: MIX2_TUNING
Table 59. Bit Descriptions for MIX2_TUNING
Bits
[7:0]
Bit Name
MIX2_TUNING
Description
Mix2 Tuning. Fine down/upconversion frequency. For decimation Mode 1 and Mode 3, this
twos complement number represents steps of FADC/4096. For decimation Mode 2 and
Mode 4, it represents steps of FADC/3072. A positive number is a downconverion; a negative
number is an upconversion.
Reset
0x15
Access
RW
This register has four copies, one for each of the ADC profiles. The default for Profile 0 is 0x21; the default for the other profiles is 0x00.
At the default ADC clock rate of 3.2 GHz, the default Profile 0 downconversion frequency is (33/4096) × 3.2 GHz = 25.78125 MHz
Coarse NCO Initial Phase Register
Address: 0x143, Reset: 0x00, Name: MIX1_INIT
Table 60. Bit Descriptions for MIX1_INIT
Bits
[7:6]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[5:0]
MIX1_INIT
NCO1 Initial Phase. Initial phase of the coarse resolution NCO after synchronization with
SYSREF, in units of 1/64 of a cycle.
0x00
RW
This register has four copies, one for each of the ADC profiles. The default for Profile 0 is 0x00.
Fine NCO Initial Phase LSB Register
Address: 0x144, Reset: 0x00, Name: MIX2_INIT_LSB
Table 61. Bit Descriptions for MIX2_INIT_LSB
Bits
[7:0]
Bit Name
MIX2_INIT_LSB
Description
NCO2 Initial Phase. Initial phase of the fine resolution NCO after synchronization with
SYSREF, in units of 1/1024 of a cycle. The two MSBs of the 10-bit value are in Register 0x145.
Reset
0x00
Access
RW
This register has four copies, one for each of the ADC profiles. The default for Profile 0 is 0x00.
Fine NCO Initial Phase MSB Register
Address: 0x145, Reset: 0x00, Name: MIX2_INIT_MSB
Table 62. Bit Descriptions for MIX2_INIT_MSB
Bits
[7:2]
Bit Name
RESERVED
Description
Reset
0x00
Access
RW
[1:0]
MIX2_INIT_MSB
NCO2 Initial Phase. Initial phase of the fine resolution NCO after synchronization with
SYSREF, in units of 1/1024 of a cycle. The LSBs of the 10-bit value are in Register 0x144.
0x0
RW
Reset
0x00
Access
RW
This register has four copies, one for each of the ADC profiles. The default for Profile 0 is 0x00.
Datapath Controls Register
Address: 0x146, Reset: 0x00, Name: DP_CTRL
Table 63. Bit Descriptions for DP_CTRL
Bits
[7:1]
0
Bit Name
RESERVED
NOT_2S_COMPL
Description
Output Data Format: twos complement = 0; straight binary = 1
Rev. D | Page 73 of 90
AD6676
Data Sheet
Standby Register
Address: 0x150, Reset: 0x02, Name: STANDBY
When bits in this register are set, the corresponding blocks enter a power-down state when the chip enters standby mode.
Table 64. Bit Descriptions for STANDBY
Bits
7
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
6
STBY_VSS2GEN
1: power down negative supply (VSS2) generator during standby.
0x0
RW
5
STBY_CLK_PLL
1: power down main clock PLL during standby.
0x0
RW
4
3
STBY_JESD_PLL
STBY_JESD_PHY
1: power down JESD interface PLL during standby.
1: power down JESD interface transmitters during standby.
0x0
0x0
RW
RW
2
STBY_FRAMER
1: power down JESD interface framer logic during standby.
0x0
RW
1
STBY_DATAPATH
1: power down digital datapath during standby.
0x1
RW
0
STBY_DIGCLK
1: disable all digital clocks during standby.
0x0
RW
Reset
0x00
0x0
0x0
0x0
Access
RW
RW
RW
RW
Digital Power-Down Register
Address: 0x151, Reset: 0x00, Name: PD_DIG
Table 65. Bit Descriptions for PD_DIG
Bits
[7:3]
2
1
0
Bit Name
RESERVED
PD_FRAMER
PD_DATAPATH
PD_DIGCLK
Description
1: power down JESD interface framer logic.
1: power down digital datapath.
1: power down all digital clocks.
Standby Pin Control Register
Address: 0x152, Reset: 0x00, Name: PD_PIN_CTRL
Table 66. Bit Descriptions for PD_PIN_CTRL
Bits
[7:5]
4
Bit Name
RESERVED
PD_PIN_EN
Settings
Description
0
1
[3:2]
[1:0]
RESERVED
PD_PIN_SEL
00
01
10
11
Enable Standby Mode Control from a GPIO Pin.
Use only register 2 to select standby mode.
Use Register 2 or the selected pin to select standby mode. Standby mode
is the logical OR of the register setting and the pin state.
Select GPIO pin for standby control.
Use AGC1 for standby control.
Use AGC2 for standby control.
Use AGC3 for standby control.
Use AGC4 for standby control.
Reset
0x0
0x0
Access
RW
RW
0x0
0x0
RW
RW
Attenuator Mode Register
Address: 0x180, Reset: 0x00, Name: ATTEN_MODE
Table 67. Bit Descriptions for ATTEN_MODE
Bits
[7:1]
0
Bit Name
RESERVED
ATTEN_MODE
Description
Attenuator Mode.
