Datasheet PFC Direct current resonance type White LED Driver for Large LCD BD94121F General Description Key Specifications BD94121F is a current resonance type LED Driver with frequency-controlled LED current. It can connect to PFC directly and can use half-bridge structure reducing the number of external components. It incorporates some protection functions against fault conditions such as Over-Voltage Protection, LED Short Detection (IS High Detection) and LED Open Detection (IS Low Detection). Package W(Typ) x D(Typ) x H(Max) 11.20mm x 7.80mm x 2.01mm Pin pitch 1.27mm SOP18 Features Operating Power Supply Voltage Range: 9.0V to 18.0V Minimum Oscillator Frequency: 67kHz (RRT=27kΩ,RADJ=44kΩ,VFB=3.2V) Operating Current: 2.3mA (Typ) Operating Temperature Range: -40°C to +85°C 20V High Rating Process 1 Channel Push-pull Control Current and Voltage Feedback by Driving Frequency Adjustable Soft Start Adjustable Timer Latch Under-Voltage Detection for IC’s Power Line Output Over-Voltage Protection Output Error Signal from FAIL Terminal Shift to Save Mode by STB Terminal Burst Control by External PWM Signal Analog Dimming by External DC Signal Conversion Function from Pulse to DC Applications TV, Computer Display, LCD Backlighting. Figure. 1 SOP18 Typical Application Circuit < Primary Side > VCC VCC GND GND PDIM PDIM STB ON/OFF PWM PWMIN ERR FAIL PVIN GND T1 CSS CSDON PDIM RADJ RRT CFBVS RFBVS CFBIS RFBIS CCP RS < Secondary Side > Figure. 2 Typical Application Circuit(s) 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Contents General Description ....................................................................................................................................................1 Features .......................................................................................................................................................................1 Applications ................................................................................................................................................................1 Key Specifications ......................................................................................................................................................1 Package .......................................................................................................................................................................1 Typical Application Circuit .........................................................................................................................................1 Absolute Maximum Ratings.......................................................................................................................................3 Recommended Operating Conditions ......................................................................................................................3 External Components Recommended Range ..........................................................................................................3 Pin Configuration ........................................................................................................................................................3 Physical Dimension and Marking Diagram ..............................................................................................................3 Electrical Characteristics ...........................................................................................................................................4 Pin Description............................................................................................................................................................6 I/O Equivalent Circuits................................................................................................................................................7 Block Diagram .............................................................................................................................................................8 