CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 D D D D D D D D CY54FCT240T . . . D PACKAGE CY74FCT240T . . . Q OR SO PACKAGE (TOP VIEW) OEA DA0 OB0 DA1 OB1 DA2 OB2 DA3 OB3 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OEB OA0 DB0 OA1 DB1 OA2 DB2 OA3 DB3 CY54FCT240T . . . L PACKAGE (TOP VIEW) OB0 DA 0 OEA VCC OEB D Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels CY54FCT240T – 48-mA Output Sink Current 12-mA Output Source Current CY74FCT240T – 64-mA Output Sink Current 32-mA Output Source Current 3-State Outputs DA1 OB1 DA2 OB2 DA3 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 OA0 DB0 OA1 DB1 OA2 OB 3 GND DB 3 OA 3 DB 2 D description The ’FCT240T devices are octal buffers and line drivers designed to be employed as memory address drivers, clock drivers, and bus-oriented transmitters/receivers. These devices provide speed and drive capabilities equivalent to their fastest bipolar logic counterparts, while reducing power consumption. The input and output voltage levels allow direct interface with TTL, NMOS, and CMOS devices without external components. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 ORDERING INFORMATION 4.3 CY74FCT240CTSOC Tape and reel 4.3 CY74FCT240CTSOCT Tape and reel 4.3 CY74FCT240CTQCT Tube 4.8 CY74FCT240ATSOC Tape and reel 4.8 CY74FCT240ATSOCT Tape and reel 4.8 CY74FCT240ATQCT Tube 8 CY74FCT240TSOC Tape and reel 8 CY74FCT240TSOCT QSOP – Q Tape and reel 8 CY74FCT240TQCT CDIP – D Tube 4.7 CY54FCT240CTDMB CDIP – D Tube 5.1 CY54FCT240ATDMB LCC – L Tube 5.1 CY54FCT240ATLMB QSOP – Q SOIC – SO QSOP – Q SOIC – SO –55°C 55°C to 125°C ORDERABLE PART NUMBER Tube SOIC – SO –40°C to 85°C SPEED (ns) PACKAGE† TA TOP-SIDE MARKING FCT240C FCT240C FCT240A FCT240A FCT240 FCT240 CDIP – D Tube 9 CY54FCT240TDMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OEA OEB D OUTPUT O L L L H L L H L H H X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 logic diagram (positive logic) OEA 1 2 18 DA1 4 16 DA2 6 14 8 12 DA0 DA3 OEB DB0 DB1 DB2 DB3 OA0 OA1 OA2 OA3 19 17 3 15 5 13 7 11 9 OB0 OB1 OB2 OB3 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 recommended operating conditions (see Note 2) CY54FCT240T CY74FCT240T MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current –12 –32 mA IOL TA Low-level output current 48 64 mA 85 °C High-level input voltage 2 Operating free-air temperature –55 2 125 NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. 4 UNIT POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 –40 V V CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT240T TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC = 4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 IOZH VCC = 5.5 V, VCC = 5.25 V, VOUT = 2.7 V VOUT = 2.7 V 10 IOZL VCC = 5.5 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0.5 V –10 IOS‡ VCC = 5.5 V, VCC = 5.25 V, VOUT = 0 V VOUT = 0 V VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VIN ≤ 0.2 V, ∆ICC 0.3 3.3 0.55 IOL = 64 mA 0.3 0.2 0.55 0.2 ±1 ±1 10 –10 –120 –225 –60 –120 ±1 VIN ≥ VCC – 0.2 V VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN ≤ 0.2 V, VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.1 0.5 VCC = 5.5 V, One input switching at 50% duty cycle, Outputs open, OEA = OEB = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.06 V V 5 –60 V V 2 IOH = –15 mA IOL = 48 mA VCC = 4.5 V, VCC = 4.75 V, ICC –1.2 UNIT 3.3 VOL Ioff CY74FCT240T TYP† MAX MIN –225 ±1 0.2 0.1 0.2 0.5 2 2 µA µA µA µA µA mA µA mA mA 0.12 mA/ MHz VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, OEA = OEB = GND, 0.06 0.12 VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. ICCD¶ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER CY54FCT240T TYP† MAX TEST CONDITIONS MIN One bit switching VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V at f1 = 10 MHz at 50% duty cycle V = 3.4 V or GND IN IC# VCC = 5.5 V, Outputs open, Eight bits VIN = 0.2 V or OEA = OEB = GND switching VIN ≥ VCC – 0.2 V at f1 = 2.5 2 5 MHz at 50% duty cycle VIN = 3.4 V or GND 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| UNIT mA One bit switching VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V at f1 = 10 MHz at 50% duty cycle V = 3.4 V or GND IN VCC = 5.25 V, Outputs open, Eight bits VIN = 0.2 V or OEA = OEB = GND switching VIN ≥ VCC – 0.2 V at f1 = 2.5 2 5 MHz at 50% duty cycle VIN = 3.4 V or GND 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| Ci 5 10 5 10 pF Co 9 12 9 12 pF † Typical values are at VCC = 5 V, TA = 25°C. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: = Total supply current IC ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 6 CY74FCT240T TYP† MAX MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O CY54FCT240T CY54FCT240AT CY54FCT240CT MIN MAX MIN MAX MIN MAX 1.5 9 1.5 5.1 1.5 4.7 1.5 9 1.5 5.1 1.5 4.7 1.5 10.5 1.5 6.5 1.5 5.7 1.5 10.5 1.5 6.5 1.5 5.7 1.5 10 1.5 5.9 1.5 4.6 1.5 10 1.5 5.9 1.5 4.6 UNIT ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O POST OFFICE BOX 655303 CY74FCT240T CY74FCT240AT CY74FCT240CT MIN MAX MIN MAX MIN MAX 1.5 8 1.5 4.8 1.5 4.3 1.5 8 1.5 4.8 1.5 4.3 1.5 10 1.5 6.2 1.5 5 1.5 10 1.5 6.2 1.5 5 1.5 9.5 1.5 5.6 1.5 4.5 1.5 9.5 1.5 5.6 1.5 4.5 • DALLAS, TEXAS 75265 UNIT ns ns ns 7 CY54FCT240T, CY74FCT240T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS017A – MAY 1994 – REVISED OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9220301M2A ACTIVE LCCC FK 20 1 TBD 5962-9220301MRA ACTIVE CDIP J 20 1 TBD 5962-9220301MSA ACTIVE CFP W 20 1 TBD 5962-9220302M2A ACTIVE LCCC FK 20 1 TBD 5962-9220302MRA ACTIVE CDIP J 20 1 TBD 5962-9220302MSA ACTIVE CFP W 20 1 TBD 5962-9220303M2A ACTIVE LCCC FK 20 1 TBD 5962-9220303MRA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-9220303MSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type 5962-9221301MRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9221303M2A ACTIVE LCCC FK 20 1 TBD 5962-9221303MRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9221305MRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT240ATDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type POST-PLATE N / A for Pkg Type CY54FCT240ATLMB ACTIVE LCCC FK 20 1 TBD CY54FCT244ATDMB ACTIVE CDIP J 20 1 TBD CY54FCT244ATLMB ACTIVE LCCC FK 20 1 TBD CY54FCT244ATW ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type CY54FCT244CTDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT244CTW ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type CY54FCT244TDMB ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CY54FCT244TLMB ACTIVE LCCC FK 20 1 TBD CY54FCT244TW ACTIVE CFP W 20 1 TBD CY74FCT240ATQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240ATQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240ATQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240ATSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240ATSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240CTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240CTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT240CTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 CY74FCT240CTSOC ACTIVE SOIC DW 20 25 CY74FCT240CTSOCE4 ACTIVE SOIC DW 20 CY74FCT240CTSOCG4 ACTIVE SOIC DW 20 CY74FCT240CTSOCT ACTIVE SOIC DW CY74FCT240CTSOCTE4 ACTIVE SOIC CY74FCT240CTSOCTG4 ACTIVE CY74FCT240TQCT 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240TQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240TQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT240TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240TSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240TSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240TSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT240TSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATPC ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT244ATPCE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT244ATQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244ATSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT244ATSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244CTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244CTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244DTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244DTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244TQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT244TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT244TSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CY74FCT240ATQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT240ATSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT240CTQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT240CTSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT240TQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT240TSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT244ATQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT244ATSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT244CTQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT244CTSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT244DTQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT244DTSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 CY74FCT244TQCT DBQ 20 SITE 41 330 16 6.5 9.0 2.1 8 16 Q1 CY74FCT244TSOCT DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) CY74FCT240ATQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT240ATSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT240CTQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT240CTSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT240TQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT240TSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT244ATQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT244ATSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT244CTQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT244CTSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT244DTQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT244DTSOCT DW 20 SITE 41 346.0 346.0 41.0 CY74FCT244TQCT DBQ 20 SITE 41 346.0 346.0 33.0 CY74FCT244TSOCT DW 20 SITE 41 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated