Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR General Description Features The AZ1117C is a low dropout three-terminal regulator. · · Current Limit: 1.35A (Typ.) Output Noise from 10Hz to 10KHz: 0.003% of VOUT · PSRR at IOUT=300mA and f=120Hz: 70dB · · · Output Voltage Accuracy: ±1% (Except 1.2V version) On-chip Thermal Shutdown Maximum Quiescent Current: IQMAX=6mA · · Compatible with Low ESR Ceramic Capacitor Operation Junction Temperature: -20 to 125oC The AZ1117C has been optimized for low voltage where transient response and minimum input voltage are critical. It provides current limit and thermal shutdown. Its circuit includes a trimmed bandgap reference to assure output voltage accuracy to be within ±1%. On-chip thermal shutdown provides protection against a combination of high current and ambient temperature that would create excessive junction temperature. The AZ1117C is available in 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5.0V fixed output voltage vesions and ADJ output voltage version. The fixed versions integrate the adjust resistors. It is also available in an adjustable version which can set the output voltage with two external resistors. Applications · · · · The AZ1117C is available in the industry-standard TO-252-2 (3), TO-252-2 (4), SOT-89 and SOT-223 power packages. USB Device Add-on Card DVD Player PC Motherboard SOT-89 SOT-223 TO-252-2 (3) TO-252-2 (4) Figure 1. Package Types of AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 1 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Pin Configuration D Package (TO-252-2 (4)) (TO-252-2 (3)) VOUT 3 INPUT 2 OUTPUT 1 ADJ/GND VOUT 3 INPUT 2 OUTPUT 1 ADJ/GND R Package R2 Package (SOT-89) (SOT-89) 3 INPUT 2 OUTPUT 1 ADJ/GND VIN 3 OUTPUT 2 INPUT 1 ADJ/GND H Package (SOT-223) VOUT 3 INPUT 2 OUTPUT 1 ADJ/GND Figure 2. Pin Configuration of AZ1117C (Top View) Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 2 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Functional Block Diagram 3(2) Thermal Protection INPUT + 2(3) OUTPUT For Adjustable Output, disconnect A1 and A2, connect B For Fixed Output, connect A1 and A2, disconnect B A1 A2 1(1) B ADJ/GND A(B) A for TO-252-2 (3)/TO-252-2 (4)/SOT-223/SOT-89 (R) B for SOT-89 (R2) Figure 3. Functional Block Diagram of AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 3 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Ordering Information AZ1117C G1: Green Circuit Type TR: Tape and Reel Blank: Tube Package H: SOT-223 R/R2: SOT-89 D: TO-252-2 (3) /TO-252-2 (4) Package Temperature Range SOT-223 -20 to 125oC TO-252-2 (3) /TO-252-2 (4) ADJ: Adjustable Output 1.2: Fixed Output 1.2V 1.5: Fixed Output 1.5V 1.8: Fixed Output 1.8V 2.5: Fixed Output 2.5V 3.3: Fixed Output 3.3V 5.0: Fixed Output 5.0V Part Number Marking ID Packing Type AZ1117CH-ADJTRG1 GH15B Tape & Reel AZ1117CH-1.2TRG1 GH16B Tape & Reel AZ1117CH-1.5TRG1 GH15C Tape & Reel AZ1117CH-1.8TRG1 GH16C Tape & Reel AZ1117CH-2.5TRG1 GH15D Tape & Reel AZ1117CH-3.3TRG1 GH16D Tape & Reel AZ1117CH-5.0TRG1 GH15E Tape & Reel AZ1117CD-ADJG1 AZ1117CD-ADJG1 Tube AZ1117CD-ADJTRG1 AZ1117CD-ADJG1 Tape & Reel AZ1117CD-1.2G1 AZ1117CD-1.2G1 Tube AZ1117CD-1.2TRG1 AZ1117CD-1.2G1 Tape & Reel AZ1117CD-1.5G1 AZ1117CD-1.5G1 Tube AZ1117CD-1.5TRG1 AZ1117CD-1.5G1 Tape & Reel AZ1117CD-1.8G1 