0 = Use AGC2 pin to select between values in Register 0x0181 and Register 0x0182.
1 = Use AGC1 and AGC2 pins to decrement/increment attenuation value.
Rev. D | Page 74 of 90
Reset
0x00
0x0
Access
RW
RW
Data Sheet
AD6676
Attenuator AGC2 Pin Low Value Register
Address: 0x181, Reset: 0x0C, Name: ATTEN_VALUE_PIN0
Table 68. Bit Descriptions for ATTEN_VALUE_PIN1
Bits
[7:0]
Bit Name
ATTEN_VALUE_PIN0
Description
Attenuation value to be used in ATTEN_MODE = 0 when the AGC2 pin is low.
Valid range is from 0 (minimum attenuation) to 27 (maximum attenuation).
Value 28 to Value 31 disable the attenuator. Default is 12 dB attenuation.
Reset
0x0C
Access
RW
Reset
0x0C
Access
RW
Reset
0x00
Access
RW
Reset
0x0
Access
R
0x0
RW
0x0C
R
Reset
0x00
0x5
Access
RW
RW
Attenuator AGC2 Pin High Value Register
Address: 0x182, Reset: 0x0C, Name: ATTEN_VALUE_PIN1
Table 69. Bit Descriptions for ATTEN_VALUE_PIN1
Bits
[7:0]
Bit Name
ATTEN_VALUE_PIN1
Description
Attenuation value to be used in ATTEN_MODE = 0 when the AGC2 pin is high.
Valid range is from 0 (minimum attenuation) to 27 (maximum attenuation).
Value 28 to Value 31 disable the attenuator. Default is 12 dB attenuation.
Attenuator Initialization Register
Address: 0x183, Reset: 0x00, Name: ATTEN_INIT
Table 70. Bit Descriptions for ATTEN_INIT
Bits
[7:0]
Bit Name
ATTEN_INIT
Description
Initialize the attenuator value when using ATTEN_MODE = 1.
Attenuator Status Register
Address: 0x184, Reset: 0x0C, Name: ATTEN_CTL
Table 71. Bit Descriptions for ATTEN_CTL
Bits
7
Bit Name
ATT_PIN
[6:5]
RESERVED
[4:0]
ATTEN_READ
Description
Read back the state of the AGC2 pin.
Read back the actual attenuation value in ATTEN_MODE.
ADC Reset Threshold Register
Address: 0x188, Reset: 0x05, Name: ADCRE_THRH
Table 72. Bit Descriptions for ADCRE_THRH
Bits
[7:3]
[2:0]
Bit Name
RESERVED
ADCRE_THRH
Description
ADC Reset Threshold. The ADC reset triggers if more than threshold out of
eight consecutive ADC samples have the full-scale value of ±8.
ADC Reset Pulse Length Register
Address: 0x189, Reset: 0x01, Name: ADCRE_PULSE_LEN
Table 73. Bit Descriptions for ADCRE_PULSE_LEN
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[4:0]
ADCRE_PULSE_LEN
The duration of the reset pulse to the ADC, (x + 1) × 8/FADC.
0x01
RW
Rev. D | Page 75 of 90
AD6676
Data Sheet
ADC Reset Attenuation Step Register
Address: 0x18A, Reset: 0x06, Name: ATTEN_STEP_RE
Table 74. Bit Descriptions for ATTEN_STEP_RE
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[4:0]
ATTEN_STEP_RE
The size of the increase in attenuation after a reset event, in dB. The
attenuation is clipped to a maximum value of 27 dB.
0x06
RW
ADC Unstable Flag Control Register
Address: 0x18F, Reset: 0x00, Name: ADC_UNSTABLE
Table 75. Bit Descriptions for ADC_UNSTABLE
Bits
[7:2]
1
Bit Name
RESERVED
CLEAR_UNSTABLE_FLAG
0
UNSTABLE_FLAG
Description
Clear unstable flag. Writing a 1 to this bit clears the UNSTABLE_FLAG. This
bit is self clearing.
Unstable flag. This is a sticky flag that indicates if an ADC reset condition
has been detected. It is cleared only by the CLEAR_UNSTABLE_FLAG bit
and the hardware/software resets.
Reset
0x00
0x0
Access
RW
RW
0x0
R
Peak Threshold 0 LSB Register
Address: 0x193, Reset: 0x00, Name: PKTHRH0_LSB
Table 76. Bit Descriptions for PKTHRH0_LSB
Bits
[7:0]
Bit Name
PKTHRH0_LSB
Settings
Description
Peak Threshold 0 LSB.
Reset
0x00
Access
RW
Reset
0x0
0x0
Access
RW
RW
Reset
0x00
Access
RW
Reset
0x0
0x0
Access
RW
RW
Peak Threshold 0 MSB Register
Address: 0x194, Reset: 0x00, Name: PKTHRH0_MSB
Table 77. Bit Descriptions for PKTHRH0_MSB
Bits
[7:4]
[3:0]
Bit Name
RESERVED
PKTHRH0_MSB
Settings
Description
Peak Threshold 0 MSB.