Typical Performance Curves .....................................................................................................................................9 Pin Function Description .........................................................................................................................................10 Detection Condition List of the Protection Functions ..........................................................................................15 Behavior List of the Protect Function ....................................................................................................................15 Application Example ................................................................................................................................................16 Timing Chart ..............................................................................................................................................................17 Operational Notes .....................................................................................................................................................20 Ordering Information ................................................................................................................................................22 Marking Diagrams .....................................................................................................................................................22 Physical Dimension, Tape and Reel Information ...................................................................................................23 Revision History .......................................................................................................................................................24 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit VCC 20 V VSTB,VPWM2DC,VN2,VN1 20 V VRT,VFB,VIS,VVS,VPWMCMP, VCP,VPWMIN,VADIM,VSS, VFAIL,VCOMPSD 5.5 V Supply Voltage STB, PWM2DC, N2, N1 Terminal Voltage RT, FB, IS, VS, PWMCMP, CP, PWMIN, ADIM, SS, FAIL, COMPSD Terminal Voltage Power Dissipation (Note 1) W -40 to +85 °C Tjmax 150 °C Tstg -55 to +150 °C Pd Operating Temperature Range 0.69 Topr Junction Temperature Storage Temperature Range (Note 1) Derating in done 5.5 mW/°C for operating above Ta≥25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Power Supply Voltage PWMIN Input Frequency Range Oscillation Frequency PWM2DC Input Voltage Range ADIM Input Voltage Range ADIM Range with Linearity IS Symbol Range Unit VCC 9.0 to 18.0 V fPWMIN 60 to 500 Hz fOUT 30 to 300 kHz fPWM2DC 0.09 to 30 kHz VADIM 0 to 5 V VADIMLIN 0.5 to 2.1 V Symbol Range Unit RRT 20 to 200 kΩ External Components Recommended Range (Ta= -40°C to +85°C) Parameter RT Connection Resistance CP Connection Capacitance 0.01 to 2.2 (Note 2) µF CADIM 0.22 to 10 (Note 2) µF CSS 0.01 to 0.1 (Note 2) µF CCP ADIM Connection Capacitance SS Connection Capacitance (Note 2) Please set connection capacitance above Min value of Recommended Range according to temperature characteristic and DC bias characteristic. Pin Configuration Physical Dimension and Marking Diagram (TOP VIEW) Product Name PWM_IN_10 ADIM_11 SS_12 FAIL_13 COMPSD_14 PWM2DC_15 PGND_16 N2_17 N1_18 (Max 11.55 (include.BURR)) BD94121F 9_CP 8_PWMCMP 7_VS 6_IS 5_FB 4_RT 3_GND 2_STB 1_VCC BD94121F Figure. 3 Pin Configuration Lot No. (UNIT : mm) PKG : SOP18 Drawing No. : EX115-5001 SOP18(Unit:mm) Figure. 