AZ1117CD-1.8G1 Tube AZ1117CD-1.8TRG1 AZ1117CD-1.8G1 Tape & Reel AZ1117CD-2.5G1 AZ1117CD-2.5G1 Tube AZ1117CD-2.5TRG1 AZ1117CD-2.5G1 Tape & Reel AZ1117CD-3.3G1 AZ1117CD-3.3G1 Tube AZ1117CD-3.3TRG1 AZ1117CD-3.3G1 Tape & Reel AZ1117CD-5.0G1 AZ1117CD-5.0G1 Tube AZ1117CD-5.0TRG1 AZ1117CD-5.0G1 Tape & Reel Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 4 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Ordering Information (Continued) Package Temperature Range SOT-89 -20 to 125oC SOT-89 Part Number Marking ID Packing Type AZ1117CR-ADJTRG1 G27N Tape & Reel AZ1117CR-1.2TRG1 G28J Tape & Reel AZ1117CR-1.5TRG1 G28K Tape & Reel AZ1117CR-1.8TRG1 G28L Tape & Reel AZ1117CR-2.5TRG1 G28M Tape & Reel AZ1117CR-3.3TRG1 G28N Tape & Reel AZ1117CR-5.0TRG1 G27M Tape & Reel AZ1117CR2-ADJTRG1 G42O Tape & Reel AZ1117CR2-1.2TRG1 G43M Tape & Reel AZ1117CR2-1.5TRG1 G43N Tape & Reel AZ1117CR2-1.8TRG1 G43O Tape & Reel AZ1117CR2-2.5TRG1 G70M Tape & Reel AZ1117CR2-3.3TRG1 G70N Tape & Reel AZ1117CR2-5.0TRG1 G33N Tape & Reel BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 5 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage VIN 18 V TJ 150 oC TSTG -65 to 150 Operating Junction Temperature Range Storage Temperature Range Thermal Resistance (Without Heatsink) Thermal Resistance (With Heatsink) (Note2) Lead Temperature (Soldering, 10sec) θJA θJA o SOT-89 170 SOT-223 125 TO-252-2 (3)/TO-252-2 (4) 100 SOT-89 150 SOT-223 100 TO-252-2 (3)/TO-252-2 (4) 70 oC/W oC/W o 260 TLEAD C C Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: Chip is soldered to 100mm2(10mm*10mm) copper (top side solder mask) on 2oz.2 layers FR-4 PCB with 8*0.5mm vias. Recommended Operating Conditions Parameter Symbol Input Voltage VIN Operating Junction Temperature Range TJ Min -20 Nov. 2012 Rev. 1. 8 Max Unit 15 V 125 o C BCD Semiconductor Manufacturing Limited 6 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics AZ1117C-ADJ Electrical Characteristics Operating Conditions: VIN=VOUT+2V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol VREF 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT ≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Reference Voltage ΔVREF=1%, IOUT=0.8A Min Typ Max 1.238 1.250 1.262 1.225 1.250 1.270 0.001 0.1 0.2 Unit V % 0.4 1.0 % SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 Adjust Pin Current A 1.35 60 120 μA Adjust Pin Current Change 1.5V≤(VIN-VOUT)≤10V 0.2 5 μA Minimum Load Current 1.5V≤(VIN-VOUT)≤10V 1.7 5 mA f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC Ripple Rejection PSRR Temperature Stability RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis Thermal Resistance (Junction to Case) 16 θJC SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 o C oC/W BCD Semiconductor Manufacturing Limited 7 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-1.2 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Max 1.176 1.2 1.224 1.152 1.2 1.228 0.5 6 10 Unit V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC 16 oC RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis θJC Typ 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA o C/W BCD Semiconductor Manufacturing Limited 8 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-1.5 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Max 1.485 1.5 1.515 1.470 1.5 1.530 0.5 6 10 Unit V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC 16 oC RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis θJC Typ 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA o C/W BCD Semiconductor Manufacturing Limited 9 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-1.8 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Max 1.782 1.8 1.818 1.764 1.8 1.836 0.5 6 10 Unit V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC 16 oC RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis θJC Typ 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA o C/W BCD Semiconductor Manufacturing Limited 10 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-2.5 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Max 2.475 2.5 2.525 2.455 2.5 2.545 0.5 6 10 Unit V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC 16 oC RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature Thermal Shutdown Hysteresis θJC Typ 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA o C/W BCD Semiconductor Manufacturing Limited 11 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-3.3 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Typ Max 3.267 3.3 3.333 3.235 3.3 3.365 0.5 6 10 V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC RMS Output Noise (% of VOUT) TA=25 C, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature o Thermal Shutdown Hysteresis 16 θJC Unit 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA o C oC/W BCD Semiconductor Manufacturing Limited 12 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Electrical Characteristics (Continued) AZ1117C-5.0 Electrical Characteristics Operating Conditions: VIN≤10V, IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC. Parameter Conditions Symbol Output Voltage VOUT 1.5V≤VIN-VOUT≤10V Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V Load Regulation VRLOAD Dropout Voltage VDROP Current Limit ILIMIT Quiescent Current IQ Ripple Rejection PSRR ΔVOUT=1%, IOUT=0.8A Max 4.950 5.0 5.050 4.900 5.0 5.100 0.5 6 10 Unit V mV 15 mV SOT-223 1.2 1.3 V TO-252-2 (3)/TO-252-2 (4) 1.3 1.4 V 1 A 1.35 IOUT=0 4 f=120Hz, COUT=22μF (VIN-VOUT)=3V, IOUT=300mA 70 dB 0.5 % 0.003 % 160 oC 16 o RMS Output Noise (% of VOUT) TA=25 C, 10Hz≤f≤10KHz Thermal Shutdown Junction Temperature o Thermal Shutdown Hysteresis θJC Typ 2 Temperature Stability Thermal Resistance (Junction to Case) Min SOT-89 30 SOT-223 15 TO-252-2 (3)/TO-252-2 (4) 10 Nov. 2012 Rev. 1. 8 6 mA C oC/W BCD Semiconductor Manufacturing Limited 13 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics 10 0.4 AZ1117C-2.5V VIN=4.5V to 10V IOUT=10mA Load Regulation (mV) Line Regulation (mV) 0.2 AZ1117C-2.5V VIN=4.5V IOUT=10mA to 800mA 5 0.0 -0.2 0 -5 -10 -15 -20 -0.4 -25 -20 0 20 40 60 80 100 120 -20 0 20 o Junction Temperature ( C) 60 80 100 120 o Junction Temperature ( C) Figure 4. Line Regulation vs. Junction Temperature Figure 5. Load Regulation vs. JunctionTemperature 2.60 1.270 1.265 AZ1117C-2.5V VIN=4.5V IOUT=10mA 2.58 AZ1117C-ADJ VIN=4.5V IOUT=10mA 1.260 2.56 2.54 1.255 Output Voltage (V) Reference Voltage (V) 40 1.250 1.245 1.240 1.235 2.52 2.50 2.48 2.46 1.230 2.44 1.225 2.42 2.40 1.220 -20 0 20 40 60 80 100 120 o Junction Temperature ( C) -20 0 20 40 60 80 100 120 o Junction Temperature ( C) Figure 6. Reference