Peak Threshold 1 LSB Register
Address: 0x195, Reset: 0x00, Name: PKTHRH1_LSB
Table 78. Bit Descriptions for PKTHRH1_LSB
Bits
[7:0]
Bit Name
PKTHRH1_LSB
Settings
Description
Peak Threshold 1 LSB.
Peak Threshold 1 MSB Register
Address: 0x196, Reset: 0x00, Name: PKTHRH1_MSB
Table 79. Bit Descriptions for PKTHRH1_MSB
Bits
[7:4]
[3:0]
Bit Name
RESERVED
PKTHRH1_MSB
Settings
Description
Peak Threshold 1 MSB.
Rev. D | Page 76 of 90
Data Sheet
AD6676
DEC Low Threshold LSB Register
Address: 0x197, Reset: 0x00, Name: LOWTHRH_LSB
Table 80. Bit Descriptions for LOWTHRH_LSB
Bits
[7:0]
Bit Name
LOWTHRH_LSB
Settings
Description
Low Threshold LSB.
Reset
0x00
Access
RW
Reset
0x0
0x0
Access
RW
RW
Reset
0x00
Access
RW
Reset
0x0
0x0
Access
RW
RW
Low Threshold MSB Register
Address: 0x198, Reset: 0x00, Name: LOWTHRH_MSB
Table 81. Bit Descriptions for LOWTHRH_MSB
Bits
[7:4]
[3:0]
Bit Name
RESERVED
LOWTHRH_MSB
Settings
Description
Low Threshold MSB.
Dwell Time Mantissa Register
Address: 0x199, Reset: 0x00, Name: DWELL_TIME_MANTISSA
Table 82. Bit Descriptions for DWELL_TIME_MANTISSA
Bits
[7:0]
Bit Name
DWELL_TIME_MANTISSA
Settings
Description
Dwell Time mantissa.
Dwell Time Exponent Register
Address: 0x19A, Reset: 0x00, Name: DWELL_TIME_EXP
Table 83. Bit Descriptions for DWELL_TIME_EXP
Bits
[7:4]
[3:0]
Bit Name
RESERVED
DWELL_TIME_EXP
Settings
Description
Dwell Time Exponent.
AGC Flag 0 Select Register
Address: 0x19B, Reset: 0x00, Name: FLAG0_SEL
Table 84. Bit Descriptions for FLAG0_SEL
Bits
[7:3]
[2:0]
Bit Name
RESERVED
FLAG0_SEL
Description
Select 1 of 4 flags to output on the AGC3 pin.
000 = ADC reset pulse.
100 = DEC peak above DEC Threshold 0.
101 = DEC peak above DEC Threshold 1.
110 = DEC peak below DEC low threshold for dwell time.
Reset
0x00
0x0
Access
RW
RW
Reset
0x00
0x0
Access
RW
RW
AGC Flag 1 Select Register
Address: 0x19C, Reset: 0x00, Name: FLAG1_SEL
Table 85. Bit Descriptions for FLAG1_SEL
Bits
[7:3]
[2:0]
Bit Name
RESERVED
FLAG1_SEL
Description
Select one of four flags to output on the AGC4 pin.
000 = ADC reset pulse.
100 = DEC peak above DEC Threshold 0.
101 = DEC peak above DEC Threshold 1.
110 = DEC peak below DEC low threshold for dwell time.
Rev. D | Page 77 of 90
AD6676
Data Sheet
AGC Flag Enable Register
Address: 0x19E, Reset: 0x00, Name: EN_FLAG
Table 86. Bit Descriptions for EN_FLAG
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
4
EN_OR
Combine ADC reset with peak detect. When asserted, this bit causes
the ADC reset pulse (Flag Select Option 0) to be logically OR-ed with
one of the peak-detect flags options specified in Register 0x19B or
Register 0x19C.
0x0
RW
0x0
RW
0x0
RW
0x0
RW
[3:2]
RESERVED
1
EN_FLAG1
0
EN_FLAG0
Enable Flag 1.
0 = Force AGC4 pin low.
1 = Enable selected flag on AGC4 pin (see FLAG1_SEL).
Enable Flag 0.
0 = Force AGC3 pin low.
1 = Enable selected flag on AGC3 pin (see FLAG0_SEL).
Force GPIO Register
Address: 0x1B0, Reset: 0x00, Name: FORCE_GPIO
Table 87. Bit Descriptions for FORCE_GPIO
Bits
[7:4]
[3:0]
Bit Name
RESERVED
FORCE_GPIO
Description
Force GPIO use. Force one or more of the pins, AGC1 to AGC4, to be used as a GPIO rather than
any other specified use.
Bit 0: force AGC1 to be used as a GPIO.
Bit 1: force AGC2 to be used as a GPIO.
Bit 2: force AGC3 to be used as a GPIO.
Bit 3: force AGC4 to be used as a GPIO.
Reset
0x0
0x00
Access
RW
RW
Force GPIO as Output Register
Address: 0x1B1, Reset: 0x00, Name: FORCE_GPIO_OUT
Table 88. Bit Descriptions for FORCE_GPIO_OUT
Bits
[7:4]
[3:0]
Bit Name
RESERVED
FORCE_GPIO_OUT
Description
Force GPIO use as an output. When used in conjunction with FORCE_GPIO, configure
one or more of the pins, AGC1 to AGC4, to be used as a general purpose output or input.
Bit 0 = 1: use AGC1 as an output.
Bit 0 = 0: use AGC1 as an input.
Bit 1 = 1: use AGC2 as an output.
Bit 1 = 0: use AGC2 as an input.
Bit 2 = 1: use AGC3 as an output.
Bit 2 = 0: use AGC3 as an input.
Bit 3 = 1: use AGC4 as an output.
Bit 3 = 0: use AGC4 as an input.
Rev. D | Page 78 of 90
Reset
0x0
0x00
Access
RW
RW
Data Sheet
AD6676
Force GPIO Value Register
Address: 0x1B2, Reset: 0x00, Name: FORCE_GPIO_VAL
Table 89. Bit Descriptions for FORCE_GPIO_VAL
Bits
[7:4]
[3:0]
Bit Name
RESERVED
FORCE_GPIO_VAL
Description
Force GPIO Value. When used in conjunction with FORCE_GPIO and FORCE_GPIO_OUT,
configure the state of one or more of the pins, AGC1 to AGC4, when being used as a
general purpose output.
Bit [0]: state of AGC1 when being used as an output.
Bit [1]: state of AGC2 when being used as an output.
Bit [2]: state of AGC3 when being used as an output.
Bit [3]: state of AGC4 when being used as an output.
Reset
0x0
0x00
Access
RW
RW
GPIO Output Status Register
Address: 0x1B3, Reset: 0x00, Name: READ_GPO
Table 90. Bit Descriptions for READ_GPO
Bits
[7:4]
[3:0]
Bit Name
RESERVED
READ_GPO
Description
Read back the status of the GPIO output bits. These are the same as the external pins,
AGC1 through AGC4, if the GPIO are enabled and configured as outputs.
Reset
0x0
0x00
Access
RW
R
GPIO Input Status Register
Address: 0x1B4, Reset: 0x00, Name: READ_GPI
Table 91. Bit Descriptions for READ_GPI
Bits
[7:4]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[3:0]
READ_GPI
Read back the status of the GPIO input bits. These are the same as the external
pins, AGC1 through AGC4, if the GPIO are enabled and configured as inputs
0x00
R
JESD204 DID Register
Address: 0x1C0, Reset: 0x00, Name: DID
Table 92. Bit Descriptions for DID
Bits
[7:0]
Bit Name
DID
Description
Device ID
Reset
0x00
Access
RW
Reset
0x0
0x0
Access
R
RW
JESD204 BID Register
Address: 0x1C1, Reset: 0x00, Name: BID
Table 93. Bit Descriptions for BID
Bits
[7:4]
[3:0]
Bit Name
RESERVED
BID
Description
Bank ID
JESD204 L/SCR Register
Address: 0x1C3, Reset: 0x00, Name: L
Table 94. Bit Descriptions for L
Bits
7
Bit Name
SCR
Settings
0
Description
SCR Parameter.
Scrambling disabled.
Rev. D | Page 79 of 90
Reset
0x0
Access
RW
AD6676
Bits
Bit Name
Data Sheet
Settings
1
[6:5]
[4:0]
RESERVED
L
00000
00001
Description
Scrambling enabled.
Reset
Access
0x0
0x00
RW
RW
Description
Octest per Frame per Lane.
F=2
F=4
Reset
0x03
Access
RW
Description
Reset
0x0
0x1F
Access
RW
RW
Description
M.
Two converters (I/Q data).
Reset
0x01
Access
RW
Description
Reset
0x0
0x00
Access
RW
RW
L Parameter.
One lane.
Two lanes.
JESD204 F Register
Address: 0x1C4, Reset: 0x03, Name: F
Table 95. Bit Descriptions for F
Bits
[7:0]
Bit Name
F
Settings
00000001
00000011
JESD204 K Register
Address: 0x1C5, Reset: 0x1F, Name: K
Table 96. Bit Descriptions for K
Bits
[7:5]
[4:0]
Bit Name
RESERVED
K
Settings
Frames per multiframe. Number of frames per multiframe is the register
value plus one.
JESD204 M Register
Address: 0x1C6, Reset: 0x01, Name: M
Table 97. Bit Descriptions for M
Bits
[7:0]
Bit Name
M
Settings
00000001
JESD204 S Register
Address: 0x1C9, Reset: 0x00, Name: S
Table 98. Bit Descriptions for S
Bits
[7:5]
[4:0]
Bit Name
RESERVED
S
Settings
00000
S.
One sample per frame (the only valid option).
JESD204 RES1 Register
Address: 0x1CB, Reset: 0x00, Name: RES1
Table 99. Bit Descriptions for RES1
Bits
[7:0]
Bit Name
RES1
Description
Reset
0x00
Rev. D | Page 80 of 90
Access
RW
Data Sheet
AD6676
JESD204 RES2 Register
Address: 0x1CC, Reset: 0x00, Name: RES2
Table 100. Bit Descriptions for RES2
Bits
[7:0]
Bit Name
RES2
Description
Reset
0x00
Access
RW
JESD204 LID0 Register
Address: 0x1D0, Reset: 0x00, Name: LID0
Table 101. Bit Descriptions for LID0
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[4:0]
LID0
Lane ID for Lane 0.
