Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC3100MOD SWRS161 – DECEMBER 2014 CC3100MOD SimpleLink™ Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications 1 Module Overview 1.1 Features 1 • The CC3100MOD is a Wi-Fi Module that Consists of the CC3100R11MRGC Wi-Fi Network Processor and Power-Management Subsystems. This Fully Integrated Module Includes all Required Clocks, SPI Flash, and Passives. • Modular FCC, IC, and CE Certifications Save Customer Effort, Time, and Money • Wi-Fi CERTIFIED™ Modules, With Ability to Request Certificate Transfer for Wi-Fi Alliance Members • Wi-Fi Network Processor Subsystem – Featuring Wi-Fi Internet-On-a-Chip™ – Dedicated ARM® MCU Completely Offloads Wi-Fi and Internet Protocols from the External Microcontroller – Wi-Fi Driver and Multiple Internet Protocols in ROM – 802.11 b/g/n Radio, Baseband, and Medium Access Control (MAC), Wi-Fi Driver, and Supplicant – TCP/IP Stack • Industry-Standard BSD Socket Application Programming Interfaces (APIs) • 8 Simultaneous TCP or UDP Sockets • 2 Simultaneous TLS and SSL Sockets – Powerful Crypto Engine for Fast, Secure Wi-Fi and Internet Connections With 256-Bit AES Encryption for TLS and SSL Connections – Station, AP, and Wi-Fi Direct™ Modes – WPA2 Personal and Enterprise Security – SimpleLink Connection Manager for Autonomous and Fast Wi-Fi Connections – SmartConfig™ Technology, AP Mode, and WPS2 for Easy and Flexible Wi-Fi Provisioning – TX Power • 17 dBm at 1 DSSS • 17.25 dBm at 11 CCK • 13.5 dBm at 54 OFDM – RX Sensitivity • –94.7 dBm at 1 DSSS • –87 dBm at 11 CCK • –73 dBm at 54 OFDM – Application Throughput • UDP: 16 Mbps • TCP: 13 Mbps • Host Interface – Wide Range of Power Supply (2.3 to 3.6 V) – Interfaces With 8-, 16-, and 32-Bit MCU or ASICs Over a Serial Peripheral Interface (SPI) With up to 20-MHz Clock – Low Footprint Host Driver: Less than 6KB – Supports RTOS and No-OS Applications • Power-Management Subsystem – Integrated DC-DC Converter With a WideSupply Voltage: • Direct Battery Mode: 2.3 to 3.6 V – Low-Power Consumption at 3.6 V • Hibernate With Real-Time Clock (RTC): 7 μA • Standby: 140 μA • RX Traffic: 54 mA at 54 OFDM • TX Traffic: 223 mA at 54 OFDM – Integrated Components on Module • 40.0-MHz Crystal With Internal Oscillator • 32.768-kHz Crystal (RTC) • 8-Mbit SPI Serial Flash RF Filter and Passive Components – Package and Operating Conditions • 1.27-mm Pitch, 63-Pin, 20.5-mm × 17.5-mm LGA Package for Easy Assembly and Low-Cost PCB Design • Operating Temperature Range: –20°C to 70°C 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC3100MOD SWRS161 – DECEMBER 2014 1.2 • • • • • • • Applications Internet of Things (IoT) Cloud Connectivity Home Automation Home Appliances Access Control Security Systems Smart Energy 1.3 www.ti.com • • • • • • Internet Gateway Industrial Control Smart Plug and Metering Wireless Audio IP Network Sensor Nodes Wearables Description Add Wi-Fi to low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications. The CC3100MOD is FCC, IC, CE, and Wi-Fi CERTIFIED module is part of the new SimpleLink Wi-Fi family that dramatically simplifies the implementation of Internet connectivity. The CC3100MOD integrates all protocols for Wi-Fi and Internet, which greatly minimizes host MCU software requirements. With built-in security protocols, the CC3100MOD solution provides a robust and simple security experience. Additionally, the CC3100MOD is a complete platform solution including various tools and software, sample applications, user and programming guides, reference designs and the TI E2E™ support community. The CC3100MOD is available an LGA package that is easy to lay out with all required components including serial flash, RF filter, crystal, passive components fully integrated. The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-Chip and contains an additional dedicated ARM MCU that completely off-loads the host MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3100MOD module supports Station, Access Point, and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security and WPS 2.0. This subsystem includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The powermanagement subsystem includes an integrated DC-DC converter with support for a wide range of supply voltages. This subsystem enables low-power consumption modes such as hibernate with RTC mode, which requires approximately 7 μA of current. The CC3100MOD module can connect to any 8-, 16-, or 32bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint requirements of less than 7KB of code memory and 700B of RAM memory for a TCP client application. Table 1-1. Module Information (1) PART NUMBER CC3100MODR11MAMOB (1) 2 PACKAGE BODY SIZE MOB (63) 20.5 mm × 17.5 mm For more information, see Section 9, Mechanical Packaging and Orderable Information. Module Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 1.4 SWRS161 – DECEMBER 2014 Functional Block Diagram Figure 1-1 shows the functional block diagram of the CC3100MOD module. 32-KHz Crystal 40-MHz Crystal Serial Flash 8Mbit VCC CC3100R11MRGC HOST I/F RF Filter Power Inductors Caps Pull-up resistors CC3100MOD Figure 1-1. CC3100MOD Functional Block Diagram Module Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 3 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com RAM WiFi Driver TCP/IP & TLS/SSL Stacks ROM Crypto Engine ARM Processor MAC Processor UART DC2DC BAT Monitor Oscillators LNA SYSTEM Synthesizer PA HOST I/F SPI Baseband Radio SWAS031-A Figure 1-2. CC3100 Hardware Overview User Application SimpleLink Driver SPI or UART Driver External Microcontroller Internet Protocols TLS/SSL Embedded Internet TCP/IP Supplicant Wi-Fi Driver Wi-Fi MAC Embedded Wi-Fi Wi-Fi Baseband Wi-Fi Radio ARM Processor (Wi-Fi Network Processor) SWAS031-B Figure 1-3. CC3100 Software Overview 4 Module Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 Table of Contents 1 2 3 4 1 5.4 Power-Management Subsystem .................... 