Voltage vs. Junction Temperature Figure 7. Output Voltage vs. Junction Temperature Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 14 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics (Continued) 100 AZ1117C-ADJ VIN=4.5V 2 AZ1117C-ADJ VIN=4.5V 90 80 Adjust Pin Current (μA) Minimum Load Current (mA) 3 1 0 -1 70 60 50 40 30 20 10 0 -20 -2 -20 0 20 40 60 80 100 120 0 20 60 80 100 120 o Junction Temperature ( C) Figure 8. Minimum Load Current vs. Junction Temperature Figure 9. Adjust Pin Current vs. Junction Temperature 1.8 10 1.7 -20 C O 0 C O +25 C O +85 C O +100 C 1.4 8 Power Dissipation (W) 1.5 AZ1117C-2.5V Package: SOT-223 No Heat Sink 9 O 1.6 Dropout Voltage (V) 40 Junction Temperature ( C) o 1.3 1.2 1.1 1.0 7 6 5 4 3 2 0.9 0.8 0.0 1 0.2 0.4 0.6 0.8 1.0 0 Output Current (A) -20 0 20 40 60 80 100 120 o Case Temperature ( C) Figure 10. Dropout Voltage vs. Output Current Figure 11. Power Dissipation vs. Case Temperature Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 15 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics (Continued) ΔVOUT (50mV/Div) ΔVOUT (0.1V/Div) 0.2 0.1 0 -0.1 100 50 0 -50 IOUT (0.3A/Div) 5.3 4.8 4.3 0.3 0 -0.3 10mA -0.6 3.8 Time (20μs/Div) Time (10μs/Div) Figure 13. Load Transient Response Figure 12. Line Transient Response 80 1.6 70 1.4 1.2 Current Limit (A) 60 PSRR (dB) VIN (0.5V/Div) 0.6 50 40 30 20 10 10 100 1k 10k 1.0 0.8 0.6 0.4 AZ1117C-2.5V VIN=4.5V 0.2 No Heat Sink @VOUT=VOUT(nom)x98% 0.0 100k -20 Frequency (Hz) 0 20 40 60 80 100 120 o Junction Temperature ( C) Figure 14. PSRR vs. Frequency Figure 15. Current Limit vs. Junction Temperature Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 16 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Typical Performance Characteristics (Continued) 2.0 1.9 IOUT=0.1A IOUT=0.5A IOUT=0.8A IOUT=1A Dropout Voltage (V) 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 120 O Junction Temperature ( C) Figure 16. Dropout Voltage vs. Junction Temperature Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 17 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Typical Applications VIN =11V 9V AZ1117C- ADJ VIN 10 μF VOUT 22μF ADJ R1 124Ω R2 768Ω VIN =5.3V VOUT=V REF * ( 1+R2/R1 ) + IADJ * R2 AZ1117C-3.3 10μF 3.3 V VOUT VIN 22μF GND Figure 17. Typical Applications of AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 18 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Mechanical Dimensions SOT-223 Unit: mm(inch) 6.300(0.248) 6.700(0.264) ) 0.250(0.010 ) 4 1 0.350(0.0 2.900(0.114) 3.100(0.122) 0.900(0.035) 3.700(0.146) 3.300(0.130) 7.300(0.287) 6.700(0.264) MIN 0.250(0.010) 1.750(0.069) TYP 2.300(0.091) 0.610(0.024) TYP 0.810(0.032) 4.500(0.177) 0° 10° 4.700(0.185) 0.020(0.001) 0.100(0.004) 1.500(0.059) 1.520(0.060) 1.700(0.067) 1.800(0.071) Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 19 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Mechanical Dimensions (Continued) SOT-89 1.550(0.061)REF Unit: mm(inch) 4.400(0.173) 4.600(0.181) 1.400(0.055) 1.600(0.063) 1.030(0.041)REF 45 2.300(0.091) 2.600(0.102) 3.950(0.156) 4.250(0.167) 2.060(0.081)REF 3 0.900(0.035) 1.100(0.043) 0.320(0.013) 0.520(0.020) 0.480(0.019) 0.320(0.013) 0.520(0.020) 10 0.350(0.014) 0.450(0.018) 3.000(0.118) TYP 1.500(0.059) 1.800(0.071) 0.320(0.013)REF 3 2.210(0.087)REF 1.620(0.064)REF R0.150(0.006) 10 Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 20 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Mechanical Dimensions (Continued) 6.500(0. 