4 Physical Dimension and Marking Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V) Parameter Symbol Limit Min Typ Max Unit Conditions 【Whole Device】 Circuit Current ICC1 － 2.3 5.0 mA Circuit Current at Stand-by ICC2 － 0 20 µA fOUT=60kHz, VPWMCOMP=0V VSTB=0V STB Pin High Voltage VSTH 2.0 － VCC V System ON STB Pin Low Voltage VSTL -0.3 － +0.8 V System OFF 【VCC UVLO Block】 VCC Operation Voltage VVCCUVP 7.5 8.0 8.5 V VCC UVLO Hysteresis ⊿VVCCUVP 0.37 0.50 0.63 V VRT 1.05 1.50 1.95 V PWMIN Pin High Voltage VPWMINH 1.8 - 5.0 V PWMIN Pin Low Voltage VPWMINL -0.3 - +0.8 V ISS 1.5 2.0 2.5 µA VSSEND 2.30 2.50 2.70 V VSDON 1.90 2.00 2.10 V IS Threshold Voltage 1 VIS1 0.466 0.477 0.488 V IS Threshold Voltage 2 VIS2 0.239 0.250 0.261 V IS Threshold Voltage 3 VIS3 0.102 0.114 0.126 V IS Threshold Voltage 4 VVS 1.212 1.250 1.288 V IS Source Current 1 IIS1 － － 0.9 µA VPWMIN=2.5V IS Source Current 2 IIS2 40 50 60 µA VPWMIN=0V, VIS=0.8V VS Source Voltage IVS － － 0.9 µA IS COMP Detection Voltage 1 VISCOMP1 0.020 0.050 0.080 V IS COMP Detection Voltage 2 VISCOMP2 0.90 1.00 1.10 V 【STB Block】 【OSC Block】 RT Terminal voltage 【PWMIN Block】 【Soft Start Block】 Setting Current for Soft Start Timer and COMPSD Timer Soft Start Ended Voltage Setting Voltage for COMPSD Timer 【Feed Back Block】 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/24 VADIM=2.1V, VPWM2DC=12V VADIM=1.1V, VPWM2DC=12V VADIM=0.5V, VPWM2DC=12V IS sweep down VADIM=0.4V IS sweep up TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Electrical Characteristics – continued (Unless otherwise specified Ta=25°C, VCC= 12V) Parameter Symbol Limit Min Typ Min Unit Conditions 【Output Block】 N1 Output Sink Resistance RN1SI 1.5 3.0 6.0 Ω N1Output Source Resistance RN1SO 4.5 9.0 18.0 Ω N2 Output Sink Resistance RN2SI 1.5 3.0 6.0 Ω N2 Output Source Resistance RN2SO 4.5 9.0 18.0 Ω MAX DUTY 43.0 45.0 47.0 % tOFF 100 200 400 ns fOUTMIN 60.3 67.0 73.7 kHz Setting Voltage for CP Time VCP 1.90 2.00 2.10 V Setting Current for CP Time 【ADIM Block】 ICP 0.85 1.00 1.15 µA ADIM Pin Inflow Current 1 IADIM1 -5 0 +5 µA ADIM Pin Inflow Current 2 IADIM2 19 28 37 µA IPWM2DC 4 6 8 µA VPWM2DCH 1.8 - 5.0 V VPWM2DCL -0.3 - +0.8 V VPWM2DCZ 7.5 8.0 8.5 V VCOMPSD 3.88 4.00 4.12 V RFAIL - 100 200 Ω MAX DUTY N1-N2,N2-N1Dead Time Output Frequency (minimum frequency setting) 【Timer Block】 PWM2DC Pin Inflow Current PWM2DC Pin High Voltage PWM2DC Pin Low Voltage PWM2DC Pin Selected Voltage to High Impedance fOUT=60kHz RRT=27kΩ,RADJ=44kΩ, VFB=3.2V VADIM=2.2V, VPWM2DC=12V VADIM=5V, VPWM2DC=12V VPWM2DC=3V PWM2DC=sweep up 【COMPSD Block】 COMPSD Detection Voltage 【FAIL Block】 FAIL Pin ON-Resistance www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Pin Description Pin No. Pin Name IN/OUT Function Rating [V] 1 VCC IN -0.3 to +20 2 STB IN 3 GND IN 4 RT OUT 5 FB OUT 6 IS IN Power Supply Pin for IC (Built-In UVLO Function) Power ON/OFF Control Pin for IC Power OFF when STB=L and Power ON when STB=H. Ground Pin for Internal Signal in IC Drive Frequency Setting Pin Basic Frequency is set by the resistor between RT and GND and Drive Frequency Modulation Range is set by the resistor between RT and FB. Error Amplifier Output pin for LED Current feedback and LED Voltage feedback Error Amplifier Input pin for LED Current feedback 7 VS IN 8 PWMCMP IN 9 CP OUT 10 PWMIN IN 11 ADIM IN 12 SS OUT 13 FAIL OUT 14 COMPSD IN 15 PWM2DC IN 16 PGND IN 17 N2 18 N1 -0.3 to +20 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 Error Amplifier Input pin for LED Open Voltage feedback PWM Comparator Input Pin which controls PWM operation during brightness adjustment. N1 and N2 output stop when PWMCMP=L, and they output Max Duty when PWMCMP=H Timer Latch Setting Pin In abnormal case, 1µA (Typ) will be charged to the capacitor connected to CP, and IC becomes latch status after output operation stops at CP>2V(Typ) PWM Signal Input Pin for burst brightness adjustment -0.3 to +5.5 DC Signal Input Pin for analog dimming Soft Start timer and COMPSD timer Setting Pin During start-up, 2µA (Typ) will be charged to connected capacitor. At SS>2.0V(typ), COMPSD can start to detect. At SS>2.5V (typ), CP can accept charge operation. Error Indication Signal Output Pin Normal : L, Error : Open Abnormal Over Voltage Detection Pin When detecting abnormality, output operation stops and IC becomes latch status after 2 clocks. Pulse to DC converting pin Pulse Signal is translated to flat dc level by 100kΩ resistor in IC and the capacitor connected to ADIM. Power Ground for external MOSFET drive -0.3 to +5.5 OUT Output pin for external FET drive circuit (Channel N2) -0.3 to +20 OUT Output pin for external FET drive circuit (Channel N1) -0.3 to +20 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/24 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +5.5 -0.3 to +20 - TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F I/O Equivalent Circuits STB RT VCC FB REF REF REF VCC 160KΩ STB 10KΩ 300KΩ 20Ω FB RT 130KΩ 50KΩ GND GND GND GND GND GND GND IS VS GND PWMCMP REF REF REF GND GND REF REF REF REF REF VCC 100KΩ 1KΩ PWMCMP 20Ω VS 100kΩ IS 10KΩ 10KΩ GND GND GND GND GND GND GND GND GND GND CP PWMIN GND GND ADIM REF 2.2V VCC REF VCC 100KΩ PWMIN CP 100KΩ ADIM GND GND REF 100KΩ 350Ω GND GND GND GND SS GND GND FAIL GND GND GND GND COMPSD REF REF REF VCC 50Ω 350Ω FAIL SS GND GND GND GND GND PWM2DC REF VCC GND GND GND VCC VCC N2 100KΩ N1 90KΩ GND PGND PGND GND N1 VCC 400KΩ 100KΩ GND GND N2 REF PWM2DC 100KΩ COMPSD PGND 90KΩ PGND PGND PGND Figure. 5 I/O equivalent circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Block Diagram VCC VCC RT PWMIN UVLO BLOCK OSC BLOCK PWM STB STB BLOCK SYSTEM BLOCK ON / OFF CT VCC FB IS N1 Feedback VS BLOCK LOGIC BLOCK CT SS DR V BLOCK PWM N2 BLOCK PWMCMP ADIM PWM2DC Analog Dimming GND PGND PROTECT BLOCK COMPSD CP FAIL Figure. 6 Block Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Typical Performance Curves 5 70 VCC=12V RRT=100kΩ RADJ=none 68 4 fOUT[kHz] Frequency: f:OUT Output [kHz] Frequency Output : ICC[mA] Current Operating [mA] : ICC1 Current Operating Ta=25°C 3 2 1 66 64 62 60 58 56 54 52 50 0 8 10 12 14 Supply Voltage Supply Voltage: V: CC Vcc[V] [V] 16 -40 18 0 20 40 60 80 Temperature : Ta [°C] Temperature : Temp. [℃] 100 Figure 8. Output Frequency vs Temperature Figure 7. Operating Current vs Power Supply Voltage 1.0 50 Ta=25°C VCC=12V VCC=12V RRT=100kΩ VPWMCMP=OPEN 0.8 : VIS[V] Voltage: VIS [V] Voltage ISIS 48 [%] DUTY MAX : [%] Max Duty -20 46 44 0.6 0.4 42 0.2 40 0.0 -40 -20 0 20 40 60 Temperature : Ta [°C] Temperature : Temp [deg] 80 100 Figure 10. IS Voltage vs ADIM Voltage Figure 9. MAX DUTY vs Temperature www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ADIMVoltage Voltage::VVADIM [V] ADIM ADIM [V] 9/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Pin Function Description PIN.1 VCC This is power supply pin for the IC. Normal operation range (Typ) is from 9V to 18V. Please place ceramic capacitor bigger than 0.1µF as bypass capacitor between VCC and GND. It is for noise elimination. PIN.2 STB This PIN is for setting of ON/OFF. It is possible to use as reset when shutting down. Please set the STB terminal voltage below VCC voltage. In addition, please set below 4V if the voltage is applied earlier than VCC. Depending on input voltage to STB pin, the status of IC might be switched (ON/OFF). Please avoid using between the two status (0.8V to 2.0V) PIN.3 GND This is signal system GND for IC inside. Please make it independent from PGND as much as possible (We recommend this because it has less influence with switching noise which comes from short circuit of PGND and GND at connector close to GND pin. Vin GND_PIN IC PGND N1 N2 GND Figure. 11 PIN.4 RT Set up the charge/discharge current by frequency of IC inside. By changing the resistance value of resistor between RT pin and GND, it is possible to set up basic drive frequency as following formula; Basic frequency means output N1, N2 frequency which is determined only with resistor between RT pin and GND. f OUT 6000 [kHz] RRT [k] ( f OUT 200 kHz) f OUT 6673 [kHz] RRT [k] 3.336 ( f OUT 200 kHz) 1,000 BD94121F Error Amp Out put Frequency : f OUT [ k Hz] OSC 100 RT 10 RRT FB IS VS CFBIS RFBIS CFBVS RFBVS 1 10 100 1,000 RT Resistance : RRT [kΩ] Figure. 13 RRT Resistor connection method Figure. 12 RT Resistance vs Output Frequency There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly verify it with actual application. In addition, frequency may change upon resistor RADJ which is placed between RT and FB pins www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F PIN.5 FB This is output pin for LED current feedback (IS pin) error amplifier and open LED voltage feedback (VS pin) error amplifier. The capacitance between FB and IS (1500pF to 0.01µF) also determines start up time of LED current necessary during phase compensation and brightness adjustment. Capacitance between FB and VS (1500pF to 0.01µF) is for phase compensation of error amplifier. BD94121F Error Amp OSC FB RT RADJ RRT Figure. 14 RRT and RADJ Resistor connection method IS VS CFBIS RFBIS CFBVS RFBVS Moduration width of Output Frequency Modulation width of Output Frequency： Δf OUT [kHz] 150 As shown by left graph, by changing resistor RADJ between FB and RT, it is possible to determine the modulation width of frequency. 125 108.1 100 Modulation width of frequency determined by the resistor between FB and RT resistor (Theoretical formula : Example) When RADJ=100kΩ , Δ fOUT=108.1kHz 75 50 Figure. xx 25 0 10 100 1000 RADJ Resistance ADJ [kΩ] Figure. 13 出力周波数変動幅 対: RR ADJ 抵抗値 特性 Figure. 15 Modulation width of Output Frequency vs RADJ Resistance Output Frequency vs FB Voltage 200 180 167.8 Output Frequency : fOUT [kHz] 160 140 120 Modulation width of frequency determined by the resistor between FB and RT resistor (Theoretical formula : Example) When RADJ=100kΩ , Δ fOUT=108.1kHz 100 80 60 59.7 40 20 0.5 3.2 0 0 1 2 3 4 5 6 FB Voltage : VFB [V] Figure. 16 Output Frequency vs FB Voltage The basic drive frequency is determined by resistor R RT which is connected from RT pin to GND. The basic frequency is the one at VFB=1.5V, and operation frequency range will be fixed with frequency modulation width that is determined by RADJ under this condition. When RRT=51kΩ, fOUT=127.7kHz becomes to basic drive frequency. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F PIN.6 IS This is input pin of LED current feedback (IS pin) error amplifier. Please set up as normal voltage (ADIM/4.4)V (Typ). When IS pin voltage becomes less than (ADIM/8.8)V (Typ) or higher than 1.0V, the output will be stopped and latched. 50uA FB R2 R1 IS _ 12kΩ + ADIM Error Amp Gain 1/4.4 Figure. 17 IS Block Diagram 50µA (Typ) current flows from IS pin to external resistor during OFF period of burst brightness adjustment. Considering Min value of IS source current during burst brightness adjustment, please set that total resistance from IS Pin to GND is from 8kΩ to 22kΩ. When R2 is 12kΩ in above diagram, please set 8kΩ < R1 + R2 < 22kΩ. PIN.7 VS This is input pin of Open LED voltage feedback (VS pin) error amplifier. It has to be 1.25V during LED is open. When LED is ON, it will be 0.5V to 1.0V. When VS pin becomes over 1.25V, protection circuit will start operation, and if it becomes more than CP timer set up time (Timer Latch), it will shut down. Connector 8 7 6 5 FB R1 VS R2 R3 Error Amp _ + 1. 25 V Figure. 18 VS Block Diagram Please set C1, C2, R1, R2, and R3 value to input 1.25V to VS pin during LED bar’s connector disconnects. PIN.8 PWMCMP PWMCOMP pin voltage is fixed by DUTY of drive output N1, N2 in comparison with a saw wave of IC inside. This pin has 100µA sink/source current capability and when external capacitor is connected between PWMCMP and GND, IC will operate PWM at brightness start up stage. When N1 and N2 only drive at MaxDuty, please set PWMCMP=open. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F PIN.9 CP This pin sets up the time from the point of abnormal detection till shut down (Timer Latch). Having 1µA constant current charges at external capacitor connected to CP pin, it will shut down when it becomes over 2.0V. During soft start, there is no charge to CP external capacitor even fulfilling CP pin charge condition (timer latch). External capacitor is set around 0.01µF to 2.2µF). TCP CCP VCP CCP 2.0 2.0 10 6 CCP I CP 1.0 10 6 [sec] Timer Latch Time TCP 1uA 100 CCP 2.0V Timer Start Timer Latch Time : TCP[sec] 10 Timer latch Shut-down 1 0.1 0.01 0.001 0.001 0.01 Figure. 19 CP Block Diagram 0.1 1 10 CP Capacitance CCP[µF] Figure. 20 Timer Latch Time vs CP Capacitance PIN.10 PWMIN By inputting PWM pulse signal at PWMIN pin, it is possible to adjust burst brightness. (High level: over 1.8V, Low level: below 0.8V). condition LED condition PWMIN : 1.8V to 5.0V Turn On PWMIN : -0.3V to 0.8V Turn Off PIN.11 ADIM ADIM pin is Input and Output Pin of DC signal for analog dimming. According to ADIM Input level, each pin’s function is changed as the followings. Pulse-DC translation Circuit is shown in Figure.20. PWM2DCinput level -0.3V<PWM2DC<6.5V 8.5V<PWM2DC<20V PWM2DC function ADIM function Pulse Signal Input for Analog Dimming Mask PWM2DC’s Function DC Signal Output for Analog Dimming DC Signal Input for Analog Dimming Needed Signal from External DUTY Signal for Analog Dimming DC Signal Output for Analog Dimming The voltage that ADIM voltage multiplies by (1/4.4) becomes IS threshold voltage and it has linear characteristic. But, ADIM voltage becomes under 0.44V(Typ), IS threshold voltage is clamped at 0.44V/0.44=0.1V(Typ). And ADIM voltage becomes over 2.2V(Typ), IS threshold voltage is clamped at 2.2V/0.44=0.5V(Typ). When you want to use linear characteristic range, please set ADIM voltage from 0.5V to 2.1V. And pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor connected to ADIM terminal (This means pulse to DC signal transfer circuit.). At this time, ADIM ripple level is changed by ADIM’s capacitance, therefore please set suitable capacitance according to set specification. IS PWM2DC IS High Det 1.0V Pulse signal 8.0V/7.0V 0.5V 2.2V Gain=1/4.4 ADIM 0.25V RADIM 100k CADIM 0.1V 0.05V IS Low Det ADIM 0.44V 2.2V Figure. 22 Pulse to DC transfer block diagram Figure. 21 IS threshold voltage vs ADIM voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F PIN.12 SS This is soft start time and SDON time set up pin. Constant current 2.0µA(Typ) is charged to external capacitor (0.01µF to 0.1µF). When SS terminal voltage is higher than 2.0V, COMPSD can be detected. When SS terminal voltage is less than 2.0V, latch protection circuit will not operate. When SS terminal voltage is higher than 2.5V, soft start completes. When soft start is under operation (SS pin voltage is less than 2.5V), timer latch protection circuit by CP charge will not operate. 2uA Finish Css ss SoftStart 2.5V POWER ON Start Where: CSS is the capacitance of SS pin COMPSD 2.0V Figure. 23 SS Block Diagram VSSEND C SS 2.5 1.25 10 6 C SS [sec] I SS 2.0 10 6 V C 2.0 TSDON C SS SDON SS 1.0 10 6 C SS [sec] 6 I SS 2.0 10 TSSEND C SS PIN.13 FAIL This is fail signal output pin of IC. At normal situation, it outputs GND Level and it becomes Open after timer latch in case any abnormality is detected. The pull up voltage during Open must be set less than rated voltage 5.5V of FAIL pin. Please connect about 0.1uF capacitor for noise reduction to FAIL pin. Condition FAILOutput Normal operation GND Level Abnormal operation Open FAIL Figure. 24 FAIL Block Diagram PIN.14 COMPSD This is input pin for over voltage protection circuit comparator. The detection voltage of comparator is 4.0V(Typ),and will start to count 2CLK over voltage detection. After 2CLK count, it will shut down by timer latch. PIN.15 PWM2DC Pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor connected to ADIM terminal (This means pulse to DC signal transfer circuit.). When the voltage that is higher than 8V(Typ) forces to PWM2DC terminal, buffer output in the IC becomes high impedance, and IC function shifts to direct DC input mode to ADIM. (Refer to the diagram of PIN11 ADIM.) PIN.16 PGND This is Power GND pin for output pin N1, N2 at driver part. Please make it independent from GND (Pin 3) pin on inverter PCB. This pin is not connected to GND pin in IC inside. PIN.17 N2 This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about 10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ. PIN.18 N1 This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about 10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Detection Condition List of the Protection Functions (Typ Condition) Protect Function Detection Pin Detect Condition Detection Condition (ADIM<0.44V) IS < 0.05V (0.44V<ADIM<2.2V) IS < ADIM/8.8 (ADIM>2.2V) IS < 0.25V Release Condition Timer Operation Protection Type SS>2.0V (ADIM<0.44V) IS > 0.05V (0.44V<ADIM<2.2V) IS > ADIM/8.8 (ADIM>2.2V) IS > 0.25V 2CLK Latch off SS LED OPEN IS LED SHORT IS IS > 1.0V SS>2.0V IS < 1.0V 2CLK Latch off OVP VS VS > 1.25V SS>2.5V VS < 1.25V CP Latch off VCC UVLO VCC VCC < 7.5V - VCC > 8.0V - COMPSD COMPSD COMPSD > 4.0V SS>2.0V COMPSD < 3.8V 2CLK Restart by release Latch off To reset the latch type protection, please set STB logic to ‘L’ once. Otherwise the detection of VCCUVLO is required. The count number in the list is calculated with double of output frequency. Behavior List of the Protect Function Protect Function Operation of the Protect Function N1,N2 Output SS pin FAIL pin LED OPEN Stop after latch Low after latch High after latch LED SHORT Stop after latch Low after latch High after latch OVP Stop after latch Low after latch High after latch VCC UVLO Stop immediately Low Immediately High Immediately COMPSD Stop after latch Low after latch High after latch www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Application Example PWMIN FAIL PWM ERR < Secondary Side > RFBIS RRT CFBIS RFBVS PDIM ON/OFF STB T1 PDIM PDIM GND VCC GND VCC PVIN GND RADJ CFBVS CSS CSDON < Primary Side > CCP RS Introduce an application example with BD94121F Figure. 25 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Application Example 16/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Timing Chart When it Detects Quick Detection Type Error STB 2.0V 2.5V 2.0V SS 2.5V 2.0V 2.5V 2.0V FB 1.0V 1 ADIM/4.4 2 ADIM/4.4 IS ADIM/8.8 1.25V 1.25V VS 3 COMPSD CP 4.0V 2.0V FAIL Figure. 26 Timing Chart 1 [The explanation of quick abnormal detection] Due to the timing of ① to ③ in the above chart, the IC detects malfunction and starts the output-mute latch without CP Charge . For ① to ③, the malfunction is detected according to the conditions in the table shown below. No. ① ② Content of Abnormal Detection Abnormal LED current detection Abnormal LED short detection Condition of Abnormal Detection IS<(ADIM/8.8)V IS>1.0V ③ COMPSD Over Voltage detection COMPSD≥ 4.0V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F When it Detects Timer Latch Type Error STB 2.0V 2.5V 2.0V SS 2.5V 2.0V 3.2V FB 1.0V ADIM/4.4 IS ADIM/8.8 1.25V 1.25V 4 VS COMPSD CP 1.80V 2.0V FAIL Figure. 27 Timing Chart 2 [The explanation of Time latch type error detection] Due to the timing of ④ in the above chart, the IC detects abnormal and starts the timer latch charging. For ④, the abnormal is detected according to the conditions in the table shown below. No. ④ Content of Abnormal Detection Abnormal LED voltage detection www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Condition of Abnormal Detection VS≥ 1.25V 18/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Output Timing Chart BD94121F outputs the signal that operates the Push-Pull or Half-Bridge which is made up of Nch FET. The output timing of drive signal is shown in the following chart CT _ SYNC_ OUT (can’t see it) PWMIN FB FB=0.5V Internal CT ( can’t see it) FB=0.5V PWMCOMP CT N1 VCC N2 VCC Figure. 28 Output Timing Chart www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Operational Notes – continued 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure xx. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Ordering Information B D 9 4 1 Part Number 2 1 F - Package F:SOP18 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams SOP18(TOP VIEW) Part Number Marking BD94121F LOT Number 1PIN MARK www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Physical Dimension, Tape and Reel Information Package Name SOP18 (Max 11.55 (include.BURR)) (UNIT : mm) PKG : SOP18 Drawing No. : EX115-5001 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 BD9412F Revision History Revision No. 001 Date 22.Feb.2016 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Page All Changes New Release 24/24 TSZ02201-0F5F0C100100-1-2 22.Feb.2016 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD94121F - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD94121F SOP18 2000 2000 Taping inquiry Yes