24 1.1 Features .............................................. 1 5.5 Low-Power Operating Modes ....................... 24 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 6.1 Reference Schematics .............................. 26 1.4 Functional Block Diagram ............................ 3 6.2 Bill of Materials ...................................... 27 Revision History ......................................... 6 Terminal Configuration and Functions .............. 7 6.3 Layout Recommendations Module Overview 6 7 Applications, Implementation, and Layout ....... .......................... 26 27 3.1 CC3100MOD Pin Diagram ........................... 7 Environmental Requirements and Specifications ........................................... 31 3.2 Pin Attributes ......................................... 8 7.1 Temperature ......................................... 31 Specifications ........................................... 10 7.2 Handling Environment 4.1 Absolute Maximum Ratings ......................... 10 7.3 Storage Condition ................................... 31 4.2 Handling Ratings .................................... 10 7.4 Baking Conditions ................................... 31 4.3 .................................... Recommended Operating Conditions ............... Brown-Out and Black-Out ........................... Electrical Characteristics (3.3 V, 25°C) ............. 7.5 Soldering and Reflow Condition 4.4 4.5 4.6 4.7 Power-On Hours 10 10 8 .............................. .................... 31 31 Product and Documentation Support .............. 33 11 8.1 Development Support ............................... 33 12 8.2 Device Nomenclature ............................... 33 Thermal Resistance Characteristics for MOB Package ............................................. 12 8.3 Community Resources .............................. 34 8.4 Trademarks.......................................... 34 12 8.5 Electrostatic Discharge Caution ..................... 34 13 8.6 Export Control Notice 15 8.7 Glossary ............................................. 34 ................................. 4.9 Current Consumption ............................... 4.10 WLAN RF Characteristics ........................... 4.11 Timing Characteristics............................... Detailed Description ................................... 5.1 Overview ............................................ 5.2 Functional Block Diagram ........................... 5.3 Wi-Fi Network Processor Subsystem ............... 4.8 5 ........................................ Reset Requirement 16 9 ............................... 34 22 Mechanical Packaging and Orderable Information .............................................. 35 22 9.1 Mechanical Drawing................................. 35 23 9.2 Package Option ..................................... 36 23 Table of Contents Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 5 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 2 Revision History 6 DATE REVISION NOTES November 2014 * Initial release. Revision History Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 3 Terminal Configuration and Functions 3.1 CC3100MOD Pin Diagram GND 27 NC GND NC GND RF_BG GND NC SOP0 nRESET VBAT_DCDC_ANA VBAT_DCDC_PA GND NC VBAT_DCDC_DIG_IO NC NC GND Figure 3-1 shows the pin diagram for the CC3100MOD. 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 CC3100MOD 44 UART1_nRTS 26 45 NC NC 25 46 UART1_TX SOP1 24 47 UART1_RX SOP2 23 48 TEST_58 NC 22 49 TEST_59 50 TEST_60 51 UART1_nCTS 52 TEST_62 53 NC 54 NC 20 RESERVED 19 NC 18 61 GND GND 60 59 58 GND GND 56 17 GND 55 11 10 9 NC NC NC HOSTINTR FORCE_AP NC 8 7 6 5 4 nHIB 12 HOST_SPI_CLK 13 HOST_SPI_DIN 14 HOST_SPI_DOUT 15 HOST_SPI_nCS 16 NC GND GND NC 57 3 2 1 GND NC 62 GND 21 63 NC RESERVED GND GND Figure 3-1. CC3100MOD Pin Diagram (Bottom View) NOTE Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical diagram refer to Section 9. Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 7 CC3100MOD SWRS161 – DECEMBER 2014 3.2 www.ti.com Pin Attributes Table 3-1 lists the pin descriptions of the CC3100MOD module. NOTE If an external device drives a positive voltage to signal pads when the CC3100MOD is not powered, DC current is drawn from the other device. If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3100MOD can occur. To prevent current draw, TI recommends one of the following: • All devices interfaced to the CC3100MOD must be powered from the same power rail as the CC3100MOD. • Use level-shifters between the CC3100MOD and any external devices fed from other independent rails. • The nRESET pin of the CC3100MOD must be held low until the VBAT supply to the device is driven and stable. Table 3-1. Pin Attributes MODULE PIN NO. MODULE PIN NAME TYPE MODULE PIN DESCRIPTION 1 GND - Ground 2 GND - Ground 3 NC - Reserved. Do not connect 4 nHIB I Hibernate signal, active low. Refer to Figure 4-8. 5 HOST_SPI_CLK I Host interface SPI clock 6 HOST_SPI_DIN I Host interface SPI data input 7 HOST_SPI_DOUT O Host interface SPI data output 8 HOST_SPI_nCS I Host interface SPI chip select (active low) 9 NC - Reserved. Do not connect 10 FORCE_AP - For forced AP mode, pull to high on the board using a 100-kΩ resistor. Otherwise, pull down to ground using a 100-kΩ resistor. (1) 11 HOSTINTR O Interrupt output 12 NC - Reserved. Do not connect 13 NC - Reserved. Do not connect 14 NC - Reserved. Do not connect 15 NC - Reserved. Do not connect 16 GND - Ground 17 NC - Reserved. Do not connect 18 NC - Reserved. Do not connect 19 RESERVED - Reserved. Do not connect 20 NC - Unused. Do not connect. 21 RESERVED - Add 100-kΩ external pulldown resistor 22 NC - Reserved. Do not connect 23 SOP2 - Add 10k pulldown to ground 24 SOP1 - Reserved. Do not connect. 25 NC - Reserved. Do not connect 26 NC - Reserved. Do not connect 27 GND - Ground 28 GND - Ground 29 NC - Reserved. Do not connect 30 GND - Ground. Reference for RF signal (1) 8 Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin. Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 Table 3-1. Pin Attributes (continued) MODULE PIN NO. MODULE PIN NAME TYPE MODULE PIN DESCRIPTION 31 RF_BG I/O 2.4-GHz RF input/output 32 GND - Ground. Reference for RF signal 33 NC - Reserved. Do not connect 34 SOP0 - Reserved. Do not connect. 35 nRESET I Power on reset. Does not require external RC circuit 36 VBAT_DCDC_ANA - Power supply for the module, can be connected to battery (2.3 V to 3.6 V) 37 VBAT_DCDC_PA - Power supply for the module, can be connected to battery (2.3 V to 3.6 V) 38 GND - Ground 39 VDD_ANA2 - To be left unconnected. Used for prototype samples only. 40 VBAT_DCDC_DIG_IO - Power supply for the module, can be connected to battery (2.3 V to 3.6 V) 41 NC - Reserved. Do not connect 42 NC - Reserved. Do not connect 43 GND - Ground 44 UART1_nRTS O UART request to send, connect to external test point. Used for on-module flash reprogramming 45 NC - Reserved. Do not connect 46 UART1_TX O UART transmit, connect to external test point. Used for on-module flash reprogramming 47 UART1_RX I UART receive, connect to external test point. Used for on-module flash reprogramming 48 TEST_58 O Connect to external test point 49 TEST_59 I Connect to external test point 50 TEST_60 O Connect to external test point 51 UART1_nCTS I UART clear to send, connect to external test point. Used for on-module flash reprogramming 52 TEST_62 O Connect to external test point 53 NC - Reserved. Do not connect 54 NC - Reserved. Do not connect 55 GND - Thermal Ground 56 GND - Thermal Ground 57 GND - Thermal Ground 58 GND - Thermal Ground 59 GND - Thermal Ground 60 GND - Thermal Ground 61 GND - Thermal Ground 62 GND - Thermal Ground 63 GND - Thermal Ground Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 9 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 4 Specifications 4.1 Absolute Maximum Ratings These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability of the module. SYMBOL CONDITION MIN TYP MAX UNIT VBAT and VIO Respect to GND –0.5 Digital I/O Respect to GND –0.5 3.3 3.8 V – VBAT + 0.5 V 2.1 V RF pins –0.5 Analog pins –0.5 2.1 V Temperature –40 +85 °C 4.2 Handling Ratings Tstg Storage temperature range Electrostatic discharge (ESD) performance: VESD (1) (2) 4.3 MIN MAX UNIT –40 85 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) –1.0 1.0 kV Charged device model (CDM), per JESD22-C101 (2) –250 250 V All pins JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Power-On Hours CONDITIONS POH TAmbient up to 85°C, assuming 20% active mode and 80% sleep mode 4.4 17,500 Recommended Operating Conditions Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the module. (1) SYMBOL CONDITION (2) VBAT and VIO Operating temperature Ambient thermal slew (1) (2) 10 MIN TYP MAX Battery mode 2.3 3.3 3.6 V – –20 25 70 °C 20 °C/minute –20 UNIT Operating temperature is limited by crystal frequency variation. To ensure WLAN performance, the ripple on the power supply must be less than ±300 mV. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 4.5 SWRS161 – DECEMBER 2014 Brown-Out and Black-Out The module enters a brown-out condition whenever the input voltage dips below VBROWN (see Figure 4-1 and Figure 4-2). This condition must be considered during design of the power supply routing, especially if operating from a battery. High-current operations (such as a TX packet) cause a dip in the supply voltage, potentially triggering a brown-out. The resistance includes the internal resistance of the battery, contact resistance of the battery holder (4 contacts for a 2 x AA battery) and the wiring and PCB routing resistance. Figure 4-1. Brown-Out and Black-Out Levels (1 of 2) Figure 4-2. Brown-Out and Black-Out Levels (2 of 2) In the brown-out condition, all sections of the CC3100MOD shut down within the module except for the Hibernate block (including the 32-kHz RTC clock), which remains on. The current in this state can reach approximately 400 µA. The black-out condition is equivalent to a hardware reset event in which all states within the module are lost. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 11 CC3100MOD SWRS161 – DECEMBER 2014 4.6 www.ti.com Electrical Characteristics (3.3 V, 25°C) PARAMETER TEST CONDITIONS MIN NOM MAX 4 UNIT CIN Pin capacitance VIH High-level input voltage 0.65 × VDD pF VIL Low-level input voltage –0.5 IIH High-level input current 5 nA IIL Low-level input current 5 nA VOH High-level output voltage (VDD = 3.0 V) VOL Low-level output voltage (VDD = 3.0 V) IOH High-level source current, VOH = 2.4 6 mA IOL Low-level sink current, VOH = 0.4 6 mA VDD + 0.5 V 0.35 × VDD 2.4 V V V 0.4 V Pin Internal Pullup and Pulldown (25°C) PARAMETER TEST CONDITIONS MIN IOH Pullup current, VOH = 2.4 (VDD = 3.0 V) 5 IOL Pulldown current, VOL = 0.4 (VDD = 3.0 V) 5 VIL nRESET (1) (1) NOM MAX 10 UNIT µA µA 0.6 V The nRESET pin must be held below 0.6 V for the module to register a reset. 4.7 Thermal Resistance Characteristics for MOB Package °C/W (1) (2) AIR FLOW (m/s) (3) NAME DESCRIPTION RΘJC Junction-to-case 9.08 0.00 RΘJB Junction-to-board 10.34 0.00 RΘJA Junction-to-free air 11.60 0.00 RΘJMA Junction-to-moving air 5.05 < 1.00 PsiJT Junction-to-package top 9.08 0.00 PsiJB Junction-to-board 10.19 0.00 (1) (2) (3) 4.8 °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. m/s = meters per second. Reset Requirement PARAMETER SYMBOL Operation mode level ViH Shutdown mode level (1) ViL Minimum time for nReset low for resetting the module Rise/fall times (1) 12 MIN TYP 0.65 × VBAT 0 0.6 V 5 Tr/Tf MAX UNIT V V ms 20 µs The nRESET pin must be held below 0.6 V for the module to register a reset. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 4.9 SWRS161 – DECEMBER 2014 Current Consumption TA = +25°C, VBAT = 3.6 V TEST CONDITIONS (1) PARAMETER 1 DSSS TX 6 OFDM 54 OFDM (2) TYP 272 TX power level = 4 188 TX power level = 0 248 TX power level = 4 179 TX power level = 0 223 TX power level = 4 160 1 DSSS RX (3) MIN TX power level = 0 mA 53 0.715 LPDS 0.140 Hibernate 7 Peak calibration current (3) (5) UNIT 53 54 OFDM Idle connected (4) (1) (2) (3) (4) (5) MAX VBAT = 3.3 V 450 VBAT = 2.3 V 620 µA mA TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4 dB. The CC3100 system is a constant power-source system. The active current numbers scale inversely on the VBAT voltage supplied. The RX current is measured with a 1-Mbps throughput rate. DTIM = 1 The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. Calibration is performed sparingly, typically when coming out of Hibernate and only if temperature has changed by more than 20°C or the time elapsed from prior calibration is greater than 24 hours. Note: The area enclosed in the circle represents a significant reduction in current when transitioning from TX power level 3 to 4. In the case of lower range requirements (13-dbm output power), TI recommends using TX power level 4 to reduce the current. Figure 4-3. TX Power and IBAT vs TX Power Level Settings (1 DSSS) Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 13 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com Figure 4-4. TX Power and IBAT vs TX Power Level Settings (6 OFDM) Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM) 14 Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 4.10 WLAN RF Characteristics WLAN Receiver Characteristics TA = +25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz) PARAMETER CONDITION (Mbps) TYP –94.7 2 DSSS –92.6 11 CCK –87.0 6 OFDM –89.0 9 OFDM –88.0 18 OFDM –85.0 36 OFDM –79.5 54 OFDM –73.0 MCS7 (Mixed Mode) –69.0 802.11b –3.0 802.11g –9.0 Sensitivity (8% PER for 11b rates, 10% PER for 11g/11n rates)(10% PER) (1) Maximum input level (10% PER) (1) MIN 1 DSSS MAX UNITS dBm Sensitivity is 1-dB worse on channel 13 (2472 MHz). 4.10.1 WLAN Transmitter Characteristics(1) TA = +25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz) PARAMETERS CONDITIONS MIN 1DSSS Max RMS Output Power measured at 1 dB from IEEE spectral mask or EVM TYP 2DSSS 17 11CCK 17.25 6OFDM 16.25 9OFDM 16.25 18OFDM 16 36OFDM 15 54OFDM 13.5 MCS7 (Mixed Mode) Transmit center frequency accuracy MAX UNIT 17 dBm 12 –20 20 ppm (1) Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission limits. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 15 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 4.11 Timing Characteristics 4.11.1 SPI Host Interface Timings CC3100 Capture Host Launch CC3100 Launch Host Capture TP HOST_SPI_CLK TCLK HOST_SPI_DIN Tis Tih HOST_SPI_DOUT Tod T oh Figure 4-6. SPI Host Interface Timing (1) SYMBOL PARAMETER F Clock frequency TCLK Clock period Duty cycle MIN MAX UNIT 20 MHz 41.6 0.35 × VBAT ns 45% 55% Tis RX setup time: minimum time in which data is stable before capture edge 4 ns Tih RX hold time: minimum time in which data is stable after capture edge 4 ns Tod TX setup propagation time: maximum time from launch edge until data is stable 16 ns Toh TX hold propagation time: minimum time of data stable after launch edge 24 ns CL Capacitive load on interface 20 pF (1) 16 Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 4.11.2 Wake-Up Sequence VBAT and VIO nRESET nHIB STATE RESET tT1t HW INIT FW INIT tT2t tT3t Device ready to serve API calls Figure 4-7. Wake-Up Sequence Table 4-1. First-Time Power-Up and Reset Removal Timing Requirements (32K XTAL) ITEM NAME DESCRIPTION MIN T1 Supply settling time Depends on application board power supply, decap, and so on T2 Hardware wakeup time T3 Initialization time TYP MAX 3 ms 25 ms 32-kHz XTAL settling + firmware initialization time + radio calibration 1.35 s Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 17 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 4.11.3 Wakeup from Hibernate Figure 4-8 shows the timing diagram for wakeup from the hibernate state. tTHIB_MINt tTWAKEUP_FROM_HIBt HIBERNATE HW + FW INIT VBAT and VIO nRESET nHIB ACTIVE STATE ACTIVE HIBERNATE Figure 4-8. nHIB Timing Diagram NOTE The internal 32.768-kHz crystal oscillator is kept enabled by default when the chip goes to hibernate in response to nHIB being pulled low. Table 4-2. nHIB Timing Requirements (1) ITEM NAME DESCRIPTION MIN Thib_min Minimum hibernate time Minimum LOW pulse width of nHIB 10 ms Twake_from_hib Hardware wakeup time plus firmware initialization time See (1) (2) (2) . TYP MAX 50 ms Ensure that the nHIB low duration is not less than the specified width under all conditions, including power-ON, MCU hibernation, and so forth. If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration. 4.11.4 Interfaces This section describes the interfaces that are supported by the CC3100 module: • Host SPI • Host UART 18 Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 4.11.4.1 Host SPI Interface Timing I3 I2 I4 CLK I6 I7 MISO I9 I8 MOSI SWAS032-017 Figure 4-9. Host SPI Interface Timing Table 4-3. Host SPI Interface Timing Parameters (1) (2) PARAMETER NUMBER PARAMETER (1) PARAMETER NAME I1 F MIN MAX UNIT Clock frequency @ VBAT = 3.3 V 20 MHz Clock frequency @ VBAT ≤ 2.1 V 12 I2 tclk (2) Clock period I3 tLP Clock low period 25 ns I4 tHT Clock high period 25 ns I5 D Duty cycle 45% I6 tIS RX data setup time 4 I7 tIH RX data hold time 4 I8 tOD TX data output delay 20 I9 tOH TX data hold time 24 50 ns 55% ns ns ns The timing parameter has a maximum load of 20 pf at 3.3 V. Ensure that nCS (active-low signa)l is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge. 4.11.4.2 SPI Host Interface The device interfaces to an external host using the SPI interface. The CC3100 device can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a speed of 20 MHz. Figure 4-10 shows the SPI host interface. CC3100 (slave) MCU HOST_SPI_CLK SPI_CLK HOST_SPI_nCS SPI_nCS HOST_SPI_MISO SPI_MISO HOST_SPI_MOSI SPI_MOSI HOST_INTR INTR nHIB GPIO SWAS031-027 Figure 4-10. SPI Host Interface Table 4-4 lists the SPI host interface pins. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 19 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com Table 4-4. SPI Host Interface Pin Name Description HOST_SPI_CLK Clock (up to 20 MHz) from MCU host to CC3100 device HOST_SPI_nCS CS (active low) signal from MCU host to CC3100 device HOST_SPI_MOSI Data from MCU host to CC3100 device HOST_INTR Interrupt from CC3100 device to MCU host HOST_SPI_MISO Data from CC3100 device to MCU host nHIB Active-low signal that commands the CC3100 device to enter hibernate mode (lowest power state) 4.11.4.3 Host UART The SimpleLink device requires the UART configuration described in Table 4-5. Table 4-5. SimpleLink UART Configuration Property Supported CC3100 Configuration Baud rate 115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command Data bits 8 bits Flow control CTS/RTS Parity None Stop bits 1 Bit order LSBit first Host interrupt polarity Active high Host interrupt mode Rising edge or level 1 Endianness Little-endian only (1) (1) The SimpleLink device does not support automatic detection of the host length while using the UART interface. 4.11.4.3.1 5-Wire UART Topology Figure 4-11 shows the typical 5-wire UART topology comprised of 4 standard UART lines plus one IRQ line from the device to the host controller to allow efficient low power mode. HOST MCU UART RTS RTS CTS CTS TX TX RX RX HOST_INTR(IRQ) CC3100 SL UART HOST_INTR(IRQ) SWAS031-088 Figure 4-11. Typical 5-Wire UART Topology This is the typical and recommended UART topology because it offers the maximum communication reliability and flexibility between the host and the SimpleLink device. 4.11.4.3.2 4-Wire UART Topology The 4-wire UART topology eliminates the host IRQ line (see Figure 4-12). Using this topology requires one of the following conditions to be met: • Host is always awake or active. • Host goes to sleep but the UART module has receiver start-edge detection for auto wakeup and does not lose data. 20 Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 HOST MCU UART RTS RTS CTS CTS TX TX RX RX X H_IRQ CC3100 SL UART H_IRQ SWAS031-089 Figure 4-12. 4-Wire UART Configuration 4.11.4.3.3 3-Wire UART Topology The 3-wire UART topology requires only the following lines (see Figure 4-13): • RX • TX • CTS RTS RTS X CTS CTS HOST MCU UART TX TX RX RX H_IRQ X CC3100 SL UART H_IRQ SWAS031-090 Figure 4-13. 3-Wire UART Topology Using this topology requires one of the following conditions to be met: • Host always stays awake or active. • Host goes to sleep but the UART module has receiver start-edge detection for auto wakeup and does not lose data. • Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow control in this direction. Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the following parameters must be carefully considered: • Max baud rate • RX character interrupt latency and low-level driver jitter buffer • Time consumed by the user's application Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 21 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 5 Detailed Description 5.1 Overview 5.1.1 Module Features 5.1.1.1 • • • • • • 5.1.1.2 • • • • 5.1.1.3 • • • 5.1.1.4 • • • 22 WLAN 802.11b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates in the 2.4-GHz ISM band Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design. Advanced connection manager with multiple user-configurable profiles stored in an NVMEM allows automatic fast connection to an access point without user or host intervention. Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security accelerators SmartConfig technology: A 1-step, 1-time process to connect a CC3100MOD-enabled device to the home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, it is usable by deeply embedded applications. 802.11 transceiver mode: Allows transmitting and receiving of proprietary data through a socket without adding MAC or PHY headers. This mode provides the option to select the working channel, rate, and transmitted power. The receiver mode works together with the filtering options. Network Stack Integrated IPv4 TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU, microprocessor, or ASIC Support of eight simultaneous TCP, UDP, or RAW sockets Built-in network protocols: ARP, ICMP, DHCP client, and DNS client for easy connection to the local network and the Internet Service discovery: Multicast DNS service discovery lets a client advertise its service without a centralized server. After connecting to the access point, the CC3100MOD provides critical information, such as device name, IP, vendor, and port number. Host Interface and Driver Interfaces over a 4-wire serial peripheral interface (SPI) with any MCU or a processor at a clock speed of 20 MHz. Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI MCUs and is easily ported to any processor or ASIC. Simple APIs enable easy integration with any single-threaded or multithreaded application. System Works from a single preregulated power supply or connects directly to a battery Ultra-low leakage when disabled (hibernate mode) with a current of less than 7 µA with the RTC running Integrated clock sources Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 5.2 SWRS161 – DECEMBER 2014 Functional Block Diagram Figure 5-1 shows the functional block diagram of the CC3100MOD SimpleLink Wi-Fi solution. VCC CC3100MOD Network Processor Module nHIB MCU SPI/UART HOST_INTR Figure 5-1. Functional Block Diagram 5.3 Wi-Fi Network Processor Subsystem The Wi-Fi network processor subsystem includes a dedicated ARM MCU to completely offload the host MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3100MOD supports station, AP, and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi network processor includes an embedded IPv4 TCP/IP stack. Table 5-1 summarizes the NWP features. Table 5-1. Summary of Features Supported by the NWP Subsystem ITEM DOMAIN CATEGORY FEATURE DETAILS 1 TCP/IP Network Stack IPv4 2 TCP/IP Network Stack TCP/UDP 3 TCP/IP Protocols DHCP 4 TCP/IP Protocols ARP 5 TCP/IP Protocols DNS/mDNS DNS Address resolution and local server 6 TCP/IP Protocols IGMP Up to IGMPv3 for multicast management 7 TCP/IP Applications mDNS Support multicast DNS for service publishing over IP 8 TCP/IP Applications mDNS-SD 9 TCP/IP Applications Web Sever/HTTP Server 10 TCP/IP Security TLS/SSL TLS v1.2 (client/server)/SSL v3.0 11 TCP/IP Security TLS/SSL For the supported Cipher Suite, go to SimpleLink Wi-Fi CC3100 SDK. 12 TCP/IP Sockets RAW Sockets User-defined encapsulation at WLAN MAC/PHY or IP layers 13 WLAN Connection Policies Allows management of connection and reconnection policy 14 WLAN MAC Promiscuous mode 15 WLAN Performance Initialization time Baseline IPv4 stack Base protocols Client and server mode Support ARP protocol Service discovery protocol over IP in local network URL static and dynamic response with template. Filter-based Promiscuous mode frame receiver From enable to first connection to open AP less than 50 ms Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 23 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com Table 5-1. Summary of Features Supported by the NWP Subsystem (continued) ITEM DOMAIN CATEGORY FEATURE 16 WLAN Performance Throughput UDP = 16 Mbps 17 WLAN Performance Throughput TCP = 13 Mbps 18 WLAN Provisioning WPS2 19 WLAN Provisioning AP Config 20 WLAN Provisioning SmartConfig 21 WLAN Role Station 802.11bgn Station with legacy 802.11 power save 22 WLAN Role Soft AP 802.11 bg single station with legacy 802.11 power save 23 WLAN Role P2P P2P operation as GO 24 WLAN Role P2P P2P operation as CLIENT 25 WLAN Security STA-Personal 26 WLAN Security STA-Enterprise WPA2 enterprise security 27 WLAN Security STA-Enterprise EAP-TLS 28 WLAN Security STA-Enterprise EAP-PEAPv0/TLS 29 WLAN Security STA-Enterprise EAP-PEAPv1/TLS 30 WLAN Security STA-Enterprise EAP-PEAPv0/MSCHAPv2 31 WLAN Security STA-Enterprise EAP-PEAPv1/MSCHAPv2 32 WLAN Security STA-Enterprise EAP-TTLS/EAP-TLS 33 WLAN Security STA-Enterprise EAP-TTLS/MSCHAPv2 34 WLAN Security AP-Personal WPA2 personal security 5.4 DETAILS Enrollee using push button or PIN method. AP mode for initial product configuration (with configurable Web page and beacon Info element) Alternate method for initial product configuration WPA2 personal security Power-Management Subsystem The CC3100 power-management subsystem contains DC-DC converters to accommodate the differing voltage or current requirements of the system. The module can operate from an input voltage ranging from 2.3 V to 3.6 V and can be directly connected to 2xAA Alkaline batteries. The CC3100MOD is a fully integrated module based WLAN radio solution used on an embedded system with a wide-voltage supply range. The internal power management, including DC-DC converters and LDOs, generates all of the voltages required for the module to operate from a wide variety of input sources. For maximum flexibility, the module can operate in the modes described in the following sections. 5.4.1 VBAT Wide-Voltage Connection In the wide-voltage battery connection, the module is powered directly by the battery. All other voltages required to operate the device are generated internally by the DC-DC converters. This scheme is the most common mode for the device as it supports wide-voltage operation from 2.3 to 3.6 V. 5.5 Low-Power Operating Modes This section describes the low-power modes supported by the module to optimize battery life. 5.5.1 Low-Power Deep Sleep The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered automatically during periods of inactivity based on internal power optimization algorithms. The module draws about 7 µA from the supply in this low-power mode. The module can wake up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this mode is 140 µA. During LPDS mode, the module retains the software state and certain configuration information. The operation is transparent to the external host; thus, no additional handshake is required to enter or exit this sleep mode. 24 Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 5.5.2 SWRS161 – DECEMBER 2014 Hibernate The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept running and the module wakes up once the n_HIB line is asserted by the host driver. The wake-up time is longer than LPDS mode at about 50 ms. NOTE Wake-up time can be extended to 75 ms if a patch is loaded from the serial flash. Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 25 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com 6 Applications, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 6.1 Reference Schematics Figure 6-1 shows the reference schematic for the CC3100MOD module. VCC (2.3 to 3.6V) U1 C3 220uF 35 (optional) 33 41 39 19 20 45 R2 100K 21 22 18 12 29 42 3 2 1 30 27 43 38 28 32 63 62 61 60 59 58 57 56 55 16 VBAT_DCDC_DIG_IO VBAT_DCDC_ANA VBAT_DCDC_PA nRESET NC NC nHIB SPI_CLK SPI_DIN SPI_DOUT SPI_nCS IRQ RF_BG ANT_SEL_1 ANT_SEL_2 NC NC NC NC RESERVED NC NC NC NC NC NC GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND UART1_TX UART1_RX UART1_nRTS UART1_nCTS NC NC NC NC TEST_58 TEST_59 TEST_60 TEST_62 NC NC NC NC SOP0 SOP1 TCXO_EN/SOP2 Matching circuit shown below is for the antenna. The module is matched internally to 50 Ohm 4 5 6 7 8 11 HOST CONTROL Feed The electrolytic capacitor is to be added based on the battery type, routing resistance and current drawn by the CC3100 40 36 37 L1 3.6nH E1 31 25 26 2.45GHz Ant 46 47 44 51 HOST CONTROL/ FLASH PROGRAM C2 1.0pF 17 15 14 13 48 49 50 52 TP1 TP2 TP3 TP4 LOGGING (DEBUG) 54 53 10 9 34 24 23 R3 10K CC3100MOD Figure 6-1. CC3100MOD Module Reference Schematic 26 Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 6.2 SWRS161 – DECEMBER 2014 Bill of Materials(1) QUANTITY PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION 1 U1 CC3100MOD Texas Instruments CC3100MODR11MAMOB SimpleLink Wi-Fi MCU Module 1 E1 2.45-GHz Ant Taiyo Yuden AH316M245001-T ANT Bluetooth WLAN ZigBee® WIMAX 1 C2 1.0 pF Murata Electronics North America GJM1555C1H1R0BB01D CAP CER 1 pF 50 V NP0 0402 1 L1 3.6 nH Murata Electronics North America LQP15MN3N6B02D INDUCTOR 3.6 NH 0.1 NH 0402 (1) Resistors are not shown here. Any resistor of 5% tolerance can be used. 6.3 6.3.1 Layout Recommendations RF Section (Placement and Routing) Figure 6-2. RF Section Layout Being wireless device, the RF section gets the top priority in terms of layout. It is very important for the RF section to be laid out correctly to get the optimum performance from the device. A poor layout can cause low output power, EVM degradation, sensitivity degradation and mask violations. Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 27 CC3100MOD SWRS161 – DECEMBER 2014 6.3.2 www.ti.com Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna is the key to increased range and data rates. The following points need to be observed for the antenna. SR NO. GUIDELINES 1 Place the antenna on an edge or corner of the PCB 2 Make sure that no signals are routed across the antenna elements on all the layers of the PCB 3 Most antennas, including the chip antenna used on the booster pack require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. 4 Ensure that there is provision to place matching components for the antenna. These need to be tuned for best return loss once the complete board is assembled. Any plastics or casing should also be mounted while tuning the antenna as this can impact the impedance. 5 Ensure that the antenna impedance is 50 Ω as the device is rated to work only with a 50-Ω system. 6 In case of printed antenna, ensure that the simulation is performed with the solder mask in consideration. 7 Ensure that the antenna has a near omni-directional pattern. 8 The feed point of the antenna is required to be grounded 9 To use the FCC certification of the Booster pack board, the antenna used should be of the same gain or lesser. In addition, the Antenna design should be exactly copied including the Antenna traces. Table 6-1. Recommended Components CHOICE PART NUMBER MANUFACTURER NOTES 1 AH316M245001-T Taiyo Yuden Can be placed on edge of the PCB and uses very less PCB space 2 RFANT5220110A2T Walsim Need to place on the corner of PCB 28 Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 6.3.3 SWRS161 – DECEMBER 2014 Transmission Line The RF signal from the device is routed to the antenna using a CPW-G (Coplanar Waveguide with ground) structure. This structure offers the maximum isolation across filter gap and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding Figure 6-3. Coplanar Waveguide (Cross Section) with GND and Via Stitching S W Figure 6-4. CPW with GND (Top View) Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 29 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com The recommended values for the PCB are provided for 4- and 2-layer boards in Table 6-2 and Table 6-3, respectively. Table 6-2. Recommended PCB Values for 4-Layer Board (L1-L2 = 10 mils) PARAMETER VALUE UNITS W 20 mils S 18 mils H 10 mils Er (FR-4 substrate) 4 Table 6-3. Recommended PCB Values for 2-Layer Board (L1-L2 = 40 mils) PARAMETER VALUE UNITS W 35 mils S 6 mils H 40 mils Er (FR-4 substrate) 3.9 6.3.4 General Layout Recommendation 1. Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. 2. Do not run signal traces underneath the module on a layer where the module is mounted. 3. RF traces must have 50-Ω impedance 4. RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered. 5. RF traces must not have sharp corners. 6. There must be no traces or ground under the antenna section. 7. RF traces must have via stitching on the ground plane beside the RF trace on both sides. 8. RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 30 Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 7 Environmental Requirements and Specifications 7.1 7.1.1 Temperature PCB Bending The PCB bending specification shall maintain planeness at a thickness of less than 0.1 mm. 7.2 7.2.1 Handling Environment Terminals The product is mounted with motherboard through land grid array (LGA). To prevent poor soldering, do not touch the LGA portion by hand. 7.2.2 Falling The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product malfunction. 7.3 7.3.1 Storage Condition Moisture Barrier Bag Before Opened A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be a 12 months from the date the bag is sealed. 7.3.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, < 30%. 7.4 Baking Conditions Products require baking before mounting if: • Humidity indicator cards read > 30% • Temp < 30°C, humidity < 70% RH, over 96 hours Baking condition: 90°C, 12–24 hours Baking times: 1 time 7.5 Soldering and Reflow Condition 1. Heating method: Conventional Convection or IR/convection 2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method. 3. Solder paste composition: Sn/3.0 Ag/0.5 Cu 4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile (see Figure 7-1). 5. Temperature profile: Reflow soldering shall be done according to the following temperature profile (see Figure 7-1). 6. Peak temp: 245°C Copyright © 2014, Texas Instruments Incorporated Environmental Requirements and Specifications Submit Documentation Feedback 31 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com Figure 7-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint) 32 Environmental Requirements and Specifications Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 8 Product and Documentation Support 8.1 Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). The following products support development of the CC3100MOD applications: Software Development Tools: Code Composer Studio Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software ( DSP/BIOS™), which provides the basic run-time target software needed to support any CC3100MOD application. Hardware Development Tools: Extended Development System ( XDS™) Emulator For a complete listing of development-support tools for the CC3100MOD platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 8.1.1 Firmware Updates TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes, TI recommends that the user has the latest service pack in his or her module for production. To stay informed, sign up for the SDK Alert Me button on the tools page or www.ti.com/tool/cc3100sdk. 8.2 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the CC3100MOD and support tools (see Figure 8-1). X CC 3 1 0 0 MOD R 1 1M A MOB PREFIX X = preproduction device no prefix = production device R PACKAGING R = tape/reel T = small reel DEVICE FAMILY CC = wireless connectivity PACKAGE DESIGNATOR MOB = module SERIES NUMBER 3 = Wi-Fi Centric Figure 8-1. CC3100MOD Device Nomenclature For orderable part numbers of CC3100MOD devices in the MOB package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. Product and Documentation Support Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 33 CC3100MOD SWRS161 – DECEMBER 2014 8.3 www.ti.com Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 8.4 Trademarks SimpleLink, Internet-On-a-Chip, SmartConfig, E2E, Code Composer Studio, DSP/BIOS, XDS are trademarks of Texas Instruments. ARM is a registered trademark of ARM Limited. Wi-Fi CERTIFIED, Wi-Fi Direct are trademarks of Wi-Fi Alliance. Wi-Fi is a registered trademark of Wi-Fi Alliance. ZigBee is a registered trademark of ZigBee Alliance. 8.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.6 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 8.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 34 Product and Documentation Support Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com SWRS161 – DECEMBER 2014 9 Mechanical Packaging and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. Figure 9-1 shows the CC3100MOD module. 9.1 Mechanical Drawing Figure 9-1. Mechanical Drawing Copyright © 2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information Submit Documentation Feedback 35 CC3100MOD SWRS161 – DECEMBER 2014 9.2 www.ti.com Package Option We offer 2 reel size options for flexibility: a 1000-unit reel and a 250-unit reel. 9.2.1 Packaging Information Orderable Device (1) (2) (3) (4) (5) Status (1) Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL, Peak Temp (3) Op Temp (°C) Device Marking (4) (5) CC3100MODR11MAMOBR ACTIVE MOB 63 1000 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB CC3100MODR11MAMOBT ACTIVE MOB 63 250 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 36 Mechanical Packaging and Orderable Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback CC3100MOD www.ti.com 9.2.2 SWRS161 – DECEMBER 2014 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants Device Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) CC3100MODR11MAMOBR MOB 63 1000 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 Q3 CC3100MODR11MAMOBT MOB 63 250 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 Q3 Copyright © 2014, Texas Instruments Incorporated A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant Mechanical Packaging and Orderable Information Submit Documentation Feedback 37 CC3100MOD SWRS161 – DECEMBER 2014 www.ti.com TAPE AND REEL BOX DIMENSIONS Width (mm) L W 38 H Device Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC3100MODR11MAMOBR MOB 63 1000 354.0 354.0 55.0 CC3100MODR11MAMOBT MOB 63 250 354.0 354.0 55.0 Mechanical Packaging and Orderable Information Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC3100MODR11MAMOBR ACTIVE 64 1000 TBD Call TI Call TI -20 to 70 CC3100MODR11MAMOBT ACTIVE 64 250 TBD Call TI Call TI -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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