Datasheet Voltage Detector IC Series Low Voltage Standard CMOS Voltage Detector ICs BU48xx series BU49xx series ●General Description ROHM standard CMOS reset IC series is a high-accuracy, low current consumption reset IC series. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltage range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. ●Features Ultra-low current consumption High accuracy detection, Ultra-low voltage detection Two output types (Nch open drain and CMOS output) Wide operating temperature range Very small and low height package Package SSOP5 and SOP4 is similar to SOT-23-5 and SC-82 respectively (JEDEC) ●Key Specifications Detection voltage: 0.9V to 4.8V 0.1V steps ±1.0% 0.55µA (Typ.) -40°C to +125°C High accuracy detection voltage: Ultra-low current consumption: Operating temperature range: ●Package SSOP5 2.90mm x 2.80mm x 1.25mm SOP4 2.00mm x 2.10mm x 0.95mm VSOF5 1.60mm x 1.60mm x 0.60mm SOT89-3F 4.50mm x 4.15mm x 1.50mm ●Applications All electronic devices that use micro controllers and logic circuits ●Typical Application Circuit VDD1 VDD2 VDD1 RL RST BU48xx CIN CIN CL Micro controller CL (Capacitor for noise filtering) (Capacitor for noise filtering) GND （Open Drain Output type） BU48xx series RST BU49xx Micro controller GND （CMOS Output type） BU49xx series ○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays .www.rohm.com TSZ02201-0R7R0G300060-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/13 TSZ22111・14・001 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Connection Diagram & Pin Descriptions SSOP5 TOP VIEW N.C. SOP4 TOP VIEW N.C. VOUT PIN No. 1 2 3 4 5 Function VOUT VDD GND N.C. Reset output Power supply voltage GND Unconnected terminal N.C. Unconnected terminal VSOF5 TOP VIEW Lot. No 1 VOUT VDD GND Symbol N.C. 3 Marking Lot. No Marking GND 4 PIN No. 1 2 3 4 Symbol VOUT VDD N.C. GND 2 VDD Function Reset output Power supply voltage Unconnected terminal GND SOT89-3F TOP VIEW GND VDD 4 5 Marking Lot.No Marking 1 2 3 VOUT SUB N.C PIN No. 1 2 3 4 5 Lot. No Symbol Function VOUT SUB N.C. VDD GND Reset output Substrate* Unconnected terminal Power supply voltage GND 2 3 1 VOUT VDD GND PIN No. 1 2 3 Symbol VOUT VDD GND Function Reset output Power supply voltage GND *Connect the substrate to VDD www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Ordering Information B U x Part Number x Output Type 48 : Open Drain 49 : CMOS x x x Reset Voltage Value 09 : 0.9V 0.1V step 48 : 4.8V - Package G : SSOP5 F : SOP4 FVE : VSOF5 FP3 : SOT89-3F T R Packaging and forming specification TR : Embossed tape and reel SSOP5 5 <Tape and Reel information> +6 ° 4° −4° 2.9±0.2 1 2 0.2Min. 2.8±0.2 +0.2 1.6 −0.1 4 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.42 −0.04 0.05±0.05 1.1±0.05 1.25Max. +0.05 0.13 −0.03 0.95 0.1 Direction of feed SOP4 ∗ Order quantity needs to be multiple of the minimum quantity. Reel (Unit : mm) VSOF5 0.9±0.05 1 1.6 ± 0.05 0.27±0.15 5 2 0.05 1.2 ± 0.05 3 4 +0.05 0.13 –0.03 4 (MAX 1.28 include BURR) +0.2 1.25 –0.1 +6° 4° –4° 1.3 0.2MAX 1.6±0.05 1.0±0.05 2.0±0.2 2.1±0.2 2 1 3 S 0.13±0.05 0.1 0.6MAX +0.05 0.42 –0.04 0.05±0.05 1.05Max. ) S +0.05 0.32 –0.04 0.5 (Unit : mm) 0.22±0.05 (Unit : mm) SOT89-3F 0.61 1.045±0.155 2.5±0.1 4.15±0.1 4.5±0.1 1 2 3 S 1.6MAX 0.42±0.02 1.50 0.425±0.045 0.505±0.045 (Unit : mm) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Lineup Output Type Open Drain Detection Voltage Marking Part Number CMOS Marking Part Number 4.8V JR BU4848 LH BU4948 4.7V JQ BU4847 LG BU4947 4.6V JP BU4846 LF