256) 6.700(0. 264) 1.29±0.1 4.700REF 0.470(0.019) 0.600(0.024) 5.250REF 0.600(0.024) 1.000(0.039) 0.150(0.006) 0.750(0.030) 5 9 2.200(0. 087) 2.380(0.094) 0.900(0.035) 1.100(0.043) 0 8 3 7 1.400(0.055) 1.700(0.067) 6.000(0.236) 6.200(0.244) 1.800REF 0.720(0.028) 0.850(0.033) 0.720(0.028) 0.900(0. 035) 5 9 2.900REF 5.130(0.202) 5.460(0.215) Option 1 2.286(0. 090) BSC Unit: mm(inch) 9.800(0.386) 10.400(0.409) 0.900(0.035) 1.250(0.049) TO-252-2 (3) 0 8 Option 2 Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited 21 Data Sheet AP1117M AP2317 AZ1117C 600mA LOW DROPOUT LINEAR REGULATOR LOW DROPOUT LINEAR REGULATOR Mechanical Dimensions (Continued) TO-252-2 (4) Unit: mm(inch) 2.180(0.086) 2.380(0.094) 6.350(0.250) 6.730(0.265) 0.890(0.035) 1.270(0.050) 4.960(0.195) 5.460(0.215) 4.320(0.170) MIN 0.460(0.018) 0.600(0.024) 2.160(0.085) MIN 0 15 1.20±0.05 5.210(0.205) MIN 5.970(0.235) 6.220(0.245) 9.940(0.391) 10.340(0.407) 1.700(0.067) 1.900(0.075) 1.145(0.045) 1.492(0.059) 0.765(0.030) 1.124(0.044) 2.290(0.090) BSC 0.640(0.025) 0.884(0.035) 1.010(0.040) MAX DETAIL “A” 0.650(0.026) 0.780(0.031) PLATING 3 3 0.460(0.018) 0.610(0.024) 0.410(0.016) 0.560(0.022) BASE METAL 0.640(0.025) 0.884(0.035) SECTION B-B GAUGE PLANE 1.500(0.059) 1.780(0.070) 0 10 B B 2.740(0.108) REF Nov. 2012 Rev. 1. 8 0.020(0.001) 0.120(0.005) SEATING PLANE BCD Semiconductor Manufacturing Limited 22 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. MAIN SITE SITE MAIN - Headquarters BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab No. 1600, Zi Xing Road, Shanghai ZiZhu Science-basedLimited Industrial Park, 200241, China Shanghai SIM-BCD Semiconductor Manufacturing Tel: Fax: +86-21-24162277 800,+86-21-24162266, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen OfficeSALES OFFICE REGIONAL - Wafer FabSemiconductor Manufacturing Limited BCD Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. - IC Design Group 800 Yi Shan Road, Shanghai 200233, China Corporation Advanced Analog Circuits (Shanghai) Tel: +86-21-6485 1491,YiFax: 0008200233, China 8F, Zone B, 900, Shan+86-21-5450 Road, Shanghai Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 Taiwan Office Shanghai Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan Semiconductor Shenzhen SIM-BCD Office Office (Taiwan) Company Limited Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan Shenzhen, 4F, 298-1, Guang Road,(Taiwan) Nei-Hu District, Taipei, Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.District, Shenzhen Office BCDRui Semiconductor Company Limited China Taiwan Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Tel: +86-755-8826 Tel: +886-2-2656 2808 Room E, 5F, Noble 7951 Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan Fax: +86-755-88267951 7865 Fax: +886-2-2656 28062808 Tel: +86-755-8826 Tel: +886-2-2656 Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 USA Office BCD Office Semiconductor Corp. USA 30920Semiconductor Huntwood Ave.Corporation Hayward, BCD CA 94544, USA Ave. Hayward, 30920 Huntwood Tel :94544, +1-510-324-2988 CA U.S.A Fax:: +1-510-324-2988 +1-510-324-2788 Tel Fax: +1-510-324-2788