Diodes DMP25H18DLFDE-7 250v p-channel enhancement mode mosfet Datasheet

DMP25H18DLFDE
250V P-CHANNEL ENHANCEMENT MODE MOSFET
RDS(ON) max
ID max
TA = +25°C
14Ω @ VGS = -10V
-0.26A
18Ω @ VGS = -3.5V
-0.23A
V(BR)DSS
-250V
Features
•
•
•
•
•
•
Description
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)) and yet maintain superior switching performance,
making it ideal for high-efficiency power management applications.
Applications
•
•
•
•
0.6mm Profile – Ideal for Low-Profile Applications
PCB Footprint of 4mm2
Low Gate Threshold Voltage
Low On-Resistance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
•
•
•
•
General Purpose Interfacing Switch
Load Switching
Battery Management Application
Power Management Functions
•
Case: U-DFN2020-6
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper Leadframe.
Solderable per MIL-STD-202, Method 208 e4
Weight: 0.0065 grams (Approximate)
D
U-DFN2020-6
Pin1
G
S
Bottom View
Pin Out
Bottom View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP25H18DLFDE-7
DMP25H18DLFDE-13
Notes:
Marking
H8
H8
Reel Size (inches)
7
13
Quantity per Reel
3,000
10,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
U-DFN2020-6
\
H8
Date Code Key
Year
Code
Month
Code
2014
B
Jan
1
2015
C
Feb
2
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
Mar
3
H8 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: B = 2014)
M = Month (ex: 9 = September)
YM
ADVANCE INFORMATION
ADVANCED INFORMATION
Product Summary
2016
D
Apr
4
2017
E
May
5
Jun
6
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2018
F
Jul
7
2019
G
Aug
8
Sep
9
2020
H
Oct
O
2021
I
Nov
N
Dec
D
January 2015
© Diodes Incorporated
DMP25H18DLFDE
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
ADVANCED INFORMATION
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Pulsed Drain Current (10µs pulse, duty cycle
≦1%)
Symbol
Value
VDSS
-250
V
VGSS
±40
V
ID
-0.26
-0.21
A
IDM
-0.8
A
IS
1.2
A
TA = +25°C
TA = +70°C
Steady
State
Maximum Body Diode Continuous Current (Note 6)
Units
Thermal Characteristics
Characteristic
Symbol
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 6)
Total Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Value
0.6
1.4
191
86
PD
RθJA
Operating and Storage Temperature Range
RθJC
17
TJ, TSTG
-55 to +150
Units
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
-250
—
—
V
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
—
—
-1
µA
VDS = -250V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±40V, VDS = 0V
VGS(th)
-0.5
-1.7
-2.5
V
VDS = VGS, ID = -1mA
10
14
13
18
-0.8
-1.2
VGS = 0V, ID = -1mA
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
RDS (ON)
—
VSD
—
Ω
V
VGS = -10V, ID = -200mA
VGS = -3.5V, ID = -100mA
VGS = 0V, IS = -200mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
—
81
—
pF
Output Capacitance
Coss
—
14
—
pF
Reverse Transfer Capacitance
Crss
—
4
—
pF
Gate Resistance
Rg
—
13
—
Ω
Total Gate Charge (VGS = -10V)
Qg
—
2.8
—
nC
Gate-Source Charge
Qgs
—
0.3
—
nC
Gate-Drain Charge
Qgd
—
0.6
—
nC
Turn-On Delay Time
tD(on)
—
7.5
—
ns
Turn-On Rise Time
tr
—
25
—
ns
Turn-Off Delay Time
tD(off)
—
124
—
ns
tf
—
95
—
ns
Reverse Recovery Time
trr
—
85
—
ns
Reverse Recovery Charge
Qrr
—
294
—
uC
Turn-Off Fall Time
Notes:
VDS = -25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -25V, ID = -200mA
VDS = -30V, ID = -200mA
VGS = -10V, RG = 50Ω
IF = -1.0A, di/dt = 100A/µs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
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January 2015
© Diodes Incorporated
DMP25H18DLFDE
0.8
0.3
VGS = -20V
VDS = -10V
TA = 85°C
VGS = -4.5V
0.5
0.4
VGS = -4.0V
0.3
VGS = -3.5V
0.2
VGS = -3.0V
VGS = -2.5V
0.1
0.0
ID, DRAIN CURRENT (A)
0.6
0
1
2
3
4
5
6
7
8
9
VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
18
16
VGS = -4.5V
VGS = -10V
12
VGS = -20V
10
8
6
4
2
0
0
0.1
0.2 0.3 0.4 0.5 0.6 0.7
ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
TA = -55° C
0.1
0
10
20
14
TA = 25°C
0.2
TA = 150°C
TA = 125°C
VGS = -2.2V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ID, DRAIN CURRENT (A)
VGS = -10V
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCE INFORMATION
ADVANCED INFORMATION
0.7
0.8
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0 0.5
1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
30
VGS = -4.5V
T A = 150°C
25
TA = 125°C
20
T A = 85°C
15
TA = 25°C
10
T A = -55°C
5
0
0
0.1
0.2
0.3
0.4
0.5
ID, DRAIN SOURCE CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.6
January 2015
© Diodes Incorporated
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
VGS = -10V
ID = -0.3A
2
1.6
VGS = -4.5V
ID = -0.2A
1.2
0.8
0.4
-50
2
25
VGS = -4.5V
ID = -0.2A
20
15
VGS = -10V
ID = -0.3A
10
5
0
-50
1
0.9
1.8
0.8
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
30
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
-I D = 1mA
1.6
-ID = 250µA
1.4
1.2
0.7
0.6
0.5
TA= 150°C
0.4
TA= 125°C
0.3
T A= 85°C
0.2
TA= 25°C
T A= -55°C
0.1
1
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
1000
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10
f = 1MHz
VGS, GATE-SOURCE VOLTAGE (V)
9
CT, JUNCTION CAPACITANCE (pF)
ADVANCE INFORMATION
ADVANCED INFORMATION
2.4
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMP25H18DLFDE
Ciss
100
Coss
10
Crss
8
7
VDS = -25V
ID = -200mA
6
5
4
3
2
1
1
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
40
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0
0
0.5
1
1.5
2
2.5
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate-Charge Characteristics
3
January 2015
© Diodes Incorporated
DMP25H18DLFDE
10
ID, DRAIN CURRENT (A)
1
0.1
DC
PW = 10s
PW = 1s
PW = 100ms
0.01 T
J(max) = 150°C
0.001
PW = 10ms
TA = 25°C
VGS = 10V
Single Pulse
DUT on 1 * MRP Board
PW = 1ms
PW = 100µs
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11 SOA, Safe Operation Area
1
D = 0.9
D = 0.7
D = 0.5
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
ADVANCED INFORMATION
RDS(on)
Limited
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 192°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.0001
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIMES (sec)
Figure 12 Transient Thermal Resistance
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100
1000
January 2015
© Diodes Incorporated
DMP25H18DLFDE
Package Outline Dimensions
ADVANCE INFORMATION
ADVANCED INFORMATION
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A1
A
U-DFN2020-6
Type E
Dim
Min
Max
Typ
A
0.57
0.63
0.60
A1
0
0.05
0.03
A3
—
—
0.15
b
0.25
0.35
0.30
b1
0.185 0.285 0.235
D
1.95
2.05
2.00
D2
0.85
1.05
0.95
E
1.95
2.05
2.00
E2
1.40
1.60
1.50
e
—
—
0.65
L
0.25
0.35
0.30
L1
0.82
0.92
0.87
K1
—
—
0.305
K2
—
—
0.225
Z
—
—
0.20
All Dimensions in mm
A3
D
b1
K1
D2
E E2
L1
L(2X)
K2
Z(4X)
e
b(6X)
Suggested Pad Layout
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
U-DFN2020-6 Type E
Dimensions
Y3 Y2
X2
C
X
X1
X2
Y
Y1
Y2
Y3
Y1
X1
X (6x)
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
C
Value
(in mm)
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
Y (2x)
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January 2015
© Diodes Incorporated
DMP25H18DLFDE
ADVANCE INFORMATION
ADVANCED INFORMATION
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
DMP25H18DLFDE
Datasheet number: DS37298 Rev. 3 - 2
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January 2015
© Diodes Incorporated
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