TI AM26C31IDG4 Quadruple differential line driver Datasheet

AM26C31
www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
QUADRUPLE DIFFERENTIAL LINE DRIVER
FEATURES
1
1A
16
VCC
1Y
2
15
4A
1Z
3
14
4Y
G
4
13
4Z
2Z
5
12
G
2Y
6
11
2A
7
10
3Z
3Y
GND
8
9
3A
NC
VCC
3
2
1 20 19
4A
1A
AM26C31M. . .FK PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
1Z
4
18
4Y
G
5
17
4Z
NC
6
16
NC
2Z
7
15
G
2Y
8
14
3Z
3Y
3A
9 10 11 12 13
2A
The AM26C31 is a differential line driver with
complementary outputs, designed to meet the
requirements of TIA/EIA-422-B and ITU (formerly
CCITT). The 3-state outputs have high-current
capability for driving balanced lines, such as
twisted-pair or parallel-wire transmission lines, and
they provide the high-impedance state in the
power-off condition. The enable functions are
common to all four drivers and offer the choice of an
active-high (G) or active-low (G) enable input.
BiCMOS circuitry reduces power consumption without
sacrificing speed.
1
NC
•
•
AM26C31M. . .J OR W PACKAGE
AM26C31Q. . .D PACKAGE
AM26C31C. . .D, DB, OR NS PACKAGE
AM26C31I. . .D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1Y
•
•
•
•
•
Meets or Exceeds the Requirements of
TIA/EIA-422-B and ITU Recommendation V.11
Low Power, ICC = 100 µA Typ
Operates From a Single 5-V Supply
High Speed, tPLH = tPHL = 7 ns Typ
Low Pulse Distortion, tsk(p) = 0.5 ns Typ
High Output Impedance in Power-Off
Conditions
Improved Replacement for AM26LS31
Available in Q-Temp Automotive
– High-Reliability Automotive Applications
– Configuration Control/Print Support
– Qualification to Automotive Standards
GND
•
NC – No internal connection
The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation
from –40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of
–40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of
–55°C to 125°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1990–2008, Texas Instruments Incorporated
AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com
ORDERING INFORMATION
PACKAGE (1) (2)
TA
PDIP (N)
0°C to 70°C
–40°C to 125°C
–55°C to 125°C
(1)
(2)
TOP-SIDE MARKING
Tube of 25
AM26C31CN
Tube of 40
AM26C31CD
Reel of 2500
AM26C31CDR
SOP (NS)
Reel of 2000
AM26C31CNSR
26C31
SSOP (DB)
Reel of 2000
AM26C31CDBR
26C31
PDIP (N)
Tube of 25
AM26C31IN
AM26C31IN
Tube of 40
AM26C31ID
Reel of 2500
AM26C31IDR
SOP (NS)
Reel of 2000
AM26C31INSR
26C31I
SSOP (DB)
Reel of 2000
AM26C31IDBR
26C31I
TSSOP (PW)
Tube of 90
AM26C31IPW
26C31I
Tube of 40
AM26C31QD
Reel of 2500
AM26C31QDR
CDIP (J)
Tube of 25
AM26C31MJ
AM26C31MJ
CFP (W)
Tube of 150
AM26C31MW
AM26C31MW
LCCC (FK)
Tube of 55
AM26C31MFK
AM26C31MFK
SOIC (D)
SOIC (D)
–40°C to 85°C
ORDERABLE PART NUMBER
SOIC (D)
AM26C31CN
AM26C31C
AM26C31I
AM26C31QD
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
(Each Driver) (1)
INPUT
A
(1)
2
ENABLES
OUTPUTS
G
G
Y
H
H
X
H
Z
L
L
H
X
L
H
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
H = High level, L = Low level, X = Irrelevant,
Z = High impedance (off)
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AM26C31
www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
4
G
G
12
2
1
1A
2A
3A
3
6
7
5
10
9
11
14
4A
15
13
1Y
1Z
2Y
2Z
3Y
3Z
4Y
4Z
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
SCHEMATICS OF INPUTS AND OUTPUTS
EQUIVALENT OF EACH INPUT
TYPICAL OF ALL OUTPUTS
VCC
VCC
Input
Output
GND
GND
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AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.5
7
V
VI
Input voltage range
–0.5
VCC + 0.5
V
VID
Differential input voltage range
–14
14
V
VO
Output voltage range
–0.5
7
IIK
IOK
Input or output clamp current
IO