BU4946 4.5V JN BU4845 LE BU4945 4.4V JM BU4844 LD BU4944 4.3V JL BU4843 LC BU4943 4.2V JK BU4842 LB BU4942 4.1V JJ BU4841 LA BU4941 4.0V JH BU4840 KZ BU4940 3.9V JG BU4839 KY BU4939 3.8V JF BU4838 KX BU4938 3.7V JE BU4837 KW BU4937 3.6V JD BU4836 KV BU4936 3.5V JC BU4835 KU BU4935 3.4V JB BU4834 KT BU4934 3.3V JA BU4833 KS BU4933 3.2V HZ BU4832 KR BU4932 3.1V HY BU4831 KQ BU4931 3.0V HX BU4830 KP BU4930 2.9V HW BU4829 KN BU4929 2.8V HV BU4828 KM BU4928 2.7V HU BU4827 KL BU4927 2.6V HT BU4826 KK BU4926 2.5V HS BU4825 KJ BU4925 2.4V HR BU4824 KH BU4924 2.3V HQ BU4823 KG BU4923 2.2V HP BU4822 KF BU4922 2.1V HN BU4821 KE BU4921 2.0V HM BU4820 KD BU4920 1.9V HL BU4819 KC BU4919 1.8V HK BU4818 KB BU4918 1.7V HJ BU4817 KA BU4917 1.6V HH BU4816 JZ BU4916 1.5V HG BU4815 JY BU4915 1.4V HF BU4814 JX BU4914 1.3V HE BU4813 JW BU4913 1.2V HD BU4812 JV BU4912 1.1V HC BU4811 JU BU4911 1.0V HB BU4810 JT BU4910 0.9V HA BU4809 JS BU4909 www.rohm.com © 2013 ROHM Co., Ltd. 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TSZ22111・15・001 4/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Absolute Maximum Ratings Parameter Symbol Limits Unit Power Supply Voltage VDD -0.3 to +7 V Nch Open Drain Output GND-0.3 to +7 Output Voltage VOUT V CMOS Output GND-0.3 to VDD+0.3 Output Current Io 70 mA *1*4 SSOP5 540 Power *2*4 SOP4 Pd 400 mW Dissipation *3*4 VSOF5 210 Operation Temperature Range Topt -40 to +125 °C Ambient Storage Temperature Tstg -55 to +125 ℃ *1 When used at temperatures higher than Ta=25℃, the power is reduced by 5.4mW per 1℃ above 25℃. *2 When used at temperatures higher than Ta=25℃, the power is reduced by 4.0mW per 1℃ above 25℃. *3 When used at temperatures higher than Ta=25℃, the power is reduced by 2.1mW per 1℃ above 25℃. *4 When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted. ●Electrical Characteristics Parameter Symbol Condition VDD=H L , Ta=25℃,RL=470kΩ Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET=1.8V VDET=2.5V Detection Voltage Detection Voltage Temperature Coefficient Hysteresis Voltage VDET=3.0V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET=3.3V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET=4.2V Ta=+25°C Ta=-40°C to 85°C Ta=85°C to 125°C VDET VDET/∆T Ta=-40℃ to 125℃ ∆VDET *1 VDD=L H L Ta=-40℃ to 125℃ RL=470kΩ VDET≤1.0V VDET≥1.1V Min. VDET(T) ×0.99 1.782 1.741 1.731 2.475 2.418 2.404 2.970 2.901 2.885 3.267 3.191 3.173 4.158 4.061 4.039 Limits Typ. Unit 1.8 2.5 3.0 3.3 4.2 - Max. VDET(T) ×1.01 1.818 1.860 1.870 2.525 2.584 2.597 3.030 3.100 3.117 3.333 3.410 3.428 4.242 4.341 4.364 - ±30 - ppm/℃ VDET ×0.03 VDET ×0.03 VDET ×0.05 VDET ×0.05 VDET ×0.08 VDET ×0.07 V VDET(T) V *1 Guaranteed by design.(Outgoing inspection is not done on all products.) VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series Unless Otherwise Specified Ta=-25 to 125℃ Parameter Symbol Condition VDET=0.9-1.3V VDET=1.4-2.1V VDET=2.2-2.7V Circuit Current when ON IDD1 VDD=VDET-0.2V VDET=2.8-3.3V VDET=3.4-4.2V VDET=4.3-4.8V VDET=0.9-1.3V VDET=1.4-2.1V VDET=2.2-2.7V Circuit Current when OFF VDD=VDET+2.0V IDD2 VDET=2.8-3.3V VDET=3.4-4.2V VDET=4.3-4.8V VOL≤0.4V, Ta=25 to 125℃, RL=470kΩ Operating Voltage Range VOPL VOL≤0.4V, Ta=-40 to 25℃, RL=470kΩ VDD=0.85V, ISINK = 20 µA ‘Low’ Output Voltage (Nch) VDD=1.5V, ISINK = 1 mA, VDET=1.7-4.8V VOL VDD=2.4V, ISINK = 4 mA, VDET=2.7-4.8V VDD=4.8V,ISOURCE=1.7mA, VDET=0.9V to 3.9V ‘High’ Output Voltage (Pch) VOH (only BU49xx) VDD=6.0V,ISOURCE=2.0mA, VDET=4.0V to 4.8V VDD=VDS=7V Output Leak Current when Ta=-40℃ to 85℃ OFF Ileak VDD=VDS=7V (only BU48xx) Ta=85℃ to 125℃ * This product is not designed for protection against radioactive rays. VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Min. 0.70 0.90 - Limit Typ. 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 - Max. 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.05 0.5 0.5 VDD-0.5 - - VDD-0.5 - - - 0 0.1 - 0 1 Unit µA µA V V V V µA ●Block Diagrams VDD VDD VOUT VOUT Vref Vref GND GND Fig.1 BU48xx Series www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Fig.2 6/13 BU49xx Series TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Typical Performance Curves "LOW" OUTPUT CURRENT ： IOL [mA] CIRCUIT CURRENT ： IDD [µA] 0.7 【BU4816】 【BU4816F】 【BU4916】 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 5 【BU4816】 【BU4816F】 【BU4916】 4 3 2 VDD =1.2V 1 0 0.0 VDD SUPPLY VOLTAGE ：VDD [V] 0.5 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current Fig.4 “LOW” Output Current 25 7 20 BU4816F】 【【BU4816】 OUTPUT VOLTAGE： VOUT [V] ： 【BU4916】 【BU4916F】 "HIGH" OUTPUT CURRENT I OH [mA] 1.0 VDD =6.0V 15 VDD =4.8V 10 5 6 【BU4916】 5 4 3 2 1 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD SUPPLY VOLTAGE ：VDD [V] Fig.5 “High” Output Current Fig.6 I/O Characteristics www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 7 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Typical Performance Curves – continued 2.0 【BU4816】 【BU4816F】 【BU4916】 DETECTION VOLTAGE： VDET[V] OUTPUT VOLTAGE ： VOUT [V] 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 Low to high(VDET+∆VDET) 1.5 High to low(VDET) 【BU4816】 BU4816F】 【【BU4916】 1.0 -40 2.5 CIRCUIT CURRENT WHEN OFF ： IDD2 [µA] CIRCUIT CURRENT WHEN ON ： IDD1 [µA] 0.5 【BU4816】 【BU4816F】 【BU4916】 0.4 0.3 0.2 0.1 40 80 80 120 Fig.8 Detecting Voltage Release Voltage Fig.7 Operating Limit Voltage 0 40 TEMPERATURE ： Ta[℃] VDD SUPPLY VOLTAGE ： VDD [V] 0.0 -40 0 120 1.0 【BU4816】 【BU4816F】 【BU4916】 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.10 Circuit Current when OFF Fig.9 Circuit Current when ON www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Typical Performance Curves – continued MINIMUM OPERATING VOLTAGE ： V OPL [V] 1.0 【BU4816】 【BU4816F】 【BU4916】 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 TEMPERATURE ： Ta[℃] Fig.11 Operating Limit Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Application Information Explanation of Operation For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU48xx series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD R1 R1 RL Vref Q2 Vref RESET R2 R2 VOUT VOUT Q1 R3 R3 RESET Q1 GND GND Fig.12 (BU48xx type internal block diagram) Fig.13 (BU49xx type internal block diagram) Reference Data Examples of Output rising value(tPLH)and Output falling value(tPHL) Part Number tPLH[µs] BU4845 23.3 BU4945 3.5 tPHL[µs] 275.9 354.3 VDD=4.3V 5.1V VDD=5.1V 4.3V * This data is for reference only. This figure will vary with the application, so please confirm actual operation conditions before use. Timing Waveforms Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.12 and 13). ①When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted VDD when the rise time of VDD is faster than tPHL. VDET+ΔVDET ⑤ ②When VDD is greater than VOPL but less than the reset release VDET voltage (VDET + VDET), output (VOUT) voltages will switch to L. VOPL ③If VDD exceeds the reset release voltage (VDET + VDET), then 0V VOUT switches from L to H (with a delay of tPLH). ④If VDD drops below the detection voltage (VDET) when the VOUT power supply is