0x00
RW
JESD204 LID1 Register
Address: 0x1D1, Reset: 0x01, Name: LID1
Table 102. Bit Descriptions for LID1
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[4:0]
LID1
Lane ID for Lane 1.
0x01
RW
Reset
0x44
Access
RW
Reset
0x45
Access
RW
JESD204 FCHK0 Register
Address: 0x1D8, Reset: 0x44, Name: FCHK0
Table 103. Bit Descriptions for FCHK0
Bits
[7:0]
Bit Name
FCHK0
Description
Checksum for Lane 0.
JESD204 FCHK1 Register
Address: 0x1D9, Reset: 0x45, Name: FCHK1
Table 104. Bit Descriptions for FCHK1
Bits
[7:0]
Bit Name
FCHK1
Description
Checksum for Lane 1.
Enable Lane FIFO Register
Address: 0x1E0, Reset: 0x00, Name: EN_LFIFO
Table 105. Bit Descriptions for EN_LFIFO
Bits
[7:1]
Bit Name
RESERVED
Description
Reset
0x00
Access
RW
0
EN_LFIFO
Lane FIFO Enable. Once the entire configuration of the framer has been completed, and the
link is powered up, set this bit to start the lane FIFOs that manage the hand-off of data from
the framer to the transmitter PHY.
0x0
RW
Rev. D | Page 81 of 90
AD6676
Data Sheet
Swap Register
Address: 0x1E1, Reset: 0x00, Name: SWAP
Table 106. Bit Descriptions for SWAP
Bits
[7:6]
[5:4]
[3:2]
[1:0]
Bit Name
RESERVED
SWAP_CONV
Settings
Description
00
01
10
11
Bit [4] swaps the source of Framer Converter 0 (default is I channel).
Bit [5] swaps the source of Framer Converter 1 (default is Q channel).
Framer Input 1 = Q channel; Framer Input 0 = I channel
Framer Input 1 = Q channel; Framer Input 0 = Q channel
Framer Input 1 = I channel; Framer Input 0 = I channel
Framer Input 1 = I channel; Framer Input 0 = Q channel
00
01
10
11
Bit [0] swaps the source of physical output lane 0.
Bit [1] swaps the source of physical output lane 1.
Output Lane 1 = Famer lane 1; Output Lane 0 = Framer Lane 0
Output Lane 1 = Framer lane 1; Output Lane 0 = Framer Lane 1
Output Lane 1 = Framer lane 0; Output Lane 0 = Framer Lane 0
Output Lane 1 = Framer lane 0; Output Lane 0 = Framer Lane 1
RESERVED
SWAP_LANE
Reset
0x0
0x0
Access
RW
RW
0x0
0x0
RW
RW
Link/Lane Power-Down Register
Address: 0x1E2, Reset: 0x00, Name: LANE_PD
Table 107. Bit Descriptions for LANE_PD
Bits
[7:4]
Bit Name
ILAS_DELAY
[3:2]
[1:0]
RESERVED
LANE_PD
Description
ILAS Start Delay. Usually the ILAS starts on the first LMFC rising edge after
SYNCINB goes high. This value delays the ILAS by the given number of LMFC
periods (multiframe periods).
Lane Power-down.
Bit 0 powers down transmitter PHY for Lane 0.
Bit 1 powers down transmitter PHY for Lane 1.
Reset
0x0
Access
RW
0x0
0x0
RW
RW
Interface Control 0 Register
Address: 0x1E3, Reset: 0x14, Name: MIS1
Table 108. Bit Descriptions for MIS1
Bits
[7:6]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
5
TEST_SAMPLE_EN
0x0
RW
4
LSYNC_EN
0 = Disable transport layer test samples.
1 = Enable transport layer test samples.
0 = Disable lane synchronization.
1 = Enable lane synchronization (default).
0x1
RW
[3:2]
ILAS_MODE
0x1
RW
1
FACI_DISABLE
01 = Enable ILAS (default).
11 = ILAS always on; data link layer test mode.
Control of Frame Alignment Characters.
0 = Enable frame alignment character insertion.
1 = Disable frame alignment character insertion.
0x0
RW
0
RESERVED
0x0
RW
Rev. D | Page 82 of 90
Data Sheet
AD6676
Interface Control 1 Register
Address: 0x1E4, Reset: 0x00, Name: SYNC_PIN
Table 109. Bit Descriptions for SYNC_PIN
Bits
[7:6]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
5
SYNC_PIN_INV
0 = do not invert SYNCINB pin; SYNCINB is active low.
1 = invert SYNCINB pin; SYNCINB is active high.
0x0
RW
[4:2]
RESERVED
0x0
RW
1
INV_10B
0x0
RW
0
RESERVED
0x0
RW
0 = do not invert octets.
1 = invert all bits in 10-bit octets from framer. Setting the bit to 1 has the same effect
as swapping the differential output data pins.
Interface Test Register
Address: 0x1E5, Reset: 0x00, Name: TEST_GEN
Table 110. Bit Descriptions for TEST_GEN
Bits
[7:6]
[5:4]
Bit Name
RESERVED
TEST_GEN_SEL
Settings
Description
00
01
10
[3:0]
TEST_GEN_MODE
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
Test Point.
Insert test data at framer input (16 bits).
Insert test data at PHY input (10 bits).
Insert test data at scrambler input (8 bits).
Test Mode.
Normal mode; test disabled.
Alternating checkerboard.
1/0 word toggle.
Long PN sequence.
Short PN sequence.
Repeating user pattern mode.
Single user pattern mode.
Ramp. Note that in single lane mode the Q sample is 1 LSB less than the
I sample. In other words, Q[n] = I[n] – 1 LSB, where n is nth IQ sample.
Modified RPAT sequence.
Not used.
JSPAT sequence.
JTSPAT sequence.
Reset
0x0
0x0
Access
RW
RW
0x0
RW
ILAS Count Register
Address: 0x1E6, Reset: 0x00, Name: KF_ILAS
Table 111. Bit Descriptions for KF_ILAS
Bits
[7:0]
Bit Name
KF_ILAS
Description
Initial Lane Assignment Sequence Count. The ILAS is transmitted (KF_ILAS + 1) times.
Rev. D | Page 83 of 90
Reset
0x00
Access
RW
AD6676
Data Sheet
SYNCINB and SYSREF Control Register
Address: 0x1E7, Reset: 0x00, Name: SYNCINB_CTRL
Table 112. Bit Descriptions for SYNCB_CTRL
Bits
[7:4]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
3
2
PD_SYSREF_RX
LVDS_SYNCINB
Power down SYSREF receiver.
Use LVDS for SYNCINB. (0 = CMOS, 1 = LVDS differential with 100 Ω termination).
0x0
0x0
RW
RW
[1:0]
RESERVED
0x0
RW
Clock Synchronization Register
Address: 0x1E8, Reset: 0x00, Name: MIX_CTRL
Table 113. Bit Descriptions for MIX_CTRL
Bits
7
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
6
MIX_USE_2ND
0x0
RW
5
MIX_NEXT
0x0
RWAC
4
MIX_ALL
When used in conjunction with Bit 5, setting this bit causes the second SYSREF that
is used to align the clocks to also be used to reset the mixer NCO phases. This bit
does not self-clear. This bit is only active when Bit 2 is also active.
Once set, only the next SYSREF pulse that is used to align the clock dividers is also
used to reset the mixers NCO phases. This bit self clears after use. This bit is only
active when Bit 1 is also active.
Any SYSREF that is used to align the clocks is also used to reset the mixers' NCO
phases. This bit is only active when Bit 0 is also active.
0x0
RW
3
RESERVED
0x0
RW
2
USE_2ND_SYSREF
0x0
RW
1
NEXT_SYSREF
0x0
RWAC
0
ALL_SYSREF
0x0
RW
When used in conjunction with Bit 1, setting this bit causes the second SYSREF to be
used for alignment rather than the first. This bit does not self clear.
Once set, only the next SYSREF pulse is used to align the clock dividers. This bit selfclears after the next SYSREF.
All SYSREF pulses are used to align the clock dividers.
LMFC Offset Register
Address: 0x1E9, Reset: 0x00, Name: K_OFFSET
Table 114. Bit Descriptions for K_OFFSET
Bits
[7:5]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[4:0]
K_OFFSET
This register provides an offset that moves the position of the internal LMFC
with respect to SYSREF. A larger value places the LMFC later in time. In units of
frame periods.
0x00
RW
Reset
0x0
Access
RW
0x0
RW
SYSREF Window Register
Address: 0x1EA, Reset: 0x00, Name: SYSREF
Table 115. Bit Descriptions for SYSREF
Bits
[7:4]
Bit Name
SYSREF_WIN_NEG
[3:0]
SYSREF_WIN_POS
Description
SYSREF_WIN_NEG. Do not align clocks if SYSREF is no earlier than register
value before its expected position. In units of 2/FADC.
SYSREF_WIN_POS. Do not align clocks if SYSREF is no later than register
value after its expected position. In units of 2/FADC.
Rev. D | Page 84 of 90
Data Sheet
AD6676
PHY Control 0 Register
Address: 0x1EB, Reset: 0x1C, Name: SER1
Table 116. Bit Descriptions for SER1
Bits
7
Bit Name
SER_DRV_PS
Description
Serializer Polarity Selection.
Reset
0x0
Access
RW
0x1C
RW
0 = Polarity not inverted.
1 = Polarity inverted.
[6:0]
RESERVED
PHY Control 1 Register
Address: 0x1EC, Reset: 0x00, Name: SER2
Table 117. Bit Descriptions for SER1
Bits
[7:4]
Bit Name
SER_ITRIM
Description
Driver bias current trim with recommended setting of 0x0B.
Reset
0x9
Access
RW
[3:0]
SER_RTRIM
Resistor termination code with recommended setting of 0x0D.
0xB
RW
PHY Control 3 Register
Address: 0x1EF, Reset: 0x00, Name: PRE-EMPHASIS
Table 118. Bit Descriptions for PRE-EMPHASIS
Bits
7
Bit Name
SER_EMP_PS1
Description
Toggle Polarity of Lane 1 Emphasis.
Reset
0x0
Access
RW
[6:4]
SER_EMP_IDAC1
Lane 1 IDAC Setting.
00: 0 mV emphasis differential p-p.