Output current
VCC current
GND current
θJA
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
±20
mA
±150
mA
200
mA
–200
Package thermal impedance (3) (4)
UNIT
mA
D package
73
DB package
82
N package
67
NS package
64
PW package
108
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground terminal.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
4.5
5
5.5
UNIT
VCC
Supply voltage
VID
Differential input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
–20
µA
IOL
Low-level output current
20
mA
±7
TA
4
Operating free-air temperature
V
2
AM26C31C
V
0
70
AM26C31I
–40
85
AM26C31Q
–40
125
AM26C31M
–55
125
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V
°C
Copyright © 1990–2008, Texas Instruments Incorporated
Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AM26C31C
AM26C31I
TEST CONDITIONS
MIN TYP (1)
VOH
High-level output voltage
IO = –20 mA
VOL
Low-level output voltage
IO = 20 mA
VOD
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
(2)
2.4
UNIT
MAX
3.4
0.2
2
V
0.4
3.1
V
V
Δ|VOD|
Change in magnitude of differential output voltage
RL = 100 Ω,
See Figure 1
±0.4
V
VOC
Common-mode output voltage
RL = 100 Ω,
See Figure 1
3
V
Δ|VOC|
Change in magnitude of common-mode output voltage (2)
RL = 100 Ω,
See Figure 1
±0.4
V
II
Input current
VI = VCC or GND
±1
µA
IO(off)
Driver output current with power off
VCC = 0
IOS
Driver output short-circuit current
VO = 0
IOZ
High-impedance off-state output current
ICC
Quiescent supply current
Ci
Input capacitance
VO = 6 V
100
VO = –0.25 V
–100
–30
–150
VO = 2.5 V
20
VO = 0.5 V
–20
VI = 0 or 5 V
(1)
(2)
(3)
IO = 0
VI = 2.4 V or 0.5
V (3)
µA
mA
µA
100
µA
3
mA
1.5
6
pF
All typical values are at VCC = 5 V and TA = 25°C.
Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
S1 is open,
See Figure 2
Pulse skew time (|tPLH – tPHL|)
S1 is open,
See Figure 2
tr(OD), tf(OD)
Differential output rise and fall times
S1 is open,
See Figure 3
tPZH
Output enable time to high level
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
tPLZ
Output disable time from low level
Cpd
Power dissipation capacitance (each driver) (2)
(1)
(2)
S1 is closed,
See Figure 4
S1 is closed,
See Figure 4
S1 is open,
See Figure 2
AM26C31C
AM26C31I
UNIT
MIN
TYP (1)
MAX
3
7
12
3
7
12
0.5
4
ns
ns
5
10
10
19
10
19
7
16
7
16
170
ns
ns
ns
pF
All typical values are at VCC = 5 V and TA = 25°C.
Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
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AM26C31
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ELECTRICAL CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AM26C31Q
AM26C31M
TEST CONDITIONS
MIN TYP (1)
VOH
High-level output voltage
IO = –20 mA
VOL
Low-level output voltage
IO = 20 mA
VOD
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
(2)
2.2
UNIT
MAX
3.4
0.2
2
V
0.4
3.1
V
V
Δ|VOD|
Change in magnitude of differential output voltage
RL = 100 Ω,
See Figure 1
±0.4
V
VOC
Common-mode output voltage
RL = 100 Ω,
See Figure 1
3
V
Δ|VOC|
Change in magnitude of common-mode output voltage (2)
RL = 100 Ω,
See Figure 1
±0.4
V
II
Input current
VI = VCC or GND
±1
µA
IO(off)
Driver output current with power off
VCC = 0
IOS
Driver output short-circuit current
VO = 0
IOZ
High-impedance off-state output current
ICC
Quiescent supply current
Ci
Input capacitance
(1)
(2)
(3)
VO = 6 V
100
VO = –0.25 V
–100
–170
VO = 2.5 V
20
VO = 0.5 V
–20
IO = 0
µA
mA
µA
VI = 0 or 5 V
100
µA
VI = 2.4 V or 0.5
V (3)
3.2
mA
6
pF
All typical values are at VCC = 5 V and TA = 25°C.
Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level
to a low level.
This parameter is measured per input. All other inputs are at 0 or 5 V.
