plerowTM ALN1100R2 Internally Matched LNA Module Features Description · S21 = 34 dB@950 MHz = 31 dB@1250 MHz · NF of 0.75 dB over Frequency · Unconditionally Stable · Single 5 V Supply · High OIP3@Low Current The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ.@T = 25 °C, Vs = 5 V, Freq. = 1100 MHz, Zo.sys = 50 ohms Parameter Unit Frequency Range Specifications Min Typ Max MHz 950 Gain dB 31.5 Gain Flatness dB ±1.5 ±1.6 Noise Figure dB 0.75 0.8 Output IP3 (1) dBm S11/S22 (2) 1250 dBm Switching Time (3) More Information 32.5 31 Website: www.asb.co.kr E-mail: [email protected] 32 dB Output P1dB 2-stage Single Type Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -12/-14 19 20 msec - Supply Current mA 100 Supply Voltage V 5 Impedance W 50 120 Max. RF Input Power dBm C.W 29~31 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Operating temperature is –40 °C to +85 °C. 1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz. 2) S11, S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow ALN1100R2 ASB Inc. (Top View) (Bottom View) Pin Number Function 2 RF In 4 Vs 6 RF Out Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Solder Stencil Area (Side View) Ø0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr December 2009 plerowTM ALN1100R2 Internally Matched LNA Module S-parameters Typical Performance (Measured) 950~1250 MHz +5 V Stability Factor (K) Noise Figure OIP3 2/4 P1dB www.asb.co.kr December 2009 plerowTM ALN1100R2 Internally Matched LNA Module RF Performance with Voltage Change 1. S-parameter 950 MHz 1100 MHz 1250 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) 4.50 V 33.03 -16.25 -19.85 32.71 2.42 -20.18 -26.95 30.61 -17.57 -20.54 4.75 V 33.26 -16.18 -19.94 32.96 2.41 -20.70 -27.04 30.85 -18.02 -20.74 5.00 V 33.42 -16.00 -20.23 33.13 2.41 -21.11 -26.93 31.01 -18.27 -20.89 5.25 V 33.54 -15.99 -20.95 33.23 2.45 -21.36 -26.35 31.09 -18.50 -21.07 5.50 V 33.53 -15.90 -21.71 33.28 2.40 -21.73 -25.59 31.13 -18.78 -21.03 2. OIP3, P1dB & NF 950 MHz 1100 MHz 1250 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) 4.50 V 32.70 20.32 0.693 32.38 20.57 0.646 31.05 19.43 0.612 4.75 V 33.34 21.00 0.702 33.45 21.17 0.650 32.15 20.39 0.614 5.00 V 34.61 21.55 0.708 34.23 21.76 0.652 33.02 21.08 0.614 5.25 V 34.62 21.97 0.707 34.18 22.18 0.663 33.05 21.52 0.617 5.50 V 34.68 22.43 0.710 34.15 22.54 0.672 33.12 21.87 0.626 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 950 MHz 1100 MHz 1250 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) -45 °C 34.65 -12.54 -16.47 34.70 2.34 -16.42 -29.72 32.31 -15.43 -21.40 -10 °C 34.23 -14.38 -17.83 34.12 2.23 -19.22 -27.89 32.00 -17.50 -21.04 25 °C 33.67 -15.30 -19.72 33.48 2.33 -20.61 -28.56 31.34 -18.17 -21.32 60 °C 33.35 -16.65 -21.54 32.98 2.46 -20.77 -27.32 30.89 -17.75 -20.90 85 °C 32.85 -17.75 -23.53 32.38 2.58 -20.00 -26.22 30.27 -16.89 -20.13 2. OIP3, P1dB & NF 950 MHz 1100 MHz 1250 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) -45 °C 35.73 22.55 0.427 35.50 22.61 0.389 34.45 22.03 0.345 -10 °C 35.45 22.51 0.558 35.10 22.78 0.502 34.05 21.87 0.475 25 °C 34.75 21.75 0.710 34.20 22.00 0.658 33.12 21.15 0.625 60 °C 33.87 21.32 0.890 33.12 20.72 0.820 32.20 20.20 0.801 85 °C 32.40 20.28 0.941 31.82 20.25 0.877 31.65 19.85 0.853 Note: tested at Vs= 5V. 3/4 www.asb.co.kr December 2009 plerowTM ALN1100R2 Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 ALN IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process 20~40 sec 260 °C Ramp-up (3 °C/sec) 200 °C Evaluation Board Layout OUT Ramp-down (6 °C/sec) IN 150 °C Vs 60~180 sec 4/4 Size 25x25 mm (for ALN-R Series – 10x10 mm) www.asb.co.kr December 2009