0x0
RW
01: 160 mV emphasis differential p-p.
10: 80 mV emphasis differential p-p.
11: 40 mV emphasis differential p-p.
3
SER_EMP_PS0
Toggle polarity of Lane 0 emphasis.
0x0
RW
[2:0]
SER_EMP_IDAC0
Lane 0 IDAC Setting.
0x0
RW
Reset
0xFF
Access
RW
00: 0 mV emphasis differential p-p.
01: 160 mV emphasis differential p-p.
10: 80 mV emphasis differential p-p.
11: 40 mV emphasis differential p-p.
ADC Standby 0 Register
Address: 0x250, Reset: 0xFF, Name: STBY_DAC
Table 119. Bit Descriptions for STBY_DAC
Bits
[7:0]
Bit Name
STBY_DAC
Description
Setting register to 0x95 results in faster standby ADC recovery time.
Rev. D | Page 85 of 90
AD6676
Data Sheet
CLKSYN Enable Register
Address: 0x2A0, Reset: 0x00, Name: CLKSYN_ENABLE
Table 120. Bit Descriptions for CLKSYN_ENALBE
Bits
7
6
5
4
3
2
1
0
Bit Name
EN_EXTCK
EN_ADC_CK
EN_SYNTH
EN_VCO_PTAT
EN_VCO_ALC
EN_VCO
EN_OVERIDE_CAL
EN_OVERIDE
Description
EXTCK Enable.
ADC CK Enable.
Synthesizer Enable.
VCO PTAT Enable.
VCO ALC Enable.
VCO Enable.
Override Calibration Enable.
Override Enable.
Reset
0x0
0x0
0x0
0x0
0x0
0x0
0x0
0x0
Access
RW
RW
RW
RW
RW
RW
RW
RW
Reset
0x80
Access
RW
Reset
0x0
0x0
Access
RW
RW
CLKSYN Integer N LSB Register
Address: 0x2A1, Reset: 0x80, Name: CLKSYN_INT_N_LSB
Table 121. Bit Descriptions for CLKSYN_INT_N_LSB
Bits
[7:0]
Bit Name
INT_N_LSB
Description
Lower LSBs of 11-bit Integer-N Value.
CLKSYN Integer N MSB Register
Address: 0x2A2, Reset: 0x00, Name: CLKSYN_INT_N_MSB
Table 122. Bit Descriptions for CLKSYN_INT_N_MSB
Bits
[7:3]
[2:0]
Bit Name
RESERVED
INT_N_MSB
Description
Upper 3 MSBs of 11-bit Integer N Value.
CLKSYN VCO Calibration RESET Register
Address: 0x2A5, Reset: 0x00, Name: VCO_CAL_RESET
Table 123. Bit Descriptions for VCO_CAL_RESET
Bits
[7:4]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
3
VCO_CAL_RESET
Reset VCO Calibration.
0
RW
[2:0]
RESERVED
0x0
RW
CLKSYN KVCO VCO Register
Address: 0x2A9, Reset: 0x00, Name: CLKSYN_KVCO
Table 124. Bit Descriptions for CLKSYN_KVCO
Bits
[7:4]
Bit Name
VCO KVCO VAR
[3:0]
VCO_ALC_LVL
Description
Rev. D | Page 86 of 90
Reset
0x0
Access
RW
0xA
RW
Data Sheet
AD6676
CLKSYN VCO Bias Register
Address: 0x2AA, Reset: 0x37, Name: CLKSYN_VCO_BIAS
Table 125. Bit Descriptions for CLKSYN_VCO_BIAS
Bits
[7:6]
[5:4]
3
[2:0]
Bit Name
RESERVED
BIAS_TEMPCO
RESERVED
BIAS
Description
VCO Bias Tempco Setting.
VCO Bias Setting.
Reset
0
0x3
0
0x7
Access
RW
RW
RW
RW
Reset
0xC
Access
RW
CLKSYN VCO Calibration Register
Address: 0x2AB, Reset: 0xC0, Name: CLKSYN_VCO_CAL
Table 126. Bit Descriptions for CLKSYN_VCO_CAL
Bits
[7:4]
Bit Name
INIT_ALC_VALUE
Description
Initial Automatic Level Control Value.
3
ALC_DIS
ALC calibration Test Bit.
[2:1]
RESERVED
0
ID_SYNTH
Initiates VCO Calibration.
0
RW
0
RW
0
RW
CLKSYN Charge Pump Register
Address: 0x2AC, Reset: 0x19, Name: CLKSYN_I_CP
Table 127. Bit Descriptions for CLKSYN_I_CP
Bits
[7:6]
Bit Name
RESERVED
Description
Reset
0x0
Access
RW
[5:0]
I_CP
Charge Pump Current = min(63, 1.33 × 1028/(fPFD × FCLK2) − 1).
0x19
RW
Reset
0x0
Access
RW
0x0
RW
Reset
0xD0
Access
RW
CLKSYN Charge Pump Calibration Register
Address: 0x2AD, Reset: 0x00, Name: EN_CP_CAL
Table 128. Bit Descriptions for EN_CP_CAL
Bits
[7:6]
Bit Name
EN_CP_CAL
[6:0]
RESERVED
Description
CLKSYN VCO Varactor Register
Address: 0x2B7, Reset: 0xD0, Name: CLKSYN_VCO_VAR
Table 129. Bit Descriptions for CLKSYN_VCO_VAR
Bits
[7:4]
[3:0]
Bit Name
VCO_VAR
RESERVED
Description
VCO Varactor Setting.