SWITCHING CHARACTERISTICS
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
AM26C31Q
AM26C31M
MIN
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
S1 is open,
See Figure 2
Pulse skew time (|tPLH – tPHL|)
S1 is open,
See Figure 2
tr(OD), tf(OD)
Differential output rise and fall times
S1 is open,
See Figure 3
tPZH
Output enable time to high level
tPZL
Output enable time to low level
tPHZ
Output disable time from high level
tPLZ
Output disable time from low level
Cpd
Power dissipation capacitance (each driver) (2)
(1)
(2)
6
S1 is closed,
See Figure 4
S1 is closed,
See Figure 4
S1 is open,
See Figure 2
UNIT
TYP (1)
MAX
7
12
6.5
12
0.5
4
ns
ns
5
12
10
19
10
19
7
16
7
16
100
ns
ns
ns
pF
All typical values are at VCC = 5 V and TA = 25°C.
Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
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Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION
Figure 1. Differential and Common-Mode Output Voltages
C2 = 40 pF
Input
RL/2
500 Ω
C1 =
40 pF
1.5 V
S1
C3 = 40 pF
RL/2
See Note A
TEST CIRCUIT
3V
1.3 V
0V
Input A
(see Note B)
tPLH
Output Y
50%
tPHL
50%
1.3 V
tsk(p)
Output Z
50%
tsk(p)
50%
1.3 V
tPHL
tPLH
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit
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AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit
8
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Product Folder Link(s): AM26C31
AM26C31
www.ti.com................................................................................................................................................... SLLS103M – DECEMBER 1990 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION (continued)
Output
C2 =
40 pF
0V
3V
Enable Inputs
(see Note B)
C1 =
40 pF
Input A
C3 =
40 pF
G
50 Ω
500 Ω
1.5 V
S1
50 Ω
Output
G
See Note A
TEST CIRCUIT
Enable G Input
(see Note C)
3V
1.3 V1.3 V
Enable G Input
0V
1.5 V
Output WIth
0 V to A Input
VOL + 0.3 V
0.8 V
VOL
tPLZ
tPZL
VOH
Output WIth
3 V to A Input
VOH - 0.3 V
2V
1.5 V
tPHZ
tPZH
VOLTAGE WAVEFORMS
A.
C1, C2, and C3 include probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and
tr, tf ≤ 6 ns.
C.
Each enable is tested separately.
Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit
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AM26C31
SLLS103M – DECEMBER 1990 – REVISED JUNE 2008................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SWITCHING FREQUENCY
Figure 5.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
AM26C31CD
ACTIVE
SOIC
D
16
AM26C31CDBLE
OBSOLETE
SSOP
DB
16
AM26C31CDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
AM26C31CNE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
AM26C31CNSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CNSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31CNSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31ID
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDBLE
OBSOLETE
SSOP
DB
16
AM26C31IDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31IN
ACTIVE
PDIP
N
16
CU NIPDAU
N / A for Pkg Type
40
Green (RoHS &
no Sb/Br)
TBD
40
Green (RoHS &
no Sb/Br)
TBD
25
Addendum-Page 1
Pb-Free
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
AM26C31INE4
ACTIVE
PDIP
N
16
AM26C31INSR
ACTIVE
SO
NS
16
AM26C31INSRG4
ACTIVE
SO
NS
16
AM26C31IPW
ACTIVE
TSSOP
PW
16
90
AM26C31IPWE4
ACTIVE
TSSOP
PW
16
AM26C31IPWG4
ACTIVE
TSSOP
PW
16
AM26C31IPWR
ACTIVE
TSSOP
PW
AM26C31IPWRG4
ACTIVE
TSSOP
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31QD
ACTIVE
SOIC
D
16
40
TBD
CU NIPDAU
Level-1-220C-UNLIM
AM26C31QDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26C31QDR
ACTIVE
SOIC
D
16
2500
TBD
CU NIPDAU
Level-1-220C-UNLIM
AM26C31QDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
AM26C31CDBR
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
DB
16
2000
330.0
16.4
8.2
6.6
2.5
AM26C31CDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31CNSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
AM26C31IDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
AM26C31IDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26C31INSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
AM26C31IPWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Apr-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AM26C31CDBR
SSOP
DB
16
2000
346.0
346.0
33.0
AM26C31CDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C31CNSR
SO
NS
16
2000
346.0
346.0
33.0
AM26C31IDBR
SSOP
DB
16
2000
346.0
346.0
33.0
AM26C31IDR
SOIC
D
16
2500
333.2
345.9
28.6
AM26C31INSR
SO
NS
16
2000
346.0
346.0
33.0
AM26C31IPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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