powered down or when there is a power VOH supply fluctuation, VOUT switches to L (with a delay of tPHL). tPLH tPHL tPLH ⑤The potential deference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The tPHL VOL system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, ① ③ ④ ② preventing malfunctions due to noise. Fig.14 Timing Waveforms www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Circuit Applications 1) Examples of a common power supply detection reset circuit VDD1 VDD2 RL RST BU48xx Micro controller CIN CL (Capacitor for noise filtering) GND Application examples of BU48xx series (Open Drain output type) and BU49xx series (CMOS output type) are shown below. CASE1:The power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (V DD1). Use the Open Drain Output Type (BU48xx series). Attach a load resistance (RL) between the output and VDD2. (As shown Fig.15) Fig.15 Open Drain Output type VDD1 Micro RST controller BU49xx CASE2:The power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BU43xx series) or Open Drain Output Type (BU48xx series). Attach a load resistance (RL) between the output and VDD1. (As shown Fig.16) When a capacitance CL for noise filtering for setting the output delay time is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). CIN CL (Capacitor for noise filtering) GND Fig.16 CMOS Output type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL BU48Exxx NO.1 BU48xx NO.2 RST microcontroller CT CT GND Fig.17 To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BU48xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series 3) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC is connected through resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 IDD R2 I1 R1 Through Current VDD BU48xx BU49xx CIN VOUT CL GND VDD VDET 0 Fig.18 A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. Consider the use of BU48xx when the power supply input it with resistor dividers. VDD - IDD Peak Current Ta=25°C Tem p - ID D (B U 42xx) V D D 3V V D D 6V V D D 7V V D D 4V BU49xx,BU43xx 10 2.5 BU48xx,BU42xx IDD peak Current[mA] BD52xx BD53xx IDD-peak[mA] 1 0.1 0.01 2.0 1.5 1.0 0.5 0.0 0.001 3 4 5 6 7 8 9 10 -50 -30 -10 10 30 50 Tem p 70 90 110 130 VDD[V] Fig.19 Current Consumption vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 BU48xx series Datasheet BU49xx series ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Recommended operating conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 4) Bypass Capacitor for Noise Rejection To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 5) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 6) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7) The VDD line impedance might cause oscillation because of the detection current. 8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD) condition. 10) External parameters The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The recommended value of RL Resistor is over 10kΩ to 1MΩ for VDET=1.5V to 4.8V, and over 100kΩ to 1MΩ for VDET=0.9V to 1.4V. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 11) Power on reset operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 12) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 13) Rush current When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 14) CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by t × RCT × CCT changes. . www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0R7R0G300060-1-2 22.May.2013 Rev.008 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.