Rev. D | Page 87 of 90
AD6676
Data Sheet
CLKSYN Reference Divider and SYSREF Control Register
Address: 0x2BB, Reset: 0xB9, Name: CLKSYN_R_DIV
Table 130. Bit Descriptions for CLKSYN_R_DIV
Bits
[7:6]
[5:4]
3
Bit Name
R_DIV
RESERVED
SYSREF_CTRL
2
CLKIN_IMPED
[1:0]
RESERVED
Description
00 = div-by-1; 01 = div-by-2; 10 = div-by-4; 11 = multiply-by-2.
SYSREF Input Sampling Clock.
0 = use clock synthesizer reference clock.
1 = use internal clock at FADC/2 (use for nonclock synthesizer case).
CLKIN Impedance.
0 = configure CLK± as 100 Ω termination, configuration for clock
synthesizer disabled.
1 = configure CLK+ as high-Z, configuration for clock synthesizer enabled.
Reset
10
0x3
1
Access
RW
RW
RW
0
RW
0x1
RW
Reset
0x8
0x0
0x0
0x0
0x0
Access
R
R
R
R
R
Reset
0x8
Access
R
CLKSYN Status Register
Address: 0x2BC, Reset: 0x80, Name: CLKSYN_STATUS
Table 131. Bit Descriptions for CLKSYN_STATUS
Bits
[7:4]
3
2
1
0
Bit Name
RESERVED
PLL_LCK
RESERVED
VCO CAL BUSY
CP CAL DONE
Description
Clock Synthesizer Lock Bit (1 = lock).
VCO Calibration Busy (0 = done).
Charge Pump Calibration Done (1 = done).
JESDSYN Status Register
Address: 0x2DC, Reset: 0x80, Name: JESDSYN_STATUS
Table 132. Bit Descriptions for JESDSYN_STATUS
Bits
[7:4]
Bit Name
RESERVED
Description
3
PLL_LCK
JESD204 PLL Synthesizer Lock Bit (1 = lock).
2
RESERVED
0x0
R
0x0
R
1
VCO CAL BUSY
VCO Calibration Busy (0 = done).
0x0
R
0
CP CAL DONE
Charge Pump Calibration Done (1 = done).
0x0
R
Shuffler Control Register
Address: 0x340, Reset: 0x03, Name: SHUFFLE_CTRL
Table 133. Bit Descriptions for SHUFFLE_CTRL
Bits
[7:2]
Bit Name
RESERVED
1
RESERVED
0
EN_ADAPTIVE_SHUFFLE
Description
Enable Adaptive Flash Shuffling.
Rev. D | Page 88 of 90
Reset
0x00
Access
RW
1
RW
1
RW
Data Sheet
AD6676
Shuffler Threshold 1 and 2 Register
Address: 0x342, Reset: 0xF5, Name: SHUFFLE_THREG_0
Table 134. Bit Descriptions for SHUFFLE_THREG_0
Bits
[7:4]
Bit Name
SHUFFLE_TH2
[3:0]
SHUFFLE_TH1
Description
Threshold value for shuffling every two cycles. Shuffle-every-2 is triggered
when the ADC data is greater than or equal to this threshold.
Threshold value for shuffling every one cycle. Shuffle-every-1 is triggered
when the ADC data is greater than or equal to this threshold
Reset
0xF
Access
R
0x5
R
Reset
0xF
Access
R
0xF
R
Shuffler Threshold 3 and 4 Register
Address: 0x343, Reset: 0xFF, Name: SHUFFLE_THREG_1
Table 135. Bit Descriptions for SHUFFLE_THREG_1
Bits
[7:4]
Bit Name
SHUFFLE_TH4
[3:0]
SHUFFLE_TH3
Description
Threshold value for shuffling every four cycles. Shuffle-every-4 is triggered
when the ADC data is greater than or equal to this threshold.
Threshold value for shuffling every three cycles. Shuffle-every-3 is triggered
when the ADC data is greater than or equal to this threshold
Rev. D | Page 89 of 90
AD6676
Data Sheet
OUTLINE DIMENSIONS
4.33
4.29
4.25
0.27
8
7 6 5
4 3
2
1
A
B
BALL A1
IDENTIFIER
C
5.08
5.04
5.00
D
4.50 REF
E
F
G
H
J
(BALL SIDE DOWN)
SEATING
PLANE
SIDE VIEW
BOTTOM VIEW
0.36
0.390
0.360
0.330
(BALL SIDE UP)
0.43
3.50 REF
COPLANARITY
0.05
0.360
0.320
0.280
0.270
0.240
0.210
03-14-2013-A
0.660
0.600
0.540
K
0.50
BALL PITCH
TOP VIEW
Figure 151. 80-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-80-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD6676BCBZRL
AD6676EBZ
1
Temperature Range
−40°C to +85°C
Package Description
80-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
Z = RoHS Compliant Part.
©2014–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12348-0-5/17(D)
Rev. D | Page 90 of 90
Package Option
CB-80-5